A small test system and method for semiconductor components

Abstract

The application relates to the technical field of semiconductor component testing, and provides a small-size testing system and testing method for semiconductor components, a valve island function detection module is used for verifying the function adaptability of the valve island in semiconductor equipment, a temperature control module is used for receiving the input of thermocouple and thermal resistance temperature signals, calculating the temperature deviation of each measuring point and the temperature control point, an input signal detection module is used for being connected with the equipment to be tested through a connecting line, so that an operator can observe the signal change of the equipment to be tested through a man-machine interactive interface, and a power module is connected with the valve island function detection module, the temperature control module and the input signal detection module through externally adapted connecting lines, so as to provide required power supply for the modules; the application controls and adjusts the temperature through the temperature control module, carries out PID parameter automatic setting and optimization, integrates or flexibly combines multiple function modules to reduce the volume, satisfies the system universality, and does not occupy the production space.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor component testing, in particular to a portable small test system and test method suitable for life test, heating test, power supply test and other projects of semiconductor components. BACKGROUND

[0002] In today's digital era, the semiconductor industry, as the core support of information technology, is showing a thriving development trend. Semiconductor components, as the cornerstone of the industry, are extremely diverse, covering a wide range of key components from photomask in the chip manufacturing process, wafer carrier, to lead frame, bonding wire and other key components in the packaging link.

[0003] Moreover, different brands of semiconductor components have significant differences in design philosophy and manufacturing process. Even different series of products under the same brand, due to the diversification of application scenarios, have great differences in performance emphasis. Therefore, multiple performance tests need to be performed on different brands or different series of products under the same brand, and the product iteration cycle is short. In order to meet the testing requirements and not be idle due to the mismatch between the system function and the requirements caused by product iteration, the test system needs to be as universal as possible and easy to maintain and adjust.

[0004] Currently, the existing test systems on the market have single functions, or in order to be universal, they are relatively large in size and occupy a lot of production space. The small test systems have their functions limited to the testing of specific types or specific performance indicators.

[0005] At the same time, the existing system has significant defects in temperature control testing. During temperature control testing, the temperature fluctuation range is large, it is difficult to achieve such high precision requirements, the PID parameter setting mainly depends on manual experience, there is a lack of automatic setting method, different semiconductor components with different thermal characteristics require different parameters, manual setting is difficult to achieve the best, and temperature overshoot and slow response problems are prone to occur. In addition, the basic parameters are not set reasonably, the temperature sampling period is not optimized, and the accuracy and efficiency of the test results are affected. SUMMARY

[0006] To solve the above technical problems, the present application provides a small test system and method for semiconductor components, which realizes accurate temperature control and stable adjustment through the PLC module of the temperature control module, automatic PID parameter setting and optimization through the PID parameter setting unit, and integrates and flexibly combines multiple functional modules to reduce the size, meet the high-precision process temperature control requirements of semiconductor components, and achieve universal system functions without occupying a large amount of production space, to solve the problems in the prior art.

[0007] A small test system for semiconductor components, comprising:

[0008] a valve island function detection module for verifying the functional suitability of the valve island in the semiconductor equipment;

[0009] a power module for providing 24VDC power output, ±15VDC power output and 220VAC source output;

[0010] a temperature control module including solid-state relays and thermocouple extension lines, for receiving the input of thermocouple and thermistor temperature signals, and calculating the temperature deviation of each measuring point and the temperature control point;

[0011] an input signal detection module for receiving the input signal of the equipment to be tested, so that the operator can observe the signal change of the equipment to be tested through the human-machine interface;

[0012] The valve island function detection module, the power module, the temperature control module and the input signal detection module each have a uniform appearance and include an adaptive connection line, a PLC module, a power supply module, a stainless steel shell (2), an interface board (4), a human-machine interface (3) and a handle (1), and each has a size of 400mm x 300mm x 260mm.

[0013] The power module is connected to the valve island function detection module, the temperature control module and the input signal detection module through the adaptive connection line, and provides the required power supply for them.

[0014] Preferably, the PLC module in the temperature control module includes a PID parameter setting unit, a temperature control unit and a temperature deviation calculation unit.

