Component processing equipment

Abstract

The invention provides element processing equipment. The element processing equipment comprises a bearing unit, a control unit and a processing module, the bearing unit is used for bearing a to-be-machined object. The control unit is in signal connection with the bearing unit and defines the surface of the to-be-machined object as a plurality of machining areas. The processing module is controlled by the control unit. The machining module comprises a transferring unit and a repairing unit. The transfer unit is adapted to configure a plurality of elements to each processing area according to a set sequence among the plurality of processing areas. The repairing unit and the transferring unit synchronously machine the to-be-machined object. Moreover, the repairing unit removes a part of the elements configured by the transfer unit in each processing area, or configures another element to one empty point position of each processing area.

Description

Technical Field

[0001] The present invention relates to a component processing device, and more particularly to a component processing device including a transfer unit and a repair unit. Background Art

[0002] In recent years, Micro LED Displays have gradually attracted the investment attention of major technology companies. Different from traditional thin-film transistor displays, each pixel of a Micro LED Display is composed of multiple light-emitting chips, which makes Mass transfer a key technology in this field.

[0003] The difficulties currently encountered in mass transfer technology can be roughly divided into two aspects. First, the accuracy (yield) of transfer is insufficient, and an additional mass repair process is required to meet the requirements of commercial grades. Second, the mass repair and related detection processes are too time-consuming, and as the number of pixels in the display increases, the number and difficulty of chips that need to be repaired per wafer increase significantly, resulting in high costs. Summary of the Invention

[0004] The present invention is directed to a component processing device that can synchronously perform detection and repair in the mass transfer process, thereby improving process efficiency.

[0005] According to an embodiment of the present invention, the component processing device includes a carrier unit, a control unit, and a processing module. The carrier unit is used to carry the object to be processed. The control unit is signal-connected to the carrier unit and defines the surface of the object to be processed as a plurality of processing areas. The processing module is controlled by the control unit. The processing module includes a transfer unit and a repair unit. The transfer unit is adapted to configure a plurality of components to each processing area according to a set order between the plurality of processing areas. The repair unit processes the object to be processed synchronously with the transfer unit. Moreover, the repair unit removes a part of the components configured by the transfer unit in each processing area, or configures another component to an empty position in each processing area.

[0006] Based on the above, in the component processing device according to an embodiment of the present invention, the transfer unit and the repair unit can be adapted to synchronously perform corresponding processing (such as transfer and repair) in different processing areas. Therefore, the processing efficiency of the component processing device can be better, and the throughput can be correspondingly increased. Brief Description of the Drawings

[0007] Figure 1A is a partial perspective view of the component processing device according to an embodiment of the present invention and the corresponding object to be processed;

[0008] Figure 1BIt is a partial system schematic diagram of an element processing device according to an embodiment of the present invention;

[0009] Figure 2A and Figure 2B It is a partial side view schematic diagram of an element processing device performing a mass transfer process according to an embodiment of the present invention;

[0010] Figure 3A and Figure 3B It is a partial side view schematic diagram of an element processing device performing an inspection process according to an embodiment of the present invention;

[0011] Figure 4A and Figure 4B It is a partial side view schematic diagram of an element processing device performing a mass repair process according to an embodiment of the present invention;

[0012] Figure 5A It is a partial three-dimensional schematic diagram of an element processing device processing a workpiece to be processed according to an embodiment of the present invention;

[0013] Figure 5B is Figure 5A A processing path schematic diagram of the workpiece to be processed of the element processing device;

[0014] Figure 6A is Figure 5A A partial three-dimensional schematic diagram of the element processing device rotating the workpiece to be processed;

[0015] Figure 6B is Figure 6A A processing path schematic diagram of the workpiece to be processed of the element processing device;

[0016] Figure 7 It is a schematic diagram of an element processing device synchronously performing mass transfer and mass repair according to an embodiment of the present invention;

[0017] Figure 8A It is a partial three-dimensional schematic diagram of an element processing device processing a workpiece to be processed according to another embodiment of the present invention;

[0018] Figure 8B is Figure 8A A processing path schematic diagram of the workpiece to be processed of the element processing device;

[0019] Figure 9 It is a top view schematic diagram of an element processing device processing a workpiece to be processed according to yet another embodiment of the present invention;

[0020] Figure 10A and Figure 10B is Figure 9 A top view schematic diagram of a processing method of an embodiment;

[0021] Figure 11A and Figure 11B is Figure 9 The top view schematic diagram of another processing method of the embodiment;

[0022] Figure 12A and Figure 12B is Figure 9 The top view schematic diagram of yet another processing method of the embodiment.

