Mixed-voltage circuit board, circuit board module and preparation method of mixed-voltage circuit board
By adopting a mixed voltage circuit board structure with consistent dielectric constant in the circuit board, the problem of high-speed signal impedance jump in the asymmetric stacked structure is solved, and the signal quality is improved.
Patent Information
- Application Number
- CN202510326147.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-19
- Publication Date
- 2025-07-01
AI Technical Summary
In circuit boards with asymmetric laminated structures, the impedance of high-speed signals will jump, affecting the transmission quality of high-speed signals.
Using a mixed circuit board structure, by pressing the third sub-board whose dielectric constant is consistent with the first sub-board in the first compressed area of the first sub-board, and forming a high-speed signal via between the first sub-board and the third sub-board, the impedance jump caused by the change in the dielectric constant is avoided.
Maintain the impedance consistency of high-speed signal vias and improve the signal quality of high-speed signals in network equipment.
Smart Images
Figure CN120239167A_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the field of electronic technology, and particularly to a hybrid pressure circuit board, a circuit board module, and a method for manufacturing a hybrid pressure circuit board. Background Art
[0002] With the development of network technology, the demand for network transmission speed has gradually increased. The lines formed on the circuit board of network devices are divided into high-speed signal lines for rapid data interaction, low-speed signal lines for management and control, and power supply lines for power supply, etc. In order to improve the current-carrying capacity and signal integrity on the circuit board, an asymmetric stack structure has emerged, which is formed by laminating a high-speed sub-board and a low-speed sub-board made of different substrates.
[0003] However, in order to achieve the reliability of rapid data interaction in the circuit board, it is necessary to maintain the impedance consistency of high-speed signals. In an asymmetric stack structure, since high-speed signals need to pass through the high-speed sub-board and the low-speed sub-board, under other unchanged conditions, the impedance of high-speed signals will jump, affecting the signal integrity of high-speed signal transmission and reducing the signal quality of high-speed signals on network devices. Summary of the Invention
[0004] To overcome the problems existing in the related art, this specification provides a hybrid pressure circuit board, a circuit board module, and a method for manufacturing a hybrid pressure circuit board.
[0005] According to the first aspect of the embodiments of this specification, a hybrid pressure circuit board is provided, including:
[0006] A first sub-board, which is divided into a first lamination area and a second lamination area, and a processor area is formed in the second lamination area;
[0007] A second sub-board, which is laminated on the second lamination area of the first sub-board;
[0008] A third sub-board, which is laminated on the first lamination area of the first sub-board, the outer surfaces of the second sub-board and the third sub-board are parallel, the dielectric constant of the substrate of the third sub-board is less than the dielectric constant of the substrate of the second sub-board and the dielectric constant of the substrate of the third sub-board is consistent with the dielectric constant of the substrate of the first sub-board;
[0009] Wherein, the high-speed signal blind vias provided in the processor area of the first sub-board are connected to the high-speed signal vias formed in the first lamination area through high-speed signal lines, and the high-speed signal vias extend from the first sub-board to the outer surface of the third sub-board.
[0010] Optionally, the number of layers of the third sub-board is less than the number of layers of the second sub-board.
[0011] Optionally, a first through-flow blind hole is formed on one side of the second daughter board close to the third daughter board;
[0012] A power supply hole is formed on the third daughter board, the power supply hole is located in the input / output IO device area of the third daughter board, a second through-flow blind hole is formed on one side of the third daughter board close to the second daughter board, and the second through-flow blind hole is connected to the power supply hole;
[0013] Wherein, the first through-flow blind hole corresponds to the second through-flow blind hole.
[0014] Optionally, a gap is formed between the second daughter board and the third daughter board.
[0015] According to the second aspect of the embodiments of the present specification, a circuit board module is provided, including:
[0016] The hybrid pressure circuit board described in any one of the above.
[0017] Optionally, the circuit board module further includes a voltage conversion module, wherein one end of the voltage conversion module is connected to the first through-flow blind hole in the hybrid pressure circuit board, and the other end of the voltage conversion module is connected to the second through-flow blind hole in the hybrid pressure circuit board.
