Production system, management device, and management method

Abstract

The invention provides a production system, a management device, and a management method, which facilitate management of a mounting ID of a production program and an inspection ID of an inspection program. The production system includes: a production line including a mounting device for mounting a component on a substrate and an inspection device for inspecting the substrate using an inspection program; and a management device that manages the production line using the production program. The production program includes information on a mounting ID for each component having mounting coordinates for the component. The inspection program contains information of an inspection ID for each component having inspection coordinates of the component. When the mounting ID of the production program is different from the inspection ID of the inspection program, the management device associates the mounting ID and the inspection ID on the basis of the degree of proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a production system, a management device, and a management method. Background Art

[0002] In the technical field related to a production system for mounting substrates, a production line as disclosed in Patent Document 1 is known. The production line is constructed by a plurality of mounting devices and inspection devices. Mounted substrates are produced by mounting components on substrates. The inspection device inspects the substrates on which components are mounted by the mounting device for position deviation of the components and the like.

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-141114

[0004] Each of the mounting devices is controlled based on a production program. The inspection device is controlled based on an inspection program. The production program and the inspection program each include an ID for identifying a component as a mounting ID and an inspection ID. Here, for the same component, sometimes the mounting ID in the production program is inconsistent with the inspection ID in the inspection program.

[0005] If the mounting ID and the inspection ID are inconsistent, when the inspection device outputs an inspection result of inspection failure for a component represented by a certain inspection ID, it is not clear which component of which mounting ID and which mounting device mounted the component. Therefore, conventionally, the program maker makes the program in such a way that the mounting ID and the inspection ID are made consistent, or performs an operation of investigating the correspondence between the mounting ID and the inspection ID after program production. Therefore, the management of the mounting ID in the production program and the inspection ID in the inspection program is cumbersome. Summary of the Invention

[0006] An object of the technology disclosed in this specification is to facilitate the management of the mounting ID in the production program and the inspection ID in the inspection program.

[0007] This specification discloses a production system. The production system includes: a production line including a mounting device that mounts components on a substrate and an inspection device that inspects the substrate using an inspection program; and a management device that manages the production line using a production program. The production program includes information on the mounting ID of each component having the mounting coordinates of the component, and the inspection program includes information on the inspection ID of each component having the inspection coordinates of the component. When the mounting ID in the production program is different from the inspection ID in the inspection program, the management device associates the mounting ID with the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID.

[0008] This specification discloses a management device. The management device manages a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program. The management device includes: a storage unit that stores a production program including information on mounting IDs of each component having mounting coordinates of the component; an information acquisition unit that acquires information on inspection IDs of each component having inspection coordinates of the component included in the inspection program; and a processing unit that, when the mounting ID in the production program is different from the inspection ID in the inspection program, associates the mounting ID with the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID.

[0009] This specification discloses a management method. The management method manages a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program. The management method includes: a step of acquiring information on mounting IDs of each component having mounting coordinates of the component included in the production program; a step of acquiring information on inspection IDs of each component having inspection coordinates of the component included in the inspection program; and a step of associating the mounting ID with the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID when the mounting ID in the production program is different from the inspection ID in the inspection program.

[0010] According to the technology disclosed in this specification, it is possible to facilitate the management of the mounting ID of the production program and the inspection ID of the inspection program. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a diagram showing a production system according to an embodiment. Figure 2 is a block diagram showing a production system according to an embodiment. Figure 3 is a block diagram showing a computer system according to an embodiment. Figure 4 is an explanatory diagram for explaining a production program and an inspection program according to an embodiment. Figure 5 is an explanatory diagram for explaining the process of component mounting and inspection according to the production program and the inspection program. Figure 6 is a diagram for explaining the data included in the production program. Figure 7 is a diagram for explaining the data included in the inspection program. Figure 8 is a schematic diagram showing a specific example for explaining the association between the mounting ID and the inspection ID. Figure 9 This is a diagram for explaining a determination method for the association between the mounting ID and the inspection ID. Figure 10 This is a diagram for explaining the function of the notification of the first candidate. Figure 11 This is a diagram for explaining the function of the notification of the second candidate. Figure 12 This is a flowchart showing the management method of the embodiment. Detailed Embodiment

[0012] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, but the present invention is not limited to the embodiments.

[0013] [Production System] Figure 1 This is a diagram showing the production system 1 of the embodiment. The production system 1 of the embodiment includes: a production line 6 including a mounting device 3 and an inspection device 4; and a management device 5. In Figure 1 the example, the production system 1 includes an inspection device 2, a mounting device 3, an inspection device 4, and a management device 5. The inspection device 2, the mounting device 3, and the inspection device 4 construct a production line 6 for electronic devices.

[0014] In the production line 6, one or more mounting devices 3 are provided. When multiple mounting devices 3 are provided, the mounting devices 3 are arranged in series. In Figure 1 the example shown, the production line 6 includes three mounting devices 3 arranged in series. The mounting device 3 includes a mounting device 3A, a mounting device 3B, and a mounting device 3C. The number of mounting devices 3 can also be one, two, or four or more.

[0015] In the embodiment, the substrate P on which a plurality of components C are mounted by the mounting device 3 is appropriately referred to as a mounted substrate Pm. The substrate P is conveyed in the production line 6. By conveying the substrate P in the production line 6, the mounted substrate Pm is produced. In the embodiment, the leading device of the production line 6 is the inspection device 2. The trailing device of the production line 6 is the inspection device 4. After the substrate P is carried into the inspection device 2, it is sequentially conveyed to each of the multiple mounting devices 3 (3A, 3B, 3C). The multiple mounting devices 3 (3A, 3B, 3C) sequentially mount the component C on the substrate P. The substrate P on which a plurality of components C are mounted in the mounting device 3 is carried out from the inspection device 4.

[0016] Before the substrate P is carried into the production line 6, paste solder is printed on the substrate P by a printer. The substrate P on which the paste solder is printed is carried into the inspection device 2. In addition, the illustration of the printer is omitted.

[0017] The inspection device 2 includes a solder paste inspection device (SPI: Solder Paste Inspection), and the solder paste inspection device inspects the printing state of the substrate P before mounting the component C.

