Multi-layer collaborative heat dissipation structure of switching power supply module of asymmetric fluid channel

Abstract

The invention discloses a switching power supply module multilayer collaborative heat dissipation structure of an asymmetric fluid channel, and relates to the technical field of heat dissipation of electrical components, the switching power supply module multilayer collaborative heat dissipation structure comprises a shell and a middle cooling layer arranged in the shell, circuit layers are arranged on the upper side and the lower side of the middle cooling layer, and a cooling liquid flow channel is arranged in the middle cooling layer. The cooling liquid flow channel is arranged in the middle cooling layer in a coiled mode, the shell is provided with a cooling liquid inlet and a cooling liquid outlet which are communicated with the cooling liquid flow channel, the cooling liquid flow channel is provided with a plurality of buffer areas, the channel width of the buffer areas is larger than that of the cooling liquid flow channel, and flow blocking columns are arranged in the middles of the buffer areas. According to the application, the flow velocity distribution of the cooling liquid in the cooling liquid flow channel can be effectively improved, the problem of overlarge temperature difference caused by uneven flow velocity is reduced, local thermal stress concentration is avoided, and the long-term stability of equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electrical components, and in particular to a multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel. Background Art

[0002] The heat dissipation technology of switching power supply modules occupies an important position in the field of power electronics. With the widespread application of high-power density power supply equipment, efficient heat dissipation structure can not only ensure the normal operation of the equipment, but also improve the reliability and efficiency of the overall system. The increasing demand for high performance and high reliability of modern electronic equipment has made heat dissipation technology one of the key factors restricting equipment performance and life. Especially in multi-layer circuit structures, how to effectively control heat distribution and reduce thermal stress concentration has become an important issue that needs to be solved in the industry.

[0003] In the prior art, in order to solve the heat dissipation problem of the multi-layer circuit structure layer of the switching power supply module, the circuit layer and the cooling layer are usually integrated together, and the heat dissipation function is achieved by designing cooling channels. Common cooling channel designs include hexagonal symmetrical channels, linear channels, and grid channels. These channel designs are intended to remove heat through the circulation of coolant, thereby achieving the basic heat dissipation function of the multi-layer circuit structure layer.

[0004] However, existing cooling channel designs generally have the problem of uneven coolant flow rate, which leads to a large temperature difference between the high-speed area and the low-speed area of ​​the fluid, thus causing local thermal stress concentration. This phenomenon not only affects the long-term stability of the equipment, but may also shorten the service life of the equipment and cannot meet the requirements of high-power density equipment for uniform heat dissipation. Summary of the invention

[0005] In view of the problems existing in the prior art, the present application provides a multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel.

[0006] The present application provides a multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel, which adopts the following technical solution: A multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel, comprising a shell and an intermediate cooling layer arranged in the shell, wherein circuit layers are arranged on the upper and lower sides of the intermediate cooling layer, a coolant flow channel is arranged in the intermediate cooling layer, and the coolant flow channel is coiled in the intermediate cooling layer, a coolant inlet and a coolant outlet connected to the coolant flow channel are arranged on the shell, the coolant flow channel is provided with a plurality of buffer zones, the channel width of the buffer zone is greater than the channel width of the coolant flow channel, and a baffle column is arranged in the middle position of the buffer zone for slowing down the coolant flow rate at the corresponding position, so that the coolant flow rate in the entire coolant flow channel remains quite stable.

[0007] Optionally, the corner position of the coolant flow channel is set to be arc-shaped.

[0008] Optionally, the liquid inlet direction of the coolant inlet is perpendicular to the extension direction of the coolant flow channel, and the liquid outlet direction of the coolant outlet is the same as the extension direction of the coolant flow channel.

[0009] Optionally, openings are provided on the intermediate cooling layer for electrical connection of each circuit layer, and the coolant flow channel bypasses the openings on the intermediate cooling layer.

[0010] Optionally, a processing groove is provided at one end of the intermediate cooling layer, the processing groove is communicated with the coolant flow channel, a heat exchange copper plate is arranged in the processing groove, and the heat exchange copper plate is adapted to the processing groove for closing the processing groove.

