Loop heat pipe and electronic equipment
By using flexible metal-plastic composite material and corrugated structure, the problem of loop heat pipe difficulty in miniaturization is solved, and the lightness and flexibility are improved, which is suitable for bending electronic equipment.
Patent Information
- Application Number
- CN202311873682.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-07-01
AI Technical Summary
The loop heat pipe is difficult to adapt to the miniaturization design of electronic equipment, and the large size makes it difficult to make the thickness thinner.
The first and second shells of flexible metal-plastic composite materials are used to form a circulation circuit through sealing connections, and a corrugated structure is provided in the gas and liquid channels. Combined with the cavity support component, separate evaporators, condensers, gas and liquid pipelines are cancelled to increase deformation capacity.
The loop heat pipe is miniaturized and thinner, suitable for bending scenarios, such as folding mobile phones and head-mounted display devices, improving flexibility and heat dissipation efficiency.
Smart Images
Figure CN120232292A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of intelligent electronic devices, and more particularly, to a loop heat pipe and an electronic device. Background Art
[0002] A loop heat pipe is a loop-closed heat pipe. Generally, it includes an evaporator, a condenser, a vapor pipeline, and a liquid pipeline. The evaporator absorbs the heat of the heating element, causing the working fluid to evaporate on the outer surface of the capillary wick of the evaporator. The generated vapor enters the vapor pipeline and then enters the condenser to condense into a liquid. The reflux liquid enters the evaporator through the liquid pipeline, and so on in a cycle. Compared with the heat pipes and vapor chambers widely used in laptop computers, tablets, mobile phones, and electronic wearable devices, the loop heat pipe has the advantages of large heat transfer power and long heat transfer distance. However, due to its large size, it is difficult to be thinned, which is not conducive to the miniaturization design of electronic devices. Summary of the Invention
[0003] In view of this, an object of the present invention is to provide a loop heat pipe and an electronic device, and the structural design of the loop heat pipe and the electronic device can effectively solve the problem that the loop heat pipe is difficult to adapt to the miniaturization design of electronic devices.
[0004] To achieve the above object, the present invention provides the following technical solutions:
[0005] A loop heat pipe, comprising:
[0006] A first housing;
[0007] A second housing, disposed opposite to the first housing, the four peripheral edges of the first housing and the second housing are hermetically connected, and the first housing and / or the second housing is provided with a groove to form a circulation loop between the first housing and the second housing. The circulation loop includes an evaporation chamber, a condensation chamber, a gas channel, and a liquid channel. The evaporation chamber and the condensation chamber are respectively located at opposite ends of the loop heat pipe. The gas channel and the liquid channel are respectively communicated between the evaporation chamber and the condensation chamber, and at least a part of the first housing and the second housing corresponding to the gas channel and the liquid channel is provided with a corrugated structure;
[0008] Capillary wicks, respectively disposed in the evaporation chamber and the condensation chamber;
[0009] A cavity support assembly, disposed in the circulation loop.
[0010] Optionally, in the above loop heat pipe, the capillary wick includes:
[0011] A main capillary wick, disposed in the evaporation chamber;
[0012] A secondary wick, which is disposed through the liquid channel, has one end connected to the main wick and the other end extending into the condensation chamber.
[0013] Optionally, in the above loop heat pipe, the main wick includes a main wick body and a plurality of side wick bodies, and the plurality of side wick bodies are arranged at intervals and are respectively connected to the main wick body.
[0014] Optionally, in the above loop heat pipe, the wick further includes:
[0015] A first woven mesh, which is disposed in the evaporation chamber and is located on the upper and lower sides of the main wick;
[0016] A second woven mesh, which is disposed in the condensation chamber and is located on the upper and lower sides of the secondary wick.
[0017] Optionally, in the above loop heat pipe, a part of the second woven mesh extends into the liquid channel.
[0018] Optionally, in the above loop heat pipe, the secondary wick includes braided wires and is disposed through the cavity support assembly.
