Electronic equipment, composite board and preparation method of composite board

Abstract

The embodiment of the invention discloses electronic equipment, a composite board and a preparation method thereof, and relates to the field of board structures. The conductive performance of the composite board is improved. According to the specific scheme, the composite board comprises a composite layer, a carbon fiber yarn layer, a conductive layer and a floor. The composite layer is provided with a groove structure; the carbon fiber yarn layer is embedded in the composite layer, and part of the carbon fiber yarn layer is located in the groove structure. The conductive layer and the composite layer are stacked, and the conductive layer covers at least part of the groove structure and is electrically connected with the carbon fiber yarn layer. One side of the conductive layer away from the composite layer is electrically connected with the floor. And the conductive layer is electrically conducted with the carbon fiber yarn layer. And the carbon fiber yarn layer embedded in the composite layer is electrically connected with the floor through the arrangement of the groove structure and the conductive layer. Therefore, charges in the whole carbon fiber yarn layer can flow to the floor through the conductive layer. And the whole carbon fiber yarn layer has an electromagnetic compatibility protection effect. When the composite board is applied to the electronic equipment, the electromagnetic compatibility protection performance of the electronic equipment can be improved.

Description

Technical Field

[0001] This application relates to the field of plate structures, and particularly to an electronic device, a composite plate and a preparation method thereof. Background Art

[0002] Electronic devices (such as mobile phones) require a large number of plates. For example, the back cover or middle frame of an electronic device is made of plates. Among them, the excellent performance of the plate will directly affect the performance of the electronic device. For example, the current plates all have the problem of poor electrical conductivity. Poor electrical conductivity will directly affect the application of the plate in the electronic device. Summary of the Invention

[0003] Embodiments of this application provide an electronic device, a composite plate and a preparation method thereof, aiming to improve the electrical conductivity of the composite plate.

[0004] To achieve the above object, this application adopts the following technical solutions.

[0005] In a first aspect, embodiments of this application provide a composite plate. The composite plate includes a composite layer, a first carbon fiber filament layer, a conductive layer and a floor. The composite layer is provided with a groove structure; the first carbon fiber filament layer is embedded in the composite layer, and a part of the first carbon fiber filament layer is located in the groove structure. The conductive layer is stacked with the composite layer, and the conductive layer covers at least part of the groove structure and is electrically connected to the first carbon fiber filament layer. The side of the conductive layer away from the composite layer is electrically connected to the floor. Thus, the conductive layer and the first carbon fiber filament layer are electrically connected. The groove structure and the conductive layer are arranged to electrically connect the first carbon fiber filament layer embedded in the composite layer and the floor. So that the charges in the entire first carbon fiber filament layer can flow to the floor through the conductive layer. In addition, the conductive layer covers at least part of the groove structure and is electrically connected to the first carbon fiber filament layer in the groove structure, so that the entire first carbon fiber filament layer has an electromagnetic compatibility protection function. In addition, the first carbon fiber filament layer has excellent support performance and extensibility. The composite plate can make full use of the excellent support performance and extensibility of the first carbon fiber filament layer to provide support performance for other components, and also make the composite plate take into account the electromagnetic compatibility protection function. When the composite plate is applied to an electronic device, the electromagnetic compatibility protection performance of the electronic device can be improved.

[0006] In combination with the first aspect, in some realizable ways, the composite plate further includes: a second carbon fiber filament layer, which is embedded in the composite layer and stacked with the first carbon fiber filament layer, and the arrangement directions of the second carbon fiber filament layer and the first carbon fiber filament layer are not parallel. Thus, charges can flow between the first carbon fiber filament layer and the second carbon fiber filament layer, the second carbon fiber filament layer can be electrically connected to the floor through the conductive layer, and the second carbon fiber filament layer and the first carbon fiber filament layer with non-parallel arrangement directions can increase the tensile strength of the composite plate in multiple directions.

[0007] In combination with the first aspect, in some implementable ways, the second carbon fiber filament layer is closer to the conductive layer than the first carbon fiber filament layer, and the groove structure penetrates the second carbon fiber filament layer.

[0008] In combination with the first aspect, in some implementable ways, the composite board further includes: a first glass fiber filament layer, buried in the composite layer and arranged in a stacked manner with the first carbon fiber filament layer, and the first glass fiber filament layer is farther from the conductive layer than the first carbon fiber filament layer. The first glass fiber filament layer can improve the tensile resistance of the composite board. In addition, the first carbon fiber filament layer with excellent electrical conductivity overcomes the problem of the first glass fiber filament layer with poor electrical conductivity, enabling the composite board to have electromagnetic compatibility protection performance.

[0009] In combination with the first aspect, in some implementable ways, the arrangement directions of the first glass fiber filament layer and the first carbon fiber filament layer are not parallel. Thus, the composite board has excellent ductility along the arrangement direction of the first glass fiber filament layer. The composite board also has excellent ductility along the arrangement direction of the first carbon fiber filament layer.

[0010] In combination with the first aspect, in some implementable ways, the composite board further includes: a second glass fiber filament layer, buried in the composite layer and arranged in a stacked manner with the first carbon fiber filament layer, and the second glass fiber filament layer is closer to the conductive layer than the first carbon fiber filament layer; the groove structure penetrates the second glass fiber filament layer. Thus, the connecting part of the conductive layer is electrically connected through the parts of the second glass fiber filament layer and the first carbon fiber filament layer. The conductive layer passing through the second glass fiber filament layer with poor electrical conductivity enables the first carbon fiber filament layer with electrical conductivity to have electromagnetic compatibility protection and anti-static effects, thereby enabling the support board to have electromagnetic compatibility protection performance and anti-static effects.

[0011] In combination with the first aspect, in some implementable ways, the arrangement directions of the second glass fiber filament layer and the first carbon fiber filament layer are not parallel; thus, the composite board has excellent ductility in the arrangement directions of the second glass fiber filament layer and the first carbon fiber filament layer.

[0012] In combination with the first aspect, in some realizable ways, the composite board further includes: a third carbon fiber filament layer, embedded in the composite layer, the third carbon fiber filament layer being stacked on a side of the second glass fiber filament layer away from the first carbon fiber filament layer, and the groove structure penetrating through the third carbon fiber filament layer. Thus, the setting of the third carbon fiber filament layer can increase the extensibility of the support board. Additionally, since the groove structure penetrates through the third carbon fiber filament layer, a part of the side wall of the groove structure is formed by the third carbon fiber filament layer. Also, because the conductive layer covers a part of the groove structure, the conductive layer will also penetrate through the third carbon fiber filament layer and be connected to the third carbon fiber filament layer. Therefore, the conductive layer electrically connects the first carbon fiber filament layer and the third carbon fiber filament layer. The presence of the second glass fiber filament layer with poor electrical conductivity does not affect the electromagnetic compatibility protection performance of the composite board.

[0013] In combination with the first aspect, in some realizable ways, the arrangement directions of the third carbon fiber filament layer and the second glass fiber filament layer are not parallel. Thus, the composite board has excellent extensibility in the arrangement directions of both the third carbon fiber filament layer and the second glass fiber filament layer.

[0014] In combination with the first aspect, in some realizable ways, the composite board further includes: a third glass fiber filament layer, embedded in the composite layer, the third glass fiber filament layer being arranged side by side with the first carbon fiber filament layer. Thus, the third glass fiber filament layer can extend the length of the composite layer.

[0015] In combination with the first aspect, in some realizable ways, the conductive layer is a coating or a plating layer.

[0016] In combination with the first aspect, in some realizable ways, the composite board further includes: a conductive thin film, the conductive thin film being connected to a side of the conductive layer away from the composite layer, and the floor being electrically connected to a side of the conductive thin film away from the conductive layer. Thus, the conductive thin film can increase the thickness of the conductive structure on the surface of the support board. Additionally, the conductive thin film and the conductive layer can be formed by different processes, providing multiple options for the preparation of the support board.

[0017] In a second aspect, an embodiment of the present application provides a composite board. The composite board includes a composite layer, a carbon fiber filament layer, a conductive layer, and a floor. The composite layer has a plurality of pores, and the plurality of pores communicate with each other. The carbon fiber filament layer is embedded in the composite layer, and a part of the carbon fiber filament layer is located in the pores. The conductive layer is stacked with the composite layer; the conductive layer includes a plurality of conductive continuous phase structures, the plurality of conductive continuous phase structures are connected, and a part of the conductive continuous phase structures are located in the pores and are electrically connected to the carbon fiber filament layer. A part of the conductive continuous phase structures are located outside the composite layer and are electrically connected to the floor. Thus, through the conductive continuous phase structures of the conductive layer extending into the pores, the charges on the carbon fiber filament layer are released to the floor outside the composite layer, avoiding the influence of the static electricity generated on the carbon fiber filament layer on other electronic devices (such as antennas).

[0018] In combination with the second aspect, in some implementable ways, the conductive layer is formed by physical vapor deposition process. The conductive continuous phase structure formed by the physical vapor deposition process can pass through the pores on the composite layer and be electrically connected to the carbon fiber filament layer, improving the electrical performance of the composite board.

