Rigid-flexible mixed pressing plate, network equipment and preparation method of rigid-flexible mixed pressing plate

Abstract

The invention provides a rigid-flexible mixed pressing plate, network equipment and a preparation method of the rigid-flexible mixed pressing plate, and relates to the technical field of electronics. A rigid-flexible mixed pressing plate comprises a signal processing plate; the signal processing board is located between the at least two signal interaction boards; wherein at least two layers of rigid circuit boards and at least one layer of flexible circuit board in the signal processing board and the signal interaction board are alternately stacked, and a gap is formed between the rigid circuit board in the signal processing board and the rigid circuit board in the signal interaction board. The first high-speed signal hole in the signal processing board is connected with the second high-speed signal hole in the signal interaction board through a high-speed signal line formed in the flexible circuit board, and the top layer and the bottom layer of the signal processing board and the signal interaction board are provided with a rigid top board and a rigid bottom board. Through the structure, the signal quality of high-speed signals in the network equipment can be improved.

Description

Technical Field

[0001] This specification relates to the field of electronic technologies, and particularly to a rigid-flex hybrid board, a network device, and a method for manufacturing a rigid-flex hybrid board. Background Art

[0002] With the development of network technologies, the demand for data operation and data transmission of network devices is getting higher and higher. The number of devices accommodated on the circuit boards of network devices is increasing, and it is gradually moving towards high-density deployment.

[0003] Due to the increase in the number of devices, multiple circuit boards are deployed in the network device, and electrical connections are formed between the circuit boards to lead out signal lines to signal connectors for data transmission with other network devices. In this process, the signal lines need to pass through a relatively long distance, and additional cables or connectors are required for electrical connections between the circuit boards to achieve cross-board transmission. When transmitting high-speed signals, the excessive transmission distance and additional cables and connectors will cause signal attenuation and reduce the reliability of high-speed signal transmission in the network device. Summary of the Invention

[0004] To overcome the problems existing in the related technologies, this specification provides a rigid-flex hybrid board, a network device, and a method for manufacturing a rigid-flex hybrid board.

[0005] According to the first aspect of the embodiments of this specification, a rigid-flex hybrid board is provided, including:

[0006] A signal processing board;

[0007] At least two signal interaction boards, with the signal processing board located between the at least two signal interaction boards;

[0008] Wherein, at least two layers of rigid circuit boards and at least one layer of flexible circuit board in the signal processing board and the signal interaction boards are alternately stacked. There is a gap between the rigid circuit boards in the signal processing board and the rigid circuit boards in the signal interaction boards. The first high-speed signal holes on the signal processing board are connected to the second high-speed signal holes on the signal interaction boards through high-speed signal lines formed in the flexible circuit board. Rigid top plates and rigid bottom plates are provided on the top and bottom layers of the signal processing board and the signal interaction boards.

[0009] Optionally, a processor area is provided on the signal processing board, and the first high-speed signal holes are formed in the processor area;

[0010] An interface connector area is provided on the signal interaction board, and the second high-speed signal holes are formed in the interface connector area.

[0011] Optionally, a first power module area is further provided on the signal processing board, and the first power module area is disposed on the periphery of the processor area and at a position where the high-speed signal lines are not formed;

[0012] A second power module area is further provided on the signal interaction board, and the second power module area is disposed on the side of the signal interaction board close to the signal processing board.

[0013] Optionally, the first high-speed signal hole includes at least two vias and a conversion line connecting the two vias, and each of the at least two vias is non-coaxially arranged; and / or,

[0014] The second high-speed signal hole includes at least two vias and a conversion line connecting the two vias, and each of the at least two vias is non-coaxially arranged.

[0015] According to a second aspect of the embodiments of the present specification, a network device is provided, including:

[0016] A box body;

[0017] A front panel;

[0018] A circuit board module, which includes the rigid-flexible hybrid board described in any one of the above, in the gap between the signal processing board and the signal interaction board in the rigid-flexible hybrid board, the flexible circuit board is bent, and the interface connector provided on the signal interaction board is disposed toward the front panel side.

[0019] Optionally, a first power receiving area is provided on the signal processing board, and the first power receiving area is disposed on the edge of the signal processing board away from the signal interaction board, and the first power receiving area is connected to the first power module area on the signal processing board;

[0020] The circuit board module further includes:

[0021] A bus bar, which is connected to the first power receiving area.

[0022] Optionally, a second power receiving area is provided on the signal interaction board, and the second power receiving area and the first power receiving area are disposed on the same side;

[0023] The bus bar includes:

[0024] A first connection portion, which is connected to the first power receiving area;

[0025] A second connection portion, which is bent and connected to the first connection portion, and the second connection portion is connected to the second power receiving area.

