Substrate processing apparatus

Abstract

Disclosed is an apparatus for processing a substrate, and more particularly, a substrate processing apparatus capable of capturing soot generated during substrate processing without forming a vortex in a chamber. The apparatus comprises: an outer cup having a processing space with an open top portion; a support unit for supporting and rotating the substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit and disposed to be lower than the substrate supported on the support unit; a liquid supply unit for supplying a processing solution to the substrate supported on the support unit; a discharge unit for discharging the treatment space; and a trapping unit for trapping soot generated during the processing of the substrate, in which a space between the outer cup and the guide cup is provided as a first discharge passage for guiding an air flow in the processing space to the discharge unit, and the trapping unit is provided in the first discharge passage and includes a plurality of rods spaced apart from each other.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing a substrate, and more particularly, to a substrate processing apparatus capable of capturing soot generated during substrate processing without forming a vortex in a chamber. Background Art

[0002] To fabricate semiconductor devices or flat panel display panels, various processes such as deposition, photolithography, etching, and cleaning are required. Among these processes, the photolithography process includes a coating process of coating a photosensitizer (such as a photoresist) onto a substrate surface to form a film, an exposure process of transferring a circuit pattern onto the film formed on the substrate, and a development process of selectively removing the film formed on the substrate from an exposed area or an area opposite to the exposed area.

[0003] The photoresist used during the coating process generates soot containing particles during substrate processing. It is necessary to appropriately remove the soot because the soot may contaminate the substrate or the device. To remove the soot, a trapping ring may be provided in the discharge path to capture the soot. However, the trapping ring reduces the cross-sectional area of the discharge path and may create a flow stagnation region. The flow stagnation region causes the soot to flow back, which may contaminate the substrate. Summary of the Invention

[0004] The present invention is directed to providing a substrate processing apparatus capable of removing soot generated during substrate processing.

[0005] The present invention is also directed to providing a substrate processing apparatus capable of preventing a reverse air flow from forming in a liquid processing chamber.

[0006] The present invention is also directed to providing a substrate processing apparatus capable of preventing the substrate from being contaminated due to a reverse air flow.

[0007] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art will clearly understand the unmentioned problems through the following description.

[0008] Exemplary embodiments of the present invention provide an apparatus for processing a substrate. The apparatus includes: an outer cup having a processing space with an open top portion; a support unit for supporting and rotating the substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit and disposed below the substrate supported on the support unit; a liquid supply unit for supplying a processing solution to the substrate supported on the support unit; a discharge unit for discharging the processing space; and a trapping unit for trapping soot generated during the processing of the substrate, wherein the space between the outer cup and the guide cup is configured as a first discharge passage for guiding an air flow in the processing space to the discharge unit, and the trapping unit is disposed in the first discharge passage and includes a plurality of rods spaced apart from each other.

[0009] According to an exemplary embodiment, when viewed from above, the plurality of rods may be disposed along the circumferential direction of the substrate supported on the support unit.

[0010] According to an exemplary embodiment, when viewed from above, the plurality of rods may be disposed such that the longitudinal direction is inclined with respect to the radial direction of the substrate supported on the support unit.

[0011] According to an exemplary embodiment, the plurality of rods may be disposed such that the longitudinal direction inclines downward in the direction from the outer cup to the guide cup.

[0012] According to an exemplary embodiment, the guide cup may include: an inner wall surrounding the support unit; an outer wall surrounding the inner wall; and a top wall connecting the inner wall and the outer wall and having an upward convex shape, and providing a second discharge passage surrounded by the outer wall, the inner wall, and the top wall, and the plurality of rods may be installed to pass through the outer wall and extend into the second discharge passage.

[0013] According to an exemplary embodiment, the discharge unit may include a discharge pipe disposed in the second discharge passage.

[0014] According to an exemplary embodiment, the plurality of rods may further include: a plurality of first rods disposed at the same height and spaced apart from each other; and a plurality of second rods disposed at the same height and spaced apart from each other, and the first rods may be disposed at a higher position than the second rods.

[0015] According to an exemplary embodiment, when viewed from above, the first rods and the second rods may not overlap.

[0016] According to an exemplary embodiment, when viewed from above, the spacing between the plurality of adjacent rods may be wider than the thickness of the rods.

[0017] According to an exemplary embodiment, the plurality of rods may be configured to be removable from the guide cup and the outer cup.

[0018] According to an exemplary embodiment, the processing solution may be a photoresist.

[0019] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus including: an outer cup having a processing space with an open top portion; a support unit configured to support and rotate the substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit, and disposed below the substrate supported on the support unit; a liquid supply unit configured to supply a photoresist to the substrate supported on the support unit; a discharge unit configured to discharge the processing space; and a trapping unit configured to trap soot generated during processing of the substrate, wherein a space between the outer cup and the guide cup is configured as a first discharge passage for guiding an air flow in the processing space to the discharge unit, and a space provided by the guide cup is configured as a second discharge passage connected to the first discharge passage, the trapping unit includes a plurality of rods spaced apart from each other, and the plurality of rods are disposed in any one of the first discharge passage and the second discharge passage.

[0020] According to an exemplary embodiment, when viewed from above, the plurality of rods may be disposed along a circumferential direction of the substrate supported on the support unit; when viewed from above, the plurality of rods are disposed such that a longitudinal direction is inclined with respect to a radial direction of the substrate supported on the support unit; and the plurality of rods may be disposed such that the longitudinal direction is inclined downward in a direction from the outer cup to the guide cup.

