Apparatus for processing substrate

Abstract

Disclosed is an apparatus for processing a substrate, the apparatus comprising: a container having a processing space therein; a support unit for supporting a substrate in the processing space; a supply port provided in the container and for supplying a process fluid to the processing space; and a filler unit disposed below the substrate supported on the support unit in the processing space, in which the filler unit includes: a plate disposed opposite the substrate supported on the support unit; and a plurality of legs extending downwardly from a lower surface of the plate to support the plate within the container, a bottom wall of the container forming a recess defined by an inner surface and a bottom surface, the plate positioned higher than the recess, and each of the plurality of legs is arranged to be in contact with an inner surface forming the groove.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing a substrate, and more particularly to an apparatus for processing a substrate by using a supercritical fluid. Background Art

[0002] In order to fabricate semiconductor devices, desired patterns are formed on a substrate through various processes such as photolithography, etching, ashing, ion implantation, and thin film deposition. Various processing liquids are used in the various processes, and contaminants and particles are generated during the processes. To solve this problem, a cleaning process must be performed before and after each process to remove the contaminants and particles.

[0003] Typically, the cleaning process is completed by treating the substrate with chemicals and a rinsing liquid and then drying it. In recent years, organic solvents such as isopropyl alcohol (IPA) have been used as the rinsing liquid, and supercritical fluids have been used for drying.

[0004] In an apparatus for drying a substrate using a supercritical fluid, generally, the substrate is supported in a container, and a packing is placed under the substrate.

[0005] The packing has a plate and legs extending downward from the plate. To facilitate removal of the packing from the container, the legs of the packing are placed on the bottom wall of the container, and the method is performed in a state where the packing is not fixedly coupled to the container.

[0006] Meanwhile, when a drying process is performed and a supercritical fluid is supplied to the area under the packing, the supercritical fluid vibrates the packing, or rotates or moves the packing. This may cause non-uniform drying of the particles or wafers in the packing. Summary of the Invention

[0007] The present invention is directed to providing a substrate processing apparatus capable of efficiently processing a substrate.

[0008] The present invention is also directed to providing a substrate processing apparatus capable of minimizing generation of particles in a container during a substrate processing process.

[0009] The present invention is also directed to providing a substrate processing apparatus capable of easily mounting a packing unit in a container and also preventing vibration, rotation, or movement of the packing unit during a substrate processing process.

[0010] The present invention is also directed to providing a substrate processing apparatus capable of uniformly drying a substrate during a supercritical process.

[0011] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art will clearly understand the unmentioned problems through the following description.

[0012] Exemplary embodiments of the present invention provide an apparatus for processing a substrate, the apparatus including: a container having a processing space therein; a support unit configured to support the substrate in the processing space; a supply port disposed in the container and configured to supply a process fluid to the processing space; and a packing unit disposed in the processing space below the substrate supported by the support unit, wherein the packing unit includes: a plate disposed opposite to the substrate supported on the support unit; and a plurality of legs extending downward from a lower surface of the plate to support the plate within the container, a bottom wall of the container being formed with a groove defined by an inner surface and a bottom surface, the plate being positioned above the groove, and each of the plurality of legs being configured to contact the inner surface forming the groove.

[0013] In an exemplary embodiment, each of the plurality of legs may have a raised area along its longitudinal direction.

[0014] In an exemplary embodiment, each of the plurality of legs may have: a first portion having a cylindrical shape; a second portion extending downward from the first portion and having a gradually widening cross-sectional area; and a third portion extending downward from the second portion and having a gradually narrowing cross-sectional area, and at a boundary portion between the second portion and the third portion, each of the plurality of legs contacts the inner surface forming the groove.

[0015] In an exemplary embodiment, each of the plurality of legs may be provided with an elastic material.

[0016] In an exemplary embodiment, the plurality of legs may each be provided with a polyetheretherketone material.

[0017] In an exemplary embodiment, each of the plurality of legs may be configured to make a point contact with the inner surface forming the groove.

[0018] In an exemplary embodiment, each of the plurality of legs may contact the bottom surface forming the groove.

[0019] In an exemplary embodiment, the plate may be spaced apart from a bottom wall of the container, and when viewed from above, the plate may be provided with an area larger than that of the groove.

[0020] In an exemplary embodiment, the supply port may include a first supply port connected to the bottom surface forming the groove.

