Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus. The substrate processing apparatus includes: a container providing a sealed processing space; and a substrate supporting member positioned in the processing space of the container and supporting a substrate, in which the container includes: a through hole formed to penetrate from an outer surface to an inner surface so as to supply a process fluid to the processing space; and a pipe connection assembly disposed on an outer surface on which the through-hole is formed, and disposed to be connected to a process fluid supply pipe.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2023 - 0197548, filed with the Korean Patent Office on December 29, 2023, the entire contents of which are incorporated herein by reference. Technical field

[0003] The present invention relates to a substrate processing apparatus. Background art

[0004] To manufacture semiconductor devices, desired patterns are formed on a substrate (such as a wafer) through various processes such as lithography, etching, ashing, ion implantation, and thin - film deposition. Various processing liquids and processing gases are used in each process, and particles and process by - products are generated during the process. A cleaning process is performed before and after the process to remove particles and process by - products from the substrate.

[0005] A general cleaning process treats the substrate with chemicals and a rinse solution, and then performs a drying process. As an example of the drying process, there is a spin - drying process for removing the rinse solution remaining on the substrate by rotating the substrate at a high speed. However, this spin - drying method raises concerns about potential collapse of the pattern formed on the substrate.

[0006] Therefore, recently, a supercritical drying process has been used. In the supercritical drying process, an organic solvent such as Isopropyl Alcohol (IPA) is supplied to the substrate, the rinse solution remaining on the substrate is replaced with an organic solvent having a low surface tension, and then the organic solvent remaining on the substrate is removed by supplying a processing liquid in a supercritical state to the substrate. In the supercritical drying process, a drying gas is supplied to a sealed process chamber, and the drying gas is heated and pressurized. Thus, both the temperature and the process of the drying gas exceed the critical point, and the state of the drying gas becomes a supercritical state.

[0007] A substrate processing apparatus for performing the supercritical drying process has an internal space formed by combining an upper body and a lower body, and after maintaining the pressure of the internal space at a high level, a substrate (such as a wafer) is dried by supplying a drying gas, wherein the substrate is supported by a support member in the internal space.

[0008] In a substrate processing apparatus that performs a supercritical drying process, a supercritical fluid supply pipe is inserted into a cavity and then fixed by welding. However, according to this structure, a part of the gap between the pipe and the hole is joined (welded), so the discontinuous surface of the material acts as a stress concentration factor and causes a reduction in the durability of the cavity. Summary of the Invention

[0009] An object of the present invention is to provide a substrate processing apparatus that can improve durability by removing the stress concentration factor.

[0010] An object of the present invention is to provide a substrate processing apparatus that can additionally protect the welded portion between the pressure vessel and the pipe.

[0011] The object of the present invention is not limited to this, and those skilled in the art can clearly understand other objects not mentioned herein from the following description.

[0012] An exemplary embodiment of the present invention provides a substrate processing apparatus including: a container that provides a sealed processing space; and a substrate support member that is positioned in the processing space of the container and supports a substrate, wherein the container includes: a through hole that is formed to penetrate from an outer surface to an inner surface to supply a process fluid to the processing space; and a pipe connection assembly that is provided on the outer surface where the through hole can be formed and is configured to be connected to a process fluid supply pipe.

[0013] According to an embodiment of the present invention, the pipe connection assembly may include: a protruding port through which the through hole extends and that protrudes from the outer surface; and a connecting pipe that is connected to the protruding port by welding and has a joint for assembling with the process fluid supply pipe.

[0014] According to an embodiment of the present invention, the pipe connection assembly may include: a protective cap that is provided to surround the welded portion between the protruding port and the expansion pipe and the welded portion between the expansion pipe and the connecting pipe.

[0015] According to an embodiment of the present invention, the protective cap may be provided to surround the joint.

[0016] According to an embodiment of the present invention, the expansion pipe has: a first end portion having a first inner diameter that is the same as the inner diameter of the protruding port; a second end portion having a second inner diameter that is the same as the inner diameter of the connecting pipe; and a connecting portion that connects the first end portion and the second end portion; the inner diameter of the protruding port is the same as the inner diameter of the through hole; and the inner diameter of the connecting pipe may be the same as the inner diameter of the process fluid supply pipe.

[0017] According to an embodiment of the present invention, the roughness of the through hole may be the same as the surface roughness of the inner surface of the process fluid supply pipe.

[0018] According to an embodiment of the present invention, the through hole may be electropolished.

[0019] According to an embodiment of the present invention, the inner diameter of the through hole may be larger than the inner diameter of the process fluid supply pipe.

[0020] According to an embodiment of the present invention, the process fluid may be a supercritical fluid.

[0021] An exemplary embodiment of the present invention, a substrate processing apparatus includes: a container that provides a sealed processing space through a combination of an upper body and a lower body; and a substrate support member that is positioned in the processing space of the container and supports a substrate, wherein the upper body includes: a first through hole formed by penetrating from an inner lower surface in contact with the processing space to an outer upper surface; and a first pipe connection assembly provided on the outer upper surface for connecting the first through hole and a first process fluid supply pipe; and the lower body may include: a second through hole formed by penetrating from an inner top surface in contact with the processing space to an outer lower surface; and a second pipe connection assembly provided on the outer lower surface for connecting the second through hole and a second process fluid supply pipe.

[0022] According to an embodiment of the present invention, the first pipe connection assembly includes: a first protruding port through which the first through hole extends and which protrudes from the outer upper surface; and a first connecting pipe that is connected to the first protruding port by welding and has a joint for assembling with the first process fluid supply pipe, and the second pipe connection assembly may include: a second protruding port through which the second through hole extends and which protrudes from the outer lower surface; and a second connecting pipe that is connected to the second protruding port by welding and has a joint for assembling with the second process fluid supply pipe.