[0018] According to the third aspect of the embodiments of the present specification, a method for manufacturing a hybrid pressure circuit board is provided, including:
[0019] Manufacture a first daughter board, and drill daughter board positioning holes in the first lamination area of the first daughter board, wherein the high-speed signal lines formed in the first daughter board extend from the first lamination area to the high-speed signal blind holes formed in the processor area of the first daughter board;
[0020] Manufacture a second daughter board, and form a window opening at a position corresponding to the first lamination area of the first daughter board on the second daughter board;
[0021] Manufacture a third daughter board, and drill installation positioning holes corresponding to the daughter board positioning holes on the third daughter board, wherein the dielectric constant of the base material of the third daughter board is less than the dielectric constant of the base material of the second daughter board and the dielectric constant of the base material of the third daughter board is consistent with the dielectric constant of the base material of the first daughter board;
[0022] Bond a semi-cured sheet on the first daughter board, fix the third daughter board to the first lamination area of the first daughter board by passing positioning pins through the daughter board positioning holes and the installation positioning holes, and place the second daughter board in the second lamination area according to the corresponding relationship between the window opening of the second daughter board and the first lamination area, and laminate to form a laminated board;
[0023] Drill high-speed signal vias through the first sub-board and the third sub-board on the press-fit board to form a mixed-pressure circuit board.
[0024] Optionally, the opening size of the second sub-board is larger than the size of the third sub-board.
[0025] Optionally, during the process of preparing the second sub-board, it further includes:
[0026] Drill a first through-flow hole on the side of the second sub-board close to the third sub-board;
[0027] During the process of preparing the third sub-board, it further includes:
[0028] Form a second through-flow hole on the side of the third sub-board close to the second sub-board;
[0029] During the process of drilling high-speed signal vias through the first sub-board and the third sub-board on the press-fit board to form a mixed-pressure circuit board, it further includes:
[0030] Form a second through-flow blind hole through the second through-flow hole, form a first through-flow blind hole through the first through-flow hole, and drill and form a power supply hole, and form a power supply hole on the third sub-board, where the power supply hole is located in the IO device area of the third sub-board and is connected to the second through-flow blind hole.
[0031] Optionally, grooves are formed on one side of the sub-board positioning hole and the mounting positioning hole close to the outer surface;
[0032] During the process of fixing the third sub-board to the first pressing area of the first sub-board by inserting positioning pins through the sub-board positioning hole and the mounting positioning hole, the head of the positioning pin is received in the groove.
[0033] The technical solutions provided in the embodiments of this specification may include the following beneficial effects:
[0034] In the embodiments of this specification, through the above structure, the dielectric constant of the base material of the third sub-board pressed in the first pressing area of the first sub-board of the mixed-pressure circuit board is consistent with the dielectric constant of the base material of the first sub-board and is less than the dielectric constant of the base material of the second sub-board. When forming high-speed signal vias between the first sub-board and the third sub-board, impedance jumps caused by changes in the dielectric constant of the base material can be avoided, the impedance consistency of the high-speed signal vias is maintained, and the signal quality of high-speed signals in the network device is improved.
[0035] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. Description of the Drawings
[0036] The accompanying drawings here are incorporated into and constitute a part of this specification, showing embodiments consistent with this specification, and are used together with the specification to explain the principles of this specification.
[0037] Figure 1 is a schematic structural diagram of a hybrid pressure circuit board involved in this application;
[0038] Figure 2 is a schematic structural diagram of a circuit board module involved in this application;
[0039] Figure 3 is a flowchart of a method for manufacturing a hybrid pressure circuit board involved in this application;
[0040] Figure 4 is a schematic structural diagram of a first sub-board manufactured in a method for manufacturing a hybrid pressure circuit board involved in this application;
[0041] Figure 5 is a schematic structural diagram of a second sub-board manufactured in a method for manufacturing a hybrid pressure circuit board involved in this application;
[0042] Figure 6 is a schematic structural diagram of a third sub-board manufactured in a method for manufacturing a hybrid pressure circuit board involved in this application;
[0043] Figure 7 is a schematic structural diagram of the first sub-board and the third sub-board fixed by positioning pins and laminated with the second sub-board in a method for manufacturing a hybrid pressure circuit board involved in this application. Detailed Description of the Embodiments
[0044] Exemplary embodiments will be described in detail herein, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. On the contrary, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.