[0018] The mounting device 3 mounts the component C on the substrate P printed with the paste solder.

[0019] The inspection device 4 includes a substrate appearance inspection device (AOI: Automated Optical Inspection), and the substrate appearance inspection device inspects the state of the substrate P (mounted substrate Pm) after mounting the component C. After the mounted substrate Pm is subjected to appearance inspection by the inspection device 4, it is heated in a reflow furnace. By heating the substrate P in the reflow furnace, the paste solder melts. The component C is soldered to the substrate P by the melted paste solder being cooled and solidified. In addition, the illustration of the reflow furnace is omitted.

[0020] The management device 5 includes a computer system. The management device 5 manages the production line 6. The management device 5 is communicably connected to the inspection device 2, the mounting device 3, and the inspection device 4 via the network NW, respectively.

[0021] The substrate P includes a printed wiring board (PWB: Printed Wiring Board). The component C includes an electronic component. The mounted substrate Pm includes a printed circuit board (PCB: Printed Circuit Board).

[0022] [Management device] Figure 2 is a block diagram showing the production system of the embodiment. As Figure 2 shown, the inspection device 2 includes a control device 20 and a detection device 21. The mounting device 3 includes a control device 30 and a mounting head 35. The inspection device 4 includes a control device 40 and a detection device 41.

[0023] The detection device 21 includes an imaging device that acquires an image of the substrate P. The detection device 21 has an optical system and an image sensor. The detection device 21 detects the printing state of the substrate P before mounting the component C. The control device 20 checks the printing state of the solder based on the image of the substrate P acquired by the detection device 21 and outputs the inspection result to the management device 5.

[0024] The mounting head 35 holds the component C supplied from the component supply device with a nozzle and mounts it on the substrate P. The mounting head 35 has a plurality of nozzles. The mounting head 35 can move between the supply position where the component C is supplied from the component supply device and the mounting position where the substrate P is disposed. The mounting head 35 holds the component C supplied to the supply position with a nozzle, and after moving to the mounting position, mounts the component C on the substrate P disposed at the mounting position. The component supply device is, for example, a tape feeder.

[0025] The detection device 41 includes an imaging device that acquires an image of the substrate P. The detection device 41 has an optical system and an image sensor. The detection device 41 detects the component mounting state of the mounted substrate Pm after the component C is mounted. The control device 40 uses the inspection program 12 (refer to Figure 4 ) to control the inspection process. The inspection program 12 is a computer program used for inspecting the mounted substrate Pm in the production line 6. The inspection program 12 includes information such as position coordinates, inspection parts, and inspection methods for each component C mounted on the mounted substrate Pm. The control device 40 inspects the mounting state of the component C based on the image of the mounted substrate Pm acquired by the detection device 41, and outputs the inspection result to the management device 5.

[0026] The management device 5 has an information acquisition unit 51, a storage unit 52, a processing unit 53, a mounting control unit 55, and a notification control unit 56.

[0027] The information acquisition unit 51 acquires the information of the inspection ID 70 (refer to Figure 7 ) for each component C included in the inspection program 12. The inspection ID 70 has the inspection coordinates 72 of the component C. The information acquisition unit 51 acquires the inspection ID 70 and the inspection coordinates 72 of this inspection ID from the control device 40 of the inspection device 4 via the network.

[0028] The storage unit 52 stores the production program 11 (refer to Figure 4 ). The storage unit 52 stores in advance the production program 11 made by the program maker before production. The production program 11 is a computer program used for the production of the mounted substrate Pm in the production line 6. The production program 11 includes data such as the component name of the component C mounted on the substrate P by the production line 6, the mounting coordinates, and the information of the component C. The production program 11 includes the information of the mounting ID 60 (refer to Figure 6 ) for each component C. The mounting ID 60 has the mounting coordinates 62 of the component C. The management device 5 manages the production line 6 using the production program 11.

[0029] The processing unit 53 performs the association process of the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12. The processing unit 53 acquires the information of the mounting ID 60 and the mounting coordinates 62 from the storage unit 52. The processing unit 53 acquires the information of the inspection ID 70 and the inspection coordinates 72 from the information acquisition unit 51. Based on the mounting coordinates 62 and the inspection coordinates 72, the processing unit 53 associates the mounting ID 60 and the inspection ID 70 for each component C. The association process will be described later.

[0030] The mounting control unit 55 causes the mounting device 3 to execute the production program 11. In the embodiment, a plurality of (three) mounting devices 3 sequentially perform component mounting on one substrate P. The mounting control unit 55 distributes the mounting operations specified in the production program 11 to each mounting device 3 according to the division data 13 described later. Each mounting device 3 sequentially executes the assigned mounting operations on the same substrate P.

[0031] The notification control unit 56 notifies the user (production manager or on-site operator) by outputting various information to the output device 7. Examples of the output device 7 include display devices such as liquid crystal displays and organic EL displays, lights, speakers, printers, etc., but the present invention is not limited thereto. For example, when the inspection device 4 outputs an inspection result of inspection defects, the management device 5 notifies the information corresponding to the inspection result through the notification control unit 56. The production manager or on-site operator who receives the notification can grasp the content of the notification through the output device 7.

[0032] [Computer System] Figure 3 It is a block diagram showing the computer system 1000 of the embodiment. The above-mentioned management device 5 includes the computer system 1000. The computer system 1000 has a processor 1001 such as a CPU (Central Processing Unit), a main memory 1002 including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage device 1003, and an interface 1004 including an input / output circuit. The functions of the management device 5 are stored in the storage device 1003 as a computer program. The storage unit 52 of the management device 5 is implemented by the storage device 1003. The processor 1001 reads the computer program from the storage device 1003 and expands it in the main memory 1002, and executes various processes according to the computer program. The computer program causes the processor 1001 to function as the information acquisition unit 51, the processing unit 53, the mounting control unit 55, and the notification control unit 56. In addition, the computer program can also be transmitted to the computer system 1000 through the network NW.

[0033] In addition, the control device 20 of the inspection device 2, the control device 30 of the mounting device 3, and the control device 40 of the inspection device 4 are also implemented by the same hardware structure as the Figure 3 computer system 1000 shown. The control device 30 acquires the division data 13 indicating the mounting operations assigned to the mounting device 3 to which it belongs among all the mounting operations specified in the production program 11 from the management device 5. The control device 30 controls the component mounting operations of the mounting device 3 based on the division data 13.