[0023] According to an embodiment of the present invention, the first protective cap is provided to surround the welding portion between the first protruding port and the first expansion pipe and the welding portion between the first expansion pipe and the first connecting pipe; and the second pipe connection assembly further includes: a second protective cap that is provided to surround the welding portion between the second protruding port and the second expansion pipe and the welding portion between the second expansion pipe and the second connecting pipe.

[0024] According to an embodiment of the present invention, the first protective cap and the second protective cap can be arranged to surround the joint.

[0025] According to an embodiment of the present invention, the first expansion tube and the second expansion tube have: a first end portion having a first inner diameter that is the same as the inner diameter of the first protrusion port and the inner diameter of the second protrusion port; a second end portion having a second inner diameter that is the same as the inner diameter of the first connection tube and the inner diameter of the second connection tube; and a connection portion connecting the first end portion and the second end portion; the inner diameter of the first protrusion port and the inner diameter of the second protrusion port are the same as the inner diameter of the first through hole and the inner diameter of the second through hole; the inner diameter of the first connection tube and the inner diameter of the second connection tube are the same as the inner diameter of the first process fluid supply tube and the inner diameter of the second process fluid supply tube; and the inner diameter of the first through hole and the inner diameter of the second through hole can be greater than the inner diameter of the first process fluid supply tube and the inner diameter of the second process fluid supply tube.

[0026] According to an embodiment of the present invention, the surface roughness of the first through hole and the second through hole can be the same as the surface roughness of the inner surface of the first process fluid supply tube and the surface roughness of the inner surface of the second process fluid supply tube.

[0027] According to an embodiment of the present invention, the first through hole and the second through hole can be electropolished.

[0028] According to an embodiment of the present invention, the process fluid can be a supercritical fluid.

[0029] An exemplary embodiment of the present invention, a substrate processing apparatus includes: a container that provides a sealed processing space through a combination of an upper body and a lower body; and a substrate support member that is positioned in the processing space of the container and supports a substrate, wherein each of the upper body and the lower body includes: a through hole formed by penetrating from an outer surface to an inner surface to supply a process fluid to the processing space; and a tube connection assembly provided on the outer surface on which the through hole is formed and configured to be connected to a process fluid supply tube, and the tube connection assembly includes: a protrusion port through which the through hole extends and which protrudes from the outer surface; an expansion tube connected to the protrusion port by welding; and a connection tube connected to the expansion tube by welding and having a joint for assembling with the process fluid supply tube.

[0030] According to an embodiment of the present invention, the tube connection assembly further includes a protective cap that can be arranged to surround the welded portion between the protrusion port and the expansion tube and the welded portion between the expansion tube and the connection tube.

[0031] According to an embodiment of the present invention, the expansion tube has: a first end portion having a first inner diameter that is the same as the inner diameter of the protrusion port; a second end portion having a second inner diameter that is the same as the inner diameter of the connection tube; and a connection portion connecting the first end portion and the second end portion; the inner diameter of the protrusion port is the same as the inner diameter of the through hole; the inner diameter of the connection tube is the same as the inner diameter of the process fluid supply tube; the inner diameters of the first through hole and the second through hole are greater than the inner diameters of the first process fluid supply tube and the second process fluid supply tube; and the roughness of the through hole can be the same as the surface roughness of the inner surface of the process fluid supply tube.

[0032] According to an embodiment of the present invention, the durability can be improved by removing the stress concentration factor at the tube connection assembly.

[0033] According to an embodiment of the present invention, the welded portion between the chamber and the tube can be additionally protected.

[0034] The effects of the present invention are not limited to the above effects, and those skilled in the art will clearly understand the effects not stated above from the specification and the drawings. Description of the Drawings

[0035] Figure 1 A view showing a substrate processing apparatus according to an embodiment of the present invention.

[0036] Figure 2 Schematically showing Figure 1 A view of an embodiment of the liquid processing chamber.

[0037] Figure 3 Schematically showing Figure 1 A view of an embodiment of the drying chamber.

[0038] Figure 4 Showing Figure 3 A view in which the upper body and the lower body are positioned in the closed position.

[0039] Figure 5 Showing Figure 3 A view in which the first clamping body and the second clamping body are positioned in the clamping position.

[0040] Figure 6 Showing Figure 3 An enlarged view of the first tube connection assembly shown.

[0041] Figure 7 An enlarged view of the first tube connection assembly according to a modified embodiment.

[0042] Figure 8 For Figure 7 An exploded perspective view of the first tube connection assembly shown.

[0043] Figure 9 A view showing another embodiment of the first protective cap.

[0044] Figure 10 To show Figure 7 A view showing another embodiment of the first expansion tube of the first tube connection assembly shown.

[0045] Figure 11 A view showing a modified embodiment of the first protruding port.

[0046] Figure 12 A view schematically showing another embodiment of the drying chamber. Detailed Description

[0047] Hereinafter, exemplary embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention may be implemented differently and is not limited to the following exemplary embodiments. In the following description of the present invention, detailed descriptions of known functions and configurations incorporated herein are omitted to avoid obscuring the subject matter of the present invention. In addition, throughout the drawings, the same reference numerals are used for components having similar functions and actions.

[0048] Unless explicitly stated to the contrary, the term "comprising" will be understood to mean including the stated elements but not excluding any other elements. It should be understood that the terms "comprising" and "having" are intended to specify the presence of the features, numbers, operations, components, and parts described in this specification, or combinations thereof, and do not exclude the possibility of the pre - existence or addition of one or more other features, numbers, operations, components, and parts, or combinations thereof.

[0049] The singular expressions used herein include plural expressions unless they have a clearly opposite meaning in the context. Therefore, for a clearer description, the shapes and dimensions of the elements in the drawings may be exaggerated.

