Electric connector structure, terminal module and terminal module manufacturing method

Abstract

The invention discloses an electric connector structure, a terminal module and a terminal module manufacturing method. The electric connector structure is used for connecting a photoelectric transceiver module on a mainboard. The electric connector structure comprises an intermediate plate module and a fixing structure. The terminal modules of the intermediate plate module are arranged side by side. The terminal module comprises a plurality of terminals and a terminal seat. The terminal seat covers the terminal. Each terminal comprises a root portion, a first terminal arm and a second terminal arm, the root portion is wrapped by the terminal seat, and the end portion of the first terminal arm and the end portion of the second terminal arm extend out of the terminal seat.

Description

Technical Field

[0001] This application relates to the field of connectors, and particularly to an electrical connector structure for connecting an optical transceiver module to a motherboard and a method for manufacturing its terminal module. Background Art

[0002] It is an inevitable trend in the future to use photons to replace electrons for computing in integrated circuits and use light for data transmission to meet the requirements of high-capacity and high-speed signal transmission. Currently, optoelectronic integrated circuits have been developed, and optoelectronic transceiver components are formed using co-packaging technology, which are suitable for high-performance data exchange, long-distance interconnection, 5G facilities, and computing devices. However, currently, co-packaged optical transceiver components must be connected to the motherboard through connecting wires and connectors, resulting in an overly long signal transmission path, which affects the transmission efficiency, cannot fully utilize the high transmission bandwidth density and high-speed characteristics of co-packaged optical transceiver components, and is difficult to repair and replace. In view of this, how to improve the connection between current co-packaged optical transceiver components and the motherboard is an urgent issue to be solved.

[0003] In addition, in the prior art, as Figure 17 shown, the terminals of the connector are usually manufactured by etching. Generally, the process of manufacturing terminals by etching roughly includes multiple processes such as metal etching plate, degreasing, water washing, etching, and drying. Moreover, if the terminals are manufactured by etching, it will be difficult to adjust the number of terminals, causing many inconveniences.

[0004] Furthermore, in the existing manufacturing method, it is also necessary to bond a printed circuit board to the terminals formed by etching, and finally form a stacked structure, which is very time-consuming in production capacity. Moreover, in the existing manufacturing process, due to the need for etching, it is also necessary to consider the compatibility of photomasks, printed circuit boards, etc., increasing the design difficulty of the manufacturing process. On average, it takes about 4 to 6 months to mass-produce products, which is very time-consuming and causes many problems. Summary of the Invention

[0005] One objective of this application is to provide an electrical connector structure that can fully utilize the advantages of high-capacity and high-speed transmission provided by the optical transceiver module and shorten the transmission distance between the optical transceiver module and the motherboard.

[0006] Another objective of this application is to provide a terminal module that is small in size and can be arranged side by side by piecing together to increase the terminal density.

[0007] Another objective of this application is to provide a method for manufacturing a terminal module, which has the advantages of stable terminal size, high precision, fast production, convenient terminal storage and protection.

[0008] Based on the above objectives, this application provides a method for manufacturing a terminal module, which includes:

[0009] Provide a strip

[0010] Form a plurality of terminals and at least one strip fixing part on the strip by stamping, wherein the plurality of terminals are connected to the at least one strip fixing part; and

[0011] First form a terminal block on the plurality of terminals, and then separate the plurality of terminals from the at least one strip fixing part; or

[0012] First separate the plurality of terminals from the at least one strip fixing part, and then form a terminal block on the plurality of terminals.

[0013] Preferably, the terminal block is made of plastic, and the method for manufacturing the terminal module further includes setting the plurality of terminals and the at least one strip fixing part in a plastic molding machine to form a terminal block.

[0014] Preferably, the strip defines a plurality of stamping areas, and the method for manufacturing the terminal module further includes forming a plurality of terminals in each of the plurality of stamping areas, and the plurality of terminals between the plurality of stamping areas are connected by a first connecting part.

[0015] Preferably, the method for manufacturing the terminal module further includes, after forming a terminal block on the plurality of terminals, cutting the first connecting part and the connection part between the plurality of terminals and the at least one strip fixing part.

[0016] Preferably, the method for manufacturing the terminal module further includes cutting and removing terminals by laser according to a predetermined number so that the plurality of terminals with the predetermined number are connected.

[0017] Preferably, each terminal block is formed with a plurality of holes, the plurality of holes are formed between the plurality of connected terminals, and the method for manufacturing the terminal module further includes cutting a plurality of second connecting parts connected between the plurality of terminals in the same stamping area by laser cutting method with the aid of the plurality of holes.

[0018] Preferably, the strip defines a plurality of stamping areas, and the method for manufacturing the terminal module further includes forming a plurality of terminals in the plurality of stamping areas respectively.

[0019] Preferably, the method for manufacturing the terminal module further includes, after separating the plurality of terminals from the at least one strip fixing part first, forming the terminal block on each of the plurality of terminals spaced apart by a plastic molding machine.

[0020] Based on the above purpose, the present application further provides a terminal module, which includes a plurality of terminals and a terminal block. The terminal block covers the plurality of terminals. Each terminal includes a root, a first terminal arm and a second terminal arm, the root is covered by the terminal block, and the ends of the first terminal arm and the second terminal arm extend out of the terminal block.

[0021] Preferably, the terminal block is formed with a plurality of holes, and the plurality of terminals are spaced corresponding to the plurality of holes.

[0022] Preferably, the terminal block comprises an insulating material.

