Method for manufacturing a light emitting panel and light emitting panel

Abstract

The application discloses a manufacturing method of a light-emitting panel and the light-emitting panel. The manufacturing method comprises the following steps: controlling a first discharge port of a first transfer device to be in contact with a first chip unit, so that the first chip unit is adhered by a first color conversion fluid at the first discharge port; in response to the first transfer device moving the first chip unit to a first position where the first chip unit is opposite to a first electrode of a target substrate, controlling a deformation unit to compress a first containing cavity, so that part of the first color conversion fluid adhered to the first chip unit is separated from the first color conversion fluid in the first containing cavity under the action of gravity of the first chip unit, and then the first chip unit is close to and electrically connected with the first electrode under the action of gravity of the first chip unit. The first color conversion fluid adheres and transfers the first chip unit, and part of the first color conversion fluid is separated from the first transfer device with the first chip unit, so that the first color conversion fluid is manufactured on the first chip unit synchronously, and the process is simplified.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a method for manufacturing a light-emitting panel and the light-emitting panel itself. Background Technology

[0002] With the continuous development of modern display technology, light-emitting diodes (LEDs) are widely used in display modules and display devices due to their energy-saving, high efficiency, long lifespan, excellent light quality, and environmental friendliness.

[0003] When using light-emitting diodes (LEDs) to fabricate display modules, a color conversion layer is typically created on the LED chip. Simultaneously, it's crucial to ensure good alignment between the LED chip, the color conversion layer, and the target substrate. Furthermore, transferring a massive number of LED chips is essential. The entire manufacturing process demands high precision and is highly complex. Therefore, improvements to the manufacturing process are necessary to enhance related performance. Summary of the Invention

[0004] In order to solve the above-mentioned technical problems existing in the prior art, this application provides a method for manufacturing a light-emitting panel and a light-emitting panel.

[0005] To address the aforementioned issues, this application provides a method for manufacturing a light-emitting panel. The method includes: controlling a first discharge port of a first transfer device to contact a first chip unit, so as to adhere the first chip unit to the first color conversion fluid at the first discharge port. The first transfer device is provided with a first receiving cavity, the first discharge port is connected to the first receiving cavity, and the first receiving cavity contains the first color conversion fluid. In response to the first transfer device moving the first chip unit to a first position where the first chip unit is opposite to the first electrode of the target substrate, a deformation unit is controlled to compress the first receiving cavity so that the portion of the first color conversion fluid adhered to the first chip unit separates from the first color conversion fluid in the first receiving cavity under the action of the first chip unit's own gravity, thereby causing the first chip unit to approach and electrically connect to the first electrode under its own gravity.

[0006] In some embodiments, prior to the step of controlling the first outlet of the first transfer device to contact the first chip unit so as to adhere the first chip unit by the first color conversion fluid at the first outlet, the manufacturing method includes: processing the first color conversion slurry and adhesive to obtain the first color conversion fluid; and filling the first color conversion fluid into the first receiving cavity.

[0007] In some embodiments, after the step of controlling the deformation unit to compress the first receiving cavity so that a portion of the first color conversion fluid adhering to the first chip unit is separated from the first color conversion fluid in the first receiving cavity under the action of the first chip unit's own gravity, the manufacturing method includes a return step: controlling the first outlet of the first transfer device to contact the first chip unit so as to adhere the first chip unit through the first color conversion fluid at the first outlet until each of the first electrodes of the target substrate is connected to the first chip unit.

[0008] In some embodiments, the fabrication method includes: detecting the number of connections between the first electrode and the first chip unit on the target substrate; if the number of connections is greater than or equal to a preset threshold, filling the cavity with the first color conversion fluid.

[0009] In some embodiments, the manufacturing method includes: controlling a second outlet of a second transfer device to contact a second chip unit, so as to adhere the second chip unit to the second chip unit through a second color conversion fluid at the second outlet, wherein the second transfer device is provided with a second receiving cavity, the second outlet is connected to the second receiving cavity, the second receiving cavity contains the second color conversion fluid, and the color conversion slurry of the second color conversion fluid is different from that of the first color conversion fluid; in response to the second transfer device driving the second chip unit to move to a second position opposite to the second electrode of the target substrate, controlling a deformation unit to compress the second receiving cavity so that the portion of the second color conversion fluid adhered to the second chip unit is separated from the second color conversion fluid in the second receiving cavity under the action of the second chip unit's own gravity, thereby causing the second chip unit to approach and electrically connect to the second electrode under the action of its own gravity.

[0010] In some embodiments, when the first outlet of the first transfer device is in contact with the first chip unit, the second transfer device is in the second position, and when the second outlet of the second transfer device is in contact with the second chip unit, the first transfer device is in the first position.