[0045] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the", and "said" used in this specification and the appended claims are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
[0046] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to determining".
[0047] This application provides a hybrid pressure circuit board 100, as Figure 1 shown, including:
[0048] A first sub-board 1, on which a first lamination area 10 and a second lamination area 11 are defined. A processor area 12 is formed in the second lamination area 11. The first lamination area 10 and the second lamination area 11 can be understood as ranges on the first sub-board 1. The second lamination area 11 is used to correspondingly laminate the second sub-board 2 described later, and the first lamination area 10 is used to correspondingly laminate the third sub-board 3 described later. The actual ranges of the first lamination area 10 and the second lamination area 11 are determined by the sizes and shapes of the second sub-board 2 and the third sub-board 3 that need to be laminated to the first sub-board 1. The processor area 12 can be a position for setting a processor. In the processor area 12, a first power supply hole 40 for powering the processor, a high-speed signal blind hole 42, and a ground via 43 for connecting to the ground plane, etc. can be set. On the first sub-board 1, a low-speed signal hole 44 for realizing low-speed signal transmission, a high-speed signal via 41 for transmitting high-speed signals, etc. can also be set;
[0049] A second sub-board 2, which is laminated on the second lamination area 11 of the first sub-board 1. A voltage conversion module can be plugged in later on the second sub-board 2, and the converted power supply is input to the processor through the above-mentioned first power supply hole 40. Since different devices installed on the hybrid pressure circuit board 100 may require different voltage power supplies, the number of voltage conversion modules may be multiple, providing different voltages to different devices. For example, the second sub-board 2 may also include power supply provided for an interface connector;
[0050] The third sub-board 3 is pressed and bonded to the first pressing area 10 of the first sub-board 1. The outer surfaces of the second sub-board 2 and the third sub-board 3 are parallel. The dielectric constant of the base material of the third sub-board 3 is less than that of the base material of the second sub-board 2 and is consistent with the dielectric constant of the base material of the first sub-board 1. The inner surfaces of the second sub-board 2 and the third sub-board 3 refer to the side surfaces pressed and bonded to the first sub-board 1, and the outer surfaces of the second sub-board 2 and the third sub-board 3 refer to the side surfaces located on the side pressed and bonded to the first sub-board 1. An IO device area 30 can be provided on the third sub-board 3 for IO devices that can be plugged in for subsequent high-speed signal external transmission. Therefore, high-speed signal blind vias 42 and high-speed signal vias 41 can also be provided on the third sub-board 3, and high-speed signal transmission from the high-speed signals in the processor area 12 to the IO device area 30 is achieved through high-speed signal lines 48;
[0051] Among them, the high-speed signal blind vias 42 provided in the processor area 12 of the first sub-board 1 are connected to the high-speed signal vias 41 formed in the first pressing area 10 through high-speed signal lines 48, and the high-speed signal vias 41 extend from the first sub-board 1 to the outer surface of the third sub-board 3.
[0052] The hybrid pressing circuit board 100 can refer to a circuit board formed by pressing and bonding several sub-boards made of different base materials.
[0053] By dividing the first pressing area 10 on the first sub-board 1 of the above hybrid pressing circuit board 100 to correspondingly press and bond the third sub-board 3, and dividing the second pressing area 11 to correspondingly press and bond the second sub-board 2, when the high-speed signal vias 41 or high-speed signal blind vias 42 need to pass through the first sub-board 1 and the third sub-board 3, by selecting base materials with the same dielectric constant for the first sub-board 1 and the third sub-board 3, impedance jumps that occur during the formation of high-speed signal holes in the first sub-board 1 and the third sub-board 3 are avoided, thereby improving the reliability of high-speed signal transmission in the network device.
[0054] In the above structure, other internal circuits such as ground wires can also be provided on the first sub-board 1, the second sub-board 2, and the third sub-board 3 in addition to the high-speed signal lines 48. For the convenience of observation, they are not all shown in the figure. During pressing, the first sub-board 1 bonds the second sub-board 2 and the third sub-board 3 through the bonding layer 104A formed by the prepreg.