[0023] For the above purpose, the present application further provides an electrical connector structure for connecting an optical transceiver module on a main board. The electrical connector structure includes an intermediate board module and a fixing structure. The intermediate board module includes a plurality of terminal modules, and each of the plurality of terminal modules includes a plurality of terminals and a terminal block. The plurality of terminals are arranged at intervals, and the plurality of terminal modules are arranged side by side. The fixing structure includes a pair of fixing walls, a plurality of first limiting members and a second limiting member. The pair of fixing walls are arranged on the main board and spaced apart from each other to form a receiving space. The plurality of first limiting members are respectively arranged on the pair of fixing walls and protrude into the receiving space. The second limiting member is arranged above the plurality of first limiting members. The intermediate board module and the optical transceiver module are stacked in sequence and detachably arranged in the receiving space. The plurality of first limiting members limit the intermediate board module on the main board, and the second limiting member limits the optical transceiver module on the intermediate board module. And the optical transceiver module is electrically connected to the main board through the plurality of terminals of the intermediate board module.

[0024] Preferably, the intermediate board module further includes a first board body and a second board body assembled with each other, and the terminal module is arranged between the first board body and the second board body. Each terminal includes a root portion, a first terminal arm and a second terminal arm. The root portion is fixed to the terminal block, and the end of the first terminal arm extends out of the first board body, and the end of the second terminal arm extends out of the second board body.

[0025] Compared with the prior art, the present application has the following beneficial effects:

[0026] In the embodiments provided by the terminal module and its manufacturing method of the present application, the number of required terminals can be adjusted by laser cutting to manufacture the terminal module. In another embodiment provided by the manufacturing method of the terminal module of the present application, the terminals can be formed independently, and then the terminal module can be manufactured according to the number of required terminals, without laser cutting processing. In addition, since the terminals of the present application are manufactured by stamping, compared with the existing etching manufacturing method, it has the advantages of stable size, high precision, fast production, convenient storage and protection of terminals. In addition, since the size of the terminal module is small, it can be pieced together and arranged side by side to increase the terminal density.

[0027] In the electrical connector structure of the embodiment of the present application, the intermediate board module and the optical transceiver module can be stacked in a crimping manner in sequence and detachably arranged in the fixed structure, and the first limiting member and the second limiting member are respectively used to firmly press the intermediate board module and the optical transceiver module, so that the optical transceiver module can be connected to the electrical connector structure through a simple crimping method. Furthermore, the main board is directly electrically connected through the integrally formed terminals of the intermediate board module, so that the electrical signals after optical-electrical conversion from the optical transceiver module can be transmitted to the main board, giving full play to the advantages of high-capacity and high-speed transmission provided by the optical transceiver module, shortening the transmission distance between the optical transceiver module and the main board, and effectively solving the problems that the current co-packaged optical transceiver components need to be connected to the main board through connecting wires and connectors, resulting in too long a transmission path and being difficult to repair and replace. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of manufacturing terminals by stamping in the embodiment of the present application.

[0029] Figure 2A Schematic diagram of terminals manufactured by the manufacturing method of the first terminal module in the present application.

[0030] Figure 2B Schematic diagram of terminals manufactured by the manufacturing method of the first terminal module in the present application.

[0031] Figure 2C Schematic flow chart of the manufacturing method of the first terminal module in the embodiment of the present application.

[0032] Figure 2D Schematic flow chart of the manufacturing method of the second terminal module in the embodiment of the present application.

[0033] Figure 3A Schematic diagram of insert injection in the manufacturing method of the first terminal module in the embodiment of the present application.

[0034] Figure 3B Schematic diagram of insert injection in the manufacturing method of the second terminal module in the embodiment of the present application.

[0035] Figure 4 Schematic perspective combination diagram of the electrical connector structure in the embodiment of the present application and a main board.

[0036] Figure 5 For Figure 4 exploded view of the electrical connector structure.

[0037] Figure 6 Schematic perspective exploded view of the intermediate board module in the embodiment of the present application.

[0038] Figure 7 Partial enlarged schematic diagram of the terminal module in the embodiment of the present application.

[0039] Figure 8 Schematic exploded perspective view of the electrical connector structure of an embodiment of the present application and an optical transceiver module.

[0040] Figure 9 is Figure 8 Schematic assembled perspective view of the electrical connector structure and the optical transceiver module.

[0041] Figure 10 is Figure 9 Top view of the electrical connector structure, the optical transceiver module and the main board.

[0042] Figure 11 is Figure 10 Cross-sectional view of line segment A-A of

[0043] Figure 12 is Figure 10 Cross-sectional view of line segment B-B of

[0044] Figure 13 is Figure 9 Schematic assembled perspective view of the electrical connector structure and the optical transceiver module from a bottom view angle.

[0045] Figures 14A to 14F Schematic process diagram of the optical transceiver module being connected to the electrical connector structure of an embodiment of the present application in a crimping manner.

[0046] Figure 15 Schematic structural view of the terminal of an embodiment of the present application in contact with the optical transceiver module.

[0047] Figure 16 Schematic view of a usage state of the electrical connector structure of an embodiment of the present application.

[0048] Figure 17 Schematic process diagram of manufacturing a terminal by an etching method in the prior art.

[0049] The reference numerals in the above-mentioned drawings are explained as follows:

