Cabinet cooling method and device, electronic equipment and medium

Abstract

The invention discloses a cabinet cooling method and device, electronic equipment and a medium. The method comprises the steps that temperature data of multiple points in a space in a cabinet are collected; constructing a space temperature field based on the collected temperature data of the plurality of points in the space in the cabinet; constructing a heat source temperature state space model in an airflow balance state; constructing a forced convection heat dissipation temperature field based on a three-dimensional model of the cabinet, the space temperature field and the heat source temperature state space model; and determining the position of a local hot spot in the cabinet at least based on the forced convection heat dissipation temperature field, and arranging a guide plate in the cabinet according to the position of the local hot spot, so that cold air passes through the local hot spot and / or hot air is prevented from flowing back to the local hot spot. According to the invention, the heat dissipation performance of the cabinet is improved by analyzing the internal airflow organization of the cabinet and optimizing the air duct design.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal models, and in particular, to a cabinet cooling method, device, electronic device, and medium. Background Art

[0002] In hot weather, especially from June to August, the devices in existing peripheral cabinets often shut down due to high temperature. When the devices shut down, the user signal is interrupted, which not only reduces user satisfaction but also causes significant losses. When the device shutdown occurs, enterprises often send employees to the failure location to manually open the peripheral cabinet door and then restart it to make the cabinet devices return to normal. The reasons for this phenomenon are, on the one hand, that the heat radiation in the high-temperature environment causes heat to continuously accumulate in the enclosed cabinet, and on the other hand, part of the electrical energy is converted into heat when the device is running. Once the cumulative heat of the two makes the internal temperature of the cabinet exceed the critical temperature (the critical temperature inside the cabinet is 40°C), the device will malfunction.

[0003] Cabinet heat dissipation is crucial for ensuring the stable operation of data centers and communication base stations. At present, due to reasons such as solar radiation, heat transfer of equipment, and too small equipment spacing, there are problems of overall high internal environment temperature and local overheating and downtime in the cabinet. Currently, most theoretical research at the cabinet level focuses on controlling the air supply volume and air supply temperature of the air-cooling system, and relatively lacks the analysis of the internal air flow organization of the cabinet and the design of the cooling air duct. Summary of the Invention

[0004] The present invention provides a cabinet cooling method, device, electronic device, and medium to improve the heat dissipation performance of the cabinet by analyzing the internal air flow organization of the cabinet and optimizing the air duct design.

[0005] According to one aspect of the present invention, a cabinet cooling method is provided, including:

[0006] Collecting temperature data at multiple points in the space inside the cabinet;

[0007] Constructing a space temperature field based on the temperature data at multiple points in the space inside the cabinet, and the space temperature field is used to reflect the temperature distribution inside the cabinet;

[0008] Constructing a heat source temperature state space model in the air flow balance state, and the heat source temperature state space model characterizes the relationship between the temperature rise change of the cabinet server, the air supply volume and air supply temperature of the air-cooling system, and the bypass of cold air and the return of hot air inside the cabinet;

[0009] Constructing a forced convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the space temperature field, and the heat source temperature state space model; the forced convection heat dissipation temperature field is used to reflect the model of the temperature distribution and heat dissipation flow field distribution inside the cabinet after adding a heat dissipation device;

[0010] Determine the location of local hot spots in the cabinet based at least on the forced convection heat dissipation temperature field, and set a flow deflector in the cabinet according to the location of the local hot spots, so that cold air passes through the local hot spots and / or blocks the return of hot air to the local hot spots.

[0011] Optionally, collecting temperature data at multiple points in the space inside the cabinet includes:

[0012] Collecting temperature data at multiple points at equal intervals in the horizontal direction inside the cabinet, and collecting temperature data at multiple points at equal intervals in the vertical direction in the cabinet.

[0013] Optionally, constructing a spatial temperature field based on the temperature data of multiple points in the space inside the cabinet collected includes:

[0014] Construct the spatial temperature field by using the natural neighbor interpolation algorithm based on the temperature data of multiple points in the space inside the cabinet collected.

[0015] Optionally, constructing a heat source temperature state space model in the air flow balance state includes:

[0016] Construct a mass balance equation in the cabinet:

[0017] Q L = ∑Q S,i -Q C

[0018] Q OC,i = Q OC,i-1 + D i × Q C + B i × Q L - S i × Q L - Q S,i

[0019] In the formula, Q C refers to the total amount of cold air sent into the cabinet by the air cooling system; the supply cold air proportion coefficient D i represents the proportion of cold air allocated to the intake areas of each server in the cabinet; Q L refers to the total leakage air flow between the hot and cold channels of the cabinet, including the return flow of hot air in the exhaust area and the bypass flow of cold air in the intake area; the hot air return proportion coefficient B i and the cold air bypass proportion coefficient S i represent the proportion of hot air return and the proportion of cold air bypass in the leakage air flow in each server channel; Q S，i refers to the air flow entering the i-th server from the i-th intake area; Q OC,i The air flow flowing from the i-th intake area into the (i + 1)-th intake area;

[0020] The energy conservation equation for the server intake area is as follows:

[0021]

[0022] Where p a is the air density; c p,a is the specific heat capacity of air; V I is the volume of the server intake area; T I,i is the temperature of the intake area of server i; T O,i is the temperature of the exhaust area of server i; T C is the supply air temperature of the air-cooling system;