[0011] In some embodiments, the manufacturing method includes: controlling a third outlet of a third transfer device to contact a third chip unit, so as to adhere the third chip unit to the third chip unit through a third color conversion fluid at the third outlet, wherein the third transfer device is provided with a third receiving cavity, the third outlet is connected to the third receiving cavity, and the third receiving cavity contains the third color conversion fluid; wherein the color conversion slurry of the first color conversion fluid, the color conversion slurry of the second color conversion fluid, and the color conversion slurry of the third color conversion fluid are respectively a red conversion slurry, a green conversion slurry, and a blue conversion slurry; in response to the third transfer device moving the third chip unit to a third position where the third chip unit is opposite to the third electrode of the target substrate, controlling a deformation unit to compress the third receiving cavity so that a portion of the third color conversion fluid adhered to the third chip unit separates from the third color conversion fluid in the third receiving cavity under the action of the third chip unit's own gravity, thereby causing the third chip unit to approach and electrically connect to the third electrode under the action of its own gravity.

[0012] In some embodiments, the target substrate includes at least three target regions, each target region including at least one first electrode, a second electrode and a third electrode, wherein the first transfer device is located at a first position opposite to the first electrode of the first target region, the second transfer device is located at a second position opposite to the second electrode of the second target region, and the third transfer device is located at a third position opposite to the third electrode of the third target region.

[0013] In some embodiments, the fabrication method includes: irradiating the first color conversion fluid with a light source to cure the first color conversion fluid on the first chip unit to form a first color conversion layer; and / or irradiating the second color conversion fluid with a light source to cure the second color conversion fluid on the second chip unit to form a second color conversion layer; and / or irradiating the third color conversion fluid with a light source to cure the third color conversion fluid on the third chip unit to form a third color conversion layer.

[0014] To address the aforementioned issues, this application provides a light-emitting panel, which is obtained through the manufacturing method described above.

[0015] Compared with the prior art, the method for manufacturing the light-emitting panel of this application includes controlling the first outlet of the first transfer device to contact the first chip unit so as to adhere the first chip unit to the first color conversion fluid at the first outlet. The first transfer device is provided with a first receiving cavity, the first outlet is connected to the first receiving cavity, and the first receiving cavity contains the first color conversion fluid. In response to the first transfer device driving the first chip unit to move to a first position where the first chip unit is opposite to the first electrode of the target substrate, the deformation unit is controlled to compress the first receiving cavity so that the portion of the first color conversion fluid adhered to the first chip unit is separated from the first color conversion fluid in the first receiving cavity under the action of the first chip unit's own gravity, thereby allowing the first chip unit to approach and electrically connect to the first electrode under the action of its own gravity. Through the above embodiments, the first chip unit is adhered and transferred to the position opposite to the first electrode of the target substrate by the first color conversion fluid in the cavity of the transfer device. The deformation unit separates part of the first color conversion fluid to the first chip unit and separates the first chip unit from the first transfer device at the same time. Thus, while the first transfer device transfers the first chip unit to the target substrate, the first transfer device simultaneously creates the first color conversion fluid on the first chip unit, which simplifies the manufacturing process and improves the alignment between the first color conversion fluid and the first chip unit. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic flowchart of the first embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0018] Figure 2 This is a process diagram of the first embodiment of the light-emitting panel manufacturing method provided in this application;

[0019] Figure 3 yes Figure 1 A flowchart of an embodiment prior to step S101;

[0020] Figure 4 This is a schematic flowchart of the second embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0021] Figure 5 This is a process diagram of the second embodiment of the method for manufacturing the light-emitting panel provided in this application;

[0022] Figure 6This is a process diagram of the third embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0023] Figure 7 This is a schematic flowchart of the third embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0024] Figure 8 This is a process diagram of the fourth embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0025] Figure 9 This is a process diagram of the fifth embodiment of the method for manufacturing a light-emitting panel provided in this application;

[0026] Figure 10 This is a partial structural schematic diagram of a light-emitting panel obtained using the manufacturing method of the light-emitting panel provided in this application.

[0027] Reference numerals in the attached figures: First transfer device 10; First outlet 110; First color conversion fluid 120; First receiving cavity 130; First chip unit 20; Second transfer device 30; Second outlet 310; Second color conversion fluid 320; Second receiving cavity 330; Second chip unit 40; Third transfer device 50; Third outlet 510; Third color conversion fluid 520; Third receiving cavity 530; Third chip unit 60; Target substrate 70; First electrode 710; Second electrode 720; Third electrode 730; First target area 740; Second target area 750; Third target area 760; Deformation unit 80; Temporary storage substrate 90. Detailed Implementation

[0028] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0029] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "setting," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium. Those skilled in the art will understand the specific meanings of the above terms within the context of this application.

[0031] With the continuous development of modern display technology, light-emitting diodes (LEDs) are widely used in display modules and display devices due to their energy-saving, high efficiency, long lifespan, excellent light quality, and environmental friendliness.

[0032] When using light-emitting diodes (LEDs) to fabricate display modules, a color conversion layer is typically created on the LED chip. Simultaneously, it's crucial to ensure good alignment between the LED chip, the color conversion layer, and the target substrate. Furthermore, transferring a massive number of LED chips is essential. The entire manufacturing process demands high precision and is highly complex. Therefore, improvements to the manufacturing process are necessary to enhance related performance.

