Optical assembly adopting optical system-in-package and photon lead bonding

Abstract

The invention relates to the technical field of optical communication, and discloses an optical assembly adopting optical system-in-package and photon lead bonding, which comprises a shell, a TX O-SiP optical engine, an RX O-SiP optical engine, a DSP chip and a PCBA, the TX O-SiP optical engine and the RX O-SiP optical engine are arranged in the shell, and the TX O-SiP optical engine and the RX O-SiP optical engine are directly arranged on the PCBA through SMT; an electric chip and an optical chip are integrated into a semiconductor package in a heterogeneous mode through optical system-level packaging, a traditional active optical coupling optical chip is replaced by photon wire bonding (PWB), large-scale wafer-level packaging production can be achieved through O-SiP and PWB, mass production efficiency is greatly improved, and packaging consistency is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of optical communication, and specifically relates to an optical component using optical system-level packaging and photon wire bonding. Background Art

[0002] When encapsulating an optical module using the traditional COB method, individual chips need to be installed one by one. In this process, wire bonding between the electrical chip and the circuit board and optical coupling of the optical chip are required, which requires a variety of production equipment and processes to support, and the mass production efficiency is not high.

[0003] Therefore, in view of the above situation, there is an urgent need to provide an optical component using optical system-level packaging and photon wire bonding to overcome the deficiencies in current practical applications. Summary of the Invention

[0004] In view of the above situation, to overcome the defects of the prior art, the present invention provides an optical component using optical system-level packaging and photon wire bonding, effectively solving the problems in the above background art.

[0005] To achieve the above object, the present invention provides the following technical solution: An optical component using optical system-level packaging and photon wire bonding, including a housing, and further including a TX O-SiP optical engine, an RX O-SiP optical engine, a DSP chip, and a PCBA disposed in the housing, wherein the TX O-SiP optical engine and the RX O-SiP optical engine are directly SMT on the PCBA.

[0006] Preferably, a heat sink is further provided on the DSP chip.

[0007] Preferably, in the TX O-SiP optical engine and the RX O-SiP optical engine, the optical engine is an optical sub-module already equipped with electronic components and a control unit.

[0008] Preferably, the TX O-SiP optical engine includes a VCSEL and an IC corresponding to the VCSEL.

[0009] Preferably, the PWB of the TX O-SiP optical engine is used to guide the light emitted by the VCSEL into the optical fiber and connect to the outside through the optical fiber.

[0010] Preferably, the RX O-SiP optical engine includes a PD and an IC corresponding to the PD.

[0011] Preferably, the PWB of the RX O-SiP optical engine is used to connect to the optical fiber and guide the external light onto the PD.

[0012] Compared with the prior art, the beneficial effects of the present invention are: The optical engine in the form of O-SiP is conducive to efficient integration, and for the later maintenance of the optical module, the entire optical engine can be directly replaced; The packaging form of the optical engine in the form of O-SiP is compact, and the electrical connection between the internal chips can be optimized to be very short, which not only reduces signal loss but also reduces signal crosstalk; On the optical module, photon wire bonding (PWB) is used to achieve end-to-end connection between optical components, replacing the strict active alignment required by the traditional COB method. In addition, it can significantly reduce insertion loss, reduce the possibility of reflection at the optical interface, improve return loss, and reduce optical signal crosstalk between channels; The PWB process is passive, which greatly simplifies the integration of wafer-level lasers and detectors, and can significantly improve production efficiency and scalability; The present invention uses optical system-level packaging (O-SiP) to heterogeneously integrate electrical chips and optical chips into a semiconductor package. Photon wire bonding (PWB) replaces the traditional active optical coupling of optical chips. Using this O-SiP and PWB can achieve large-scale wafer-level packaging production, greatly improving mass production efficiency and ensuring packaging consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention.

[0014] In the drawings: Figure 1 is a schematic structural diagram of the present invention.

[0015] Figure 2 is a schematic side view structure diagram of the TX optical engine in the present invention.

[0016] Figure 3 is a schematic side view structure diagram of the RX optical engine in the present invention.

[0017] In the figure: 1 - housing, 2 - TX O-SiP optical engine, 3 - RX O-SiP optical engine, 4 - DSP chip, 5 - PCBA, 6 - PD, 7 - heat sink, 8 - VCSEL. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Traditional COB optical module assembly is usually carried out in the following order: 1. Chip soldering to the PCB, which requires surface mount technology (SMT), wire bonding, or Flip-chip technology; 2. Optical coupling; 3. Housing assembly. However, the present invention omits the wire bonding / Flip-chip technology and optical coupling, and directly SMTs the TX O-SiP optical engine 2 and the RX O-SiP optical engine 3 onto the PBCA1.