[0021] In an exemplary embodiment, the apparatus may further include a discharge port connected to the bottom surface forming the groove.

[0022] In an exemplary embodiment, the process fluid may be a supercritical fluid.

[0023] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a container having a processing space therein; a support unit for supporting the substrate in the processing space; a supply port provided in the container and for supplying a process fluid to the processing space; and a filler unit provided in the processing space below the substrate supported on the support unit, wherein the filler unit comprises: a plate disposed opposite to the substrate supported on the support unit; and a plurality of legs extending downward from the lower surface of the plate to support the plate within the container, a groove defined by an inner surface and a bottom surface being formed in a bottom wall of the container, the plate being positioned above the groove, and each of the plurality of legs being provided to contact the inner surface forming the groove.

[0024] In an exemplary embodiment, each of the plurality of legs may be provided with an elastic material.

[0025] In an exemplary embodiment, the plurality of legs may each be provided with a polyetheretherketone material.

[0026] In an exemplary embodiment, each of the plurality of legs may be provided to make a point contact with the inner surface forming the groove.

[0027] In an exemplary embodiment, the plurality of legs may be three, and the center of the circle defined by the three legs may be concentric with the center of the plate.

[0028] In an exemplary embodiment, the three legs may be spaced apart from each other equidistantly.

[0029] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus including: a container having a processing space therein; a support unit for supporting the substrate in the processing space; a supply port disposed in the container and for supplying a process fluid to the processing space; a discharge port for discharging the process fluid from the processing space; and a packing unit disposed below the substrate supported on the support unit in the processing space, including a first supply port in contact with the bottom surface of the packing unit, the packing unit including: a plate disposed opposite to the substrate supported on the support unit; and a plurality of legs extending downward from the lower surface of the plate to support the plate within the container, a groove defined by an inner surface and a bottom surface being formed in the bottom wall of the container, the plate being positioned higher than the groove, and each of the plurality of legs being disposed in contact with the inner surface forming the groove, each of the plurality of legs having a raised area along its longitudinal direction, each of the plurality of legs being disposed in point contact with the inner surface forming the groove, each of the plurality of legs being in contact with the bottom surface forming the groove, each of the plurality of legs being provided with an elastic material, and the discharge port being connected to the bottom surface.

[0030] In an exemplary embodiment, the plate may be spaced apart from the bottom wall of the container, and when viewed from above, the plate may be provided with an area larger than that of the groove.

[0031] In an exemplary embodiment, the plurality of legs may each be provided with a polyether ether ketone material, and each of the plurality of legs may have: a first portion having a cylindrical shape; a second portion extending downward from the first portion and provided with a gradually wider cross-sectional area; and a third portion extending downward from the second portion and provided with a gradually narrower cross-sectional area, and at the boundary portion between the second portion and the third portion, each of the plurality of legs is in contact with the inner surface forming the groove.

[0032] According to an exemplary embodiment of the present invention, the substrate can be processed efficiently.

[0033] According to an exemplary embodiment of the present invention, when a supercritical process is performed, particles generated within the container can be minimized.

[0034] According to an exemplary embodiment of the present invention, vibration, rotation, or movement of the packing unit can be prevented when a supercritical process is performed.

[0035] According to an exemplary embodiment of the present invention, the wafer can be dried uniformly during supercritical processing.

[0036] The effects of the present invention are not limited to the aforementioned effects, and those skilled in the art can clearly understand the effects not mentioned from this specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a top plan view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0038] Figure 2 is a view schematically showing an example of a liquid processing device provided in a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0039] Figure 3 is a view schematically showing a first exemplary embodiment of a supercritical processing device provided in a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0040] Figure 4 is a bottom view of a packing unit according to an exemplary embodiment of the present invention.

[0041] Figure 5 is a perspective view of a leg member according to an exemplary embodiment of the present invention.

[0042] Figure 6 and Figure 7 is a view schematically showing an installation process of a packing unit according to an exemplary embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0043] Hereinafter, exemplary embodiments of the present invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. However, the present invention can be implemented differently and is not limited to the following exemplary embodiments. In the following description of the present invention, detailed descriptions of known functions and configurations incorporated herein are omitted to avoid obscuring the subject matter of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

[0044] Unless clearly stated to the contrary, the word "comprising" will be understood to imply the inclusion of the stated elements but not the exclusion of any others. It should be understood that the terms "comprising" and "having" are intended to indicate the presence of the features, numbers, operations, operations, components and parts described in this specification, or combinations thereof, but do not exclude the possibility of the pre-existence or addition of one or more other features, numbers, operations, operations, components and parts, or combinations thereof.