[0023] The energy conservation equation for the server exhaust area is as follows:

[0024]

[0025] Where X is the heat capacity of the server exhaust temperature, P S,i is the workload of server i;

[0026] The server is simplified to a black-box model, that is, the enthalpy difference between the inlet and outlet airflows of the server is equal to the heat generation of the server, expressed as:

[0027] Q = m a c p,a ΔT a = m equ c p,equ ΔT equ

[0028] Where Q is the heat generation of the server; m a is the air quality; is the temperature difference between the inlet and outlet areas of the server, m equ is the mass of the server; C p,equ is the specific heat capacity of the server, ΔT equ is the temperature rise of the server;

[0029] Based on the energy conservation equation of the server intake area, the energy conservation equation of the server exhaust area, and the simplified "black-box" model, the following state-space structure can be obtained:

[0030]

[0031]

[0032] Among them, the state vector is:

[0033] T(t) = [T I,1 T I,2 T I,3 T O,1 T O,2 TO,3 T

[0034] The input vector is:

[0035] u(t) = [Q C P S,1 P S,2 P S,3 T

[0036] The output vector is:

[0037] Y(t) = [ΔT equ1 ΔT equ2 ΔT equ3 T .

[0039] Optionally, a natural convection heat dissipation temperature field is constructed based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model, and the natural convection heat dissipation temperature field is used to reflect the model of the temperature distribution and the heat dissipation flow field distribution in the cabinet without adding a heat dissipation device.

[0040] Optionally, constructing the natural convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model includes:

[0041] Constructing a three-dimensional model of the cabinet based on the actual cabinet structure, including setting the three-dimensional structure of the cabinet and the material of the heat dissipation components;

[0042] Designing the heat source power of each heat source in the cabinet and the ambient temperature;

[0043] Constructing a natural convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model.

[0044] Optionally, determining the position of local hot spots in the cabinet based on at least the forced convection heat dissipation temperature field, and setting flow guiding plates in the cabinet according to the position of the local hot spots includes:

[0045] Determining the position of local hot spots, the distribution of hot air reflux, and the distribution of cold air bypass in the cabinet based on the forced convection heat dissipation temperature field;

[0046] Setting flow guiding plates on the hot air reflux air duct and the cold air bypass air duct according to the intake position, the exhaust position, the hot air reflux distribution, the cold air bypass distribution, and the position of the local hot spots in the cabinet.

[0047] According to another aspect of the present invention, a cabinet cooling device is provided, including:

[0048] ​​​A data acquisition unit for acquiring temperature data at multiple points in the space inside the cabinet;

[0049] A temperature field construction unit for constructing a spatial temperature field based on the temperature data at multiple points in the space inside the cabinet, and the spatial temperature field is used to reflect the temperature distribution inside the cabinet;

[0050] A spatial model construction unit for constructing a heat source temperature state space model under an air flow balance state, and the heat source temperature state space model characterizes the relationship between the temperature rise change of the cabinet server, the air supply volume of the air cooling system, the air supply temperature, and the cold air bypass and hot air return inside the cabinet;

[0051] A heat dissipation temperature field construction unit for constructing a forced convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model; the forced convection heat dissipation temperature field is used to reflect the model of the temperature distribution and the heat dissipation flow field distribution inside the cabinet after adding a heat dissipation device;

[0052] A deflector setting unit for determining at least the position of local hot spots inside the cabinet based on the forced convection heat dissipation temperature field, and setting deflectors inside the cabinet according to the positions of the local hot spots, so that cold air passes through the local hot spots and / or blocks the hot air from flowing back to the local hot spots.

[0053] According to another aspect of the present invention, there is provided an electronic device, and the electronic device includes:

[0054] At least one processor; and

[0055] A memory communicatively connected to the at least one processor; wherein,

[0056] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the cabinet cooling method according to any embodiment of the present invention.

[0057] According to another aspect of the present invention, there is provided a computer-readable storage medium, and the computer-readable storage medium stores computer instructions, and the computer instructions are used to implement the cabinet cooling method according to any embodiment of the present invention when executed by a processor.

[0058] The technical solution of the embodiment of the present invention constructs a spatial temperature field reflecting the temperature distribution in the cabinet by collecting temperature data at multiple points in the space inside the cabinet; constructs a state space model of the heat source temperature under the air flow balance state to determine the temperature rise change of the cabinet server, the air supply volume and the air supply temperature of the air cooling system, and the relationship with the cold air bypass and the hot air return in the cabinet; constructs a forced convection heat dissipation temperature field according to the three-dimensional model of the cabinet, the spatial temperature field and the state space model of the heat source temperature, and then determines the temperature distribution and the heat dissipation flow field distribution in the cabinet and the position of local hot spots in the cabinet, so as to analyze the installation position of the deflector, so that the cold air passes through the local hot spots and / or blocks the hot air from flowing back to the local hot spots, and finally improves the heat dissipation performance of the cabinet.

[0059] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings without creative efforts based on these drawings.