[0019] Optionally, in the above loop heat pipe, the cavity support assembly includes:
[0020] A first support plate, which is disposed in the evaporation chamber. The first support plate includes a first substrate and first protrusions protruding from the surface of the first substrate. The wick in the evaporation chamber is provided with first holes that cooperate with the first protrusions, and the first protrusions are disposed through the first holes;
[0021] A first support spring and a second support spring, which are respectively disposed in the gas channel and the liquid channel;
[0022] A second support plate and / or a third support spring, which are disposed in the condensation chamber. The second support plate includes a second substrate and second protrusions protruding from the surface of the second substrate. The wick in the condensation chamber is provided with second holes that cooperate with the second protrusions, and the second protrusions are disposed through the second holes.
[0023] Optionally, in the above loop heat pipe, both the first housing and the second housing are made of a flexible metal-plastic composite material, and the first housing and the second housing are sealed by low-temperature diffusion welding.
[0024] Optionally, in the above loop heat pipe, the inner walls of the first housing and / or the second housing are provided with micron-level channels corresponding to the positions of the liquid channel and the wick in the evaporation chamber.
[0025] The loop heat pipe provided by the present invention includes a first housing, a second housing, a cavity support assembly, and a capillary wick. Among them, the second housing is disposed opposite to the first housing, the four peripheral edges of the first housing and the second housing are hermetically connected, and the first housing and / or the second housing is provided with a groove to form a circulation loop between the first housing and the second housing. The circulation loop includes an evaporation chamber, a condensation chamber, a gas channel, and a liquid channel. The evaporation chamber and the condensation chamber are respectively located at opposite ends of the loop heat pipe. The gas channel and the liquid channel are respectively connected between the evaporation chamber and the condensation chamber, and at least a part of the first housing and the second housing corresponding to the gas channel and the liquid channel is provided with a corrugated structure; the capillary wicks are respectively disposed in the evaporation chamber and the condensation chamber; the cavity support assembly is disposed in the circulation loop.
[0026] When applying the loop heat pipe provided by the present invention, the four peripheral edges of the first housing and the second housing are hermetically connected to form a circulation loop inside, and through the setting of the cavity support assembly, it plays a role in supporting the circulation loop to prevent the circulation loop from sagging. By directly forming the circulation loop on the first housing and the second housing, there is no need to separately provide an evaporator, a condenser, a gas pipeline, and a liquid pipeline, and the structure is simple, which is beneficial to the miniaturization, thinness, and lightness of the loop heat pipe. Moreover, the good deformation ability of the corrugated structure can be better applied to bending scenarios, such as realizing heat conduction across the hinge of a folding mobile phone and heat conduction across the hinge of a head-mounted display device.
[0027] To achieve the above object, the present invention also provides an electronic device, and the electronic device includes any one of the above loop heat pipes. Since the above loop heat pipe has the above technical effects, the electronic device having the loop heat pipe should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 It is a schematic structural diagram of the loop heat pipe according to a specific embodiment of the present invention;
[0030] Figure 2 For Figure 1 the exploded structural diagram;
[0031] Figure 3 It is another schematic diagram of the setting of the second braided net;
[0032] Figure 4 For Figure 1 the cross-sectional schematic diagram of the evaporator in
[0033] Figure 5 is Figure 1 a partial cross-sectional view of the gas pipeline in
[0034] Figure 6 is Figure 1 a partial cross-sectional view of the liquid pipeline in
[0035] Figure 7 is Figure 1 a cross-sectional view of the condenser in
[0036] Figure 8 is a cross-sectional view of another condenser.