[0011] Optionally, a high-efficiency heat exchange area is provided on the heat exchange copper plate, a plurality of heat exchange copper columns are arranged in the high-efficiency heat exchange area, the heat exchange copper columns are integrally formed with the heat exchange copper plate, and the end faces of the heat exchange copper columns away from the heat exchange copper plate are flush, and there is a clearance fit between adjacent heat exchange copper columns. The layout of the heat exchange copper columns corresponds to the position of the coolant flow channel, and the heat exchange copper columns are in contact with the high-heat-generating electrical components on the corresponding circuit layer.

[0012] Optionally, the coolant flow channel is respectively provided with a shunt port and a return port, the shunt port and the return port are jointly communicated with a heat exchange copper tube, and the heat exchange copper tube is in contact with the high-heat-generating electrical components on the circuit layer.

[0013] Optionally, the shunt port is arranged at a position close to the coolant inlet, the return port is arranged at a position close to the coolant outlet, and when the coolant enters the shunt port, the flow direction of the coolant is the same as the extension direction of the shunt port. When the coolant returns to the coolant flow channel through the return port, the flow direction is the same as the flow direction of the coolant inside the coolant flow channel.

[0014] Optionally, the heat exchange copper tube is detachably arranged on the intermediate cooling layer, and connection structures for connecting the heat exchange copper tube are arranged at both the shunt port and the return port.

[0015] Optionally, the connection structure includes a threaded sleeve and a soft rubber sleeve. The threaded sleeve is provided with an external thread, and the side walls of the shunt port and the return port are both provided with internal threads adapted to the threaded sleeve. The soft rubber sleeve is sleeved on the threaded sleeve, and the soft rubber sleeve is adapted to the heat exchange copper tube.

[0016] In summary, the present application includes at least one of the following beneficial technical effects: 1. This application can effectively improve the flow velocity distribution of the coolant in the coolant flow channel, reduce the problem of excessive temperature difference caused by uneven flow velocity, avoid local thermal stress concentration, and enhance the long-term stability of the equipment. Specifically, by optimizing the overall structural design of the coolant flow channel, setting multiple buffer zones in the coolant flow channel, and adding flow blocking columns in the buffer zones, the flow velocity of the coolant at the buffer zone position can be significantly slowed down, so that the flow velocity of the coolant in the entire coolant flow channel remains quite stable, and the velocity difference between the high-speed zone and the low-speed zone of the coolant is reduced, thereby avoiding excessive temperature difference between the high-speed zone and the low-speed zone of the fluid. This design can not only reduce the risk of local thermal stress concentration, but also improve the heat dissipation uniformity of the entire cooling system, thereby enhancing the long-term stability and reliability of the switching power supply module.

[0017] 2. By setting the corner position of the coolant flow channel in an arc shape, this application can effectively reduce the eddy current and pressure loss generated by the sudden change of the angle during the fluid flow. The flow of the coolant becomes smoother, avoiding the problem of local temperature unevenness caused by fluid turbulence, thereby further improving the heat dissipation efficiency and stability of the entire cooling system.

[0018] 3. By setting a number of heat exchange copper columns in the high-efficiency heat exchange area on the heat exchange copper plate, and the heat exchange copper columns are in contact with the high-heat-generating electrical components to form a heat bridge, the heat in the coolant flow channel can be efficiently conducted to the high-heat-generating electrical components, thereby achieving precise heat dissipation. In addition, considering that the coverage area of the coolant flow channel is limited, by making the gaps between adjacent heat exchange copper columns in a clearance fit and corresponding the layout of the heat exchange copper columns to the position of the coolant flow channel, the heat in the coolant flow channel can be efficiently conducted to the heat exchange copper columns, and the high-heat-generating electrical components are cooled, avoiding the phenomenon of local thermal concentration.

[0019] 4. By setting heat exchange copper tubes, and respectively setting a diversion port and a return port communicating with the heat exchange copper tubes in the coolant flow channel, and contacting the heat exchange copper tubes with the high-heat-generating electrical components on the circuit layer, the heat dissipation efficiency of the high-heat-generating electrical components can be effectively improved. In addition, the heat exchange copper tubes, as an additional heat dissipation channel, can quickly conduct and dissipate the heat in the high-heat-generating area inside the switching power supply module, avoiding local overheating, thereby enhancing the uniformity and stability of the overall heat dissipation structure. Description of the Drawings

[0020] Figure 1 is the overall structural sectional view of the embodiment of the present application; Figure 2 is the structural schematic diagram of the intermediate cooling layer used in the embodiment of the present application; Figure 3 is the structural schematic diagram of the coolant flow channel used in the embodiment of the present application; Figure 4It is a structural sectional view of an embodiment of the present application, mainly used to show the layout of the heat exchange cylinder columns; Figure 5 It is a structural sectional view of an embodiment of the present application for showing the connection structure.