[0034] (Production Program and Inspection Program) Figure 4 FIG. is an explanatory diagram of the production program 11 and the inspection program 12 of the embodiment. Figure 5 FIG. is an explanatory diagram of the process of component mounting and inspection according to the production program 11 and the inspection program 12.

[0035] As Figure 4 shown, based on the design data 10 of the electronic circuit board (mounting board Pm) to be produced, the production program 11 and the inspection program 12 are prepared in advance. That is, the production program 11 and the inspection program 12 respectively specify the component mounting steps and the inspection steps for the same production object.

[0036] The production program 11 determines each component C included in the design data 10 and specifies the content of the mounting operation for each component C. The content of the mounting operation includes the mounting position (coordinates), mounting angle, etc. of the component C on the board P. As described above, the management device 5 distributes the mounting operations specified in the production program 11 to each of the mounting devices 3 constituting the production line 6 so that they share the mounting operations. The management device 5 creates the division data 13 distributed from the production program 11 to each mounting device 3. In Figure 4 the example, the management device 5 creates the division data 13A, 13B, and 13C for the three mounting devices 3A, 3B, and 3C, respectively. All the data of the mounting operation of the component C specified in the production program 11 is included in any one of the division data 13A, 13B, and 13C.

[0037] The division data 13A includes data related to the mounting operations of the component group G1 among all the components C specified in the production program 11. In Figure 4 it, the components C belonging to the component group G1 are represented by circular marks. The division data 13B includes data related to the mounting operations of the component group G2 among all the components C specified in the production program 11. In Figure 4 it, the components C belonging to the component group G2 are represented by rectangular marks. The division data 13C includes data related to the mounting operations of the component group G3 among all the components C specified in the production program 11. In Figure 4Among them, the component C belonging to the component group G3 is represented by a triangular mark. In this example, the sum of the component group G1, the component group G2, and the component group G3 corresponds to all the components C specified in the production program 11.

[0038] As Figure 5 shown, the mounting device 3A performs the mounting operation of the component group G1 on the unmounted substrate P according to the divided data 13A. The mounting device 3B performs the mounting operation of the component group G2 on the substrate P on which the component group G1 has been mounted according to the divided data 13B. The mounting device 3C performs the mounting operation of the component group G3 on the substrate P on which the component groups G1 and G2 have been mounted according to the divided data 13C. As a result, all the components C specified in the production program 11 are mounted on the substrate P.

[0039] As Figure 4 shown, the inspection program 12 identifies each component C included in the design data 10 and specifies the content of the inspection operation for each component C. The content of the inspection operation includes the inspection position (coordinates) of the component C on the substrate P, inspection items, etc. Examples of inspection items may include missing components, offsets (including position offsets and angular offsets), whether the polarity is correct, front-back inversion, non-welding, formation of bridges, whether the solder volume is appropriate, etc. The inspection program 12 is stored in the storage unit (storage device 1003) of the control device 40 of the inspection device 4. The inspection program 12 specifies the inspection steps for the same components C as those specified in the production program 11. As Figure 5 shown, the inspection device 4 inspects each component C including the component groups G1, G2, and G3 on the mounting substrate Pm on which the mounting of the component groups G1, G2, and G3 has been completed, according to the inspection program 12.

[0040] The inspection device 4 determines whether each component C is inspected as good (OK) or bad (NG). Being inspected as good means that the component C being inspected falls within the allowable range in the inspection items specified by the inspection program 12. Being inspected as bad means that the component C being inspected is outside the allowable range in the inspection items specified by the inspection program 12. The inspection device 4 sends the inspection results according to the inspection program 12 to the management device 5. When the inspection results include inspection failures, the management device 5 notifies the inspection failure through the notification control unit 56.

[0041] Figure 6 is a diagram for explaining the data included in the production program 11. Figure 7 is a diagram for explaining the data included in the inspection program 12.

[0042] As Figure 6 shown, the production program 11 includes information on the mounting ID 60 of each component C. In the production program 11, each component C is identified by the mounting ID 60.Figure 6 The data of the production program 11 is represented in matrix form, with one row corresponding to a component C represented by a mounting ID 60.

[0043] The mounting ID 60 is unique identification information assigned to each component C, represented by a string of a predetermined number of digits, for example. One mounting ID 60 represents one component C. The mounting ID 60 has a component name 61, mounting coordinates 62 of the component C, and a component size 63. The component name 61 includes the name, product number, model number, etc. assigned to the component C identified by the mounting ID 60. The mounting coordinates 62 are coordinate information indicating the mounting position on the substrate P. The mounting coordinates 62 are represented by coordinate values relative to a reference point set on the substrate P in a coordinate system (referred to as the substrate coordinate system) set on the surface of the substrate P, for example. The component size 63 is information on the size of the component C.

[0044] The production program 11 includes association ID information 64 indicating an inspection ID 70 associated with the mounting ID 60. The association ID information 64 is assigned to each mounting ID 60 separately. Details of the association ID information 64 will be described later.

[0045] As Figure 7 shown, the inspection program 12 includes information on the inspection ID 70 for each component C. In the inspection program 12, each component C is identified by the inspection ID 70. Figure 7 The data of the inspection program 12 is represented in matrix form, with one row corresponding to a component C represented by an inspection ID 70.

[0046] The inspection ID 70 is unique identification information for each part that is the object of the inspection operation, represented by a string of a predetermined number of digits, for example. The parts that are the object of the inspection operation include all the components C mounted on the mounting substrate Pm. Therefore, an inspection ID 70 is assigned to each component C, and one inspection ID 70 represents one component C. The inspection ID 70 has a component name 71, inspection coordinates 72 of the component C, and detailed data 73. The component name 71 includes the name, product number, model number, etc. assigned to the component C identified by the inspection ID 70. The inspection coordinates 72 are coordinate information indicating the inspection position on the substrate P. The inspection coordinates 72 are represented by coordinate values relative to a reference point set on the substrate P in a coordinate system (referred to as the substrate coordinate system) set on the surface of the substrate P, for example. The inspection coordinates 72 are the coordinates of the position where the component C identified by the inspection ID 70 is mounted. The detailed data 73 is a general term for the detailed information on the inspection of the component C identified by the inspection ID 70. The detailed data 73 includes information on which parts of the component C are inspected for which inspection items.