[0026] Optionally, the signal processing board further includes a power supply transmission area, and the power supply transmission area is connected to the first power receiving area;

[0027] A second power receiving area is provided on the signal interaction board;

[0028] The circuit board module further includes:

[0029] An auxiliary bus bar, one end of the auxiliary bus bar is connected to the second power receiving area, and the other end is connected to the power supply transmission area.

[0030] Optionally, the interface connector is a double-layer connector, and the interface connector is disposed on one side opposite to each other between the signal interaction boards.

[0031] According to the third aspect of the embodiments of the present specification, a method for manufacturing a rigid-flex hybrid board is provided, including:

[0032] Manufacturing a rigid circuit board through a rigid core board, wherein a window area is formed on the rigid circuit board;

[0033] Manufacturing a flexible circuit board through a flexible core board, wherein high-speed signal lines are formed in the flexible circuit board, and cover films are formed on the top surface and the bottom surface of the flexible circuit board;

[0034] Stacking the manufactured flexible circuit board, the manufactured rigid circuit board, and a rigid top plate and a rigid bottom plate, filling gaskets in the window area, and pressing to form a first pressed board, wherein the rigid top plate and the rigid bottom plate are rigid core boards without window areas;

[0035] Making vias and outer layer patterns on the first pressed board to form a second pressed board;

[0036] Performing controlled-depth milling on the rigid top plate and the rigid bottom plate of the second pressed board to expose the gaskets near the rigid top plate and the rigid bottom plate, cutting the second pressed board to expose the side surfaces of the gaskets in the second pressed board, and removing the gaskets in the second pressed board to form a rigid-flex hybrid board.

[0037] Optionally, the manufacturing of the flexible circuit board through the flexible core board includes:

[0038] Forming via anti-pads on the copper-clad surfaces on one side of the first flexible core board and the second flexible core board;

[0039] Removing the copper-clad surface on the other side of the first flexible core board;

[0040] Forming high-speed signal lines on the copper-clad surface on the other side of the second flexible core board;

[0041] Apply the coating pressure-sensitive adhesive to press the first flexible core board and the second flexible core board, wherein the copper-clad surface formed with the via anti-pad is located on the outside;

[0042] Attach a cover film to the exposed area on the outside to form a flexible circuit board, wherein the cover film corresponds to the windowed area of the rigid circuit board.

[0043] The technical solutions provided by the embodiments of this specification may include the following beneficial effects:

[0044] In the embodiments of this specification, through the above-mentioned rigid-flex hybrid board, the high-speed signal holes of the signal processing board and at least two signal interaction boards are connected by the high-speed signal lines of the flexible circuit board pressed therein, so that the distance for the high-speed signal lines to reach the interface connector area becomes smaller. In the network device applying this rigid-flex hybrid board, the flexible circuit board can be bent based on this, so that the signal interaction board provided with the interface connector can be arranged towards the panel port, thereby avoiding signal attenuation during high-speed signal transmission and improving the reliability of high-speed signal transmission in the network device.

[0045] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The drawings here are incorporated into the specification and form a part of this specification, showing the embodiments conforming to this specification, and are used together with the specification to explain the principles of this specification.

[0047] Figure 1 is a schematic structural diagram of a rigid-flex hybrid board involved in the present application;

[0048] Figure 2 is a schematic cross-sectional diagram of a rigid-flex hybrid board involved in the present application;

[0049] Figure 3 is a schematic structural diagram of a circuit board module involved in the embodiment of the present application;

[0050] Figure 4 is a schematic structural diagram of a rigid-flex hybrid board involved in the embodiment of the present application;

[0051] Figure 5 is a schematic partial structural diagram of a rigid-flex hybrid board involved in the embodiment of the present application;

[0052] Figure 6 is a schematic structural diagram of a circuit board module involved in the embodiment of the present application;

[0053] Figure 7 is a schematic structural diagram of a circuit board module involved in another embodiment of the present application;

[0054] Figure 8 is a flowchart of a method for preparing a rigid-flex hybrid printed circuit board involved in the present application;

[0055] Figure 9 is a schematic structural diagram after the opening of the rigid circuit board in a method for preparing a rigid-flex hybrid printed circuit board involved in the present application;

[0056] Figure 10 is a schematic diagram of the preparation process of the flexible circuit board in a method for preparing a rigid-flex hybrid printed circuit board involved in the present application, wherein, Figure 10 (A) is a schematic diagram before the lamination of the flexible core board, Figure 10 (B) is a schematic diagram of the flexible circuit board formed after the lamination of the flexible core board;

