Server cooling units

Abstract

The present application discloses a server cooling device, which relates to the field of server cooling technology. The server cooling device includes an internal heat dissipation circulation device, an external cooling device, and a heat-conducting connection device. The internal heat dissipation circulation device is detachably mounted on a heating element within a server housing. A circulation cavity for a first cooling medium is disposed within the internal heat dissipation circulation device. The circulation cavity includes a heat dissipation cavity, a condensation cavity, and a diversion cavity. One end of the heat dissipation cavity is adjacent to the heating element within the housing, and the other end of the heat dissipation cavity is connected to the condensation cavity. The diversion cavity connects the condensation cavity and the heat dissipation cavity. The external cooling device includes a cooling element and a cooling source. The cooling element is disposed on the outer side of the housing and adjacent to the condensation cavity. One end of the heat-conducting connection device contacts the cooling element, and the other end of the heat-conducting connection device extends into the housing and contacts the outer surface of the internal heat dissipation circulation device. The present invention can facilitate the operation and maintenance of the server, thereby improving the efficiency of operation and maintenance.

Description

Technical Field

[0001] The present application relates to the technical field of server cooling, and in particular to a server cooling device. Background Art

[0002] The server cooling device in the related art is to place a cold plate inside the server and connect the cold plate to an external cooling device through a cooling pipe. The cooling device requires a large constant pressure liquid injection, liquid drainage, drying, nitrogen filling and other devices, which makes the server operation and maintenance inconvenient and the efficiency is low. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems in the related art to a certain extent. To this end, an embodiment of the present invention provides a server cooling device that can facilitate the operation and maintenance of the server and help improve the operation and maintenance efficiency.

[0004] The server cooling device of this embodiment includes an internal heat dissipation circulation device, an external cooling device and a heat-conducting connection device. The internal heat dissipation circulation device is detachably arranged on the heating element in the shell of the server. A circulation cavity for a first cooling medium is arranged in the internal heat dissipation circulation device. The circulation cavity includes a heat dissipation cavity, a condensation cavity and a guide cavity. One end of the heat dissipation cavity is adjacent to the heating element, and the other end of the heat dissipation cavity is connected with the condensation cavity. The guide cavity is connected with the condensation cavity and the heat dissipation cavity, so that the first cooling medium forms an internal circulation in the heat dissipation cavity, the condensation cavity and the guide cavity, and the internal circulation is located in the shell; the external cooling device includes a cooling element and a cooling source, and the cooling source is used to supply a second cooling medium to the cooling element. The cooling element is arranged on the outer side surface of the shell, and the cooling element is adjacent to the condensation cavity; one end of the heat-conducting connection device is in contact with the cooling element, and the other end of the heat-conducting connection device extends into the shell and contacts the outer surface of the internal heat dissipation circulation device. The heat-conducting connection device is arranged adjacent to the condensation cavity and is arranged opposite to the condensation cavity in the wall thickness of the shell.

[0005] It can be understood that when the heating element in the server housing generates heat and the temperature reaches a certain value, the liquid first cooling medium in the heat dissipation cavity absorbs the heat generated by the heating element and is converted into a gaseous state. The gaseous first cooling medium flows toward the condensing cavity. In the condensing cavity, the first cooling medium exchanges heat with the second cooling medium in the cooling element through the heat-conducting connection device, thereby converting the gaseous first cooling medium into a liquid state. The liquid first cooling medium can be converted into a liquid state again and flow toward the first end of the circulation cavity. In this way, the heat generated by the heating element is removed from the circulation cavity, thereby cooling the interior of the server housing. The server is cooled by two cooling systems, the internal heat dissipation circulation device and the external cooling device. The internal heat dissipation circulation device and the external cooling device are independent of each other. When the interior of the server is operated and maintained, the external cooling device can still work independently without affecting the operation and maintenance of the server. The internal heat dissipation circulation device is detachably connected to the housing and can be removed from the server when maintenance is required to the interior of the server to avoid interference with the maintenance. The external cooling device can also be managed by professional operators, which can facilitate the operation and maintenance of the server and help improve the efficiency of operation and maintenance.

[0006] In this embodiment, the internal heat dissipation circulation device includes an outer shell and an isolating member, the heat dissipation chamber is located at the bottom of the outer shell, the condensation chamber is located at the top of the outer shell, and the isolating member is arranged in the outer shell and forms the guide chamber between the inner wall surface of the outer shell.

[0007] In this embodiment, the condensation chamber is provided on both sides of the housing that are opposite to each other in the horizontal direction;

[0008] The guide cavities are provided on two sides of the shell that are opposite to each other in a horizontal direction, and the guide cavities on both sides correspond to the condensation cavities on both sides one by one.

