Improved data throughput using metal stents

Abstract

Aspects of the present disclosure configure a memory subsystem processor to use a triangular metal bracket to improve heat dissipation to increase data transfer rates. The triangular metal bracket is physically attached to an edge of the PCB at a base portion of the triangular metal bracket. The triangular metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with heat sinks on the primary and secondary sides of the bracket. The triangular metal bracket is configured to dissipate heat from the processing device and the set of memory components through vertex portions of the triangular metal bracket to at least one host device.

Description

[0001] Priority Application

[0002] This application claims the benefit of priority of U.S. Application No. 18 / 385,191, filed Oct. 30, 2023, which claims the benefit of priority of Indian Patent Application No. 202241067040, filed Nov. 22, 2022, the entire disclosures of all of which are incorporated herein by reference. Technical Field

[0003] Embodiments of the present disclosure generally relate to memory subsystems, and more particularly, to providing thermal management and dissipation. Background Art

[0004] A memory subsystem may be a storage system (such as a solid state drive (SSD)), and may include one or more memory components that store data. The memory components may be, for example, non-volatile memory components and volatile memory components. Generally, a host system may utilize the memory subsystem to store data on and retrieve data from the memory components. Description of the Drawings

[0005] The present disclosure will be more fully understood from the detailed description given below and from the accompanying drawings of various embodiments of the disclosure.

[0006] Figure 1 is a block diagram illustrating an example computing environment including a memory subsystem in accordance with some embodiments of the present disclosure.

[0007] Figure 2 is a diagram of an example physical assembly of a memory subsystem having a triangular metal bracket in accordance with some embodiments of the present disclosure.

[0008] Figure 3 is a block diagram of different views of an example physical assembly of a memory controller having a triangular metal bracket in accordance with some embodiments of the present disclosure.

[0009] Figure 4A is a flowchart of an example method for performing data throughput management and heat dissipation in accordance with some embodiments of the present disclosure.

[0010] Figure 4B is a flowchart of an example method for fabricating a physical assembly of a memory subsystem having a triangular metal bracket in accordance with some embodiments of the present disclosure.

[0011] Figure 5A block diagram is shown that illustrates a pictorial representation of a machine in the form of a computer system within which a set of instructions can be executed to cause the machine to perform any one or more of the methodologies discussed herein. Detailed Description

[0012] Aspects of the present disclosure configure system components (such as memory subsystem processors or controllers (e.g., power management units or modules)) to control data throughput (e.g., transfer between a memory component and a host implemented on a motherboard) based on heat dissipated through a triangular metal bracket. In response to detecting that the temperature of a processor or memory exceeds a threshold or reference temperature, the memory subsystem processor or controller adjusts (e.g., throttles or reduces) the data throughput (the rate of exchanging data with the host or transferring data from the processor to external components) to reduce the temperature. When the temperature no longer exceeds the threshold or reference temperature, the processor or controller increases the data throughput (e.g., increases the rate of exchanging data). The temperature can be controlled (minimized or reduced) to delay the time when data throughput is throttled or adjusted using a triangular metal bracket thermally coupled to one of the memory subsystem components (such as a memory controller, a memory component, and / or a memory cell) and one or more heat sinks thermally coupled to the triangular metal bracket and the memory subsystem component. The triangular metal bracket can be coupled through a ground plane of a printed circuit board (PCB) and is configured to dissipate heat to a host device, such as a motherboard, via screws similar to a heat sink. This ensures that the performance of the memory system remains optimal and avoids drastic throttling or reduction of data throughput with minimal hardware addition. This improves the overall efficiency of operating and implementing the memory subsystem.

[0013] The memory subsystem can be a storage device, a memory module, or a hybrid of a storage device and a memory module. Examples of storage devices and memory modules are described below in connection with Figure 1 Generally, a host system can utilize a memory subsystem that includes one or more memory components (such as memory devices (e.g., memory dies) that store data). The host system can send access requests (e.g., write commands, read commands) to the memory subsystem, such as to store data at the memory subsystem and read data from the memory subsystem. Data (or a data set) specified by the host is hereinafter referred to as "host data", "application data", or "user data".

[0014] A memory subsystem may initiate media management operations, such as write operations, on host data stored on a memory device. For example, as part of a garbage collection management operation, the firmware of the memory subsystem may rewrite previously written host data from one location on the memory device to a new location. The data being rewritten (e.g., as initiated by the firmware) is hereinafter referred to as "garbage collection data". "User data" may include host data and garbage collection data. "System data" hereinafter refers to data created and / or maintained by the memory subsystem for performing operations in response to host requests and for media management. Examples of system data include, but are not limited to, system tables (e.g., logical to physical address mapping tables), data from logging, scratchpad data, etc.

