A multi-layer collaborative heat dissipation structure for a switching power supply module with an asymmetric fluid channel

Abstract

The present application discloses a multi-layer cooperative heat dissipation structure for a switching power supply module with an asymmetric fluid channel, which relates to the technical field of heat dissipation of electrical components. The structure comprises a housing and an intermediate cooling layer disposed within the housing. Circuit layers are disposed on both the upper and lower sides of the intermediate cooling layer. A coolant flow channel is disposed within the intermediate cooling layer. The coolant flow channel is coiled within the intermediate cooling layer. A coolant inlet and a coolant outlet are disposed on the housing and communicate with the coolant flow channel. The coolant flow channel is provided with multiple buffer zones, the channel width of the buffer zones being greater than the channel width of the coolant flow channel, and a flow blocking column is disposed in the middle of the buffer zones. The present application can effectively improve the flow velocity distribution of the coolant within the coolant flow channel, reduce the problem of excessive temperature difference caused by uneven flow velocity, avoid local thermal stress concentration, and improve the long-term stability of the equipment.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electrical components, and in particular to a multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel. Background Art

[0002] Heat dissipation technology for switching power supply modules plays a crucial role in the field of power electronics. With the widespread adoption of high-power density power supply devices, efficient heat dissipation structures not only ensure proper operation but also improve overall system reliability and efficiency. The increasing demand for high performance and reliability in modern electronic devices has made heat dissipation a key factor limiting device performance and lifespan. In particular, effectively controlling heat distribution and reducing thermal stress concentration in multi-layer circuit structures has become a critical issue for the industry.

[0003] To address the heat dissipation issues of the multi-layer circuit structure of a switching power supply module, the prior art typically integrates the circuit layer with the cooling layer and implements heat dissipation through the design of cooling channels. Common cooling channel designs include hexagonal symmetrical channels, linear channels, and grid-like channels. These channel designs aim to remove heat through the circulation of coolant, thereby achieving the basic heat dissipation function of the multi-layer circuit structure.

[0004] However, existing cooling channel designs often suffer from uneven coolant flow rates, leading to large temperature differences between high- and low-speed areas, which in turn causes localized thermal stress concentration. This phenomenon not only affects the long-term stability of the equipment but can also shorten its service life, failing to meet the uniform heat dissipation requirements of high-power density equipment. Summary of the Invention

[0005] In response to the problems existing in the prior art, the present application provides a multi-layer collaborative heat dissipation structure of a switching power supply module with an asymmetric fluid channel.

[0006] The present application provides a multi-layer collaborative heat dissipation structure for a switching power supply module with an asymmetric fluid channel, which adopts the following technical solutions:

[0007] A multi-layer cooperative heat dissipation structure for a switching power supply module with an asymmetric fluid channel includes a shell and an intermediate cooling layer arranged in the shell, circuit layers are arranged on the upper and lower sides of the intermediate cooling layer, a coolant flow channel is arranged in the intermediate cooling layer, and the coolant flow channel is coiled in the intermediate cooling layer, the shell is provided with a coolant inlet and a coolant outlet connected to the coolant flow channel, the coolant flow channel is provided with multiple buffer zones, the channel width of the buffer zones is greater than the channel width of the coolant flow channel, and a baffle column is provided in the middle position of the buffer zone for slowing down the coolant flow rate at the corresponding position, so that the coolant flow rate in the entire coolant flow channel remains quite stable.

[0008] Optionally, the corner position of the coolant flow channel is set to be an arc shape.

[0009] Optionally, the liquid inlet direction of the coolant inlet is perpendicular to the extension direction of the coolant flow channel, and the liquid outlet direction of the coolant outlet is the same as the extension direction of the coolant flow channel.

[0010] Optionally, the intermediate cooling layer is provided with openings for connecting electrical appliances of each circuit layer, and the coolant flow channel bypasses the openings on the intermediate cooling layer.

[0011] Optionally, a processing groove is opened at one end of the intermediate cooling layer, the processing groove is connected to the coolant flow channel, a heat exchange copper plate is arranged in the processing groove, and the heat exchange copper plate is adapted to the processing groove and is used to seal the processing groove.