[0057] Figure 11 is a schematic diagram of the preparation process of the rigid-flex hybrid printed circuit board in a method for preparing a rigid-flex hybrid printed circuit board involved in the present application, wherein, Figure 11 (A) is a schematic structural diagram of the first laminated board, Figure 11 (B) is a schematic structural diagram of the second laminated board, Figure 11 (C) is a schematic structural diagram of the prepared rigid-flex hybrid printed circuit board. Detailed Embodiments

[0058] Here, the exemplary embodiments will be described in detail, and the examples are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this specification. On the contrary, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0059] The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit this specification. The singular forms "a", "the", and "said" used in this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0060] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "when" or "while" or "in response to a determination".

[0061] This application provides a rigid-flex hybrid board 100, as Figure 1 , 2 shown, including:

[0062] A signal processing board 1, on which a processing chip may be provided;

[0063] At least two signal interaction boards 2, with the signal processing board 1 located between the at least two signal interaction boards 2;

[0064] Among them, at least two rigid circuit boards 30 and at least one flexible circuit board 31 in the signal processing board 1 and the signal interaction board 2 are alternately stacked. There is a gap 32 between the rigid circuit board in the signal processing board 1 and the rigid circuit board 30 in the signal interaction board 2. The first high-speed signal hole 33 on the signal processing board 1 is connected to the second high-speed signal hole 34 on the signal interaction board 2 through the high-speed signal line 35 formed in the flexible circuit board 31. Rigid top plates 40 and rigid bottom plates 41 are provided on the top and bottom layers of the signal processing board 1 and the signal interaction board 2. In addition, the high-speed signal line 35 is preferably arranged perpendicular to the bending line of the flexible circuit board 31 in the gap 32. This bending line refers to the position where the flexible circuit board 31 is bent. By the above method, it is possible to avoid the breakage of the internal high-speed signal line 35 when the flexible circuit board 31 is bent, thereby improving the reliability of the high-speed signal line.

[0065] When the signal processing board 1 and the signal interaction board 2 are alternately stacked through the rigid circuit board 30 and the flexible circuit board 31, it can be regarded as two rigid circuit boards 30 clamping one flexible circuit board 31. However, two flexible circuit boards 31 can be respectively corresponding above and below the same rigid circuit board 30. The number of the rigid circuit board 30 and the flexible circuit board 31 is set according to the actual transmission requirements of the high-speed signal, as Figure 2 shown, with 4 layers of flexible circuit boards 31 provided. It should be noted that the alternate stacking can be at positions close to the top and bottom surfaces of the rigid-flex hybrid board 100, and an intermediate board formed by pressing several rigid circuit boards 30 is provided in the middle, but the flexible circuit boards 31 will not be stacked. In Figure 2 , it is schematically shown by a white frame Figure 1One first high-speed signal hole 33 and one second high-speed signal hole 34 do not represent a limitation on the number of high-speed signal holes provided.

[0066] By disposing the signal processing board 1 between at least two signal interaction boards 2, the high-speed signal pins in the processing chip on the signal processing board 1 can extend to both sides respectively and be connected to the interface connectors on the signal interaction boards 2 to achieve external signal transmission. After the components are plugged into the rigid-flex hybrid board 100 to form the circuit board module 200, it can be bent based on the flexible circuit board 31 exposed in the gap between the signal processing board 1 and the signal interaction boards 2 to form a structure as shown in Figure 3 As shown. In this way, with the cooperation of mechanisms such as brackets for fixation, the signal interaction board 2 provided with the interface connector 22 can be configured to face the panel port of the network device, realizing the exposure of the interface connector 22 on one side of the panel port and subsequent plugging, etc. After the network device is started, the high-speed signals received by the interface connector 22 can be transmitted to the processing chip 201 of the signal processing board 1 through the bent flexible circuit board 31 to achieve high-speed signal processing.

[0067] It can be seen from the above description that since the signal processing board 1 is located between the two bent signal interaction boards 2, the distances from the processing chip to the signal interaction boards 2 on both sides are close and can be maintained within a small range. Compared with the case where an interface connector is provided on one side of a circuit board, the high-speed signal pins on the farther side of the processing chip need to bypass a longer distance to reach the interface connector for connection, or by means of connecting a buckle board through a buckle connector, the signal attenuation caused by the long-distance transmission of high-speed signals on the circuit board is reduced, thereby improving the reliability of high-speed signal transmission in the network device.

[0068] It should be noted that the number and positions of the high-speed signal holes, the number and positions of the high-speed signal lines, and the number and positions of the power module areas in the figure are only exemplary representations and are not limited.