[0015] Many different media management operations may be performed on the memory device. For example, media management operations may include different scan rates, different scan frequencies, different wear leveling, different read disturbance management, different near miss error correction (ECC), and / or different dynamic data refresh. Wear leveling ensures that all blocks in a memory component approach their defined erase cycle budget at the same time, rather than some blocks approaching the erase cycle budget earlier. Read disturbance management counts all read operations on a memory component. If a certain threshold is reached, then the surrounding area is refreshed. Near miss ECC refreshes all data read by an application that exceeds a configured error threshold. Dynamic data refresh scans all data read as a background operation and identifies the error status of all data blocks. If a certain error threshold per block or ECC unit is exceeded during this scan read, then a refresh operation is triggered.

[0016] The memory device may be a non-volatile memory device. A non-volatile memory device is an encapsulation of one or more dice (or dies). Each die may be composed of one or more planes. For some types of non-volatile memory devices (e.g., NAND devices), each plane is composed of a set of physical blocks. For some memory devices, a block is the smallest area that can be erased. Each block is composed of a set of pages. Each page is composed of a set of memory cells that store data bits. The memory device may be a raw memory device (e.g., NAND), which is externally managed by, for example, an external controller. The memory device may be a managed memory device (e.g., managed NAND), which is a raw memory device combined with a local embedded controller for memory management within the same memory device encapsulation.

[0017] Managing or performing media management operations efficiently on a typical memory device is challenging in cases where the temperature of the memory device and / or memory controller is relatively high. Specifically, a typical memory subsystem is implemented on a printed circuit board (PCB) and components on the PCB are distributed in a manner that minimizes heat accumulation on certain components. Sometimes, specialized hardware (e.g., a heat sink) physically attached to a corresponding component can be used to improve heat dissipation and cooling of the component. When the memory device / controller becomes overheated (e.g., reaches a temperature above a threshold temperature), the typical device begins to throttle or reduce the data transfer rate and may slow down certain operations in an attempt to reduce the operating temperature. While these systems and methods are generally effective, the need to add these large heat sinks to reduce power can consume a significant amount of physical substrate area on the PCB and may exceed the maximum allowable dimensions that the PCB and the components on the PCB are permitted to reach in order to properly fit and connect to a host device (e.g., a motherboard). As a result, fewer memory components can be added and heat sinks cannot always be included (which causes the components to reach the threshold temperature very quickly), which reduces the overall data throughput and the speed at which the memory subsystem can operate.

[0018] Aspects of the present disclosure address the above and other deficiencies by providing a triangular metal bracket thermally coupled to one or more memory components (e.g., a memory processor and / or a memory die or cell), which can improve heat dissipation and act as a heat sink without violating any specifications, such as maximum height, width, and length limits or PCB space constraints. The triangular metal bracket can collect heat dissipated by the memory components and transfer the heat to the air and the host device (e.g., a motherboard) by coupling via the ground plane of the PCB. The triangular metal bracket is screwed into the host device and the memory components are connected to the host device, for example, via an interface (e.g., an M.2 interface). This provides a heat sink for the various components on the PCB without having to place the heat sink directly on top of the individual components (which would violate certain specifications and constraints). In this way, compared to a typical system, the operating temperature of the memory system can be maintained at a relatively lower level (e.g., below the threshold temperature) for a longer period of time, which can delay, defer, or prevent throttling of the data throughput and degradation of the memory system performance. This improves the efficiency of operating the memory system and can reduce the amount of physical resources consumed by the memory subsystem.

[0019] In addition, the triangular metal bracket can be physically coupled to the PCB and shaped to ensure that the PCB implementing the memory component can meet the physical specifications of the underlying host device and reduce the number of mounting holes on the motherboard. For example, the triangular metal bracket can be formed to a certain length to extend the length of the PCB to meet the minimum length of the slot corresponding to the host device. That is, the host device may include a memory slot with a length of 80 mm, while the length of the PCB is only 30 mm or 42 mm. In such cases, the triangular metal bracket can be formed to 50 mm or 38 mm and attached to the PCB in a flush manner to ensure that the PCB and the triangular metal bracket are firmly and properly assembled in the 80 mm memory slot. In addition to providing heat dissipation to the host device, the triangular metal bracket can also reduce the vibration of the PCB by absorbing a certain amount of vibration, and also increase the stiffness of the PCB, which improves the overall reliability of the memory component implemented on the PCB.