[0061] Figure 1 is a flowchart of a method for cooling equipment provided in Embodiment 1 of the present invention;

[0062] Figure 2 is a flowchart of a method for cooling equipment provided in Embodiment 2 of the present invention;

[0063] Figure 3 is a schematic diagram of the temperature acquisition of discrete points inside the cabinet in an embodiment of the present invention;

[0064] Figure 4 is a front view schematic diagram of the three-dimensional temperature field of the cabinet in an embodiment of the present invention;

[0065] Figure 5 is a rear view schematic diagram of the three-dimensional temperature field of the cabinet in an embodiment of the present invention;

[0066] Figure 6 is a schematic diagram of local overheating points in the environment inside the cabinet in an embodiment of the present invention;

[0067] Figure 7 is a schematic diagram of the airflow distribution of multi-region nodes in the cabinet in an embodiment of the present invention;

[0068] Figure 8Schematic diagram of the actual cabinet model in an embodiment of the present invention;

[0069] Figure 9 Schematic diagram of the temperature convergence residual curve and the heat source center temperature monitoring in an embodiment of the present invention;

[0070] Figure 10 Schematic diagram of the natural convection heat dissipation temperature field of the cabinet in an embodiment of the present invention;

[0071] Figure 11 Schematic diagram of the Z-axis cross-sectional velocity field of the natural convection heat dissipation of the cabinet in an embodiment of the present invention;

[0072] Figure 12 Schematic diagram of the natural convection heat dissipation flow field of the cabinet in an embodiment of the present invention;

[0073] Figure 13 Schematic diagram of the temperature field of the cabinet shell in an embodiment of the present invention;

[0074] Figure 14 Schematic diagram of the perspective temperature field of the cabinet shell in an embodiment of the present invention;

[0075] Figure 15 Schematic diagram of the forced convection heat dissipation temperature field of the cabinet in an embodiment of the present invention;

[0076] Figure 16 Schematic diagram of the Z-axis cross-sectional velocity field of the forced convection heat dissipation of the cabinet in an embodiment of the present invention;

[0077] Figure 17 Schematic diagram of the forced convection heat dissipation flow field of the cabinet in an embodiment of the present invention;

[0078] Figure 18 Schematic diagram of the front of the cabinet temperature field after adding a flow deflector in an embodiment of the present invention;

[0079] Figure 19 Schematic diagram of the back of the cabinet temperature field after adding a flow deflector in an embodiment of the present invention;

[0080] Figure 20 Flow chart of a device cooling device provided in Embodiment 3 of the present invention;

[0081] Figure 21 Structural schematic diagram of an electronic device for implementing a device cooling method according to an embodiment of the present invention. Detailed implementation manners

[0082] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0083] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0084] Embodiment 1

[0085] Figure 1 A flowchart of a method for cooling a device is provided for Embodiment 1 of the present invention. As Figure 1 shown, the method includes:

[0086] S101. Collect temperature data at multiple points in the space inside the cabinet.

[0087] Multiple methods can be used to collect temperature data at multiple points in the three-dimensional space inside the cabinet. For example, temperature sensors can be set at multiple spatial positions in the cabinet to collect temperatures, or a movable temperature collection device can be used to collect temperature data at each point in the cabinet.

[0088] S102. Construct a spatial temperature field based on the temperature data collected at multiple points in the space inside the cabinet, and the spatial temperature field is used to reflect the temperature distribution inside the cabinet.

[0089] According to the temperature data collected at multiple points in the space inside the cabinet, a spatial temperature field inside the cabinet can be constructed. For example, a spatial interpolation algorithm can be used to calculate the temperature value at any point in the space inside the cabinet, and then a spatial temperature field model inside the cabinet can be constructed.

[0090] S103. Construct a heat source temperature state space model under the air flow balance state. The heat source temperature state space model characterizes the relationship between the temperature rise change of the cabinet server, the air supply volume and the supply air temperature of the air cooling system, and the cold air bypass and hot air return in the cabinet.

[0091] A heat source temperature state space model under the air flow balance state in the cabinet can be constructed. The heat source temperature state space model is a mathematical model used to characterize the relationship between the temperature rise change of the cabinet server, the air supply volume and the supply air temperature of the air cooling system, and the cold air bypass and hot air return in the cabinet.

[0092] S104. Construct a forced convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model. The forced convection heat dissipation temperature field is a model used to reflect the temperature distribution and heat dissipation flow field distribution in the cabinet after adding a heat dissipation device.

[0093] It should be noted that the three-dimensional model of the cabinet can be obtained by performing three-dimensional modeling on the cabinet according to the actual three-dimensional structure of the cabinet. The three-dimensional model includes parameters such as the power of each heat source in the cabinet and the heat dissipation material. After the three-dimensional model is constructed, the forced convection heat dissipation temperature field can be constructed based on the already constructed cabinet spatial temperature field and heat source temperature state space model. Among them, the forced convection heat dissipation temperature field is a model used to reflect the temperature distribution and heat dissipation flow field distribution in the cabinet after adding a heat dissipation device.

[0094] S105. Determine the position of local hot spots in the cabinet at least based on the forced convection heat dissipation temperature field, and set a flow guide plate in the cabinet according to the position of the local hot spots, so that the cold air passes through the local hot spots and / or blocks the hot air from flowing back to the local hot spots.

[0095] According to the positions of the air inlet, air outlet, hot air return distribution, cold air bypass distribution, and local hot spots shown in the forced convection heat dissipation temperature field, the most suitable position for setting the flow guide plate can be analyzed to minimize the bypass amount of the cold air flowing in from the air inlet as much as possible and block the hot air flowing back from the air outlet position from flowing to the local hot spots, so as to fully dissipate the heat of the local hot spots.