[0021] Explanation of reference numerals: 100, housing; 101, intermediate cooling layer; 102, circuit layer; 103, coolant flow channel; 104, coolant inlet; 105, coolant outlet; 106, buffer zone; 107, baffle post; 108, opening; 109, processing groove; 110, heat exchange copper plate; 111, high-efficiency heat exchange area; 112, heat exchange copper column; 113, heat exchange copper tube; 114, shunt port; 115, return port; 116, threaded sleeve; 117, soft rubber sleeve. Detailed implementation manners

[0022] Next, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the attached Figure 1 - attached Figure 5 , and the described embodiments are only possible technical implementations of the present invention, not all possible implementations. Those skilled in the art can completely combine the embodiments of the present invention to obtain other embodiments without creative labor, and these embodiments are also within the protection scope of the present invention.

[0023] The inventors of the present application found that in the prior art, to solve the heat dissipation problem of the multi-layer circuit structure layer of the switching power supply module, the circuit layer and the cooling layer are usually integrated together, and the heat dissipation function is realized by designing a cooling flow channel. However, the existing cooling flow channel designs generally have the problem of uneven coolant flow velocity, resulting in a large temperature difference between the high-speed area and the low-speed area of the fluid, thereby causing local thermal stress concentration. This phenomenon not only affects the long-term stability of the device but also may shorten the service life of the device, and cannot meet the demand for uniform heat dissipation of high-power density devices. Therefore, the present application discloses a multi-layer collaborative heat dissipation structure of a switching power supply module with an asymmetric fluid channel, mainly adopting the following solutions: The embodiments of the present application disclose a multi-layer collaborative heat dissipation structure of a switching power supply module with an asymmetric fluid channel. Referring to Figure 1 and Figure 2 , it includes a housing 100 and an intermediate cooling layer 101 arranged in the housing 100. Circuit layers 102 are arranged on both the upper and lower sides of the intermediate cooling layer 101, which are a filter circuit layer 102 and a DC-DC circuit conversion layer respectively. A coolant flow channel 103 is arranged in the intermediate cooling layer 101, and the coolant flow channel 103 is arranged in a coiled manner in the intermediate cooling layer 101. A coolant inlet 104 and a coolant outlet 105 communicated with the coolant flow channel 103 are arranged on the housing 100.

[0024] Specifically, the intermediate cooling layer 101 is welded inside the housing 100. The intermediate cooling layer 101 is made of a metal material with high thermal conductivity, such as stainless steel, copper or aluminum alloy. These materials have good thermal conductivity, can quickly conduct heat, and can ensure that the intermediate cooling layer 101 has sufficient structural strength.

[0025] Refer to Figure 3 , the corner position of the coolant flow channel 103 is set to be arc-shaped to reduce the eddy current and pressure loss generated by the sudden change of the angle during the fluid flow, and ensure the smooth flow of the coolant. The coolant flow channel 103 is provided with a plurality of buffer zones 106. The channel width of the buffer zone 106 is greater than the channel width of the coolant flow channel 103, and a flow blocking column 107 is arranged at the middle position of the buffer zone 106. The overall structural design of the coolant flow channel 103 and the position selection of the buffer zone 106 need to accurately analyze the velocity change of the coolant in the entire coolant flow channel 103 and be accurately calculated. The settings of the buffer zone 106 and the flow blocking column 107 can effectively slow down the coolant flow velocity at the corresponding positions, keep the coolant flow velocity in the entire coolant flow channel 103 quite stable, thereby effectively improving the coolant flow velocity distribution, avoiding local thermal stress concentration, and enhancing the long-term stability of the equipment.

[0026] Specifically, the buffer zone 106 is a key structure in the coolant flow channel 103. Its channel width is significantly greater than the main part of the coolant flow channel 103, and can be specifically designed to be between 1.5 times and 2 times the width of the main body of the coolant flow channel 103. Moreover, a slope is arranged at the connection position between the buffer zone 106 and the coolant flow channel 103 to connect the buffer zone 106 and the coolant flow channel 103 and guide the coolant into the coolant flow, avoiding the occurrence of turbulent flow phenomena.