[0047] Thus, in the production program 11, each component C is identified by the mounted ID60. In the inspection program 12, each component C is identified by the inspection ID70. In terms of management, ideally, the mounted ID60 and the inspection ID70 representing the same component C are the same string. However, the mounted ID60 and the inspection ID70 do not have to be the same. For example, when the manufacturer of the mounting device 3 is different from the manufacturer of the inspection device 4, or when the production times of the production program 11 and the inspection program 12 are different, etc., it is easy for the mounted ID60 and the inspection ID70 representing the same component C to be inconsistent. When the manufacturer of the mounting device 3 is different from the manufacturer of the inspection device 4, due to differences in program specifications, there are cases where the same ID cannot be assigned. When the mounted ID60 and the inspection ID70 representing the same component C are inconsistent, for example, when an inspection defect is output from the inspection device 4 for any inspection ID70, it is impossible to identify which mounted ID60 the component C represented by the inspection ID70 corresponds to based on the ID.

[0048] Since the inspection defect may be caused by some abnormality in the production line 6, through the maintenance of the operator, etc., it is possible to achieve cause determination and elimination of the abnormal cause. The abnormal cause includes that it is difficult to directly determine the mounting device 3 on which the component C that has become the inspection defect is mounted based on the inspection ID70 due to the inconsistency between the mounted ID60 and the inspection ID70 representing the same component C, and the cause determination becomes cumbersome.

[0049] Therefore, in the embodiment, when the mounted ID60 of the production program 11 is different from the inspection ID70 of the inspection program 12, the management device 5 pre-associates the mounted ID60 and the inspection ID70 before the start of the mounting operation. Specifically, the management device 5 obtains the information of the inspection ID70 included in the inspection program 12 from the inspection device 4 through the information acquisition unit 51. And, as Figure 6 shown, the management device 5 associates by assigning the associated ID information 64 of the inspection ID70 with a high possibility of representing the same component C to each mounted ID60 of the production program 11. The associated ID information 64 includes one or more inspection ID70s.

[0050] Thus, during production, when the inspection device 4 outputs an inspection defect for a certain inspection ID 70, the management device 5 determines the mounting ID 60 associated with the inspection ID 70 for which the inspection defect has been output. That is, the management device 5 extracts, from among the respective mounting IDs 60 of the production program 11, the mounting ID 60 to which the following associated ID information 64 has been assigned, where the associated ID information 64 includes the inspection ID 70 for which the inspection defect has been output. Thus, even when the mounting ID 60 and the inspection ID 70 representing the same component C do not match, it is possible to determine the mounting ID 60 corresponding to the component C that has become an inspection defect. Based on the determined mounting ID 60, it is possible to determine which divided data 13 the component C that has become an inspection defect is included in, that is, which mounting device 3 has mounted it.

[0051] (Detailed description of the association) Next, the details of the association between the mounting ID 60 and the inspection ID 70 will be described. In the embodiment, the management device 5 associates the mounting ID 60 with the inspection ID 70 based on the proximity between the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70. The association process is performed by the processing unit 53 of the management device 5.

[0052] Figure 8 is a schematic diagram showing a specific example for explaining the association between the mounting ID 60 and the inspection ID 70. Figure 9 is a diagram for explaining the determination method of the association between the mounting ID 60 and the inspection ID 70.

[0053] Figure 8 Schematically shows the arrangement of components C on the substrate P (mounting substrate Pm). In Figure 8 shows four components C, namely components C1, C2, C3, and C4. The mounting IDs 60 of components C1, C2, C3, and C4 are respectively set as mounting ID 601, mounting ID 602, mounting ID 603, and mounting ID 604. The inspection IDs 70 of components C1, C2, C3, and C4 are respectively set as inspection ID 701, inspection ID 702, inspection ID 703, and inspection ID 704.

[0054] Figure 9 shows in Figure 8 the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70 shown in. In Figure 9 the mounting coordinates 62 of the mounting ID 601 are set as mounting coordinates 621. The inspection coordinates 72 of inspection IDs 701, 702, 703, and 704 are respectively set as inspection coordinates 721, inspection coordinates 722, inspection coordinates 723, and inspection coordinates 724.

[0055] The mounting coordinates 62 of mounting ID60 and the inspection coordinates 72 of inspection ID70 for the same component C respectively represent the positions of the same component C on the same substrate P. Therefore, ideally, for the inspection coordinates 72 of an inspection ID70, there should be one mounting ID60 with the same coordinate value for the mounting coordinates 62. For example, if we focus on component C1, the mounting coordinates 621 of mounting ID601 should be the same as the inspection coordinates 721 of inspection ID701. However, as Figure 9 shown, strictly speaking, for the same component C1, there may be a case where the mounting coordinates 621 are different from the inspection coordinates 721.

[0056] For example, assume that according to the specifications of production program 11, the mounting coordinates 621 are set to the coordinates corresponding to the geometric center of component C1. On the other hand, according to the specifications of inspection program 12, the inspection coordinates 721 are set to the coordinates corresponding to the position of a specific corner of component C1. Although the mounting coordinates 621 and the inspection coordinates 721 represent the position of the same component C1, the coordinate values are different. In this case, even if we search for pairs of mounting ID60 and inspection ID70 with the same coordinate value, such pairs cannot be found.

[0057] Therefore, the processing unit 53 of the management device 5 associates the inspection ID70 with the closest inspection coordinates 72 to the mounting coordinates 62 of the targeted mounting ID60 to the targeted mounting ID60. In the embodiment, the processing unit 53 can not only associate the inspection ID70 with the closest inspection coordinates 72 to the targeted mounting ID60, but also associate the inspection ID70 with the inspection coordinates 72 around the mounting coordinates 62 to the targeted mounting ID60.

[0058] Specifically, the processing unit 53 sets a determination range DR centered on the mounting coordinates 62 of the targeted mounting ID60. The processing unit 53 associates the inspection ID70 with the inspection coordinates 72 included in the determination range DR to the targeted mounting ID60.