[0050] 1: Electrical connector structure

[0051] 10: Interposer module

[0052] 105: Hollowed-out portion

[0053] 11: First board body

[0054] 110: Through hole

[0055] 111: Terminal slot

[0056] 11a: Upper surface

[0057] 11b: Lower surface

[0058] 112: First positioning groove

[0059] 115: First engaging portion

[0060] 12: Second plate body

[0061] 12a: Top

[0062] 12b: Bottom

[0063] 121: Through groove

[0064] 122, 123: Side walls

[0065] 124: Second positioning groove

[0066] 125: First engaging member

[0067] 126: Positioning post

[0068] 13: Terminal module

[0069] 130: Terminal seat

[0070] 1301: Hole

[0071] 131: Terminal

[0072] 1311: Terminal protection leg

[0073] 132: Root

[0074] 1321: First connecting portion

[0075] 1322: Second connecting portion

[0076] 133: First terminal arm

[0077] 135: Second terminal arm

[0078] 134, 136: Ends

[0079] 14: Tape

[0080] 141: Tape fixing portion

[0081] 1411: First positioning hole

[0082] 1412: Second positioning hole

[0083] 15: Protection cover plate

[0084] 20: Fixing structure

[0085] 200: Accommodating space

[0086] 201, 202: Fixing walls

[0087] 201a: Top edge

[0088] 201b: Bottom

[0089] 203: Front limiting wall

[0090] 203a: Opening

[0091] 204: Rear limiting wall

[0092] 205: Holding part

[0093] 206: Pivoting part

[0094] 207: Fixed piece

[0095] 208: Limiting groove

[0096] 211: First limiting member

[0097] 221: Second limiting member

[0098] 222: Connecting rod

[0099] 223, 224: Pressing rod

[0100] 225: Operating part

[0101] 3: Photoelectric transceiver module

[0102] 301, 302: Two sides

[0103] 30a: Top

[0104] 303: Neck

[0105] 304: Connector head

[0106] 305: Positioning convex part

[0107] 308: Limiting convex part

[0108] 5: Main board

[0109] 51: Surface

[0110] 60: Stamping machine

[0111] 61, 62: Stamping area

[0112] 70: Feeding machine

[0113] 80: Plastic molding machine Detailed implementation method

[0114] The following description of the present application is accompanied by the drawings that are incorporated in and constitute a part of the specification, which illustrate embodiments of the present application. However, the present application is not limited to these embodiments. In addition, the following embodiments can be appropriately integrated with the following embodiments to complete another embodiment.

[0115] The description of each of the following embodiments refers to the accompanying drawings, which are used to illustrate specific embodiments in which the present application can be implemented. The directional terms mentioned in the present application, such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "horizontal", "vertical", etc., are only with reference to the directions of the accompanying drawings. Therefore, unless otherwise clearly specified and limited, the directional terms used are for explaining and understanding the present application, rather than for limiting the present application.

[0116] As used herein, unless otherwise stated, the ordinal adjectives "first", "second", "third", etc. used to describe general objects only indicate different instances of similar objects being referred to, and are not intended to imply that the objects so described must be in a given order in terms of time, space, arrangement, or any other method.

[0117] In order to enable the present application to be fully understood, the following description provides detailed steps and structures. Obviously, the implementation of the present application does not limit the specific details known to those skilled in the art. In addition, the known structures and steps will not be described in detail so as not to unnecessarily limit the present application. It should be noted that in the description of the present application, the functions or steps mentioned herein may occur in an order different from the order marked in the drawings. For example, according to the functions or steps involved, two consecutively shown diagrams can actually be executed substantially simultaneously or sometimes in the reverse order.

[0118] An embodiment of the present application provides an electrical connector structure, a terminal module, and a method for manufacturing a terminal module. The electrical connector structure is used to connect an optical transceiver module on a main board. Further explanation, the terminals of the present application are made by stamping, and have advantages such as high precision, high speed, low cost, and small size in manufacturing.

[0119] Further explanation, in some embodiments, the optoelectronic transceiver module is an optoelectronic integrated circuit (OEIC) that integrates an electronic integrated circuit and a photonic integrated circuit, and uses co-packaging technology to form a co-packaged optics (CPO) transceiver module. Preferably, the optoelectronic transceiver module may include at least one photodetector element and a light source module, as well as several active elements and passive elements, such as but not limited to filters or multiplexing structures, optical power distribution structures, fiber optic input / output structures, and optical modulation structures. Since the features of this application do not lie in the structure of the optoelectronic transceiver module known to those skilled in the art, the details thereof are not described herein. In some embodiments, the optoelectronic transceiver module connected to the electrical connector structure of this application has an element structure that complies with the 3.2 Tb / s co-packaged module implementation protocol of the Optical Internetworking Forum (OIF).

[0120] This application provides a method for manufacturing a terminal module, including the following steps:

[0121] As Figure 1 shown, provide a strip 14;

[0122] Place the strip 14 in a stamping machine 60;

[0123] As Figure 1 and Figures 2A to 2D shown, use the stamping machine 60 to perform a stamping process on the strip 14, and form at least one terminal 131 and at least one strip fixing portion 141 on the strip 14, and the at least one terminal 131 is connected to the at least one strip fixing portion 141; and

[0124] First form a terminal block 130 on several terminals 131, and then separate the several terminals 131 from at least one strip fixing portion 141; or first separate the several terminals 131 from at least one strip fixing portion 141, and then form the terminal block 130 on the several terminals 131.

[0125] Further explanation, the strip 14 can be made of a metal sheet, and in a preferred embodiment, the strip 14 can be made of beryllium copper alloy, which has advantages such as light weight and high strength. The terminal block 130 includes an insulating material to avoid short circuits between the terminals 131.

[0126] In one embodiment, when using the stamping machine 60 to perform a stamping process on the strip 14, first form a strip fixing portion 141 on the strip 14 for positioning and feeding during the subsequent formation of the terminals 131. Further explanation, in another embodiment, as Figure 2AAs shown, when the stamping machine 60 forms the terminal 131, the terminal protection leg 1311 can also be formed together to increase the strength and prevent the terminal 131 from being damaged when the strip 14 curls. In one embodiment, as Figure 2A and Figure 2B shown, part of the terminal protection leg 1311 can be cut off by laser to facilitate subsequent processes.

[0127] In one embodiment, the present application stamps and forms the terminal module 13 in two different modes. Further explanation, the stamping tonnage of the stamping machine 60 can be 50 tons, and the accuracy is less than + / - 0.01 mm. In the first terminal module manufacturing method, the number of stamping times per minute is about 200 times, and two terminals 131 are formed at one time. In the second terminal module manufacturing method, the number of stamping times per minute can be about 300 times, and one terminal 131 is formed at one time. In other embodiments, the stamping machine 60 can have other stamping tonnages, and according to the manufacturing of the stamping die, more terminals 131 can be formed at one time, such as forming three terminals 131 at one time, etc.