[0015] The PID parameter setting unit automatically obtains the dynamic characteristics of the system through a step response experiment, and automatically optimizes the PID parameters using an adaptive algorithm, outputs the PID parameters suitable for the current working condition, and ensures that the system quickly completes the self-tuning process.

[0016] The temperature control unit is used for real-time adjustment and control output, and dynamically adjusts the control parameters according to the temperature error and its rate of change, so as to stabilize the temperature within the set value range.

[0017] The temperature deviation calculation unit is used for calculating the temperature field distribution, the temperature deviation and uniformity of multiple measuring points by using the real-time data of multiple temperature measuring points collected through the thermocouple extension line, and outputting the maximum deviation and the temperature field distribution.

[0018] Preferably, the specific parameter setting process of the PID parameter setting unit is as follows:

[0019] First, define the ideal second-order reference model without overshoot and fast response :

[0020] ;

[0021] Where s represents the complex variable of the Laplace transform, used for frequency domain analysis. This represents the natural frequency, set based on the thermal inertia of the device to be heated. This is expressed as the damping ratio, set to 1.0, which is the critical damping.

[0022] Next, a step response experiment was conducted, applying 50% of the rated power to the equipment to be heated, i.e. Record the time-based temperature rise curve ;

[0023] Extract characteristic parameters, steady-state gain for:

[0024] ;

[0025] in, For the system to heat the equipment with a power of The steady-state temperature value at that time. The initial temperature before the step response experiment begins is represented by the inverse initial parameter based on the steady-state gain K;

[0026] Equivalent time constant :

[0027] ;

[0028] in, express The time of intersection between the tangent line at the point of maximum slope and the initial temperature line. express The time of intersection between the tangent at the point of maximum slope and the steady-state temperature line, 1.2 is an empirical correction coefficient derived from the Ziegler-Nichols tuning rule;

[0029] Then, the Chien-Hrones-Reswick tuning rule is applied, based on the steady-state gain. inverse ratio and equivalent time constant Initial parameters: PID parameters, i.e., proportional parameters Integral parameters and differential parameters ;

[0030] Adaptive parameter adjustment: The PID parameters are dynamically adjusted based on the error between the reference model and the actual output.

[0031] ;

[0032] in, Indicates time, , and The gain coefficient, used to control the adjustment speed of PID parameters, ranges from 0.01 to 0.1; a larger value results in faster convergence. , and The sensitivity of the error to the PID parameters is calculated using the numerical difference method. This represents the temperature tracking error, i.e., the error caused by the reference model. The theoretical temperature obtained by discretization calculation Compared with actual temperature Real-time tracking error;

[0033] Parameter convergence judgment is based on the temperature control stability index H, which sets convergence conditions. When the temperature tracking error... Once the parameter is determined to be converged, tuning stops, and the final output is given. , and .

[0034] Preferably, the specific temperature control calculation process of the temperature control unit is as follows:

[0035] Set the target temperature value to Then, based on the PID parameter tuning unit , , The initial state space matrices A, B, and C are derived using a second-order inertial element model, and a state space model is established.

[0036] ;

[0037] in, yes The state vector at time is composed of temperature and heating rate. The PWM signal represents the control signal of the solid-state relay, i.e., the duty cycle of the control quantity. Then, the temperature value in the next n steps is predicted through a state-space model, and an optimization objective function is constructed:

[0038] ;

[0039] in, Let j represent the temperature value predicted by the state-space model at a future moment based on the current state vector, where j represents the index of the temperature value in the prediction step size n, and the value ranges from 1 to n. This is the weight that penalizes sudden changes in the control quantity; the larger the value, the smoother the control. Finally, the optimization problem is solved using quadratic programming to obtain the optimal control sequence, which is then executed at the current time step. Update the duty cycle of the control quantity of the solid-state relay.