[0069] Optionally, as shown in Figure 1 As shown, a processor area 10 is provided on the signal processing board 1, and the first high-speed signal hole 33 is formed within the processor area 10. The processor area 10 refers to the area where a processor is plugged in the circuit board module formed after plugging components into the rigid-flex hybrid board 100. Power supply holes, high-speed signal holes, low-speed signal holes, ground holes, etc. that can be used by the processor can be provided in this area;

[0070] An interface connector area 20 is provided on the signal interaction board 2, and the second high-speed signal holes 34 are formed in the interface connector area 20. The interface connector area 20 refers to the area in the circuit board module formed after plugging devices into the rigid-flex hybrid board 100 for plugging interface connectors and other IO devices. Power supply holes, high-speed signal holes, low-speed signal holes, ground holes, etc. that can be used by the interface connector can be provided in this area.

[0071] In the Figure 1 shown rigid-flex hybrid board 100, high-speed signals need to be transmitted between the processor and the interface connector. The processor is arranged in the processor area 10 of the signal processing board 1, and the interface connector is arranged in the interface connector area 20 of the signal interaction board 2. On the signal processing board 1, a first high-speed signal hole 33 is provided in the processor area 10, which extends to the flexible circuit board 31 of the signal processing board 1 through a via hole. On the signal interaction board 2, a second high-speed signal hole 34 is provided in the interface connector area 20, which extends to the flexible circuit board 31 of the signal interaction board 2 through a via hole. On the flexible circuit board 31, the via holes are connected through the deployed high-speed signal lines 35, so as to realize the connection between the first high-speed signal hole 33 and the second high-speed signal hole 34, so as to transmit the signals received by the interface connector to the processor for processing, and transmit the signals processed by the processor to the interface connector for external forwarding.

[0072] Optionally, as Figure 4 shown, a first power module area 11 is further provided on the signal processing board 1. The first power module area 11 is arranged on the periphery of the processor area 10 and at a position where the high-speed signal line 35 is not formed. The position where the high-speed signal line 35 is not formed refers to the position on the plane where the rigid-flex hybrid board 100 is arranged, and the projection of the high-speed signal line 35 does not overlap with the first power module area 11;

[0073] A second power module area 21 is further provided on the signal interaction board 2. The second power module area 21 is arranged on the side of the signal interaction board 2 close to the signal processing board 1.

[0074] The first power module area 11 and the second power module area 21 refer to the areas in the circuit board module formed after plugging devices into the rigid-flex hybrid board 100 for plugging power modules. Power supply holes, low-speed signal holes, ground holes, etc. can be provided in this area.

[0075] In Figure 4 , the dotted line on the signal processing board 1 can be regarded as the internal high-speed signal line 35, and its projection on the plane where the signal processing board 1 is located can be understood as avoiding the first power module area 11. Of course, in the signal processing board 1 and

[0076] On the signal processing board 1 and the signal interaction board 2, a power module needs to be set up to achieve voltage conversion of the power supply, and then the components on the signal processing board 1 and the signal interaction board 2 are powered through the internal power supply lines.

[0077] The power supply lines can be arranged on the rigid circuit board 30 in the signal processing board 1 and the signal interaction board 2. Correspondingly, via anti-pads need to be set on the flexible circuit board 31 to avoid the copper coating on the flexible circuit board 31.

[0078] It should be noted that in some cases, the power supply of the network device will first reach the signal processing board 1 and then be transmitted from the signal processing board 1 to the signal interaction board 2 through the internally laminated flexible circuit board 31 between the signal processing board 1 and the signal interaction board 2. At this time, the transmission of the power supply needs to pass from the edge of the signal processing board 1 through the edge of the flexible circuit board 31 to the edge of the signal interaction board 2. The high-speed signal transmission between the signal processing board 1 and the signal interaction board 2 can adopt the nearest-distance transmission method, that is, the high-speed signal lines 35 are concentrated in the middle position between the signal processing board 1 and the signal interaction board 2. Then, the edge positions of the flexible circuit board 31 in the signal processing board 1 and the signal interaction board 2 will be areas without deployed lines, and this part of the flexible circuit board 31 can be used to realize the power supply from the signal processing board 1 to the signal interaction board 2.

[0079] Optionally, as Figure 5 shown, the first high-speed signal hole 33 includes at least two vias 33A and a conversion line 33B connecting the two vias 33A, and each of the at least two vias 33A is non-coaxially arranged; and / or,

[0080] the second high-speed signal hole 34 includes at least two vias 34A and a conversion line 33B connecting the two vias 34A, and each of the at least two vias 33A is non-coaxially arranged.