[0128] As Figures 2A to 2C shown, in the first terminal module manufacturing method, the terminals 131 are connected by the first connecting portion 1321 and the second connecting portion 1322. The strip 14 is defined with several stamping areas 61. The terminals 131 are continuously formed by the die of the stamping machine 60 in each stamping area 61. The terminals 131 in adjacent stamping areas 61 are connected by the first connecting portion 1321. In this embodiment, the length of the first connecting portion 1321 is longer than the length of the second connecting portion 1322. The length of the second connecting portion 1322 is 0.5 mm to 0.7 mm, preferably 0.6 mm, to maintain the spacing between the terminals 131.

[0129] In the embodiment where the terminals 131 are connected by the first connecting portion 1321 and the second connecting portion 1322, since two terminals 131 are formed at one time, in order to feed the strip 14 more accurately into the stamping machine 60, therefore, the terminal module manufacturing method of the present application can further include forming several first positioning holes 1411 on one side of the strip 14 and several second positioning holes 1412 on the other side to position the strip 14 in two directions. Further explanation, the feeder 70 sequentially pushes the strip 14 through the first positioning holes 1411 and the second positioning holes 1412 in one direction to facilitate the subsequent manufacturing of the terminals 131 by the stamping machine 60.

[0130] As Figure 2DAs shown, in the method for manufacturing the second terminal module, the terminals 131 are independently manufactured, and the terminals 131 are not connected to each other by the above-mentioned first connecting portion 1321 and second connecting portion 1322. In this embodiment, a plurality of stamping areas 62 are still defined on the strip 14, and each terminal 131 is formed in each stamping area 62. At this time, a plurality of first positioning holes 1411 are formed only on one side of the strip 14, so that the feeder 70 can sequentially push the strip 14 in one direction through the plurality of first positioning holes 1411, facilitating the subsequent manufacturing of the terminals 131 by the stamping machine 60.

[0131] In the embodiment of the present application, the terminals 131 are formed by a stamping process using a metal strip to form an integrally formed terminal structure. After stamping out the outline of the terminals 131, an electroplating process can be further performed. Further, before the electroplating process, since the terminals 131 are formed by a flexible metal strip, they can be wound up for storage, reducing the storage space.

[0132] It is worth mentioning that, in one embodiment, the terminals 131 manufactured by the method for manufacturing the first terminal module can be removed according to a predetermined number, such as any number from 1 to 30. For example, the first connecting portion 1321 and / or the second connecting portion 1322 between the terminals 131 can be cut by a laser method to obtain a predetermined number of terminals 131, and these terminals 131 are connected to each other by the second connecting portion 1322. For the terminals 131 manufactured by the second method for manufacturing the terminal module, the above-mentioned step of removing the terminals 131 will not be performed because each terminal 131 is independently stamped and formed.

[0133] After stamping out the outline of the terminals 131 by the process, the method for manufacturing the terminal module of the present application further includes electroplating the terminals 131. In one embodiment, the electroplating method is to first electroplate nickel on at least one terminal 131, and then electroplate silver, gold, or palladium on the terminals 131. In a preferred embodiment, the electroplating method further includes a selective plating method or a spraying method. The selective plating method is to electroplate at the places where the plating is required, and the spraying method is to form a plating layer on the terminals 131 by spraying. After the plating layer is formed, a terminal base 130 can be further manufactured on the terminals 131 to form a terminal module 13, which is assembled with other components to form the electrical connector structure 1 in Figure 3. Further, before forming the terminal base, since the terminals 131 are formed by a flexible metal strip, they can be wound up for storage, reducing the storage space.

[0134] After the plating layer is formed on the terminal 131, in one embodiment, the present application further includes forming the terminal block 130 on the row of terminals 131 by using the insert injection molding technology. Further elaboration, in one embodiment, the terminal block 130 is made of plastic, and the method for manufacturing the terminal module of the present application further includes forming the terminal block 130 on a plurality of terminals 131 by using a plastic molding machine 80.

[0135] As Figure 2C and Figure 3A shown, for the terminal 131 manufactured by the first method for manufacturing a terminal module, after the plating layer is formed on the terminal 131, the strip 14 and the strip fixing portion 141 and the terminal 131 it contains can be arranged in the plastic molding machine 80, and the terminal block 130 is formed on the terminal 131 by the plastic molding machine 80, and then, cutting is performed by a laser method.

[0136] In one embodiment, a plurality of holes 1301 are formed in the terminal block 130. These holes 1301 are formed on the terminal 131 together with the terminal block 130 and are formed between these connected terminals 131.

[0137] In order to avoid short circuits between the terminals 131, in the present application, the method for manufacturing a terminal module further includes cutting these second connecting portions 1322 and the first connecting portion 1321 connected between each of the plurality of terminals 131 in the same stamping area 61 by means of laser cutting through these holes 1301, so that the plurality of terminals 131 are not connected to each other. And, the terminal 131 and the strip fixing portion 141 can be separated from each other. The way to separate the terminal 131 and the strip fixing portion 141 can also be a laser cutting method, but it is not limited thereto. In this way, the terminal block 130 combining the row of terminals 131 can be obtained, and the production of the terminal module 13 is completed.

[0138] It is worth mentioning that there is no limitation on the cutting order between the first connecting portion 1321, the second connecting portion 1322 and the strip fixing portion 141 and the terminal 131. For example, the first connecting portion 1321 and the second connecting portion 1322 can be cut in sequence, and then the connection between the strip fixing portion 141 and the terminal 131 can be cut, but the above cutting order can also be changed.

[0139] Further elaboration, as Figure 2D and Figure 3BAs shown, for the terminal 131 manufactured by the second terminal module manufacturing method, since the terminal 131 is formed by independent stamping, they are not connected to each other. After the plating is formed on the terminal 131, the terminal 131 can be separated from the tape fixing part 141 in various ways such as automatically by machine or manually, and the terminal 131 can be set in the plastic molding machine 80 according to the required quantity, such as any number from 1 to 100, etc., to facilitate the subsequent insert injection process, so that the terminal block 130 can be formed on each of the spaced terminals 131. In this way, the terminal block 130 combined with the row of terminals 131 can be obtained, and the production of the terminal module 13 is completed.