[0055] In addition, the second sub-board 2 selects a base material with a dielectric constant higher than that of the first sub-board 1 and the third sub-board 3 to reduce the overall cost of the hybrid pressing circuit board 100.
[0056] It should be noted that the dielectric constants of the substrates of the first sub-board 1 and the third sub-board 3 being consistent can mean that the dielectric constants of the substrates are the same or similar, with the criterion that the impedance change when high-speed signal holes (including high-speed signal vias and / or high-speed signal blind vias) pass through the first sub-board 1 and the third sub-board 3 is not too large. The specific materials selected can be chosen according to actual requirements.
[0057] On the first sub-board 1 in a hybrid multilayer circuit board 100, multiple first lamination regions 10 can be defined. That is to say, multiple third sub-boards 3 for realizing high-speed signal transmission can be laminated on the first sub-board 1. The third sub-board 3 can include sub-boards arranged at the positions of plug-in interface connectors, sub-boards arranged at the positions of high-speed signal transmission buckle plates, and sub-boards arranged at the positions of connection backplane connectors. The specific number and functions of the third sub-boards 3 can be set according to actual requirements.
[0058] Optionally, the number of layers of the third sub-board 3 is less than the number of layers of the second sub-board 2.
[0059] In the hybrid multilayer circuit board 100, since the first sub-board 1, the second sub-board 2, and the third sub-board 3 are formed by preparing a core board, the core board can include a substrate in the middle and copper-clad layers attached to both sides of the substrate. Circuit patterns can be formed on each core board through processes such as exposure, development, etching, and rinsing. Multiple core boards with prepared circuit patterns are formed into a laminated board through processes such as attaching prepregs and lamination, and a sub-board is prepared on the laminated board through processes such as drilling, metallization, and via filling.
[0060] For each sub-board, each core board can be understood as a layer in the sub-board. As the number of layers in the sub-board increases, the cost of preparing the sub-board will increase. And since the circuit patterns mainly arranged on the third sub-board 3 are those related to high-speed signals and power supply and grounding related to high-speed signal transmission, etc., therefore, compared with the second sub-board 2 that requires more complex layer change, the number of layers of the third sub-board 3 can be set to be less than the number of layers of the second sub-board 2, thereby reducing the preparation complexity and cost of the hybrid multilayer circuit board 100, and further reducing the complexity and cost of the circuit board in the network device.
[0061] Optionally, a first through-flow blind hole 45 is formed on one side of the second sub-board 2 close to the third sub-board 3;
[0062] Power supply holes are formed on the third sub-board 3, and the power supply holes are located in the IO (Input Output) device area of the third sub-board 3. A second through-flow blind hole 46 is formed on one side of the third sub-board 3 close to the second sub-board 2, and the second through-flow blind hole 46 is connected to the power supply holes;
[0063] Among them, the first flow-through blind hole 45 corresponds to the second flow-through blind hole 46.
[0064] The power supply holes formed on the third sub-board 3 can be referred to as the second power supply holes 47. The IO device area 30 can be understood as corresponding to the above-mentioned interface connector area. Of course, it is not limited to interface connectors and varies according to different devices to be welded and plugged.
[0065] The first flow-through blind hole 45 and the second flow-through blind hole 46 refer to the structures formed after the second sub-board 2 and the third sub-board 3 are pressed onto the first sub-board 1. When the second sub-board 2 and the third sub-board 3 are not pressed onto the first sub-board 1, the first flow-through blind hole 45 and the second flow-through blind hole 46 are provided in the form of through-flow holes.
[0066] Since the second sub-board 2 and the third sub-board 3 are prepared separately and power supply cannot be achieved through the internal lines of the board, it is necessary to form flow-through blind holes at positions close to each other between the second sub-board 2 and the third sub-board 3, that is, on the side of the second sub-board 2 close to the third sub-board 3 and on the side of the third sub-board 3 close to the second sub-board 2 respectively. Then, when plugging in the voltage conversion module later, the two pins are respectively plugged into the first flow-through blind hole 45 and the second flow-through blind hole 46 to realize the supply of power on the second sub-board 2 to the devices (such as interface connectors) on the third sub-board 3 after being converted by the voltage conversion module.