[0050] Terms such as first and second are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0051] It should be understood that when a component is referred to as being "coupled to" or "connected to" another component, the former can be directly coupled to or connected to the latter, but there may be other components in between. Conversely, when a component is "directly coupled to" or "directly connected to" another component, it should be understood that there are no intervening components. Other expressions describing the relationship between components, such as "between... and...", "exactly between... and...", or "adjacent to..." and "directly adjacent to...", should be interpreted similarly.

[0052] All terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art, unless otherwise defined. Terms defined in a general dictionary will be interpreted to have a meaning that matches their meaning in the relevant technical context, and they should not be interpreted as having an ideal or overly formal meaning unless explicitly defined in this application.

[0053] The following refers to Figures 1 to 12 to describe embodiments of the present invention.

[0054] Figure 1 is a view showing a substrate processing apparatus according to an embodiment of the present invention.

[0055] Referring to Figure 1 , the substrate processing apparatus includes an index module 10, a processing module 20, and a control unit 30. When viewed from above, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the arrangement direction of the index module 10 and the processing module 20 is referred to as the first direction X, the direction perpendicular to the first direction X when viewed from above is referred to as the second direction Y, and the direction perpendicular to both the first direction X and the second direction Y is referred to as the third direction Z.

[0056] The index module 10 transfers the substrate W from the container C that houses the substrate W to the processing module 20, and places the substrate W processed in the processing module 20 into the container C. The longitudinal direction of the index module 10 is set in the second direction Y. The index module 10 has a loading port 12 and an index frame 14. The loading port 12 is located on the side opposite to the processing module 20, and the index frame 14 is located between the loading port and the processing module. The container C that houses the substrate W is placed in the loading port 12. The loading port 12 can be provided as a plurality of loading ports, and the plurality of loading ports 12 can be provided in the second direction Y.

[0057] The container C can be a container for sealing, such as a Front Open Unified Pod (FOUP). The container C can be placed in the load port 12 by a worker or a transfer device (such as an overhead transporter, an overhead conveyor, or an automated guided vehicle) (not shown).

[0058] The indexing robot 120 is provided at the indexing frame 14. The guide rail 124 is provided in the indexing frame 14, the longitudinal direction of the guide rail is set in the second direction Y, and the indexing robot 120 can be set to be movable on the guide rail 124. The indexing robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 can be set to be capable of moving forward and backward, rotating around the third direction Z, and moving in the third direction Z. The hand 122 can be set as a plurality of hands spaced apart in the vertical direction, and the hands 122 can move forward and backward independently of each other.

[0059] The control unit 30 can control the substrate processing apparatus. The control unit 30 can include a process controller, a user interface, a display, and a memory. The process controller is a microprocessor (computer) that executes the control of the substrate processing apparatus. The user interface is a keyboard through which an operator performs command input operations and the like to manage the substrate processing apparatus. The display visualizes and displays the operation status of the substrate processing apparatus and the like. And the memory stores a control program for executing the processing performed in the substrate processing apparatus under the control of the process controller, and a program for performing processing on each component according to various data and processing conditions (i.e., a treatment recipe). In addition, the user interface and the memory can be connected to the process controller. The treatment recipe can be stored in a storage medium in the memory, and the storage medium can be a hard disk, a portable disk (such as a CD-ROM or a DVD), or a semiconductor memory (such as a flash memory).

[0060] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space for the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 to stay temporarily. The liquid processing chamber 400 performs a liquid processing process for liquid-treating the substrate W by supplying liquid to the substrate W. The drying chamber 500 can perform a drying process for removing the liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0061] The longitudinal direction of the transfer chamber 300 can be set in the first direction X. The buffer unit 200 can be set between the indexing module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 can be set on the sides of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 can be set in the second direction Y. The drying chamber 500 and the transfer chamber 300 can be set in the second direction Y. The buffer unit 200 can be positioned at the end of the transfer chamber 300.

[0062] According to an embodiment, the liquid processing chambers 400 are provided on both sides of the transfer chamber 300, and the drying chambers 500 are provided on both sides of the transfer chamber 300, and the liquid processing chambers 400 can be provided at a position closer to the buffer unit 200 than the drying chambers 500. The liquid processing chambers 400 can be arranged in an array of A×B (where A and B are each a natural number of 1 or greater) in the first direction X and the third direction Z on one side of the transfer chamber 300. In addition, the drying chambers 500 can be provided in a number of C×D (where C and D are each a natural number of 1 or greater) in the first direction X and the third direction Z on one side of the transfer chamber 300. Different from the above description, only the liquid processing chambers 400 can be provided on one side of the transfer chamber 300, and only the drying chambers 500 can be provided on the other side.

[0063] The transfer chamber 300 has a transfer robot 320. A guide rail 324 is provided in the transfer chamber 300, the longitudinal direction of the guide rail is set in the first direction X, and the transfer robot 320 can be set to be movable on the guide rail 324. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 can be set to be able to move forward and backward, rotate around the third direction Z, and move in the third direction Z. The hand 322 can be set as a plurality of hands spaced apart in the up and down direction, and the hands 322 can move forward and backward independently of each other.

[0064] The buffer unit 200 has a plurality of buffers 220 on which the substrate W is placed. The buffers 220 can be set to be spaced apart from each other in the third direction Z. The buffer unit 200 is open at the front and the back. The front is the surface facing the indexing module 10, and the back is the surface facing the transfer chamber 300. The indexing robot 120 can approach the buffer unit 200 through the front, and the transfer robot 320 can approach the buffer unit 200 through the back.

[0065] Figure 2 For schematically showing Figure 1 a view of an embodiment of the liquid processing chamber.