[0140] It is worth mentioning that if the terminal 131 is manufactured by the above first terminal manufacturing method, laser cutting is required subsequently, while if the terminal 131 is manufactured by the above second terminal manufacturing method, laser cutting is not required. Therefore, manufacturing the terminal 131 by the above second terminal manufacturing method can save more costs.

[0141] To sum up, as Figure 2C and 2D shown, the terminal module 13 of the present application includes a plurality of terminals 131 and a terminal block 130. The terminal block 130 covers the terminal 131. Each terminal 131 includes a root portion 132, a first terminal arm 133, and a second terminal arm 135. The root portion 132 is covered by the terminal block 130, and the ends 134 of the first terminal arm 133 and the second terminal arm 135 extend out of the terminal block 130.

[0142] In addition, in the terminal module 13 manufactured by the first terminal module manufacturing method, a plurality of holes 1301 are also formed on each terminal block 130, and due to the above laser cutting process, a plurality of terminals 131 are spaced corresponding to a plurality of holes 1301. For the terminal module 13 manufactured by the second terminal module manufacturing method, since the terminal 131 is originally formed by independent stamping, there is no need to use the laser cutting process for a plurality of terminals 131, so there will be no holes 1301 on the terminal block 130.

[0143] It should be noted that since the intermediate board module 10 of the present application is configured with thousands of terminals 131, and each terminal 131 is a micro-size in millimeters, the assembly difficulty between the terminals and the terminal block is greatly increased. By directly integrally forming the terminal 131 on the continuous metal tape through the above stamping process, and then using the insert injection molding technology to combine the terminal 131 with the terminal block 130, the terminal 131 can be accurately and firmly fixed on the terminal block 130, effectively reducing the assembly difficulty and being more beneficial to the subsequent combination of the terminal module 13 and the terminal groove 111.

[0144] Referring to Figure 4 and Figure 5 ,Figure 4 A three-dimensional combined schematic diagram of the electrical connector structure 1 of an embodiment of the present application and a main board 5. Figure 5 is Figure 4 exploded schematic diagram of the electrical connector structure 1. As Figure 1 shown, the present application provides an electrical connector structure 1, including an intermediate board module 10 and a fixing structure 20. Specifically, the intermediate board module 10 includes a first board body 11 and a second board body 12 that can be assembled with each other and detached, and a plurality of terminal modules 13. Specifically, the second board body 12 and the first board body 11 are assembled in a manner of being stacked up and down. A plurality of terminal modules 13 are arranged between the first board body 11 and the second board body 12, and include a plurality of terminals 131 and a terminal seat 130. A plurality of terminals 131 are arranged at intervals from each other, and a plurality of terminal modules 13 are arranged side by side. In some embodiments, each terminal 131 includes a root portion 132, a first terminal arm 133 and a second terminal arm 135, and the root portion 132 is fixed to the terminal seat 130, and one end portion 134 of the first terminal arm 133 extends out of the first board body 11, and one end portion 136 of the second terminal arm 135 extends out of the second board body 12.

[0145] It is worth mentioning that since the terminal module 13 of the present application itself has a very small size and is arranged side by side, compared with the existing method (loading metal terminals into the entire plastic body), the way of arranging the terminal modules 13 side by side in the present application can break through the size limitation. The reason is that in the existing manufacturing process, if injection molding is required at one time, there are manufacturing limitations on the minimum volume of the plastic body. Therefore, the terminal module 13 of the present application can realize the possibility of maximizing the terminal density.

[0146] Continuing to refer to Figure 4 , the fixing structure 20 includes a pair of fixing walls 201 and 202, a front limiting wall 203 and a rear limiting wall 204, a plurality of first limiting members 211 and a second limiting member 221. Specifically, the front limiting wall 203 and the rear limiting wall 204 are respectively connected between the front end and the rear end of the pair of fixing walls 201 and 202, and together with the pair of fixing walls 201 and 202 form a frame structure, and can be fixed on the surface 51 of a main board 5 through, for example, surface adhesion technology, thereby forming an accommodating space 200. In this embodiment, the main board 5 is a kind of circuit board, on which one or a plurality of processors and electronic components (not shown) can be provided, and is applicable to, for example, the main board of a switch or a server. In some embodiments, the fixing walls 201 and 202, the front limiting wall 203 and the rear limiting wall 204 can be made of materials with high hardness characteristics, such as metal materials, preferably stainless steel, and can be formed by a metal stamping process, but the above materials and preparation methods are not limited thereto. As Figure 4 and Figure 5As shown, through the stamping process on the fixed walls 201 and 202, a number of first limiting members 211 are integrally formed. The number of first limiting members 211 protrude into the accommodating space 200 and form an inclined side 211a and a free end 211b, so that the first limiting member 211 can be displaced outward due to the pressing of an external object in the accommodating space 200. In this embodiment, as shown in FIG. 2, the fixed walls 201 and 202 include a number of fixing pieces 207 and limiting grooves 208. Specifically, the limiting grooves 208 are formed at a top edge 201a of the pair of fixed walls 201 and 202, and the fixing pieces 207 are disposed at a bottom 201b of the pair of fixed walls 201 and 202 and are bent toward the accommodating space 200 respectively. In this embodiment, the fixing pieces 207 can be fixed on the surface 51 of the main board 5 through surface adhesion technology.