[0033] To address the technical problems existing in related technologies, this application provides a method for manufacturing a light-emitting panel, see [link to relevant documentation]. Figure 1 and Figure 2 . Figure 1 This is a schematic flowchart of the first embodiment of the method for manufacturing the light-emitting panel provided in this application. Figure 2 This is a process diagram of the first embodiment of the light-emitting panel manufacturing method provided in this application, specifically including the following steps S101 to S102.

[0034] Step S101: Control the first outlet 110 of the first transfer device 10 to contact the first chip unit 20 so that the first color conversion fluid 120 at the first outlet 110 adheres to the first chip unit 20.

[0035] The first transfer device 10 has a first receiving cavity 130, and a first discharge port 110 is connected to the first receiving cavity 130. The first receiving cavity 130 contains a first color conversion fluid 120. A first chip unit 20 has a light-emitting surface and pins. The light-emitting surface is located on the side of the first chip unit 20 opposite to the pins. Multiple first chip units 20 are spaced apart on a transient substrate. The pins of the first chip units 20 are in contact with the transient substrate. The first chip units 20 are bonded together by the light-emitting surface and the first color conversion fluid 120 at the first discharge port 110. The size of the first discharge port 110 is smaller than the surface size of the first chip unit 20. Before bonding the first chip units 20, the first discharge port 110 of the first transfer device 10 is moved to align above the center of the light-emitting surface to make the bonding more stable. The first color conversion fluid 120 is semi-solid and has adhesive properties, and the first outlet 110 is small in size (on the order of micrometers). Therefore, the intermolecular forces or surface tension inside the first color conversion fluid 120 can prevent it from dripping out of the first outlet 110 due to gravity (similar to capillary action). Only under the action of external force can the first color conversion fluid 120 drip from the first outlet 110.

[0036] Step S102: In response to the first transfer device 10 moving the first chip unit 20 to a first position where the first chip unit 20 is opposite to the first electrode 710 of the target substrate 70, the deformation unit 80 is controlled to compress the first receiving cavity 130 so that the portion of the first color conversion fluid 120 adhering to the first chip unit 20 is separated from the first color conversion fluid 120 in the first receiving cavity 130 under the action of the first chip unit 20's own gravity, thereby causing the first chip unit 20 to approach and be electrically connected to the first electrode 710 under the action of its own gravity.

[0037] The first discharge port 110 protrudes from the first receiving cavity 130, and the size of the first discharge port 110 is smaller than that of the first receiving cavity 130. The first transfer device 10 uses the first color conversion fluid 120 at the first discharge port 110 to adhere to the first chip unit 20, causing it to move above the target substrate 70, so that the pins of the first chip unit 20 and the first electrode 710 are aligned, that is, the first chip unit 20 is in the first position. It should be noted that the spacing between the two pins of the first chip unit 20 and the spacing between the two electrodes of the first electrode 710 are set to be the same; there is a certain spacing between the first position and the first electrode 710 to provide space for the separation of the first chip unit 20 and the first transfer device 10.

[0038] Deformation units 80 are disposed on both sides of the first receiving cavity 130. They can be electrostrictive materials, such as lead zirconate titanate ceramics, ferroelectric materials, etc., so that the deformation units 80 can expand to compress the first receiving cavity 130 when electricity is applied. The part of the first color conversion fluid 120 that is adhered to the first chip unit 20 is gradually squeezed out of the first discharge port 110, so that the contact area between the first chip unit 20 and the first discharge port 110 becomes smaller. Finally, gravity overcomes the intermolecular forces of the first color conversion fluid 120, causing the first chip unit 20 to separate from the part of the first color conversion fluid 120 that is adhered to it and the first transfer device 10 and move vertically onto the first electrode 710, so that the pins of the first chip unit 20 and the first electrode 710 make contact and electrical connection. It should be noted that the distance between the first position and the first electrode 710 is small (on the order of micrometers), preferably the thickness of the first chip unit 20. This ensures that the first chip unit 20 is separated from the first transfer device 10, while also ensuring that the pins of the first chip unit 20 can make good contact with the first electrode 710 (avoiding that the first chip unit 20 falls too far and causes a large deviation between it and the first electrode 710).

[0039] Through the above implementation method, the first color conversion fluid 120 is bonded to the first chip unit 20 through the first outlet 110, and the first transfer device 10 transfers the first chip unit 20 to a first position opposite to the first electrode 710 of the target substrate 70. While the deformation unit 80 compresses the first receiving cavity 130 to separate part of the first color conversion fluid 120 from the first transfer device 10, the first chip unit 20 is also separated from the first transfer device 10. Thus, while the first transfer device 10 is used to bond and transfer the first chip unit 20, the first color conversion fluid 120 is coated on the light-emitting surface of the first chip unit 20 to form a color conversion layer. Because the first outlet 110 is attached to the first chip unit 20, the alignment of the first color conversion fluid 120 and the first chip unit 20 is ensured, and the process flow is simplified.

[0040] See Figure 3 , Figure 3 yes Figure 1 A flowchart of an embodiment prior to step S101.

[0041] Step S301: Process the first color conversion slurry and adhesive to obtain the first color conversion fluid 120.