[0066] ReferenceFigure 2 , the liquid processing chamber 400 includes a housing 410, a cup-shaped member 420, a support unit 440, a liquid supply unit 460, and a lifting unit 480.

[0067] The housing 410 may have an internal space in which a substrate W is processed. The housing 410 may have a hexahedral shape. For example, the housing 410 may have a rectangular prism shape. In addition, an opening (not shown) through which the substrate W is loaded and unloaded may be formed in the housing 410. In addition, a door (not shown) that selectively opens and closes the opening may be installed on the housing 410.

[0068] The cup-shaped member 420 may have a box shape with an open top. The cup-shaped member 420 may have a processing space, and the substrate W may be subjected to liquid processing in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies a processing liquid to the substrate W supported on the support unit 440. A plurality of processing liquids are provided, and the plurality of processing liquids may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the cup-shaped member 420 and the support unit 440.

[0069] According to an embodiment, the cup-shaped member 420 has a plurality of recovery pools 422, 424, and 426. Each of the recovery pools 422, 424, and 426 has a recovery space for recovering the liquid used for processing the substrate. The recovery pools 422, 424, and 426 are each arranged in an annular shape around the support unit 440. The processing liquid splashed due to the rotation of the substrate W during the execution of the liquid processing process flows into the recovery space through the inlets 422a, 424a, and 426a of the recovery pools 422, 424, and 426, respectively. According to an embodiment, the cup-shaped member 420 has a first recovery pool 422, a second recovery pool 424, and a third recovery pool 426. The first recovery pool 422 is arranged to surround the support unit 440, the second recovery pool 424 is arranged to surround the first recovery pool 422, and the third recovery pool 426 is arranged to surround the second recovery pool 424. The second inlet 424a for supplying liquid to the second recovery pool 424 may be positioned higher than the first inlet 422a for supplying liquid to the first recovery pool 422, and the third inlet 426a for supplying liquid to the third recovery pool 426 may be positioned higher than the second inlet 424a.

[0070] The support unit 440 has a support plate 442 and an actuating shaft 444. The upper surface of the support plate 442 is provided to be substantially circular and may have a diameter larger than the diameter of the substrate W. A support pin 442a for supporting the rear surface of the substrate W is provided at the central portion of the support plate 442 and is provided such that its upper end protrudes from the support plate 442 to space the substrate W from the support plate 442 by a predetermined distance. A chuck pin 442b is provided on the edge portion of the support plate 442. The chuck pin 442b protrudes upward from the support plate 442 and supports one side of the substrate W to prevent the substrate W from separating from the support unit 440 when the substrate W rotates. The actuating shaft 444 is driven by an actuator 446, is connected to the center of the bottom side of the substrate W, and rotates the support plate 442 about its central axis.

[0071] According to an embodiment, the liquid supply unit 460 may include a nozzle 462. The nozzle 462 may supply a processing liquid to the substrate W. The processing liquid may be a chemical, a rinsing solution, or an organic solvent. The chemical may be a chemical having strong acid or strong base properties. In addition, the rinsing solution may be deionized water. In addition, the organic solvent may be isopropyl alcohol (IPA). In addition, the liquid supply unit 460 may include a plurality of nozzles 462, and the nozzles 462 may discharge different types of processing liquids. For example, any one of these nozzles 462 may discharge a chemical, another nozzle 462 may discharge a rinsing solution, and another nozzle 462 may discharge an organic solvent. In addition, the control unit 30 may control the liquid supply unit 460 to supply a rinsing solution to the substrate W from another nozzle 462, and then supply an organic solvent from another nozzle 462. Therefore, the rinsing solution supplied onto the substrate W can be replaced with an organic solvent having a low surface tension.

[0072] The lifting unit 480 moves the cup-shaped member 420 in the vertical direction. The relative height between the cup-shaped member 420 and the substrate W is changed by the vertical movement of the cup-shaped member 420. Therefore, according to the type of the processing liquid supplied to the substrate W, the recovery pools 422, 424, and 426 for recovering the processing liquid are changed, whereby the processing liquid can be recovered separately. Different from the above description, the cup-shaped member 420 may be fixed, and the lifting unit 480 may move the support unit 440 in the vertical direction.

[0073] Figure 3 For schematically showing Figure 1 a view of an embodiment of the drying chamber, Figure 4 For showing Figure 3 a view in which the upper body and the lower body are positioned at the closed position, and Figure 5 For showing Figure 3 a view in which the first clamping body and the second clamping body are positioned at the clamping position.

[0074] ReferenceFigures 3 to 5 According to an embodiment of the present invention, the drying chamber 500 may use a drying fluid in a supercritical state to remove the processing liquid remaining on the substrate W. For example, the drying chamber 500 may perform a drying process of using carbon dioxide (CO2) in a supercritical state to remove the organic solvent remaining on the substrate W. For example, the supercritical process may include a cleaning process, a drying process, an etching process, etc. using a supercritical fluid. The supercritical fluid may be a substance that has a diffusivity, viscosity, and surface tension similar to those of a gas, has a solubility similar to that of a liquid, and has a temperature and pressure exceeding the critical point. For example, the supercritical fluid may include carbon dioxide (CO2), water (H2O), methane (CH4), ethane (C2H6), propane (C3H8), ethylene (C2H4), propylene (C3H6), methanol (CH3OH), ethanol (C2H5OH), sulfur hexafluoride (SF6), acetone (C3H6O), etc.

[0075] The drying chamber 500 may include a chamber body 510, a chuck body 520, a fluid supply unit 530, a fluid discharge pipeline 540, a support member 550, a first moving unit 560, a second moving unit 570, and a filler member 600. The chamber body 510 and the chuck body 520 may be collectively referred to as the main body.