[0037] The markings in the attached drawings are as follows:
[0038] Evaporator 01, condenser 02, gas pipeline 03, liquid pipeline 04, vacuum injection port 05;
[0039] First housing 1, first housing substrate skirt 11, first housing groove 12, first housing groove branch 13, first housing gas pipeline corrugated structure 14, first housing liquid pipeline corrugated structure 15;
[0040] Main capillary core 21, secondary capillary core 22, first woven mesh 23, second woven mesh 24, main capillary core body 211, side capillary core body 212;
[0041] First support plate 31, first support spring 32, second support spring 33, third support spring 34, second support plate 35, first substrate 311, first protrusion 312;
[0042] Second housing 4, second housing substrate 41, second housing branch 42, second housing liquid pipeline corrugated structure 43, second housing gas pipeline corrugated structure 44. Specific embodiments
[0043] An embodiment of the present invention discloses a loop heat pipe and an electronic device to achieve miniaturization of the loop heat pipe.
[0044] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0045] In one embodiment, please refer to Figure 1 - Figure 2, the loop heat pipe provided by the present invention includes a first housing 1, a second housing 4, a cavity support assembly, and a capillary wick. Among them, the second housing 4 is disposed opposite to the first housing 1, the four peripheral edges of the first housing 1 and the second housing 4 are hermetically connected, and the first housing 1 and / or the second housing 4 are provided with grooves to form a circulation loop between the first housing 1 and the second housing 4. The necessary structures of the loop heat pipe include an evaporator 01, a condenser 02, a gas pipeline 03, and a liquid pipeline 04. In this application, the evaporator 01, the condenser 02, the gas pipeline 03, and the liquid pipeline 04 are integrally arranged, that is, through the cooperation of the first housing 1 and the second housing 4, a circulation loop is formed inside, and the circulation loop includes an evaporation chamber, a condensation chamber, a gas channel, and a liquid channel. The evaporation chamber and the condensation chamber are respectively located at opposite ends of the loop heat pipe, and the gas channel and the liquid channel are respectively connected between the evaporation chamber and the condensation chamber. A working fluid is filled in the circulation loop, and the working fluid circulates in the circulation loop and takes away the heat of the heat source through gas-liquid phase change. Specifically, the working fluid absorbs the heat of the heat source and undergoes a phase change when flowing through the evaporation chamber, then flows into the condensation chamber through the gas channel, and can be condensed in the condensation chamber and flows back to the evaporation chamber through the liquid channel to achieve circulation. The first housing 1 and the second housing 4 corresponding to at least a part of the gas channel and the liquid channel are provided with a corrugated structure, which can increase their flexibility, so that the loop heat pipe can be better applied to occasions that require multiple bends, such as the hinge connection part of the temple of a head-mounted display device and the folding part of a folding mobile phone, improving the flexibility of the loop heat pipe and making its application range wider. The capillary wicks are respectively arranged in the evaporation chamber and the condensation chamber. The cavity support assembly is arranged in the circulation loop to play a supporting role for the circulation loop to prevent the circulation loop from sagging.
[0046] When applying the loop heat pipe provided by the present invention, the four peripheral edges of the first housing 1 and the second housing 4 are hermetically connected to form a circulation loop inside, and through the setting of the cavity support assembly, a supporting role for the circulation loop is played to prevent the circulation loop from sagging. By directly forming the circulation loop with the first housing 1 and the second housing 4, there is no need to separately set the evaporator 01, the condenser 02, the gas pipeline 03, and the liquid pipeline 04, and the structure is simple, which is beneficial to the miniaturization and thinning of the loop heat pipe. Moreover, the good deformation ability of the corrugated structure can be better applied to bending scenarios, such as realizing heat conduction across the hinge of a folding mobile phone and heat conduction across the hinge of a head-mounted display device.
[0047] In some embodiments, both the first housing 1 and the second housing 4 are made of a flexible metal-plastic composite material. The flexible metal-plastic composite material is a material composed of a flexible metal and a plastic, specifically a flexible copper clad laminate, which includes a conductor material (such as copper foil) and an insulating base film. By using the flexible metal-plastic composite material as the first housing 1 and the second housing 4, the flexible metal-plastic composite material has the characteristics of being thin, light, and flexible, which is beneficial to the miniaturization and thinness of the loop heat pipe. Moreover, the flexible metal-plastic composite material has a certain flexibility, combined with the good deformation ability of the corrugated structure, and can be better applied to bending scenarios.