[0042] The adhesive is mainly used to bond with the first chip unit 20. The adhesive can be a UV-curable adhesive. The first color conversion paste is used to receive the light emitted by the first chip unit 20 and convert it into different colors of light. The first color conversion paste can be made of quantum dot material or color resist material, which can receive light and emit red, blue, green, yellow, etc. It should be noted that the first chip unit 20 itself can also emit light; it can be pre-fabricated as a chip unit emitting red, blue, or green light. The proportion of adhesive in the first color conversion fluid 120 should not be too high or too low. Too high a proportion may affect the light conversion effect of the first color conversion fluid 120, while too low a proportion may prevent the first color conversion fluid 120 from firmly bonding with the first chip unit 20.

[0043] Step S302: Fill the first color conversion fluid 120 into the first receiving cavity 130.

[0044] The first color conversion fluid 120 can be squeezed and filled into the first receiving cavity 130 through the first discharge port 110. Since the first color conversion fluid 120 is in a semi-solid state, after a certain amount is filled into the first receiving cavity 130, the first transfer device 10 can be shaken to fully fill the first receiving cavity 130 with the first color conversion fluid 120. At the same time, it is necessary to ensure that the first discharge port 110 is also filled with the first color conversion fluid 120 so that the first chip unit 20 can be adhered to the first discharge port 110 through the first color conversion fluid 120.

[0045] Further, after completing step S102, return to step: control the first outlet 110 of the first transfer device 10 to contact the first chip unit 20, so as to adhere the first chip unit 20 through the first color conversion fluid 120 at the first outlet 110, until each first electrode 710 of the target substrate 70 is connected to the first chip unit 20.

[0046] Multiple first chip units 20 are spaced apart on the temporary storage substrate 90, and multiple first electrodes 710 are correspondingly spaced apart on the target substrate 70. When the first transfer device 10 transfers the first first chip unit 20 on the temporary storage substrate 90 to the target substrate 70 and makes contact with the first first electrode 710, it returns from the target substrate 70 to the position of the second first chip unit 20 on the temporary storage substrate 90, and then transfers the second first chip unit 20 to the target substrate 70 and makes contact with the second first electrode 710. The above steps are repeated until each first chip unit 20 on the temporary storage substrate 90 is connected to each first electrode 710 on the target substrate 70.

[0047] Furthermore, during the process of repeatedly transferring multiple first chip units 20 to the target substrate 70 using the first transfer device 10, the number of connections between the first electrode 710 and the first chip unit 20 on the target substrate 70 is detected. If the number of connections is greater than or equal to a preset threshold, the first color conversion fluid 120 is filled into the receiving cavity.

[0048] Because each time the first transfer device 10 transfers the first chip unit 20 onto the target substrate 70, the deformation unit 80 compresses the first receiving cavity 130, causing some of the first color conversion fluid 120 to separate from the first transfer device 10 along with the first chip unit 20. That is, each transfer of a first chip unit 20 consumes some of the first color conversion fluid 120. Therefore, when the number of connections reaches a certain number, there may be too little first color conversion fluid 120 in the first receiving cavity 130, so that when the deformation unit 80 compresses the first receiving cavity 130, the first color conversion fluid 120 at the first discharge port 110 cannot be squeezed out of the first discharge port 110, or the first color conversion fluid 120 at the first discharge port 110 is too little to effectively adhere the first chip unit 20. Therefore, when the number of connections is greater than or equal to a preset threshold, the first color conversion fluid 120 is added to the first receiving cavity 130 to ensure the normal operation of the first transfer device 10. When the number of connections is less than the preset threshold, the first color conversion fluid 120 in the first receiving cavity 130 is sufficient. The deformation unit 80 compresses the first receiving cavity 130, causing the portion of the first color conversion fluid 120 adhered to the first chip unit 20 to separate from the first transfer device 10. The first color conversion fluid 120 can then automatically fill the first outlet 110, enabling the first transfer device 10 to operate normally. The preset threshold can be 50, but it can also be adjusted to other values ​​as needed, such as 100 or 200. However, it is necessary to ensure that the first transfer device 10 can operate normally when the number of connections is less than or equal to the preset threshold so that the first chip unit 20 can be transferred to the target substrate 70 and the first electrode 710 can be properly connected.

[0049] Because each time the first transfer device 10 transfers the first electrode 710 to the target substrate 70 and connects the first electrode 710, the deformation unit 80 will work once to separate the first chip unit 20 from the first transfer device 10 and to make color conversion adhesive on the surface of the first chip unit 20. Therefore, the number of connections between the first electrode 710 and the first chip unit 20 can be obtained by the number of times the deformation unit 80 works.

[0050] See Figure 4 and Figure 5 , Figure 4 This is a schematic flowchart of the second embodiment of the method for manufacturing the light-emitting panel provided in this application. Figure 5 This is a process diagram of the second embodiment of the method for manufacturing the light-emitting panel provided in this application.

[0051] In some embodiments, a second transfer device 30 is also included. The manufacturing method includes steps S401 to S404, whereby the first transfer device 10 adheres to the first chip unit 20, the first transfer device 10 transfers the first chip unit 20 to the first electrode 710 and then the second transfer device 30 adheres to the second chip unit 40 and transfers the second chip unit 40 to the second electrode 720.