[0021] According to an exemplary embodiment, the plurality of rods may further include: a plurality of first rods disposed at the same height and spaced apart from each other; and a plurality of second rods disposed at the same height and spaced apart from each other, and the first rods may be disposed at a higher position than the second rods, and when viewed from above, the first rods and the second rods may not overlap.

[0022] According to an exemplary embodiment, when viewed from above, the spacing between the plurality of adjacent rods may be wider than the thickness of the rods.

[0023] According to an exemplary embodiment, the plurality of rods may be configured to be removable from the guide cup and the outer cup.

[0024] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus including: an outer cup having a processing space with an open top portion; a support unit for supporting and rotating the substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit, and disposed below the substrate supported on the support unit; a liquid supply unit for supplying a photoresist to the substrate supported on the support unit; a discharge unit for discharging the processing space; and a trapping unit for trapping soot generated during processing of the substrate, wherein a space between the outer cup and the guide cup is configured as a first discharge passage for guiding an air flow in the processing space to the discharge unit, and the guide cup includes: an inner wall surrounding the support unit; an outer wall surrounding the inner wall; and a top wall connecting the inner wall and the outer wall and having an upwardly convex shape, and the guide cup provides a second discharge passage surrounded by the outer wall, the inner wall, and the top wall, the trapping unit is disposed in the first discharge passage and the second discharge passage and includes a plurality of rods spaced apart from each other, when viewed from above, the plurality of rods are disposed along a circumferential direction of the substrate supported on the support unit, and the plurality of rods are configured such that a longitudinal direction is inclined with respect to a radial direction of the substrate supported on the support unit and is inclined downward in a direction from the outer cup to the guide cup, wherein a first rod and a second rod do not overlap, and the plurality of rods further include: a plurality of first rods disposed at the same height and spaced apart from each other; and a plurality of second rods disposed at the same height and spaced apart from each other, and the first rods are disposed at a higher position than the second rods, and the plurality of rods are mounted to pass through the outer wall and extend into the second discharge passage, and the discharge unit includes a discharge pipe disposed in the second discharge passage.

[0025] According to an exemplary embodiment, when viewed from above, a spacing between the plurality of adjacent rods may be wider than a thickness of the rods.

[0026] According to an exemplary embodiment, the plurality of rods may be configured to be removable from the guide cup and the outer cup.

[0027] According to an exemplary embodiment of the present invention, soot generated during substrate processing can be removed.

[0028] In addition, according to an exemplary embodiment of the present invention, air flow reversal in the liquid processing chamber can be prevented.

[0029] In addition, according to an exemplary embodiment of the present invention, air flow reversal and contamination of the substrate can be prevented.

[0030] The effects of the present invention are not limited to the foregoing effects, and those skilled in the art will clearly understand the effects not mentioned from this specification and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] After reading the detailed description in conjunction with the drawings, various features and advantages of the non-limiting exemplary embodiments of this specification will become apparent. The drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless otherwise specified, the drawings are not considered to be drawn to scale. For clarity, various dimensions in the drawings may be enlarged.

[0032] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0033] Figure 2 is Figure 1 a front view of the substrate processing apparatus.

[0034] Figure 3 is Figure 1 a top plan view of a coating block in the substrate processing apparatus.

[0035] Figure 4 is Figure 1 a top plan view of a developing block in the substrate processing apparatus.

[0036] Figure 5 is schematically showing Figure 3 a top plan view of a transfer robot.

[0037] Figure 6 is schematically showing Figure 3 or Figure 4 a top plan view of an example of a heat treatment chamber.

[0038] Figure 7 is Figure 6 a front view of the heat treatment chamber.

[0039] Figure 8 is schematically showing Figure 3 or Figure 4 a cross-sectional view of an example of a liquid processing chamber.

[0040] Figure 9 is Figure 8 an enlarged view of the discharge passage side of the liquid processing chamber.

[0041] Figure 10 is Figure 8 a view of the capture unit as viewed from above.

[0042] Figure 11 is a diagram schematically showing a substrate processing apparatus according to another exemplary embodiment of the present invention.

[0043] Figure 12 is a diagram schematically showing a substrate processing apparatus according to another exemplary embodiment of the present invention.

[0044] Figure 13 is a diagram schematically showing a substrate processing apparatus according to another exemplary embodiment of the present invention. Detailed Description

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies have not been described in detail.

[0046] The terminology used herein is for the purpose of describing particular example embodiments only and is not limiting. As used herein, unless the context clearly dictates otherwise, the singular forms "a", "an" and "the" may be intended to include the plural forms as well. The terms "comprises", "comprising", "includes" and "including" are inclusive and therefore specify the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. Unless specifically identified as the order of execution, the method steps, processes, and operations described herein should not be construed as necessarily requiring them to be performed in the particular order discussed or illustrated. It should also be understood that additional or alternative steps may be employed.

[0047] When an element or layer is referred to as being "on", "engaged to", "connected to", or "coupled to" another element or layer, it can be directly "on", "engaged to", "connected to", or "coupled to" the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on", "directly engaged to", "directly connected to", or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0048] Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, and / or section from another region, layer, or section. Unless the context clearly indicates otherwise, terms such as "first", "second", and other numerical terms used herein do not imply a sequence or order. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.

[0049] To facilitate the description of the relationship of one element or feature to another element or feature as shown in the figures, spatial relative terms such as "inside", "outside", "beneath", "below", "under", "above", and "over" may be used herein. In addition to the orientation depicted in the figures, the spatial relative terms may be intended to cover different orientations of the device during use or operation. For example, if the device in the figures is flipped, an element described as "beneath" or "below" other elements or features will be oriented "above" the other elements or features. Thus, the exemplary term "below" can cover both an orientation above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein may be interpreted accordingly.