[0076] The chamber body 510 has a container shape including an upper body 512 and a lower body 514. The upper body 512 and the lower body 514 are combined with each other to provide a processing space 501. With respect to the substrate placed on the support member, the processing space 501 may include an upper space 502 corresponding to the upper part and a lower space 503 corresponding to the lower part. The upper body 512 may include a lower surface 513. The lower surface 513 of the upper body 512 may be set as the upper wall of the chamber body 510. The lower body 514 may include an upper surface 515. The upper surface 515 of the lower body 514 may be set as the lower wall of the chamber body 510.

[0077] Either the upper body 512 or the lower body 514 can be configured to be movable relative to the other. For example, either the upper body 512 or the lower body 514 can be moved by the first moving unit 560. The first moving unit 560 can include a lifting actuator 562 and a lifting plate 564. A plurality of lifting actuators 562 are provided and can be connected to the lifting plate 564. The lifting plate 564 can be coupled to the lower body 514. When the lifting actuator 562 moves the lifting plate 564 up and down, the lower body 514 can also move up and down with the lifting plate 564. A heater for heating the drying liquid supplied to the processing space 501 can be embedded in the cavity 510. In addition, a groove can be formed at the lower body 514, and an O-ring 516 as a sealing member can be inserted into the groove to increase the sealing performance of the processing space 501 when the upper body 512 and the lower body 514 are in the closed position.

[0078] The upper body 512 is fixed, and the lower body 514 can be moved up and down in the third direction Z by the first moving unit 560. Hereinafter, the position where the lower body 514 contacts the upper body 512 by moving upward to form the processing space 501 is referred to as the closed position, and the position where the lower body 514 is separated from the upper body 512 by moving downward is referred to as the open position.

[0079] The clamping body 520 can include a first clamping body 522 and a second clamping body 524. The first clamping body 522 and the second clamping body 524 can clamp the cavity 510 at positions opposite to each other. The inner sides of the first clamping body 522 and the second clamping body 524 can have shapes substantially corresponding to the outer side of the cavity 510 in the closed position. The first clamping body 522 and the second clamping body 524 can be moved by the second moving unit 570. A plurality of second moving units 570 can be provided.

[0080] The support member 550 can support the substrate W in the processing space 501. The support member 550 can support the edge region of the substrate W in the processing space 501. The support member 550 can support the bottom surface of the edge region of the substrate W. The support member 550 can be mounted on the upper body 512.

[0081] The supply hole 518 can supply the supercritical fluid into the cavity 510. The supply hole 518 can include a first through hole 518a and a second through hole 518b.

[0082] The second through hole 518b may be provided in the central region of the lower wall of the lower body 514. In an embodiment, the second through hole 518b may be provided at a predetermined position from the center of the lower wall. In an embodiment, the center of the lower wall may be a position corresponding to the center of the substrate W on the vertical line when the substrate W is supported on the support member 550. The second through hole 518b supplies supercritical fluid to the lower space 503 below the substrate W positioned in the processing space 501. The second through hole 518b is formed through the lower body 514 from the inner top surface 514a in contact with the processing space 501 to the outer lower surface 514b.

[0083] The first through hole 518a is provided in the central region of the upper wall of the upper body 512. The first through hole 518a supplies supercritical fluid to the upper space 502 above the substrate W positioned in the processing space 501. The supercritical fluid supplied from the first through hole 518a may be provided to the upper surface of the substrate W. The first through hole 518a is formed through the upper body 512 from the inner bottom side 512a in contact with the processing space to the outer upper surface 512b. The inner diameter of the first through hole 518a is the same as the inner diameter of the upper branch pipeline 534 which is a process fluid supply pipe. The inner diameter of the second through hole 518b is the same as the inner diameter of the lower branch pipeline 536 which is a process fluid supply pipe.

[0084] The discharge hole 518c discharges the fluid staying in the cavity 510 to the outside. The discharge hole 518c is provided in the lower wall of the lower body 514. The discharge hole 518c may be positioned adjacent to the second through hole 518b. The discharge hole 518c may be provided in the central region of the lower wall of the lower body. The diameter of the discharge hole 518c may be the same as the diameter of the second through hole 518b. The fluid discharged from the discharge hole 518c may include supercritical fluid containing an organic solvent dissolved therein. The fluid discharged from the discharge hole 518c may be sent to a recovery device (not shown). In the recovery device, the fluid may be separated into supercritical fluid and organic solvent. Alternatively, the fluid discharged from the discharge hole 518c may be discharged to the atmosphere through the fluid discharge pipeline 540.

[0085] The fluid supply unit 530 supplies a process fluid into the processing space 501 of the cavity 510. According to an embodiment, the process fluid may be supplied into the processing space 501 in a supercritical state. Alternatively, the process fluid may be supplied into the processing space 501 in a gaseous state, and the phase of the process fluid may be changed to a supercritical state in the processing space 501. According to an embodiment, the fluid supply unit 530 has a main supply pipeline 532, an upper branch pipeline 534, and a lower branch pipeline 536. The upper branch pipeline 534 and the lower branch pipeline 536 branch off from the main supply pipeline 532.

[0086] The upper branch pipeline 534 is connected to the first through-hole 518a through the first pipe connection assembly 600a. The lower branch pipeline 536 is connected to the second through-hole 518b through the second pipe connection assembly 600b. The fluid discharge pipeline 540 is connected to the discharge hole 518c through the third pipe connection assembly 600c. The supercritical fluid in the processing space 501 of the cavity 510 is discharged to the outside through the fluid discharge pipeline 540. The fluid discharge pipeline 540 can be connected to a decompression member (not shown) that provides decompression to the processing space. The decompression member can be a pump. However, the decompression member is not limited thereto, and can be modified in various ways to known devices that can provide decompression to the processing space.