[0147] As Figure 4 and Figure 5 shown, the intermediate board module 10 is detachably disposed on the main board 5. Specifically, the intermediate board module 10 enters the accommodating space 200 from directly above the accommodating space 200, and during the downward movement, it interferes with and presses the inclined sides 211a of the first limiting members 211 on the opposite sides, thereby pushing the first limiting members 211 to displace outward. Finally, after passing through the first limiting members 211, the first limiting members 211 return to their original positions and their free ends 211a press and fix the intermediate board module 10 on the surface 51 of the main board 5. Through the above crimping method, the intermediate board module 10 can be firmly fixed on the main board 5, and the first terminal arm 133 contacts the corresponding conductive contact points (not shown) of the main board 5. When the intermediate board module 10 is to be detached from the fixing structure 20, the first limiting members 211 can be pushed out of the accommodating space 200 to remove the intermediate board module 10.

[0148] It should be noted that, in some other embodiments, the fixing structure 20 may also only have the pair of fixed walls 201 and 202 without the front limiting wall 203 and the rear limiting wall 204. Among them, the fixed walls 201 and 202 can use a diagonal bracing structure (not shown) supported on the main board 5 to strengthen the structural strength. In some other embodiments, the fixed walls 201 and 202 can also adopt a number of columnar structures (not shown). Through the above arrangement of the fixed walls 201 and 202, the intermediate board module 10 can also be pressed and fixed by the first limiting members 211.

[0149] As Figure 5As shown, the rear limiting wall 204 includes a pivoting portion 206 having a shaft hole, and the second limiting member 221 is pivotally connected to the pivoting portion 206 and is disposed above the first limiting member 211. Specifically, the front limiting wall 203 includes an opening 203a and a pair of holding portions 205, and the holding portions 205 are disposed at a top of the front limiting wall 203 and on both sides of the opening 203a. In some embodiments, the pair of holding portions 205 respectively have a barb structure. As shown in FIG. 2, the second limiting member 221 includes a pair of pressing rods 223 and 224 and a connecting rod 222 connected between the pair of pressing rods, and the pressing rods 223 and 224 and the connecting rod 222 are integrally formed to form a U-shaped structure, and the material of the second limiting member 221 may be the same as that of the fixed walls 201 and 202. Specifically, the connecting rod 222 is pivotally connected to the pivoting portion 206 and rotates about the pivoting portion 206 as an axis to drive the pressing rods 223 and 224 to rotate between an open state (as shown in Figure 4 shown) and a holding state (as shown in Figure 14A shown) to press against the optoelectronic transceiver module 3 or release the pressing against the optoelectronic transceiver module 3 (as described in detail later). In some embodiments, the pressing rods 223 and 224 extend close to the fixed walls 201 and 202, and each of the pressing rods 223 and 224 includes an operating portion 225 that extends out of the holding portion 205 by a preset distance and is bent upward to facilitate operating the rotation of the pressing rods 223 and 224 between the open state and the holding state. When the pressing rods 223 and 224 are in the holding state, the ends of the pressing rods 223 and 224 away from the connecting rod 222 are movably held by the holding portions 205 of the barb structure.

[0150] Referring to Figure 6 , Figure 6 is a perspective exploded view of the interposer module 10 according to an embodiment of the present application. As shown in Figure 5 and Figure 6 shown, the first plate body 11 includes a plurality of terminal slots 111 and a plurality of first positioning grooves 112, and the plurality of terminal slots 111 penetrate through an upper surface 11a and a lower surface 11b of the first plate body 11 in a thickness direction. Specifically, each terminal slot 111 extends in a short-axis direction of the first plate body 11, and the plurality of terminal slots 111 are arranged at intervals along a long-axis direction of the first plate body 11. The second plate body 12 is detachably assembled to the first plate body 11 and includes a pair of side walls 122 and 123 and a plurality of through slots 121, and the plurality of through slots 121 are correspondingly disposed with respect to the terminal slots 111 and communicate with the terminal slots 111.

[0151] As shown in Figure 6As shown, the pair of side walls 122 and 123 are spaced apart from each other and disposed on a top portion 12a of the second plate body 12, and are close to and parallel to the fixed walls 201 and 202, and each of the side walls 122 and 123 includes a plurality of second positioning grooves 124. The plurality of second positioning grooves 124 are respectively disposed on a top portion of the side walls 122 and 123. In this embodiment, the first limiting member 211 presses against the corresponding second positioning groove 124 (as Figure 4 shown) to fix the intermediate board module 10 on the main board 5. In addition, the fixing pieces 207 of the fixed walls 201 and 202 are inserted into the corresponding first positioning grooves 112 to further limit the first plate body 11 in the long axial direction. As Figure 5 and Figure 6 shown, the terminal seat 130 of the terminal module 13 is disposed in the terminal groove 111 and located between the first plate body 11 and the second plate body 12, and the end portion 134 of the first terminal arm 133 (the reference numeral is shown in Figure 7 ) extends out of the terminal groove 111, and the end portion 136 of the second terminal arm 135 (the reference numeral is shown in Figure 7 ) extends out of the through groove 121.

[0152] Continuing to refer to Figures 6 to 7 , in some embodiments, the first plate body 11 includes a plurality of first engaging portions 115, the second plate body 12 includes a plurality of first engaging members 125, and the first engaging members 125 are detachably engaged with the first engaging portions 115. Preferably, the first engaging member 125 is a downwardly protruding hook, and the first engaging portion 115 is a groove for the hook to be buckled. A bottom portion 12b of the second plate body 12 abuts against an upper surface 11a of the first plate body 11, and the bottom portion 12b of the second plate body 12 includes a plurality of positioning posts 126, and the positioning posts 126 extend toward the first plate body 11. The first plate body 11 further includes a plurality of through holes 110, and the main board 5 includes a plurality of positioning holes, and these positioning posts 126 respectively penetrate the corresponding through holes 110 and are inserted into the corresponding positioning holes to further position the intermediate board module 10 on the main board 5.