[0050] When the terms "same" or "equivalent" are used in the description of the exemplary embodiments, it should be understood that there may be some imprecision. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within the manufacturing or operating tolerances (e.g., ±10%).

[0051] When the terms "about" or "substantially" are used in conjunction with a numerical value, it should be understood that the relevant numerical value includes manufacturing or operational tolerances in the vicinity of the stated numerical value (e.g., ±10%). Additionally, when the words "generally" and "substantially" are used in conjunction with a geometry, it should be understood that precision of the geometry is not required, but the latitude of the shape is within the scope of the present disclosure.

[0052] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this exemplary embodiment belongs. It should also be understood that terms (including terms defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0053] In this exemplary embodiment, a wafer will be described as an example of an object to be processed. However, in addition to wafers, the technical spirit of the present invention can also be applied to devices used for processing other types of substrates.

[0054] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0055] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention, and Figure 2 is Figure 1 a front view of the substrate processing apparatus. Figure 3 is Figure 1 a top plan view of a coating block in the substrate processing apparatus, and Figure 4 is Figure 1 a top plan view of a developing block in the substrate processing apparatus.

[0056] Referring Figures 1 to 4 to

[0057] The transfer module 100 is arranged to transfer the substrate W between the container C that houses the substrate W therein and the processing module 300. The longitudinal direction of the transfer module 100 is arranged in the second direction 14. The transfer module 100 includes a load port 110 and a transfer frame 130. The container F that houses the substrate W is placed on the load port 110. The load port 110 is located on the opposite side of the processing module 300 with respect to the transfer frame 130. A plurality of load ports 110 can be provided, and the plurality of load ports 110 can be arranged along the second direction 14.

[0058] In the example, as the container F, a hermetic container F such as a front-opening unified pod (FOUP) can be used. The container F can be placed on the load port 110 by a transfer device (not shown) such as an overhead transporter, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0059] A transfer robot 132 is arranged inside the transfer frame 130. Guide rails 136 are arranged inside the transfer frame 130. The longitudinal direction of the guide rails 136 is arranged in the second direction 14. The transfer robot 132 is mounted on the guide rails 136 so as to be movable along the guide rails 136. The transfer robot 132 includes a hand 132a on which the substrate W is placed. The hand 132a can be arranged to be movable back and forth, linearly movable along the third direction, and rotatably movable about the axis of the third direction 16.

[0060] The interface module 500 connects the processing module 300 with an external exposure device 700. The interface module 500 includes an interface frame 501, a buffer unit 510, a cooling unit 520, a transfer mechanism 530, an interface robot 540, and an additional process chamber 560.

[0061] A fan filter unit can be arranged at the top of the interface frame 501, and a downward air flow is formed in the fan filter unit. The buffer unit 510, the cooling unit 520, the transfer mechanism 530, the interface robot 540, and the additional process chamber 560 are arranged inside the interface frame 501.

[0062] The structures and arrangements of the buffer unit 510 and the cooling unit 520 can be the same as or similar to the structures and arrangements of the buffer unit 310 and the cooling unit 320 arranged in the processing module 300. The buffer unit 510 and the cooling unit 520 are arranged adjacent to the end of the transfer chamber 350. The substrate W transferred between the processing module 300, the cooling unit 520, the additional process chamber 560, and the exposure device 700 can be temporarily stopped in the buffer unit 510. The cooling unit 520 can be arranged only at the height corresponding to the coating block 300a between the coating block 300a and the developing block 300b.

[0063] The transfer mechanism 530 can transfer the substrate W between the buffer units 510. The transfer mechanism 530 can also transfer the substrate W between the buffer unit 510 and the cooling unit 520. The transfer mechanism 530 can be provided with the same or a similar structure as the transfer mechanism 330 of the processing module 300. Another transfer mechanism 531 can also be provided in a region opposite to the region where the transfer mechanism 530 is provided with respect to the buffer unit 510.

[0064] The interface robot 540 is provided between the buffer unit 510 and the exposure apparatus 700. The interface unit 540 is provided to transfer the substrate W between the buffer unit 510, the cooling unit 520, the additional process chamber 560, and the exposure apparatus 700. The interface robot 540 includes a hand 542 on which the substrate W is placed, and the hand 542 can be provided to move back and forth, rotate about the third direction 16, and move along the third direction 16.

[0065] The additional process chamber 560 can perform a predetermined additional process before loading the substrate W to be processed in the coating block 300a into the exposure apparatus 700. Optionally, the additional process chamber 560 can perform a predetermined additional process before loading the substrate W to be processed in the exposure apparatus 700 into the developing block 300b. In one example, the additional process can be an edge exposure process for exposing the edge region of the substrate W, or a top surface cleaning process for cleaning the top surface of the substrate W, or a bottom surface cleaning process for cleaning the bottom surface of the substrate W, or an inspection process for performing a predetermined inspection on the substrate W. A plurality of additional process chambers 560 can be provided, and they can be provided to be stacked on top of each other.

[0066] The processing module 300 performs a coating process and a developing process on the substrate W. The processing module 300 includes a coating block 300a and a developing block 300b.

[0067] Before the exposure process, the coating block 300a performs a coating process on the substrate W. After the exposure process, the developing block 300b performs a developing process on the substrate W. A plurality of coating blocks 300a are provided. The plurality of coating blocks 300a can be provided to be stacked on top of each other. A plurality of developing blocks 300b are provided. The plurality of developing blocks 300b can be provided to be stacked with each other. In one example, two coating blocks 300a are provided, and two developing blocks 300b are provided. The plurality of coating blocks 300a can be located below the developing block 300b.