[0027] Specifically, the specific shape of the flow blocking column 107 can be cylindrical or prismatic, and the size can be adjusted according to actual needs. For example, a cylindrical flow blocking column 107 with a diameter of 8 mm to 12 mm. The flow blocking column 107 is integrally formed with the intermediate cooling layer 101 to ensure its structural stability and reliability.

[0028] Refer to Figure 3 , to further optimize the fluid flow characteristics of the coolant in the coolant flow channel 103, the liquid inlet direction of the coolant inlet 104 is perpendicular to the extension direction of the coolant flow channel 103, which can effectively slow down the flow velocity of the coolant when it enters the coolant flow channel 103, thereby improving the flow stability of the coolant in the entire coolant flow channel 103. In addition, the liquid outlet direction of the coolant outlet 105 is the same as the extension direction of the coolant flow channel 103, which helps to smoothly discharge the coolant and avoid the occurrence of backflow or eddy current phenomena at the outlet, further enhancing the heat dissipation efficiency and the overall stability of the system.

[0029] Specifically, the specific dimensions of the coolant inlet 104 and the coolant outlet 105 can be adjusted according to actual requirements. For example, for circular interfaces with a diameter of 10 mm to 15 mm, the dimensions of the coolant inlet 104 and the coolant outlet 105 need to be smaller than the cross-sectional dimension of the coolant flow channel 103 to ensure that the coolant can effectively fill the entire coolant flow channel 103.

[0030] Refer to Figure 3 , an opening 108 is provided on the intermediate cooling layer 101, and the coolant flow channel 103 bypasses the opening 108 on the intermediate cooling layer 101. Providing the opening 108 on the intermediate cooling layer 101 facilitates the electrical connection between the circuit layers 102 and ensures that the electrical connection between the circuit layers 102 is not affected. At the same time, the design that the coolant flow channel 103 bypasses the opening 108 ensures the integrity of the coolant flow channel 103, avoids a decrease in the cooling effect caused by the opening 108, and also avoids coolant leakage, thus meeting the connection requirements between the circuit layers 102 while ensuring the heat dissipation performance.

[0031] Refer to Figure 2 , for the convenience of the processing and manufacturing of the coolant flow channel 103, a processing groove 109 is provided at one end of the intermediate cooling layer 101. The processing groove 109 communicates with the coolant flow channel 103, and a heat exchange copper plate 110 is provided in the processing groove 109. The heat exchange copper plate 110 is adapted to the processing groove 109 and is used to close the processing groove 109. At the same time, due to its good thermal conductivity, the heat exchange copper plate 110 can ensure the heat exchange efficiency between the coolant and the circuit layer 102.

[0032] Refer to Figure 2 , a plurality of high-efficiency heat exchange areas 111 are provided on the heat exchange copper plate 110. The high-efficiency heat exchange areas 111 correspond to the positions of the high-heat-generating electrical components on the circuit layer 102 on the same side. A number of heat exchange copper columns 112 are provided in the high-efficiency heat exchange areas 111. The heat exchange copper columns 112 are integrally formed with the heat exchange copper plate 110, and the end faces of the heat exchange copper columns 112 away from the heat exchange copper plate 110 are flush. The heat exchange copper columns 112 are in contact with the corresponding high-heat-generating electrical components. The heat exchange copper columns 112 can be designed as cylindrical or square columnar shapes, and the thickness is controlled within 2 mm to 4 mm. By providing a number of heat exchange copper columns 112 in the high-efficiency heat exchange areas 111 on the heat exchange copper plate 110 to form a heat bridge, the heat in the coolant flow channel 103 can be efficiently conducted to the high-heat-generating electrical components, thereby achieving precise heat dissipation.

[0033] Refer to Figure 2 and Figure 4, the adjacent heat exchange copper columns 112 are in clearance fit, and the layout of each heat exchange copper column 112 corresponds to the position of the coolant flow channel 103. Considering that the coverage area of the coolant flow channel 103 is limited, by making the adjacent heat exchange copper columns 112 in clearance fit and corresponding the layout of the heat exchange copper columns 112 to the position of the coolant flow channel 103, the heat in the coolant flow channel 103 can be efficiently conducted to the heat exchange copper columns 112, and the high-heat-generating electrical components can be cooled, avoiding the phenomenon of local thermal concentration.