[0087] The filling member 580 is positioned below the support unit 550. The filling member 580 has a plate shape. The filling member 580 can prevent the supercritical fluid supplied from the second through-hole 518b from directly jetting onto the rear surface of the substrate W. In addition, the volume of the processing space 501 can be reduced by the filling member 580. In addition, the filling member 580 can increase the turbulence intensity of the processing fluid by causing the collision of the processing fluid supplied into the processing space. Therefore, the filling member 580 can reduce the amount of supercritical fluid used for the drying process and can reduce the process time while maintaining the process performance.

[0088] Meanwhile, each of the first pipe connection assembly 600a to the third pipe connection assembly 600c includes a protruding port 610, a connecting pipe 630, and a joint 640. The first pipe connection assembly 600a is described in detail below. The second pipe connection assembly 600b and the third pipe connection assembly 600c have the same configuration as the first pipe connection assembly 600a, and thus will not be described in detail.

[0089] Figure 6 For illustration Figure 3 An enlarged view of the shown first pipe connection assembly.

[0090] Refer to Figure 6 , the first pipe connection assembly 600a is disposed on the outer upper surface of the upper body 512. The first pipe connection assembly 600a may include a first protruding port 610, a first connecting pipe 630, and a first protective cap 650.

[0091] The first protruding port 610 protrudes from the outer upper surface 512b of the upper body 512. The first protruding port 610 is integrally provided with the upper body 512.

[0092] Figure 11 A view for illustrating a modified embodiment of the first protruding port. As Figure 11 shown, the first protruding port 610 can be separately manufactured and then fixed to the outer upper surface 512b of the upper body 512 by welding.

[0093] Refer to againFigure 6 , the first through-hole 518a extends through the first protruding port 610. The first connection pipe 630 can be connected to the first protruding port 610 by welding. For example, the first connection pipe 630 and the first protruding port 610 can be welded by butt welding.

[0094] The first connection pipe 630 has a joint 640 at the upper end for assembling with the upper branch pipeline 534. Although not shown in detail, this joint may have a well-known structure. The inner diameters of the first connection pipe 630 and the first through-hole 518a are the same as the inner diameter of the upper branch pipeline 534.

[0095] A first protective cap 650 can be provided to surround the welded portion between the first protruding port 610 and the first connection pipe 630. The first protective cap 650 can be composed of two bodies to facilitate assembly. The first protective cap 650 can be fixed by a separate fixture 660. The fixture 660 can be implemented in various ways. Although not shown, the first protective cap 650 can be bolted to the upper body 512.

[0096] Meanwhile, preferably, the first through-hole 518a has the same surface roughness as the inner surface of the upper branch pipeline 534. Since the first through-hole 518a has the same surface roughness as the inner surface of the upper branch pipeline 534, pressure drop loss and the generation of turbulence can be prevented, and contamination in the processing space can be minimized.

[0097] For this purpose, the surface of the first through-hole 518a can be processed to the surface roughness level of the inner surface of the upper branch pipeline 534. The first through-hole 518a can be mainly machined by grinding, lapping, polishing, buffing, reaming, etc., and then surface-treated by electro-polishing (EP). To perform electro-polishing on the first through-hole 518a, an electrode rod (not shown) smaller than the diameter of the first through-hole 518a is manufactured, a negative voltage is applied to the electrode rod, and a positive voltage is applied to the upper body 512, thereby performing surface treatment. That is, the electrode rod is inserted into the first through-hole 518a of the upper body 512 formed by machining, an electrolyte is supplied between the first through-hole 518a of the upper body 512 and the electrode rod, a negative voltage is applied to the electrode rod, and a positive voltage is applied to the upper body 512, so that the first through-hole 518a can be surface-treated.

[0098] According to the substrate processing apparatus having the above configuration, the stress concentration coefficient of the discontinuous surface of the material can be removed by changing the welding position of the supply pipeline from a position with greater force and greater deformation to a position with smaller force and smaller deformation.

[0099] Figure 7To show an enlarged view of the first pipe connection assembly according to a modified embodiment, Figure 8 is Figure 7 an exploded perspective view of the first pipe connection assembly shown.

[0100] Referring Figure 7 and Figure 8 , the first pipe connection assembly 600-1 according to the first modified embodiment is disposed on the outer upper surface of the upper body. The first pipe connection assembly 600-1 includes a first protruding port 610, a first expansion pipe 620, a first connection pipe 630, and a first protective cap 650, which are substantially similar in structure and function to Figure 6 the first protruding port 610, the first expansion pipe 620, the first connection pipe 630, and the first protective cap 650 shown, and thus the differences from this embodiment will be mainly described hereinafter for this modified embodiment.

[0101] In the first modified embodiment, the first pipe connection assembly 600-1 is characterized by having a first expansion pipe 620. The first expansion pipe 620 can be provided when the inner diameters of the first through hole 518a and the upper branch pipeline 534 as a process fluid supply pipeline are different from each other. In this modified embodiment, the inner diameter of the first through hole 518a is larger than the inner diameter of the upper branch pipeline 534 as a process fluid supply pipe. The first expansion pipe 620 has a conical shape, which has a first end 622, a second end 624, and a tapered portion 626. The first end 622 of the first expansion pipe 620 has a first inner diameter that is the same as the inner diameter of the first protruding port 610. The second end 624 has a second inner diameter that is the same as the inner diameter of the first connection pipe 630. The tapered portion 626 connects the first end 622 and the second end 624. The inner diameter of the first protruding port 610 can be the same as the inner diameter of the first through hole 518a, and the inner diameter of the first connection pipe 630 can be the same as the inner diameter of the upper branch pipeline 534 as a process fluid supply pipe.