[0068] In one example, a plurality of coating blocks 300a may be provided with the same structure as each other. The films coated onto the substrate W in each of the plurality of coating blocks 300a may be the same type of film. Optionally, the films coated onto the substrate W by each coating block 300a may be different types of films. The film coated onto the substrate W includes a photoresist film. The film coated onto the substrate W may further include an antireflection film. Optionally, the film coated onto the substrate W may further include a protective film.

[0069] In addition, two developing blocks 300b may be provided with the same structure as each other. The developers supplied to the substrate W in the plurality of developing blocks 300b may be the same type of liquid. Optionally, depending on the developing block 300b, the developers supplied to the substrate W may be different types of developers.

[0070] Reference Figure 3 , the coating block 300a includes a buffer unit 310, a cooling unit 320, a hydrophobization chamber 340, a transfer chamber 350, a heat treatment chamber 360, and a liquid processing chamber 380.

[0071] The buffer unit 310, the cooling unit 320, and the hydrophobization chamber 340 are disposed adjacent to the indexing block 100. The hydrophobization chamber 340 and the buffer unit 310 may be arranged in sequence along the second direction 14. In addition, the cooling unit 320 and the buffer unit 310 may be arranged to be stacked on top of each other in the vertical direction.

[0072] The buffer unit 310 includes one or more buffers 312. When a plurality of buffers 312 are provided, the plurality of buffers 312 may be arranged to be stacked on top of each other. The buffer 312 provides a space for the substrate W to stay when the substrate W is transferred between the indexing module 100 and the processing module 300. The hydrophobization chamber 340 provides a hydrophobization treatment to the surface of the substrate W. The hydrophobization treatment may be performed before the coating process on the substrate W. The hydrophobization treatment may be completed by supplying a hydrophobization gas to the substrate W while heating the substrate W. The cooling unit 320 cools the substrate W. The cooling unit 320 includes one or more cooling plates. When a plurality of cooling plates are provided, the plurality of cooling plates may be arranged to be stacked on top of each other. In one example, the cooling unit 320 may be disposed below the buffer unit 310. The cooling plate may have a flow path through which a coolant flows. The substrate W after the hydrophobization treatment may be cooled on the cooling plate.

[0073] The transfer mechanism 330 is disposed between the hydrophobization chamber 340 and the buffer unit 310 and between the hydrophobization chamber 340 and the cooling unit 320. The transfer mechanism 330 is provided for transferring the substrate W between the buffer unit 310, the hydrophobization chamber 340, and the cooling unit 320.

[0074] The transfer mechanism 330 includes a hand 332 on which the substrate W is placed, and the hand 332 can be set to move back and forth, rotate about the third direction 16, and move along the third direction 16. In one example, the transfer mechanism 330 moves in the third direction 16 along a guide rail 334. The guide rail 334 extends from the coating block at the lowest position in the coating block 300a to the developing block at the highest position in the developing block 300b. This allows the transfer mechanism 330 to transfer the substrate W between the blocks 300a and 300b provided on different layers. For example, the transfer mechanism 330 can transfer the substrate W between the coating block 300a and the developing block 300b provided on different layers. The transfer mechanism 330 can also transfer the substrate W between the coating block 300a and the developing block 300b.

[0075] In addition, another transfer unit 331 can also be provided on the side opposite to the side where the hydrophobic chamber 340 is provided with respect to the buffer unit 310. The other transfer unit 331 can be provided to transfer the substrate W between the buffer unit 310 and the cooling unit 320 provided in the same blocks 300a and 300b. In addition, the other transfer unit 331 can be provided to transfer the substrate W between the buffer unit 310 and the cooling unit 320 provided in different blocks 300a and 300b.

[0076] The transfer chamber 350 is arranged such that its longitudinal direction is parallel to the first direction 12. One end of the transfer chamber 350 can be positioned adjacent to the buffer unit 310 and / or the cooling unit 320. The other end of the transfer chamber 350 can be positioned adjacent to the interface module 500.

[0077] A plurality of heat treatment chambers 360 are provided. Some of the heat treatment chambers 360 are arranged along the first direction 12. In addition, some of the heat treatment chambers 360 can be stacked along the third direction 16. The heat treatment chambers 360 can all be located on one side of the transfer chamber 350.

[0078] The liquid processing chamber 380 performs a liquid film forming process to form a liquid film on the substrate W. In one example, the liquid film forming process includes a resist film forming process. The liquid film forming process can include an antireflection film forming process. Optionally, the liquid film forming process can also include a protective film forming process. A plurality of liquid processing chambers 380 are provided. The liquid processing chambers 380 can be located on the opposite side of the heat treatment chambers 360. For example, all of the heat treatment chambers 380 can be located on the other side of the transfer chamber 350. The liquid processing chambers 380 are arranged side by side along the first direction 12. Optionally, some of the liquid processing chambers 1000 can be stacked along the third direction 16.

[0079] In one example, the liquid processing chamber 380 includes a front-end liquid processing chamber 380a and a back-end liquid processing chamber 380b. The front-end liquid processing chamber 380a is arranged relatively close to the indexing module 100, and the back-end liquid processing chamber 380b is arranged closer to the interface module 500.