[0009] In this embodiment, the housing includes a top plate, a bottom plate, and a peripheral wall. The peripheral wall is provided between the bottom plate and the top plate and extends along the circumference of the housing. The portion of the top plate that encloses the condensation chamber includes a conductive portion, and the conductive portion is in contact with the heat-conductive connection device.

[0010] The conducting portion extends from the inside to the outside and is arranged to be inclined downward, and the heat-conductive connecting device contacts the conducting portion and is adapted in shape.

[0011] In this embodiment, the peripheral wall includes a connecting portion extending from the inside to the outside and arranged to be inclined upward, and the upper end of the connecting portion is connected to the lower end of the conducting portion.

[0012] In this embodiment, in the longitudinal cross-sectional view of the shell, the angle between the connecting portion and the conducting portion is A, and both the connecting portion and the conducting portion are made of shape memory alloy; if the temperature at the top of the heat dissipation cavity is higher than the first preset temperature t1, the angle between the connecting portion and the conducting portion increases to the first preset angle A1; if the temperature at the top of the heat dissipation cavity is lower than the second preset temperature t2, the angle between the connecting portion and the conducting portion decreases to the second preset angle A2; wherein t1>t2, A1>A2.

[0013] In this embodiment, the bottom plate is provided with a guide groove and a uniform flow groove. There are multiple guide grooves, and the multiple guide grooves are evenly spaced along the circumference of the bottom plate of the shell. The uniform flow groove is annular and is provided in the middle of the multiple guide grooves. The guide groove is connected to the uniform flow groove.

[0014] In this embodiment, the flow cross-section of the guide cavity first gradually decreases and then gradually increases from top to bottom.

[0015] In this embodiment, the cooling member is a cooling coil, which is laid on the shell, the inlet of the cooling coil is connected to the outlet of the cooling source, and the outlet of the cooling coil is connected to the inlet of the cooling source; the cooling coil is distributed in an S shape, and the distance between adjacent pipe sections of the cooling coil gradually increases from the middle of the cooling coil to the outside.

[0016] In this embodiment, the internal heat dissipation circulation device further includes a pressure sensor, which is disposed in the circulation cavity and configured to obtain pressure information in the circulation cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A schematic structural diagram of a server cooling device and a server housing provided in an embodiment of the present application;

[0019] Figure 2 A three-dimensional diagram of the internal heat dissipation circulation device provided in an embodiment of the present application after removing the conductive member;

[0020] Figure 3 A cross-sectional view of the internal heat dissipation circulation device provided in an embodiment of the present application in a first position after the conductive member is removed;

[0021] Figure 4A cross-sectional view of the internal heat dissipation circulation device provided in an embodiment of the present application at a second position after the conductive member is removed;

[0022] Figure 5 A cross-sectional view of the internal heat dissipation circulation device provided in an embodiment of the present application at a third position after the conductive member is removed;

[0023] Figure 6 A cross-sectional view of the internal heat dissipation circulation device provided in an embodiment of the present application at a fourth position after the conductive member is removed;

[0024] Figure 7 A schematic structural diagram of the cooling element provided in an embodiment of the present application.

[0025] The above drawings include the following reference numerals:

[0026] 100, housing;

[0027] 1. Internal heat dissipation circulation device; 11. Circulation cavity; 111. Heat dissipation cavity; 112. Condensation cavity; 113. Diversion cavity; 12. Housing; 121. Top plate; 1211. Conducting portion; 122. Bottom plate; 1221. Diversion groove; 1222. Flow-uniform groove; 123. Peripheral wall; 1231. Connecting portion; 13. Isolation member;

[0028] 2. External cooling device; 21. Cooling element;