[0040] Preferably, the temperature deviation calculation unit specifically calculates the process as follows:

[0041] Based on And And thermocouple multi-point temperature data Temperature deviation statistics are performed to calculate single-point deviation :

[0042] ;

[0043] Calculate the maximum deviation :

[0044] ;

[0045] Calculate the temperature range R:

[0046] ;

[0047] Wherein, y represents the temperature measurement point index of the thermocouple multi-point temperature data, The temperature control target temperature value corresponding to the temperature measurement point y is calculated, and the RBF space interpolation method is used to construct an interpolation function to estimate the temperature of the region without arranged measurement points from the limited measurement point data, generate a continuous temperature field cloud map, and intuitively display the high temperature area and the low temperature area.

[0048] Preferably, the valve island function detection module, power module, temperature control module and input signal detection module all have data recording and export functions and an emergency stop button, which can stop the system in an emergency, and the power plug is suitable for ordinary wall plug.

[0049] Preferably, the valve island function detection module, power module, temperature control module and input signal detection module can be tested as independent states, can be combined for testing according to actual testing requirements, and can integrate two or more units in a stainless steel shell, further reducing the volume of the test system on the premise of sacrificing the number of specified interfaces.

[0050] A small test method for semiconductor parts, comprising:

[0051] Step 1, power supply test, the operator adjusts the parameters of the power supply module to the appropriate parameters according to the electrical parameters of the product to be tested, starts the power supply module, measures the interface output with a measuring tool, if normal, proceed to the next step, if not, check the specific reason; After turning off the power supply module, connect the test system and the product to be tested using the interface board and the adaptive connection line, connect the power supply of the power supply module after the connection is firm, judge whether it is qualified according to the test purpose, so as to complete the power supply test of the sample to be tested;

[0052] Step 2, valve island test, the operator selects the appropriate valve island type according to the information about the valve drive on the valve island manual or wiring diagram paper on the man-machine interface of the valve island function detection module, selects the appropriate adapter connection line according to the interface prompt, and connects the corresponding interface board with the valve island to be tested, selects the appropriate test parameters on the man-machine interface, and clicks to start, the PLC module receives the instruction and sequentially outputs the drive signal to the valve island to be tested according to the set process, and the operator observes whether the action of the valve island is according to the preset parameters, thereby completing the function test of the valve island to be tested;

[0053] Step 3, temperature control test, the operator sets the basic parameters on the man-machine interface of the temperature control module according to the heating requirements of the heating equipment to be tested, connects the power supply line and the temperature signal line of the heating equipment to be tested to the corresponding interface of the temperature control module, clicks the self-tuning button of the loop on the man-machine interface of the temperature control module, and the PLC module receives the instruction and starts the PID self-tuning of the heating equipment to be tested. After self-tuning, the system automatically switches to the temperature control mode, and the PLC module controls the solid-state relay to output PWM signals continuously, so that the heating equipment to be tested is continuously maintained at the target temperature;

[0054] If you want to monitor the temperature of other points of the heating equipment, you can paste the temperature signal line at that position, and the signal is transmitted to the PLC module and displayed on the man-machine interface of the temperature control module;

[0055] Step 4, input signal test, the operator selects the output signal type and interface of the product to be tested on the man-machine interface, connects it with the corresponding interface board and the product to be tested according to the interface prompt, starts the product to be tested, and observes the type of the signal on the man-machine interface of the signal detection module to complete the input signal test of the product to be tested.

[0056] Compared with the prior art, the present application has the following beneficial effects:

[0057] 1、The temperature control unit in the PLC module in the temperature control module dynamically adjusts the control parameters according to the temperature error and its rate of change, and the temperature deviation calculation unit calculates the temperature deviation and uniformity of multiple measurement points, so that accurate temperature control and stable adjustment during the test process of semiconductor parts are realized, the beneficial effect of meeting the temperature control requirements of high-precision semiconductor processes is achieved, and the problem of affecting test accuracy and product yield due to large temperature fluctuations is avoided.

[0058] 2、The present application defines ideal second-order reference model through PID parameter setting unit, extracts characteristic parameters through step response experiment, adopts Chien-Hrones-Reswick setting rule to set initial PID parameters, and then adjusts PID parameters according to the error between reference model and actual output and judges convergence, so as to realize automatic setting and optimization of PID parameters, achieve the beneficial effects of getting rid of dependence on artificial experience and quickly finding optimal PID parameter combination suitable for current working condition, and solve the problems of difficult PID parameter setting, temperature overshoot and slow response in the prior art.