[0045] As used herein, singular expressions include plural expressions, unless they have a clearly opposite meaning in the context. Thus, for a clearer description, the shapes, sizes, etc. of elements in the drawings may be exaggerated.

[0046] The expression "and / or" includes each item mentioned and all combinations including one or more of the items. Further, in this specification, "connected" not only means the case where member A and member B are directly connected, but also includes the case where member A and member B are indirectly connected by interposing member C between member A and member B.

[0047] The expression "and / or" includes each item mentioned and all combinations including one or more of the items. Further, in this specification, "connected" not only means the case where member A and member B are directly connected, but also includes the case where member A and member B are indirectly connected by interposing member C between member A and member B.

[0048] Exemplary embodiments of the present invention can be modified in many forms, and the scope of the present invention should not be construed as being limited to the following exemplary embodiments. The present exemplary embodiments are provided to more fully illustrate the present invention to those of ordinary skill in the art. Thus, the shapes of the elements in the drawings are enlarged to emphasize a clearer description.

[0049] Figure 1 is a top plan view schematically showing a substrate processing system according to an exemplary embodiment of the present invention.

[0050] Reference Figure 1 , the substrate processing system includes a transfer module 10, a processing module 20, and a controller 30. In one example, the transfer module 10 and the processing module 20 are arranged in a first direction. Hereinafter, the direction in which the transfer module 10 and the processing module 20 are arranged is referred to as the first direction 92, and when viewed from above, the direction perpendicular to the first direction 92 is referred to as the second direction 94, and the direction perpendicular to both the first direction 92 and the second direction 94 is referred to as the third direction 96.

[0051] The transfer module 10 transfers the substrate W from the container 80 accommodating the substrate W to the processing module 20, and accommodates the substrate W that has been completely processed in the processing module 20 in the container 80. The longitudinal direction of the transfer module 10 is arranged in the second direction 94. The transfer module 10 includes a load port 12 and a transfer frame 14. Based on the transfer frame 14, the load port 12 is located on the side opposite to the processing module 20. The container 80 accommodating the substrate W is placed on the load port 12. A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be provided in the second direction 94.

[0052] As the container 80, an airtight container such as a front-opening unified pod (FOUP) can be used. The container 80 can be placed on the loading port 12 by a transfer tool (not shown) such as an overhead transfer device, an overhead transporter, or an automated guided vehicle, or by an operator.

[0053] The transfer robot 120 is provided to the transfer frame 14. A guide rail 140 whose longitudinal direction is the second direction 94 is provided within the transfer frame 14, and the transfer robot 120 can be provided to be movable on the guide rail 140. The transfer robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 can be provided to be movable back and forth, rotatable about the third direction 96, and movable along the third direction 96. A plurality of hands 122 are provided to be spaced apart from each other in the vertical direction and capable of independently moving back and forth.

[0054] The processing module 20 includes a buffer unit 200, a transfer unit 300, a liquid processing unit 400, and a supercritical processing unit 500. The buffer unit 200 provides a space in which the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 temporarily stay. The liquid processing device 400 performs a liquid processing process of supplying a liquid onto the substrate W and processing the substrate W with the liquid. The supercritical processing device 500 performs a drying process to remove any residual liquid on the substrate W. The transfer device 300 transfers the substrate W between the buffer unit 200, the liquid processing device 400, and the supercritical processing device 500.

[0055] The longitudinal direction of the transfer device 300 can be the first direction 92. The buffer unit 200 can be provided between the transfer module 10 and the transfer device 300. The liquid processing device 400 and the supercritical processing device 500 can be provided on the side of the transfer device 300. The liquid processing device 400 and the transfer device 300 can be provided in the second direction 94. The supercritical processing device 500 and the transfer device 300 can be provided along the second direction 94. The buffer unit 200 can be positioned at one end of the transfer device 300.