[0102] The first connection pipe 630 is connected to the first expansion pipe 620 by welding. For example, the first expansion pipe 620 and the first connection pipe 630 can be welded by butt welding. The first connection pipe 630 has a joint 640 at the upper end for assembling with the upper branch pipeline 534.

[0103] A first protective cap 650 can be provided to surround the welding portion between the first protruding port 610 and the first expansion pipe 620 and the welding portion between the first expansion pipe 620 and the first connection pipe 630. The first protective cap 650 can be composed of two bodies for easy assembly. The first protective cap 650 can be fixed by a separate fixture 660. The fixture 660 can be implemented in various ways.

[0104] As another embodiment, a first protective cap 650 may even be provided at the assembly (joint) portion between the first connecting pipe 630 and the upper branch pipeline 534 (see Figure 9 ).

[0105] Meanwhile, preferably, the surface roughness of the first through hole 518a, the first protruding port 610, the first expansion pipe 620, and the first connecting pipe 630 is the same as the surface roughness of the inner surface of the upper branch pipeline 534. Since the surface roughness of the first through hole 518a, the first protruding port 610, the first expansion pipe 620, and the first connecting pipe 630 is the same as the surface roughness of the inner surface of the upper branch pipeline 534, pressure drop loss and the generation of turbulence can be prevented, and contamination in the processing space can be minimized. The surface treatment of the first through hole 518a has been described above, so it will not be described here.

[0106] Figure 10 To show Figure 7 a view of another embodiment of the first expansion pipe of the first pipe connection assembly shown.

[0107] As Figure 10 shown, the first expansion pipe 620a has a first end 622, a second end 624, and a connecting portion 626a. The first end 622 of the first expansion pipe 620a has a first inner diameter that is the same as the inner diameter of the first protruding port 610. The second end 624 has a second inner diameter that is the same as the inner diameter of the first connecting pipe 630. The connecting portion 626a is connected to the first end 622 and the second end 624 at a right angle.

[0108] Meanwhile, a clamp 660a for fixing the first protective cap 650 can be fixed to the upper body by bolts 669.

[0109] Figure 12 A view schematically showing a modified embodiment of the drying chamber.

[0110] Referring to Figure 12 , the drying chamber includes a cavity 510, a clamping body 520, a fluid supply unit 530, a fluid discharge pipeline 540, a support member 550, a first moving unit 560, a second moving unit 570, and a filling member 600, which are similar in structure and function to Figure 3 the cavity 510, the clamping body 520, the fluid supply unit 530, the fluid discharge pipeline 540, the support member 550, the first moving unit 560, the second moving unit 570, and the filling member 600 shown, so for this modified embodiment, the differences from this embodiment will be mainly described below

[0111] According to the modified embodiment, a common through-hole 518d can be provided in the lower body 514. The common through-hole 518d can be used as a supply passage through which the processing fluid is supplied to the processing space 501, and can be used as a discharge passage through which the fluid in the processing space 501 is discharged. The common through-hole 518d can be provided at the center of the lower wall of the lower body 514. The center of the lower wall can be a position corresponding to the center of the substrate W on the vertical line when the substrate W is supported on the support member 550.

[0112] A common pipeline 519 is connected to the common through-hole 518d, and the lower branch pipeline 536 of the fluid supply unit 530 and the fluid discharge pipeline 540 can be connected to the common pipeline 519. When supplying the processing fluid to the processing space 501, the valve of the fluid discharge pipeline 540 is closed, and when discharging the fluid in the processing space 501, the valve of the lower branch pipeline 536 is closed.

[0113] The common pipeline 519 is connected to the common through-hole 518d through a second pipe connection assembly 600b. In this modified embodiment, the first pipe connection assembly 600a and the second pipe connection assembly 600b are shown to be the same as Figure 7 the pipe connection assemblies shown, but they are not limited thereto, and various pipe connection assemblies disclosed in the present invention can be applied.

[0114] This specification provides embodiments of the present invention. In addition, the description provides implementation schemes of the present invention, and the present invention can be used in other various combinations, variations, and environments. That is, the present invention can be changed or modified within the scope of the present invention described herein, within the scope equivalent to the description, and / or within the scope of the knowledge or technology of the related art. The implementation schemes show the best state of realizing the spirit of the present invention and can be changed in various ways according to the specific application fields and uses of the present invention. Therefore, the detailed description of the present invention is not intended to limit the present invention to the implementation schemes. In addition, the claims should be interpreted to include other implementation schemes.

Claims

1. A substrate processing device, comprising: A container providing a sealed processing space; and a substrate supporting member positioned in the processing space of the container and supporting a substrate, Wherein, the container comprises: a through hole formed from the outer surface to the inner surface so as to supply a process fluid to the processing space; and A pipe connection assembly is provided on the outer surface on which the through hole is formed, and is configured to be connected to a process fluid supply pipe.

2. The substrate processing apparatus according to claim 1, wherein: The pipe connection assembly comprises: a protruding port through which the through hole extends and which protrudes from the outer surface; and A connecting pipe is connected to the protruding port by welding and has a joint for fitting with the process fluid supply pipe.

3. The substrate processing apparatus according to claim 2, wherein: The pipe connection assembly also includes: an expansion tube, when the through hole and the process fluid supply tube have different diameters, the expansion tube is disposed between the protruding port and the connecting tube; a protective cap disposed to surround a weld between the protruding port and the expansion pipe and a weld between the expansion pipe and the connection pipe, and The expansion pipe is connected to the protruding port and the connection pipe by welding.

4. The substrate processing apparatus according to claim 3, wherein: The protective cap is disposed around the joint.

5. The substrate processing apparatus according to claim 3, wherein: The expansion pipe has: a first end portion having a first inner diameter that is the same as the inner diameter of the protruding port; a second end portion having a second inner diameter that is the same as the inner diameter of the connecting pipe; and a connecting portion that connects the first end portion and the second end portion; The inner diameter of the protrusion port is the same as the inner diameter of the through hole; and The inner diameter of the connecting pipe is the same as the inner diameter of the process fluid supply pipe.

