Capacitor assembly

Abstract

The present disclosure provides a capacitor assembly. The capacitor assembly includes a body including a dielectric layer and alternately disposed first and second internal electrodes with the dielectric layer interposed between the first and second internal electrodes. The first and second internal electrodes and the dielectric layer are wound around an axis extending in a second direction. The capacitor assembly further includes external electrodes disposed on a third surface and a fourth surface of the body opposite to each other in the second direction. The body also has first and second surfaces opposed to each other in a first direction perpendicular to the second direction, and fifth and sixth surfaces opposed to each other in a third direction perpendicular to both the first and second directions.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0196231, filed with the Korean Intellectual Property Office on December 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a capacitor assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is an important chip component used in industries such as communication, computers, household appliances, and automobiles due to its advantages of small size and high capacitance. In particular, multilayer ceramic capacitors are important passive components used in various electrical, electronic, and information communication devices such as mobile phones, computers, and digital televisions (TVs).

[0004] Due to advantages such as small size, high capacitance, and easy installation, multilayer ceramic capacitors can be used as components in various electronic devices. Recently, due to the miniaturization and high performance of electronic devices, multilayer ceramic capacitors have become smaller and have achieved higher capacitance.

[0005] In addition, a multilayer ceramic capacitor is formed by stacking a plurality of internal electrodes and a plurality of dielectric green sheets. When an MLCC having this structure operates in a high-temperature and high-voltage environment, cracks may occur due to the contraction and expansion (electrostriction) of the dielectric layer caused by the piezoelectric phenomenon. In particular, cracks may form between the internal electrode with insufficient adhesion strength and the dielectric layer, which may cause the MLCC to fail. In addition, a conventional multilayer ceramic capacitor may have a step difference in the edge portion according to the change in the stacking degree of the internal electrodes.

[0006] Therefore, there is a need for a new structure and manufacturing method of a capacitor assembly that can suppress electrostriction and step difference while maintaining the capacitance per unit volume achieved in existing multilayer ceramic capacitors. Summary of the Invention

[0007] One aspect of the present disclosure is to reduce the occurrence of cracks in a capacitor assembly by suppressing expansion and contraction caused by electrostriction.

[0008] Another aspect of the present disclosure is to reduce the step difference caused by the difference in the stacking degree of internal electrodes.

[0009] Another aspect of the present disclosure is to improve the productivity of the capacitor assembly.

[0010] However, the object of the present disclosure is not limited to the above, and will be more easily understood in the process of explaining specific exemplary embodiments of the present disclosure.

[0011] According to one aspect of the present disclosure, a capacitor assembly includes: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately arranged with the dielectric layer therebetween, and the first and second internal electrodes being wound around an axis extending in a second direction; and external electrodes provided on third and fourth surfaces of the body that are opposite to each other in the second direction, wherein the body further includes a first surface and a second surface that are opposite to each other in a first direction perpendicular to the second direction and a fifth surface and a sixth surface that are opposite to each other in a third direction perpendicular to the first and second directions.

[0012] According to another aspect of the present disclosure, a capacitor assembly includes: a body including a dielectric layer and alternately arranged first and second internal electrodes with the dielectric layer therebetween, the first and second internal electrodes being wound around an axis extending in a second direction; external electrodes provided on third and fourth surfaces of the body that are opposite to each other in the second direction; and a protective layer provided on a capacitance forming portion of the body, the capacitance forming portion including a region where the first and second internal electrodes are wound around the axis extending in the second direction. Description of the Drawings