[0052] Step S401: Control the first outlet 110 of the first transfer device 10 to contact the first chip unit 20 so that the first color conversion fluid 120 at the first outlet 110 adheres to the first chip unit 20.

[0053] Step S402: In response to the first transfer device 10 moving the first chip unit 20 to a first position where the first chip unit 20 is opposite to the first electrode 710 of the target substrate 70, the deformation unit 80 is controlled to compress the first receiving cavity 130 so that the portion of the first color conversion fluid 120 adhering to the first chip unit 20 is separated from the first color conversion fluid 120 in the first receiving cavity 130 under the action of the first chip unit 20's own gravity, thereby causing the first chip unit 20 to approach and be electrically connected to the first electrode 710 under the action of its own gravity.

[0054] Steps S401 and S402 are equivalent to Figure 1 For details of steps S101 and S102 shown, please refer to the previous description of steps S101 and S102.

[0055] Step S403: Control the second outlet 310 of the second transfer device 30 to contact the second chip unit 40, so that the second color conversion fluid 320 at the second outlet 310 adheres to the second chip unit 40. The second transfer device 30 is provided with a second receiving cavity 330, the second outlet 310 is connected to the second receiving cavity 330, and the second receiving cavity 330 contains the second color conversion fluid 320.

[0056] The second chip unit 40 is transferred via the second transfer device 30. The principle of the second transfer device 30 in adhering to and transferring the second chip unit 40 is the same as that of the first transfer device 10. The difference lies in the color conversion paste used in the second color conversion fluid 320 and the first color conversion fluid 120. The structural configuration of the second transfer device 30 and the first transfer device 10 is the same. The second color conversion fluid 320 also includes an adhesive and a second color conversion paste. The difference is that the quantum dot material or color resist material used in the second color conversion paste is different from that used in the first color conversion paste. The color of the light received and converted by the second color conversion paste is different from that of the first color conversion paste. For example, the second color conversion paste can use a quantum dot material or color resist material that can convert and emit green light, while the first color conversion paste can use a quantum dot material or color resist material that can convert and emit red light. It should be noted that the light emitted by the first chip unit 20 and the second chip unit 40 can be the same or different. For example, the first chip unit 20 and the second chip unit 40 can both be LED chips that emit red light, or the first chip unit 20 and the second chip unit 40 can be LED chips that emit green light and blue light, respectively. In this embodiment, the first chip unit 20 and the second chip unit 40 can both be LED chips that emit blue light.

[0057] Step S404: In response to the second transfer device 30 moving the second chip unit 40 to a second position where the second chip unit 40 is opposite to the second electrode 720 of the target substrate 70, the deformation unit 80 is controlled to compress the second receiving cavity 330 so that the portion of the second color conversion fluid 320 adhering to the second chip unit 40 is separated from the second color conversion fluid 320 in the second receiving cavity 330 under the action of the second chip unit 40's own gravity, thereby causing the second chip unit 40 to approach and be electrically connected to the second electrode 720 under the action of its own gravity.

[0058] Similar to the working principle of the first transfer device 10, the second transfer device 30 transfers the second chip unit 40 from the temporary storage substrate 90 to a position above the target substrate 70 opposite to the second electrode 720, i.e., the second position. The deformation unit 80 compresses the second receiving cavity 330 to separate the second chip unit 40 and the portion of the second color conversion fluid 320 adhered to it from the second transfer device 30 so as to electrically connect it to the second electrode 720. During the process of electrically connecting the second chip unit 40 and the second electrode 720, the second color conversion fluid 320 is simultaneously coated on it. There are also multiple second chip units 40 and second electrodes 720. After electrically connecting the first second chip unit 40 and the first second electrode 720, the second transfer device 30 returns to the position of the second chip unit on the temporary storage substrate 90 and transfers it to the target substrate 70 to electrically connect it to the second second electrode 720. This process is repeated until all second chip units 40 and all second electrodes 720 are electrically connected. During the repeated transfer process, it is also necessary to detect the number of electrical connections between the second chip unit 40 and the second electrode 720. When the number of connections reaches a preset threshold, it is necessary to replenish the second color conversion fluid 320 into the second receiving cavity 330 in a timely manner.

[0059] It should be noted that the steps of the production method can be followed as follows: Figure 4 Steps S401 to S404 are executed sequentially. In other embodiments, the execution order of steps S401 to S404 can be reasonably and flexibly adjusted. For example, in some embodiments, steps S401 and S403 are executed simultaneously, and then steps S402 and S404 are executed simultaneously. That is, the first transfer device 10 is simultaneously attached to the first chip unit 20 and the second transfer device 30 is simultaneously attached to the second chip unit 40. Then, the first transfer device 10 is simultaneously transferred to electrically connect the first chip unit 20 to the first electrode 710 and the second transfer device 30 is simultaneously transferred to electrically connect the second chip unit 40 to the second electrode 720.

[0060] For example, in some embodiments, steps S403, S404, S401 and S402 may be executed first, that is, the second transfer device 30 is first attached to the second chip unit 40, then the second transfer device 30 is used to transfer the second chip unit 40 to the second electrode 720 for electrical connection, then the first transfer device 10 is attached to the first chip unit 20, and finally the first transfer device 10 is used to transfer the first chip unit 20 to the first electrode 710 for electrical connection.