[0048] In some embodiments, the cavity support assembly is not provided in the gas channel and liquid channel portions corresponding to the corrugated positions to facilitate bending at the corrugated positions more. That is, the support structures at the corrugated positions of the gas channel and the liquid channel are removed, and the support structures at other positions are retained.
[0049] In some embodiments, please refer to Figure 1 - Figure 2 , the capillary wick includes a main capillary wick 21 and a secondary capillary wick 22. The main capillary wick 21 is arranged in the evaporation chamber to provide capillary driving force. The secondary capillary wick 22 penetrates through the liquid channel, and one end is connected to the main capillary wick 21, and the other end extends into the condensation chamber. Through the arrangement of the secondary capillary wick 22, the capillary action of the secondary capillary wick 22 can be used to transport the liquid working medium, so that the working medium can flow better in the circulation loop, and the heat dissipation efficiency is further improved.
[0050] In some embodiments, the main capillary wick 21 includes a main capillary wick body 211 and a plurality of side capillary wick bodies 212. The plurality of side capillary wick bodies 212 are arranged at intervals and are respectively connected to the main capillary wick body 211. The specific number of the side capillary wick bodies 212 is set according to needs, such as not less than three. The plurality of side capillary wick bodies 212 are arranged at intervals, so that the interval positions can provide a layout space for the support structure to ensure the circulation of the working medium in the circulation loop while avoiding the depression of the circulation loop.
[0051] In some embodiments, please refer to Figure 1 - Figure 2 , the capillary wick further includes a first woven mesh 23 arranged in the evaporation chamber, and the first woven mesh 23 is located on the upper and lower sides of the main capillary wick 21. By arranging the first woven mesh 23 on the upper and lower sides of the main capillary wick 21, the first woven mesh 23 cooperates with the main capillary wick 21 to provide better capillary force.
[0052] In some embodiments, please refer to Figure 1 - Figure 2, the capillary wick further includes a second woven mesh 24 disposed in the condensation chamber, and the second woven mesh 24 is located on the upper and lower sides of the secondary capillary wick 22. By providing the second woven mesh 24 on the upper and lower sides of the secondary capillary wick 22, the second woven mesh 24 cooperates with the secondary capillary wick 22 to provide better capillary force. During assembly, specifically, the second woven mesh 24 can be first welded and fixed in the condensation chamber, then the secondary capillary wick 22 and the support structure are placed in, the tail end of the secondary capillary wick 22 is welded and fixed to one of the second woven meshes 24 and the inner wall of the condensation chamber, and the other second woven mesh 24 is welded and fixed to the inner wall of the condensation chamber, and then the first housing 1 and the second housing 4 are joined by low-temperature diffusion welding.
[0053] In some embodiments, referring to Figure 3 , a part of the second woven mesh 24 extends into the liquid channel. Compared with the second woven mesh 24 being disposed in the condensation chamber, extending a part of the second woven mesh 24 into the liquid channel can further enhance the capillary reflux ability of the condensation chamber, making the circulating flow of the working fluid more efficient and further improving the heat dissipation efficiency.
[0054] In some embodiments, to increase the capillary force of the condensation chamber, the two second woven meshes 24 located on the upper and lower sides of the secondary capillary wick 22 can be combined into an integral woven mesh and pressed into a C shape and fixed in the condensation chamber.
[0055] In some embodiments, the secondary capillary wick 22 includes woven wires and is disposed through the cavity support assembly. Using woven wires can not only provide good capillary action, but also has a small volume, facilitating cooperation with the cavity support assembly and being jointly disposed in the liquid channel.