[0059] 3、The present application integrates valve island function detection module, power module, temperature control module and input signal detection module, each module has data recording and exporting function and emergency stop button, and can be tested independently or in combination, and more than two units can be integrated in a stainless steel shell, so as to realize the versatility and flexibility of the test system function, reduce the system size, achieve the beneficial effects of meeting the test requirements of various semiconductor parts without occupying a large amount of production space, and avoid the defects of single function or large size of the existing test system. BRIEF DESCRIPTION OF DRAWINGS

[0060] Figure 1 is a schematic diagram of the appearance of a unit of the small test system for semiconductor parts of the present application;

[0061] Figure 2 is a schematic diagram of the parameter setting process of the PID parameter setting unit in the temperature control module of the present application;

[0062] Figure 3 is a schematic diagram of the running process of the temperature control unit and the temperature deviation calculation unit in the temperature control test of the present application;

[0063] Figure 4 is a schematic diagram of the internal principle process of the system of the present application;

[0064] In the figure: 1, handle; 2, stainless steel shell; 3, human-computer interaction interface; 4, interface board. DETAILED DESCRIPTION

[0065] The embodiments of the present application will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0066] The present application provides a small test system for semiconductor parts, comprising:

[0067] Valve island function detection module, the valve island function detection module is used to verify the function adaptability of the valve island in the semiconductor equipment;

[0068] A power module for providing 24VDC power output, ±15VDC power output and 220VAC power output;

[0069] A temperature control module comprising a solid state relay and a thermocouple extension line set for receiving input of thermocouple and thermal resistance temperature signals, calculating temperature deviation of each measuring point and temperature control point;

[0070] An input signal detection module for receiving input signals of the device to be tested, allowing the operator to observe the signal changes of the device to be tested through the human-computer interaction interface;

[0071] The valve island function detection module, the power module, the temperature control module and the input signal detection module each have a uniform appearance and each comprises an adaptive connecting line, a PLC module, a power supply module, a stainless steel shell (2), an interface board (4), a human-computer interaction interface (3) and a handle (1), and each has a size of 400mm x 300mm x 260mm;

[0072] The power module is connected to the valve island function detection module, the temperature control module and the input signal detection module through the adaptive connecting line, respectively, to provide the required power supply for them.

[0073] Embodiment:

[0074] As shown in Figures 1-4 In this embodiment, a semiconductor manufacturing enterprise is facing the testing problem brought by the large variety of products and the fast iteration speed. Recently, the enterprise has newly developed a batch of semiconductor components of different specifications, covering new valve islands, temperature-sensitive heating elements and chip assemblies with complex signal output, and it is urgent to comprehensively test the performance of these components to ensure that they meet the production standards and can be smoothly put into subsequent production links.

[0075] Therefore, the enterprise decides to use the small test system and method for semiconductor components of the present application to test the semiconductor in and out; the test personnel carries out work according to the following steps:

[0076] Step 1, power supply test, the operator adjusts the parameters of the power supply module according to the electrical parameters of the product to be tested to appropriate parameters, starts the power supply module, measures the interface output with a measuring tool, if normal, proceeds to the next step, if not, checks the specific reason again; after turning off the power supply module, connect the test system and the product to be tested using the interface board and the adaptive connecting line, connect the power supply of the power supply module after the connection is firm, judge whether it is qualified according to the test purpose, thereby completing the power supply test of the sample to be tested;

[0077] Step 2, valve island test, the operator selects the appropriate valve island type on the valve island function detection module human-computer interaction interface according to the information about the valve drive on the valve island manual or wiring diagram paper, selects the appropriate adapter connection line according to the interface prompt, and connects the corresponding interface board with the valve island to be tested using it, selects the appropriate test parameters on the human-computer interaction interface, and clicks to start. The special PLC module receives the instruction and sequentially outputs the drive signal to the valve island to be tested according to the set process. The operator observes whether the action of the valve island is according to the preset parameters, thereby completing the function test of the valve island to be tested;