[0059] In Figure 9 the example, the determination range DR centered on the mounting coordinates 621 of mounting ID601 is indicated by a double-dashed line. In the embodiment, the management device 5 sets the determination range DR according to the component size 63. That is, the processing unit 53 sets the radius of the determination range DR according to the component size 63. The processing unit 53 sets the range obtained by adding a predetermined margin to the component size 63 of the targeted mounting ID601 (refer to Figure 6 ) as the radius of the determination range DR. The processing unit 53 processes according to the component size 63, making the determination range DR wider as the component size 63 is larger and making the determination range DR narrower as the component size 63 is smaller.

[0060] When there are multiple inspection coordinates 72 within the determination range DR centered on the mounting coordinate 62, the management device 5 associates the inspection ID 70 with the inspection coordinate 72 closest to the mounting coordinate 62 as the first candidate K1. The management device 5 associates the inspection IDs 70 other than the first candidate K1 that have inspection coordinates 72 within the determination range DR as the second candidate K2. When there are multiple inspection IDs 70 other than the first candidate K1, the management device 5 associates the multiple inspection IDs 70 as the second candidate K2. When only one inspection coordinate 72 is included within the determination range DR, the management device 5 associates the inspection ID 70 having this inspection coordinate 72 as the first candidate K1 with the mounting ID 60.

[0061] In Figure 9 the example of, within the determination range DR centered on the mounting coordinate 621 of the mounting ID 601, the inspection coordinate 721, the inspection coordinate 723, and the inspection coordinate 724 are included. The inspection coordinate 722 is outside the determination range DR. The positional relationship of each coordinate is from near to far in the order of the inspection coordinate 721, the inspection coordinate 724, and the inspection coordinate 723 with respect to the mounting coordinate 621. That is, the respective distances L between the mounting coordinate 621 and the inspection coordinate 721, the inspection coordinate 724, and the inspection coordinate 723 are from small to large in the order of the inspection coordinate 721, the inspection coordinate 724, and the inspection coordinate 723. Therefore, in Figure 9 the example of, the processing unit 53 associates the inspection ID 701 having the inspection coordinate 721 as the first candidate K1 with the mounting ID 601. Thus, the mounting ID 601 and the inspection ID 701 representing the same component C1 are correctly associated. The processing unit 53 also associates the inspection ID 703 having the inspection coordinate 723 and the inspection ID 704 having the inspection coordinate 724 as the second candidate K2 with the mounting ID 601. The processing unit 53 does not associate the inspection ID 702 having the inspection coordinate 722 with the mounting ID 601.

[0062] In addition, when there are multiple inspection IDs 70 having the inspection coordinate 72 closest to the mounting coordinate 62, any one of the inspection IDs 70 is associated as the first candidate K1. The selection criterion in this case can, for example, use other information possessed by the mounting ID 60 and the inspection ID 70, or the inspection ID 70 to be selected as the first candidate K1 can be based on the user's input operation.

[0063] Furthermore, when there are multiple second candidates K2 within the determination range DR, the management device 5 numbers the multiple second candidates K2 in the order from near to far from the mounting ID 60 (the mounting coordinate 62) associated with the first candidate K1. In Figure 9In the example, the inspection ID 701 is associated with the mounting ID 601 as the first candidate K1, and the inspection ID 703 and the inspection ID 704 are associated with the mounting ID 601 as the second candidate K2. Also, by comparing the respective distances L from the mounting coordinate 621 of the mounting ID 601 to the inspection coordinate 723 of the inspection ID 703 and the inspection coordinate 724 of the inspection ID 704, it can be seen that they are in the order of the inspection ID 704 and the inspection ID 703 from near to far. Therefore, the management device 5 associates the inspection ID 704 with the mounting ID 601 as the second candidate K2 of the first number, and associates the inspection ID 703 with the mounting ID 601 as the second candidate K2 of the second number.

[0064] As a result of making such an association determination, as Figure 6 shown, the processing unit 53 assigns the information of one inspection ID 70 that becomes the first candidate K1 and the information of one or more inspection IDs 70 that become the second candidate K2 as the association ID information 64 to the mounting ID 60 in the production program 11. Thus, the mounting ID 60 is associated with each inspection ID 70 that becomes the first candidate K1 and the second candidate K2.

[0065] By performing the association in advance, thus as Figure 5 shown, if an inspection failure is output for a certain inspection ID 70 from the inspection device 4 during the operation of the production line 6, the management device 5 obtains the mounting ID 60 associated with the inspection ID 70 as the first candidate K1 or the second candidate K2 from the production program 11.

[0066] When the inspection device 4 outputs an inspection failure for the inspection ID 70, the management device 5 makes a notification regarding the mounting ID 60 associated with the inspection ID 70 for which the inspection failure has occurred. The management device 5 makes the notification by outputting information to the output device 7 by the notification control unit 56.

[0067] In the embodiment, when the inspection device 4 outputs an inspection failure for the inspection ID 70, the management device 5 separately notifies the mounting ID 60 associated with the inspection ID 70 as the first candidate K1 for which the inspection failure has occurred and the mounting ID 60 associated with the inspection ID 70 as the second candidate K2 for which the inspection failure has occurred. The management device 5 explicitly notifies by the notification control unit 56 that one mounting ID 60 associated with the inspection ID 70 for which the inspection failure has occurred as the first candidate K1 is the first candidate K1. The management device 5 explicitly notifies by the notification control unit 56 that one or more mounting IDs 60 associated with the inspection ID 70 for which the inspection failure has occurred as the second candidate K2 are the second candidate K2. Regarding the mounting ID 60 associated with the inspection ID 70 for which the inspection failure has occurred as the second candidate K2, the management device 5 notifies the mounting ID 60 together with the number assigned in the order from near to far from the mounting ID 60. For example, assumeFigure 9 The inspection ID 703 shown becomes a defective inspection. The inspection ID 703 is the second candidate K2 of the second unit equipped with the mounting ID 601. Therefore, the management device 5 notifies the mounting ID 601 together with the number "2", thereby indicating that it is the second candidate K2 of the second unit farther than the inspection ID 704. In addition, as Figure 8 shown, the inspection ID 703 is the first candidate K1 of the mounting ID 603. Therefore, when the inspection ID 703 becomes a defective inspection, the management device 5 indicates that the mounting ID 603 is the first candidate K1.