[0029] 3. Thermal conductive connection device. DETAILED DESCRIPTION

[0030] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0031] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0032] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0033] The embodiment of the present application provides a server cooling device, such as Figures 1 to 3As shown, the server cooling device includes an internal heat dissipation circulation device 1, an external cooling device 2 and a heat conducting connection device 3. The internal heat dissipation circulation device 1 can be detachably arranged on the heating element in the shell 100 of the server. A circulation cavity 11 of a first cooling medium is provided in the internal heat dissipation circulation device 1. The circulation cavity 11 includes a heat dissipation cavity 111, a condensation cavity 112 and a guide cavity 113. One end of the heat dissipation cavity 111 is adjacent to the heating element in the shell 100, and the other end of the heat dissipation cavity 111 is connected to the condensation cavity 112. The guide cavity 113 is connected to the condensation cavity 112 and the heat dissipation cavity 111, so that the first cooling medium is cooled in the heat dissipation cavity 111. , an internal circulation is formed in the condensation chamber 112 and the guide chamber 113, and the internal circulation is located in the shell 100; the external cooling device 2 includes a cooling member 21 and a cooling source, the cooling source is used to supply a second cooling medium to the cooling member 21, the cooling member 21 is arranged on the outer side of the shell 100, and the cooling member 21 is adjacent to the condensation chamber 112; one end of the heat-conducting connecting device 3 is in contact with the cooling member 21, and the other end of the heat-conducting connecting device 3 extends into the shell 100 and contacts the outer surface of the internal heat dissipation circulation device 1, the heat-conducting connecting device 3 is arranged adjacent to the condensation chamber 112 and is arranged opposite to the condensation chamber 112 in the wall thickness of the shell 100.

[0034] For example, the heat source may be a chip inside a server. The first cooling medium may be liquid ammonia or Freon, and the specific type of the first cooling medium may be selected as needed. The second cooling medium may be water or other coolant, which is not limited here.

[0035] The process of the first cooling medium forming an internal circulation in the circulation cavity 11 is as follows: the liquid first cooling medium in the heat dissipation cavity 111 is transformed into a gaseous state under the action of the heating element and flows toward the condensation cavity 112; the first cooling medium is liquefied through heat exchange with the second cooling medium in the external cooling device 2 through the heat-conducting connection device 3 in the condensation cavity 112; and the liquid first cooling medium flows into the heat dissipation cavity 111 through the guide cavity 113.

[0036] Specifically, the height of one end of the heat dissipation cavity 111 adjacent to the heating element is lower than that of one end of the heat dissipation cavity 111 adjacent to the condensation cavity 112, so that when the first cooling medium is vaporized at one end of the heat dissipation cavity 111 adjacent to the heating element, the gaseous first cooling medium can automatically flow to the other end of the heat dissipation cavity 111 and enter the condensation cavity 112.

[0037] It can be understood that when the heating element in the server housing 100 generates heat and the temperature reaches a certain value, the liquid first cooling medium in the heat dissipation cavity 111 absorbs the heat generated by the heating element and is converted into a gaseous state, and the gaseous first cooling medium flows toward the condensation cavity 112. The first cooling medium exchanges heat with the second cooling medium in the cooling element 21 through the heat-conducting connection device 3 in the condensation cavity 112, so that the gaseous first cooling medium is converted into a liquid state. The liquid first cooling medium can be converted into a liquid state again and flow toward the first end of the circulation cavity 11. In this way, the heat generated by the heating element is taken out of the circulation cavity 11, thereby realizing the cooling of the inside of the server housing 100. By setting the heat dissipation cavity 111, the condensation cavity 112 and the conduction cavity 112, the heat dissipation cavity 111, the condensation cavity 112 and the conduction cavity 112 can be realized. Cavity 113 can facilitate the circulation of the first cooling medium along the desired path, and cool the server through two cooling systems, namely the internal heat dissipation circulation device 1 and the external cooling device 2. The internal heat dissipation circulation device 1 and the external cooling device 2 are independent of each other and are not directly connected. When the internal operation and maintenance of the server are carried out, the external cooling device 2 can still work independently and will not affect the operation and maintenance of the server. The internal heat dissipation circulation device 1 can be detachably connected to the shell 100 and can be removed from the server when the internal maintenance of the server is required to avoid interference with the maintenance. The external cooling device 2 can also be managed by professional operators, which can facilitate the operation and maintenance of the server and help improve the operation and maintenance efficiency.

[0038] In this embodiment, the portion of the housing 100 corresponding to the outer cooling device 2 and the inner heat dissipation circulation device 1 can be made of a copper-aluminum alloy, which can improve thermal conductivity and achieve both lightness and high rigidity. Of course, the housing 100 can also be made of other materials, which is not limited here.

[0039] In this embodiment, if Figures 3 to 6 As shown, the internal heat dissipation circulation device 1 includes an outer shell 12 and an isolation member 13. The isolation member 13 is arranged in the outer shell 12 and forms a heat dissipation cavity 111, a guide cavity 113 and a condensation cavity 112 between the inner wall surface of the outer shell 12. The heat dissipation cavity 111 is located at the bottom of the outer shell 12, the condensation cavity 112 is located at the top of the outer shell 12, and the guide cavity 113 is located on the side of the outer shell 12.