[0067] Therefore, through the above settings of the first flow-through blind hole 45 and the second flow-through blind hole 46, power supply between the second sub-board 2 and the third sub-board 3 in the hybrid pressure circuit board 100 can be realized.
[0068] Optionally, a gap 32 is formed between the second sub-board 2 and the third sub-board 3.
[0069] Due to the positional relationship between the second sub-board 2 and the third sub-board 3, it can be understood that the second sub-board 2 surrounds the third sub-board 3. Therefore, forming a gap 32 between the second sub-board 2 and the third sub-board 3 can avoid interference between the second sub-board 2 and the third sub-board 3 caused by tolerances and improve the pressing reliability of the hybrid pressure circuit board.
[0070] Correspondingly, the present application also provides a circuit board module 200, as Figure 2 shown, including:
[0071] The hybrid pressure circuit board 100 described in any one of the above, and an interface connector 201, a processor 202, etc. are connected to the hybrid pressure circuit board 100 by plugging, welding, etc. Of course, other devices can also be connected to the hybrid pressure circuit board 100 according to actual needs, such as buckle connectors, backplane connectors, etc.
[0072] Optionally, the circuit board module 200, as Figure 2As shown, it further includes a voltage conversion module 203. One end of the voltage conversion module 203 is connected to the first current-carrying blind hole 45 in the mixed-voltage circuit board 100, and the other end of the voltage conversion module 203 is connected to the second current-carrying blind hole 46 in the mixed-voltage circuit board 100.
[0073] Through the above method, power supply from the second sub-board 2 to the third sub-board 3 in the mixed-voltage circuit board 100 can be achieved.
[0074] Correspondingly, the present application further provides a method for manufacturing a mixed-voltage circuit board, as Figure 3 shown, including:
[0075] S100. Prepare a first sub-board, and drill sub-board positioning holes in the first lamination area of the first sub-board.
[0076] The first lamination board 101 is formed by preparing circuit patterns on a plurality of core boards and performing lamination. As Figure 1 , 4 shown, divide a first lamination area 10 and a second lamination area 11 on the first lamination board 101, and drill sub-board positioning holes 101A at at least two corners of the first lamination area 10. In Figure 4 the example, four sub-board positioning holes 101A are drilled in the first lamination area 10. There can be multiple first lamination areas 10, which are set according to actual requirements. The second lamination area 11 can be understood as the part other than the first lamination area 10 to form the first sub-board 1. In addition to the above sub-board positioning holes 101A, lamination positioning holes for positioning when the first sub-board 1 and the second sub-board 2 are laminated later also need to be formed on the first sub-board 1. Among them, from Figure 4 observation, the first lamination area 10 and the second lamination area 11 can refer to the areas within the dotted line frames.
[0077] Among them, the high-speed signal line 48 formed in the first sub-board 1 extends and is connected to the high-speed signal blind hole 42 formed in the processor area 12 of the first sub-board 1. The high-speed signal blind hole 42 can be a high-speed signal through hole when the first sub-board 1, the second sub-board 2, and the third sub-board 3 are not completely laminated, and forms a high-speed signal blind hole 42 after the first sub-board 1, the second sub-board 2, and the third sub-board 3 are laminated.
[0078] Among them, the side cross-sectional structures of the above-mentioned first sub-board 1, second sub-board 2, and third sub-board 3 are explained with reference to the completed mixed-voltage circuit board 100 shown in Figure 1 to more clearly show the internal structure. In addition, the first lamination area 10, the second lamination area 11, the processor area 12, etc. in Figure 4The following describes one side surface of the hybrid laminate circuit board 100, and it does not mean that the first lamination area 10, the second lamination area 11, and the processor area 12 are all on one side surface of the hybrid laminate circuit board 100. For example, for the first laminate 101, the first lamination area 10 and the second lamination area 11 can be on one side surface, and the processor area 12 can be on the other side surface of the first laminate 101. However, when observed from Figure 4 the angle shown, the projection of the processor area 12 falls within the projection of the second lamination area 11.
[0079] S101. Prepare the second sub-board, and form a window at a position corresponding to the first lamination area of the first sub-board on the second sub-board.