[0056] In one example, the liquid processing device 400 is disposed on the opposite side of the transfer device 300, the supercritical processing device 500 is disposed on the opposite side of the transfer device 300, and the liquid processing device 400 can be arranged closer to the buffer unit 200 than the supercritical processing device 500. On one side of the transfer device 300, the liquid processing device 400 can be arranged in an A×B arrangement (each of A and B is a natural number of 1 or greater than 1) in the first direction 92 and the third direction 96. On one side of the transfer device 300, the supercritical processing device 500 can be arranged in a C×D quantity (each of C and D is a natural number of 1 or greater than 1) in the first direction 92 and the third direction 96. As described above, only the liquid processing device 400 can be arranged on one side of the transfer device 300, while only the supercritical processing device 500 can be arranged on the other side.

[0057] The transfer device 300 includes a transfer robot 320. A guide rail 340 in the longitudinal direction, which is the first direction 92, is provided inside the transfer device 300, and the transfer robot 320 can be arranged to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 can be arranged to be movable back and forth, rotatable around the third direction 96, and movable along the third direction 96. A plurality of hands 322 are arranged to be spaced apart from each other in the vertical direction and can move back and forth independently.

[0058] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 can be arranged to be spaced apart from each other in the third direction 96. The front and rear of the buffer unit 200 are open. The front is the surface facing the indexing module 10, and the rear is the surface facing the transfer device 300. The indexing robot 120 can approach the buffer unit 200 through the front, and the transfer robot 320 can approach the buffer unit 200 through the rear.

[0059] Figure 2 is a diagram schematically showing an example of a liquid processing device provided in a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0060] Figure 2 is schematically showing Figure 1 an example of the liquid processing device.

[0061] Referring to Figure 2 FIG., the liquid processing device 400 includes a housing 410, a cup 420, a support unit 440, a liquid supply unit 460, and a lifting unit 480. The housing 410 is arranged in a generally rectangular parallelepiped shape. The cup 420, the support unit 440, and the liquid supply unit 460 are provided in the housing 410.

[0062] The cup 420 has a processing space with an open top, and substrates W are processed with liquid in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid onto the substrate W supported by the support unit 440. The liquid can be of multiple types and can be supplied onto the substrate W in sequence. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0063] According to the example, the cup 420 includes a plurality of recovery containers 422, 424, and 426. Each of the recovery containers 422, 424, and 426 has a recovery space for recovering the liquid used for processing the substrate. Each of the recovery containers 422, 424, and 426 is arranged in an annular shape surrounding the support unit 440. The pretreatment liquid scattered by the rotation of the substrate W during the liquid processing process is introduced into the recovery space through the inlets 422a, 424a, and 426a of the recovery containers 422, 424, and 426 respectively. According to the example, the cup 420 includes a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is arranged to surround the support unit 440, the second recovery container 424 is arranged to surround the first recovery container 422, and the third recovery container 426 is arranged to surround the second recovery container 424. The second inlet 424a for introducing liquid into the second recovery container 424 can be located above the first inlet 422a for introducing liquid into the first recovery container 422, and the third inlet 426a for introducing liquid into the third recovery container 426 can be located above the second inlet 424a.

[0064] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 can be arranged in a generally circular shape and can have a diameter larger than the diameter of the substrate W. At the central portion of the support plate 442, a support pin 442a is provided to support the rear surface of the substrate W, and the support pin 442a is arranged such that its upper end protrudes from the support plate 442, so that the substrate W is spaced apart from the support plate 442 by a certain distance. Chuck pins 442b are provided to the edge of the support plate 442. The chuck pins 442b are arranged to protrude upward from the support plate 442 and support the lateral portions of the substrate W, so that when the substrate W rotates, the substrate W does not separate from the support unit 440. The drive shaft 444 is driven by a driver 446, is connected to the center of the bottom surface of the substrate W, and rotates the support plate 442 relative to its central axis.