[0023] Explanation of reference numerals in the drawings:

[0024] 100: Component processing equipment;

[0025] 101: Base platform;

[0026] 102: Carrying unit;

[0027] 103: Control unit;

[0028] 104: Processing module;

[0029] 105A, 105B, 105C: Moving platform;

[0030] 106: Support column;

[0031] 107: Cross beam;

[0032] 110: Transfer unit;

[0033] 118, 128, 138: Laser light source;

[0034] 120: Repair unit;

[0035] 130: Detection unit;

[0036] 71, 72, 73, 74, 75, 76: Movable parts;

[0037] 80, 81, 82: Components;

[0038] 90: Object to be processed;

[0039] A1, A2, A3: Optical axes;

[0040] L1: Transfer beam;

[0041] L2: Welding beam;

[0042] L3: Detection beam;

[0043] L4: Repair beam;

[0044] L9: Line;

[0045] A9: Rotation axis;

[0046] MK: Positioning mark;

[0047] W1: First processing area;

[0048] W2: Second processing area;

[0049] W3: Third processing area;

[0050] W4: Fourth processing area;

[0051] WS: Sub - processing area;

[0052] S1: First sequence;

[0053] S2: Second sequence;

[0054] G01, G11, G21, G41: Successfully transferred components;

[0055] 81N, N01, N02, N03, N04, N11, N12, N13, N23, N24, N25, N41, N42, N43, N44, N45, N46, N51, N52, N53, N54, N55, N61, N62, N63, N64: Damaged or defective components;

[0056] 81V, V01, V02, V11, V41, V42, V43, V51, V52, V53, V61, V62, V63, V64: Empty point positions;

[0057] RN01, RN02, RN03, RN04, RN11, RN21, RN22, RN41, RN44, RN45, RN46, RN51, RN52, RN53, RN61, RN62: Components repaired from damaged or defective components;

[0058] RV01, RV02, RV11, RV21, RV42, RV51, RV52, RV61: Components repaired from empty point positions;

[0059] X, Y, Z: Directions. Detailed implementation

[0060] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. However, the present invention may be embodied in various different forms and should not be limited to the embodiments described herein. The dimensions of some elements, layers, or regions in the drawings are enlarged for clarity. The same or similar reference numerals denote the same or similar elements and will not be repeated in the following paragraphs. Additionally, the directional terms mentioned in the embodiments, such as: up, down, top, or bottom, etc., are only with reference to the directions of the attached drawings. Therefore, unless otherwise specifically stated, the directional terms used are for illustration and not for limiting the present invention. Also, in order to clearly show the directional relationships between different drawings, in some of the illustrations, the corresponding directions are exemplarily represented by a Cartesian coordinate system (i.e., the XYZ rectangular coordinate system), but the present invention is not limited thereto.

[0061] Figure 1A is a partial perspective view of an element processing apparatus and a corresponding object to be processed according to an embodiment of the present invention. Figure 1B is a partial system diagram of an element processing apparatus according to an embodiment of the present invention.

[0062] Please refer to Figure 1A and Figure 1B , the element processing apparatus 100 includes a carrying unit 102, a control unit 103, and a processing module 104.

[0063] The control unit 103 may include corresponding hardware and / or software and may perform input, output, arithmetic operations, storage, monitoring, data collection, statistics, and / or other suitable operations. In one embodiment, the control unit 103 includes, for example, software suitable for logical judgment or a platform suitable for advanced process control (APC) and / or a programmable logic controller (PLC), but the present invention is not limited thereto.

[0064] The control unit 103 is signal-connected to the carrying unit 102 and the processing module 104 and causes the carrying unit 102 and the processing module 104 to perform, for example, movement, rotation, causing corresponding processing light beams to be emitted, or performing corresponding sensing, but the present invention is not limited thereto.

[0065] The carrier unit 102 can carry the object 90 to be processed. The object 90 to be processed can be an intermediate substrate in a mass transfer process or a display screen in a mass repair process, but the present invention is not limited thereto. The control unit 103 can define the surface of the object 90 to be processed as a plurality of processing regions by means of corresponding hardware and / or software. In this embodiment, the plurality of processing regions can be located on a single plate body, but the present invention is not limited thereto. Specifically, in Figure 1A or other similar figures, the dotted line L9 shown can be used as a virtual line to distinguish different processing regions on the same plate body. However, in other embodiments, the plurality of processing regions can also belong to different plate bodies carried by the carrier unit 102; that is, in Figure 1A or other similar figures, the dotted line L9 shown may represent the gap between adjacent different plate bodies or other physical mechanisms.