[0153] Continuing to refer to Figures 6 to 7 and in cooperation with Figures 2A to 2C, the first terminal arm 133 is inclined from the root 132 towards the terminal slot 111 of the first plate body 11 and the middle of the accommodating space 200, and the second terminal arm 135 is inclined from the root 132 towards the through slot 121 of the second plate body 12 and the middle of the accommodating space 200, and the first terminal arm 133 and the second terminal arm 135 are symmetrically arranged up and down relative to the root 132. In this embodiment, the second terminal arm 135 has a convex arc-shaped cross-section relative to the terminal base 130, which extends from the root 132 to the end 136 of the second terminal arm 135, and the first terminal arm 133 has an arc-shaped cross-section identical to that of the second terminal arm 135. The terminal base 130 covers the root 132, and these terminals 131 are aligned in rows and spaced apart from each other on the terminal base 130. In some embodiments, the ends 134 and 136 have convex arc-shaped contours to facilitate contact with the docking conductive contacts. It should be specifically noted that the second terminal arm 135 and the first terminal arm 133 can be deformed by the pressing of external objects and can return to their original state when the pressure is released.

[0154] Referring to Figures 8 to 13 , Figure 8 is a perspective exploded view of the electrical connector structure 1 and the optical transceiver module 3 according to an embodiment of the present application, Figure 9 is Figure 8 a perspective combined view of the electrical connector structure 1 and the optical transceiver module 3, Figure 10 is Figure 9 a top view of the electrical connector structure 1, the optical transceiver module 3 and the main board 5, Figure 11 is Figure 10 a sectional view of the line segment A-A of Figure 12 is Figure 10 a sectional view of the line segment B-B of Figure 13 and Figure 9 is a perspective combined view of the electrical connector structure and the optical transceiver module from the bottom view perspective. As Figure 8 shown, the electrical connector structure 1 according to an embodiment of the present application further includes a protective cover plate 15, which removably covers the top 12a of the second plate body 12 to protect the exposed terminals 131 during the assembly process. In some embodiments, as Figure 8As shown, the optical and electrical transceiver module 3 includes a top 30a, opposite sides 301 and 302, a neck 303, a connection head 304, and a plurality of limiting protrusions 308. In some embodiments, the connection head 304 is used to connect a plurality of optical fibers (not shown) or cables (not shown) to transmit and receive optical signals or electrical signals. Specifically, the limiting protrusions 308 are provided on the opposite sides 301 and 302 of the optical and electrical transceiver module 3. After the intermediate board module 10 enters the accommodation space 200 through a crimping method and is fixed on the main board 5, the protective cover plate 15 is removed, and the optical and electrical transceiver module 3 is detachably disposed on the intermediate board module 10 through a crimping method, wherein the limiting protrusions 308 are detachably engaged with the limiting grooves 208 of the fixing walls 201 and 202 (as Figure 9 shown).

[0155] As Figure 11 and Figure 12 shown, after the optical and electrical transceiver module 3 is positioned by crimping, the pressing rods 223 and 224 of the second limiting member 221 press against the top 30a of the optical and electrical transceiver module 3, and the bottom of the optical and electrical transceiver module 3 is located within the fixing walls 201 and 202, and the optical and electrical transceiver module 3 is electrically connected to the main board 5 through a plurality of terminals 131 of the intermediate board module 10. As Figure 13 shown, the bottom of the optical and electrical transceiver module 3 includes a positioning protrusion 305, and the intermediate board module 10 includes a hollow portion 105. The positioning protrusion 305 is inserted into the hollow portion 105 to further position the optical and electrical transceiver module 3 and the intermediate board module 10 on the main board 5.

[0156] Referring to Figures 14A to 14F , Figures 14A to 14F is a schematic flow chart of connecting the optical and electrical transceiver module 3 to the electrical connector structure 1 by a crimping method. When connecting, first assemble the fixing structure 20 at a predetermined position on the main board 5 (as Figure 14A shown), then lift the second limiting member 221 to the open state (as Figure 14B shown), then, use the protective cover plate 15 to press the intermediate board module 10 to enter the accommodation space 200 from above the main board 5, so that the intermediate board module 10 presses against the surface 51 of the main board 5 through the first limiting member 211 (as Figure 14C shown), after the intermediate board module 10 is positioned, remove the protective cover plate 15 (as Figure 14D shown), place the optical and electrical transceiver module 3 into the accommodation space 200 from top to bottom, and the limiting protrusions 308 are engaged with the limiting grooves 208 (as Figure 14E shown), finally, cover the second limiting member 221 back to the holding state (as Figure 14FAs shown in the figure, the ends of the pressure bars 223 and 224 away from the connecting rod 222 are fixed to the holding part 205 of the barb structure. At this time, the pressure bars 223 and 224 press against the top 30a of the optical transceiver module 3, thereby completing the connection of the optical transceiver module 3 and the interposer module 10, enabling the optical transceiver module 3 to be electrically connected to the main board 5 through a plurality of terminals 131 of the interposer module 10. Similarly, when removing the optical transceiver module 3, lift the second limiting member 221 to the open state in the opposite direction of the above steps to remove the optical transceiver module 3.

[0157] Referring to Figure 15 , Figure 15 is a schematic structural diagram of the contact between the terminal 131 and the optical transceiver module 3. As Figure 15 shown, when the optical transceiver module 3 is pressed downward onto the second plate body 12, the conductive contacts (not shown) at the bottom of the optical transceiver module 3 contact the end 136 of the second terminal arm 135 and force the second terminal arm 135 to move downward, enabling each terminal 131 to be securely connected to the corresponding conductive contact.

[0158] Referring to Figure 16 , which is a schematic diagram of a use state of the electrical connector structure 1 according to an embodiment of the present application. As Figure 16 shown, electronic components such as a processor (not shown) can be provided in the middle part of the main board 5, and multiple groups of electrical connector structures 1 and optical transceiver modules 3 can be respectively arranged around the main board 5. The actual number of groups of electrical connector structures 1 and optical transceiver modules 3 can be determined according to requirements and is not particularly limited. Each optical transceiver module 3 is externally connected to a signal transmission element, such as an optical fiber or a cable (not shown). With the above structure, high-capacity signal transmission and reception can be processed to meet the requirements of high-speed and large-volume signal processing.