[0019] In a third aspect, an embodiment of the present application provides an electronic device. The electronic device includes a printed circuit board and any one of the composite boards provided in the first aspect and the second aspect above. The floor is disposed on the printed circuit board. Because the aforementioned composite board has excellent electrical conductivity and electromagnetic compatibility protection performance. The housing including the composite board also has electromagnetic compatibility protection performance, ensuring the electrical performance of the electronic device.

[0020] In combination with the third aspect, in some implementable ways, the electronic device further includes: a middle frame, a display screen, and a rear shell; the display screen and the rear shell are both connected to the middle frame, and the middle frame and the printed circuit board are both located between the display screen and the rear shell; wherein, at least one of the middle frame, the display screen, and the rear shell includes the composite board.

[0021] In a fourth aspect, an embodiment of the present application provides a method for preparing a composite board. The method includes: forming a groove structure on the surface of the composite layer; a first carbon fiber filament layer is buried in the composite layer, and a part of the first carbon fiber filament layer is located in the groove structure. Coating or plating on the surface of the composite layer to form a conductive layer; wherein, the conductive layer is stacked with the composite layer, and the conductive layer covers at least a part of the groove structure and is electrically connected to the first carbon fiber filament layer. Electrically connect the side of the conductive layer away from the composite layer to the floor. Thus, the preparation method can accurately locate the position of the groove structure on the composite layer, and thus accurately obtain the connection position of the conductive layer and the first carbon fiber filament layer. The composite board obtained by this preparation method has the advantage of accurate positioning of the groove structure.

[0022] In combination with the fourth aspect, in some implementable ways, before forming the groove structure on the surface of the composite layer, it further includes: extending the first carbon fiber filament layer into the glue solution to form a prefabricated layer; curing the prefabricated layer to form the composite layer. The preparation method of the composite layer has a simple process.

[0023] In combination with the fourth aspect, in some implementable ways, dipping the first carbon fiber filament layer into the glue to form a prefabricated layer includes: dipping the first carbon fiber filament layer into the glue; dipping the first glass fiber filament layer into the glue to form the prefabricated layer; coating or plating on the surface of the composite layer to form a conductive layer includes: coating or plating on the surface of the composite layer to form a conductive layer so that the first glass fiber filament layer is farther away from the conductive layer than the first carbon fiber filament layer. Thus, the preparation method can embed the first glass fiber filament layer in the composite layer, and the setting of the first glass fiber filament layer does not affect the electrical connection between the conductive layer and the first carbon fiber filament layer.

[0024] In combination with the fourth aspect, in some implementable ways, dipping the first carbon fiber filament layer into the glue to form a prefabricated layer includes: dipping the first carbon fiber filament layer into the glue. Dipping the second glass fiber filament layer into the glue to form the prefabricated layer. Forming a groove structure on the surface of the composite layer includes: forming a groove structure on the surface of the composite layer so that the groove structure penetrates through the second glass fiber filament layer, and a part of the first carbon fiber filament layer is located in the groove structure. Thus, the preparation method can embed the second glass fiber filament layer in the composite layer, the groove structure penetrating through the second glass fiber filament layer, and the conductive layer covering at least part of the groove structure to conduct the first carbon fiber filament layer and the external circuit of the composite layer. Overcome the problem of poor electrical conductivity of the second glass fiber filament layer. Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of an electronic device.

[0026] Figure 2a It is a schematic structural diagram of the housing and printed circuit board of an electronic device.

[0027] Figure 2b It is a schematic structural diagram of a display screen and a printed circuit board.

[0028] Figure 3a It is a schematic structural diagram of a support plate provided by an embodiment of the present application.

[0029] Figure 3b It is Figure 3a A schematic exploded view of the support plate shown.

[0030] Figure 3c It is a schematic structural diagram of another support plate provided by an embodiment of the present application.

[0031] Figure 4 It is a schematic structural diagram of yet another support plate provided by an embodiment of the present application.

[0032] Figure 5a It is a schematic structural diagram of still another support plate provided by an embodiment of the present application.

[0033] Figure 5b is Figure 5a Schematic diagram of the decomposition structure of the conductive layer and the composite layer in

[0034] Figure 6 Schematic diagram of the structures of the composite layer and the conductive layer provided by an embodiment of the present application.

[0035] Figure 7 Schematic diagram of yet another support plate structure provided by an embodiment of the present application.

[0036] Figure 8 Schematic diagram of the structure in which the first carbon fiber filament layer and the third glass fiber filament layer are arranged side by side provided by an embodiment of the present application.

[0037] Figure 9 Schematic diagram of yet another structure of the support plate provided by an embodiment of the present application.

[0038] Figure 10a Schematic diagram of another structure of the conductive layer and the composite layer provided by an embodiment of the present application.

[0039] Figure 10b is Figure 10a Enlarged schematic diagram at D in

[0040] Figure 10c is Figure 10b Enlarged schematic diagram at E in

[0041] Figure 10d is Figure 10a SEM image of the support plate in

[0042] Figure 11a is including Figure 4 Process flow chart of a composite plate of the support plate in

[0043] Figure 11b is after executing Figure 11a Schematic diagram of the structure after s1 in

[0044] Figure 12a Process flow chart of the formation of a composite layer.

[0045] Figure 12b is executing Figure 12a Schematic diagram of the structure after s11 in

[0046] Figure 12c is executing Figure 12a Schematic diagram of the structure after s12 in

[0047] Figure 12d is executing Figure 12a Schematic diagram of the structure after s13 in

[0048] Figure 12e is after executingFigure 12a Schematic diagram of the structure after s13 in the middle

[0049] In the figure: 10 - electronic device; 11 - cover plate; 12 - display screen; 13 - printed circuit board; 14 - middle frame; 15 - rear shell; 16 - border; 20 - composite board; 101 - floor; 100 - support plate; 102 - auxiliary board; 103 - conductive part; 104 - gap; 110 - composite layer; 111 - groove structure; 112 - opening; 113 - bottom wall of the groove; 120 - conductive layer; 121 - connecting part; 122 - extending part; 130 - first carbon fiber filament layer; 131 - first carbon fiber filament; 140 - second carbon fiber filament layer; 141 - second carbon fiber filament; 150 - first glass fiber filament layer; 151 - first glass fiber filament; 160 - second glass fiber filament layer; 170 - third carbon fiber filament layer; 180 - fourth glass fiber filament layer; 202 - fifth glass fiber filament layer; 201 - third glass fiber filament layer; 203 - conductive film; 210 - conductive layer; 211 - conductive continuous phase structure; 115 - pore; 220 - carbon fiber filament layer; 221 - carbon fiber filament; 17 - adhesive; 18 - prefabricated layer; 001 - support member; 002 - back film; 003 - display panel. Detailed implementation manners

[0050] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0051] Hereinafter, terms such as "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0052] Secondly, in the embodiments of the present application, orientation terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and they may change accordingly with the change of the orientation of the components placed in the drawings.

[0053] In addition, in the embodiments of the present application, connection / being connected: may refer to a mechanical connection relationship or a physical connection relationship, that is, A is connected to B or A is connected with B may mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or A and B are in contact with each other and it is difficult to separate A and B.

[0054] Embodiments of the present application provide an electronic device, which can be a terminal device with an antenna and an electrical connector. The electronic device can be implemented in various forms, including but not limited to mobile phones, tablet computers, desktop computers, laptop computers, PDAs (Personal Digital Assistants), wearable devices, display devices (such as TVs), information display devices, or smart home terminals, etc. In the embodiments of the present application, the electronic device is exemplified by a mobile phone.

[0055] Figure 1 It is a schematic structural diagram of an electronic device 10. As Figure 1 shown, the electronic device 10 may include: a cover 11, a display 12, a printed circuit board (PCB) 13, a middle frame 14, and a rear case 15. In some embodiments, the rear case 15 is also referred to as a rear cover. The cover 11, the display 12, and the rear case 15 are stacked.

[0056] The cover 11 can be disposed closely against the display 12, and the cover 11 is used to protect the display 12 and prevent dust. The cover 11 can be a cover glass, or can be replaced with a cover of other materials, such as an ultra-thin glass material cover, a PET (polyethylene terephthalate) material cover, etc.

[0057] The display 12 may include a liquid crystal display (LCD) panel, a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., and the present application does not limit this. The types of the display 12 include but are not limited to water-drop screens, notch screens, full screens, or punch-hole screens.

[0058] The middle frame 14 has the function of supporting the whole machine. Figure 1 As shown in the figure, the printed circuit board 13 is disposed between the middle frame 14 and the rear case 15. It should be understood that in some embodiments, the printed circuit board 13 can also be disposed between the middle frame 14 and the display 12, and the embodiments of the present application do not limit this.

[0059] Exemplarily, the electronic device 10 may further include a battery (not shown in the figure). The battery can be disposed between the middle frame 14 and the rear case 15, or the battery can be disposed between the middle frame 14 and the display 12, and the present application does not limit this.