[0068] Figure 10 is a diagram illustrating the function of the notification of the first candidate K1. Figure 11 is a diagram illustrating the function of the notification of the second candidate K2.

[0069] As Figure 10 shown, it is assumed that the inspection ID 70 indicating a certain component C1 becomes a defective inspection. The management device 5 notifies the inspection ID 70 that has become a defective inspection as one mounting ID 60 associated with the first candidate K1. Thus, the operator of the production line 6 can determine the mounting device 3 on which the component C1 that has become a defective inspection is actually mounted based on the mounting ID 60 associated with the first candidate K1. For example, when the component C1 (indicated by hatched lines) is mounted on the mounting device 3B, the operator can investigate whether the cause of the defective inspection lies in the mounting device 3B. If the cause lies in the mounting device 3B, the operator performs maintenance on the mounting device 3B or resets the mounting conditions (such as the speed of the mounting operation of the mounting head 35) of the mounting device 3B.

[0070] It is also considered that the cause of the defective inspection of the component C1 lies in the mounting operation of the component C mounted around the component C1. In Figure 11 it shows an example in which after the component C1 is mounted by the mounting device 3B, the component C3 is mounted around the component C1 by the mounting device 3C. Here, it is assumed that there is no abnormality in the mounting of the component C1 by the mounting device 3B. At the time when the component C1 is mounted by the mounting device 3B, the component C1 is mounted in an appropriate state at an appropriate position. Then, when the component C3 is mounted by the mounting device 3C, for example, the substrate P sometimes undergoes a slight bending deformation or vibration, and due to the influence of the displacement of the substrate P, a position shift of the component C1 occurs. As a result, when the inspection is performed by the inspection device 4 after the components are mounted, a defective inspection is output for the inspection ID 70 indicating the component C1. In such a case, since the cause lies in the mounting operation of the component C3 (indicated by hatched lines) by the mounting device 3C, the abnormal cause cannot be determined even if the mounting device 3B is investigated.

[0071] In an embodiment, an operator can determine the mounting device 3 on which a component C is mounted, which is disposed near the component C that has become a defective inspection, based on the mounting ID 60 associated with the second candidate K2. That is, in Figure 11 In the case of, based on the inspection ID 70 associated with the mounting ID 60 of the component C1 as the second candidate K2, the mounting device 3C that mounts the component C3 can be determined. By resetting the mounting conditions (such as the speed of the mounting operation of the mounting head 35) of the mounting device 3C or performing maintenance on the mounting device 3C, the operator can prevent the positional deviation of the component C1 caused by the influence of the mounting operation of the component C3.

[0072] As described above, in the embodiment, through the association of the first candidate K1, the mounting ID 60 of the component C that has become a defective inspection and the mounting device 3 on which the component C is mounted can be quickly determined. And through the association of the second candidate K2, the mounting ID 60 of the peripheral component that may affect the component C that has become a defective inspection and the mounting device 3 on which the peripheral component is mounted can be quickly determined.

[0073] [Management Method] Figure 12 is a flowchart showing the management method of the embodiment. The management method of the embodiment is a management method for managing the production line 6, and the production line 6 includes a mounting device 3 that mounts the component C on the substrate P and an inspection device 4 that inspects the substrate P using the inspection program 12. The management method is implemented by the management device 5 of the embodiment. In Figure 12 the production program 11 is pre-stored in the storage unit 52 of the management device 5, and the inspection program 12 is pre-stored in the control device 40 (storage device 1003) of the inspection device 4.

[0074] First, information on the inspection ID 70 of each component C having the inspection coordinate 72 of the component C included in the inspection program 12 is obtained (step S1). The information acquisition unit 51 of the management device 5 obtains, by communication through the network, information on each inspection ID 70 included in the inspection program 12 and the inspection coordinate 72 of the inspection ID 70. The information acquisition unit 51 outputs the obtained information to the processing unit 53.

[0075] Information on the mounting ID 60 of each component C having the mounting coordinate 62 of the component C included in the production program 11 is obtained (step S2). The processing unit 53 of the management device 5 reads out the production program 11 from the storage unit 52 and obtains information on each mounting ID 60 included in the production program 11 and the mounting coordinate 62 of the mounting ID 60. In addition, either step S1 or step S2 can be implemented first.

[0076] When the mounting ID60 of the production program 11 is different from the inspection ID70 of the inspection program 12, the association between the mounting ID60 and the inspection ID70 is performed based on the proximity between the mounting coordinates 62 of the mounting ID60 and the inspection coordinates 72 of the inspection ID70 (step S3). The processing unit 53 of the management device 5 sets a determination range DR centered on the mounting coordinates 62 for each mounting ID60, and associates the inspection ID70 whose inspection coordinates 72 are included in the determination range DR with the mounting ID60. The processing unit 53 associates the inspection ID70 having the inspection coordinates 72 closest to the mounting coordinates 62 within the determination range DR as the first candidate K1. The processing unit 53 associates the inspection ID70 other than the first candidate K1 having the inspection coordinates 72 within the determination range DR as the second candidate K2. When there are multiple second candidates K2, the processing unit 53 numbers each second candidate K2 in the order from the closest to the mounting coordinates 62 of the mounting ID60. The processing unit 53 performs the association by attaching the inspection ID70 that becomes the first candidate K1 and the inspection ID70 that becomes the second candidate K2 as the associated ID information 64 to the data of the mounting ID60 of the production program 11, respectively. In addition, when the mounting ID60 and the inspection ID70 are the same, the processing unit 53 regards the two as IDs representing the same component C.

[0077] Using the above steps S1 to S3, the association between the mounting ID60 and the inspection ID70 is completed. Steps S1 to S3 are performed as preparatory operations before starting production on the production line 6.