[0078] Step 3, temperature control test, the operator sets the corresponding parameters on the human-computer interaction interface according to the heating requirements of the heating equipment to be tested, and connects the power supply line and temperature signal line of the heating equipment to be tested to the corresponding interfaces of the temperature control module;

[0079] Click the self-tuning button of the loop on the human-computer interaction interface of the temperature control module. The PLC module receives the instruction and starts the PID self-tuning of the heating equipment to be tested. The PLC module in the temperature control module includes a PID parameter tuning unit, a temperature control unit and a temperature deviation calculation unit.

[0080] The PID parameter tuning unit automatically obtains the dynamic characteristics of the system through the step response experiment, and automatically optimizes the PID parameters using an adaptive algorithm. The PID parameter tuning unit outputs the PID parameters suitable for the current working condition, ensuring that the system quickly completes the self-tuning process. The specific parameter tuning process of the PID parameter tuning unit is as follows:

[0081] First, define the ideal second-order reference model without overshoot and fast response :

[0082] ;

[0083] Where s represents the complex variable of Laplace transform, which is used for frequency domain analysis, represents the natural frequency, which is set based on the thermal inertia of the heating equipment to be tested, represents the damping ratio, which is set to 1.0, i.e. critical damping;

[0084] Then perform a step response experiment, apply 50% of the rated power to the heating equipment to be tested, i.e. , record the temperature rise curve based on time ;

[0085] Extract the characteristic parameters, steady-state gain :

[0086] ;

[0087] Where, is the system power of the heating equipment to be tested The steady-state temperature value at that time. The initial temperature before the step response experiment begins is represented by the inverse initial parameter based on the steady-state gain K;

[0088] Equivalent time constant :

[0089] ;

[0090] in, express The time of intersection between the tangent line at the point of maximum slope and the initial temperature line. express The time of intersection between the tangent at the point of maximum slope and the steady-state temperature line, 1.2 is an empirical correction coefficient derived from the Ziegler-Nichols tuning rule;

[0091] Then, the Chien-Hrones-Reswick tuning rule is applied, based on the steady-state gain. inverse ratio and equivalent time constant Initial parameters: PID parameters, i.e., proportional parameters Integral parameters and differential parameters ;

[0092] Adaptive parameter adjustment: The PID parameters are dynamically adjusted based on the error between the reference model and the actual output.

[0093] ;

[0094] in, Indicates time, , and The gain coefficient, used to control the adjustment speed of PID parameters, ranges from 0.01 to 0.1; a larger value results in faster convergence. , and The sensitivity of the error to the PID parameters is calculated using the numerical difference method. This represents the temperature tracking error, i.e., the error caused by the reference model. The theoretical temperature obtained by discretization calculation Compared with actual temperature Real-time tracking error;

[0095] Parameter convergence judgment is based on the temperature control stability index H, which sets convergence conditions. When the temperature tracking error... Once the parameter is determined to be converged, tuning stops, and the final output is given. , and .

[0096] PID parameter setting unit adopts advanced method, defines ideal second order reference model, carries out step response experiment to extract characteristic parameters, then uses setting rule to set initial PID parameters, and dynamically adjusts PID parameters according to error between reference model and actual output, finally realizes automatic convergence of parameters. This intelligent parameter self-setting mode gets rid of traditional artificial experience dependence, can quickly and accurately find optimal PID parameter combination suitable for current working condition, greatly shortens test preparation time, improves test efficiency, and also avoids problems such as temperature overshoot and slow response caused by improper manual setting.

[0097] After self-setting, the system automatically switches to temperature control mode, and the PLC module controls the solid-state relay to continuously output PWM signals, so that the equipment to be heated can be continuously maintained at the target temperature.

[0098] The temperature control unit is used for real-time adjustment and control of output, dynamically adjusts control parameters according to temperature error and its change rate, and stabilizes the temperature in the set value range. The specific temperature control calculation process of the temperature control unit is as follows:

[0099] The set temperature control target temperature value is Then, based on the PID parameter setting unit 、 、 The initialization state space matrix A, B and C are derived through the second order inertia link model, and the state space model is established.