[0081] Figure 5 is a partial structure in the rigid-flex hybrid circuit board 100 of the present application. Since in the processor, the positions of the high-speed signal pins can be concentrated in the center of the processor, and the high-speed signal pins are located in the near-surface layer, therefore, in the process of connecting the high-speed signals, it is necessary to go through the surface layer to the flexible circuit board 31 and from the center to the edge of the signal processing board 1. In addition, on the signal interaction board 2, high-speed signals need to be connected from one edge of the signal interaction board 2 to the other edge.

[0082] During the extension of the above high-speed signal, it needs to pass through multiple flexible circuit boards 31 and / or rigid circuit boards 30, and may interfere with other inner-layer circuits on the circuit board. To avoid the influence caused by the straight setting of vias, multiple vias can be set between the surface layer of the circuit board and the target flexible circuit board 31, and each via is connected through a conversion line set on this layer, so as to form non-coaxial and interconnected high-speed signal holes, avoiding interference problems during cross-layer.

[0083] Correspondingly, the present application also provides a network device 300, as Figure 6 shown, including:

[0084] A box body 5, with an opening 50 provided on the front side of the box body 5;

[0085] A front panel 6, which covers the opening 50, and interface holes are formed on the front panel 6;

[0086] A circuit board module 200, which includes the rigid-flex hybrid circuit board 100 described in any one of the above, in the gap 32 between the signal processing board 1 and the signal interaction board 2 in the rigid-flex hybrid circuit board 100, the flexible circuit board 31 is bent, and the interface connector 22 provided on the signal interaction board 2 is arranged towards the front panel 6 side.

[0087] Through the bending of the flexible circuit board 31 in the rigid-flex hybrid circuit board 100, the interface connectors 22 on the signal interaction boards 2 located on both sides of the signal processing board 1 can be arranged towards the front panel 6 side, and this layout form can be fixed by brackets or screws, etc.

[0088] In the network device 300, both signal interaction boards 2 can have a relatively short distance from the signal processing board 1, can have relatively low signal attenuation, and improve the transmission reliability of high-speed signals in the network device.

[0089] In the network device 300, the interface connector 22 can be set as a double-layer structure as Figure 6 shown, the interface connector 22 is arranged on the surface of the signal interaction boards 2 that are oppositely arranged after bending, so as to make the position of the signal interaction boards 2 closer to the top and bottom surfaces of the box body 5, facilitating the fixation of the signal interaction boards 2. In addition, the interface connector 22 can also be separately arranged, one is arranged on the top surface of one signal interaction board 2, and the other is arranged on the bottom surface of one signal interaction board 2, which can be set according to actual needs, and there is no limitation on this.

[0090] Optionally, as Figure 1 、 6As shown, a first power receiving area 12 is provided on the signal processing board 1. The first power receiving area 12 is disposed on one side edge of the signal processing board 1 away from the signal interaction board 2, and is connected to a first power supply module area 11 on the signal processing board 1;

[0091] The circuit board module 200 further includes:

[0092] A bus bar 203, which is connected to the first power receiving area 12.

[0093] In the network device 300, the signal processing board 1 and the signal interaction board 2 need to be powered through the bus bar 203.

[0094] In a possible implementation, as Figure 6 shown, a second power receiving area 23 is provided on the signal interaction board 2. The second power receiving area 23 and the first power receiving area 12 are disposed on the same side. This same side means that the first power receiving area 12 and the second power receiving area 23 are deployed on one side of the signal processing board 1 and the signal interaction board 2, and are arranged on this side so that the first power receiving area 12 and the second power receiving area 23 are in close proximity;

[0095] The bus bar 203 includes:

[0096] A first connection portion 203A, which is connected to the first power receiving area 12;

[0097] A second connection portion 203B, which is bent and connected to the first connection portion 203A, and the second connection portion 203B is connected to the second power receiving area 23.

[0098] The bus bar 203 can supply power to the signal processing board 1 and the signal interaction board 2 respectively. The bus bar 203 can be divided into two parts. The middle part of the bus bar 203 forms the first connection portion 203A for connecting the signal processing board 1 in the middle, and the two ends of the bus bar 203 are bent to form the second connection portion 203B for connecting the signal interaction boards 2 on both sides of the signal processing board 1.