[0066] In one embodiment, the carrier unit 102 is movably disposed on the base platform 101 and can be adapted to drive the object 90 to be processed to move or rotate by means of corresponding movable members 71, such as motors, rollers, balls, gears, toothed rails, toothed belts, belts and other members. The carrier unit 102 can perform translation in the X direction and / or the Y direction along the XY plane. In addition, in order to increase the process flexibility, the carrier unit 102 can also be adapted to rotate relative to the base platform 101 about the rotation axis A9, and the axial direction of the rotation axis A9 is perpendicular to the XY plane, but the present invention is not limited thereto. In other embodiments not shown, the relative movement relationship between the carrier unit 102 and the base platform 101 can also be implemented by using any movable structure design well known to those of ordinary skill in the technical field to which the present invention pertains. In addition, for the sake of simplicity, the movable member 71 in the drawings is only schematically shown, and other movable members similar to the movable member 71 may be omitted.

[0067] The processing module 104 includes a transfer unit 110 and a repair unit 120. The transfer unit 110 and the repair unit 120 are movably disposed on a moving platform 105A. The moving platform 105A may be a gantry type moving platform including corresponding support columns 106 and cross beams 107, but the present invention is not limited thereto. By means of the movable members 72, 73, and 74 of the moving platform 105A, the processing module 104 mounted thereon can be moved relative to the base platform 101 along the X direction, the Y direction, and the Z direction, respectively. In addition, by means of the movable members 75 and 76, the transfer unit 110 and the repair unit 120 can be further translated on the XZ plane, respectively. That is, the plane on which the loading unit 102 and the processing module 104 move can be orthogonal to each other. In cooperation with the movement of the movable member 71 and / or the movable member 72 on the XY plane, the transfer unit 110 and the repair unit 120 can achieve three-dimensional movement relative to the object to be processed, and perform transfer and / or repair in a plurality of processing regions on the XY plane, including but not limited to in a column-by-column scanning form. Moreover, the transfer unit 110 and the repair unit 120 can be actuated synchronously at different locations (such as both sides of the object to be processed 90 in the X direction). In addition, for the sake of simplicity, the movable members 72, 73, 74, 75, and 76 in the drawings are only schematically shown, and other movable members similar to the movable members 72, 73, 74, 75, and 76 may be omitted from showing.

[0068] The transfer unit 110 is adapted to dispose a plurality of components to the object to be processed 90 according to the sequence set in the control unit 103. For example, the transfer unit 110 is adapted to dispose a plurality of components to each processing region and / or corresponding positions according to the set sequence between a plurality of processing regions and / or corresponding arrangement patterns. The components are, for example, microlight-emitting diodes (μLEDs), but the present invention is not limited thereto. For example, please refer to Figure 2A , the temporary carrier 61 adhered with the corresponding component 80 can be disposed on another moving platform 105B. The another moving platform 105B is, for example, a gantry type moving platform, and its cross beam (not shown) has another extending direction (such as along the X direction). The transfer unit 110 may have corresponding laser light sources 118 and 119. By the relative movement between the moving platform 105A and the moving platform 105B, the laser light source 118 can be directed to a certain component 81 (one of the components 80) located on the temporary carrier 61. Please refer to Figure 2B, so that the temporary carrier 61 is close to the processing area of ​​the object 90 to be processed, and the viscosity of the part of the adhesive layer 62 between the component 81 and the temporary carrier 61 can be reduced or invalidated by the irradiation of the transfer light beam L1 emitted by the laser light source 118, so that the component 81 to be transferred is placed on the processing area of ​​the object 90 to be processed. By corresponding movement, the laser light source 119 can be aligned with the component 81 on the temporary carrier 61. The laser light source 118 and the laser light source 119 can be coaxial (that is, have the same optical axis A1). The component 81 and the object 90 to be processed can be joined by irradiation of the corresponding welding light beam L2 (for example, to melt the metal pad pre-set on the object 90 to be processed). In this way, the component 81 can be transferred from the temporary carrier 61 to the corresponding processing area in the object 90 to be processed.

[0069] It is worth noting that the light sources of the transfer beam L1 and the welding beam L2 of the present embodiment are respectively located above and below the object to be processed 90, but in an embodiment not shown, the positions of the light sources of the transfer beam L1 and the welding beam L2 can also be swapped. That is, the light source of the transfer beam L1 is located below the object to be processed 90, and the light source of the welding beam L2 is located above the object to be processed 90, but it is not limited to this. For example, the light sources of the transfer beam L1 and the welding beam L2 can also be located on the same side of the object to be processed 90, and tilted laser processing is used to achieve the same-side configuration of the light sources.