[0078] After steps S1 to S3, the production of the production line 6 is started (step S4). The management device 5 distributes the divided data 13 of the production program 11 to each mounting device 3 through the installation control unit 55 to start the mounting operation. The inspection device 2 inspects the substrate P after solder printing is completed. The mounting device 3A mounts the first component group G1 on the substrate P that has completed the printing inspection according to the divided data 13A. The mounting device 3B mounts the second component group G2 on the substrate P that has completed the mounting of the first component group G1 according to the divided data 13B. The mounting device 3C mounts the third component group G3 on the substrate P that has completed the mounting of the second component group G2 according to the divided data 13C. The inspection device 4 performs an appearance inspection of the mounted substrate Pm on the component C represented by each inspection ID70 according to the inspection program 12. The inspection device 4 generates an inspection result of good inspection or bad inspection for each inspection ID70 and sends the generated inspection result to the management device 5.

[0079] The management device 5 determines whether the inspection result of the inspection device 4 includes a bad inspection (step S5).

[0080] In the case where inspection defects are not included (step S5 is "No"), the management device 5 determines that the production of one substrate P has been completed, and performs control such as unloading the substrate P from the production line 6 (inspection device 4). Then, the management device 5 determines whether the production of the substrate P has been completed (step S6). When the production of all the substrates P planned for production has been completed (step S6 is "Yes"), the management device 5 ends the production. When the production of all the substrates P planned for production has not been completed (step S6 is "No"), the management device 5 continues the production and performs the determination process of step S5 on the inspection result of the next substrate Pm to be mounted.

[0081] In the case where it is determined in step S5 that inspection defects are included (step S5 is "Yes"), the management device 5 notifies, through the notification control unit 56, the mounting ID 60 associated with the inspection ID 70 that has become an inspection defect (step S7). At this time, the management device 5 can temporarily stop part or all of the production operation of the production line 6 through the mounting control unit 55. The management device 5 separately notifies the mounting ID 60 associated with the inspection ID 70 that has become an inspection defect as the first candidate K1 and the mounting ID 60 associated with the inspection ID 70 that has become an inspection defect as the second candidate K2. The management device 5 also notifies the mounting ID 60 associated with the second candidate K2 of the number of the second candidate K2 assigned in the order of proximity to the mounting ID 60 (mounting coordinates 62). As a result, the operator can study countermeasures for determining the cause of the inspection defect and eliminating the cause. Then, when the management device 5 receives an instruction to restart production from the operator, it returns the process to step S4 and restarts the production of the production line 6.

[0082] [Effect] As described above, according to the embodiment, the production system 1 includes: a production line 6 including a mounting device 3 for mounting a component C on a substrate P and an inspection device 4 for inspecting the substrate P using an inspection program 12; and a management device 5 for managing the production line 6 using a production program 11. The production program 11 includes information of the mounting ID 60 of each component C having the mounting coordinates 62 of the component C, and the inspection program 12 includes information of the inspection ID 70 of each component C having the inspection coordinates 72 of the component C. When the mounting ID 60 of the production program 11 is different from the inspection ID 70 of the inspection program 12, the management device 5 associates the mounting ID 60 with the inspection ID 70 based on the proximity between the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70. Here, even when the mounting ID 60 of the production program 11 is inconsistent with the inspection ID 70 of the inspection program 12, among the mounting ID 60 and the inspection ID 70 representing the same component C, the mounting coordinates 62 and the inspection coordinates 72 are the same or approximate. Therefore, the mounting ID 60 and the inspection ID 70 representing the same component C can be associated. As a result, even if the program maker does not make the program in such a way that one of the mounting ID 60 and the inspection ID 70 is consistent with the other, the management device 5 can perform the association afterwards. In addition, without the need to perform an operation of investigating the correspondence between the two after program production, the management device 5 can perform automatic association. As a result, the management of the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 can be facilitated.

[0083] In addition, when the inspection device 4 outputs an inspection defect for the inspection ID 70, the management device 5 issues a notification regarding the mounting ID 60 associated with the inspection ID 70 that has become an inspection defect. Thus, based on the mounting ID 60 of the component C represented by the inspection ID 70 that has become an inspection defect, it is possible to easily identify the mounting device 3 on which the component C that has become an inspection defect is mounted. As a result, the operation of determining the cause of the inspection defect can be facilitated.

[0084] In addition, when there are multiple inspection coordinates 72 within the determination range DR centered on the mounting coordinate 62, the management device 5 associates the inspection ID 70 of the inspection coordinate 72 closest to the mounting coordinate 62 as the first candidate K1, and associates the inspection ID 70 other than the first candidate K1 that has an inspection coordinate 72 within the determination range DR as the second candidate K2. Thereby, using the inspection ID 70 of the first candidate K1, it is possible to easily identify the mounting device 3 on which the component C that has become a defective inspection is mounted. Using the inspection ID 70 of the second candidate K2, it is possible to easily identify the mounting device 3 of the peripheral component that may have affected the component C that has become a defective inspection and caused the cause of the defective inspection. In addition, in the embodiment, when the inspection device 4 outputs a defective inspection for the inspection ID 70, the management device 5 separately notifies the mounting ID 60 associated with the inspection ID 70 that has become a defective inspection as the first candidate K1 and the mounting ID 60 associated with the inspection ID 70 that has become a defective inspection as the second candidate K2. As a result, the operator can separately grasp the first candidate K1 and the second candidate K2, so that it is possible to set a priority order corresponding to the likelihood of the cause of the defective inspection in the entire production line 6 and determine the cause. As a result, the management and cause determination when a defective inspection occurs become easier.

[0085] In addition, in the embodiment, when there are multiple second candidates K2 within the determination range DR, the management device 5 assigns numbers to the multiple second candidates K2 in the order from the closest to the mounting ID 60 associated with the first candidate K1. Thereby, for the peripheral components (i.e., the second candidates K2) that may have affected a certain component C and caused the cause of the defective inspection, by determining the order of proximity, it is possible to grasp the degree of the likelihood of causing the influence. As a result, it becomes easy to determine the cause of the occurrence of the defective inspection.

[0086] In addition, the production program 11 includes information on the component size 63 of the component C determined by the mounting ID 60, and the management device 5 sets the determination range DR according to the component size 63. Thereby, in the case where small components C are dense and in the case where large components C are arranged, it is possible to set the determination range DR that does not unnecessarily increase the number of inspection IDs 70 that become the first candidate K1 and the second candidate K2.