[0080] As Figure 5 shown, the second laminate 102 is formed by preparing circuit patterns on several core boards and performing lamination, and a window 102A is milled corresponding to the first lamination area 10 on the first sub-board 1. The window 102A can be a hollow area, which is used to place the formed third sub-board 3 later. The size of the window 102A can be slightly larger than the size of the third sub-board 3 to avoid interference with the third sub-board 3 that has been laminated to the first sub-board 1 when laminating the second sub-board 2.
[0081] When preparing the second sub-board 2, it is also necessary to drill lamination positioning holes, which correspond to the lamination positioning holes on the first sub-board 1.
[0082] S102. Prepare the third sub-board, and drill installation positioning holes corresponding to the sub-board positioning holes on the third sub-board.
[0083] As Figure 6 shown, the third laminate 103 is formed by preparing circuit patterns on several core boards and performing lamination, and installation positioning holes 103A corresponding to the first sub-board 1 are drilled on the third laminate 103. The required size of the third sub-board 3 may be small. Therefore, multiple identical or different third sub-boards 3 can be prepared on one third laminate 103 respectively, and after laminating to form the third laminate 103 and completing the drilling of vias, through holes, and / or blind holes, etc., it is cut to finally form one or more third sub-boards 3.
[0084] When preparing the first sub-board 1, the second sub-board 2, and the third sub-board 3, it is necessary to pay attention to selecting the required base material and the number of core boards. The base material can be understood as the intermediate layer of the core board. The dielectric constant of the base material of the third sub-board 3 is less than the dielectric constant of the base material of the second sub-board 2 and the dielectric constant of the base material of the third sub-board 3 is consistent with the dielectric constant of the base material of the first sub-board 1.
[0085] S103. Bond a prepreg on the first sub-board, fix the third sub-board to the first lamination area of the first sub-board by inserting positioning pins through the sub-board positioning holes and the mounting positioning holes, and place the second sub-board in the second lamination area according to the corresponding relationship between the window opening of the second sub-board and the first lamination area, and then laminate to form a laminated board.
[0086] As Figure 7 shown, after the first sub-board 1, the second sub-board 2, and the third sub-board 3 are respectively prepared, these sub-boards need to be laminated to form a mixed-laminated circuit board 100. At this time, it is necessary to first fix the first sub-board 1, place a prepreg on the first sub-board 1, and then place the third sub-board 3 in the first lamination area 10. The first sub-board 1 and the third sub-board 3 are fixed by inserting the positioning pin 105 through the sub-board positioning hole 101A and the mounting positioning hole 103A, etc., to form a fourth laminated board 104. The prepreg in the laminated board can form the subsequent adhesive layer 104A.
[0087] To avoid deviation during insertion caused by the dimensional deviation between the positioning pin 105 and the sub-board positioning hole 101A and the mounting positioning hole 103A, resulting in lamination deviation between the first sub-board 1 and the third sub-board 3. Optionally, a groove 106 is formed on one side of the sub-board positioning hole 101A and the mounting positioning hole 103A close to the outer surface;
[0088] During the process of fixing the third sub-board 3 to the first lamination area 10 of the first sub-board 1 by inserting the positioning pin 105 through the sub-board positioning hole 101A and the mounting positioning hole 103A, the head 105A of the positioning pin 105 is received in the groove 106.
[0089] Through the above setting, the head 105A of the positioning pin 105 can be received in the groove 106 to achieve preliminary positioning, and the shaking of the positioning pin 105 is restricted by the groove 106, thereby avoiding lamination deviation when laminating the first sub-board 1 and the third sub-board 3.
[0090] After the first sub-board 1 and the third sub-board 3 are fixed, the second sub-board 2 can be laminated to the second lamination area 11. Since the size of the window opening 102A of the second sub-board 2 can be set to be slightly larger than the size of the third sub-board 3 to avoid interference between the second sub-board 2 and the third sub-board 3 when placing the second sub-board 2. After placing the second sub-board 2 and the third sub-board 3 on the first sub-board 1 and then laminating, the prepreg bonds the second sub-board 2 and the third sub-board 3 to the first sub-board 1.
[0091] In this process, since the size of the opening 102A of the second sub-board 2 is larger than that of the third sub-board 3, a gap 32 is formed between the second sub-board 2 and the third sub-board 3. During the lamination process, the prepreg melts and overflows into the gap 32. On the one hand, it can improve the adhesion between the second sub-board 2 and the third sub-board 3. On the other hand, it can also avoid the shaking of the third sub-board 3 through the filling of the prepreg, further improving the reliability of the fabricated hybrid laminate circuit board.