[0070] In the process of mass transfer, it is not possible to ensure that each component 80 is successfully transferred, and some components 80 may fail to transfer due to various reasons. The aforementioned failed transfer may include but is not limited to: component transfer failure, damage or destruction of components after transfer, component displacement or other unknown reasons for component failure.

[0071] refer to Figure 1A , Figure 1B and Figure 3A, the component processing equipment 100 of this embodiment may further include a detection unit 130. The control unit 103 is signal-connected to and controls the detection unit 130. The detection unit 130 may have a corresponding laser light source 138 to emit a detection beam L3, and the control unit 103 can receive the detection data from the detection unit 130 to determine whether the component 80 has been successfully transferred. In addition, the detection unit 130 and the transfer unit 110 may be integrated into the same component, so as to be suitable for performing appropriate detection means on the transferred component by the detection unit 130 synchronously when the transfer unit 110 performs the transfer. For example: measuring the electrical properties of the component 80 with a probe, measuring the brightness or its light field with electroluminescence, testing the photoexcitation and spectrum of the component 80 with photoluminescence, or taking images of the transfer or repair with a charge-coupled device (CCD), but the present invention is not limited to the above. And, if a component has a failed transfer, the control unit 103 can control the repair unit 120 to perform repair processing on the failed part according to the detection data (such as: the position of the failure, the type of failure, etc.). In one embodiment, the optical axis A1 (marked in Figure 2A or Figure 2B ) of the laser light source 118 and the optical axis A3 of the laser light source 138 may be coaxial or close. Here, the coaxiality of the optical path can be achieved by using, for example, a scanning galvanometer combined with an optical lens group design; or, through the design of mechanism integration, the light sources can be kept coaxial during the movement of the platform.

[0072] Taking Figure 3A as an example, after the detection beam L3 of the laser light source 138 is irradiated, if the control unit 103 determines that there is substantially no component at the position where there should be a component, that position can be called a vacant position 81V. Referring to Figure 3B again, if the transferred component 81N is determined to be damaged, defective or otherwise abnormal, that point can be called a dead pixel, and the removal process of the component 81N needs to be performed first.

[0073] Taking Figure 4A as an example, the laser light source 128 of the repair unit 120 emits a repair beam L4 to desolder and remove the damaged or defective component 81N, and the component 81N is recovered by means of vacuum suction, etc., so that the dead pixel position is repaired to a vacant position.

[0074] Referring to Figure 4B, the temporary carrier 61 adhered with a corresponding other component 82 can be disposed on another mobile platform 105C, which is, for example, a gantry mobile platform, and the cross beam thereof (not shown) has another extending direction (e.g., along the X direction). Here, the repair unit 120 can carry a corresponding laser light source 118, that is, when the repair unit 120 cooperates with the mobile platform 105C, it is regarded as another transfer unit. By the relative movement between the mobile platform 105A and the mobile platform 105C, the optical axis A1 of the laser light source 118 can be aligned with one of the components 82 on the temporary carrier 61, and through the transfer beam L1, it can be transferred from the temporary carrier 61 to the corresponding processing area in the object to be processed 90, thereby completing the corresponding repair.

[0075] In addition, since the mass transfer process and the mass repair process are carried out synchronously, at least in the state where the above two processes are parallel, the mobile platform 105B applicable to the transfer unit 110 and the temporary carrier 61 carried thereon, and the mobile platform 105C applicable to the repair unit 120 and the temporary carrier 61 carried thereon are two independent configurations. In this way, the transfer unit 110 and the repair unit 120 can synchronously perform corresponding processing (e.g., transfer and repair) in different processing areas. Therefore, the processing efficiency of the component processing device 100 can be improved, and the throughput can be correspondingly increased. Here, since the process of the repair unit 120 configuring another repair component to the empty point position essentially belongs to component transfer, the transfer unit 110 and the repair unit 120 can use the same laser light source of the processing module 104, and then respectively cooperate with appropriate optical path designs to process the object to be processed 90.

[0076] Furthermore, for the sake of convenience of explanation, Figure 4A the removal process of Figure 4B and the repair process of

[0077] are both performed from the upper side of the object to be processed 90. However, in other component processing devices 100 not shown, the relevant mechanisms of the removal process and the repair process may also be disposed on both sides of the object to be processed 90. Thus, when the transfer unit 110 performs the transfer process, the repair unit 120 can synchronously remove abnormal components from the other side of the object to be processed 90.

[0078] In addition, for a clear determination of the orientation of the object 90 to be processed, corresponding positioning marks MK may be shown in the drawings. In this embodiment, the orientation and position of the object 90 to be processed are determined by the control unit 103 based on the wafer flat of the object 90 to be processed. However, based on different objects 90 to be processed, the determination methods may vary widely, such as position patterns or wafer notches.