[0040] Specifically, the outer bottom of the housing 12 may be disposed on the heating element, so that the housing 12 is in direct contact with the heating element to improve the efficiency of heat exchange, thereby improving the cooling efficiency of the heating element.

[0041] Specifically, the thermal connection device 3 can be made of a material with good thermal conductivity. For example, the thermal connection device 3 can include a copper block. One end of the thermal connection device 3 is clamped on the internal heat dissipation circulation device 1, and the other end is against the inner wall of the shell 100.

[0042] In detail, the middle of the heat dissipation cavity 111 corresponds to the heating center of the heating element, so that the first cooling medium flowing back from the guide cavity 113 on the side of the shell 12 to the heat dissipation cavity 111 can converge from the edge of the shell 12 to the middle, so as to evenly cool the heating element and improve the cooling effect.

[0043] By setting up the shell 12, a closed cavity can be formed, so that the first cooling medium circulates in the shell 100, reducing the risk of leakage of the first cooling medium, and by setting up the isolation member 13 in the shell 100, a heat dissipation cavity 111, a guide cavity 113 and a condensation cavity 112 can be formed between the isolation member 13 and the inner wall of the shell 12. The guide cavity 113 is located on the side of the shell 12, and the first cooling medium flowing back to the heat dissipation cavity 111 can flow from the edge to the middle inside the shell 12, thereby increasing the heat dissipation area.

[0044] In this embodiment, condensation chambers 112 are provided on two horizontally opposite sides of the housing 12. Guide chambers 113 are provided on two horizontally opposite sides of the housing 12, and the guide chambers 113 on both sides correspond to the condensation chambers 112 on both sides.

[0045] Specifically, each condensation chamber 112 may be provided with one guide chamber 113 or multiple guide chambers 113 . For example, each condensation chamber 112 may be provided with two, three or four guide chambers 113 , etc., which is not limited here.

[0046] It can be understood that a condensation chamber 112 is provided on both sides of the shell 12 that are opposite to each other in the horizontal direction, which can expand the heat dissipation area and improve the cooling efficiency, and a guide chamber 113 is provided corresponding to each cooling chamber to improve the reflux efficiency of the first cooling medium.

[0047] In addition, the condensation chamber 112 can also be annular and arranged on the circumference of the edge of the outer shell 12, and the corresponding guide chamber 113 can also be annular. Technicians in this field can choose the method of setting the condensation chamber 112 and the guide chamber 113 according to actual needs, and there is no restriction here.

[0048] In this embodiment, if Figure 1 and Figure 2 As shown, the shell 12 includes a top plate 121, a bottom plate 122 and a peripheral wall 123. The peripheral wall 123 is arranged between the bottom plate 122 and the top plate 121 and extends along the circumference of the shell 12. The part of the top plate 121 that encloses the condensation chamber 112 includes a conduction portion 1211, and the conduction portion 1211 is in contact with the heat-conducting connection device 3.

[0049] The material of the conducting portion 1211 can be different from that of other parts of the housing 12 to improve the heat conduction effect and reduce the cost.

[0050] It can be understood that the shell 12 includes a top plate 121, a bottom plate 122 and a surrounding wall 123. The heat in the shell 12 can be transferred to the external cooling device 2 outside the server shell 100 through the contact between the conduction part 1211 of the top plate 121 and the heat-conducting connection device 3, thereby realizing heat exchange between the first cooling medium and the second cooling medium. The first cooling medium in the shell 12 can dissipate heat to the heating element through the bottom plate 122.

[0051] In this embodiment, the conducting portion 1211 extends from the inside to the outside and is arranged to be tilted downward, and the thermally conductive connection device 3 contacts the conducting portion 1211 and is adapted in shape.

[0052] Specifically, when condensation chambers 112 are provided on both sides of the shell 12 that are opposite to each other in the horizontal direction, the top plate 121 between the two conduction parts 1211 corresponding to the two condensation chambers 112 is recessed in a direction away from the external cooling device 2 to form a gap with the inner wall of the shell 100. The recessed position of the top plate 121 corresponds to the heat dissipation chamber 111, thereby reducing the heat exchange between the gaseous first cooling medium in the heat dissipation chamber 111 and the external cooling device 2 and liquefaction in the heat dissipation chamber 111.

[0053] It is understood that by extending the conductive portion 1211 from the inside out and slanting downward, after the gaseous first cooling medium enters the condensing chamber 112, the conductive portion 1211 can block a portion of the gaseous first cooling medium, causing the gaseous first cooling medium to become liquid and then flow downward along the conductive portion 1211 into the guide chamber 113, thereby increasing the return flow rate. Furthermore, the thermally conductive connection device 3 is in contact with the conductive portion 1211 and has a compatible shape, which helps to improve the heat conduction effect.