[0096] The technical solution of the embodiment of the present invention is to collect the temperature data of multiple points in the space inside the cabinet to construct a spatial temperature field reflecting the temperature distribution inside the cabinet; to construct a heat source temperature state space model under the air flow balance state to determine the temperature rise change of the cabinet server, the air supply volume and the air supply temperature of the air-cooling system, and the relationship with the cold air bypass and the hot air return inside the cabinet; to construct a forced convection heat dissipation temperature field according to the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model, and then determine the temperature distribution and the heat dissipation flow field distribution inside the cabinet and the position of the local hot spots inside the cabinet, so as to analyze the installation position of the baffle plate, so that the cold air passes through the local hot spots and / or blocks the hot air from flowing back to the local hot spots, and finally improve the heat dissipation performance of the cabinet.

[0097] Embodiment 2

[0098] Figure 2 A cabinet cooling method provided by the second embodiment of the present invention, as Figure 2 shown, the method includes:

[0099] S201. Collect the temperature data of multiple points at equal intervals in the horizontal direction inside the cabinet, and collect the temperature data of multiple points at equal intervals in the vertical direction inside the cabinet.

[0100] It should be noted that in this embodiment, a mobile temperature acquisition device can be designed. For example, the mobile temperature acquisition device can be set on one side of the cabinet. The mobile temperature acquisition device includes a controller, a plurality of lifting slide rails arranged on the base, a plurality of motors, and a temperature collector arranged on the lifting slide rail. The temperature collector includes a controllable telescopic rod. The controller can control the motors to work so that the temperature collector moves on the lifting slide rail, and then collect the temperature of each measurement point in the space inside the cabinet. After collecting the temperature data, the mobile temperature acquisition device transmits the collected temperature data to the upper computer PC for further analysis.

[0101] In the actual temperature acquisition work, through the control of the motor, the temperature collector can move in the Y-axis direction along the lifting slide rail; through the telescopic movement of the controllable telescopic rod, the temperature collector can accurately move in the Z-axis. As for the movement in the X-axis direction, it can be achieved by manually adjusting the position of the lifting slide rail on the base, so as to ensure that the probe of the temperature acquisition module can touch any predetermined measurement point inside the cabinet.

[0102] S202. Based on the temperature data of multiple points in the space inside the cabinet collected, use the natural neighbor interpolation algorithm to construct the spatial temperature field.

[0103] For the temperature data of multiple points in the collected space, the natural neighbor interpolation algorithm can be used to construct the spatial temperature field.

[0104] Specifically, during the acquisition process, in order to completely and evenly reflect the environmental temperature distribution inside the cabinet, the cabinet can be equally divided based on the lengths of the XYZ three axes. For example, for the long side of the X axis of the cabinet, four acquisition positions can be selected, which are respectively For the wide side of the Y axis of the cabinet, three acquisition positions can be selected, which are respectively For the high side of the Z axis of the cabinet, five acquisition positions can be selected, which are respectively A total of 3 * 4 * 5 = 60 discrete temperature data are collected.

[0105] This system starts collecting from the XOY section where Z = 0. After 3 * 4 = 12 temperature data on one plane are collected, the motor controls the temperature collector to rise vertically and continues to collect the temperature data of the plane until the temperature data of the plane where Z = H are collected. After that, the overall data collection of this turbine cabinet ends, and it returns to the Z = 0 plane to cycle and continue collecting.

[0106] For the data collection of the XOY section, first collect 4 temperature data on the line where Y = W. The 4 controllable telescopic rods extend forward and continue to collect the temperature data on the line until the temperature data on the line where Y = 0 are collected. After that, the data collection of 3 * 4 = 12 points on this XOY section ends.

[0107] After collecting the overall temperature data of the cabinet for one round, the data is uploaded to the PC side, and through the upper computer software, the overall temperature data of the cabinet is uploaded and saved as a csv file. The csv data is imported into the MATLAB workspace, and a visual display of the collected discrete temperature data is made as Figure 3 shown.

[0108] The temperature field inside the cabinet will be affected by various factors, including the heat distribution of equipment, ventilation conditions, etc. Considering the complex structure inside the actual cabinet, when using the in-cabinet environmental temperature acquisition system to collect the temperature information inside the cabinet, the collected discrete temperature data is often irregularly distributed.

[0109] Therefore, in this embodiment, the natural neighbor interpolation method can be used to better approximate the continuity and smoothness of the temperature field by considering the relationship between multiple neighboring points and reduce the occurrence of discontinuity. For the problem of reconstructing the three-dimensional temperature field inside the cabinet, it essentially belongs to a three-dimensional interpolation problem. In MATLAB, first generate an interpolation grid, import the temperature data of the sampled points, and create an interpolator F. The temperature data of the cabinet boundary is collected, and the natural neighbor interpolation method is used to reconstruct the three-dimensional space temperature field. Then traverse the grid data and input it into the interpolator F to output the reconstructed three-dimensional temperature field inside the cabinet as Figure 4 、 Figure 5As shown. By setting the internal temperature tolerance threshold T of the cabinet to 50 and hiding the display of the part where the interpolation result is less than 50, the local overheating points in the cabinet environment are obtained as Figure 6 shown.