[0079] In addition, for the sake of simplicity and consistency in description, the representation and marking methods of the components on the object 90 to be processed in the drawings are described as follows. Components with solid outer frame lines and white filling are the components that have been successfully transferred to the object 90 to be processed (such as components with the following marks: Gn, where n is the corresponding number, e.g., G01); the transfer method thereof can be as described above. Components without outer frame lines and with dotted filling are vacant positions (such as vacant positions with the following marks: Vn, where n is the corresponding number, e.g., V01), and the repair method thereof can be as described above. Moreover, for components at the same or similar positions, the repaired components (such as repaired components with the following marks: RVn, where n is the corresponding number, e.g., RV01) are marked with similar labels. For example, the component RV01 is the one that is transferred and repaired corresponding to the vacant position V01, and so on. Components with solid outer frame lines and grid filling are the components that have been transferred to the object 90 to be processed but are damaged or defective (such as damaged or defective components with the following marks: Nn, where n is the corresponding number, e.g., N01), and the method of releasing and then performing subsequent repair thereof is as described above. Moreover, for components at the same or similar positions, the repaired components (such as repaired components with the following marks: RNn, where n is the corresponding number, e.g., RN01) are marked with similar labels. For example, the component RN01 is the one that is released from the damaged or defective component N01 and then transferred and repaired, and so on.

[0080] Figures 5A to 7 To illustrate the process of the component processing apparatus 100 of an embodiment of the present invention synchronously performing mass transfer and mass repair on the object 90 to be processed. For example, Figure 5B and Figure 6B may be top view schematic diagrams corresponding to the object 90 to be processed in Figure 5A and Figure 6A respectively.

[0081] Please refer to FIG. 1 and Figure 5A 、 Figure 5B, after placing the object 90 to be processed on the carrier unit 102, relative movement can be generated between the carrier unit 102 and the processing module 104 in an appropriate manner (e.g., the carrier unit 102 moves in the -X direction and the processing module 104 moves in the +X direction), so that the transfer unit 110 can transfer components as shown in Figure 2A and Figure 2B .

[0082] The surface of the object 90 to be processed can be defined as a first processing area W1 and a second processing area W2. The range of the first processing area W1 can be substantially the same as the range of the second processing area W2. And, the transfer unit 110 can first transfer components in the first processing area W1 according to the first sequence S1. Here, the first sequence S1 is schematically depicted, and the actual processing sequence of the processing module 104 can have various variations. For example, in the embodiments introduced later, the transfer unit 110 can transfer components in a regular array pattern according to different settings. That is to say, the first sequence S1 includes but is not limited to forms in which components are distributed in rows and columns, staggered, or other regular distributions.

[0083] After the transfer process, most positions in the first processing area W1 are configured with successfully transferred components G01, and there may be some damaged or defective components N01, N02, and some empty point positions V01.

[0084] Continuing to refer to Figure 6A , the carrier unit 102 and the object 90 to be processed located thereon can be rotated along the rotation axis A9 in Figure 5A to perform subsequent repair. Specifically, before rotation (e.g., as shown in Figure 5A / Figure 5B ), the transfer unit 110 corresponds to the first processing area W1, and the repair unit 120 corresponds to the second processing area W2; after completion of rotation (e.g., as shown in Figure 6A , Figure 6B ), the transfer unit 110 corresponds to the second processing area W2, and the repair unit 120 corresponds to the first processing area W1. And, for the same processing area, the arrangement patterns formed by the multiple components corresponding to the transfer unit 110 and the repair unit 120 are interchanged as the rotation axis A9 rotates, and the arrangement patterns are centrosymmetric to each other. That is, the object 90 to be processed in Figure 6B has a rotation angle of 180 degrees compared to Figure 5B . However, in other embodiments not shown, the object 90 to be processed can also be rotated by other angles, and the arrangement patterns corresponding to the transfer unit 110 and the repair unit 120 are rotationally symmetric in this case.

[0085] Referring toFigure 6B After completion of the rotation, the transfer unit 110 can then transfer components to the second processing area W2 according to the first sequence S1. However, the present invention does not limit that the processing sequences must be the same. At the same time, the repair unit 120 repairs the first processing area W1 of the object to be processed 90 (e.g., Figures 4A to 4B explains) the aforementioned damaged or defective components N01, N02, and the void position V01. That is to say, the transfer unit 110 and the repair unit 120 can synchronously perform corresponding processing in different processing areas. It should be noted that, Figure 6B illustrates the repair process of the repair unit 120, that is, the component RN02 is the repaired component, while the components N01 and the void position V01 are about to be repaired.