[0013] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following specific embodiments in conjunction with the accompanying drawings, in which: Figure 1 is a schematic perspective view of a capacitor assembly according to an exemplary embodiment in the present disclosure; Figure 2 is a schematic perspective view of a body according to an exemplary embodiment in the present disclosure; Figure 3 is a cross-sectional view taken along line I-I' of Figure 1 ; Figure 4 is a cross-sectional view taken along line II-II' of Figure 1 ; Figure 5 is a schematic perspective view of a sheet for forming internal electrodes and a dielectric layer of a capacitor assembly according to an exemplary embodiment; Figure 6 is a schematic perspective view schematically showing a process of winding a sheet for forming internal electrodes and a dielectric layer around an axis extending in a second direction in a manufacturing process of a capacitor assembly according to another exemplary embodiment; Figure 7 is in a capacitor assembly according to another exemplary embodiment and is related toFigure 1 Cross-sectional view corresponding to the II-II' cross-section; Figure 8 is a schematic perspective view schematically showing a sheet for forming an inner electrode and a dielectric layer in a capacitor assembly according to another exemplary embodiment; and Figure 9 is in a capacitor assembly according to another exemplary embodiment and is Figure 1 Cross-sectional view corresponding to the II-II' cross-section. Detailed Description of the Invention

[0014] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. However, the present disclosure can be illustrated in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided to ensure that the present disclosure is thorough and complete and to fully convey the scope of the present disclosure to those skilled in the art. In the drawings, for clarity, the shapes and dimensions of elements may be exaggerated, and the same reference numerals will always be used to denote the same elements.

[0015] To clarify the present disclosure, parts irrelevant to the description are omitted, and the same reference numerals refer to the same elements throughout the specification. In the drawings, for clarity, the thicknesses of layers, films, panels, regions, etc. are exaggerated. Also, in the drawings, although the same reference numerals are shown in different drawings, they refer to the same elements. Throughout the specification, unless explicitly stated to the contrary, the word "comprising" and variations such as "comprises" and "having" will be understood to imply the inclusion of the stated elements but not the exclusion of any other elements.

[0016] Figure 1 is a schematic perspective view of a capacitor assembly according to an exemplary embodiment of the present disclosure.

[0017] Figure 2 is a schematic perspective view of a main body according to an exemplary embodiment of the present disclosure.

[0018] Figure 3 is a cross-sectional view taken along line I-I' of Figure 1 .

[0019] Figure 4 is a cross-sectional view taken along line II-II' of Figure 1 .

[0020] Hereinafter, a capacitor assembly 100 according to an exemplary embodiment of the present disclosure will be described with reference to Figures 1 to 4 .

[0021] The capacitor assembly 100 according to an exemplary embodiment in the present disclosure includes: a main body 110 including a dielectric layer 111 and first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately arranged in a first direction with the dielectric layer 111 therebetween, and the first and second internal electrodes 121 and 122 being wound around an axis extending in a second direction; and external electrodes 131 and 132 respectively provided on a third surface 3 and a fourth surface 4 of the main body 110 that are opposite to each other in the second direction, wherein the main body 110 may further include a first surface 1 and a second surface 2 that are opposite to each other in a first direction perpendicular to the second direction and a fifth surface 5 and a sixth surface 6 that are opposite to each other in a third direction perpendicular to the first and second directions. Additionally, the first and second internal electrodes 121 and 122 may each be wound around an axis extending in the second direction and may each be formed as a single layer.

[0022] The main body 110 may include a dielectric layer 111 and first and second internal electrodes 121 and 122, the first and second internal electrodes 121 and 122 being alternately arranged in a first direction with the dielectric layer 111 therebetween, and the first and second internal electrodes 121 and 122 being wound around an axis extending in a second direction.

[0023] There is no particular limitation on the specific shape of the main body 110, but as Figure 1 shown, the main body 110 may be formed in a hexahedron shape or a shape similar to a hexahedron shape. Due to the shrinkage of the ceramic particles included in the main body 110 during the sintering process, the main body 110 may not have a completely flat surface, but may generally have a hexahedron shape. Specifically, the main body 110 may include a third surface 3 and a fourth surface 4 that are opposite to each other in the second direction, a first surface 1 and a second surface 2 that are opposite to each other in a first direction perpendicular to the second direction, and a fifth surface 5 and a sixth surface 6 that are opposite to each other in a third direction perpendicular to the first and second directions.

[0024] Additionally, referring to Figure 4 , the main body 110 may include: a capacitance forming portion Ac formed with a capacitance and including a region where the first and second internal electrodes 121 and 122 are wound around an axis extending in the second direction; and a protective layer 112 provided on the capacitance forming portion Ac.