[0092] S104. Drill high-speed signal vias through the first sub-board and the third sub-board on the laminated board to form a hybrid laminate circuit board.
[0093] After the fourth laminated board 104 is formed, high-speed signal vias 41 passing through the first sub-board 1 and the third sub-board 3 are fabricated by drilling through holes and performing processes such as metallization, via filling, and back drilling during the process of preparing the surface pattern. In addition, the fabrication of the hybrid laminate circuit board 100 is finally completed through other circuit board fabrication processes. For example, the process edge provided with the lamination positioning holes is removed, the positioning pins 105 are drilled out, and fixing holes for fixing the hybrid laminate circuit board 100 to the inside of the network device are formed through the positions of the mounting positioning holes 103A and the sub-board positioning holes 101A. Finally, a structure as shown in Figure 1 is formed. Other processes are set according to actual requirements and are not limited.
[0094] Optionally, during the process of step S101 of fabricating the second sub-board, it further includes:
[0095] Drill a first through-flow hole on the side of the second sub-board close to the third sub-board.
[0096] During the process of step S102 of fabricating the third sub-board, it further includes:
[0097] Form a second through-flow hole on the side of the third sub-board close to the second sub-board, and form a third through-flow hole on the third sub-board.
[0098] As shown in Figure 1 、 5 、6, drill a first through-flow hole 45A on the second laminated board 102, and drill a second through-flow hole 46A on the third laminated board 103.
[0099] During the process of step S103 of drilling high-speed signal vias through the first sub-board and the third sub-board on the laminated board to form a hybrid laminate circuit board, it further includes:
[0100] Form a second through-flow blind hole through the second through-flow hole, form a first through-flow blind hole through the first through-flow hole, and drill and form a power supply hole, and form a power supply hole on the third sub-board.
[0101] After the second daughter board 2 and the third daughter board 3 are laminated to the first daughter board 1, since one side of the first through-flow hole 45A and the second through-flow hole 46A is blocked, a first through-flow blind hole 45 and a second through-flow blind hole 46 are formed. A power supply hole (i.e., the second power supply hole 47) is formed through processes such as drilling, metallization, via filling, and back drilling.
[0102] Among them, the power supply hole (i.e., the second power supply hole 47) is located in the IO device area 30 of the third daughter board 3 and is connected to the second through-flow blind hole 46 to achieve power supply transmission from the second daughter board 2 to the third daughter board 3.
[0103] It should be noted that only some structures and devices are schematically shown in the above-mentioned first daughter board, second daughter board, third daughter board, the hybrid laminated circuit board formed after lamination, and the circuit board module after plugging in devices. It does not mean that only the recorded structures are included, and it does not limit the devices and internal structures that the above-mentioned circuit board and circuit board assembly can be connected to.
[0104] The technical solutions provided in the embodiments of this specification may include the following beneficial effects:
[0105] In the embodiments of this specification, through the above structure, the dielectric constant of the base material of the third daughter board laminated in the first lamination area of the first daughter board of the hybrid laminated circuit board is consistent with the dielectric constant of the base material of the first daughter board and is less than the dielectric constant of the base material of the second daughter board. When forming high-speed signal vias between the first daughter board and the third daughter board, impedance jumps caused by changes in the dielectric constant of the base material can be avoided, maintaining the impedance consistency of the high-speed signal vias and improving the signal quality of high-speed signals in network devices.
[0106] The specific embodiments of this specification have been described above. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require the specific order or sequential order shown to achieve the desired result. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0107] Those skilled in the art will readily think of other implementations of this specification after considering the specification and practicing the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations of this specification, which follow the general principles of this specification and include known common knowledge or conventional technical means in the technical field not claimed in this application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of this specification are pointed out by the following claims.
[0108] It should be understood that the present specification is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present specification is only limited by the appended claims.
[0109] The above are only the preferred embodiments of the present specification and are not intended to limit the present specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present specification shall be included within the scope of protection of the present specification.