[0020] In some examples, a system is provided that includes a PCB that implements a set of memory components of a memory subsystem and a processing device operatively coupled to the set of memory components. The system includes a triangular metal bracket that includes a base portion and a vertex portion. The triangular metal bracket is physically attached to an edge of the PCB at the base portion and thermally coupled to the set of memory components and the processing device of the PCB via the base portion. The triangular metal bracket is configured to dissipate heat from the processing device and the set of memory components to at least one host device through the vertex portion, for example, via one or more screws connecting the triangular metal bracket to the host device. The processing device is configured to perform operations including: measuring a temperature of at least one of the processing device or the set of memory components; and adjusting a data transfer rate based on the measured temperature of the at least one of the processing device or the set of memory components.

[0021] In some examples, the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with the host device, and the M.2 interface is implemented on the PCB at an end opposite to the edge of the PCB to which the triangular metal bracket is physically attached. In some examples, the PCB includes a plurality of layers, and the plurality of layers include a ground layer. The set of memory components and the processing device are both coupled to the triangular metal bracket through the ground layer. In some examples, the triangular metal bracket is physically attached to the edge of the PCB using thermal epoxy.

[0022] In some examples, the edge of the PCB includes a circular recessed portion and the base portion of the triangular metal bracket includes a circular protruding portion. The circular protruding portion is configured to fit securely within the circular recessed portion to physically attach the triangular metal bracket to the edge of the PCB. In some examples, the size of the base portion of the triangular metal bracket corresponds to the width of the PCB, which is measured from the first and second sides of the PCB adjacent to the edge of the PCB.

[0023] In some examples, the length of the PCB measured between the opposite other edge of the PCB and the edge of the PCB corresponds to a first length that is less than the minimum length associated with the slot of the host device. In some aspects, the height of the triangular metal bracket measured between the base portion and the vertex portion corresponds to the minimum length associated with the slot when combined with the length of the PCB. That is, the sum of the height of the triangular metal bracket and the length of the PCB matches the length associated with the memory slot of the motherboard. In some examples, the minimum length is 80 millimeters and the length of the PCB is 30 millimeters or 42 millimeters.

[0024] In some examples, the vertex portion is configured to be physically attached to the host device via a screw and is configured to dissipate heat to the host device via the screw. In some aspects, the triangular metal bracket is configured to increase the stiffness of the PCB and absorb vibrations. In some aspects, the triangular metal bracket includes a heat sink. In some examples, a heat radiator is thermally coupled to one or more components of the PCB and thermally coupled to the triangular metal bracket via the base portion. In some aspects, the heat radiator is thermally coupled to the one or more components of the PCB via the top portion of the PCB. In some aspects, the heat radiator is a first heat radiator. In such cases, a second heat radiator is thermally coupled to the bottom portion of the PCB and thermally coupled to the triangular metal bracket via the base portion.

[0025] In some instances, the techniques described herein relate to a method of manufacturing a printed circuit board (PCB) that includes a memory system. The method includes placing a processing device on a first portion of the PCB and placing a set of memory components of the memory system on a second portion of the PCB. The method includes physically attaching a triangular metal bracket to the PCB by fitting a circular protrusion of a base of the triangular metal bracket into a circular recess of the PCB, the triangular metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least one host device through a vertex portion of the triangular metal bracket. The method includes coupling the processing device and the set of memory components to the triangular metal bracket through a ground plane of the PCB.

[0026] Although various embodiments are described herein as implemented with respect to a memory subsystem (e.g., a controller of a memory subsystem), some or all portions of the embodiments may be implemented with respect to a host system (e.g., a software application or operating system of a host system).

[0027] Figure 1 An example computing environment 100 that includes a memory subsystem 110 is illustrated in accordance with some examples of the present disclosure. The memory subsystem 110 may include media, such as memory components 112A through 112N (also referred to hereinafter as “memory devices”). The memory components 112A through 112N may be volatile memory devices, non-volatile memory devices, or a combination thereof. The memory components 112A through 112N may be implemented by individual dies such that a first memory component 112A may be implemented by a first memory die (or a first set of memory dies) and a second memory component 112N may be implemented by a second memory die (or a second set of memory dies). These individual dies may be coupled to each other on an integrated circuit and placed on a PCB as separate or combined components.

[0028] In some embodiments, the memory subsystem 110 is a storage system. The memory subsystem 110 may be a storage device, a memory module, or a hybrid of a storage device and a memory module. Examples of storage devices include solid state drives (SSDs), flash drives, universal serial bus (USB) flash drives, embedded multimedia controllers (eMMCs), universal flash storage (UFS) drives, and hard disk drives (HDDs). Examples of memory modules include dual in-line memory modules (DIMMs), small outline DIMMs (SO-DIMMs), and non-volatile dual in-line memory modules (NVDIMMs).