[0025] Referring to Figure 2 and Figure 3 , the first internal electrode 121 may be in contact with the third surface 3 and spaced apart from the fourth surface 4, while the second internal electrode 122 may be in contact with the fourth surface 4 and spaced apart from the third surface 3. Thus, voltages of different polarities may be applied to the first and second internal electrodes 121 and 122.

[0026] The dielectric layer 111 forming the main body 110 is in a sintered state, and adjacent dielectric layers 111 can be integrated such that their boundaries are not easily distinguishable without using a scanning electron microscope (SEM).

[0027] The dielectric layer 111 can be formed by: manufacturing a ceramic slurry including ceramic particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a green sheet, and then sintering the green sheet. There is no particular limitation on the ceramic particles as long as sufficient capacitance can be provided thereby. However, for example, barium titanate (BaTiO3)-based particles can be used as the ceramic particles. For a more specific example, the ceramic particles can be barium titanate (BaTiO3)-based particles. For example, the barium titanate (BaTiO3)-based particles can be BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1), or one or more of them. In this case, the dielectric layer 111 can include Ba and Ti.

[0028] There is no particular limitation on the average thickness td of the dielectric layer 111.

[0029] To achieve miniaturization and high capacitance of the capacitor assembly 100, the average thickness td of the dielectric layer 111 can be less than or equal to 1.0 μm, and to improve the reliability of the capacitor assembly 100 at high temperature and high voltage, the average thickness td of the dielectric layer 111 can be greater than or equal to 3.0 μm.

[0030] The first inner electrode 121 and the second inner electrode 122 can be wound around an axis extending in the second direction, and the dielectric layer 111 can be disposed between the first inner electrode 121 and the second inner electrode 122.

[0031] There is no particular limitation on the materials forming the first inner electrode 121 and the second inner electrode 122, and they can include conductive metals with excellent conductivity. For example, the inner electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0032] In addition, the first internal electrode 121 and the second internal electrode 122 may include the same conductive metal, but are not limited thereto, and may include different conductive metals.

[0033] In addition, the first internal electrode 121 may contact the first external electrode 131 at one end of the main body 110 in the second direction, and the second internal electrode 122 may contact the second external electrode 132 at the other end of the main body 110 in the second direction. Additionally, the external electrodes 131 and 132 may include the first external electrode 131 and the second external electrode 132.

[0034] The external electrodes 131 and 132 are respectively disposed on the third surface 3 and the fourth surface 4 of the main body 110, and are respectively connected to the internal electrodes 121 and 122. Specifically, the first external electrode 131 is disposed on the third surface 3 and connected to the first internal electrode 121, while the second external electrode 132 is disposed on the fourth surface 4 and connected to the second internal electrode 122.

[0035] In the exemplary embodiments of the present disclosure, although a structure in which the capacitor assembly 100 has two external electrodes 131 and 132 is described, the number or shape of the external electrodes 131 and 132 may be changed according to the shape of the internal electrodes 121 and 122 or other purposes.

[0036] In addition, the external electrodes 131 and 132 may be formed of any conductive material (such as metal), and the specific material may be selected based on electrical characteristics, structural stability, etc.

[0037] In addition, the external electrodes 131 and 132 may be formed as a single layer or multiple layers, and may include an electrode layer in direct contact with the third surface 3 and the fourth surface 4 and a plating layer provided on the electrode layer. However, it is not limited thereto, and a conductive resin layer including a thermosetting resin and a conductive metal may be provided between the electrode layer and the plating layer.

[0038] The prior art multilayer ceramic capacitor includes a main body formed by alternately stacking dielectric layers and internal electrodes. When a voltage is applied to the end electrodes of the multilayer ceramic capacitor, contraction and expansion of the dielectric layer including the piezoelectric material may occur, thereby applying stress to the entire multilayer ceramic capacitor.

[0039] In addition, when the multilayer ceramic capacitor is used in a high-voltage environment, the amplitude of the stress caused by electrostriction may be further increased, which may cause cracks to appear between the internal electrode and the dielectric layer with insufficient bonding strength.