[0034] Refer to Figure 3 and Figure 4 , on the side of the intermediate cooling layer 101 away from the heat exchange copper plate 110, there is a heat exchange copper tube 113. A flow splitting port 114 and a return port 115 are respectively arranged in the coolant flow channel 103. The two ends of the heat exchange copper tube 113 are respectively communicated with the flow splitting port 114 and the return port 115. The heat exchange copper tube 113 abuts against the high-heat-generating electrical components on the circuit layer 102 on the same side. The heat exchange copper tube 113 serves as an additional heat dissipation channel. By abutting the heat exchange copper tube 113 against the high-heat-generating electrical components on the circuit layer 102, the heat dissipation efficiency of the high-heat-generating electrical components can be effectively improved. In addition, the design of the heat exchange copper tube 113 can also quickly conduct and dissipate the heat in the high-heat-generating area inside the switching power supply module, cool the inside of the switching power supply module, avoid local overheating, and thus improve the uniformity and stability of the overall heat dissipation structure.

[0035] Refer to Figure 3 and Figure 5 , specifically, the flow splitting port 114 is arranged at a position close to the coolant inlet 104, the return port 115 is arranged at a position close to the coolant outlet 105, and when the coolant enters the flow splitting port 114, the flow direction of the coolant is the same as the extending direction of the flow splitting port 114. When the coolant returns to the coolant flow channel 103 through the return port 115, the flow direction is the same as the flow direction of the coolant inside the coolant flow channel 103. By arranging the flow splitting port 114 at a position close to the coolant inlet 104 and the return port 115 at a position close to the coolant outlet 105, it is possible to avoid the influence of the coolant flowing through the heat exchange copper tube 113 on the temperature of the original coolant inside the coolant flow channel 103 and ensure the stability of the temperature inside the coolant flow channel 103. And, by making the flow direction of the coolant the same as the extending direction of the flow splitting port 114 when the coolant enters the flow splitting port 114, it can ensure that the coolant is quickly split after entering the coolant flow channel 103 and reduce the flow velocity loss of the coolant. In addition, by controlling the flow direction of the coolant to be the same as the flow direction of the coolant inside the coolant flow channel 103 when the coolant returns to the coolant flow channel 103 through the return port 115, the coolant flow is made smoother and the phenomenon of turbulence is avoided.

[0036] Refer to Figure 5, for the convenience of the processing and assembly of the switching power supply module, and at the same time, to improve the convenience during equipment maintenance, the heat exchange copper tube 113 is detachably arranged on the intermediate cooling layer 101, and connection structures for connecting the heat exchange copper tube 113 are arranged at both the shunt port 114 and the return port 115. Specifically, the connection structure includes a threaded sleeve 116 and a soft rubber sleeve 117. The threaded sleeve 116 is provided with external threads, and the side walls of the shunt port 114 and the return port 115 are both provided with internal threads adapted to the threaded sleeve 116. The soft rubber sleeve 117 is sleeved on the threaded sleeve 116, and the soft rubber sleeve 117 is adapted to the heat exchange copper tube 113. The threaded sleeve 116 and the soft rubber sleeve 117 in the connection structure can realize the reliable connection between the heat exchange copper tube 113 and the shunt port 114 and the return port 115. The cooperation of the threaded sleeve 116 with the internal threads of the shunt port 114 and the return port 115 ensures the stability of the connection, while the setting of the soft rubber sleeve 117 effectively prevents the leakage of the coolant and at the same time protects the heat exchange copper tube 113 from mechanical damage. This design not only improves the convenience of connection, but also enhances the sealing performance and reliability of the heat dissipation structure, thus ensuring the efficient and stable operation of the entire heat dissipation system.

[0037] The implementation principle of the multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel in the embodiment of the present application is as follows: By optimizing the overall structural design of the coolant flow channel 103, a plurality of buffer zones 106 are arranged in the coolant flow channel 103, and flow blocking columns 107 are added in the buffer zones 106, which can significantly slow down the flow rate of the coolant at the position of the buffer zones 106, keep the flow rate of the coolant quite stable in the entire coolant flow channel 103, and reduce the speed difference between the high-speed area and the low-speed area of the coolant, thereby avoiding excessive temperature differences between the high-speed area and the low-speed area of the fluid. This design can not only reduce the risk of local thermal stress concentration, but also improve the heat dissipation uniformity of the entire cooling system, and further enhance the long-term stability and reliability of the switching power supply module.