[0110] S203. Construct a heat source temperature state space model under the air flow balance state, where the heat source temperature state space model characterizes the relationship between the temperature rise change of the cabinet server, the air supply volume and the air supply temperature of the air-cooling system, and the cold air bypass and hot air return in the cabinet.

[0111] As the main heat source inside the cabinet, the average inlet air temperature and the average outlet air temperature of the server are intuitive parameters reflecting the thermal environment of the cabinet. Taking three servers as an example in this model, the intake area and the exhaust area of each server are selected as nodes, and the node air flow distribution is as Figure 7 shown.

[0112] Then, a heat source temperature state space model under the air flow balance state can be constructed according to the Figure 7 cabinet model shown. Specifically, the heat source temperature state space model constructed in the cabinet under the air flow balance state is specifically:

[0113] Construct the mass balance equation in the cabinet:

[0114] Q L =∑Q S,i -Q C

[0115] Q OC,i =Q OC,i-1 +D i ×Q C +B i ×Q L -S i ×Q L -Q S,i

[0116] In the formula, Q C refers to the total amount of cold air sent into the cabinet by the air-cooling system; the supply cold air proportion coefficient D i represents the proportion of cold air distributed to the intake areas of each server in the cabinet; Q L refers to the total leakage air flow between the cold and hot channels of the cabinet, including the hot air return flow in the exhaust area and the cold air bypass flow in the intake area; the hot air return proportion coefficient B i and the cold air bypass proportion coefficient S i represent the proportion of hot air return and the proportion of cold air bypass in the leakage air flow in each server channel; Q S，i refers to the air flow entering the i-th server from the i-th intake area; Q OC,i the air flow flowing from the i-th intake area to the (i + 1)-th intake area;

[0117] The energy conservation equation for the server intake area is as follows:

[0118]

[0119] In the formula, p a is the air density; c p,a is the specific heat capacity of air; V I is the volume of the server intake area; T I,i is the temperature of the intake area of server i; T O,i is the temperature of the exhaust area of server i; T C is the supply air temperature of the air-cooling system;

[0120] The energy conservation equation for the server exhaust area is as follows:

[0121]

[0122] In the formula, X is the heat capacity of the server exhaust temperature, P S,i is the workload of server i;

[0123] The server is simplified to a black box model, that is, the enthalpy difference between the inlet and outlet airflows of the server is equal to the heat generation of the server, expressed as:

[0124] Q = m a c p,a ΔT a = m equ c p,equ ΔT equ

[0125] In the formula, Q is the heat generation of the server; m a is the air quality; is the temperature difference between the inlet and exhaust areas of the server, m equ is the mass of the server; C p,equ is the specific heat capacity of the server, ΔT equ is the temperature rise of the server;

[0126] Based on the energy conservation equation of the server intake area, the energy conservation equation of the server exhaust area, and the simplified "black box" model, the following state space structure can be obtained:

[0127]

[0128] Among them, the state vector is:

[0129] T(t) = [T I,1 T I,2 T I,3 T O,1 T O,2 T O,3 T ​

[0130] The input vector is:

[0131] u(t) = [Q C P S,1 P S,2 P S,3 T

[0132] The output vector is:

[0133] Y(t) = [ΔT equ1 ΔT equ2 ΔT equ3 T .

[0135] S204. Construct a natural convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model. The natural convection heat dissipation temperature field is used to reflect the model of the temperature distribution and the heat dissipation flow field inside the cabinet when no heat dissipation device is added.

[0136] In one embodiment, a three-dimensional model of the cabinet is constructed based on the actual cabinet structure, including setting the three-dimensional structure of the cabinet and the material of the heat dissipation components; designing the heat source power of each heat source in the cabinet and the ambient temperature; constructing a natural convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model.

[0137] It should be noted that the Icepak thermal simulation software can be used to perform thermal simulation analysis on the cabinet. It can handle the complex internal structure of the cabinet, including electronic components and the heat dissipation system, and optimize the design to improve the heat dissipation efficiency.

[0138] Based on the actual three-dimensional structure of the cabinet, as Figure 8 shown, first perform three-dimensional modeling on the cabinet, then simplify the cabinet model, set boundary conditions, set the corresponding heat source power for each entity module in the cabinet, select thermally conductive pure iron for the flat plate (plate) with a thickness of 3 mm. The 12 aluminum alloy radiators are actually for cooling the internal servers. Since their power is too large, aluminum alloy radiators must be installed. Small fans are set on the servers, and iron fences and openings are set on the cabinet shell for heat exchange with the outside.

[0139] When no fan is added to the cabinet shell, the heat dissipation of the cabinet at this time is natural convection heat dissipation. The environmental conditions can be set to 25 degrees, the solution equation is the zero balance equation, and solar radiation can be considered during model solution, and then finite element calculation is performed.

[0140] After the simulation calculation is completed, the obtained residual curve is as Figure 9 ​​As shown. In an ideal state, the total flux of each face of the cell should be zero, indicating the conservation of physical quantities in the absence of source terms. The RSM residual or the maximum residual measures the deviation between the simulated flow field and the target flow field. Ideally, the lower the residual value, the more accurate the simulation. However, due to the limitation of computational accuracy, it is impossible to completely eliminate the residual. For single-precision calculations, it is generally considered acceptable when the residual drops below 1e-2 of the initial value. In this context, "continuity" represents the residual of the mass conservation equation, "x-velocity", "y-velocity", and "z-velocity" correspond to the velocity residuals in each direction in the three-dimensional Cartesian coordinate system, respectively, and "energy" represents the residual of the energy equation.