[0060] Exemplarily, the printed circuit board 13 carries electronic components, for example, radio frequency chips and the like. In some embodiments, components such as input buttons, transmitters, processors, memories, batteries, charging circuits, system on chip (SoC) structures, etc. can be mounted on the printed circuit board 13 or connected to the printed circuit board 13.

[0061] In some embodiments, the printed circuit board 13 is divided into a main board and a sub-board, and the battery can be disposed between the main board and the sub-board, wherein the main board can be disposed between the middle frame 14 and the upper edge of the battery, and the sub-board can be disposed between the middle frame 14 and the lower edge of the battery.

[0062] In some embodiments, the electronic device 10 may further include a frame 16, and the frame 16 may be formed of a conductive material such as metal. The frame 16 can be disposed between the display screen 12 and the rear case 15 and extend circumferentially around the periphery of the display screen 12. The frame 16 may have four side edges surrounding the display screen 12, and the four side edges help to fix the display screen 12.

[0063] Figure 1 Among them, the frame 16 and the middle frame 14 are connected as an integrally formed part, and the frame 16 and the middle frame 14 together play a supporting role for the entire electronic device 10. The rear case 15 and the cover plate 11 are respectively covered along opposite sides of the frame 16 to form the outer shell or housing of the electronic device. In other embodiments, the frame 16 and the middle frame 14 can be connected by means of elastic pieces, screws, welding, etc.

[0064] In some embodiments, the rear case 15, the cover plate 11, the frame 16, and the middle frame 14 can be collectively referred to as the outer shell or housing of the electronic device 10. It should be understood that the "outer shell or housing" can be used to refer to a part or all of any one of the rear case 15, the cover plate 11, the frame 16, and the middle frame 14, or refer to a part or all of any combination of the rear case 15, the cover plate 11, the frame 16, and the middle frame 14. In the embodiments of the present application, the rear case 15 is taken as an example of the outer shell of the electronic device 10 for description.

[0065] In some embodiments of the present application, the electronic device 10 further includes a floor 101. Herein, the floor 101 generally refers to at least a part of any ground layer, ground plane, or ground metal layer within the electronic device (such as a mobile phone), or at least a part of any arbitrary combination of the above-mentioned ground layer, ground plane, or ground component, etc. The floor 101 can be used for grounding components within the electronic device 10. Exemplarily, the floor 101 can include the ground layer of the printed circuit board 13, the ground metal layer formed by a metal film on the side of the display screen 12 facing the rear case 15, the conductive ground layer of the battery, and the conductive member or metal member electrically connected to the above-mentioned ground layer / ground plane / metal layer. The embodiments of the present application describe the floor 101 as the ground layer of the printed circuit board 13 as an example.

[0066] The electronic device 10 further includes a composite board 20. Herein, the composite board 20 can be disposed at multiple positions on the electronic device 10. For example, the composite board 20 can be disposed on at least one of the rear case 15, the display screen 12, and the middle frame 14. In other words, in some embodiments, the rear case 15 includes the composite board 20. In some embodiments, the display screen 12 includes the composite board 20. In some embodiments, the middle frame 14 includes the composite board 20. It can be understood that the rear case 15 including the composite board 20, the display screen 12 including the composite board 20, and the middle frame 14 including the composite board 20 do not conflict with each other. The composite board 20 can be selectively disposed one by one, two by two according to requirements, or all of them can be disposed.

[0067] Figure 2a It is a schematic structural diagram of the housing of an electronic device and the printed circuit board 13. Figure 2a The rear case 15 and the floor 101 are electrically connected. In other words, the rear case 15 is grounded to the floor 101. Therefore, charges (such as static electricity) on the rear case 15 can be discharged to the floor 101, avoiding the influence of static electricity on other structures (such as the display screen or antenna). In addition, when the user holds or touches the rear case 15 of the electronic device, the static electricity of the rear case 15 is discharged to the floor 101, which can avoid the static electricity being discharged to the user and affecting the user experience. In addition, the rear case 15 is grounded, enabling the rear case 15 to have an electromagnetic compatibility (EMC) protection function and improving the electrical performance of the electronic device. Alternatively, in some embodiments, part or the entire antenna of the electronic device can be integrated on the rear case 15, enabling the rear case 15 to also serve as an antenna.

[0068] Since the rear case 15 and the floor 101 are electrically connected, the part of the rear case 15 used for connecting to the floor 101 needs to have conductive performance. In some embodiments, the rear case 15 includes a connected support plate 100 and auxiliary plate 102. The support plate 100 has conductive performance. The support plate 100 is electrically connected to the floor 101.

[0069] The embodiments of the present application do not limit the electrical conductivity of the auxiliary plate 102. For example, the auxiliary plate 102 has electrical conductivity, or the auxiliary plate 102 may not have electrical conductivity. The embodiments of the present application do not limit the connection manner between the auxiliary plate 102 and the support plate 100. For example, the auxiliary plate 102 and the support plate 100 are bonded, welded, screwed or clamped, etc. In an embodiment where the auxiliary plate 102 has electrical conductivity, the support plate 100 and the auxiliary plate 102 may be integrally formed. In other words, the auxiliary plate 102 and the support plate 100 can be regarded as a plate structure.

[0070] In addition, the embodiments of the present application do not limit the relative positions of the auxiliary plate 102 and the support plate 100. For example, the auxiliary plate 102 may surround the support plate 100 on all sides. Or, the support plate 100 may surround the auxiliary plate 102 on all sides. Or, the auxiliary plate 102 is located on one side of the support plate 100. Or, the support plate 100 and the auxiliary plate 102 are stacked. In an example where the support plate 100 and the auxiliary plate 102 are stacked, the support plate 100 may be closer to the floor 101 relative to the auxiliary plate 102, or the support plate 100 may be farther from the floor 101 relative to the auxiliary plate 102.

[0071] The dimensions of the support plate 100 and the auxiliary plate 102 in the same direction may be the same or different. In an embodiment where the dimensions of the support plate 100 and the auxiliary plate 102 in the same direction are different, the dimension of the support plate 100 in this direction may be much larger than the dimension of the auxiliary plate 102 in this direction. Or, the dimension of the support plate 100 in this direction may be much smaller than the dimension of the auxiliary plate 102 in this direction.

[0072] The embodiments of the present application do not limit the shapes of the auxiliary plate 102 and the support plate 100 either, and can be adaptively adjusted according to the shape of the electronic device.

[0073] It can be understood that the rear shell 15 may further include structures other than the auxiliary plate 102 and the support plate 100. For example, the rear shell 15 may further include a decorative member, and the decorative member may be connected to the auxiliary plate 102 or the support plate 100. The embodiments of the present application do not limit this.

[0074] In the embodiments of the present application, the composite plate 20 includes the aforementioned support plate 100 and the floor 101. Exemplarily, the floor 101 may be integrated on the rear shell 15, or the floor 101 and the rear shell 15 are provided independently.

[0075] The embodiments of the present application do not limit the manner of electrically connecting the support plate 100 and the floor 101. In some embodiments, the support plate 100 and the floor 101 are in contact, so that electrical conduction between the support plate 100 and the floor 101 can be achieved. In other embodiments, such as Figure 2aAs shown, the composite board 20 further includes a conductive member 103 , and the support board 100 and the floor 101 are electrically connected via the conductive member 103 .

[0076] The embodiment of the present application does not limit the structure of the conductive member 103 . For example, the conductive member 103 may be a conductive sheet, a conductive adhesive layer, a conductive foam, a conductive spring, or a conductive bolt.

[0077] The embodiment of the present application does not limit the number of the conductive members 103. For example, the number of the conductive members 103 may be one, two, three, four or more. In the embodiment where the number of the conductive members 103 is multiple, the multiple conductive members 103 are arranged at intervals.

[0078] Figure 2a In the embodiment, there is a gap 104 between the support plate 100 and the floor 101. The embodiment of the present application does not limit the size and shape of the gap 104. In some embodiments, the gap 104 can be used to accommodate components of the electronic device, such as a camera. It is understood that in some embodiments, the gap 104 is not necessary and may not be provided, for example, the support plate 100 and the floor 101 are fitted together.

[0079] Figure 2a In the embodiment, the floor 101 is located on the side of the printed circuit board 13 facing the support plate 100. It is understandable that in other embodiments, the floor 101 may be located on the side of the printed circuit board 13 facing away from the support plate 100, and the embodiment of the present application does not limit this.

[0080] As mentioned above, the support plate 100 has a conductive property. The support plate 100 includes a composite layer 110 and a conductive layer 120, and the conductive layer 120 is connected to the composite layer 110. The conductive layer 120 has a conductive property, and a side of the conductive layer 120 away from the composite layer 110 is electrically connected to the floor 101. For example, the conductive layer 120 is electrically connected to an end of the conductive member 103 away from the floor 101.