6. The substrate processing apparatus according to claim 2, wherein: The roughness of the through hole is the same as the surface roughness of the inner surface of the process fluid supply pipe.

7. The substrate processing apparatus according to claim 6, wherein: The through holes are electropolished.

8. The substrate processing apparatus according to claim 5, wherein: The through hole has an inner diameter greater than the inner diameter of the process fluid supply tube.

9. The substrate processing apparatus according to claim 2, wherein: The process fluid is a supercritical fluid.

10. A substrate processing device, comprising: A container, wherein the container provides a sealed processing space through a combination of an upper body and a lower body; as well as a substrate supporting member positioned in the processing space of the container and supporting a substrate, The upper body comprises: a first through hole, which is formed from the inner lower surface in contact with the processing space to the outer upper surface; and a first pipe connecting assembly, which is arranged on the outer upper surface and is used to connect the first through hole and a first process fluid supply pipe; and The lower body includes: a second through hole, which is formed from an inner top surface in contact with the processing space to the outer lower surface; and a second pipe connecting assembly, which is arranged on the outer lower surface and is used to connect the second through hole and a second process fluid supply pipe.

11. The substrate processing apparatus according to claim 10, wherein: The first pipe connection assembly comprises: a first protruding port through which the first through hole extends and which protrudes from the outer upper surface; and a first connecting pipe connected to the first protruding port by welding and having a joint for fitting with the first process fluid supply pipe, and The second pipe connection assembly comprises: a second protruding port through which the second through hole extends and which protrudes from the outer lower surface; and A second connecting pipe is connected to the second protruding port by welding and has a joint for fitting with the second process fluid supply pipe.

12. The substrate processing apparatus according to claim 11, wherein: The first pipe connection assembly also includes: a first expansion pipe, which is disposed between the first protruding port and the first connecting pipe and is connected to the first protruding port and the first connecting pipe by welding when the diameter of the first through hole and the diameter of the first process fluid supply pipe are different; and a first protective cap disposed to surround a weld between the first protruding port and the first expansion pipe and a weld between the first expansion pipe and the first connecting pipe; and The second pipe connection assembly also includes: a second expansion pipe, which is disposed between the second protruding port and the second connecting pipe and is connected to the second protruding port and the second connecting pipe by welding when the diameter of the second through hole and the diameter of the second process fluid supply pipe are different; and A second protective cap is provided to surround a welded portion between the second protruding port and the second expansion pipe and a welded portion between the second expansion pipe and the second connection pipe.

13. The substrate processing apparatus according to claim 12, wherein: The first protective cap and the second protective cap are disposed around the joint.

14. The substrate processing apparatus according to claim 12, wherein: The first expansion pipe and the second expansion pipe have: a first end portion having a first inner diameter that is the same as the inner diameter of the first protruding port and the inner diameter of the second protruding port; a second end portion having a second inner diameter that is the same as the inner diameter of the first connecting pipe and the inner diameter of the second connecting pipe; and a connecting portion that connects the first end portion and the second end portion; The inner diameter of the first protrusion port and the inner diameter of the second protrusion port are the same as the inner diameter of the first through hole and the inner diameter of the second through hole; The inner diameter of the first connecting pipe and the inner diameter of the second connecting pipe are the same as the inner diameter of the first process fluid supply pipe and the inner diameter of the second process fluid supply pipe; and An inner diameter of the first through hole and an inner diameter of the second through hole are larger than an inner diameter of the first process fluid supply tube and an inner diameter of the second process fluid supply tube.

15. The substrate processing apparatus according to claim 11, wherein: The roughness of the first through hole and the roughness of the second through hole are the same as the surface roughness of the inner surface of the first process fluid supply tube and the surface roughness of the inner surface of the second process fluid supply tube.

16. The substrate processing apparatus according to claim 11, wherein: The first through hole and the second through hole are electropolished.

17. The substrate processing apparatus according to claim 11, wherein: The process fluid is a supercritical fluid.

18. A substrate processing device, comprising: A container, wherein the container provides a sealed processing space through a combination of an upper body and a lower body; as well as a substrate supporting member positioned in the processing space of the container and supporting a substrate, Wherein, the upper body and the lower body each include: a through hole formed from the outer surface to the inner surface so as to supply a process fluid to the processing space; and a pipe connection assembly disposed on the outer surface on which the through hole is formed and configured to be connected to a process fluid supply pipe, and The pipe connection assembly comprises: a protrusion port through which the through hole extends and which protrudes from the outer surface; an expansion tube connected to the protruding port by welding; and A connecting pipe is connected to the expansion pipe by welding and has a joint for being assembled with the process fluid supply pipe.

19. The substrate processing apparatus according to claim 18, wherein: The pipe connection assembly further includes a protection cap disposed to surround a weld between the protruding port and the expansion pipe and a weld between the expansion pipe and the connection pipe.

20. The substrate processing apparatus according to claim 19, wherein: The expansion pipe has: a first end portion having a first inner diameter that is the same as the inner diameter of the protruding port; a second end portion having a second inner diameter that is the same as the inner diameter of the connecting pipe; and a connecting portion that connects the first end portion and the second end portion; The inner diameter of the protrusion port is the same as the inner diameter of the through hole; The inner diameter of the connecting pipe is the same as the inner diameter of the process fluid supply pipe; The inner diameter of the first through hole and the inner diameter of the second through hole are larger than the inner diameter of the first process fluid supply pipe and the inner diameter of the second process fluid supply pipe; and The roughness of the through hole is the same as the surface roughness of the inner surface of the process fluid supply pipe.

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