Claims
1. A hybrid circuit board, characterized in that: include: A first sub-board, wherein the first sub-board is divided into a first pressing area and a second pressing area, and a processor area is formed in the second pressing area; a second sub-board, the second sub-board being pressed onto a second pressing area of the first sub-board; a third sub-board, the third sub-board being pressed onto the first pressing region of the first sub-board, the outer surfaces of the second sub-board and the third sub-board being parallel, the dielectric constant of the substrate of the third sub-board being smaller than the dielectric constant of the substrate of the second sub-board and being consistent with the dielectric constant of the substrate of the first sub-board; The high-speed signal blind holes arranged in the processor area of the first sub-board are connected to the high-speed signal vias formed in the first pressing area through high-speed signal lines, and the high-speed signal vias extend from the first sub-board to the outer surface of the third sub-board.
2. The hybrid circuit board according to claim 1, characterized in that: The number of layers of the third sub-board is smaller than the number of layers of the second sub-board.
3. The hybrid circuit board according to claim 1, characterized in that: A first through-flow blind hole is formed on one side of the second sub-plate close to the third sub-plate; A power supply hole is formed on the third sub-board, and the power supply hole is located in the input and output IO device area of the third sub-board. A second flow blind hole is formed on a side of the third sub-board close to the second sub-board, and the second flow blind hole is connected to the power supply hole; The first through-flow blind hole corresponds to the second through-flow blind hole.
4. The hybrid circuit board according to claim 1, characterized in that: A gap is formed between the second sub-board and the third sub-board.
5. A circuit board module, characterized in that: include: A hybrid circuit board as described in any one of claims 1 to 4 above.
6. The circuit board module according to claim 5, characterized in that: It also includes a voltage conversion module, wherein one end of the voltage conversion module is connected to a first through-flow blind hole in the hybrid circuit board, and the other end of the voltage conversion module is connected to a second through-flow blind hole in the hybrid circuit board.
7. A method for preparing a mixed pressure circuit board, characterized in that: include: Prepare a first daughter board, drill a daughter board positioning hole in a first pressing area of the first daughter board, wherein a high-speed signal line formed in the first daughter board extends from the first pressing area to connect to a high-speed signal blind hole formed in a processor area of the first daughter board; Prepare a second sub-board, and form a window at a position of the second sub-board corresponding to the first pressing area of the first sub-board; Prepare a third sub-board, and drill a mounting positioning hole on the third sub-board corresponding to the positioning hole of the sub-board, wherein the dielectric constant of the substrate of the third sub-board is smaller than the dielectric constant of the substrate of the second sub-board and the dielectric constant of the substrate of the third sub-board is consistent with the dielectric constant of the substrate of the first sub-board; The prepreg is attached to the first sub-board, the third sub-board is fixed to the first pressing area of the first sub-board by inserting positioning pins through the sub-board positioning holes and the installation positioning holes, and the second sub-board is placed in the second pressing area according to the corresponding relationship between the opening of the second sub-board and the first pressing area, and pressed to form a pressed board; High-speed signal vias passing through the first sub-board and the third sub-board are drilled on the press board to form a mixed pressure circuit board.
8. The method according to claim 7, characterized in that The window size of the second sub-board is larger than that of the third sub-board.
9. The method according to claim 7, characterized in that: The process of preparing the second sub-board also includes: A first through-hole is drilled on a side of the second sub-plate close to the third sub-plate; The process of preparing the third sub-board also includes: A second through hole is formed on a side of the third sub-plate close to the second sub-plate; The process of drilling high-speed signal vias through the first sub-board and the third sub-board on the press board to form a hybrid circuit board also includes: A second through-flow blind hole is formed through the second through-flow hole, a first through-flow blind hole is formed through the first through-flow hole, and a power supply hole is drilled to form a power supply hole on the third sub-board, wherein the power supply hole is located in the IO device area of the third sub-board and is connected to the second through-flow blind hole.
10. The method according to claim 7, characterized in that A groove is formed on one side of the sub-board positioning hole and the installation positioning hole close to the outer surface; In the process of fixing the third sub-board to the first pressing area of the first sub-board by inserting positioning pins through the sub-board positioning holes and the installation positioning holes, the heads of the positioning pins are accommodated in the grooves.