[0080] The front-end liquid processing chamber 380a coats a first liquid onto the substrate W, and the back-end liquid processing chamber 380b coats a second liquid onto the substrate W. The first liquid and the second liquid can be different types of liquids. In an embodiment, the first liquid can be a liquid for forming an anti-reflection layer, and the second liquid can be a liquid for forming a photoresist film. A photoresist film can be formed on the substrate W that has been coated with an anti-reflection film. Optionally, the first liquid can be a liquid for forming a photoresist film, and the second liquid can be a liquid for forming an anti-reflection film. In this case, an anti-reflection film can be formed on the substrate W on which a photoresist has been formed. Optionally, the first liquid and the second liquid can be of the same type, and both of them can be liquids for forming a photoresist film.

[0081] Reference Figure 4 , the developing block 300b includes a buffer unit 310, a cooling unit 320, a transfer chamber 350, a heat treatment chamber 360, and a liquid processing chamber 380. The arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid processing chamber 380 in the developing block 300b can be the same as the arrangement of the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid processing chamber 380 in the coating block 300a. When viewed from above, the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid processing chamber 380 in the developing block 300b and the buffer unit 310, the cooling unit 320, the transfer chamber 350, the heat treatment chamber 360, and the liquid processing chamber 380 in the coating block 300a can be arranged at overlapping positions.

[0082] The heat treatment chamber 360 performs a heating process on the substrate W. The heating process includes a post-exposure baking process performed on the substrate W after the exposure process is completed, and a hard baking process performed on the substrate W after the developing process is completed.

[0083] The liquid processing chamber performs a developing process by supplying a developer onto the substrate W and developing the substrate W.

[0084] In Figure 3 or Figure 4In [the figure], a transfer chamber 350 is provided with a transfer robot 351. The transfer robot 351 transfers a substrate W between the buffer unit 310, the cooling unit 320, the heat treatment chamber 360, the liquid treatment chamber 380, and the buffer unit 510 or the cooling unit 520 of the interface module 500. In one example, the transfer robot 351 includes a hand 352 on which the substrate W is placed. The hand 352 can be set to move forward and backward, rotate around the third direction 16, and move along the third direction 16. A guide rail 356 is provided in the transfer chamber 350, the longitudinal direction of which is parallel to the first direction 12, and the transfer robot 351 can be set to move on the guide rail 356.

[0085] Figure 5 FIG. is a diagram showing an example of the hand of the transfer robot. Refer to Figure 5 , the hand 352 includes a base 352a and support protrusions 352b. The base 352a may have an annular shape, a part of the circumference of which is curved. The base 352a has an inner diameter larger than the diameter of the substrate W. The support protrusions 352b extend inward from the base 352a. A plurality of support protrusions 352b are provided, and they support the edge region of the substrate W. In one example, the support protrusions 352b can be set in four equally spaced rows.

[0086] Figure 6 FIG. schematically shows Figure 3 or Figure 4 a top plan view of an example of the heat treatment chamber of Figure 7 and Figure 6 is a front view of the heat treatment chamber of

[0087] Refer to Figure 6 and Figure 7 , the heat treatment chamber 360 includes a housing 361, a heating unit 363, and a transfer plate 364.

[0088] The housing 361 is set in a generally rectangular parallelepiped shape. An inlet opening (not shown) is formed in the side wall of the housing 361, through which the substrate W enters and exits. The inlet opening can be kept open. Optionally, a door (not shown) can be provided to open and close the inlet opening. The heating unit 363 and the transfer plate 364 are provided in the housing 361.

[0089] The heating unit 323 includes a heating plate 363a, a cover 363c, and a heater 323b. When viewed from above, the heating plate 363a has a generally circular shape. The heating plate 363a has a diameter larger than that of the substrate W. The heater 363b is mounted on the heating plate 363a. The heater 363b can be set as a heating wire or a heating pattern that is heated by supplying power. The heating plate 363a is provided with lifting pins 363e. The lifting pins 363e are set to be movable in the vertical direction along the third direction 16. The lifting pins 363e receive the substrate W from the transfer robot 352 and place the received substrate W on the heating plate 363a, or lift the substrate W from the heating plate 363a and transfer the substrate to the transfer robot 352. According to an example, three lifting pins 363e can be provided. The cover 363c has a space with an open lower portion therein. The cover 363c is located above the heating plate 363a and is movable in the vertical direction by a driver 363d. The space formed by the cover 363c and the heating plate 363a according to the movement of the cover 363c is set as a heating space for heating the substrate W.

[0090] The transfer plate 364 is set to have a generally disk shape and has a diameter corresponding to the diameter of the substrate W. Notches 364b are formed at the edge of the transfer plate 364. The notches 364b can have a shape corresponding to the protrusions 352b formed on the hand of the transfer robot 352 described above. In addition, the notches 364b are set to correspond in number to the protrusions 352b formed on the hand and are formed at positions corresponding to the protrusions 352b. At the position where the hand and the transfer plate 364 are arranged in the vertical direction, when the vertical positions of the hand and the transfer plate 364 are changed, the substrate W is transferred between the hand 354 and the transfer plate 364. The transfer plate 364 is mounted on a guide rail 364d and can be moved along the guide rail 364d by a driver 364c.

[0091] A plurality of slit-shaped guide grooves 364a are provided in the transfer plate 364. The guide grooves 364a extend from the distal end of the transfer plate 364 to the inside of the transfer plate 364. The longitudinal direction of the guide grooves 364a is set along the second direction 14, and the guide grooves 364a are spaced apart from each other along the first direction 12. When transferring the substrate W between the transfer plate 364 and the heating unit 363, the guide grooves 364a prevent the transfer plate 364 and the lifting pins 363e from interfering with each other.

[0092] The transfer plate 364 is made of a heat-conductive material. In one example, the transfer plate 364 can be made of a metal material.