[0054] In this embodiment, if Figure 2 As shown, the peripheral wall 123 includes a connecting portion 1231 extending from the inside to the outside and arranged to be inclined upward, and the upper end of the connecting portion 1231 is connected to the lower end of the conductive portion 1211 .

[0055] Specifically, an arc-shaped transition connection is formed between the connecting portion 1231 and the conducting portion 1211 , so that the first cooling medium can flow from the conducting portion 1211 to the connecting portion 1231 .

[0056] It can be understood that by setting the peripheral wall 123 to include a connecting portion 1231 extending from the inside to the outside and arranged upwardly inclined, and connecting the connecting portion 1231 to the lower end of the conduction portion 1211, the space of the condensation chamber 112 can be increased, and the flow rate of the first cooling medium entering the condensation chamber 112 can be reduced, thereby increasing the condensation time and ensuring that there is sufficient liquid first cooling medium to flow back to the heat dissipation chamber 111 through the guide chamber 113.

[0057] In this embodiment, if Figure 2 and Figure 3 As shown, in a longitudinal cross-sectional view of the housing 12, the angle A is formed between the connecting portion 1231 and the conducting portion 1211. Both the connecting portion 1231 and the conducting portion 1211 are made of shape memory alloy. If the temperature at the top of the heat dissipation cavity 111 exceeds a first preset temperature t1, the angle between the connecting portion 1231 and the conducting portion 1211 increases to a first preset angle A1. If the temperature at the top of the heat dissipation cavity 111 falls below a second preset temperature t2, the angle between the connecting portion 1231 and the conducting portion 1211 decreases to a second preset angle A2. Here, t1>t2, and A1>A2.

[0058] It can be understood that the higher the temperature at the top of the heat dissipation cavity 111, the larger the angle between the connecting portion 1231 and the conducting portion 1211, the lower the temperature at the top of the heat dissipation cavity 111, the smaller the angle between the connecting portion 1231 and the conducting portion 1211, the larger the angle between the connecting portion 1231 and the conducting portion 1211, the faster the liquid first cooling medium flows back from the condensing cavity 112 to the guide cavity 113, thereby accelerating the circulation of the first cooling medium to improve the heat dissipation efficiency. Of course, the smaller the angle between the connecting portion 1231 and the conducting portion 1211, the slower the speed at which the liquid first cooling medium flows back from the condensing cavity 112 to the guide cavity 113, thereby reducing the heat dissipation efficiency and avoiding excessively low temperature.

[0059] In this embodiment, the first preset temperature t1 is 60° C., and the first preset angle A1 is 45°; the second preset temperature t2 is 40° C., and the second preset angle A2 is 10°.

[0060] When the first preset temperature t1 is greater than 60°C, the first preset angle A1 can be increased to 45°, and when the second preset temperature t2 is lower than 40°C, the second preset angle A2 can be reduced to 10°. By reasonably setting the value of the first preset angle A1, a better heat dissipation effect can be achieved, so that the temperature inside the server will not be too high or too low.

[0061] In this embodiment, if Figure 4 and Figure 5 As shown, the bottom plate 122 is provided with a guide groove 1221 and a uniform flow groove 1222. There are multiple guide grooves 1221, and the multiple guide grooves 1221 are evenly spaced along the circumference of the bottom plate 122 of the outer shell 12. The uniform flow groove 1222 is annular and is provided in the middle of the multiple guide grooves 1221. The guide groove 1221 is connected to the uniform flow groove 1222.

[0062] Specifically, the guide groove 1221 can extend from below the guide cavity 113 to the middle of the bottom plate 122 , so that the first cooling medium flowing back from the guide cavity 113 can flow smoothly from the edge of the bottom plate 122 to the middle of the bottom plate 122 .

[0063] It can be understood that by arranging multiple guide grooves 1221 at evenly spaced circumferential intervals on the bottom plate 122 of the shell 12, the cooled liquid first cooling medium can quickly flow back to the middle of the bottom plate 122 of the shell 12, that is, into the heat dissipation cavity 111, so as to quickly dissipate heat from the heating element. The ends of the guide grooves 1221 are connected through the annular uniform flow grooves 1222 to achieve uniform flow, so as to make full use of the first cooling medium and help reduce energy consumption.

[0064] In this embodiment, the size of the guide groove 1221 in the circumferential direction of the bottom plate 122 gradually decreases from the edge of the bottom plate 122 to the middle of the bottom plate 122 .