[0040] The body 110 of the capacitor assembly 100 according to an exemplary embodiment in the present disclosure may include a dielectric layer 111, a first internal electrode 121, and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately arranged in a first direction, and the dielectric layer 111 is interposed therebetween. The first internal electrode 121 and the second internal electrode 122 are wound around an axis extending in a second direction.

[0041] Therefore, by minimizing the difference in the shrinkage behavior of the body 110 in the first direction or the third direction, the occurrence of cracks in the capacitor assembly 100 can be suppressed.

[0042] In addition, in a wound capacitor of the prior art, the body is formed by winding a plurality of dielectric sheets and a plurality of internal electrode sheets, thereby obtaining a generally cylindrical structure. A wound capacitor having such a cylindrical structure has a small effective volume when mounted on a substrate or the like, and thus may have problems such as a reduction in the reliability of ensuring an effective capacitance.

[0043] Therefore, in an exemplary embodiment of the present disclosure, in addition to the third surface 3 and the fourth surface 4 that face each other in the second direction, the body 110 may further include a first surface 1 and a second surface 2 that face each other in a first direction perpendicular to the second direction, and a fifth surface 5 and a sixth surface 6 that face each other in a third direction perpendicular to the first direction and the second direction, thereby improving the effective volume, which can be more beneficial for ensuring an effective capacitance.

[0044] Figure 5 A perspective view schematically showing a sheet for forming an internal electrode and a dielectric layer of a capacitor assembly 100 according to an exemplary embodiment is shown.

[0045] In Figure 5 , the first sheet S1 may include a first green dielectric sheet 11 and a first internal electrode pattern 21 provided on the first green dielectric sheet 11, and the second sheet S2 may include a first green dielectric sheet 11 and a second internal electrode pattern 22 provided on the first green dielectric sheet 11. At this time, the first internal electrode pattern 21 and the second internal electrode pattern 22 may be offset in the second direction. The first green dielectric sheet 11 may be sintered to form the dielectric layer 111, the first internal electrode pattern 21 may be sintered to form the first internal electrode 121, and the second internal electrode pattern 22 may be sintered to form the second internal electrode 122.

[0046] The first sheet S1 and the second sheet S2 may be stacked in the first direction and then wound around an axis in the second direction. The winding direction is not particularly limited as long as the axis is in the second direction.

[0047] In addition, in an exemplary embodiment of the present disclosure, the main body 110 may generally have a hexahedral shape. There is no particular limitation on the method of forming the main body 110 having a generally hexahedral shape. For example, when the first sheet S1 and the second sheet S2 are wound around an axis extending in the second direction, a square pillar-shaped shaft may be used to wind the first sheet S1 and the second sheet S2, or the main body 110 may be formed by the following method: forming a cylindrical rollbody and then processing the cylindrical rollbody into a hexahedral shape using a hexahedral mold, the cylindrical rollbody being formed by winding the first sheet S1 and the second sheet S2 into a cylindrical shape.

[0048] In addition, the second dielectric green sheet 12 may be disposed in a region of the first dielectric green sheet 11 of the first sheet S1 where the first inner electrode pattern 21 is not provided, and the second dielectric green sheet 12 may be disposed in a region of the first dielectric green sheet 11 of the second sheet S2 where the second inner electrode pattern 22 is not provided. Therefore, when the first sheet S1 and the second sheet S2 are wound around an axis extending in the second direction, misalignment or step difference between the sheets can be prevented.

[0049] Figure 6 is a perspective view schematically showing a process of winding sheets for forming inner electrodes and dielectric layers around an axis extending in the second direction in a preparation process of a capacitor assembly 100' according to another exemplary embodiment.

[0050] Referring to Figure 6 , the first sheet S1 and the second sheet S2 may be wound around an axis extending in the second direction to form a rollbody. The rollbody may form the main body 110 after pressing or firing.