[0099] In another possible implementation, as Figure 7 shown, the signal processing board 1 further includes a power supply transmission area 13, and the power supply transmission area 13 is connected to the first power receiving area 12, that is, the first power receiving area 12 is respectively connected to the power supply transmission area 13 and the first power supply module area 11;

[0100] A second power receiving area 23 is provided on the signal interaction board 2;

[0101] The circuit board module 200 further includes:

[0102] Auxiliary bus bar 204, one end of the auxiliary bus bar 204 is connected to the second power receiving area 23, and the other end is connected to the power supply transmission area 13. The power supply transmission area 13 is used to transmit the power received by the signal processing board 1 to the signal interaction board 2.

[0103] In this case, on the signal processing board 1, the power supply received by the first power receiving area 12 is respectively provided to the first power module area 11 and the power supply transmission area 13 through the internal circuit board. The power supply transmission area 13 is used to supply power to the signal interaction board 2, and the first power module area 11 is used to convert and supply power to the devices on the signal processing board 1. On the signal interaction board 2, a second power receiving area 23 is provided, and transmission is provided between the second power receiving area 23 and the power supply transmission area 13 through the auxiliary bus bar 204. The second power receiving area 23 is connected to the second power module area 21 for power supply conversion and to supply power to the devices on the signal interaction board 2.

[0104] Of course, it should be noted that when powering the circuit board module 200, it can also be achieved by setting a cable between the signal processing board 1 and the signal interaction board 2, which can be set according to actual needs and is not limited thereto.

[0105] Correspondingly, the present application also provides a preparation method for a rigid-flex hybrid board, as Figure 8 shown, including:

[0106] S100. Prepare a rigid circuit board through a rigid core board.

[0107] The rigid core board refers to a board including a rigid substrate and copper-clad layers on both sides. The circuit required for one or more layers of rigid core boards is made and stacked to form a rigid circuit board 30. Among them, as Figure 9 shown, when preparing the rigid circuit board 30 using a rigid core board, low-speed signal lines, power supply lines, conversion lines, and other lines need to be deployed. In addition, a window area 30A is formed on the rigid circuit board 30. The window area 30A can be understood as a slot on the rigid circuit board 30, and the window area 30A needs to avoid the above-mentioned various lines.

[0108] S101. Prepare a flexible circuit board through a flexible core board.

[0109] The flexible core board refers to a board formed by a flexible substrate and copper-clad layers on both sides. The circuit required for one or more layers of flexible core boards is made and laminated to form a flexible circuit board 31. Among them, high-speed signal lines 35 are formed in the flexible circuit board 31. Cover films 36 are formed on the top surface 31A and the bottom surface 31B of the flexible circuit board 31. The cover films 36 are flexible insulating materials. After via anti-pads 31C are etched on the top surface 31A and the bottom surface 31B of the flexible circuit board 31, the cover films 36 cover the non-via anti-pad 31C areas of the flexible circuit board 31.

[0110] Specifically, in step S101, a flexible circuit board is prepared from a flexible core board, including:

[0111] S101A. Form via anti-pads on the copper-clad surfaces on one side of the first flexible core board and the second flexible core board.

[0112] S101B. Remove the copper-clad surface on the other side of the first flexible core board.

[0113] S101C. Form high-speed signal lines on the copper-clad surface on the other side of the second flexible core board.

[0114] As Figure 10 (A) shows, when preparing a flexible circuit board 31, it can be formed by two flexible core boards 37. On the first flexible core board 37A and the second flexible core board 37B, via anti-pads 31C are etched on the upper surface of the first flexible core board 37A and the lower surface of the second flexible core board 37B. The copper-clad surface on the lower surface of the first flexible core board 37A is removed, and high-speed signal lines 35 are etched on the upper surface of the second flexible core board 37B.

[0115] S101D. Coat with a lamination adhesive and laminate the first flexible core board and the second flexible core board.

[0116] After the etching is completed, a lamination adhesive is coated between the first flexible core board 37A and the second flexible core board 37B and laminated to form the structure as shown in Figure 10 (B).

[0117] Among them, the copper-clad surface formed with via anti-pads 37C is located on the outside, that is, on the upper surface and the lower surface of the board formed after lamination.

[0118] S101E. Attach a cover film to the exposed area on the outside to form a flexible circuit board.

[0119] Among them, the cover film 36 corresponds to the opening area 30A of the rigid circuit board 30, so that the subsequent cover film 36 forms the area of the flexible circuit board 31 exposed in the gap 32 between the signal processing board 1 and the signal interaction board 2.

[0120] S102. Stack the prepared flexible circuit board, the prepared rigid circuit board, and the rigid top plate and the rigid bottom plate, fill gaskets in the opening area, and laminate to form a first laminated plate.