[0061] See Figure 6 , Figure 6 This is a process diagram of the third embodiment of the method for manufacturing a light-emitting panel provided in this application.

[0062] Furthermore, when the first outlet 110 of the first transfer device 10 is in contact with the first chip unit 20, the second transfer device 30 is in the second position; when the second outlet 310 of the second transfer device 30 is in contact with the second chip unit 40, the first transfer device 10 is in the first position.

[0063] The first transfer device 10 and the second transfer device 30 can operate independently to transfer the first chip unit 20 and the second chip unit 40 respectively, or they can operate simultaneously. When the first transfer device 10 and the second transfer device 30 operate simultaneously, in order to enable them to work better, they can be staggered on the temporary storage substrate 90 and the target substrate 70 to avoid mutual interference, especially when there is space constraint between the first chip unit 20 and the second chip unit 40 or between the first electrode 710 and the second electrode 720.

[0064] See Figure 7 and Figure 8 , Figure 7 This is a schematic flowchart of the third embodiment of the method for manufacturing a light-emitting panel provided in this application. Figure 8 This is a process diagram of the fourth embodiment of the method for manufacturing a light-emitting panel provided in this application.

[0065] In some implementations, a third transfer device 50 is also included, and the manufacturing method includes sequentially executing steps S701 to S706, wherein steps S701 and S702 are equivalent to... Figure 1 Steps S101 and S102, and steps S703 and S704 are equivalent to Figure 4 For details of steps S403 and S404, please refer to the previous descriptions of steps S101, S102, S403 and S404.

[0066] Step S701: Control the first outlet 110 of the first transfer device 10 to contact the first chip unit 20 so that the first color conversion fluid 120 at the first outlet 110 adheres to the first chip unit 20.

[0067] Step S702: In response to the first transfer device 10 moving the first chip unit 20 to a first position where the first chip unit 20 is opposite to the first electrode 710 of the target substrate 70, the deformation unit 80 is controlled to compress the first receiving cavity 130 so that the portion of the first color conversion fluid 120 adhering to the first chip unit 20 is separated from the first color conversion fluid 120 in the first receiving cavity 130 under the action of the first chip unit 20's own gravity, thereby causing the first chip unit 20 to approach and be electrically connected to the first electrode 710 under the action of its own gravity.

[0068] Step S703: Control the second outlet 310 of the second transfer device 30 to contact the second chip unit 40 so that the second color conversion fluid 320 at the second outlet 310 adheres to the second chip unit 40.

[0069] Step S704: In response to the second transfer device 30 moving the second chip unit 40 to a second position where the second chip unit 40 is opposite to the second electrode 720 of the target substrate 70, the deformation unit 80 is controlled to compress the second receiving cavity 330 so that the portion of the second color conversion fluid 320 adhering to the second chip unit 40 is separated from the second color conversion fluid 320 in the second receiving cavity 330 under the action of the second chip unit 40's own gravity, thereby causing the second chip unit 40 to approach and be electrically connected to the second electrode 720 under the action of its own gravity.

[0070] Step S705: Control the third outlet 510 of the third transfer device 50 to contact the third chip unit 60 so that the third color conversion fluid 520 at the third outlet 510 can adhere the third chip unit 60. The third transfer device 50 is provided with a third receiving cavity 530. The third outlet 510 is connected to the third receiving cavity 530. The third receiving cavity 530 contains the third color conversion fluid 520. The color conversion slurry of the first color conversion fluid 120, the color conversion slurry of the second color conversion fluid 320, and the color conversion slurry of the third color conversion fluid 520 are red conversion slurry, green conversion slurry, and blue conversion slurry, respectively.

[0071] The structure and working principle of the third transfer device 50 are the same as those of the first transfer device 10 and the second transfer device 30. The third color conversion fluid 520 is made of adhesive and third color conversion paste (i.e., blue paste), which enables the third color conversion fluid 520 to receive the light emitted by the third chip unit 60 and convert it to emit blue light. The third chip unit 60 can also be an LED chip that emits red, green, blue, etc. In this application, the third chip unit 60 and the first chip unit 20 and the second chip unit 40 are selected to be LED chips that emit the same blue light. In this case, the third color conversion fluid 520 can be composed only of adhesive and does not require the third color conversion paste.

[0072] Step S706: In response to the third transfer device 50 moving the third chip unit 60 to a third position where the third chip unit 60 is opposite to the third electrode 730 of the target substrate 70, the deformation unit 80 is controlled to compress the third receiving cavity 530 so that the portion of the third color conversion fluid 520 adhering to the third chip unit 60 is separated from the third color conversion fluid 520 in the third receiving cavity 530 under the action of the third chip unit 60's own gravity, thereby causing the third chip unit 60 to approach and electrically connect with the third electrode 730 under the action of its own gravity.