[0093] A cooling flow path 364 is formed in the transfer plate 364. The cooling flow path 364 is supplied with a coolant. The substrate W that has been fully heated in the heating unit 363 can be cooled while being transferred by the transfer plate 364. In addition, when the transfer plate 364 stops so that the substrate W is received by the transfer robot 351, the substrate W can be cooled on the transfer plate 364.

[0094] Optionally, a cooling unit can also be provided inside the housing 361. In this case, the cooling unit can be arranged in parallel with the heating unit 363. The cooling unit can be provided as a cooling plate in which channels are formed, and the coolant flows through the channels. The substrate that has been heated in the heating unit can return to the cooling unit for cooling.

[0095] Figure 8 is schematically shown Figure 3 or Figure 4 a cross-sectional view of an example of a liquid processing chamber, Figure 9 is Figure 8 an enlarged view of the discharge channel side of the liquid processing chamber, and Figure 10 is Figure 8 a view of the trapping unit as viewed from above.

[0096] Refer to Figures 8 to 10 , the liquid processing chamber 380 includes a housing 382, an outer cup 384, a support unit 386, a liquid supply unit 387, a discharge unit, and a trapping unit 400.

[0097] The housing 382 is provided in the shape of a rectangular column having an internal space. An opening 382a is formed in one side of the housing 382. The opening 382a serves as a passage through which the substrate W enters and exits. A door (not shown) is installed in the opening 382a, and the door opens and closes the opening.

[0098] The internal space of the housing 382 is provided with an outer cup 384. The outer cup 384 has a processing space with an open top.

[0099] The support unit 386 supports the substrate W inside the processing space of the outer cup 384. The support unit 386 includes a support plate 386a, a rotating shaft 386b, and a driver 386c. The support plate 386a is provided with a circular top surface. The support plate 386a has a diameter smaller than that of the substrate W. The support plate 386a is arranged to support the substrate W by vacuum pressure. The rotating shaft 386b is coupled to the center of the lower surface of the support plate 386a, and the driver 386c is provided on the rotating shaft 386b to provide a rotational force to the rotating shaft 386b. The driver 386c can be a motor. In addition, a lifting driver (not shown) can be provided to adjust the relative height of the support plate 386a and the outer cup 384.

[0100] The liquid supply unit 387 supplies a processing solution onto the substrate W. When the liquid processing chamber 380 is provided in the coating block 300a, the processing solution may be a liquid for forming a photoresist film, an antireflection film, or a protective film. When the liquid processing chamber 380 is provided in the developing block 300b, the processing solution may be a developer liquid. The liquid supply unit 387 has a nozzle 387a, a nozzle support 387b, and a liquid supply source (not shown). The nozzle 387a discharges the processing solution onto the substrate W. The nozzle 387a is supported on the nozzle support 387b. The nozzle support 387b moves the nozzle 387a between a process position and a standby position. At the process position, the nozzle 387a supplies the processing solution to the substrate W placed on the support plate 386a, and after the supply of the processing solution is completed, the nozzle 387a waits at the standby position. At the standby position, the nozzle 387a waits at the receiving port 388, which is located outside the outer cup 384 within the housing 382.

[0101] A fan filter unit 383 is provided on the top wall of the housing 382 to supply a downward air flow to the internal space. The fan filter unit 383 includes a fan that introduces air from the outside into the internal space and a filter that filters the air from the outside.

[0102] The outer cup 384 includes a bottom wall 384a, a side wall 384b, and a top wall 384c. The inner portion of the outer cup 384 is set as the above-mentioned internal space. The internal space includes a processing space at the top and a discharge space at the bottom.

[0103] The bottom wall 384a is set in a circular shape and has an opening at the center. The side wall 384b extends upward from the outer end of the bottom wall 384a. The side wall 384b is set in an annular shape and is set perpendicular to the bottom wall 384a. In one example, the side wall 384b extends to the same height as the top surface of the support plate 386a, or extends to a height slightly lower than the top surface of the support plate 386a. The top wall 384c has an annular shape with an opening at the center. The top wall 384c is provided with an upward slope from the top end of the side wall 384b toward the central axis of the outer cup 384.

[0104] The guide cup 385 is positioned on the inner side of the outer cup 384. The guide cup 385 has an inner wall 385a, an outer wall 385b, and a top wall 385c. The inner wall 385a has a through hole penetrating in the vertical direction. The inner wall 385a is arranged to surround the driver 386c. The inner wall 385a minimizes the exposure of the driver 386c to the air flow 84 in the processing space. The rotation axis 386b of the support unit 386 and / or the driver 386c extends through the through hole in the vertical direction. The outer wall 385b is spaced apart from the inner wall 385a and is arranged to surround the inner wall 385a. The outer wall 385b is spaced apart from the side wall 384b of the outer cup 384. The inner wall 385a is spaced upward from the bottom wall 384a of the outer cup 384. The top wall 385c connects the upper end of the outer wall 385b to the upper end of the inner wall 385a. The top wall 385c has an annular shape and is arranged to surround the support plate 386a. In one example, the top wall 385c has an upward convex shape.

[0105] The bottom wall 384a of the outer cup 384 is connected to an outlet pipe 381a and an outlet pipe 381b for discharging the processing solution. When viewed from above, the outlet pipe 381a can be connected to the outer cup 384 from the outside of the outer wall 385b. When viewed from above, the outlet pipe 381a can be connected to the outer cup 384 from the outside of the outer wall 385b.

[0106] The space below the support plate 386a in the processing space can be set as a discharge channel. The discharge channel includes a first discharge channel E1 and a second discharge channel E2. The gas in the processing space can be discharged through the first discharge channel E1 and the second discharge channel E2 in sequence.