[0065] According to one example, the liquid supply unit 460 includes a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 supplies a first liquid onto the substrate W. The first liquid can be a liquid for removing a film or foreign matter remaining on the substrate W. The second nozzle 464 supplies a second liquid onto the substrate W. The second liquid can be a liquid that is well dissolved in a third liquid. For example, the second liquid can be more soluble in the third liquid than the first liquid. The second liquid can be a liquid that neutralizes the first liquid supplied onto the substrate W. Further, the second liquid can be a liquid that neutralizes the first liquid and is at the same time more soluble in the third liquid than the first liquid. According to one example, the second liquid can be water. The third nozzle 466 supplies a third liquid onto the substrate W. The third liquid can be a liquid that is highly soluble in a supercritical fluid used in the supercritical processing apparatus 500. For example, the third liquid can be a liquid that is more soluble in the supercritical fluid used in the supercritical processing apparatus 500 than the second liquid. According to the example, the third liquid can be an organic solvent. The organic solvent can be isopropyl alcohol (IPA). In addition to isopropyl alcohol, the organic solvent can be ethylene glycol, 1-propanol, tetrahydrofuran, 4-hydroxy, 4-methyl, 2-pentanone, 1-butanol, 2-butanol, methanol, ethanol, n-propanol, dimethyl ether, etc. For example, the supercritical fluid can be carbon dioxide. The first nozzle 462, the second nozzle 464, and the third nozzle 466 are supported on different arms 461, and the arms 461 can move independently. Optionally, the first nozzle 462, the second nozzle 464, and the third nozzle 466 can be mounted on the same arm and move simultaneously.

[0066] The lifting unit 480 moves the cup 420 in the vertical direction. By moving the cup 420 up and down, the relative height between the cup 420 and the substrate W changes. Thereby, the recovery containers 422, 424, and 426 for recovering the pretreatment liquid change according to the type of liquid supplied to the substrate W, so that the liquids can be separated and recovered. Different from this description, the cup 420 can be fixedly mounted, and the lifting unit 480 can move the support unit 440 in the vertical direction.

[0067] Figure 3 is a schematic illustration of Figure 1 an example of a supercritical processing apparatus.

[0068] Referring to Figure 3 , the supercritical processing apparatus 500 processes the substrate W that has completed liquid processing with a supercritical fluid. In an exemplary embodiment, the supercritical processing apparatus 500 dries the substrate W by using a supercritical fluid. The supercritical fluid can be carbon dioxide (CO2) in a supercritical state. When the temperature rises to 30 °C or higher and the pressure is maintained at 7.4 MPa or higher, carbon dioxide becomes supercritical. Hereinafter, the process fluid will be described as an example of using supercritical carbon dioxide.

[0069] In one example, the supercritical processing apparatus 500 removes a liquid on a substrate W by using a supercritical fluid. The supercritical processing apparatus 500 includes a container 520, a support unit 540, a fluid supply unit 560, and a packing unit 580.

[0070] The container 520 provides a processing space 502 for performing supercritical processing. The container 520 is provided with a material capable of withstanding the critical temperature and critical pressure of the supercritical fluid. The container 520 includes an upper main body 522 and a lower main body 524.

[0071] The upper main body 522 has a low-side open space formed therein. The upper wall of the upper main body 522 is provided as the upper wall of the container 520. In addition, the side wall of the upper main body 522 is provided as a part of the side wall of the container 520. The lower main body 524 is located below the upper main body 522. The lower main body 524 has a space with an open top therein. The open top surface of the lower main body 524 faces the open bottom surface of the upper main body 522. The bottom wall of the lower main body 524 is provided as the bottom wall of the container 520. In addition, the side wall of the lower main body 524 is provided as a part of the side wall of the container 520. The upper main body 522 and the lower main body 524 are coupled to each other to provide the above-described processing space 502.

[0072] The upper main body 522 and the lower main body 524 can open or close the processing space 502 by relative movement. The driving member 590 moves at least one of the upper main body 522 and the lower main body 524 in an upward or downward direction. The driving member 590 can be provided by hydraulic pressure. In an exemplary embodiment, the upper main body 522 can be fixed in place, and the lower main body 524 can be raised and lowered by the driving member 590 (such as a cylinder). When the lower main body 524 is spaced apart from the upper main body 522, the processing space 502 is opened, and in this case, the substrate W is loaded or unloaded. During processing, the lower main body 524 is in close contact with the upper main body 522 so that the processing space 502 is sealed from the outside.

[0073] The supercritical processing apparatus 500 has a heater 570. In one example, the heater 570 is located within the wall of the container 520. In an exemplary embodiment, the heater 570 can be provided in either the upper main body 522 or the lower main body 524 that forms the container 520, or in each of the upper main body 522 and the lower main body 524. The heater 570 heats the processing space 502 of the container 520 so that the fluid supplied to the processing space 502 of the container 520 remains in a supercritical state. The processing space 502 is filled with a supercritical fluid atmosphere.

[0074] A groove 524c defined by a bottom surface 524a and an inner surface 524b is formed in the bottom wall of the container 520. The groove 524c may be formed to a predetermined depth. The groove may be provided in a circular shape.