[0012] Optionally, a high-efficiency heat exchange area is provided on the heat exchange copper plate, and a plurality of heat exchange copper columns are provided in the high-efficiency heat exchange area. The heat exchange copper columns are integrally formed with the heat exchange copper plate, and the end surface of each heat exchange copper column away from the heat exchange copper plate is flush, and the gaps between adjacent heat exchange copper columns are matched. The layout of each heat exchange copper column corresponds to the position of the coolant flow channel, and the heat exchange copper column abuts against the high-heat-generating electrical components on the circuit layer on the corresponding side.

[0013] Optionally, the coolant flow channel is respectively provided with a diversion port and a return port, and the diversion port and the return port are commonly connected to a heat exchange copper tube, and the heat exchange copper tube is in contact with the high-heat-generating electrical components on the circuit layer.

[0014] Optionally, the diversion port is arranged at a position close to the coolant inlet, and the reflux port is arranged at a position close to the coolant outlet, and when the coolant enters the diversion port, the flow direction of the coolant is the same as the extension direction of the diversion port, and when the coolant flows back to the coolant flow channel through the reflux port, the flow direction is the same as the flow direction of the coolant inside the coolant flow channel.

[0015] Optionally, the heat exchange copper tube is detachably arranged on the intermediate cooling layer, and the diversion port and the return port are both provided with connection structures for connecting the heat exchange copper tube.

[0016] Optionally, the connecting structure includes a threaded sleeve and a soft rubber sleeve, the threaded sleeve is provided with an external thread, the side walls of the diversion port and the return port are provided with internal threads that are compatible with the threaded sleeve, the soft rubber sleeve is provided on the threaded sleeve, and the soft rubber sleeve is compatible with the heat exchange copper tube.

[0017] In summary, this application includes at least one of the following beneficial technical effects:

[0018] 1. The present application can effectively improve the flow velocity distribution of the coolant in the coolant flow channel, reduce the problem of excessive temperature difference caused by uneven flow velocity, avoid local thermal stress concentration, and improve the long-term stability of the equipment. Specifically, by optimizing the overall structural design of the coolant flow channel, setting multiple buffer zones in the coolant flow channel, and adding baffle columns in the buffer zones, the flow velocity of the coolant in the buffer zone can be significantly slowed down, so that the flow velocity of the coolant in the entire coolant flow channel remains quite stable, and the speed difference of the coolant in the high-speed zone and the low-speed zone is reduced, thereby avoiding excessive temperature difference between the high-speed zone and the low-speed zone. This design can not only reduce the risk of local thermal stress concentration, but also improve the heat dissipation uniformity of the entire cooling system, thereby enhancing the long-term stability and reliability of the switching power supply module.

[0019] 2. By creating arc-shaped corners at the coolant flow channel, this application effectively reduces eddy currents and pressure losses caused by sudden angle changes during fluid flow. This allows for smoother coolant flow, avoids localized temperature unevenness caused by fluid turbulence, and further improves the heat dissipation efficiency and stability of the entire cooling system.

[0020] 3. This application sets up a number of heat-exchange copper columns in the high-efficiency heat-exchange area on the heat-exchange copper plate, and the heat-exchange copper columns abut against the high-heat-generating electrical components to form a heat bridge, so that the heat in the coolant flow channel can be efficiently transferred to the high-heat-generating electrical components, thereby achieving precise heat dissipation. In addition, considering the limited coverage area of ​​the coolant flow channel, by matching the gaps between adjacent heat-exchange copper columns and aligning the layout of the heat-exchange copper columns with the position of the coolant flow channel, the heat in the coolant flow channel can be efficiently transferred to the heat-exchange copper columns, and the high-heat-generating electrical components can be cooled, thereby avoiding the phenomenon of local heat concentration.

[0021] 4. This application utilizes a heat exchange copper tube, and provides a diversion port and a return port connected to the heat exchange copper tube in the coolant flow channel. This allows the heat exchange copper tube to abut against the high-heat-generating electrical components on the circuit layer, effectively improving the heat dissipation efficiency of the high-heat-generating electrical components. Furthermore, the heat exchange copper tube serves as an additional heat dissipation channel, quickly conducting and dissipating heat from the high-heat-generating areas within the switching power supply module, preventing local overheating and improving the uniformity and stability of the overall heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a cross-sectional view of the overall structure of an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the structure of the intermediate cooling layer used in the embodiment of the present application;

[0024] Figure 3 This is a schematic diagram of the structure of the coolant flow channel used in the embodiment of the present application;

[0025] Figure 4 This is a structural cross-sectional view of an embodiment of the present application, mainly used to express the layout of the heat exchange column;

[0026] Figure 5 It is a structural cross-sectional view used to express the connection structure in an embodiment of the present application.