[0065] It can be understood that by setting the guide groove 1221 so that the size in the circumferential direction of the bottom plate 122 gradually decreases from the edge of the bottom plate 122 to the middle of the bottom plate 122, the flow cross-section of the guide groove 1221 gradually decreases, which can increase the flow rate of the first cooling medium and enable the first cooling medium to quickly flow back to the bottom of the heat dissipation cavity 111 to dissipate heat to the heating element in a timely manner.

[0066] In this embodiment, if Figure 5 As shown, the flow cross section of the flow guide cavity 113 gradually decreases and then gradually increases from top to bottom.

[0067] Specifically, the inner wall of the guide cavity 113 is streamlined, which can enhance the turbulence of the liquid, reduce liquid resistance and avoid bubble retention, so that the first cooling medium can quickly flow back to the bottom of the heat dissipation cavity 111. Furthermore, the cone angle of the inlet end of the guide cavity 113 is greater than the cone angle of its outlet end. For example, the cone angle of the inlet end of the guide cavity 113 can be 15°, and the cone angle of the outlet end of the guide cavity 113 can be 30°. Furthermore, the inner diameter of the inlet end of the guide cavity 113 is D1, and the smallest inner diameter of the middle part of the guide cavity 113 in the vertical direction is D2, D2=1 / 3D1, for example, D1 is 12mm, and D2 is 4mm.

[0068] It can be understood that by setting the flow cross-section of the guide cavity 113 to a shape that gradually decreases and then gradually increases in the direction from top to bottom, the inner diameter of the guide cavity 113 adopts such a gradual design, which can reduce the gas flow rate and increase the condensation time of the first cooling medium, so that there is sufficient liquid first cooling medium reflux.

[0069] In this embodiment, the flow guiding cavity 113 includes a plurality of sub-cavities arranged at intervals, and the flow cross-sections of the sub-cavities gradually decrease and then gradually increase from top to bottom.

[0070] It can be understood that by providing a plurality of sub-cavities, the plurality of sub-cavities can divert the first cooling medium, and the first cooling medium is dispersed and refluxed into the heat dissipation cavity 111, which is beneficial to improving the uniformity of the heat dissipation effect.

[0071] In this embodiment, the initial state of the first cooling medium is liquid, and the volume of the first cooling medium is 50%-60% of the volume of the circulation cavity 11 .

[0072] For example, the volume of the first cooling medium is 50%, 52%, 55%, 57% or 60% of the volume of the circulation cavity 11. If the volume of the first cooling medium is too small, it is not conducive to reliable heat dissipation of the heating element. If the volume of the first cooling medium is too large, it is not conducive to the circulation of the first cooling medium in the circulation cavity 11.

[0073] By setting the volume of the first cooling medium to 50%-60% of the volume of the circulation cavity 11, it is beneficial to ensure that the liquid first cooling medium covers the contact surface between the shell 12 and the heating element, while retaining enough space for the gaseous first cooling medium to achieve efficient phase change.

[0074] In this embodiment, a nano-coating capable of reducing contact thermal resistance is provided on a side of the internal heat dissipation circulation device 1 adjacent to the heating element.

[0075] Specifically, the nano coating is provided on the side of the housing 12 adjacent to the heating element. In addition, other coatings may also be provided on the side of the housing 12 adjacent to the heating element, which is not limited here.

[0076] It can be understood that by providing a nano-coating to reduce the contact thermal resistance, the heat dissipation efficiency can be improved, which is beneficial for protecting the heating element from overheating damage.

[0077] In this embodiment, the internal heat dissipation circulation device 1 further includes a pressure sensor (not shown in the figure). The pressure sensor is disposed in the circulation cavity 11 and is configured to obtain pressure information in the circulation cavity 11 .

[0078] By setting up a pressure sensor to monitor the pressure information of the circulation cavity 11, it is possible to determine whether there is an abnormal air pressure in the circulation cavity 11 based on the pressure information, so as to warn of leakage or insufficient working fluid.

[0079] In this embodiment, the cooling element 21 is a cooling coil, which is laid on the server housing 100 . The inlet of the cooling coil is connected to the outlet of the cooling source, and the outlet of the cooling coil is connected to the inlet of the cooling source.

[0080] For example, the cooling coil can be made of flexible metal bellows, which is resistant to high pressure and corrosion.

[0081] The cooling coil can be arranged in a multi-pipe manner, for example, double, triple or quadruple pipes can be used, which can shorten the length of each pipe, accelerate the fluidity of the liquid, and avoid the poor fluidity caused by a single pipe being too long, which affects the heat dissipation effect.