[0081] Figure 2b FIG. 1 is a schematic diagram of the structure of the display screen 12 and the printed circuit board 13. Figure 2b The display screen 12 includes a supporting member 001, a back film 002 and a display panel 003, wherein the supporting member 001, the back film 002 and the display panel 003 are stacked in sequence. The supporting member 001 is used to support the back film 002 and the display panel 003. The display panel 003 is used to emit light, and the back film 002 is used to protect the display panel 003. Figure 2b In the embodiment, the support member 001 includes a composite plate 20. The structure of the composite plate 20 can be found in Figure 2aIn the description, the floor 101 in the composite board 20 is disposed on the printed circuit board 13, and the conductive layer 120 is disposed on the side of the composite layer 110 away from the display panel 003.

[0082] Figure 2b In this case, charges (such as static electricity) on the display panel 003 can be discharged to the floor 101 to avoid the influence of static electricity on the display panel 003. In addition, the composite board 20 is grounded, so that the support member 001 has an electromagnetic compatibility EMC protection function, improving the electrical performance of the electronic device.

[0083] In some embodiments, the display screen 12 may further include a polarizing plate and a transparent cover plate. The polarizing plate is located on the side of the display panel 003 away from the back film 002, and the transparent cover plate is located on the side of the polarizing plate away from the display panel 003.

[0084] In the embodiments of the present application, the display screen 12 can be a flexible screen or a non-flexible screen. In the embodiments where the electronic device is a folding device, the display screen 12 is a flexible screen. Thus, the support member 001 has a bendable property.

[0085] The same principle applies to the relationship between the foregoing composite board 20 and the rear case 15. In the embodiments of the present application, the entire support member 001 is the composite board 20. In some embodiments, the support member 001 may further include other members in addition to the composite board 20. For example, the support member 001 may further include a metal plate, and the metal plate is arranged side by side with the composite board 20, or the metal plate and the composite board 20 may be stacked. The embodiments of the present application do not limit this.

[0086] In the embodiments of the present application, the support plate 100 has various examples.

[0087] Figure 3a This is a schematic structural diagram of a support plate 100 provided by an embodiment of the present application. Please refer to Figure 3a , the support plate 100 further includes a first carbon fiber filament layer 130, and the first carbon fiber filament layer 130 is embedded in the composite layer 110. The conductive layer 120 and the composite layer 110 are stacked. In the embodiments of the present application, for the convenience of description, the direction in which the conductive layer 120 and the composite layer 110 are stacked is defined as the z direction, that is, the conductive layer 120 and the composite layer 110 are stacked along the z direction. Figure 3a In this case, the z direction is also the thickness direction of the composite layer 110.

[0088] Figure 3b For Figure 3a This is an exploded structural diagram of the support plate 100 shown. Please refer to Figure 3b , the composite layer 110 is provided with a groove structure 111. The first carbon fiber filament layer 130 is partially located in the groove structure 111. The conductive layer 120 covers at least part of the groove structure 111 and is electrically connected to the first carbon fiber filament layer 130.

[0089] In this way, the conductive layer 120 and the first carbon fiber filament layer 130 are electrically connected. The groove structure 111 and the conductive layer 120 are arranged such that the first carbon fiber filament layer 130 embedded in the composite layer 110 and the floor 101 (as Figure 2a shown) are electrically connected. This enables the charges within the entire first carbon fiber filament layer 130 to flow through the conductive layer 120 to the floor 101, avoiding the electrostatic influence on the electrical performance of other components by the first carbon fiber filament layer 130. Additionally, the conductive layer 120 covers at least a portion of the groove structure 111 and is electrically connected to the first carbon fiber filament layer 130 within the groove structure 111, and the first carbon fiber filament layer 130 and the floor 101 are electrically connected, enabling the entire first carbon fiber filament layer 130 to have an electromagnetic compatibility protection effect. Moreover, the first carbon fiber filament layer 130 has excellent support performance and extensibility. The embodiments of the present application can make full use of the excellent support performance and extensibility of the first carbon fiber filament layer 130 to provide support performance for other components (such as the display screen 12), and also enable the first carbon fiber filament layer 130 to take into account the protection effect of electromagnetic compatibility. This enables the rear shell 15 (as Figure 2a shown) to have multiple functions.

[0090] Exemplarily, the first carbon fiber filament layer 130 includes multiple arranged first carbon fiber filaments 131. The multiple arranged first carbon fiber filaments 131 are electrically connected. Figure 2a In, the arrangement direction of the first carbon fiber filament layer 130 is the a1 direction. That is, the arrangement direction of the multiple first carbon fiber filaments 131 is the a1 direction. There are partial regions where adjacent two first carbon fiber filaments 131 are in contact, and there may be gaps between some regions. In some examples, glue can be filled in the aforementioned gaps.

[0091] The aforementioned first carbon fiber filament layer 130 being embedded in the composite layer 110 means that: all the multiple arranged first carbon fiber filaments 131 are located within the composite layer 110. It can be understood that some regions of the first carbon fiber filaments 131 located at the edge of the composite layer 110 may be exposed on the surface of the composite layer 110.

[0092] The aforementioned first carbon fiber filament layer 130 being partially located within the groove structure 111 includes: a portion of the first carbon fiber filaments 131 in the first carbon fiber filament layer 130 have a part of the region located within the groove structure 111. The embodiments of the present application do not limit the size ratio of the portion of the first carbon fiber filament layer 130 located within the groove structure 111 and the portion of the first carbon fiber filament layer 130 not located within the groove structure 111. It can be set according to the shape and size of the groove structure 111.

[0093] The embodiments of the present application do not limit the shape of the first carbon fiber filament 131. The first carbon fiber filament 131 can be cylindrical, prismatic or irregular filamentous, etc. The embodiments of the present application also do not limit the extension path of the first carbon fiber filament 131. For example, the extension path of the first carbon fiber filament 131 can be a straight line or a curve.

[0094] In some embodiments, the diameter of the first carbon fiber filament 131 is 3 μm (micrometers) - 5 μm. For example, the diameter of the first carbon fiber filament 131 is 3 μm, 4 μm or 5 μm, etc. When the diameter of the first carbon fiber filament 131 is within the above range, the first carbon fiber filament layer 130 can have better ductility. In other embodiments, the diameter of the first carbon fiber filament 131 may not be within the above range, and the embodiments of the present application do not limit this.

[0095] Exemplarily, the maximum distance between two adjacent first carbon fiber filaments 131 is less than or equal to 50 μm. In this way, it is beneficial for charges to move between two adjacent first carbon fiber filaments 131. Static charges and the like are more likely to be transmitted within the first carbon fiber filament layer 130, increasing the electrical conductivity of the first carbon fiber filament layer 130. Exemplarily, the maximum distance between two adjacent first carbon fiber filaments 131 can be 4 μm, 5 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 25 μm, 30 μm, 34 μm, 38 μm, 42 μm or 50 μm, etc.

[0096] Exemplarily, the groove structure 111 has an opening 112 and a groove bottom wall 113. The opening 112 is provided on the surface of the composite layer 110. The opening 112 and the groove bottom wall 113 are oppositely arranged. The embodiments of the present application do not limit the shape of the opening 112. For example, the opening 112 can be square, circular, oval or irregular in shape. The embodiments of the present application also do not limit the shape of the groove bottom wall 113. For example, the groove bottom wall 113 can be square, circular, oval or irregular in shape. It can be understood that the shapes of the opening 112 and the groove bottom wall 113 can be the same or different. For example, if the opening 112 is square, the groove bottom wall 113 can be irregular in shape or stepped, etc.

[0097] The foregoing conductive layer 120 covering at least part of the groove structure 111 includes: the conductive layer 120 covering the entire groove structure 111. In other words, the entire groove bottom wall 113 of the groove structure 111 is covered by the conductive layer 120. Or, the conductive layer 120 covers part of the groove structure 111. In other words, part of the groove bottom wall 113 of the groove structure 111 is covered by the conductive layer 120 and part is not covered by the conductive layer 120.

[0098] Exemplarily, the conductive layer 120 includes a connection portion 121 and an extension portion 122. The connection portion 121 and the extension portion 122 are connected. For example, the connection portion 121 and the extension portion 122 are integrally formed. The extension portion 122 and the composite layer 110 are stacked in the z direction. The connection portion 121 covers at least a part of the groove structure 111 and is electrically connected to the first carbon fiber filament layer 130. It can be understood that the part of the conductive layer 120 that covers at least a part of the groove structure 111 is named the connection portion 121, and the remaining part is named the extension portion 122.

[0099] The embodiments of the present application do not limit the relative sizes of the conductive layer 120 and the composite layer 110. For example, the conductive layer 120 covers the entire surface of the composite layer 110 facing the conductive layer 120, or the conductive layer 120 covers a part of the surface of the composite layer 110 facing the conductive layer 120.