[0027] Explanation of the accompanying reference numerals: 100, shell; 101, intermediate cooling layer; 102, circuit layer; 103, coolant flow channel; 104, coolant inlet; 105, coolant outlet; 106, buffer zone; 107, baffle column; 108, opening; 109, processing groove; 110, heat exchange copper plate; 111, high-efficiency heat exchange zone; 112, heat exchange copper column; 113, heat exchange copper tube; 114, diversion port; 115, return port; 116, threaded sleeve; 117, soft rubber sleeve. DETAILED DESCRIPTION

[0028] The following will be combined with the Figure 1 -Attached Figure 5 The technical solutions in the embodiments of the present invention are clearly and completely described. The described embodiments are only possible technical implementations of the present invention and do not constitute a complete set of implementations. Those skilled in the art can combine the embodiments of the present invention to derive other embodiments without inventive work, and such embodiments are also within the scope of protection of the present invention.

[0029] The inventors of the present application have discovered that in the prior art, in order to solve the heat dissipation problem of the multi-layer circuit structure layer of the switching power supply module, the circuit layer and the cooling layer are usually integrated together, and the heat dissipation function is achieved by designing cooling channels. However, the existing cooling channel design generally has the problem of uneven coolant flow rate, which causes a large temperature difference between the high-speed area and the low-speed area of ​​the fluid, thereby causing local thermal stress concentration. This phenomenon not only affects the long-term stability of the equipment, but may also shorten the service life of the equipment and cannot meet the requirements of high-power density equipment for uniform heat dissipation. To this end, the present application discloses a multi-layer collaborative heat dissipation structure of a switching power supply module with an asymmetric fluid channel, which mainly adopts the following scheme:

[0030] The embodiment of the present application discloses a multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel. Figure 1 and Figure 2 , including a shell 100 and an intermediate cooling layer 101 arranged in the shell 100, circuit layers 102 are arranged on the upper and lower sides of the intermediate cooling layer 101, which are a filter circuit layer 102 and a DC-DC circuit conversion layer respectively, a coolant flow channel 103 is arranged in the intermediate cooling layer 101, and the coolant flow channel 103 is coiled in the intermediate cooling layer 101, and a coolant inlet 104 and a coolant outlet 105 connected to the coolant flow channel 103 are provided on the shell 100.

[0031] Specifically, the intermediate cooling layer 101 is welded inside the shell 100. The intermediate cooling layer 101 is made of a metal material with high thermal conductivity, such as stainless steel, copper or aluminum alloy. These materials have good thermal conductivity, can quickly conduct heat, and can ensure that the intermediate cooling layer 101 has sufficient structural strength.

[0032] Reference Figure 3 , the corner position of the coolant flow channel 103 is set to be arc-shaped to reduce the eddy current and pressure loss caused by the sudden change of angle during the flow of the fluid, and ensure the smooth flow of the coolant. The coolant flow channel 103 is provided with a plurality of buffer zones 106, the channel width of the buffer zone 106 is greater than the channel width of the coolant flow channel 103, and a baffle column 107 is provided in the middle position of the buffer zone 106. The overall structural design of the coolant flow channel 103 and the position selection of the buffer zone 106 require accurate analysis of the flow velocity changes of the coolant in the entire coolant flow channel 103 and are accurately calculated. The setting of the buffer zone 106 and the baffle column 107 can effectively slow down the coolant flow rate at the corresponding position, so that the coolant flow rate in the entire coolant flow channel 103 remains quite stable, thereby effectively improving the coolant flow rate distribution, avoiding local thermal stress concentration, and improving the long-term stability of the equipment.