[0100]

[0101] Among them, is the state vector composed of temperature and heating rate at time t, represents the control signal PWM signal of the solid-state relay, that is, the control amount duty ratio, then the future n-step temperature value is predicted through the state space model, and the optimization objective function is constructed:

[0102]

[0103] Among them, represents the temperature value at a certain time in the future predicted by the state space model based on the current state vector, j represents the temperature value index in the prediction step n, and the value range is 1 to n, is the weight of punishing control amount mutation, the greater the value, the more gentle the control, and finally the optimization problem is solved through quadratic programming to obtain the optimal control sequence, update the control amount duty ratio of the solid-state relay.

[0104] ​​​The temperature control parameter is dynamically adjusted according to the temperature error and its change rate by the temperature control unit, so that high-precision temperature control and stable adjustment can be realized. In the temperature control test of the heating element, the temperature can be quickly stabilized near the target value, the temperature deviation of each measuring point is extremely small, the temperature uniformity is excellent, the problem that the performance test accuracy of semiconductor components and the product yield are affected due to large temperature fluctuation is effectively avoided, and the strict requirements of high-precision semiconductor process on temperature control are fully met.

[0105] If the temperature of other points of the heating device needs to be monitored, the temperature signal line can be pasted on the position, and the signal is transmitted to the special PLC module;

[0106] The temperature deviation calculation unit is used for calculating the temperature field distribution, the temperature deviation and the uniformity of multiple measuring points by using statistical analysis and spatial interpolation algorithm based on the real-time data of multiple measuring points collected by the thermocouple extension line, and outputting the maximum deviation and the temperature field distribution. The specific calculation process of the temperature deviation calculation unit is as follows:

[0107] Based on and and the thermocouple multi-point temperature data temperature deviation statistics are carried out, and single-point deviation is calculated :

[0108] ;

[0109] The maximum deviation is calculated :

[0110] ;

[0111] The temperature range R is calculated

[0112] ;

[0113] Wherein, y represents the measuring point index of the thermocouple multi-point temperature data, represents the temperature control target temperature value of the corresponding measuring point y, at the same time, the RBF spatial interpolation method is used to construct the interpolation function, the temperature of the region without arranged measuring points is estimated by using the limited measuring point data, the continuous temperature field cloud picture is generated, the high temperature area and the low temperature area are directly displayed, and then the temperature control test of the to-be-heated equipment is completed through the above operation.

[0114] Step 4, input signal test, the operator selects the output signal type and interface of the product to be tested on the man-machine interface, connects it with the corresponding interface board and the product to be tested according to the interface prompt, starts the product to be tested, observes the type of the signal on the man-machine interface in the signal detection module, and completes the input signal test of the product to be tested.

[0115] The valve island function detection module, the power supply module, the temperature control module and the input signal detection module all have data recording and export functions and an emergency stop button, and can stop the system in an emergency, and the power plug is suitable for ordinary wall plugs.

[0116] Meanwhile, the above modules can be tested independently, can be combined according to actual test requirements, and can integrate two or more units in a stainless steel shell, further reducing the size of the test system under the premise of sacrificing a specified number of interfaces.

[0117] The test system and method integrate valve island function detection, power supply, temperature control and input signal detection and other functional modules, and each module can be tested independently or combined flexibly according to actual test requirements. This design makes the system highly versatile and can meet the diversified test requirements of different types of semiconductor components. Meanwhile, the modules have a unified appearance, and two or more units can be integrated in a stainless steel shell, effectively reducing the size of the system under the premise of sacrificing a small number of specified interfaces, not occupying a large amount of production space, solving the problem of single function or large size of the existing test system, saving valuable space resources for the production workshop of the enterprise, and improving the utilization rate of the production site.