[0100] Figure 3b In an example, the surface K of the conductive layer 120 facing away from the composite layer 110 is not a flat surface. For example, the surface K of the conductive layer 120 facing away from the composite layer 110 is a concave surface. Alternatively, the surface K of the conductive layer 120 facing away from the composite layer 110 can be a convex surface, a wedge-shaped surface, or an irregular flat surface, etc. Figure 3c This is a schematic structural diagram of another support plate 100 provided by the embodiments of the present application. Figure 3c In [description], the surface K of the conductive layer 120 facing away from the composite layer 110 is a flat surface. Thus, Figure 3c In [description], the connection portion 121 of the conductive layer 120 fills the entire groove structure 111. The surface of the connection portion 121 facing away from the groove structure 111 and the surface of the extension portion 122 facing away from the composite layer 110 are coplanar, and the surface K of the conductive layer 120 facing away from the composite layer 110 is flatter.

[0101] Exemplarily, the material of the conductive layer 120 includes a conductive material, and the conductive material can be any one of the following materials: copper, aluminum, stainless steel, brass, and their alloys, or graphite powder, etc. Alternatively, the conductive material can be a cured conductive paste, and the aforementioned conductive paste includes, but is not limited to, silver paste or copper paste.

[0102] The embodiments of the present application do not limit the material of the composite layer 110. Exemplarily, the material of the composite layer 110 includes at least one of epoxy resin, polyurethane glue, acrylic glue, and silicone glue.

[0103] The embodiments of the present application do not limit the connection manner between the conductive layer 120 and the composite layer 110. For example, it can be bonded by a conductive adhesive. Alternatively, the conductive layer 120 can be formed on the surface of the composite layer 110 and in the groove structure 111 by means of coating, electroplating, electroless plating, or physical vapor deposition (PVD).

[0104] In some embodiments of the present application, the composite layer 110 may further embed a second carbon fiber filament layer. Figure 4 FIG. 2 is a schematic structural diagram of another support plate 100 provided by an embodiment of the present application. Figure 4 Different from Figure 3a is that: Figure 4 the support plate 100 in

[0105] Figure 4 may further include a second carbon fiber filament layer 140. In

[0106] , the second carbon fiber filament layer 140 and the first carbon fiber filament layer 130 are stacked. The second carbon fiber filament layer 140 is embedded in the composite layer 110. Relative to the second carbon fiber filament layer 140, the first carbon fiber filament layer 130 is closer to the conductive layer 120. In other words, the second carbon fiber filament layer 140, the first carbon fiber filament layer 130, and the conductive layer 120 are stacked in the z direction in sequence. The arrangement direction of the second carbon fiber filament layer 140 is the a2 direction. The a2 direction is not parallel to the a1 direction. Figure 2a

[0107] The second carbon fiber filament layer 140 and the first carbon fiber filament layer 130 are electrically connected. Also, because the connecting portion 121 of the conductive layer 120 is electrically connected to the first carbon fiber filament layer 130, the second carbon fiber filament layer 140 can be electrically connected to the floor 101 (such as

[0108] shown) through the conductive layer 120. The second carbon fiber filament layer 140 and the first carbon fiber filament layer 130 with non-parallel arrangement directions can increase the tensile strength of the support plate 100 in multiple directions. For example, the support plate 100 has excellent mechanical properties in both the a1 direction and the a2 direction.

[0109] It should be understood that in some examples, some of the second carbon fiber filaments 141 may be exposed on the surface of the composite layer 110 facing away from the conductive layer 120. For example, it is allowed that a part of the second carbon fiber filaments 141 in the second carbon fiber filament layer 140 away from the first carbon fiber filament layer 130 are exposed on the surface of the composite layer 110 facing away from the conductive layer 120. For the structure of the second carbon fiber filament layer 140, please refer to the description of the foregoing first carbon fiber filament layer 130, which will not be elaborated here.The a2 direction is not parallel to the a1 direction. Exemplarily, the angle between the a2 direction and the a1 direction is not 0°. In some embodiments, the angle between the a2 direction and the a1 direction is 70° - 100°, for example, the angle between the a2 direction and the a1 direction can be 70°, 75°, 80°, 85°, 88°, 89°, 90°, 92°, 97° or 100°, etc. The following description of non - parallel arrangement directions is the same as that of the non - parallel arrangement directions of the aforementioned first carbon fiber filament layer 130 and second carbon fiber filament layer 140, and will not be elaborated hereinafter.

[0110] The embodiments of the present application do not limit the dimensional relationship between the second carbon fiber filament layer 140 and the first carbon fiber filament layer 130 along the z - direction. For example, the dimensions of the second carbon fiber filament layer 140 and the first carbon fiber filament layer 130 along the z - direction can be equal, or the dimension of the second carbon fiber filament layer 140 along the z - direction can be much larger or much smaller than the dimension of the first carbon fiber filament layer 130 along the z - direction. Additionally, the dimensions, shapes, and other properties of the second carbon fiber filaments 141 and the first carbon fiber filaments 131 can be the same or different.

[0111] In some other embodiments, the aforementioned second carbon fiber filament layer 140 can be a first glass fiber filament layer 150. The first glass fiber filament layer 150 includes a plurality of first glass fiber filaments 151. The electrical conductivity of the first glass fiber filament layer 150 is poor, but the electrical conductivity of the first carbon fiber filament layer 130 can overcome the problem of poor electrical conductivity of the first glass fiber filament layer 150 to enable the support plate 100 to have electrical conductivity, so that the composite plate 20 including the support plate 100 (as Figure 2a shown) has EMC protection and anti - static effects. Additionally, the first glass fiber filament layer 150 has excellent support performance, which can improve the support performance of the support plate 100. Therefore, the support plate 100 including the first glass fiber filament layer 150 and the first carbon fiber filament layer 130 has excellent electrical conductivity and support performance.

[0112] The embodiments of the present application do not limit the extension path of the first glass fiber filaments 151. For example, the extension path of the first glass fiber filaments 151 can be a straight line or a curve. The embodiments of the present application also do not limit the dimension of the first glass fiber filament layer 150 along the z - direction, which can be set according to the dimensional requirements of the support plate 100 along the z - direction.

[0113] It can be understood that the arrangement direction of the first glass fiber filament layer 150 and the arrangement direction of the first carbon fiber filament layer 130 can be parallel. Or, the arrangement direction of the first glass fiber filament layer 150 and the arrangement direction of the first carbon fiber filament layer 130 can be non - parallel.

[0114] In some embodiments, more layers of structures can be buried in the composite layer 110 to increase the thickness or mechanical strength of the composite layer 110.

[0115] Figure 5a This is a schematic structural diagram of another support plate 100 provided by an embodiment of the present application. Figure 5a Compared with Figure 4 the difference is that Figure 5a in, the support plate 100 further includes a second glass fiber filament layer 160. The second glass fiber filament layer 160 and the first carbon fiber filament layer 130 are stacked along the z direction, and the second glass fiber filament layer 160 is embedded in the composite layer 110. The second glass fiber filament layer 160 is closer to the conductive layer 120 than the first carbon fiber filament layer 130. The arrangement direction of the second glass fiber filament layer 160 is the a3 direction. The groove structure 111 penetrates through the second glass fiber filament layer 160.

[0116] As described above, since a part of the first carbon fiber filament layer 130 is located in the groove structure 111, the connecting portion 121 of the conductive layer 120 covers a part of the groove structure 111 and is electrically connected to a part of the first carbon fiber filament layer 130. The groove structure 111 penetrates through the second glass fiber filament layer 160. Thus, the connecting portion 121 of the conductive layer 120 penetrates through the second glass fiber filament layer 160 and is electrically connected to a part of the first carbon fiber filament layer 130. The conductive layer 120 passes through the second glass fiber filament layer 160 with poor conductivity, enabling the first carbon fiber filament layer 130 with conductivity to have EMC protection and anti-static effects, so that the support plate 100 has EMC protection and anti-static effects.

[0117] In some embodiments, the a3 direction and the a1 direction are not parallel. Thus, the support plate 100 has good extensibility in both the a3 direction and the a1 direction. In other embodiments, the a3 direction and the a1 direction can be parallel.

[0118] Figure 5a In the example of

[0119] Figure 5b is Figure 5a a schematic exploded view of the conductive layer 120 and the composite layer 110 in. Figure 5bIn this case, the groove structure 111 penetrates through the second glass fiber filament layer 160. A part of the first carbon fiber filaments 131 in the first carbon fiber filament layer 130 is exposed within the groove structure 111. After the connecting portion 121 of the conductive layer 120 extends into the groove structure 111, it contacts the first carbon fiber filaments 131 exposed within the groove structure 111 to achieve electrical connection.

[0120] It can be understood that Figure 5a in the example of, the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150) is not necessary, Figure 5a and the support plate 100 in may also not be provided with the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150).