[0033] Specifically, the buffer zone 106 is a key structure in the coolant flow channel 103, and its channel width is significantly larger than the main part of the coolant flow channel 103. Specifically, it can be designed to be between 1.5 times and 2 times the width of the main body of the coolant flow channel 103. A slope is provided at the connection position between the buffer zone 106 and the coolant flow channel 103 to connect the buffer zone 106 and the coolant flow channel 103 and guide the coolant into the coolant flow to avoid turbulence.

[0034] Specifically, the specific shape of the baffle column 107 can be cylindrical or prismatic, and the size can be adjusted according to actual needs, such as a cylindrical baffle column 107 with a diameter of 8mm to 12mm. The baffle column 107 is integrally formed with the intermediate cooling layer 101 to ensure its structural stability and reliability.

[0035] Reference Figure 3 To further optimize the coolant flow characteristics within the coolant channel 103, the coolant inlet 104 is oriented perpendicular to the direction of extension of the coolant channel 103. This effectively slows the coolant flow rate upon entering the channel 103, thereby improving the coolant flow stability throughout the channel 103. Furthermore, the coolant outlet 105 is oriented in the same direction as the channel 103, facilitating smooth coolant discharge and preventing backflow or eddy currents at the outlet, further improving heat dissipation efficiency and overall system stability.

[0036] Specifically, the specific dimensions of the coolant inlet 104 and the coolant outlet 105 can be adjusted according to actual needs. For example, for a circular interface with a diameter of 10 mm to 15 mm, the dimensions of the coolant inlet 104 and the coolant outlet 105 need to be smaller than the cross-sectional dimensions of the coolant channel 103 to ensure that the coolant can effectively fill the entire coolant channel 103.

[0037] Reference Figure 3 The intermediate cooling layer 101 is provided with an opening 108, and the coolant flow channel 103 bypasses the opening 108 of the intermediate cooling layer 101. The provision of openings 108 in the intermediate cooling layer 101 facilitates electrical connections between the circuit layers 102, ensuring that the electrical connections between the circuit layers 102 are not affected. At the same time, the design of the coolant flow channel 103 bypassing the opening 108 ensures the integrity of the coolant flow channel 103, preventing the cooling effect from being reduced due to the opening 108 and preventing coolant leakage. This ensures heat dissipation performance while meeting the connection requirements between the circuit layers 102.

[0038] Reference Figure 2To facilitate the fabrication of the coolant channel 103, a processing groove 109 is provided at one end of the intermediate cooling layer 101. This groove communicates with the coolant channel 103 and houses a heat exchange copper plate 110, which fits snugly within and seals the groove. The excellent thermal conductivity of the heat exchange copper plate 110 ensures efficient heat exchange between the coolant and the circuit layer 102.

[0039] Reference Figure 2 The heat exchange copper plate 110 is provided with a plurality of high-efficiency heat exchange areas 111. The high-efficiency heat exchange areas 111 correspond to the positions of the high-heat-generating electrical components on the circuit layer 102 located on the same side. A plurality of heat exchange copper pillars 112 are provided within the high-efficiency heat exchange areas 111. The heat exchange copper pillars 112 are integrally formed with the heat exchange copper plate 110, and each heat exchange copper pillar 112 is flush with the end surface away from the heat exchange copper plate 110. The heat exchange copper pillars 112 abut the corresponding high-heat-generating electrical components. The heat exchange copper pillars 112 can be designed as cylindrical or square pillars, with a thickness controlled between 2mm and 4mm. By providing a plurality of heat exchange copper pillars 112 in the high-efficiency heat exchange areas 111 on the heat exchange copper plate 110, a thermal bridge is formed, allowing the heat in the coolant flow channel 103 to be efficiently transferred to the high-heat-generating electrical components, thereby achieving precise heat dissipation.

[0040] Reference Figure 2 and Figure 4 , adjacent heat exchange copper pillars 112 are spaced apart, and the layout of each heat exchange copper pillar 112 corresponds to the position of the coolant flow channel 103. Considering the limited coverage area of ​​the coolant flow channel 103, by ensuring the clearance between adjacent heat exchange copper pillars 112 and aligning the layout of the heat exchange copper pillars 112 with the position of the coolant flow channel 103, the heat in the coolant flow channel 103 can be efficiently transferred to the heat exchange copper pillars 112, thereby cooling the high-heat-generating electrical components and avoiding local heat concentration.