[0073] Similarly, the deformation unit 80 compresses the third receiving cavity 530 to squeeze the third color conversion fluid 520, causing the third chip unit 60 and the portion of the third color conversion fluid 520 adhering to it to separate from the third transfer device 50 under gravity. This allows the third chip unit 60 to be transferred to the third electrode 730 for electrical connection, while simultaneously coating its light-emitting surface with the third color conversion fluid 520. There are multiple third chip units 60 and third electrodes 730. After electrically connecting the first third chip unit 60 and the first third electrode 730, the third transfer device 50 returns to the position of the second third chip unit 60 on the temporary substrate 90, transferring it to the target substrate 70 and electrically connecting it to the second third electrode 730. This process is repeated until all third chip units 60 and all third electrodes 730 are electrically connected. Similar to the first transfer device 10 and the second transfer device 30, during the process of the third transfer device 50 repeatedly transferring the third chip unit 60, it is necessary to detect the number of connections between the third chip unit 60 and the third electrode 730. When the number of connections reaches a preset threshold, the third color conversion fluid 520 is added to the third receiving cavity 530.

[0074] It should be noted that the steps of the production method can be followed as follows: Figure 7 The steps S701 to S706 are executed sequentially. In other embodiments, the execution order of steps S701 to S706 can be reasonably and flexibly adjusted. For example, in some embodiments, steps S701, S703, and S705 can be executed synchronously first, and then steps S702, S704, and S706 can be executed synchronously.

[0075] For example, in some implementations, steps S701, S702, S705, S706, S703, and S704 may be executed sequentially.

[0076] See Figure 9 , Figure 9 This is a process diagram of the fifth embodiment of the method for manufacturing a light-emitting panel provided in this application.

[0077] In some embodiments, the target substrate 70 includes at least three target regions, each target region including at least one first electrode 710, a second electrode 720 and a third electrode 730. When the first transfer device 10 is located at a first position opposite to the first electrode 710 of the first target region, the second transfer device 30 is located at a second position opposite to the second electrode 720 of the second target region, and the third transfer device 50 is located at a third position opposite to the third electrode 730 of the third target region.

[0078] At this point, the first chip unit 20, the second chip unit 40, and the third chip unit 60 on the temporary storage substrate 90 need to be transferred to the target substrate 70 and electrically connected to the first electrode 710, the second electrode 720, and the third electrode 730, respectively. The first transfer device 10, the second transfer device 30, and the third transfer device 50 can operate independently, or two of the transfer devices can operate, or all three can operate synchronously. When all three operate synchronously, to ensure they do not interfere with each other, the target substrate 70 is divided into a first target region 740, a second target region 750, and a third target region 760. The first electrodes 710, the second electrodes 720, and the third electrodes 730 of the three target regions are staggered, allowing the first transfer device 10, the second transfer device 30, and the third transfer device 50 to operate staggered within the three target regions.

[0079] In some embodiments, the manufacturing method further includes: irradiating the first color conversion fluid 120 with a light source to solidify the first color conversion fluid 120 on the first chip unit 20 to form a first color conversion layer; and / or irradiating the second color conversion fluid 320 with a light source to solidify the second color conversion fluid 320 on the second chip unit 40 to form a second color conversion layer; and / or irradiating the third color conversion fluid 520 with a light source to solidify the third color conversion fluid 520 on the third chip unit 60 to form a third color conversion layer.

[0080] The adhesive is typically liquid, therefore the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 still possess a certain degree of fluidity. After these fluids spread and cover the light-emitting surfaces of the first chip unit 20, the second chip unit 40, and the third chip unit 60 under the influence of gravity and surface tension, irradiation by a light source causes the adhesive to react and solidify, thus curing the fluids to better adhere to the light-emitting surfaces of the first chip unit 20, the second chip unit 40, and the third chip unit 60. It should be noted that the type of light source corresponds to the type of adhesive. The adhesive can only absorb specific types of light. For example, if a UV adhesive is selected, ultraviolet light is used as the light source, allowing the adhesive to absorb ultraviolet light and cure the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 to form the first color conversion layer, the second color conversion layer, and the third color conversion layer.

[0081] After the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 of the first chip unit 20, the second chip unit 40, and the third chip unit 60 are cured by light source irradiation, the pins of the first chip unit 20, the second chip unit 40, and the third chip unit 60 are respectively soldered and fixed to the first electrode 710, the second electrode 720, and the third electrode 730. Finally, black resin material is coated on the target substrate 70 to cover the first chip unit 20, the second chip unit 40, and the third chip unit 60 to form an encapsulation layer, which avoids light crosstalk between chip units and reduces the reflection of ambient light, while encapsulating and protecting the chip units.

[0082] In summary, by utilizing the adhesive properties of the first color conversion fluid 120, the second color conversion fluid 320, and the third color conversion fluid 520 to transfer the first chip unit 20, the second chip unit 40, and the third chip unit 60 to the target substrate 70, the deformation unit 80 is controlled to compress the receiving cavity of the transfer device. This separates the portion of the color conversion fluid that is adhered to the chip unit along with the chip unit and the transfer device. Simultaneously, the transfer device coats the surface of the chip unit with color conversion fluid to create a color conversion layer while transferring the chip unit. This greatly simplifies the process flow and effectively improves the alignment between the color conversion layer and the chip unit.