[0086] Please refer to Figure 7 , after transferring components to the second processing area W2, new damaged or defective components N03, N04, and the void position V02 may occur. And, the components RN01, RN02, and RV01 have been arranged at the positions to be repaired in the first processing area W1. It is worth noting that the present invention does not limit the sequence of completion of component repair in the first processing area W1 and completion of component transfer in the second processing area W2.

[0087] Continue to refer to Figure 7 , after completing the component repair in the first processing area W1 and completing the component transfer in the second processing area W2, steps similar to Figures 5A to 6B shown can be performed to rotate the carrier unit 102 and the object to be processed 90 thereon along the rotation axis A9 again to perform subsequent component repair and / or component transfer.

[0088] After the transfer unit 110 further completes the transfer of components in the first processing area W1, the carrier unit 102 and the object to be processed 90 thereon rotate again along the rotation axis A9 (not shown) to perform subsequent component repair and / or component transfer. By rotating the object to be processed 90 one or more times, the transfer unit 110 and the repair unit 120 can synchronously perform corresponding processing (such as transfer and repair) in different processing areas. In this way, the processing efficiency of the component processing device 100 can be improved, and the throughput can be correspondingly increased. In addition, in Figure 6A , 6B and Figure 7In the illustrated embodiment, since only the object 90 to be processed is driven to rotate by the carrier unit 102, the transfer unit 110 and the repair unit 120 do not move following the movement of the object 90 to be processed. That is to say, the processing areas of the transfer unit 110 and the repair unit 120 (i.e., W1 and W2) are exchanged during the processing, but the processing areas of the two are always different at the same time. Specifically, the control unit 103 can use the line L9 or other markings with positioning purposes to limit the processing areas of the transfer unit 110 and the repair unit 120 to avoid collisions during the synchronous processing. Thereby, in a configuration where, for example, the transfer unit 110 and the repair unit 120 are driven to move by the mobile platform 105A, the problem of mechanical interference between the mass transfer process and the mass repair process can be avoided.

[0089] Please refer to Figure 8A and Figure 8B , in another embodiment of the present invention, after the transfer unit 110 completes the first processing area W1, it can continue to transfer components in the second processing area W2 according to the second sequence S2. And, during the process of transferring components in the first processing area W1, there may be some damaged or defective components N11, N12, and some empty point positions V11. Similarly, Figure 8B schematically shows that the component N11 and the empty point position V11 have been repaired to the component RN11 and RV11, and the repair unit 120 is about to repair the component N12. The relative movement between the carrier unit 102 and the processing module 104 (e.g., the carrier unit 102 moves in the -X direction and the processing module 104 moves in the +X direction) can make the repair unit 120 synchronously correspond to the first processing area W1 when the transfer unit 110 corresponds to the second processing area W2 for corresponding component repair. Then, the carrier unit 102 can continue to move, for example, in the -X direction, so that when the transfer unit 110 corresponds to the third processing area W3, the repair unit 120 synchronously corresponds to the second processing area W2 for processing (e.g., repairing the damaged or defective component N13). In one embodiment, the transfer unit 110 can still transfer components in the third processing area W3 according to the second sequence S2.

[0090] Briefly speaking, in the Figure 8A , Figure 8B embodiment, by moving the object 90 to be processed one or more times, the transfer unit 110 and the repair unit 120 can synchronously perform corresponding processing (such as transfer and repair) in different processing areas. In this way, the processing efficiency of the component processing device 100 can be improved, and the throughput can be correspondingly increased.

[0091] Figure 9 is a top view schematic diagram of the component processing device 100 of another embodiment of the present invention for processing the object 90 to be processed.

[0092] Figure 9 The component processing and repair methods shown are similar to those in the foregoing embodiments, and will not be repeated here. Figure 9 The difference between this embodiment and other embodiments is that multiple transferred components can be arranged at intervals in one direction (e.g., the X direction or the Y direction). For example, Figure 9 multiple transferred components are configured in a staggered manner to have default vacant positions. In this way, the heat generated during the transfer process of the components (e.g., welding) is not likely to accumulate excessively.

[0093] As described in the foregoing embodiments, the first processing area W1 is in a state where component transfer and corresponding component repair processes are completed. And, the second processing area W2 has completed the component transfer process and is ready to perform the corresponding component repair.

[0094] Figure 10A and Figure 10B is Figure 9 a top view schematic diagram of a processing method of an embodiment.