[0159] In summary, in an embodiment provided by the method for manufacturing a terminal module of the present application, the number of required terminals can be adjusted by laser cutting to fabricate the terminal module; in another embodiment provided by the method for manufacturing a terminal module of the present application, the terminals can be formed independently, and then the terminal module can be fabricated according to the number of required terminals without laser cutting processing. Additionally, since the terminals of the present application are manufactured by stamping, compared with the existing etching manufacturing method, they have advantages such as stable dimensions, high precision, fast production, convenient storage and protection of the terminals. Moreover, since the terminal module is small in size, it can be pieced together and arranged side by side to increase the terminal density.

[0160] In the electrical connector structure of the embodiment of the present application, the intermediate board module and the optical transceiver module can be sequentially stacked by a crimping method and detachably arranged in the fixing structure, and the first limiting member and the second limiting member are respectively used to firmly press the intermediate board module and the optical transceiver module, so that the optical transceiver module can be connected to the electrical connector structure through a simple crimping method. Furthermore, the main board is directly electrically connected through the integrally formed terminals of the intermediate board module, so that the electrical signals after optical-electric conversion from the optical transceiver module can be transmitted to the main board, thereby fully exerting the advantages of high-capacity and high-speed transmission provided by the optical transceiver module, shortening the transmission distance between the optical transceiver module and the main board, and being conducive to maintenance and replacement, effectively solving the problems that the co-packaged optical components in the current situation need to be connected to the main board through connecting wires and connectors, resulting in too long transmission paths and being difficult to maintain and replace.

[0161] The above descriptions are only illustrative and not restrictive. For those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A terminal module manufacturing method, characterized in that: Include: Providing a material strip; Forming a plurality of terminals and at least one material strip fixing portion on the material strip by stamping, wherein the plurality of terminals are connected to the at least one material strip fixing portion; and Firstly, a terminal seat is formed on the plurality of terminals, and then the plurality of terminals are separated from the at least one material strip fixing portion; or The plurality of terminals are first separated from the at least one material strip fixing portion, and then the terminal seat is formed on the plurality of terminals.

2. The terminal module manufacturing method according to claim 1, characterized in that: The terminal seat is made of plastic, and the terminal module manufacturing method further comprises placing the plurality of terminals and the at least one material strip fixing portion in a plastic molding machine to form the terminal seat.

3. The method for manufacturing a terminal module according to claim 2, wherein: The material strip is defined with a plurality of stamping areas. The terminal module manufacturing method further comprises forming the plurality of terminals in each of the plurality of stamping areas. The plurality of terminals between the plurality of stamping areas are connected by a first connecting portion.

4. The method for manufacturing a terminal module according to claim 3, wherein: The terminal module manufacturing method further comprises cutting the first connection portion and the connection between the plurality of terminals and the at least one material strip fixing portion after forming the terminal seat on the plurality of terminals.

5. The method for manufacturing a terminal module according to claim 3, wherein: The terminal module manufacturing method also includes cutting and removing the terminals by laser according to a predetermined number, so that the plurality of terminals having the predetermined number are connected.

6. The method for manufacturing a terminal module according to claim 3, wherein: The terminal seat is formed with a plurality of holes, and the plurality of holes are formed between the plurality of connected terminals. The terminal module manufacturing method further comprises cutting a plurality of second connection parts connected between the plurality of terminals in the same stamping area by means of the plurality of holes using a laser cutting method.

7. The method for manufacturing a terminal module according to claim 2, wherein: The material strip is defined with a plurality of stamping areas, and the terminal module manufacturing method further comprises forming the plurality of terminals in the plurality of stamping areas respectively.

8. The method for manufacturing a terminal module according to claim 7, wherein: The terminal module manufacturing method further comprises first separating the plurality of terminals from the at least one material strip fixing portion, and then using the plastic molding machine to form the terminal seat on the plurality of terminals spaced apart from each other.

9. A terminal module, characterized in that: Include: Several terminals; A terminal seat, covering the plurality of terminals; Each of the plurality of terminals includes a root portion, a first terminal arm and a second terminal arm. The root portion is covered by the terminal seat, and an end portion of the first terminal arm and an end portion of the second terminal arm extend out of the terminal seat.

10. The terminal module according to claim 9, characterized in that: The terminal seat is formed with a plurality of holes, and the plurality of terminals are spaced apart corresponding to the plurality of holes.

11. The terminal module according to claim 9, characterized in that: The terminal block includes insulating material.

12. An electrical connector structure, used to connect an optoelectronic transceiver module on a mainboard, characterized in that: The electrical connector structure comprises: An intermediate board module, including a plurality of terminal modules, each of which includes a plurality of terminals and a terminal seat, the plurality of terminals are arranged at intervals from each other, and the plurality of terminal modules are arranged side by side; and A fixed structure includes a pair of fixed walls, a plurality of first limiting members and a second limiting member, the pair of fixed walls are arranged on the main board and are spaced apart from each other to form an accommodating space, the plurality of first limiting members are respectively arranged on the pair of fixed walls and protrude into the accommodating space, and the second limiting member is arranged above the plurality of first limiting members, wherein the intermediate board module and the optoelectronic transceiver module are stacked in sequence and detachably arranged in the accommodating space, and the plurality of first limiting members restrict the intermediate board module to the main board, the second limiting member restricts the optoelectronic transceiver module to the intermediate board module, and the optoelectronic transceiver module is electrically connected to the main board through the plurality of terminals of the intermediate board module.

13. The electrical connector structure according to claim 12, wherein: The intermediate board module also includes a first board body and a second board body assembled with each other, and the plurality of terminal modules are arranged between the first board body and the second board body, wherein each terminal includes a root portion, a first terminal arm and a second terminal arm, the root portion is fixed to the terminal seat, and one end portion of the first terminal arm extends out of the first board body, and one end portion of the second terminal arm extends out of the second board body.

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