[0118] Embodiments of the present application are given for example and description, although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A small test system for semiconductor components, characterized by, The utility model relates to a valve island function detection module for verifying the functional adaptability of a valve island in a semiconductor device, a power module for providing 24VDC power output, +15VDC power output and 220VAC source output, a temperature control module including a solid-state relay and a thermocouple extension line assembly for receiving input of thermocouple and thermal resistance temperature signals, calculating temperature deviation of each measuring point from a temperature control point, an input signal detection module for receiving input signals of a device under test, allowing an operator to observe signal changes of the device under test through a human-machine interface, and each of the valve island function detection module, the power module, the temperature control module and the input signal detection module has a uniform appearance and includes an adaptive connection line, a PLC module, a power supply module, a stainless steel shell (2), an interface board (4), a human-machine interface (3) and a handle (1), and all have a size of 400mm*300mm*260mm. The power module is connected to the valve island function detection module, the temperature control module and the input signal detection module through the adaptive connection line to provide required power for them. The PLC module in the temperature control module includes a PID parameter setting unit, a temperature control unit and a temperature deviation calculation unit. The PID parameter setting unit automatically acquires system dynamic characteristics through step response experiment and automatically optimizes PID parameters using an adaptive algorithm to output PID parameters suitable for current working conditions, ensuring that the system quickly completes the self-setting process. The temperature control unit is used for real-time adjustment and control output, dynamically adjusts control parameters according to temperature error and its change rate to stabilize the temperature within the set value range. The temperature deviation calculation unit calculates temperature field distribution using statistical analysis and spatial interpolation algorithm based on real-time data of multiple temperature measuring points collected through the thermocouple extension line, calculates temperature deviation and uniformity of multiple measuring points, and outputs maximum deviation and temperature field distribution. The specific parameter setting process of the PID parameter setting unit is as follows: Where s represents a complex variable of Laplace transform for frequency domain analysis, w represents natural frequency, which is set based on thermal inertia of the equipment to be heated, and ζ represents damping ratio, which is set to 1.0, i.e. critical damping. Characteristic parameters are extracted, and steady-state gain μ is: Adaptive parameter adjustment is performed according to error between a reference model and actual output to dynamically adjust PID parameters. The specific temperature control calculation process of the temperature control unit is as follows: Where x(τ) is a state vector composed of temperature and heating rate at τ, and u(τ) represents a control signal PWM signal of the solid-state relay, i.e. duty ratio of the control quantity, and then the temperature value at future n steps is predicted through a state space model to construct an optimization objective function. First define the ideal second order reference model G without overshoot and fast response ref (s): The specific calculation process of the temperature deviation calculation unit is as follows: A step response experiment is then performed, applying to the equipment to be heated 50% of the rated power, i.e. Q step , recording the temperature rise curve T' τ as a function of time. Temperature range R is calculated: where T steady is the steady state temperature value of the system when the power of the device to be heated is Q step , and T0represents the initial temperature before the start of the step response experiment, and then the initial parameter based on the inverse of the steady state gain K; equivalent time constant where τ1represents T' τ the intersection time of the tangent line at the maximum point of the slope with the initial temperature line, τ2represents T' τ the intersection time of the tangent line at the maximum point of the slope with the steady-state temperature line, 1.2 is an empirical correction factor derived from the Ziegler-Nichols tuning rule; Then the Chien-Hrones-Reswick tuning rules are applied, based on the inverse of the steady state gain μ and the equivalent time constant initial parameters PID parameters, i.e. a proportional parameter K P , an integral parameter K I and a derivative parameter K δ ; The valve island function detection module, the power module, the temperature control module and the input signal detection module all have data recording and export functions and an emergency stop button, can stop the system in an emergency, and the power plug is adapted to a common wall plug. Wherein, τ represents time, γP, γI and γδ are gain coefficients for controlling PID parameter adjustment speed, the value range is 0.01-0.1, the greater the value, the faster the convergence, and Indicates the sensitivity of error to PID parameters, which is calculated by numerical difference method, e(τ) indicates temperature tracking error, that is, the real-time tracking error of theoretical temperature T ref (s) obtained by discrete calculation of reference model G ref and actual temperature T actual (τ) Parameter convergence judgment, according to the temperature stability index H set convergence condition, when the temperature tracking error |e(τ)|≤0.2H, determine the parameter convergence, stop setting, output the final K P , K I and K δ ; ​ Set the temperature control target temperature value as T set Then, based on the PID parameter setting unit K P , K I , K δ Initialize the state space matrix A, B and C through the second order inertia link model, and establish a state space model ​ where T pred represents the temperature value at a certain time in the future predicted by the state space model based on the current state vector, j represents the temperature value index in the prediction step n, the value range is 1 to n, λ is the weight of punishing the mutation of the control quantity, the greater the value, the more gentle the control, and finally the optimization problem is solved by quadratic programming to obtain the optimal control sequence, execute the current time u(τ), and update the duty ratio of the solid state relay control quantity; ​ Based on T actual (τ) and T set and thermocouple multi-point temperature data (T1, T2, T y ,...,T m ) to perform temperature deviation statistics, calculate single-point deviation ΔT y : ΔT y = T y - T y,set calculating the maximum deviation ΔT max : ΔT max = max |T y - T y,set | ​ R = max(T y ) - min(T y ) Wherein, y represents the temperature measuring point index of thermocouple multi-point temperature data, T y,set The temperature target value of the corresponding temperature measuring point y is represented, and an interpolation function is constructed by using an RBF space interpolation method, the temperature of the region where the measuring point is not arranged is estimated through limited measuring point data, a continuous temperature field cloud map is generated, and the high-temperature area and the low-temperature area are intuitively displayed.