[0095] Please refer to Figure 10A , the object to be processed 90 can be moved relative to the processing module 104 by an appropriate method. For example, in Figure 10A , the object to be processed 90 is driven to move in the -X direction so that the transfer unit 110 sequentially performs the transfer process on the first processing area W1 and the second processing area W2. In Figure 10A 's processing method, although multiple transferred components are also arranged at intervals like Figure 9 , the execution methods of the transfer process and the repair process have changes. Specifically, when the transfer in the interval manner is completed in the first processing area W1 and the second processing area W2, the repair process does not start. Continuing to refer to Figure 10B , in the state where the transfer unit 110 does not move, since the object to be processed 90 is rotated 180 degrees, the transfer unit 110 can transfer the remaining part (i.e., the vacant position in Figure 10A ) of the components from the first processing area W1 to the second processing area W2 again. At the same time, the repair unit 120 can also perform the repair process along the same direction. Here, the transfer unit 110 and the repair unit 120 can actually move relative to the object to be processed 90 by the foregoing moving platform 105A, or can perform the transfer and repair of the corresponding components by, for example, galvanometer scanning.

[0096] It is worth mentioning that in Figure 10B , the repair unit 120 can perform the process following the transfer unit 110 (and the detection unit 130). Therefore, although the damaged or defective component N46 and the empty point position V43 are in Figure 10Bis newly added and detected in the transfer process, but the repair unit 120 can repair the component N46 after sequentially repairing the components N44, N41, and V42. Similarly, after the components N45, N42, and the empty point position V41 are repaired, the empty point position V43 and the component N43 are repaired successively.

[0097] In this way, the repair unit 120 and the detection unit 130 not only process synchronously with the transfer unit 110, but can also detect all the bad points generated during the transfer at one time and complete the repair.

[0098] In addition, since Figure 10A and Figure 10B the arrangement patterns of the components transferred in Figure 10B are centrosymmetric or rotationally symmetric with respect to each other, which means that after the object to be processed 90 is rotated, Figure 10A the coordinates of the object to be processed in the

[0099] Furthermore, Figures 9 to 10B In this embodiment and other embodiments introduced below, since both processing stages proceed from the first processing area W1 to the second processing area W2; considering that the repair unit 120 follows the transfer unit 110 to perform the repair process, and the number of components in the repair process is much lower than that in the transfer process, the above processing method can ensure that each processing area has sufficient heat dissipation time before the next processing stage, avoiding problems such as low transfer yield caused by thermal damage, thermal diffusion, or other thermal stress accumulations due to the dense arrangement of components in the transfer process (such as laser mass transfer).

[0100] Figure 11A and Figure 11B is Figure 9 a top view schematic diagram of another processing method of the embodiment.

[0101] The processing methods of the foregoing one or more embodiments can be integrated or adjusted so that the transfer unit 110 and the repair unit 120 can perform corresponding processing (such as: transfer and repair) synchronously in different processing areas to improve the processing efficiency of the component processing device 100. Taking Figure 11A 's processing method as an example, it can be achieved by similar to Figure 10AIn the manner described above, the process of transferring components is carried out in different processing areas (e.g., from the first processing area W1 to the third processing area W3). That is to say, within each processing stage, not only can the components in the processing area be arranged at intervals, but the different processing areas can also be arranged at intervals. Then, referring to Figure 11B , since the object to be processed 90 is rotated by 180 degrees, similar to Figure 10B the manner described above, the transfer unit 110 transfers components in other different processing areas (e.g., from the second processing area W2 to the fourth processing area W4). During this process, the repair unit 120 can perform the repair process along the same direction in the transferred processing areas (e.g., the first processing area W1 and the third processing area W3). Continuing to refer to Figure 11B , since the object to be processed 90 is rotated by 180 degrees again, the transfer unit 110 can transfer the components of the remaining part (i.e., Figure 11A the vacant positions in the right figure in

[0102] Figure 12A and Figure 12B are Figure 9 the top view schematic diagrams of another processing manner of the embodiment.

[0103] The processing manners of the foregoing one or more embodiments can be integrated or adjusted so that the transfer unit 110 and the repair unit 120 can synchronously perform corresponding processing (e.g., transfer and repair) in different processing areas to improve the processing efficiency of the component processing equipment 100. Taking the Figure 12A processing manner as an example, the process of transferring components can be carried out in a manner similar to Figure 10A the manner described above, the difference being that a plurality of components can form corresponding sub-processing areas WS, and the sub-processing areas WS are arranged at intervals. That is to say, including the first sequence S1 or the second sequence S2 of the foregoing embodiments, the transfer, detection, or repair process performed by the processing module 104 of the present invention at one time is not limited to a single component. For example, the transfer beam L1, the welding beam L2, the detection beam L3, and the repair beam L4 can all be split into multiple beams by an optical beam splitter. Continuing to refer to Figure 12B , similar to Figure 10B the manner described above, since the object to be processed 90 is rotated by 180 degrees, the transfer unit 110 can transfer the components to the remaining part (i.e., Figure 12Athe vacancy in). At the same time, the repair unit 120 can also perform the repair process along the same direction.