[0041] Reference Figure 3 and Figure 4 A heat exchange copper tube 113 is provided on the side of the intermediate cooling layer 101 away from the heat exchange copper plate 110, and a diversion port 114 and a return port 115 are respectively provided on the coolant flow channel 103. The two ends of the heat exchange copper tube 113 are respectively connected to the diversion port 114 and the return port 115, and the heat exchange copper tube 113 is in contact with the high-heating electrical components on the circuit layer 102 on the same side. The heat exchange copper tube 113 serves as an additional heat dissipation channel. By making the heat exchange copper tube 113 contact with the high-heating electrical components on the circuit layer 102, the heat dissipation efficiency of the high-heating electrical components can be effectively improved. In addition, the design of the heat exchange copper tube 113 can also quickly conduct and dissipate the heat from the high-heating area inside the switching power supply module, cool the interior of the switching power supply module, avoid local overheating, and thus improve the uniformity and stability of the overall heat dissipation structure.

[0042] Reference Figure 3 and Figure 5 Specifically, the diversion port 114 is arranged near the coolant inlet 104, and the return port 115 is arranged near the coolant outlet 105. When the coolant enters the diversion port 114, the flow direction of the coolant is the same as the extension direction of the diversion port 114. When the coolant flows back to the coolant channel 103 through the return port 115, the flow direction is the same as the flow direction of the coolant inside the coolant channel 103. By arranging the diversion port 114 near the coolant inlet 104 and the return port 115 near the coolant outlet 105, it is possible to avoid the coolant flowing through the heat exchange copper tube 113 from affecting the temperature of the original coolant inside the coolant channel 103, thereby ensuring the stability of the temperature inside the coolant channel 103. In addition, by making the flow direction of the coolant the same as the extension direction of the diversion port 114 when the coolant enters the diversion port 114, it is possible to ensure that the coolant is quickly diverted after entering the coolant channel 103, thereby reducing the flow rate loss of the coolant. In addition, when the coolant is controlled to flow back to the coolant channel 103 through the return port 115, the flow direction is the same as the coolant flow direction inside the coolant channel 103, so that the coolant flows more smoothly and turbulence is avoided.

[0043] Reference Figure 5 In order to facilitate the processing and assembly of the switching power supply module and improve the convenience of equipment maintenance, the heat exchange copper tube 113 is detachably arranged on the intermediate cooling layer 101, and a connection structure for connecting the heat exchange copper tube 113 is provided at the diversion port 114 and the return port 115. Specifically, the connection structure includes a threaded sleeve 116 and a soft rubber sleeve 117. The threaded sleeve 116 is provided with an external thread. The side walls of the diversion port 114 and the return port 115 are provided with an internal thread that matches the threaded sleeve 116. The soft rubber sleeve 117 is sleeved on the threaded sleeve 116, and the soft rubber sleeve 117 is adapted to the heat exchange copper tube 113. The threaded sleeve 116 and the soft rubber sleeve 117 in the connection structure can realize a reliable connection between the heat exchange copper tube 113 and the diversion port 114 and the return port 115. Threaded sleeve 116 mates with the internal threads of diversion port 114 and return port 115 to ensure a secure connection, while soft rubber sleeve 117 effectively prevents coolant leakage and protects heat exchange copper tube 113 from mechanical damage. This design not only improves connection convenience but also enhances the sealing and reliability of the heat dissipation structure, thereby ensuring the efficient and stable operation of the entire heat dissipation system.

[0044] The implementation principle of the multi-layer collaborative heat dissipation structure of a switching power supply module with an asymmetric fluid channel in the embodiment of the present application is as follows: by optimizing the overall structural design of the coolant flow channel 103, setting multiple buffer zones 106 in the coolant flow channel 103, and adding flow blocking columns 107 in the buffer zones 106, the flow rate of the coolant in the buffer zones 106 can be significantly slowed down, so that the flow rate of the coolant in the entire coolant flow channel 103 remains quite stable, and the speed difference of the coolant in the high-speed zone and the low-speed zone is reduced, thereby avoiding excessive temperature differences between the high-speed zone and the low-speed zone. This design not only reduces the risk of local thermal stress concentration, but also improves the heat dissipation uniformity of the entire cooling system, thereby enhancing the long-term stability and reliability of the switching power supply module.