[0141] As can be seen from Figure 10 that the temperature of the cabinet server is 68.3 °C, and the highest temperature of the two 50W small structural heat sources above the cabinet server is 78.07 °C.

[0142] The Z-axis sectional velocity field of natural convection heat dissipation in the cabinet is as Figure 11 shown. The red arrows represent the main movement direction of the air flow. The overall flow field diagram of natural convection heat dissipation in the cabinet is as Figure 12 shown. The whole system is natural convection. The fan in the cabinet causes turbulence. From the velocity section, the local flow velocity is relatively large near the turbulent fan in the cabinet. However, due to the lack of pressure difference power at the inlet and outlet, the air flow velocity is small, and the cold air cannot effectively enter the machine. A large amount of hot air accumulates and turbulates in the cabinet, resulting in an overall increase in the cabinet temperature. Due to the principle of hot air rising, the temperature in the upper part of the cabinet is slightly higher than that at the bottom. It can be seen from the system flow field diagram that the flow field of the cooling air duct is diffuse, and the phenomena of cold air bypass and hot air reflux are obvious. The cold air volume Q c is insufficient, and the cold air bypass coefficient S and the hot air reflux coefficient B are too high. The temperature field of the cabinet shell is as Figure 13 shown, and the perspective temperature field of the cabinet shell is as Figure 14 shown.

[0143] S205. Construct a forced convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field, and the heat source temperature state space model.

[0144] Replace the iron fence on the top of the cabinet with a large extraction fan for forced convection. The radius of the fan is set to 65 mm. After the same settings and solutions as the natural convection heat dissipation simulation model, the temperature field inside the cabinet is as Figure 15 shown.

[0145] As can be seen from Figure 15 that the temperature of the cabinet server is 45.26 °C, and the highest temperature of the two 50W small structural heat sources above the cabinet server is 57.6 °C. Compared with natural convection, the server temperature drops by 23 °C, and the local hot spot drops by 20.47 °C.

[0146] The Z-axis cross-sectional velocity field of forced convection heat dissipation in the cabinet is as follows Figure 16 shown. The red arrows represent the main movement direction of the air flow. The overall flow field diagram of forced convection heat dissipation in the cabinet is as follows Figure 17 shown. After adding the fan, the whole system is forced convection. From the velocity section, a small amount of air flow experiences hot air backflow after passing through the server, which increases the mixing rate of cold and hot air. It can be seen from the system flow field diagram that the phenomena of cold air bypass and hot air backflow are alleviated compared with natural convection. The cold air volume Q c increases significantly, and the bypass coefficient S and the backflow coefficient B decrease. However, the heat dissipation effect of the 50W heat source above the cabinet is slightly poor and needs further optimization.

[0147] S206. Determine the positions of local hot spots, the distribution of hot air backflow, and the distribution of cold air bypass in the cabinet based on the forced convection heat dissipation temperature field.

[0148] S207. Set flow deflectors on the hot air backflow duct and the cold air bypass duct according to the inlet position, outlet position of the cabinet, the distribution of the hot air backflow, the distribution of the cold air bypass, and the positions of the local hot spots.

[0149] Based on the forced convection air-cooling control simulation model, find the hot air backflow position and set flow deflectors at the hot air backflow position to reduce the phenomena of cold air bypass and hot air backflow, thereby effectively controlling the over-high local temperature.

[0150] After forced convection, it is found that there are local hot spots inside the cabinet, namely two 50W small structural component heat sources on the cabinet server. Therefore, the method of optimizing the cooling duct is adopted to control more air volume to pass through the local hot spots, so that their temperatures can be improved. By adding flow deflectors to the existing cooling ducts in the cabinet, the phenomena of cold air bypass and hot air backflow are reduced respectively, so that more air volume not only passes through the server, but also strengthens the heat dissipation of the local hot spots.

[0151] Flow deflectors can be added beside the duct at the inlet of the cabinet to reduce cold air bypass, and flow deflectors can be added at the outlet backflow position to block hot air backflow. After solving, the temperature field inside the cabinet is as follows Figure 18 shown, and the air flow field after controlling the duct is as follows Figure 19 shown.

[0152] As can be seen from Figure 18 , the temperature of the cabinet server is 45.02 °C, and the highest temperature of the two 50W small structural heat sources above the cabinet server is 53.3 °C. Compared with when there is no duct control for forced convection, the temperature of the server drops basically unchanged, slightly decreases, and the local hot spots drop by 4.3 °C. At this time, the overall temperature field of the cabinet has reached the basic requirements.

[0153] The upper deflector blocks the reflux of hot air. It can be seen from the flow field before optimization that the hot air reflux from the upper air outlet of the cabinet will reach two local hot spots of the 50W heat sources above the cabinet, resulting in poor cooling effect of the local hot spots. After adding the deflector, the hot air reflux coefficient B decreases, and the local hot spots improve. The lower deflector blocks the cold air bypassing from the air inlet part of the cabinet to the copper bar, reducing the cold air bypass coefficient S.