[0075] The support unit 540 supports the substrate W in the processing space 502 of the container 520. The support unit 540 includes a fixing rod 542 and a bracket 544. The fixing rod 542 may be fixedly mounted on the upper body 522 such that the fixing rod 542 protrudes downward from the bottom surface of the upper body 522. The longitudinal direction of the fixing rod 542 may be set in the vertical direction. A plurality of fixing rods 542 may be provided and may be spaced apart from each other. The fixing rods 542 are arranged such that the substrate W does not interfere with the fixing rods 542 when the substrate W is loaded into or unloaded from the space surrounded by the fixing rods 542. The bracket 544 is coupled to the bottom end of each fixing rod 542. The bracket 544 extends in a horizontal direction with respect to the ground from the bottom end of the fixing rod 542. In an exemplary embodiment, the bracket 544 extends in a shape capable of supporting the bottom edge of the substrate W.

[0076] A first supply port and a second supply port are formed in the container 520. The first supply port 566a and the second supply port 564a supply a supercritical fluid into the interior of the container 520.

[0077] The first supply port 566a is provided in a central region of the lower wall of the container 520. The first supply port 566a is formed in a region where the groove 524c of the container 520 is formed. The first supply port 566a is formed at a position penetrating the lower wall in the vertical direction. The first supply port 566a supplies the supercritical fluid to a space in the lower part of the substrate W located in the internal space 502 of the container 520.

[0078] The second supply port 564a is provided in the upper wall of the container 520. The second supply port 564a supplies the supercritical fluid to a space on top of the substrate W located in the internal space 502 of the container 520. The supercritical fluid supplied from the second supply port 564a is provided to the top surface of the substrate W.

[0079] The discharge port 550a discharges the fluid remaining in the container 520 to the outside. The discharge port 550a is provided in the lower wall of the container 520. The discharge port 550a may be positioned adjacent to the first supply port 566a. The discharge port 550a is provided in the central region of the bottom surface of the container 520. The discharge port 550a is formed in the region of the groove 524c that forms the container 520. In an exemplary embodiment, the discharge port 550a is formed at a position penetrating the lower wall in the vertical direction. In an exemplary embodiment, the diameter of the discharge port 550a is set to be smaller than the diameter of the first supply port 566a. The fluid discharged from the discharge port 550a includes a supercritical fluid in which an organic solvent is dissolved. The fluid discharged from the discharge port 550a may be guided to a regeneration device (not shown). In the regeneration device, the fluid may be separated into a supercritical fluid and an organic solvent. Instead, the fluid discharged from the discharge port 550a may be released into the atmosphere via the discharge line 550.

[0080] The fluid supply unit 560 supplies a process fluid to the processing space 502 of the container 520. In one example, the process fluid may be supplied to the processing space 502 in a supercritical state. Alternatively, the process fluid may be supplied to the processing space 502 in a gaseous state and phase-change to a supercritical state within the processing space 502. According to this example, the fluid supply unit 560 includes a main supply line 562, an upper branch line 564, and a lower branch line 566. The upper branch line 564 and the lower branch line 566 branch from the main supply line 562. The upper branch line 564 is coupled to the second supply port 564a to supply the process fluid from the top of the substrate W placed on the support unit 540. The lower branch line 566 is coupled to the first supply port 566a to supply the process fluid from the lower part of the substrate W placed on the support unit 540. The discharge line 550 is coupled to the discharge port 550a. The supercritical fluid in the processing space 502 of the container 520 is discharged to the outside of the container 520 through the discharge line 550.

[0081] Inside the processing space 502 of the container 520, a packing unit 580 is provided.

[0082] Figure 4 is a bottom view of a packing unit according to an exemplary embodiment of the present invention.

[0083] Figure 5 is a perspective view of a leg member according to an exemplary embodiment of the present invention.

[0084] Reference Figures 3 to 5 , the packing unit 580 is located below the support unit 540. The packing unit 580 includes a plate 582 and a plurality of legs 584. The plate 582 is provided to face the substrate W supported by the support unit 540. The plurality of legs 584 extend downward from the bottom surface of the plate 582.

[0085] The plate 582 is spaced apart from the bottom wall of the container 520. The position of the plate 582 is higher than the groove 524c of the container 520. When viewed from above, the area of the plate 582 is larger than the area of the groove 524c of the container 520.