[0083] See Figure 10 , Figure 10 This is a partial structural schematic diagram of a light-emitting panel obtained using the manufacturing method of the light-emitting panel provided in this application.

[0084] To address the technical problems existing in the related technologies, this application also provides a light-emitting panel, which is obtained by the above-described method for manufacturing a light-emitting panel.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for manufacturing a light-emitting panel, characterized in that, The manufacturing method includes: Process the first color conversion slurry and adhesive to obtain the first color conversion fluid; The first color conversion fluid is filled into the first receiving cavity; The first discharge port of the first transfer device is controlled to contact the first chip unit so that the first chip unit is adhered by the first color conversion fluid at the first discharge port. The first transfer device is provided with the first receiving cavity, the first discharge port is connected to the first receiving cavity, and the first receiving cavity contains the first color conversion fluid. In response to the first transfer device moving the first chip unit to a first position opposite to the first electrode of the target substrate, the deformation unit is controlled to compress the first receiving cavity so that the portion of the first color conversion fluid adhering to the first chip unit is separated from the first color conversion fluid in the first receiving cavity under the action of the first chip unit's own gravity, thereby causing the first chip unit to approach and electrically connect with the first electrode under the action of its own gravity.

2. The method for manufacturing a light-emitting panel according to claim 1, characterized in that, After the step of controlling the deformation unit to compress the first receiving cavity so that the portion of the first color conversion fluid adhering to the first chip unit separates from the first color conversion fluid in the first receiving cavity under the action of the first chip unit's own gravity, the manufacturing method includes: Return step: Control the first outlet of the first transfer device to contact the first chip unit, so as to adhere the first chip unit through the first color conversion fluid at the first outlet, until each of the first electrodes of the target substrate is connected to the first chip unit.

3. The method for manufacturing a light-emitting panel according to claim 2, characterized in that, The manufacturing method includes: Detect the number of connections between the first electrode and the first chip unit on the target substrate; If the number of connections is greater than or equal to a preset threshold, the first color conversion fluid is filled into the first receiving cavity.

4. The method for manufacturing a light-emitting panel according to claim 1, characterized in that, The manufacturing method includes: The second discharge port of the second transfer device is controlled to contact the second chip unit so that the second chip unit is adhered by the second color conversion fluid at the second discharge port. The second transfer device is provided with a second receiving cavity, the second discharge port is connected to the second receiving cavity, the second receiving cavity contains the second color conversion fluid, and the color conversion slurry of the second color conversion fluid is different from that of the first color conversion fluid. In response to the second transfer device moving the second chip unit to a second position opposite to the second electrode of the target substrate, the deformation unit is controlled to compress the second receiving cavity so that the portion of the second color conversion fluid adhering to the second chip unit is separated from the second color conversion fluid in the second receiving cavity under the action of the second chip unit's own gravity, thereby causing the second chip unit to approach and electrically connect to the second electrode under the action of its own gravity.

5. The method for manufacturing a light-emitting panel according to claim 4, characterized in that, When the first outlet of the first transfer device is in contact with the first chip unit, the second transfer device is in the second position; when the second outlet of the second transfer device is in contact with the second chip unit, the first transfer device is in the first position.

6. The method for manufacturing a light-emitting panel according to claim 4, characterized in that, The manufacturing method includes: The third discharge port of the third transfer device is controlled to contact the third chip unit so as to adhere the third chip unit through the third color conversion fluid at the third discharge port. The third transfer device is provided with a third receiving cavity, the third discharge port is connected to the third receiving cavity, and the third receiving cavity contains the third color conversion fluid. The color conversion slurry of the first color conversion fluid, the color conversion slurry of the second color conversion fluid, and the color conversion slurry of the third color conversion fluid are respectively red conversion slurry, green conversion slurry, and blue conversion slurry. In response to the third transfer device moving the third chip unit to a third position where the third chip unit is opposite to the third electrode of the target substrate, the deformation unit is controlled to compress the third receiving cavity so that the portion of the third color conversion fluid adhering to the third chip unit is separated from the third color conversion fluid in the third receiving cavity under the action of the third chip unit's own gravity, thereby causing the third chip unit to approach and electrically connect to the third electrode under the action of its own gravity.

7. The method for manufacturing a light-emitting panel according to claim 6, characterized in that, The target substrate includes at least three target regions, each target region including at least one first electrode, a second electrode and a third electrode. When the first transfer device is located at a first position opposite to the first electrode of the first target region, the second transfer device is located at a second position opposite to the second electrode of the second target region, and the third transfer device is located at a third position opposite to the third electrode of the third target region.

8. The method for manufacturing a light-emitting panel according to claim 6, characterized in that, The manufacturing method includes: The first color conversion fluid is irradiated by a light source to solidify the first color conversion fluid on the first chip unit to form a first color conversion layer; And / or, the second color conversion fluid is irradiated by a light source to cause the second color conversion fluid to solidify on the second chip unit to form a second color conversion layer; And / or, by irradiating the third color conversion fluid with a light source, the third color conversion fluid is cured on the third chip unit to form a third color conversion layer.

9. A light-emitting panel, characterized in that, The light-emitting panel is obtained by the method for manufacturing a light-emitting panel according to any one of claims 1 to 8.

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