[0038] The above are all the preferred embodiments of the present application, and the protection scope of the present application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A multi-layer collaborative heat dissipation structure for a switching power supply module with an asymmetric fluid channel, characterized in that: It includes a housing (100) and an intermediate cooling layer (101) disposed within the housing (100). Circuit layers (102) are provided on both the upper and lower sides of the intermediate cooling layer (101). A coolant flow channel (103) is disposed within the intermediate cooling layer (101), and the coolant flow channel (103) is wound and arranged within the intermediate cooling layer (101). A coolant inlet (104) and a coolant outlet (105) that communicate with the coolant flow channel (103) are provided on the housing (100). The coolant flow channel (103) is provided with a plurality of buffer zones (106), the channel width of the buffer zones (106) is greater than the channel width of the coolant flow channel (103), and a flow blocking post (107) is disposed at the middle position of the buffer zones (106) for slowing down the coolant flow rate at the corresponding position, so that the coolant flow rate within the entire coolant flow channel (103) remains quite stable.

2. The multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel according to claim 1, wherein: The corner positions of the coolant flow channel (103) are arranged in an arc shape.

3. The multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel according to claim 1, characterized in that: The liquid inlet direction of the coolant inlet (104) is perpendicular to the extending direction of the coolant flow channel (103), and the liquid outlet direction of the coolant outlet (105) is the same as the extending direction of the coolant flow channel (103).

4. An asymmetric fluid channel switching power supply module multi-layer collaborative heat dissipation structure according to claim 1, characterized in that: An opening (108) is provided on the intermediate cooling layer (101) for electrical connection of each circuit layer (102), and the coolant flow channel (103) bypasses the opening (108) on the intermediate cooling layer (101).

5. The multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel according to claim 1, characterized in that: A processing groove (109) is opened at one end of the intermediate cooling layer (101), the processing groove (109) communicates with the coolant flow channel (103), and a heat exchange copper plate (110) is disposed within the processing groove (109). The heat exchange copper plate (110) is adapted to the processing groove (109) for closing the processing groove (109).

6. The multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel according to claim 5, characterized in that: A high-efficiency heat exchange area (111) is provided on the heat exchange copper plate (110). A number of heat exchange copper columns (112) are disposed within the high-efficiency heat exchange area (111). The heat exchange copper columns (112) are integrally formed with the heat exchange copper plate (110), and the end faces of each heat exchange copper column (112) away from the heat exchange copper plate (110) are flush. There is a clearance fit between adjacent heat exchange copper columns (112). The layout of each heat exchange copper column (112) corresponds to the position of the coolant flow channel (103), and the heat exchange copper column (112) abuts against the high-heat-generating electrical components on the corresponding circuit layer (102).

7. An asymmetric fluid channel switching power supply module multi-layer collaborative heat dissipation structure according to claim 1, characterized in that: The coolant flow channel (103) is respectively provided with a diversion port (114) and a return port (115), and the diversion port (114) and the return port (115) are commonly connected to a heat exchange copper tube (113). The heat exchange copper tube (113) abuts against the high-heat-generating electrical components on the circuit layer (102).

8. An asymmetric fluid channel switching power supply module multi-layer collaborative heat dissipation structure according to claim 7, characterized in that: The shunt port (114) is arranged at a position close to the coolant inlet (104), the return port (115) is arranged at a position close to the coolant outlet (105), and when the coolant enters the shunt port (114), the flow direction of the coolant is the same as the extension direction of the shunt port (114). When the coolant returns to the coolant flow channel (103) through the return port (115), the flow direction is the same as the flow direction of the coolant inside the coolant flow channel (103).

9. The multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel according to claim 8, characterized in that: The heat exchange copper tube (113) is detachably arranged on the intermediate cooling layer (101), and connection structures for connecting the heat exchange copper tube (113) are arranged at both the shunt port (114) and the return port (115).

10. The multi-layer collaborative heat dissipation structure of the switching power supply module with an asymmetric fluid channel according to claim 9, characterized in that: The connection structure includes a threaded sleeve (116) and a soft rubber sleeve (117). The threaded sleeve (116) is provided with external threads, and the side walls of both the shunt port (114) and the return port (115) are provided with internal threads adapted to the threaded sleeve (116). The soft rubber sleeve (117) is sleeved on the threaded sleeve (116), and the soft rubber sleeve (117) is adapted to the heat exchange copper tube (113).

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