[0121] As Figure 11As shown in (A), after the flexible circuit board 31 and the rigid circuit board 30 are prepared, the prepared rigid circuit boards 30 and flexible circuit boards 31 are alternately stacked. In this process, spacers 71 are filled in the window areas 30A, and a rigid top plate 40 and a rigid bottom plate 41 are laminated on the top layer to form a first laminated plate 70. The lamination between the plates can use a prepreg of an insulating material. The spacer 71 will not be adhered by the prepreg such as epoxy resin. For example, the spacer 71 can be made of materials such as PTFE (Polytetrafluoroethylene).

[0122] Among them, the rigid top plate 40 and the rigid bottom plate 41 are rigid core plates without window areas 30A provided.

[0123] S103. Make vias and outer layer patterns on the first laminated plate to form a second laminated plate.

[0124] After the first laminated plate 70 is prepared, the required vias can be prepared on the first laminated plate 70. The vias can include power supply vias, high-speed signal vias, low-speed signal vias, and ground vias, etc. Outer layer patterns also need to be prepared on the upper surface and the lower surface of the first laminated plate 70, and processes such as back drilling are carried out, which can be set according to the actual requirements of the rigid-flex hybrid circuit board 100 without limitation, so as to form a second laminated plate 72.

[0125] S104. Perform controlled-depth milling on the rigid top plate and the rigid bottom plate of the second laminated plate to expose the spacers near the rigid top plate and the rigid bottom plate, cut the second laminated plate to expose the side surfaces of the spacers in the second laminated plate, and remove the spacers in the second laminated plate to form a rigid-flex hybrid circuit board.

[0126] As Figure 11 shown in (B), controlled-depth milling is performed on the second laminated plate 72 to expose the spacers 71 near the rigid top plate 40 and the rigid bottom plate 41, and the second laminated plate 72 is cut to expose the side surfaces of the spacers 71 inside the second laminated plate 72.

[0127] At this time, the exposed spacers 71 can be pushed out from the side to expose the cover film 36 formed on the flexible circuit board 31, so as to form the required rigid-flex hybrid circuit board 100, as Figure 11 shown in (C).

[0128] It should be noted that Figure 11 (A) and Figure 11 (B) show cross-sections in order to display the spacers 71 inside the first laminated plate 70 and the second laminated plate 72, which does not mean that the spacers 71 are exposed before cutting.

[0129] The rigid-flex hybrid board 100 formed through the above process removes a part of the rigid circuit board 30 at the position filled with the gasket 71, and a part of the flexible circuit board 31 is exposed, so that in the formed rigid-flex hybrid board 100, the signal interaction boards 2 located on both sides and the signal processing board 1 located between the signal interaction boards 2 are divided and formed according to the exposed flexible circuit board 31.

[0130] After the devices are plugged into the signal processing board 1 and the signal interaction boards 2, the process edge is removed. The gap 32 between the signal processing board 1 and the signal interaction boards 2 can be bent based on the flexibility of the flexible circuit board 31 to form the circuit board module 200 in the network device 300 as shown in Figure 5 Figure.

[0131] The technical solutions provided by the embodiments of this specification may include the following beneficial effects:

[0132] In the embodiments of this specification, through the above rigid-flex hybrid board, the high-speed signal holes of the high-speed signal lines between the signal processing board and at least two signal interaction boards are connected by the high-speed signal lines of the flexible circuit board laminated therein, so that the distance for the high-speed signal lines to reach the interface connector area becomes smaller. In the network device applying this rigid-flex hybrid board, the flexible circuit board can be bent so that the signal interaction board provided with the interface connector can be arranged towards the panel port, thereby avoiding signal attenuation during high-speed signal transmission and improving the reliability of high-speed signal transmission in the network device.

[0133] The above describes specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments and still achieve the desired results. Additionally, the processes depicted in the figures do not necessarily require the particular order or sequential order shown to achieve the desired result. In certain implementations, multitasking and parallel processing are also possible or may be advantageous.

[0134] Those skilled in the art will readily conceive of other implementations of this specification after considering the specification and practicing the invention herein. This specification is intended to cover any variations, uses, or adaptations of this specification, which follow the general principles of this specification and include known common knowledge or conventional technical means in the technical field not claimed in this application. The specification and embodiments are only to be considered exemplary, and the true scope and spirit of this specification are pointed out by the following claims.

[0135] It should be understood that this specification is not limited to the exact structures described above and shown in the figures, and various modifications and changes can be made without departing from its scope. The scope of this specification is only limited by the appended claims.

[0136] The above are only the preferred embodiments of this specification and are not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification shall be included within the scope of protection of this specification.