[0056] In some embodiments, referring to Figure 1 - Figure 2 , the cavity support assembly includes a first support spring 32 and a second support spring 33 respectively disposed in the gas channel and the liquid channel. The first support spring 32 and the second support spring 33 can respectively provide reliable support for the wall surfaces of the gas channel and the liquid channel, and at the same time do not affect the flow of the working fluid in the gas channel and the liquid channel. Specifically, the first support spring 32 and the second support spring 33 are made of stainless steel springs. The first support spring 32 and the second support spring 33 can be specifically pre-fixed in the gas channel and the liquid channel respectively by spot welding.
[0057] In some embodiments, referring to Figure 1 - Figure 2, the cavity support assembly further includes a first support plate 31 disposed in the evaporation cavity. The first support plate 31 includes a first substrate 311 and first protrusions 312 protruding from the surface of the first substrate 311. The capillary wick in the evaporation cavity is provided with first holes adapted to the first protrusions 312, and the first protrusions 312 pass through the first holes. Reliable support is provided by the cooperation of the first substrate 311 and the first protrusions 312. Specifically, the first protrusions 312 may be a plurality of small-sized protrusions formed on the first substrate 311. The first protrusions 312 are distributed in the first holes. Specifically, the first substrate 311 is disposed on the surface of the second housing 4 facing the first housing 1, and the top ends of the first protrusions 312 can abut against the surface of the first housing 1 facing the second housing 4 to provide reliable support. When the main capillary wick 21 includes a main capillary wick body 211 and a plurality of side capillary wick bodies 212, the first protrusions 312 may be disposed in the intervals between the side capillary wick bodies 212, that is, the above-mentioned first holes include the intervals between the side capillary wick bodies 212. When the capillary wick includes the first woven mesh 23, the first protrusions 312 may pass through the mesh holes 231 of the first woven mesh 23, that is, the first holes include the mesh holes 231 of the first woven mesh 23.
[0058] In some embodiments, please refer to Figure 1 - Figure 2 , the cavity support assembly further includes a second support plate 35 and / or a third support spring 34 disposed in the condensation cavity. The second support plate 35 includes a second substrate and second protrusions protruding from the surface of the second substrate. The capillary wick in the condensation cavity is provided with second holes adapted to the second protrusions, and the second protrusions pass through the second holes. That is, a third support spring 34 may be provided in the condensation cavity to provide reliable support, or a second support plate 35 may also be provided. Please refer to Figure 8 , the second support plate 35 includes a second substrate and second protrusions. Reliable support is provided by the cooperation of the second substrate and the second protrusions. Specifically, the second protrusions may be a plurality of small-sized protrusions formed on the second substrate. The second protrusions are distributed in the second holes. Specifically, the second substrate is disposed on the surface of the second housing 4 facing the first housing 1, and the top ends of the second protrusions can abut against the surface of the first housing 1 facing the second housing 4 to provide reliable support. When the capillary wick includes the second woven mesh 24, the second protrusions may pass through the mesh holes of the second woven mesh 24, that is, the second holes include the mesh holes of the second woven mesh 24.
[0059] In some embodiments, the first housing 1 and the second housing 4 are sealed by low-temperature diffusion welding. Using low-temperature diffusion welding can reduce the thermal deformation and deterioration of materials during the welding process, thereby ensuring the product quality after welding. And welding at a low temperature can reduce the thermal stress and cooling shrinkage rate of the welding material, so it is not easy to deform. Therefore, by using a flexible metal-plastic composite material as the first housing 1 and the second housing 4 of the loop heat pipe and using low-temperature diffusion welding for sealing, it is beneficial to realize the thinning and miniaturization of the loop heat pipe.
[0060] In some embodiments, microgrooves are provided on the inner walls of the first housing 1 and / or the second housing 4 corresponding to the positions of the liquid channels and the capillary wicks in the evaporation chamber. By providing the microgrooves, the liquid reflux ability is increased. Specifically, multiple continuous microgrooves can be formed on the inner walls of the first housing 1 and / or the second housing 4 by etching or laser removal. Further, microgrooves are provided on the inner walls of the first housing 1 and / or the second housing 4 corresponding to the gas-liquid conversion positions to further increase the liquid reflux ability.