[0107] The first discharge channel E1 can be defined by the outer cup 384 and the guide cup 385. In one example, the first discharge channel E1 can be provided with a space surrounded by the side wall 384b, the top wall 384c, the outer wall 385b, and the top wall 385c and / or a space below the surrounded space as a discharge space.

[0108] The second discharge channel E2 can be defined by the guide cup 385. In one example, the second discharge channel E2 can be provided with a space surrounded by the inner wall 385a, the outer wall 385b, and the top wall 385c and / or a space below the surrounded space as a discharge space.

[0109] The discharge unit discharges the inside of the outer cup 384 and the guide cup 385. The discharge unit includes a discharge pipe 388a. The discharge pipe 388a is connected to the bottom wall 384a. The discharge pipe 388a penetrates the bottom wall 384a and is connected to the second discharge channel E2.

[0110] The trapping unit 400 traps the soot generated during the processing of the substrate W. The trapping unit 400 may be disposed in the first discharge passage E1 and the second discharge passage E2. The trapping unit 400 includes a plurality of rods 410.

[0111] The plurality of rods 410 are spaced apart from each other. When viewed from above, the plurality of rods 410 may be disposed along the circumferential direction of the substrate W supported on the support unit 386. The plurality of rods 410 may be disposed such that their longitudinal directions are inclined with respect to the radial direction of the substrate W supported on the support unit 386. The plurality of rods 410 may be disposed to incline downward from the outer cup 384 toward the guide cup 385. The plurality of rods 410 may be removably disposed. The plurality of rods 410 include a plurality of first rods 411 and a plurality of second rods 412. When viewed from above, the spacing between the plurality of adjacent rods 410 may be set wider than the thickness of the rods 410.

[0112] The plurality of first rods 411 are installed in the first discharge passage E1. The plurality of first rods 411 are disposed at the same height and spaced apart from each other. The plurality of first rods 411 may be disposed in a shape extending from the side wall 384b to the top wall 385c. The plurality of first rods 411 may also be disposed in a shape penetrating the top wall 385c and extending into the second discharge passage E2.

[0113] The plurality of second rods 412 are installed in the second discharge passage E2. The plurality of second rods 412 are disposed at the same height and spaced apart from each other. The plurality of second rods 412 may be disposed in a shape extending from the outer wall 385b into the second discharge passage E2. The plurality of second rods 412 may also be disposed in a shape penetrating the outer wall 385b and extending into the first discharge passage E1.

[0114] The first rods 411 may be disposed at a higher position than the second rods 412. When viewed from above, the first rods 411 and the second rods 412 may be disposed so as not to overlap.

[0115] According to an exemplary embodiment of the present invention, the soot can be trapped by the plurality of rods 410 disposed in the discharge passage. Since the plurality of rods 410 are disposed in the first discharge passage E1 and the second discharge passage E2, soot leakage can be minimized. In addition, the shape of the rods minimizes the influence on the cross-sectional area of the discharge passage, thereby minimizing reverse air flow or eddy currents. Therefore, soot backflow and contamination of the substrate W can be minimized.

[0116] In the above example, the present invention has been described by taking as an example the case where no separate structure is provided on the upper surface of the top wall 385c. However, the present invention is not limited thereto, and a plurality of annular protrusions 385d may be provided on the upper surface of the top wall 385c, as Figure 11 shown.

[0117] In addition, in the above examples, the present invention has been described by taking as an example the case where the gas-liquid separation plate 389 is not provided on the bottom wall 384a of the outer cup. However, the present invention is not limited thereto, and the gas-liquid separation plate 389 may be provided on the bottom wall 384a. The gas-liquid separation plate 389 may be provided to extend upward from the bottom wall 384a of the outer cup 384. The gas-liquid separation plate 1230 may be provided in an annular shape. When viewed from above, the gas-liquid separation plate 389 may be positioned between the side wall 384b of the outer cup 384 and the outer wall 385b of the guide cup 385. The top end of the gas-liquid separation plate 389 may be positioned lower than the bottom end of the outer wall 385b of the guide cup 385. When the gas-liquid separation plate 389 overlaps with the plurality of rods 410, the plurality of rods 410 may penetrate through the gas-liquid separation plate 389.

[0118] In addition, in the above examples, the present invention has been described by taking as an example the case where both the first rod 411 and the second rod 412 are provided. However, the present invention is not limited thereto, and only the first rod 411 may be provided, as Figure 12 shown.

[0119] In addition, in the above examples, the present invention has been described by taking as an example the case where both the first rod 411 and the second rod 412 are provided in the first discharge passage E1 and the second discharge passage E2 and are installed through the top wall 385c at the same time. However, the present invention is not limited thereto, and both the first rod 411 and the second rod 412 may be provided only in the first discharge passage E1, as Figure 13 shown.

[0120] It should be understood that exemplary embodiments are disclosed herein, and other variations are possible. Individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable and can be used, where applicable, in selected exemplary embodiments even if not specifically shown or described. Such modifications should not be regarded as departing from the spirit and scope of the present invention, and all such modifications that will be apparent to those of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: an outer cup having a processing space with an open top portion; a supporting unit for supporting and rotating a substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit, and disposed lower than the substrate supported on the support unit; a liquid supply unit for supplying a processing solution to the substrate supported on the support unit; a discharge unit, the discharge unit being used to discharge the processing space; as well as a capture unit for capturing fumes generated during processing of the substrate, wherein the space between the outer cup and the guide cup is configured to guide the airflow in the processing space to the first discharge channel in the discharge unit, and The capturing unit is disposed in the first discharge channel and includes a plurality of rods spaced apart from each other. 2 . The apparatus according to claim 1 , wherein the plurality of rods are arranged along a circumferential direction of the substrate supported on the support unit when viewed from above. 3 . The apparatus according to claim 1 , wherein the plurality of rods are arranged such that a longitudinal direction thereof is inclined with respect to a radial direction of the substrate supported on the supporting unit when viewed from above.