2. The compact test system for semiconductor components as recited in claim 1, characterized by: ​ 3. The compact test system for semiconductor components as recited in claim 1, wherein: The valve island function detection module, the power module, the temperature control module and the input signal detection module can be tested as independent states, can be tested in combination according to actual test requirements, and can be integrated in a stainless steel shell, so that the volume of the test system is further reduced on the premise of sacrificing the number of specified interfaces.

4. A small test method for semiconductor parts, which is applied to the small test system for semiconductor parts according to any one of claims 1 to 3, characterized by Comprise: Step 1, power supply test, the operator adjusts the parameters of the power supply module to the appropriate parameters according to the electrical parameters of the product to be tested, starts the power supply module, measures the interface output with a measuring tool, if normal, proceed to the next step, if not, check the specific reason; after closing the power supply module, connect the test system and the product to be tested using the interface board and the appropriate connection line, connect the power supply of the power supply module after the connection is firm, judge whether it is qualified according to the test purpose, so as to complete the power supply test of the sample to be tested; Step 2, valve island test, the operator selects the appropriate valve island type on the man-machine interface of the valve island function detection module according to the information about the valve drive on the valve island manual or wiring diagram, selects the appropriate adapter connection line according to the interface prompt, and connects the corresponding interface board and the valve island to be tested using it, at the same time, select the appropriate test parameters on the man-machine interface, click to start, the PLC module receives the instruction and sequentially outputs the drive signal to the valve island to be tested according to the set process, the operator observes whether the action of the valve island is according to the preset parameters, thereby completing the function test of the valve island to be tested; Step 3, temperature control test, the operator sets the basic parameters on the man-machine interface in the temperature control module according to the heating requirements of the heating equipment, connects the power supply line and the temperature signal line of the heating equipment to the corresponding interface of the temperature control module, clicks the self-tuning button of the loop on the man-machine interface of the temperature control module, the PLC module receives the instruction and starts the PID self-tuning of the heating equipment, after self-tuning is completed, the system automatically switches to the temperature control mode, the PLC module controls the solid-state relay to output PWM signal continuously, thereby making the heating equipment continuously maintain at the target temperature; If you want to monitor the temperature of other points of the heating equipment, you can paste the temperature signal line at that position, the signal is transmitted to the PLC module, and the temperature is displayed on the man-machine interface of the temperature control module; Step 4, input signal test, the operator selects the output signal type and interface of the product to be tested on the man-machine interface, connects it with the corresponding interface board and the product to be tested using the appropriate connection line according to the interface prompt, starts the product to be tested, and lets it output the corresponding signal, observes the type of the signal on the man-machine interface of the signal detection module, thereby completing the input signal test of the product to be tested.

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