[0082] In this embodiment, the cooling coils are distributed in an S-shape, and the distance between adjacent pipe sections of the cooling coils gradually increases from the middle of the cooling coils to the outside.

[0083] For example, near the middle of the cooling coil, the distance between adjacent pipe sections can be reduced to 5mm, and the edge area can be expanded to 15mm, which can improve the uniformity of heat flux density by 30%.

[0084] Normally, the temperature at the center of the heat source is higher, and tends to gradually decrease toward the periphery. In this embodiment, by setting the distance between adjacent pipe sections of the cooling coil to gradually increase from the middle of the cooling coil to the outside, it is possible to avoid waste of cooling capacity at the end and improve the uniformity of heat dissipation.

[0085] When setting the temperature of the second cooling medium provided by the cooling source, it can be adjusted by detecting the temperature at the bottom of the housing 12. The specific analysis is as follows:

[0086] The internal heat load of the internal heat dissipation circulation device 1 is Q1.

[0087]

[0088] Where Q1 is the internal circulation heat load (KW); Cp1 is the internal circulation liquid constant pressure specific heat (KJ / kg·℃), such as the value of Cp1 can be 4.1868KJ / Kg·℃, which is the inherent value of the first cooling medium selected; r1 is the internal circulation liquid specific weight (Kg / m 3 )For example, the value of r1 can be 1000Kg / m 3 , is inherent to the first cooling medium selected; V s1 is the internal circulation heat dissipation liquid flow rate (m 3 / h) as V s1 The value can be 1.5m 3 / h, which is related to the pressure setting in the circulation chamber 11 and the selected first cooling medium; ∆T1 is the temperature difference (°C), ∆T1 = T2 (shell bottom temperature) - T1 (circulation chamber top temperature); M is the condensation rate coefficient, for example, M can be 2kg / m²·s. The condensation rate coefficient is determined by the length and unit cross-sectional area of ​​the condensation chamber 112 and the angle A of the condensation chamber 112.

[0089] The external circulation heat load of the external circulation cooling component is Q2,

[0090]

[0091] Where Q2 is the external circulation heat load (KW), Cp2 is the external circulation liquid constant pressure specific heat (KJ / kg·℃), such as the value of Cp2 can be 4.1868KJ / Kg·℃, which is the inherent value of the selected second cooling medium; r2 is the external circulation liquid specific weight (Kg / m 3 ), such as the value of r2 can be 1000Kg / m 3 , is the inherent value of the selected second cooling medium, V s2 is the external circulation heat dissipation liquid flow rate (m 3 / h), such as the value of Vs2 can be 1.5m 3 / h, which is related to the circulation pressure and flow rate setting of the second cooling medium. ∆T2 is the temperature difference (°C), ∆T2=T1 (heat dissipation chamber top temperature)-T3 (cooling source set temperature).

[0092] The cooling efficiency of the cooling element 21 is Q3,

[0093]

[0094] Wherein, N is the effective area of ​​the server housing 100 occupied by the cooling element 21, and S is the conduction efficiency of the cooling element 21 (affected by the cooling source and the selected material).

[0095] The calculation formulas for Q1, Q2, and Q3 show that the factors that influence the cooling device's heat dissipation efficiency are ∆T1 and ∆T2. ∆T1 = T2 (casing bottom temperature) - T1 (circulation chamber top temperature), and ∆T2 = T1 (circulation chamber top temperature) - T3 (cooling source set temperature). T2 is primarily determined by the heat output of the heat source. For example, CPU / GPU heat output ranges from 150W to 500W, with an effective operating temperature of approximately 40°C to 90°C. Designing for a maximum temperature of 90°C, with T2 = 90°C and T1 controlled at 60°C, results in a ∆T1 of 30°C. Designing for a minimum temperature of 40°C, with T2 = 40°C and T1 controlled at 30°C, results in a ∆T1 of 10°C. Frequency conversion control can be achieved by adjusting T3 (for example, from 5°C to 20°C). Monitoring T1 (for example, from 30°C to 60°C) can be used to determine whether the cooling device is operating properly.

[0096] The spatial state model and control parameters of the entire cooling device are set as follows:

[0097] T1=f1(T2, T1, Vs1, M);

[0098] T3=f2(T1, T3′, S, N), T3′ is the temperature of the shell 100;

[0099] T3′=f3(T3′, T3, Vs2);

[0100] Static calibration: In a constant temperature environment (such as 25°C), gradually adjust T3 to 5°C and 20°C, record the steady-state value of T1, and establish a T1-T3 mapping table.