[0121] Figure 6 It is a schematic structural diagram of the composite layer 110 and the conductive layer 120 provided by the embodiment of the present application. Figure 6 Compared with Figure 5a the difference is that Figure 6 the support plate 100 in further includes a third carbon fiber filament layer 170. The third carbon fiber filament layer 170 is embedded within the composite layer 110, and the third carbon fiber filament layer 170 is stacked on the side of the second glass fiber filament layer 160 away from the first carbon fiber filament layer 130. In other words, the first carbon fiber filament layer 130, the second glass fiber filament layer 160, the third carbon fiber filament layer 170, and the conductive layer 120 are stacked in the z direction. The arrangement directions of the third carbon fiber filament layer 170 and the second glass fiber filament layer 160 are not parallel, and the groove structure 111 penetrates through the third carbon fiber filament layer 170 and the second glass fiber filament layer 160.

[0122] The arrangement directions of the third carbon fiber filament layer 170 and the second glass fiber filament layer 160 are not parallel. The setting of the third carbon fiber filament layer 170 can increase the extensibility of the support plate 100. Additionally, since the groove structure 111 penetrates through the third carbon fiber filament layer 170, a part of the side wall of the groove structure 111 is formed by the third carbon fiber filament layer 170. The connecting portion 121 of the conductive layer 120 covers a part of the groove structure 111, and the connecting portion 121 can also penetrate through the third carbon fiber filament layer 170 and be connected to the third carbon fiber filament layer 170. Therefore, the conductive layer 120 electrically connects the first carbon fiber filament layer 130 and the third carbon fiber filament layer 170. Both the first carbon fiber filament layer 130 and the third carbon fiber filament layer 170 of the support plate 100 have EMC protection effects. In this way, the presence of the second glass fiber filament layer 160 with poor electrical conductivity does not affect the EMC protection effect of the support plate 100.

[0123] Figure 6In [description], the arrangement direction of the third carbon fiber filament layer 170 is the a4 direction, and the a4 direction is not parallel to the arrangement direction a3 direction of the second glass fiber filament layer 160. In other embodiments, the a4 direction and the a3 direction may also be parallel. The embodiments of the present application do not limit the relationships between the a4 direction and the a1 direction, and the a4 direction and the a2 direction. Exemplarily, Figure 6 in [description], the a4 direction and the a1 direction are parallel, and the a4 direction and the a2 direction are perpendicular to each other.

[0124] There is no limitation on the size of the channel formed by the groove structure 111 penetrating the third carbon fiber filament layer 170 on the third carbon fiber filament layer 170 and the size of the channel formed by the groove structure 111 penetrating the second glass fiber filament layer 160 on the second glass fiber filament layer 160. Figure 6 In an example, the size of the channel formed by the groove structure 111 penetrating the third carbon fiber filament layer 170 on the third carbon fiber filament layer 170 is larger than the size of the channel formed by the groove structure 111 penetrating the second glass fiber filament layer 160 on the second glass fiber filament layer 160, so that the groove structure 111 is in a stepped shape. It can be understood that in other embodiments, the size of the channel formed by the groove structure 111 on the third carbon fiber filament layer 170 may be equal to the size of the channel formed by the groove structure 111 on the second glass fiber filament layer 160.

[0125] Figure 7 This is a schematic structural diagram of another support plate 100 provided by the embodiments of the present application. Figure 7 Compared with Figure 6 the difference is that Figure 7 the support plate 100 in [description] further includes a fourth glass fiber filament layer 180. The fourth glass fiber filament layer 180 is embedded in the composite layer 110, and the fourth glass fiber filament layer 180 is stacked on the side of the third carbon fiber filament layer 170 away from the second glass fiber filament layer 160. In other words, the first carbon fiber filament layer 130, the second glass fiber filament layer 160, the third carbon fiber filament layer 170, and the fourth glass fiber filament layer 180 are stacked along the z direction. The arrangement direction of the fourth glass fiber filament layer 180 is not parallel to the arrangement direction of the third carbon fiber filament layer 170, and the groove structure 111 penetrates the fourth glass fiber filament layer 180, the third carbon fiber filament layer 170, and the second glass fiber filament layer 160. The arrangement direction of the fourth glass fiber filament layer 180 is the a5 direction, and the a5 direction is not parallel to the arrangement direction a4 direction of the third carbon fiber filament layer 170. In other embodiments, the a4 direction and the a5 direction may also be parallel.

[0126] Similarly, the arrangement of the fourth glass fiber filament layer 180 can enhance the support strength of the support plate 100. Additionally, the connecting portion 121 of the conductive layer 120 penetrates through the fourth glass fiber filament layer 180, the third carbon fiber filament layer 170, and the second glass fiber filament layer 160 to be electrically connected to the first carbon fiber filament layer 130. This enables electrical conduction between the first carbon fiber filament layer 130 and the third carbon fiber filament layer 170 through the conductive layer 120, thereby endowing the support plate 100 with excellent electrical properties. For example, when the conductive layer 120 is electrically connected to the floor 101, the charge of the support plate 100 can be released to the floor 101, and meanwhile, the support plate 100 can also provide EMC protection.

[0127] Similarly to Figure 6 the example of, Figure 7 in, the groove structure 111 can be stepped, or, along the z - direction, the dimensions of each cross - section of the groove structure 111 can be the same. The embodiments of the present application do not limit this.

[0128] It can be understood that, similarly to Figure 3c the example of, Figure 4 , Figure 5a , Figure 6 and Figure 7 the surface K of the conductive layer 120 facing away from the composite layer 110 in the example of can be a plane.

[0129] In some embodiments of the present application, the carbon fiber filament layer can be spliced with the glass fiber filament layer. In other words, the carbon fiber filament layer and the glass fiber filament layer can be arranged side by side.

[0130] Figure 8 FIG. shows a schematic structural diagram of the first carbon fiber filament layer 130 and the third glass fiber filament layer 201 arranged side by side provided by the embodiments of the present application. Figure 8 Differing from Figure 7 is that, Figure 8 the support plate 100 in can further include a third glass fiber filament layer 201. The third glass fiber filament layer 201 is embedded in the composite layer 110, and the first carbon fiber filament layer 130 and the third glass fiber filament layer 201 are arranged side by side. Thus, the arrangement of the third glass fiber filament layer 201 can increase the length of the support plate 100.

[0131] Figure 8 In, the extension portion 122 of the conductive layer 120 can extend to the orthographic projection of the third glass fiber filament layer 201 on the surface of the composite layer 110. In other words, the extension portion 122 of the conductive layer 120 and the third glass fiber filament layer 201 are stacked along the z - direction. Thus, the conductive layer 120 can extend to one side of the third glass fiber filament layer 201 with poor electrical conductivity.

[0132] On the basis that the first carbon fiber filament layer 130 and the third glass fiber filament layer 201 are arranged side by side, the embodiments of the present application do not limit the positional relationship between the first carbon fiber filament layer 130 and the third glass fiber filament layer 201. In some embodiments, the first carbon fiber filament layer 130 is located on one side of the third glass fiber filament layer 201. In other embodiments, the first carbon fiber filament layer 130 surrounds the outer periphery of the third glass fiber filament layer 201. In still other embodiments, the third glass fiber filament layer 201 surrounds the outer periphery of the first carbon fiber filament layer 130.

[0133] The embodiments of the present application do not limit the dimensional relationship between the first carbon fiber filament layer 130 and the third glass fiber filament layer 201. In some embodiments, the dimensions of the first carbon fiber filament layer 130 and the third glass fiber filament layer 201 in the z direction are equal. In this way, the first carbon fiber filament layer 130 and the third glass fiber filament layer 201 arranged side by side are relatively flat.

[0134] The embodiments of the present application also do not limit the relationship between the arrangement directions of the first carbon fiber filament layer 130 and the third glass fiber filament layer 201. Exemplarily, the arrangement direction of the first carbon fiber filament layer 130 and the arrangement direction of the third glass fiber filament layer 201 are parallel, or the arrangement direction of the first carbon fiber filament layer 130 and the arrangement direction of the third glass fiber filament layer 201 are not parallel, for example, they can be perpendicular.

[0135] Similarly, Figure 8 In [the relevant context], the support plate 100 may further include a fifth glass fiber filament layer 202. The fifth glass fiber filament layer 202 is embedded in the composite layer 110, and the fifth glass fiber filament layer 202 and the third carbon fiber filament layer 170 are arranged side by side. In this way, the setting of the fifth glass fiber filament layer 202 can increase the length of the support plate 100.

[0136] For the relationship between the fifth glass fiber filament layer 202 and the third carbon fiber filament layer 170, please refer to the description of the first carbon fiber filament layer 130 and the third glass fiber filament layer 201 above. The embodiments of the present application do not limit this.

[0137] Similarly, in some embodiments, the second carbon fiber filament layer 140 may also splice a glass fiber filament layer. The second glass fiber filament layer 160 and the fourth glass fiber filament layer 180 may also splice a carbon fiber filament layer. Details are not described herein again.

[0138] In some embodiments, the support plate 100 may further be provided with other conductive structures, which are connected to the conductive layer 120, and the conductive structures can be adjusted accordingly according to size or position requirements to meet various requirements of the support plate 100.