[0087] According to an embodiment, a management device 5 manages a production line 6 including a mounting device 3 that mounts a component C on a substrate P and an inspection device 4 that inspects the substrate P using an inspection program 12, and includes: a storage unit 52 that stores a production program 11 including information on a mounting ID 60 of each component C having a mounting coordinate 62 of the component C; an information acquisition unit 51 that acquires information on an inspection ID 70 of each component C having an inspection coordinate 72 of the component C included in the inspection program 12; and a processing unit 53 that, when the mounting ID 60 in the production program 11 is different from the inspection ID 70 in the inspection program 12, associates the mounting ID 60 with the inspection ID 70 based on the proximity between the mounting coordinate 62 of the mounting ID 60 and the inspection coordinate 72 of the inspection ID 70. Thus, as described above, it is possible to facilitate the management of the mounting ID 60 in the production program 11 and the inspection ID 70 in the inspection program 12.

[0088] According to an embodiment, a management method manages a production line 6 including a mounting device 3 that mounts a component C on a substrate P and an inspection device 4 that inspects the substrate P using an inspection program 12, and includes: a step S2 of acquiring information on a mounting ID 60 of each component C having a mounting coordinate 62 of the component C included in the production program 11; a step S1 of acquiring information on an inspection ID 70 of each component C having an inspection coordinate 72 of the component C included in the inspection program 12; and a step S3 of associating the mounting ID 60 with the inspection ID 70 based on the proximity between the mounting coordinate 62 of the mounting ID 60 and the inspection coordinate 72 of the inspection ID 70 when the mounting ID 60 in the production program 11 is different from the inspection ID 70 in the inspection program 12. Thus, as described above, it is possible to facilitate the management of the mounting ID 60 in the production program 11 and the inspection ID 70 in the inspection program 12.

[0089] [Other embodiments] In the above embodiment, an example is shown in which the first candidate K1 and the second candidate K2 are respectively associated with the mounting ID 60, but only the first candidate K1 may be associated. In this case, there is no need to set a determination range DR. The management device 5 may associate the inspection ID 70 having the inspection coordinate 72 closest to the mounting coordinate 62 of the mounting ID 60 with the mounting ID 60.

[0090] In the above embodiment, an example is shown in which when the inspection device 4 outputs an inspection defect for the inspection ID 70, the management device 5 acquires the mounting ID 60 associated with the inspection ID 70 that has become an inspection defect, but the inspection device 4 may also perform processing to acquire the mounting ID 60. In this case, the inspection device 4 may also acquire the production program 11 from the management device 5, extract the mounting ID 60 associated with the inspection ID 70 that has become an inspection defect, and output it to or notify the management device 5. Description of Reference Numerals

[0091] 1 Production system, 2 Inspection device, 3, 3A, 3B, 3C Mounting device, 4 Inspection device, 5 Management device, 6 Production line, 7 Output device, 10 Design data, 11 Production program, 12 Inspection program, 13, 13A, 13B, 13C Segmentation data, 20 Control device, 21 Inspection device, 30 Control device, 35 Mounting head, 40 Control device, 41 Inspection device, 51 Information acquisition unit, 52 Storage unit, 53 Processing unit, 55 Mounting control unit, 56 Notification control unit, 60, 601, 602, 603, 604 Mounting ID, 61 Component name, 62, 621 Mounting coordinates, 63 Component size, 64 Related ID information, 70, 701, 702, 703, 704 Inspection ID, 71 Component name, 72, 721, 722, 723, 724 Check coordinates, 73 detailed data, 1000 computer system, 1001 processor, 1002 main memory, 1003 storage device, 1004 interface, C, C1, C2, C3, C4 components, DR judgment range, G1, G2, G3 component group, K1 first candidate, K2 second candidate, NW network, P substrate, Pm mounting substrate.

Claims

1. A production system, characterized in that: include: A production line comprising a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program; as well as management means for managing said production line using a production program, The production program includes information of a mounting ID of each of the components having mounting coordinates of the components, The inspection program includes information of an inspection ID of each of the parts having inspection coordinates of the parts, When the mounting ID of the production program is different from the inspection ID of the inspection program, the management device associates the mounting ID with the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID.

2. The production system according to claim 1, characterized in that: When the inspection device outputs an inspection failure for the inspection ID, the management device performs a notification related to the mounting ID associated with the inspection ID having the inspection failure.

3. The production system according to claim 1, characterized in that: When there are a plurality of the inspection coordinates within the determination range centered on the mounting coordinates, The management device associates the inspection ID having the inspection coordinates closest to the loading coordinates as a first candidate, The management device associates the inspection IDs other than the first candidate having the inspection coordinates within the determination range as second candidates.

4. The production system according to claim 3, characterized in that: When there are a plurality of the second candidates within the determination range, the management device assigns numbers to the plurality of the second candidates in order of distance from the mounting ID associated with the first candidate.

5. The production system according to claim 3, characterized in that: The production program includes information on the component size of the component identified by the mounting ID, The management device sets the determination range according to the component size.

6. The production system according to any one of claims 3 to 5, characterized in that: When the inspection device outputs an inspection failure for the inspection ID, the management device distinguishes between the mounting ID associated with the inspection ID that failed the inspection as the first candidate and the mounting ID associated with the inspection ID that failed the inspection as the second candidate.

7. A management device for managing a production line including a mounting device for mounting a component on a substrate and an inspection device for inspecting the substrate using an inspection program, wherein the management device is characterized in that: include: a storage unit storing a production program including information of a mounting ID of each of the components having mounting coordinates of the components; an information acquisition unit that acquires information of an inspection ID of each of the components having inspection coordinates of the components included in the inspection program; as well as The processing unit associates the mounting ID with the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID when the mounting ID of the production program and the inspection ID of the inspection program are different.

8. A management method for managing a production line including a mounting device for mounting a component on a substrate and an inspection device for inspecting the substrate using an inspection program, the management method comprising: A step of acquiring information of a mounting ID of each of the components having mounting coordinates of the components included in a production program; A step of acquiring information of an inspection ID of each of the components having inspection coordinates of the components included in the inspection program; as well as When the mounting ID of the production program is different from the inspection ID of the inspection program, a step of associating the mounting ID with the inspection ID is performed based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID.

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