Claims

1. A rigid-flexible hybrid board, characterized in that: include: Signal processing board; At least two signal interaction boards, the signal processing board is located between the at least two signal interaction boards; Among them, at least two layers of rigid circuit boards and at least one layer of flexible circuit boards in the signal processing board and the signal interaction board are alternately stacked, there is a gap between the rigid circuit boards in the signal processing board and the rigid circuit boards in the signal interaction board, the first high-speed signal hole on the signal processing board and the second high-speed signal hole on the signal interaction board are connected by a high-speed signal line formed in the flexible circuit board, and the top and bottom layers of the signal processing board and the signal interaction board are provided with a rigid top plate and a rigid bottom plate.

2. The rigid-flexible hybrid board according to claim 1, characterized in that: A processor area is provided on the signal processing board, and the first high-speed signal hole is formed in the processor area; An interface connector area is arranged on the signal interaction board, and the second high-speed signal hole is formed in the interface connector area.

3. The rigid-flexible hybrid board according to claim 2, characterized in that: A first power module area is also provided on the signal processing board, and the first power module area is provided at a position around the processor area and where the high-speed signal line is not formed; A second power module area is also arranged on the signal interaction board, and the second power module area is arranged on a side of the signal interaction board close to the signal processing board.

4. The rigid-flexible hybrid board according to claim 1, characterized in that: The first high-speed signal hole comprises at least two vias and a conversion line connecting the two vias, and each of the at least two vias is non-coaxially arranged; and / or, The second high-speed signal hole includes at least two vias and a conversion line connecting the two vias, and each of the at least two vias is non-coaxially arranged.

5. A network device, characterized in that: include: Box; Front panel; A circuit board module, wherein the circuit board module comprises the rigid-flexible hybrid board as described in any one of claims 1 to 4 above, wherein the flexible circuit board is bent in a gap between a signal processing board and a signal interaction board in the rigid-flexible hybrid board, and an interface connector on the signal interaction board is arranged toward one side of the front panel.

6. The network device according to claim 5, characterized in that: The signal processing board is provided with a first power receiving area, the first power receiving area is provided at an edge of one side of the signal processing board away from the signal interaction board, and the first power receiving area is connected to the first power module area on the signal processing board; The circuit board module further includes: A bus bar connected to the first power receiving area.

7. The network device according to claim 6, characterized in that: The signal interaction board is provided with a second power receiving area, and the second power receiving area and the first power receiving area are provided on the same side; The bus bar comprises: A first connecting portion connected to the first power receiving area; The second connection portion is bent and connected to the first connection portion, and the second connection portion is connected to the second power receiving area.

8. The network device according to claim 6, characterized in that: The signal processing board further includes a power supply transmission area, wherein the power supply transmission area is connected to the first power receiving area; The signal interaction board is provided with a second power receiving area; The circuit board module further includes: An auxiliary bus bar, one end of which is connected to the second power receiving area, and the other end of which is connected to the power supply transmission area.

9. The network device according to claim 6, characterized in that: The interface connector is a double-layer connector, and the interface connector is arranged on the opposite side between the signal interaction boards.

10. A method for preparing a rigid-flexible hybrid board, characterized in that: include: A rigid circuit board is prepared by using a rigid core board, wherein a window area is formed on the rigid circuit board; Prepare a flexible circuit board by using a flexible core board, wherein a high-speed signal line is formed in the flexible circuit board, and a cover film is formed on the top and bottom surfaces of the flexible circuit board; Stacking the prepared flexible circuit board, the prepared rigid circuit board, the rigid top plate and the rigid bottom plate, filling the gasket in the window opening area, and pressing together to form a first pressed plate, wherein the rigid top plate and the rigid bottom plate are rigid core plates without window opening areas; Making vias and outer layer patterns on the first laminated board to form a second laminated board; The rigid top plate and the rigid bottom plate of the second laminated plate are subjected to controlled depth milling to expose the gaskets close to the rigid top plate and the rigid bottom plate, the second laminated plate is cut to expose the side surfaces of the gaskets in the second laminated plate, and the gaskets in the second laminated plate are removed to form a rigid-flexible hybrid laminated plate.

11. The method according to claim 10, characterized in that The method of preparing a flexible circuit board by using a flexible core board comprises: Forming via anti-pads on the copper-clad surfaces on one side of the first flexible core board and the second flexible core board; removing the copper-clad surface on the other side of the first flexible core board; forming a high-speed signal line on the copper-clad surface on the other side of the second flexible core board; Applying a pressing adhesive to press the first flexible core board and the second flexible core board, wherein the copper-clad surface with the via anti-pad is located on the outside; A cover film is attached to the exposed area on the outside to form a flexible circuit board, wherein the cover film corresponds to the window area of ​​the rigid circuit board.

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