[0051] In an exemplary embodiment, the first dielectric green sheet 11 included in the second sheet S2 may be longer in the third direction than the first dielectric green sheet 11 and the first inner electrode pattern 21 included in the first sheet S1 and the second inner electrode pattern 22 included in the second sheet S2. Therefore, an end portion of the first dielectric green sheet 11 included in the second sheet S2 in the third direction may be formed as a protective layer 112 of the main body 110.

[0052] In an exemplary embodiment, the main body 110 may include: a capacitance forming portion Ac, which is formed with capacitance and includes a region where the first inner electrode 121 and the second inner electrode 122 are wound around an axis extending in the second direction; and a protective layer 112, which is disposed on the capacitance forming portion Ac.

[0053] The protective layer 112 may serve to improve the mechanical strength and moisture-proof reliability of the capacitor assembly 100.

[0054] In addition, in order to ensure moisture-proof reliability of the capacitor assembly 100 , the protective layer 112 may cover the end portions of the first internal electrode 121 and the end portions of the second internal electrode 122 .

[0055] The composition of the protective layer 112 is not particularly limited, but may include a composition having excellent mechanical strength, moisture-proof reliability, and excellent insulation.

[0056] In addition, in the manufacturing process of the capacitor assembly 100, the dielectric layer 111 and the protective layer 112 may be integrally formed. That is, in an exemplary embodiment, the protective layer 112 may contact the end of the dielectric layer 111. In addition, the protective layer 112 may include the same material as the dielectric material included in the dielectric layer 111.

[0057] Figure 7 is a capacitor assembly according to another exemplary embodiment. Figure 1 The cross-sectional view corresponding to the II-II' section. Figure 7 , the protective layer 112 may be formed to have a thickness greater than that of the dielectric layer 111. That is, in an exemplary embodiment, the average thickness tm of the protective layer 112 may be greater than the average thickness td of the dielectric layer 111. Therefore, the moisture-proof reliability of the capacitor assembly 100' may be further improved. The method for forming the protective layer 112 having an average thickness tm greater than the average thickness td of the dielectric layer 111 is not particularly limited, but as Figure 6 As shown in , the first dielectric green sheet 11 included in the second sheet S2 may be formed to be longer in the third direction than the first dielectric green sheet 11 and the first internal electrode pattern 21 included in the first sheet S1 and the second internal electrode pattern 22 included in the second sheet S2, and the length of the exceeding portion is the circumference of the body 110 or more.

[0058] The method for measuring the average thickness tm of the protective layer 112 and the average thickness td of the dielectric layer 111 is not particularly limited. For example, the average thickness td of the dielectric layer 111 may refer to: in the cross-sections in the first direction and the third direction of the central portion of the capacitor assembly 100 polished in the second direction, at a total of five points (i.e., the central points in the first direction and the third direction of the capacitance forming portion Ac, two equally spaced points located on the left side in the third direction based on the central points in the first direction and the third direction of the capacitance forming portion Ac, and two equally spaced points located on the right side in the third direction), the average value of the widths of the dielectric layer in the third direction. Additionally, the average thickness tm of the protective layer 112 may refer to: in the protective layer formed on the side surface in the third direction of the capacitance forming portion Ac, at a total of five points (i.e., the central point in the first direction of the protective layer, two equally spaced points located on the upper side in the first direction based on the central point in the first direction of the protective layer, and two equally spaced points located on the lower side in the first direction), the average value of the widths of the protective layer in the third direction. However, the average thickness tm of the protective layer 112 and the average thickness td of the dielectric layer 111 may refer not only to the average value of the widths in the third direction, but also to the average value of the thicknesses in the first direction.

[0059] Figure 8 is a perspective view schematically showing a sheet for forming an inner electrode and a dielectric layer in a capacitor assembly 100'' according to another exemplary embodiment.

[0060] Figure 9 is in a capacitor assembly according to another exemplary embodiment and is related to Figure 1 the cross-sectional view corresponding to the II-II' cross-section of

[0061] Referring to Figure 8 , the main body of the capacitor assembly 100'' according to another exemplary embodiment can be formed by: stacking two or more layers of the first sheet S1 and two or more layers of the second sheet S2, and then winding them around an axis extending in the second direction. Thus, the productivity of the capacitor assembly 100'' can be improved.