[0139] It can be understood that, in some embodiments of the present application, the support plate 100 may further include a greater number of carbon fiber filament layers or a greater number of glass fiber filament layers. In the embodiments where the support plate 100 includes multiple carbon fiber filament layers, the electromagnetic shielding performance of the support plate 100 can be improved by adjusting the size of the groove structure 111 in the thickness direction of the support plate 100 so that the carbon fiber filament layer farthest from the conductive layer 120 in the multiple carbon fiber filament layers is electrically connected to the conductive layer 120.

[0140] Figure 9 Another structural schematic diagram of the support plate 100 provided by the embodiments of the present application. Figure 9 In [the figure], the support plate 100 may further include a conductive thin film 203. The conductive thin film 203 is connected to the side of the conductive layer 120 away from the composite layer 110, and the floor 101 (such as Figure 2a shown) is electrically connected to the side of the conductive thin film 203 away from the conductive layer 120. In this way, the conductive thin film 203 can increase the thickness of the conductive structure on the surface of the support plate 100. In addition, the conductive thin film 203 and the conductive layer 120 can be formed by different processes, providing multiple options for the preparation of the support plate 100. Exemplarily, the conductive thin film 203 and the conductive layer 120 can be connected by a conductive adhesive layer, a solder layer, etc.

[0141] The embodiments of the present application do not limit the formation method of the conductive thin film 203. For example, the conductive thin film 203 can be formed by forging or die pressing, etc. Or, the conductive thin film 203 can be formed by coating or plating, etc. In the embodiments where the formation method of the conductive thin film 203 is the same as that of the conductive layer 120, the conductive thin film 203 and the conductive layer 120 can be formed by a single process, that is, the conductive thin film 203 and the conductive layer 120 are connected as an integral molded part. Or, the conductive thin film 203 and the conductive layer 120 can be formed by two processes, and the embodiments of the present application do not limit this.

[0142] The embodiments of the present application also do not limit the relative positional relationship between the conductive thin film 203 and the conductive layer 120. For example, the conductive thin film 203 can cover the side of the connecting portion 121 away from the composite layer 110, or the conductive thin film 203 does not cover the side of the connecting portion 121 away from the composite layer 110. In some embodiments, the orthographic projection of the conductive thin film 203 on the surface of the composite layer 110 is located outside the orthographic projection of the conductive layer 120 on the surface of the composite layer 110. In this way, the conductive thin film 203 can increase the area of the conductive region on the surface of the support plate 100.

[0143] In some embodiments, the surface of the composite layer 110 has pores, and a part of the conductive layer 120 can pass through the pores on the surface of the composite layer 110 and be electrically connected to the carbon fiber layer.

[0144] Figure 10aAnother structural schematic diagram of the composite board 20 provided by the embodiment of the present application. Figure 10a In the figure, the composite board 20 includes a floor 101 and a support board 100. The support board 100 includes a composite layer 110, a carbon fiber filament layer 220, and a conductive layer 210. The carbon fiber filament layer 220 is embedded in the composite layer 110. One end of the conductive layer 210 away from the composite layer 110 is electrically connected to the floor 101. For example, the floor 101 and the conductive layer 210 are electrically connected through an electrical connector 103. The carbon fiber filament layer 220 includes multiple carbon fiber filaments 221, and the multiple carbon fiber filaments 221 are arranged side by side.

[0145] Figure 10b It is Figure 10a The enlarged schematic diagram at D in the figure. Please refer to Figure 10b , a part of the conductive layer 210 extends into the composite layer 110, a part of the conductive layer 210 is located outside the composite layer 110, and the part of the conductive layer 210 extending into the composite layer 110 is electrically connected to the carbon fiber filament layer 220. Exemplarily, the carbon fiber filaments 221 in the carbon fiber filament layer 220 have excellent electrical conductivity, and the electrical connection between the carbon fiber filament layer 220 and the conductive layer 210 enables static charges on the carbon fiber filaments 221 to be transferred to the floor 101 (as Figure 10a shown).

[0146] Figure 10c It is Figure 10b The enlarged schematic diagram at E in the figure. Please refer to Figure 10c , the composite layer 110 has multiple pores 115, and the multiple pores 115 communicate with each other. A part of the carbon fiber filament layer 220 is located in the pores 115. The conductive layer 210 includes multiple conductive continuous phase structures 211, the multiple conductive continuous phase structures 211 are connected, and a part of the conductive continuous phase structures 211 is located in the pores 115 and is electrically connected to the carbon fiber filament layer 220. A part of the conductive continuous phase structures 211 is located outside the composite layer 110 and is electrically connected to the floor 101 (as Figure 10a shown).

[0147] Among them, the above-mentioned conductive continuous phase structure includes but is not limited to: a structure in which metal atoms on the surface of metal particles diffuse to the interface of adjacent metal particles and fuse, so that two or more metal particles fuse into a whole. The embodiment of the present application does not limit the process for forming the aforementioned atomic diffusion and fusion. For example, it can be a PVD process.

[0148] Thus, through the conductive continuous phase structure 211 of the conductive layer 210 extending into the pores 115, the charges on the carbon fiber filament layer 220 are released to the floor 101 outside the composite layer 110 (as Figure 10a shown), avoiding the influence of static electricity generated on the carbon fiber filament layer 220 on other electronic devices (such as antennas). In addition, the aforementioned groove structure may not be provided in the composite layer 110, which can reduce the process flow.

[0149] In the embodiments of the present application, the sizes and shapes of the multiple pores 115 in the composite layer 110 are not limited and are set according to the material and formation process of the composite layer 110. For example, in an embodiment where the composite layer 110 includes epoxy resin, the epoxy resin has the aforementioned pores 115. It can be understood that the shapes and sizes of the respective pores 115 can be different. Similarly, the sizes and shapes of the respective conductive continuous phase structures 211 of the conductive layer 210 can also be different. The embodiments of the present application do not limit this.

[0150] Exemplarily, the carbon fiber filaments 221 of the carbon fiber filament layer 220 form the inner wall of the pore 115, and the conductive continuous phase structure 211 located within the pore 115 adheres to the carbon fiber filaments 221 within the pore 115, enabling electrical connection between the conductive continuous phase structure 211 and the carbon fiber filaments 221. Also, because the conductive continuous phase structure 211 located outside the composite layer 110 is electrically connected to the conductive continuous phase structure 211 located within the pore 115, the electrons on the carbon fiber filaments 221 can be transmitted to the outside of the composite layer 110 through the conductive continuous phase structure 211.

[0151] Exemplarily, for the structure of the carbon fiber filament layer 220, please refer to the description of the aforementioned first carbon fiber filament layer 130, and for the connection method between the conductive layer 210 and the floor 101, please refer to Figure 2a the description therein, which will not be elaborated here.

[0152] Figure 10d For Figure 10a the electron microscope image of the support plate in Figure 10d the conductive layer in the support plate in Figure 10d is formed by the PVD process. Figure 10d In

[0153] It can be understood that Figure 10a the composite board 20 of Figure 4 can also be provided with

[0154] In the embodiments of the present application, there are multiple processes for preparing the aforementioned composite board 20. In the embodiments of the present application, the formation process of the support plate 100 included in the composite board 20 is used for exemplary illustration. Figure 4 Please refer to

[0155] Figure 11a For Figure 4 a process flow chart of a composite board including the support plate 100 in Figure 11a Please refer to

[0156] S1. As shown in Figure 11b the figure, a groove structure 111 is formed on the surface of the composite layer 110.

[0157] Figure 11b It is a schematic structural diagram after S1 in Figure 11a is executed. Among them, a first carbon fiber filament layer 130 is embedded in the composite layer 110, and a part of the first carbon fiber filament layer 130 is located in the groove structure 111. In other words, during the formation of the groove structure 111, a part of the first carbon fiber filament layer 130 embedded in the composite layer 110 is exposed in the groove structure 111.

[0158] The embodiment of the present application does not limit the method for forming the groove structure 111. For example, processes such as laser engraving, computer numerical control (CNC) machining, grinding, and sandblasting are used to form the groove structure 111.

[0159] During the execution of S1, the formation of the groove structure 111 changes the shape of the composite layer 110 less. The composite layer 110 with a preset shape can be selected according to the usage scenario of the support plate 100 first, and then the groove structure 111 is formed. And the groove structure 111 can be formed on the surface of the composite layer 110 more accurately, which is convenient for positioning the groove structure 111.

[0160] Figure 11b In

[0161] the embodiment of the present application, there are various ways to form the composite layer 110. The following combines Figure 12a to exemplify a formation process of the composite layer 110. Figure 12a It is a flowchart of a formation process of the composite layer 110. Figure 12a In

[0162] S11. As shown in Figure 12b the figure, the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150) is inserted into the glue 17.

[0163] Among them, the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150) includes a plurality of second carbon fiber filaments 141 (or glass fiber filaments 151) arranged side by side. Exemplarily, the glue 17 is accommodated in a container (not shown in the figure). The embodiment of the present application does not limit the material of the glue 17. For example, the material of the glue 17 includes epoxy resin.