[0086] A plurality of legs 584 support the plate 582 within the container 520. The plurality of legs 584 are inserted into the groove 524c of the container 520. When the plurality of legs 584 are inserted into the groove, each leg 584 contacts the inner surface of the groove. In one example, the plurality of legs 584 are inserted into the groove in a forced-fit manner.

[0087] The plurality of legs 584 may have the same shape as each other. Each of the plurality of legs 584 has a raised area in the longitudinal direction. The plurality of legs 584 respectively contact the bottom surface 524a and the inner surface 524b of the container 520. In an exemplary embodiment, the plurality of legs 584 are in point contact with the inner surface 524b of the container 520. The plurality of legs 584 are each provided with an elastic material. In an exemplary embodiment, the plurality of legs 584 are each provided by a polyetheretherketone material.

[0088] In an exemplary embodiment, the plurality of legs 584 may be three. The three legs 584 are spaced apart from each other at equal distances. The three legs 584 may be spaced apart by 120° based on concentric circles. Here, a circle is defined by the three legs 584. The center of the circle is concentric with the center of the plate 582. In this case, the radius r4 of the concentric circle may be 120 mm.

[0089] The height h1 of the plurality of legs 584 is 10 mm to 12 mm. The minimum diameter L1 of the cross-sectional area of the plurality of legs 584 is 3 mm to 5 mm. The maximum diameter L2 of the cross-sectional area of the plurality of legs 584 is 5 mm to 7 mm.

[0090] Each of the plurality of legs 584 includes a first portion 584a, a second portion 584b extending downward from the first portion 584a, and a third portion 584c extending downward from the first portion 584a.

[0091] The first portion 584a is cylindrical. The diameter r1 of the cross-sectional area of the first portion 584a is equal to the minimum diameter L1 of the cross-sectional area of the plurality of legs 584.

[0092] The second portion 584a has a gradually increasing cross-sectional area as it extends downward. The minimum diameter of the cross-sectional area r2 of the second portion 584b is the same as the minimum diameter L1 of the cross-sectional area of the plurality of legs 584. The maximum diameter of the cross-sectional area r2 of the second portion 584a is equal to the maximum diameter L2 of the cross-sectional area of the plurality of legs 584.

[0093] The third part 584c has a gradually narrowing cross-sectional area when extending downward. The minimum diameter of the cross-sectional area r3 of the second part 584c is equal to the minimum diameter L1 of the cross-sectional areas of the plurality of legs 584. The maximum diameter of the cross-sectional area r3 of the third part 584c is equal to the maximum diameter L2 of the cross-sectional areas of the plurality of legs 584.

[0094] Figure 6 and Figure 7 is a diagram schematically showing the installation process of a packing unit according to an exemplary embodiment of the present invention.

[0095] Reference Figure 6 and Figure 7 As shown in, the packing unit 580 is disposed in the groove 524c. In this case, the maximum diameter of the plurality of legs 584 is L22. The packing unit 580 is installed in the groove 524c in a forced fit manner. In this case, the plurality of legs 584 are under pressure, and the maximum diameter of the plurality of legs 584 increases to L2. Therefore, the plurality of legs 584 can be in point contact with the inner surface 524b of the lower body 524.

[0096] The foregoing detailed description illustrates the present invention. Additionally, the foregoing is intended to describe exemplary or various exemplary embodiments for implementing the technical spirit of the present invention, and the present invention can be used in various other combinations, variations, and environments. That is, within the scope of the inventive concept disclosed in this specification, the scope equivalent to the present invention, and / or within the scope of the technology or knowledge in the art, the foregoing can be modified or corrected. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. Additionally, the appended claims should be construed to also include other exemplary embodiments. Such modified exemplary embodiments should not be understood separately based on the technical spirit or prospect of the present invention.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a container, having a processing space therein; a supporting unit, the supporting unit being used to support a substrate in the processing space; a supply port disposed in the container and configured to supply a process fluid to the processing space; as well as a packing unit disposed in the processing space below the substrate supported on the supporting unit, The packing unit comprises: a plate disposed opposite to the substrate supported on the supporting unit; as well as a plurality of legs extending downwardly from a lower surface of the plate to support the plate within the container, The bottom wall of the container is formed with a groove defined by an inner surface and a bottom surface, The plate is positioned higher than the groove, and Each of the plurality of legs is disposed in contact with the inner surface forming the groove.