[0020] Please refer to Figures 1 - 3 , a light component adopting optical system-level packaging and photon wire bonding provided by an embodiment of the present invention. The light component adopting optical system-level packaging and photon wire bonding includes a housing, a TX O-SiP optical engine 2, an RX O-SiP optical engine 3, a DSP chip 4, a heat sink 7, and a PCBA 5. Among them, the optical engine is an optical sub-module that already has electronic components and a control unit, which can be completed by large-scale packaging in a chip factory. For example, advanced fan-out wafer-level packaging can be adopted, and it is limited to integrated chips made of silicon materials, and digital and analog integrated chips made of many other materials (such as SiGe, GaAs, etc.) can be integrated. Inside the O-SiP package, the integrated chips are electrically interconnected through a redistribution layer (RDL). The connection to the external PCB can be through a standardized BGA (ball grid array) or LGA (land grid array).

[0021] As Figure 2 shown, the TX O-SiP optical engine 2 contains a light emitting source (laser chip, exemplified by VCSEL 8 here) and a corresponding transmitting end electrical chip (IC), and guides the light emitted by the VCSEL 8 to the optical fiber through the PWB, and then is connected to the outside through the optical fiber.

[0022] As Figure 3 shown, the RX O-SiP optical engine 3 contains a receiving detector (PD6) and a corresponding electrical chip (IC), and guides the external light to the PD6 through connection with the optical fiber through the PWB.

[0023] Currently, the machines for commercial PWBs adopt a two-photon lithography process using 780 nm femtosecond laser pulses. This method can accurately achieve local polymerization of photoresist in three-dimensional space, thereby efficiently and flexibly forming end-to-end bonding tracks between devices.

[0024] In an embodiment of the present invention, an optical engine in the form of O-SiP is conducive to efficient integration, and the entire optical engine can be directly replaced during later optical module maintenance; the optical engine in the form of O-SiP has a compact packaging form, and the electrical connection between internal chips can be optimized to be very short, which not only reduces signal loss but also reduces signal crosstalk; photon wire bonding (PWB) is adopted on the optical module to achieve end-to-end connection between optical components, replacing the strict active alignment required by the traditional COB method. In addition, it can significantly reduce the insertion loss, reduce the possibility of reflection at the optical interface, improve the return loss, and reduce the optical signal crosstalk between channels; the PWB process is passive, greatly simplifies the integration of wafer-level lasers and detectors, and can significantly improve production efficiency and scalability; The present invention uses optical system-in-package (O-SiP) to heterogeneously integrate electrical chips and optical chips into a semiconductor package, and photon wire bonding (PWB) replaces the traditional active optical coupling of optical chips. Using this O-SiP and PWB can achieve large-scale wafer-level packaging production, greatly improving the mass production efficiency and ensuring packaging consistency.

[0025] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An optical component using optical system-level packaging and photonic wire bonding, comprising a housing (1), characterized in that: The invention also comprises a TX O-SiP optical engine (2), an RX O-SiP optical engine (3), a DSP chip (4) and a PCBA (5) which are arranged in the housing (1), wherein the TX O-SiP optical engine (2) and the RX O-SiP optical engine (3) are directly SMT-mounted on the PCBA (5).

2. The optical component using optical system-level packaging and photonic wire bonding according to claim 1, characterized in that: A heat sink (7) is also provided on the DSP chip (4).

3. The optical component using optical system-level packaging and photonic wire bonding according to claim 1, characterized in that: In the TX O-SiP optical engine (2) and the RX O-SiP optical engine (3), the optical engine is an optical sub-module that already has electronic components and a control unit.

4. The optical component using optical system-level packaging and photonic wire bonding according to claim 1, characterized in that: The TX O-SiP optical engine (2) comprises a VCSEL (8) and an IC corresponding to the VCSEL (8).

5. The optical component using optical system-level packaging and photonic wire bonding according to claim 4, characterized in that: The PWB of the TX O-SiP optical engine (2) is used to guide the light emitted by the VCSEL (8) into the optical fiber and connect to the outside through the optical fiber.

6. The optical component using optical system-level packaging and photonic wire bonding according to claim 1, characterized in that: The RX O-SiP optical engine (3) comprises a PD (6) and an IC corresponding to the PD (6).

7. The optical component using optical system-level packaging and photonic wire bonding according to claim 6, characterized in that: The PWB of the RX O-SiP optical engine (3) is used to connect to the optical fiber to guide the external light to the PD (6).

Images