[0062] Referring to Figure 8 and Figure 9 , the first sheet S1 and the second sheet S2 are each stacked into two or more layers and wound around an axis extending in the second direction such that the main body 110 can include two or more layers of first inner electrodes 121 arranged to be spaced apart from each other in the first direction and the third direction and two or more layers of second inner electrodes 122 arranged to be spaced apart from each other in the first direction and the third direction.

[0063] Among the various effects of the present disclosure, the capacitor assembly includes first internal electrodes and second internal electrodes arranged alternately with a dielectric layer therebetween, and the first internal electrodes and the second internal electrodes are wound around an axis extending in the second direction, thereby suppressing the occurrence of non-uniform shrinkage behavior in the capacitor assembly.

[0064] One of the various effects of the present disclosure is to suppress the step difference caused by the formation of the edge portion by eliminating the difference in the stacking degree of the internal electrodes of the capacitor assembly.

[0065] Although the exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A capacitor assembly, comprising: a body including a dielectric layer and first and second internal electrodes, the first and second internal electrodes being alternately arranged with the dielectric layer interposed therebetween, and the first and second internal electrodes being wound around an axis extending in a second direction; and external electrodes disposed on a third surface and a fourth surface of the body that are opposite to each other in the second direction, The main body further includes a first surface and a second surface opposite to each other in a first direction and a fifth surface and a sixth surface opposite to each other in a third direction, the first direction is perpendicular to the second direction, and the third direction is perpendicular to the first direction and the second direction.

2. The capacitor assembly according to claim 1, wherein: The body generally has a hexahedral shape.

3. The capacitor assembly according to claim 1, wherein: The dielectric layer includes barium and titanium.

4. The capacitor assembly according to claim 1, wherein: The external electrodes include a first external electrode and a second external electrode, and The first internal electrode contacts the first external electrode at one end of the body in the second direction, and the second internal electrode contacts the second external electrode at the other end of the body in the second direction.

5. The capacitor assembly according to claim 1, wherein: The body includes: a capacitance forming part formed with capacitance including a region where the first internal electrode and the second internal electrode are wound around the axis extending in the second direction; and a protection layer disposed on the capacitance forming part.

6. The capacitor assembly according to claim 5, wherein: An average thickness of the protection layer is greater than an average thickness of the dielectric layer.

7. The capacitor assembly according to claim 5, wherein: The protection layer extends to cover end portions of the first and second internal electrodes.

8. The capacitor assembly according to claim 5, wherein: The protection layer includes a dielectric material that is the same as a dielectric material of the dielectric layer.

9. The capacitor assembly according to claim 5, wherein: The protection layer contacts an end portion of the dielectric layer.

10. The capacitor assembly according to claim 1, wherein: The first internal electrode and the second internal electrode are each wound around the axis extending in the second direction, and are each formed as a single layer.

11. The capacitor assembly according to claim 1, wherein: The body includes: two or more layers of first internal electrodes spaced apart from each other in the first direction and the third direction, respectively; and two or more layers of second internal electrodes spaced apart from each other in the first direction and the third direction, respectively.

12. A capacitor assembly comprising: A body, comprising a dielectric layer and first and second inner electrodes alternately arranged, wherein the dielectric layer is interposed between the first and second inner electrodes, and the first and second inner electrodes are wound around an axis extending along a second direction; external electrodes provided on a third surface and a fourth surface of the body that are opposite to each other in the second direction; and A protective layer is disposed on a capacitance forming portion of the body, the capacitance forming portion including a region where the first internal electrode and the second internal electrode are wound around the axis extending along the second direction.

13. The capacitor assembly of claim 12, wherein: The protection layer is configured to cover ends of the first and second internal electrodes and to contact ends of the dielectric layer, and the protection layer is formed using the same dielectric material as that of the dielectric layer.

14. The capacitor assembly of claim 12, wherein: An average thickness of the protection layer is greater than an average thickness of the dielectric layer.

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