[0029] The computing environment 100 may include a host system 120 (e.g., a motherboard) coupled to a memory system. The memory system may include one or more memory subsystems 110. In some embodiments, the host system 120 is coupled to different types of memory subsystems 110. Figure 1 An example of a host system 120 coupled to one memory subsystem 110 is illustrated. The host system 120 uses the memory subsystem 110, for example, to write data to the memory subsystem 110 and read data from the memory subsystem 110. As used herein, "coupled to" generally refers to a connection between components, which can be an indirect communication connection or a direct communication connection (e.g., without an intermediary component), whether wired or wireless, including, for example, electrical connections, optical, magnetic connections, etc.

[0030] The host system 120 may be a computing device, such as a desktop computer, a laptop computer, a network server, a mobile device, an embedded computer (e.g., a computer included in a vehicle, industrial equipment, or a networked commercial device), a motherboard, or such a computing device including a memory and a processing device. The host system 120 may include or be coupled to the memory subsystem 110 such that the host system 120 can read data from the memory subsystem 110 or write data to the memory subsystem 110. The host system 120 may be coupled to the memory subsystem 110 via a physical host interface. Examples of physical host interfaces include but are not limited to Serial Advanced Technology Attachment (SATA) interfaces, Peripheral Component Interconnect Express (PCIe) interfaces, Universal Serial Bus (USB) interfaces, Fibre Channel interfaces, Serial Attached SCSI (SAS) interfaces, M.2 SSD interfaces, etc. The M.2 SSD interface may have certain minimum physical size specifications for the memory slot to connect to the host device. The minimum physical size may be 22 x 80 millimeters.

[0031] The physical host interface can be used to transfer data between the host system 120 and the memory subsystem 110. When the memory subsystem 110 is coupled to the host system 120 via a PCIe interface and / or an M.2 SSD interface, the host system 120 can further utilize a Non-Volatile Memory Express (NVMe) interface to access the memory components 112A through 112N. The physical host interface can provide an interface for transferring control, address, data, and other signals between the memory subsystem 110 and the host system 120. The memory subsystem 110 can be implemented on a printed circuit board (PCB) that is coupled to the host system 120 via a specified interface (e.g., an M.2 SSD interface). In some cases, the PCB on which the memory subsystem 110 is implemented is smaller than the length of the memory slot of the M.2 SSD interface of the host device. In such cases, a triangular metal bracket can be physically attached to the PCB to extend the length of the PCB to fit tightly and securely within the memory slot of the M.2 SSD interface of the host device. In addition to allowing a smaller form factor memory system implemented on the PCB to be coupled to the host device, the triangular metal bracket also aids in heat dissipation from the PCB to the host device and the durability of the PCB. By being shaped like a triangle, heat is collected from the base portion coupled to the PCB and distributed and concentrated at the apex or vertex portion of the triangle, to which the triangular metal bracket is connected to the host device. This maximizes heat dissipation to a specific physical point that is configured to receive maximum heat dissipation.

[0032] The memory components 112A through 112N can include any combination of different types of non-volatile memory components and / or volatile memory components. Examples of non-volatile memory components include NAND-type flash memory. Each of the memory components 112A through 112N can include one or more arrays of memory cells (e.g., single-level cells (SLCs) or multi-level cells (MLCs) (e.g., TLCs or QLCs)). In some embodiments, a particular memory component 112 can include both an SLC portion and an MLC portion of memory cells. Each of the memory cells can store one or more data bits (e.g., blocks) used by the host system 120. Although non-volatile memory components such as NAND-type flash memory are described, the memory components 112A through 112N can be based on any other type of memory, such as volatile memory. In some embodiments, the memory components 112A through 112N can be, but are not limited to, random access memory (RAM), read-only memory (ROM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), phase change memory (PCM), magnetoresistive random access memory (MRAM), NOR flash memory, electrically erasable programmable read-only memory (EEPROM), and cross-point arrays of non-volatile memory cells.

[0033] The cross-point array of non-volatile memory cells can perform bit storage based on the change of bulk resistance in combination with a stackable cross-grid data access array. Additionally, compared with many flash-based memories, cross-point non-volatile memory can perform in-place write operations, where non-volatile memory cells can be programmed without first erasing the non-volatile memory cells. Further, the memory cells of memory components 112A to 112N can be grouped into memory pages or blocks, which can refer to the units of memory components 112 for storing data.