[0164] S12. As shown in Figure 12c , insert the first carbon fiber filament layer 130 into the adhesive solution 17 to form a prefabricated layer 18 as shown in Figure 12d .

[0165] Among them, the first carbon fiber filament layer 130 includes multiple first carbon fiber filaments 131, and the multiple first carbon fiber filaments 131 are arranged side by side. The arrangement direction of the first carbon fiber filament layer 130 is not parallel to the arrangement direction of the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150).

[0166] Figure 12d The prefabricated layer 18 in includes the adhesive solution 17 and the first carbon fiber filament layer 130. The first carbon fiber filament layer 130 is embedded in the adhesive solution 17. The prefabricated layer 18 may further include a second carbon fiber filament layer 140 (or a first glass fiber filament layer 150), and the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150) is embedded in the adhesive solution 17.

[0167] In some embodiments, the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150) is not necessary, and the foregoing S11 may not be performed.

[0168] S13. As shown in Figure 12d , cure the prefabricated layer 18 to form a composite layer 110 as shown in Figure 12e .

[0169] Figure 12e is a schematic structural diagram after performing S13 in Figure 12a . Figure 12e In , two layer structures are embedded in the composite layer 110, namely the first carbon fiber filament layer 130 and the second carbon fiber filament layer 140 (or the first glass fiber filament layer 150). It can be understood that in some embodiments, the composite layer 110 may further include more layer structures, such as a third carbon fiber filament layer, a fourth glass fiber filament layer, etc. The embodiment of the present application does not limit the method of curing the prefabricated layer 18. For example, the prefabricated layer 18 is cured by a molding method to obtain the composite layer 110.

[0170] Figure 12a The example shown in is only a forming process of the composite layer 110. It can be understood that in other embodiments, the composite layer 110 may be formed by other processes.

[0171] Please return to Figure 11a , after performing S1, it further includes:

[0172] S2. Form a conductive layer 120 on the surface of the composite layer 110 as shown in Figure 4 .

[0173] After performingFigure 11a The structure after s2 in Figure 4 is shown as follows. The conductive layer 120 and the composite layer 110 are stacked, and the conductive layer 120 covers at least part of the groove structure 111 and is electrically connected to the first carbon fiber filament layer 130. For the description of the remaining structures, please refer to Figure 4 .

[0174] The embodiments of the present application do not limit the manner of forming the conductive layer 120. In some embodiments, conductive paste is brushed, sprayed or pad-printed on the surface of the composite layer 110. After the conductive paste is cured, the conductive paste is electrically connected to the first carbon fiber filament layer 130 in the groove structure 111 to achieve good conduction. Exemplarily, the aforementioned conductive paste can be silver paste, copper paste or conductive paint, etc. In other embodiments, the conductive layer 120 can be formed on the surface of the composite layer 110 by plating process.

[0175] s3. Electrically connect the side of the conductive layer 120 away from the composite layer 110 to the floor 101.

[0176] After executing Figure 11a the structure after s3 in Figure 2a is shown as follows. In this way, the composite board 20 can be formed through s1, s2 and s3 in Figure 11a . The composite board 20 provided by the embodiments of the present application has good electrical conductivity. And the charge on the composite board 20 is electrically connected to the floor 101, so that the composite board 20 has an EMC protection function. In addition, the static electricity on the composite board 20 can be discharged to the floor 101.

[0177] It can be understood that the composite board 20 including the support board 100 in the aforementioned Figure 3a , Figure 5a , Figure 6 , Figure 7 or Figure 8 can also be formed by the process shown in Figure 11a , which will not be elaborated here.

[0178] Exemplarily, Figure 10a the preparation process of the support board 100 in Figure 11a can not execute s1 in Figure 10a , that is, the groove structure 111 can not be formed on the composite layer 110. For example, the conductive layer 120 is formed on the surface of the composite layer 110 by PVD process, and the support board 100 shown in Figure 11a can be obtained. For the description of the remaining processes, please refer to

[0179] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claimed rights.

Claims

1. A composite board, characterized in that, The composite board includes: A composite layer provided with a groove structure; A first carbon fiber filament layer embedded in the composite layer, with part of the first carbon fiber filament layer located within the groove structure; A conductive layer stacked with the composite layer, the conductive layer covering at least part of the groove structure and electrically connected to the first carbon fiber filament layer; and A floor electrically connected to the side of the conductive layer away from the composite layer.

2. The composite board according to claim 1, wherein The composite board further includes: A second carbon fiber filament layer embedded in the composite layer and stacked with the first carbon fiber filament layer, with the arrangement directions of the second carbon fiber filament layer and the first carbon fiber filament layer not being parallel.

3. The composite board according to claim 2, characterized in that, The second carbon fiber filament layer is closer to the conductive layer than the first carbon fiber filament layer, and the groove structure penetrates through the second carbon fiber filament layer.

4. The composite board according to any one of claims 1-3, characterized in that, The composite board further includes: A first glass fiber filament layer embedded in the composite layer and stacked with the first carbon fiber filament layer, with the first glass fiber filament layer being farther from the conductive layer than the first carbon fiber filament layer.

5. The composite board according to claims 1-4, characterized in that, The composite board further includes: A second glass fiber filament layer embedded in the composite layer and stacked with the first carbon fiber filament layer, with the second glass fiber filament layer being closer to the conductive layer than the first carbon fiber filament layer; the groove structure penetrates through the second glass fiber filament layer.

6. The composite board according to claim 5, characterized in that, The composite board further includes: A third carbon fiber filament layer embedded in the composite layer, with the third carbon fiber filament layer stacked on the side of the second glass fiber filament layer away from the first carbon fiber filament layer, and the groove structure penetrates through the third carbon fiber filament layer.

7. The composite board according to any one of claims 1-6, characterized in that, The composite board further includes: A third glass fiber filament layer embedded in the composite layer, with the third glass fiber filament layer arranged side by side with the first carbon fiber filament layer.

8. The composite board according to any one of claims 1-7, characterized in that, The conductive layer is a coating or a plating layer.

9. The composite board according to any one of claims 1-8, characterized in that, The composite board further includes: A conductive thin film connected to the side of the conductive layer away from the composite layer, and the floor is electrically connected to the side of the conductive thin film away from the conductive layer.

10. A composite board, characterized in that, The composite board includes: A composite layer having a plurality of pores, and the plurality of pores are connected; A carbon fiber filament layer embedded in the composite layer; A conductive layer stacked with the composite layer; the conductive layer includes a plurality of conductive continuous phase structures, the plurality of conductive continuous phase structures are connected, and part of the conductive continuous phase structures are located within the pores and electrically connected to the carbon fiber filament layer; and A floor electrically connected to part of the conductive continuous phase structures located outside the composite layer.

11. The composite board according to claim 10, wherein, The conductive layer is formed by a physical vapor deposition process.

12. An electronic device, characterized in that, The electronic device includes: A printed circuit board and the composite board according to any one of claims 1 - 11, and the floor is disposed on the printed circuit board.

13. The electronic device according to claim 12, characterized in that, The electronic device further includes: A middle frame, a display screen, and a rear shell; the display screen and the rear shell are both connected to the middle frame, and both the middle frame and the printed circuit board are located between the display screen and the rear shell; Wherein, at least one of the middle frame, the display screen, and the rear shell includes the composite board.

14. A method for preparing a composite board, characterized in that, Includes: Forming a groove structure on the surface of the composite layer; A first carbon fiber filament layer is embedded in the composite layer, and a part of the first carbon fiber filament layer is located in the groove structure; A conductive layer is coated or plated on the surface of the composite layer; wherein, the conductive layer is stacked with the composite layer, the conductive layer covers at least a part of the groove structure and is electrically connected to the first carbon fiber filament layer; One side of the conductive layer away from the composite layer is electrically connected to the floor.

15. The method for preparing a composite board according to claim 14, wherein, Before forming the groove structure on the surface of the composite layer, it further includes: Inserting the first carbon fiber filament layer into the glue to form a prefabricated layer; Curing the prefabricated layer to form the composite layer.

16. The method for preparing a composite board according to claim 15, wherein The step of inserting the first carbon fiber filament layer into the glue to form a prefabricated layer includes: Inserting the first carbon fiber filament layer into the glue; Inserting a first glass fiber filament layer into the glue to form the prefabricated layer; The step of coating or plating on the surface of the composite layer to form a conductive layer includes: Coating or plating on the surface of the composite layer to form a conductive layer so that the first glass fiber filament layer is farther away from the conductive layer than the first carbon fiber filament layer.

17. The method for preparing a composite board according to claim 15, wherein, The step of inserting the first carbon fiber filament layer into the glue to form a prefabricated layer includes: Inserting the first carbon fiber filament layer into the glue; Inserting a second glass fiber filament layer into the glue to form the prefabricated layer; The step of forming a groove structure on the surface of the composite layer includes: Forming a groove structure on the surface of the composite layer, making the groove structure penetrate the second glass fiber filament layer, and a part of the first carbon fiber filament layer is located in the groove structure.

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