[0061] In some embodiments, the vapor-liquid phase change position of the condensation chamber is set to be serpentine to increase the heat exchange area, thereby improving the condensation effect of the condensation chamber.
[0062] In some embodiments, the first housing 1 and the second housing 4 further form a vacuum injection port 05, and the vacuum injection port 05 is arranged close to the evaporation chamber. By providing the vacuum injection port 05, it is convenient to evacuate the inside of the loop heat pipe and fill the working fluid.
[0063] The following takes a specific embodiment as an example for illustration. In this embodiment, the first housing 1 includes a first housing base skirt 11, a first housing groove 12, a first housing groove branch 13, a first housing gas pipeline corrugated structure 14, and a first housing liquid pipeline corrugated structure 15. The first housing groove 12 and the first housing groove branch 13 can be specifically formed by stamping. The second housing 4 includes a second housing base 41, a second housing branch 42, a second housing liquid pipeline corrugated structure 43, and a second housing gas pipeline corrugated structure 44.
[0064] The first housing base skirt 11 and the second housing base 41 can be combined by a low-temperature welding process. Please refer to Figure 4 , the evaporator 01 of this loop heat pipe includes a part of the first housing base skirt 11, a part of the first housing groove 12, a part of the second housing base 41 that enclose the evaporation chamber, and a first woven mesh 23, a main capillary wick 21, and a first support plate 31 arranged in the evaporation chamber. Each component is stacked and fixedly connected. Among them, the first woven mesh 23, the main capillary wick 21, the secondary capillary wick 22, and the first support plate 31 can be pre-fixed in the first housing groove 12 by spot welding, and then the first housing base skirt 11 and the second housing base 41 are fixed by low-temperature welding.
[0065] Please refer to Figure 5 , the gas pipeline 03 includes a part of the first housing groove 12, a part of the second housing base 41 that enclose the gas channel, and the first housing gas pipeline corrugated structure 14, the second housing gas pipeline corrugated structure 44, and a first support spring 32.
[0066] Please refer to Figure 6, the liquid pipeline 04 includes a part of the first housing groove 12 that encloses the liquid passage, a part of the second housing substrate 41, the first housing liquid pipeline corrugated structure 15, the second housing liquid pipeline corrugated structure 43, the second support spring 33, and a part of the secondary wick 22. During assembly, the secondary wick 22 first passes through the second support spring 33 and then the second support spring 33 is fixed.
[0067] Please refer to Figure 7 , the condenser 02 includes a part of the first housing substrate skirt 11 that encloses the condensation chamber, a part of the first housing groove 12, a part of the second housing substrate 41, the second braided mesh 24 provided in the condenser 02, a part of the secondary wick 22, and the third support spring 34.
[0068] Specifically, a part of the first housing substrate skirt 11, the side branch 13 of the first housing groove, and the side branch 42 of the second housing form a vacuum injection port 05.
[0069] In the above embodiment, the first housing 1 is stamped with grooves, and the second housing 4 is a flat plate. Corresponding to the corrugated sections of the liquid pipeline 04 and the gas pipeline, the welding surface is located at a position slightly below the center. To facilitate bending, the position of the welding surface can be adjusted, for example, centered distribution, that is, grooves are provided on both the first housing 1 and the second housing 4.
[0070] Based on the loop heat pipe provided in the above embodiment, the present invention also provides an electronic device, which includes any one of the loop heat pipes in the above embodiment. Since the electronic device adopts the loop heat pipe in the above embodiment, the beneficial effects of the electronic device can be referred to the above embodiment.
[0071] In some embodiments, the electronic device is a head-mounted display device. The loop heat pipe is provided in the head-mounted display device, and the evaporation chamber of the loop heat pipe is located in a set of temple arms of the head-mounted display device and is in close contact with the heat source chip or the gas heat source. The condensation chamber of the loop heat pipe extends into the main housing of the head-mounted display device or another set of temple arms.