[0045] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A multi-layer cooperative heat dissipation structure for a switching power supply module with an asymmetric fluid channel, characterized by: The invention comprises a shell (100) and an intermediate cooling layer (101) arranged in the shell (100), wherein the upper and lower sides of the intermediate cooling layer (101) are both provided with circuit layers (102), a cooling liquid flow channel (103) is provided in the intermediate cooling layer (101), and the cooling liquid flow channel (103) is coiled and arranged in the intermediate cooling layer (101), and a cooling liquid inlet (104) and a cooling liquid outlet (105) in communication with the cooling liquid flow channel (103) are provided on the shell (100), and the cooling liquid flow channel (103) is provided with a plurality of buffer zones (106), wherein the channel width of the buffer zones (106) is greater than the channel width of the cooling liquid flow channel (103), and a baffle column (107) is provided in the middle position of the buffer zone (106) for slowing down the cooling liquid flow rate at the corresponding position, so that the cooling liquid flow rate in the entire cooling liquid flow channel (103) remains quite stable; A bevel is provided at a connection position between the buffer zone (106) and the coolant flow channel (103) for connecting the buffer zone (106) and the coolant flow channel (103); The liquid inlet direction of the cooling liquid inlet (104) is perpendicular to the extension direction of the cooling liquid flow channel (103), and the liquid outlet direction of the cooling liquid outlet (105) is the same as the extension direction of the cooling liquid flow channel (103); The cooling liquid flow channel (103) is respectively provided with a diversion port (114) and a return port (115), the diversion port (114) and the return port (115) are commonly connected to a heat exchange copper tube (113), and the heat exchange copper tube (113) is in contact with a high-heat-generating electrical component on the circuit layer (102); The diversion port (114) is arranged at a position close to the coolant inlet (104), and the return port (115) is arranged at a position close to the coolant outlet (105). When the coolant enters the diversion port (114), the flow direction of the coolant is the same as the extension direction of the diversion port (114). When the coolant flows back to the coolant flow channel (103) through the return port (115), the flow direction is the same as the flow direction of the coolant inside the coolant flow channel (103).

2. The multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel according to claim 1, characterized in that: The corner position of the coolant flow channel (103) is set to be in an arc shape.

3. The multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel according to claim 1, characterized in that: The intermediate cooling layer (101) is provided with an opening (108) for connecting the electrical appliances of each circuit layer (102), and the coolant flow channel (103) bypasses the opening (108) on the intermediate cooling layer (101).

4. The multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel according to claim 1, characterized in that: A processing groove (109) is provided at one end of the intermediate cooling layer (101), the processing groove (109) is communicated with the cooling liquid flow channel (103), a heat exchange copper plate (110) is provided in the processing groove (109), and the heat exchange copper plate (110) is adapted to the processing groove (109) and is used to seal the processing groove (109).

5. The multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel according to claim 4, characterized in that: A high-efficiency heat exchange area (111) is provided on the heat exchange copper plate (110), and a plurality of heat exchange copper columns (112) are provided in the high-efficiency heat exchange area (111). The heat exchange copper columns (112) are integrally formed with the heat exchange copper plate (110), and the end surface of each heat exchange copper column (112) away from the heat exchange copper plate (110) is flush, and adjacent heat exchange copper columns (112) are gap-matched. The layout of each heat exchange copper column (112) corresponds to the position of the coolant flow channel (103), and the heat exchange copper column (112) abuts against the high-heat-generating electrical component on the circuit layer (102) on the corresponding side.

6. The multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel according to claim 1, characterized in that: The heat exchange copper tube (113) is detachably arranged on the intermediate cooling layer (101), and the diversion port (114) and the return port (115) are both provided with connection structures for connecting the heat exchange copper tube (113).

7. The multi-layer cooperative heat dissipation structure of a switching power supply module with an asymmetric fluid channel according to claim 6, characterized in that: The connection structure comprises a threaded sleeve (116) and a soft rubber sleeve (117); the threaded sleeve (116) is provided with an external thread; the side walls of the diversion port (114) and the return port (115) are both provided with internal threads adapted to the threaded sleeve (116); the soft rubber sleeve (117) is sleeved on the threaded sleeve (116), and the soft rubber sleeve (117) is adapted to the heat exchange copper tube (113).

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