[0104] In summary, in the transfer unit and the repair unit of the element processing device of the present invention, they can be adapted to perform corresponding processing (such as transfer and repair) synchronously in the mass transfer process, so as to improve the process efficiency and throughput.

[0105] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A component processing device, characterized in that, Comprising: A carrying unit for carrying an object to be processed; A control unit, signal - connected to the carrying unit, and defining the surface of the object to be processed as a plurality of processing regions; And A processing module, controlled by the control unit, and the processing module includes: A transfer unit adapted to configure a plurality of components to each of the processing regions according to a set order among the plurality of processing regions; A repair unit, synchronously processing the object to be processed with the transfer unit, and removing a part of the components configured by the transfer unit in each of the processing regions, or configuring another component to an empty position in each of the processing regions.

2. The component processing equipment according to claim 1, wherein, Wherein the carrying unit is controlled by the control unit and is movable relative to the processing module, and different processing regions of the object to be processed respectively correspond to the transfer unit and the repair unit.

3. The component processing equipment according to claim 2, characterized in that, Wherein the transfer unit and the repair unit are disposed on two sides of the object to be processed.

4. The component processing equipment according to claim 1, wherein Wherein the repair unit processes the object to be processed following the transfer unit according to at least a part of the set order.

5. The component processing equipment according to claim 4, characterized in that Wherein in one of the processing regions corresponding to at least a part of the set order, a plurality of components corresponding to the transfer unit are arranged in a first arrangement pattern, and a plurality of components corresponding to the repair unit are arranged in a second arrangement pattern, wherein the first arrangement pattern and the second arrangement pattern are rotationally symmetric to each other.

6. The component processing equipment according to claim 4, characterized in that, Wherein the set order includes at least two processing regions, and the transfer unit and the repair unit synchronously process in different processing regions.

7. The component processing equipment according to claim 4, characterized in that, Wherein the carrying unit is disposed on a rotating shaft, and the processing regions corresponding to the transfer unit and the repair unit change as the rotating shaft rotates.

8. The component processing equipment according to claim 4, characterized in that, Wherein the carrying unit can be translated along a first plane, the processing module can be translated along a second plane, and the first plane is orthogonal to the second plane.

9. The component processing equipment according to claim 1, characterized in that, Wherein a plurality of processing regions corresponding to the set order are spaced apart and arranged in a direction on the surface of the object to be processed.

10. The component processing equipment according to claim 1, characterized in that, Wherein in the set order, the transfer unit configures a plurality of components in a staggered manner in each of the processing regions.

11. The component processing equipment according to claim 1, characterized in that, Further comprising: A detection unit, controlled by the control unit, and the detection unit is adapted to perform detection means on each of the components synchronously with the transfer unit.

12. The component processing equipment according to claim 11, characterized in that, Wherein the control unit receives detection data from the detection unit and controls the processing of the repair unit according to the detection data.

13. The component processing equipment according to claim 11, characterized in that, Wherein the detection unit and the transfer unit respectively have laser light sources, and the detection unit performs the detection means on a plurality of components with the laser light source, the transfer unit configures a plurality of components with the laser light source, and the laser light source of the detection unit and the laser light source of the transfer unit are co - axial on the optical axis of the object to be processed.

14. The component processing equipment according to claim 1, wherein, Wherein the repair unit has a laser light source and includes a removal part and a repair part, the removal part is adapted to remove a part of a plurality of components configured by the transfer unit, and the repair part is adapted to configure the other component according to the position of each component removed by the removal part.

15. The component processing equipment according to claim 14, characterized in that, Further comprising: The detection unit has a laser light source. The detection unit performs detection means on a plurality of the elements with the laser light source, and the laser light source of the detection unit is coaxial with the optical axis of the object to be processed with the laser light source of the repair unit.

16. The component processing equipment according to claim 14, characterized in that, Wherein the repair part and the transfer unit are located on one side of the carrying unit, while the removal part is located on the other side of the carrying unit.

17. The component processing equipment according to claim 14, characterized in that, Wherein the repair part processes the positions of the respective elements removed synchronously with the removal part.

18. The component processing equipment according to claim 1, characterized in that, Wherein the processing module has a laser light source, and the transfer unit and the repair unit are adapted to process the object to be processed with the same laser light source.

19. The component processing equipment according to claim 1, wherein It further includes a moving platform adapted to carry a plurality of the elements and move relative to the object to be processed, and the moving platform positions at least one of the respective processing areas for the processing module to configure the plurality of elements to the processing areas.

Images