[0072] Specifically, with the direction of gravity pointing downward, in the head-mounted display device, the liquid flow channel is located below the gas flow channel to facilitate better circulation of the working fluid. The corrugated structure is provided at the bending position where the temple arms are connected to the main housing. When the temple arms of the head-mounted display device are bent, the corrugated structure will bend accordingly.
[0073] In this specification, the various embodiments are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.
[0074] The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A loop heat pipe, characterized in that, Comprising: A first housing (1); A second housing (4), which is disposed opposite to the first housing (1), the four peripheral edges of the first housing (1) and the second housing (4) are hermetically connected, and the first housing (1) and / or the second housing (4) are provided with grooves to form a circulation loop between the first housing (1) and the second housing (4), the circulation loop includes an evaporation chamber, a condensation chamber, a gas channel and a liquid channel, the evaporation chamber and the condensation chamber are respectively located at opposite ends of the loop heat pipe, the gas channel and the liquid channel are respectively communicated between the evaporation chamber and the condensation chamber, and at least a part of the first housing (1) and the second housing (4) corresponding to the gas channel and the liquid channel are provided with corrugated structures; Capillary wicks, which are respectively disposed in the evaporation chamber and the condensation chamber; A cavity support assembly, which is disposed in the circulation loop.
2. The loop heat pipe according to claim 1, characterized in that, The capillary wick includes: A main capillary wick (21), which is disposed in the evaporation chamber; A secondary capillary wick (22), the secondary capillary wick (22) is disposed through the liquid channel, and one end is connected to the main capillary wick (21), and the other end extends into the condensation chamber.
3. The loop heat pipe according to claim 2, characterized in that, The main capillary wick (21) includes a main capillary wick body (211) and a plurality of side capillary wick bodies (212), and the plurality of side capillary wick bodies (212) are arranged at intervals and are respectively connected to the main capillary wick body (211).
4. The loop heat pipe according to claim 2, characterized in that, The capillary wick further includes: A first woven mesh (23), which is disposed in the evaporation chamber and is located on the upper and lower sides of the main capillary wick (21); A second woven mesh (24), which is disposed in the condensation chamber and is located on the upper and lower sides of the secondary capillary wick (22).
5. The loop heat pipe according to claim 4, characterized in that, A part of the second woven mesh (24) extends into the liquid channel.
6. The loop heat pipe according to claim 2, wherein The secondary capillary wick (22) includes woven wires and is disposed through the cavity support assembly.
7. The loop heat pipe according to any one of claims 1-6, characterized in that, The cavity support assembly includes: A first support plate (31), which is disposed in the evaporation chamber, the first support plate (31) includes a first substrate (311) and a first column protrusion (312) protruding from the surface of the first substrate (311), and the capillary wick in the evaporation chamber is provided with a first hole for cooperating with the first column protrusion (312), and the first column protrusion (312) is disposed through the first hole; A first support spring (32) and a second support spring (33), which are respectively disposed in the gas channel and the liquid channel; A second support plate (35) and / or a third support spring (34), which are disposed in the condensation chamber, the second support plate (35) includes a second substrate and a second column protrusion protruding from the surface of the second substrate, and the capillary wick in the condensation chamber is provided with a second hole for cooperating with the second column protrusion, and the second column protrusion is disposed through the second hole.
8. The loop heat pipe according to any one of claims 1-6, characterized in that, Both the first housing (1) and the second housing (4) are made of a flexible metal-plastic composite material, and the first housing (1) and the second housing (4) are sealed by low-temperature diffusion welding.
9. The loop heat pipe according to any one of claims 1-6, characterized in that, The inner walls of the first housing (1) and / or the second housing (4) are provided with micron-level channels corresponding to the positions of the liquid channel and the capillary wick in the evaporation chamber.
10. An electronic device, characterized in that, Comprising a loop heat pipe as described in any one of claims 1-9.