[0154] In the technical solution of the embodiment of the present invention, the temperature data of multiple points in the space inside the cabinet are collected to construct a spatial temperature field reflecting the temperature distribution inside the cabinet; a heat source temperature state space model under the airflow balance state is constructed to determine the relationship between the temperature rise change of the cabinet server, the air supply volume and the air supply temperature of the air cooling system, and the cold air bypass and hot air reflux inside the cabinet; a forced convection heat dissipation temperature field is constructed based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model, and then the temperature distribution and the heat dissipation flow field distribution inside the cabinet and the position of the local hot spots inside the cabinet are determined, so as to analyze the installation position of the deflector, so that the cold air passes through the local hot spots and / or blocks the hot air from refluxing to the local hot spots, and finally improves the heat dissipation performance of the cabinet.

[0155] Embodiment III Figure 20 It is a schematic structural diagram of a cabinet cooling device provided by Embodiment III of the present invention. As Figure 20 shown, the device includes: A data acquisition unit 301, configured to collect temperature data of multiple points in the space inside the cabinet; A temperature field construction unit 302, configured to construct a spatial temperature field based on the temperature data of multiple points in the space inside the cabinet collected, and the spatial temperature field is used to reflect the temperature distribution inside the cabinet; A spatial model construction unit 303, configured to construct a heat source temperature state space model under the airflow balance state, and the heat source temperature state space model characterizes the relationship between the temperature rise change of the cabinet server, the air supply volume and the air supply temperature of the air cooling system, and the cold air bypass and hot air reflux inside the cabinet; A heat dissipation temperature field construction unit 304, configured to construct a forced convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model; the forced convection heat dissipation temperature field is used to reflect the model of the temperature distribution and the heat dissipation flow field distribution inside the cabinet after adding the heat dissipation device; A deflector setting unit 305, configured to determine at least the position of the local hot spots inside the cabinet based on the forced convection heat dissipation temperature field, and set deflectors inside the cabinet according to the position of the local hot spots, so that the cold air passes through the local hot spots and / or blocks the hot air from refluxing to the local hot spots.

[0162] The cabinet cooling device provided by the embodiments of the present invention can implement the cabinet cooling device provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the implementation method.

[0163] Embodiment 4

[0164] Figure 21 FIG. shows a schematic structural diagram of an electronic device 10 that can be used to implement the embodiments of the present invention. The electronic device is intended to represent various forms of digital computers, such as, for example, a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as, for example, a personal digital processor, a cellular phone, a smart phone, a wearable device (such as a helmet, glasses, a watch, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0165] As Figure 21 shown, the electronic device 10 includes at least one processor 11, and a memory communicatively connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc. The memory stores a computer program executable by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. The input / output (I / O) interface 15 is also connected to the bus 14.

[0166] A plurality of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0167] The processor 11 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a cabinet cooling method.

[0168] In some embodiments, a cabinet cooling method can be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the cabinet cooling method described above can be executed. Alternatively, in other embodiments, the processor 11 can be configured to execute a cabinet cooling method by any other suitable means (e.g., by means of firmware).

[0169] The various embodiments of the systems and techniques described above can be implemented in digital electronic circuitry, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on a chip (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a dedicated or general-purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit the data and instructions to the storage system, the at least one input device, and the at least one output device.

[0170] The computer program for implementing the method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to the processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowchart and / or block diagram are implemented. The computer program can be executed entirely on the machine, partially on the machine, as a stand-alone software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0171] In the context of the present invention, a computer-readable storage medium can be a tangible medium that can contain or store a computer program for use by or in connection with an instruction execution system, apparatus, or device. The computer-readable storage medium can include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, the computer-readable storage medium can be a machine-readable signal medium. More specific examples of the machine-readable storage medium would include an electrical connection based on one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0172] To provide for interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the electronic device. Other kinds of devices can also be used to provide for interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0173] The systems and techniques described herein can be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer having a graphical user interface or a web browser through which the user can interact with an implementation of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0174] A computing system may include a client and a server. The client and the server are generally far from each other and usually interact via a communication network. The client-server relationship is created by computer programs running on respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or a cloud host, which is a host product in the cloud computing service system, solving the defects of difficult management and weak business scalability existing in traditional physical hosts and VPS services.

[0175] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps recited in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitation is made herein.

[0176] The above specific embodiments do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A cabinet cooling method, characterized in that: include: Collect temperature data at multiple points in the cabinet space; Based on the collected temperature data of multiple points in the cabinet space, a spatial temperature field is constructed, where the spatial temperature field is used to reflect the temperature distribution in the cabinet; Construct a heat source temperature state space model under airflow balance state, wherein the heat source temperature state space model represents the relationship between the temperature rise change of the cabinet server, the air supply volume and air supply temperature of the air cooling system, and the cold air bypass and hot air return in the cabinet; A forced convection heat dissipation temperature field is constructed based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model; the forced convection heat dissipation temperature field is used to reflect the temperature distribution and heat dissipation flow field distribution model in the cabinet after the heat dissipation device is added; The location of the local hot spot in the cabinet is determined at least based on the forced convection heat dissipation temperature field, and a guide plate is set in the cabinet according to the location of the local hot spot to allow cold air to pass through the local hot spot and / or prevent hot air from flowing back to the local hot spot.