2. The apparatus of claim 1, wherein each of the plurality of legs has a raised area along a longitudinal direction thereof.

3. The apparatus of claim 1 , wherein each leg of the plurality of legs has: a first portion, the first portion having a cylindrical shape; a second portion extending downwardly from the first portion and provided with a gradually widening cross-sectional area; as well as a third portion extending downwardly from the second portion and provided with a gradually narrowing cross-sectional area, At a boundary portion of the second portion and the third portion, each of the plurality of legs contacts the inner surface forming the groove.

4. The apparatus of claim 1, wherein each of the plurality of legs is provided with an elastic material.

5. The apparatus of claim 1, wherein each of the plurality of legs is provided in a polyetheretherketone material.

6. The apparatus of claim 1, wherein each of the plurality of legs is disposed in point contact with the inner surface forming the groove. 7 . The apparatus of claim 1 , wherein each of the plurality of legs is in contact with the bottom surface forming the groove.

8. The apparatus of claim 1, wherein the plate is spaced apart from a bottom wall of the container, and When viewed from above, the plate is provided with an area larger than the recess. 9 . The apparatus of claim 1 , wherein the supply port comprises a first supply port connected to the bottom surface forming the groove.

10. The device according to claim 1, further comprising: A discharge port is connected to the bottom surface forming the groove.

11. The apparatus of claim 1 , wherein the process fluid is a supercritical fluid.

12. An apparatus for processing a substrate, the apparatus comprising: a container, having a processing space therein; a supporting unit, the supporting unit being used to support a substrate in the processing space; a supply port disposed in the container and configured to supply a process fluid to the processing space; as well as a packing unit disposed in the processing space below the substrate supported on the supporting unit, The packing unit comprises: a plate disposed opposite to the substrate supported on the supporting unit; as well as a plurality of legs extending downwardly from a lower surface of the plate to support the plate within the container, The bottom wall of the container is formed with a groove defined by an inner surface and a bottom surface, The plate is positioned higher than the groove, and The plurality of legs are inserted into the grooves in a forced-fit manner.

13. The apparatus of claim 12, wherein each of the plurality of legs is provided with a resilient material.

14. The apparatus of claim 12, wherein each of the plurality of legs is provided in a polyetheretherketone material.

15. The apparatus of claim 12, wherein each leg of the plurality of legs is disposed in point contact with the inner surface forming the groove.

16. The apparatus of claim 12, wherein the plurality of legs is three, and The center of the circle defined by the three legs is concentric with the center of the plate.

17. The apparatus of claim 16, wherein the three legs are equidistantly spaced from one another.

18. An apparatus for processing a substrate, the apparatus comprising: a container, having a processing space therein; a supporting unit, the supporting unit being used to support a substrate in the processing space; a supply port disposed in the container and used to supply a process fluid to the processing space; a discharge port for discharging the process fluid from the processing space; as well as a packing unit disposed in the processing space below the substrate supported on the supporting unit, wherein the first supply port contacts the bottom surface of the packing unit, The packing unit comprises: a plate disposed opposite to the substrate supported on the supporting unit; as well as a plurality of legs extending downwardly from a lower surface of the plate to support the plate within the container, The bottom wall of the container is formed with a groove defined by an inner surface and a bottom surface, The plate is positioned higher than the groove, and Each of the plurality of legs is arranged to contact the inner surface forming the groove, Each of the plurality of legs has a raised area along its longitudinal direction, Each of the plurality of legs is arranged to be in point contact with the inner surface forming the groove, Each of the plurality of legs is in contact with the bottom surface forming the groove, The plurality of legs are each provided with an elastic material, and The discharge port is connected to the bottom surface.

19. The apparatus of claim 18, wherein the plate is spaced apart from the bottom wall of the container, and When viewed from above, the plate is provided with an area larger than the recess.

20. The apparatus of claim 18, wherein each of the plurality of legs is provided in a polyetheretherketone material, and Each leg of the plurality of legs has: a first portion, the first portion having a cylindrical shape; a second portion extending downwardly from the first portion and provided with a gradually widening cross-sectional area; as well as a third portion extending downwardly from the second portion and provided with a gradually narrowing cross-sectional area, and At a boundary portion of the second portion and the third portion, each of the plurality of legs contacts the inner surface forming the groove.

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