[0101] Dynamic test: simulate the load step change of the heating element (such as chip) (such as from 40℃ to 90℃), establish the dynamic response time curve, and adjust the sensitivity of the external cooling device 2 according to the response situation.

[0102] The above is a detailed introduction to a server cooling device provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core concept of the present application. It should be noted that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server cooling device, characterized in that: include: An internal heat dissipation circulation device, the internal heat dissipation circulation device is detachably mounted on a heating element within a server housing, a circulation cavity for a first cooling medium is provided within the internal heat dissipation circulation device, the circulation cavity comprising a heat dissipation cavity, a condensation cavity, and a guide cavity, one end of the heat dissipation cavity being adjacent to the heating element, the other end of the heat dissipation cavity being in communication with the condensation cavity, the guide cavity being in communication with the condensation cavity and the heat dissipation cavity, so that the first cooling medium forms an internal circulation within the heat dissipation cavity, the condensation cavity, and the guide cavity, the internal circulation being located within the housing; an external cooling device, the external cooling device comprising a cooling element and a cooling source, the cooling source being configured to supply a second cooling medium to the cooling element, the cooling element being disposed on an outer side of the shell and adjacent to the condensing chamber; a heat-conducting connecting device, one end of which contacts the cooling element, the other end of which extends into the housing and contacts the outer surface of the internal heat dissipation circulation device, the heat-conducting connecting device being arranged adjacent to the condensing chamber and opposite to the condensing chamber in an upward direction of the wall thickness of the housing; The internal heat dissipation circulation device comprises a shell, the heat dissipation cavity is located at the bottom of the shell, and the condensation cavity is located at the top of the shell; The housing includes a top plate, a bottom plate, and a peripheral wall, wherein the peripheral wall is provided between the bottom plate and the top plate and extends along the circumference of the housing, and the portion of the top plate surrounding the condensation chamber includes a conductive portion, and the conductive portion is in contact with the heat-conducting connection device; The conductive portion extends from the inside to the outside and is arranged to be inclined downward; The condensation chambers are provided on both sides of the shell that are opposite to each other in the horizontal direction. The top plate between the two conduction parts corresponding to the two condensation chambers is recessed in a direction away from the external cooling device, and the recessed position of the top plate corresponds to the heat dissipation chamber.

2. The server cooling device according to claim 1, characterized in that: The internal heat dissipation circulation device includes an isolating member, which is arranged in the shell and forms the guide cavity with the inner wall surface of the shell.

3. The server cooling device according to claim 2, wherein: The guide cavities are provided on two sides of the shell that are opposite to each other in a horizontal direction, and the guide cavities on both sides correspond to the condensation cavities on both sides one by one.

4. The server cooling device according to claim 2, wherein: The heat-conductive connecting device contacts the conducting portion and is adapted in shape.

5. The server cooling device according to claim 4, characterized in that: The peripheral wall includes a connecting portion extending from the inside to the outside and arranged to be inclined upward, wherein an upper end of the connecting portion is connected to a lower end of the conductive portion.

6. The server cooling device according to claim 5, characterized in that: In the longitudinal cross-sectional view of the housing, the angle between the connecting portion and the conducting portion is A, and both the connecting portion and the conducting portion are made of shape memory alloy; If the temperature of the top of the heat dissipation cavity is higher than the first preset temperature t1, the angle between the connecting portion and the conducting portion increases to a first preset angle A1; If the temperature of the top of the heat dissipation cavity is lower than the second preset temperature t2, the angle between the connecting portion and the conducting portion is reduced to a second preset angle A2; Among them, t1>t2, A1>A2.

7. The server cooling device according to claim 4, characterized in that: The bottom plate is provided with a guide groove and a uniform flow groove. There are multiple guide grooves, and the multiple guide grooves are evenly spaced along the circumference of the bottom plate of the shell. The uniform flow groove is annular and is provided in the middle of the multiple guide grooves. The guide groove is connected to the uniform flow groove.

8. The server cooling device according to claim 1, wherein: The flow cross section of the guide cavity gradually decreases and then increases from top to bottom.

9. The server cooling device according to claim 1, wherein: The cooling element is a cooling coil, which is laid on the shell, the inlet of the cooling coil is connected to the outlet of the cooling source, and the outlet of the cooling coil is connected to the inlet of the cooling source; The cooling coils are distributed in an S-shape, and the distance between adjacent pipe sections of the cooling coils gradually increases from the middle of the cooling coils to the outside.

10. The server cooling device according to any one of claims 1 to 9, characterized in that: The internal heat dissipation circulation device further includes a pressure sensor, which is disposed in the circulation cavity and configured to obtain pressure information in the circulation cavity.

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