4. The apparatus according to claim 1, wherein the plurality of rods are arranged with a longitudinal direction inclined downward in a direction from the outer cup to the guide cup.

5. The apparatus of claim 1, wherein the guide cup comprises: an inner wall, the inner wall surrounding the support unit; an outer wall, the outer wall surrounding the inner wall; as well as A top wall connects the inner wall and the outer wall and has an upwardly convex shape, and provides a second discharge passage surrounded by the outer wall, the inner wall, and the top wall.

6. The apparatus of claim 5, wherein the plurality of rods are mounted to pass through the outer wall and extend to the second discharge passage. 7 . The apparatus of claim 6 , wherein the discharge unit comprises a discharge pipe provided in the second discharge passage.

8. The apparatus of claim 2, wherein the plurality of rods further comprises: a plurality of first rods disposed at the same height as each other and spaced apart from each other; as well as a plurality of second rods, the plurality of second rods being disposed at the same height as each other and spaced apart from each other, and The first rod is disposed at a higher position than the second rod.

9. The apparatus of claim 8, wherein the first rod and the second rod do not overlap when viewed from above.

10. The apparatus of claim 1, wherein a spacing between a plurality of adjacent rods is wider than a thickness of the rods when viewed from above.

11. The apparatus of claim 1 , wherein the plurality of rods are configured to be removable from the guide cup and the outer cup.

12. The apparatus of claim 1, wherein the processing solution is a photoresist.

13. An apparatus for processing a substrate, the apparatus comprising: an outer cup having a processing space with an open top portion; a supporting unit for supporting and rotating a substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit, and disposed lower than the substrate supported on the support unit; a liquid supply unit for supplying a photoresist to the substrate supported on the support unit; a discharge unit, the discharge unit being used to discharge the processing space; as well as a capture unit for capturing fumes generated during processing of the substrate, wherein the space between the outer cup and the guide cup is configured to guide the airflow in the processing space to the first discharge channel in the discharge unit, and The space provided by the guide cup is provided as a second discharge channel connected to the first discharge channel, The capture unit includes a plurality of rods spaced apart from each other, and The plurality of rods are disposed in any one of the first discharge passage and the second discharge passage.

14. The apparatus according to claim 13, wherein the plurality of rods are arranged along a circumferential direction of the substrate supported on the support unit when viewed from above, wherein the plurality of rods are arranged such that a longitudinal direction thereof is inclined relative to a radial direction of the substrate supported on the support unit when viewed from above, and The plurality of rods are arranged such that the longitudinal direction thereof is inclined downward in a direction from the outer cup to the guide cup.

15. The apparatus of claim 13, wherein the plurality of rods further comprises: a plurality of first rods disposed at the same height as each other and spaced apart from each other; as well as a plurality of second rods, the plurality of second rods being disposed at the same height as each other and spaced apart from each other, and The first rod is disposed at a higher position than the second rod, and When viewed from above, the first rod and the second rod do not overlap.

16. The apparatus of claim 15, wherein a spacing between a plurality of adjacent rods is wider than a thickness of the rods when viewed from above.

17. The apparatus of claim 13, wherein the plurality of rods are configured to be removable from the guide cup and the outer cup.

18. An apparatus for processing a substrate, the apparatus comprising: an outer cup having a processing space with an open top portion; a supporting unit for supporting and rotating a substrate in the processing space; a guide cup disposed in the processing space, surrounding the support unit, and disposed lower than the substrate supported on the support unit; a liquid supply unit for supplying a photoresist to the substrate supported on the support unit; a discharge unit, the discharge unit being used to discharge the processing space; as well as a capture unit for capturing fumes generated during processing of the substrate, wherein the space between the outer cup and the guide cup is configured to guide the airflow in the processing space to the first discharge channel in the discharge unit, and The guide cup comprises: an inner wall, the inner wall surrounding the support unit; an outer wall surrounding the inner wall; and a top wall connecting the inner wall and the outer wall and having an upwardly convex shape, and The guide cup provides a second drainage channel surrounded by the outer wall, the inner wall and the top wall, The trapping unit is disposed in the first discharge channel and the second discharge channel and includes a plurality of rods spaced apart from each other, When viewed from above, the plurality of rods are arranged along a circumferential direction of the substrate supported on the support unit, and The plurality of rods are arranged such that their longitudinal directions are inclined relative to the radial direction of the substrate supported on the support unit, and such that their longitudinal directions are inclined downward in a direction from the outer cup to the guide cup, The plurality of rods further comprises: a plurality of first rods disposed at the same height as each other and spaced apart from each other; and a plurality of second rods, the plurality of second rods being disposed at the same height as each other and spaced apart from each other, and The first rod is disposed at a higher position than the second rod, and When viewed from above, the first rod and the second rod do not overlap, and The plurality of rods are mounted to pass through the outer wall and extend to the second discharge passage, and The discharge unit includes a discharge pipe disposed in the second discharge passage.

19. The apparatus of claim 18, wherein a spacing between a plurality of adjacent rods is wider than a thickness of the rods when viewed from above.

20. The apparatus of claim 18, wherein the plurality of rods are configured to be removable from the guide cup and the outer cup.

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