2. The cabinet cooling method according to claim 1, characterized in that: The collecting of temperature data of multiple points in the cabinet space includes: The temperature data of multiple points are collected at equal intervals in the horizontal direction in the cabinet, and the temperature data of multiple points are collected at equal intervals in the vertical direction in the cabinet.

3. The cabinet cooling method according to claim 1, characterized in that: The step of constructing a spatial temperature field based on the collected temperature data of multiple points in the cabinet space includes: Based on the collected temperature data of multiple points in the cabinet space, the space temperature field is constructed using a natural neighbor interpolation algorithm.

4. The cabinet cooling method according to claim 1, characterized in that: The constructing of the heat source temperature state space model under the airflow equilibrium state comprises: Construct the mass balance equation inside the cabinet: Q L =∑Q S,i -Q C Q OC,i =Q OC,i-1 +D i ×Q C +B i ×Q L -S i ×Q L -Q S,i In the formula, Q C Refers to the total amount of cold air delivered to the cabinet by the air cooling system; the cold air supply ratio coefficient D i Indicates the proportion of cold air allocated to each server air intake zone in the cabinet; Q L Refers to the total leakage air flow between the hot and cold channels of the cabinet, including the hot air return flow in the exhaust area and the cold air bypass flow in the intake area; the hot air return ratio coefficient B i and cold air bypass ratio coefficient S i Indicates the proportion of hot air return and cold air bypass in the leakage air volume in each server channel; Q S，i It refers to the airflow from the i-th air intake area into the i-th server; Q OC,i The airflow from the i-th air intake zone into the i+1-th air intake zone; Then the energy conservation equation of the server air intake area is: In the formula, p a is the air density; c p,a is the specific heat capacity of air; V I is the volume of the server air intake area; T I,i is the temperature of the air intake area of ​​server i; T O,i is the temperature of the exhaust area of ​​server i; T C is the air supply temperature of the air cooling system; The energy conservation equation for the server exhaust area is: Where X is the heat capacity of the server exhaust temperature, P S,i is the workload of server i; The server is simplified into a black box model, that is, the enthalpy difference of the airflow in and out of the server is equal to the heat generated by the server, expressed as: Q=m a c p,a ΔT a =m equ c p,equ ΔT equ Where Q is the heat generated by the server; m a is the air quality; is the temperature difference between the server inlet and outlet areas, m equ is the quality of the server; C p,equ is the specific heat capacity of the server, ΔT equ is the temperature rise of the server; According to the energy conservation equation of the server air intake area, the energy conservation equation of the server exhaust area and the simplified "black box" model, the following state space structure can be obtained: Among them, the state vector is: T(t)=[T I,1 T I,2 T I,3 T O,1 T O,2 T O,3 ] T The input vector is: u(t)=[Q C P S,1 P S,2 P S,3 ] T The output vector is: Y(t)=[ΔT equ1 ΔT equ2 ΔT equ3 ] T 。 5. The cabinet cooling method according to claim 1, characterized in that: Also includes: A natural convection heat dissipation temperature field is constructed based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model. The natural convection heat dissipation temperature field is used to reflect the temperature distribution and heat dissipation flow field distribution model in the cabinet when no heat dissipation device is added.

6. The cabinet cooling method according to claim 5, characterized in that: The natural convection heat dissipation temperature field is constructed based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model, including: Building a three-dimensional cabinet model based on the actual cabinet structure, including setting the three-dimensional structure of the cabinet and the material of the heat dissipation components; Design the heat source power of each heat source in the cabinet, as well as the ambient temperature; A natural convection heat dissipation temperature field is constructed based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model.

7. The cabinet cooling method according to claim 1, characterized in that: The method of determining the location of a local hot spot in the cabinet at least based on the forced convection heat dissipation temperature field, and setting a guide plate in the cabinet according to the location of the local hot spot, comprises: Determine the location of local hot spots, hot air return distribution, and cold air bypass distribution in the cabinet based on the forced convection heat dissipation temperature field; According to the position of the cabinet air inlet, the position of the exhaust port, the hot air return distribution, the cold air bypass distribution and the position of the local hot spot, guide plates are set on the hot air return duct and the cold air bypass duct.

8. A cabinet cooling device, characterized in that: include: A data acquisition unit is used to collect temperature data at multiple points in the cabinet space; A temperature field construction unit, used to construct a spatial temperature field based on the collected temperature data of multiple points in the cabinet space, wherein the spatial temperature field is used to reflect the temperature distribution in the cabinet; A space model building unit is used to build a heat source temperature state space model under airflow balance state, wherein the heat source temperature state space model represents the relationship between the temperature rise change of the cabinet server, the air supply volume and air supply temperature of the air cooling system, and the cold air bypass and hot air return in the cabinet; A heat dissipation temperature field construction unit is used to construct a forced convection heat dissipation temperature field based on the three-dimensional model of the cabinet, the spatial temperature field and the heat source temperature state space model; the forced convection heat dissipation temperature field is used to reflect the model of temperature distribution and heat dissipation flow field distribution in the cabinet after adding a heat dissipation device; The guide plate setting unit is used to determine the position of the local hot spot in the cabinet based on at least the forced convection heat dissipation temperature field, and set the guide plate in the cabinet according to the position of the local hot spot to allow cold air to pass through the local hot spot and / or block hot air from flowing back to the local hot spot.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the cabinet cooling method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the cabinet cooling method according to any one of claims 1 to 7 when executed.

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