[0034] The memory subsystem controller 115 can communicate with memory components 112A to 112N to perform memory operations, such as reading data, writing data, or erasing data at memory components 112A to 112N and other such operations. The memory subsystem controller 115 can communicate with memory components 112A to 112N to perform various memory management operations, such as different scan rates, different scan frequencies, different wear leveling, different read disturbance management, different near-miss ECC operations, and / or different dynamic data refreshes.

[0035] The memory subsystem controller 115 can include hardware, such as one or more integrated circuits and / or discrete components, a throughput management unit 122, a metal bracket 130 (e.g., a triangular metal bracket), buffer memory, and / or combinations thereof. The memory subsystem controller 115 can be a microcontroller, application specific logic circuitry (e.g., a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc.), or another suitable processor. The memory subsystem controller 115 can include a processor (processing device) 117 configured to execute instructions stored in local memory 119. In the illustrated example, the local memory 119 of the memory subsystem controller 115 includes embedded memory configured to store instructions for performing various processes, operations, logic flows, and routines for controlling the operation of the memory subsystem 110, including handling communication between the memory subsystem 110 and the host system 120. In some embodiments, the local memory 119 can include memory registers for storing memory pointers, retrieved data, and the like. The local memory 119 can also include a read only memory (ROM) for storing microcode (e.g., firmware) with instructions for the memory subsystem controller 115 to execute. Although Figure 1 the illustrated example memory subsystem 110 has been shown to include the memory subsystem controller 115, in another embodiment of the present disclosure, the memory subsystem 110 may not include the memory subsystem controller 115, but instead can rely on external control (e.g., provided by an external host, or provided by a processor 117 or controller separate from the memory subsystem 110).

[0036] Generally, the memory subsystem controller 115 may receive commands or operations from the host system 120 and convert the commands or operations into instructions or appropriate commands to achieve the desired access to the memory components 112A to 112N. The memory subsystem controller 115 may be responsible for other memory management operations, such as wear leveling operations, garbage collection operations, error detection and error correction code (ECC) operations, encryption operations, cache operations, memory component 112A to 112N initialization and / or address translation. The memory subsystem controller 115 may further include host interface circuitry to communicate with the host system 120 via a physical host interface. The host interface circuitry may convert commands received from the host system 120 into command instructions for accessing the memory components 112A to 112N, and convert responses associated with the memory components 112A to 112N into information for the host system 120. The memory subsystem controller 115 may include a memory interface to communicate with the memory components 112A to 112N. Any component included as part of the memory subsystem controller 115 may be included in the memory interface and vice versa.

[0037] The memory subsystem 110 may also include additional circuitry or components not shown, such as capacitors, resistors, transistors, and various other active or passive devices. In some embodiments, the memory subsystem 110 may include a cache or buffer (e.g., DRAM or other temporary storage location or device) and address circuitry (e.g., a row decoder and a column decoder), which may receive addresses from the memory subsystem controller 115 and decode the addresses to access the memory components 112A to 112N.

[0038] The memory device may be a raw memory device (e.g., NAND), which is externally managed, for example, by an external controller (e.g., the memory subsystem controller 115). The memory device may be a managed memory device (e.g., managed NAND), which is a raw memory device combined with a local embedded controller (e.g., a local media controller) for memory management within the same memory device package. Any one of the memory components 112A to 112N may include a media controller (e.g., media controller 113A and media controller 113N) to manage the memory cells of the memory component (e.g., to perform one or more memory management operations), to communicate with the memory subsystem controller 115, and to execute memory requests (e.g., read or write) received from the memory subsystem controller 115.

[0039] The memory subsystem controller 115 may include a throughput management unit 122 coupled to a metal bracket 130. In some cases, the throughput management unit 122 may be a physical component separate from the components of the memory subsystem controller 115. In some cases, the throughput management unit 122 and the components of the memory subsystem controller 115 are implemented by the same physical device or integrated circuit. The metal bracket 130 is a physical device separate from the throughput management unit 122 and / or the memory subsystem controller 115. The metal bracket 130 is physically and thermally connected and coupled to the PCB on which the memory subsystem 110 is implemented. For example, the metal bracket 130 may be triangular in shape, where the base of the triangle has a size corresponding to or matching the width of the PCB and is connected to the edge of the PCB in a flush manner. The metal bracket 130 includes an apex or vertex at an end opposite the base of the triangle, where a screw engages or physically attaches the metal bracket 130 to the host system 120 (e.g., a motherboard). The metal bracket 130 implements a heat sink (which may be an active or passive heat sink), which is configured to absorb or receive heat from one of the components of the memory subsystem 110 and dissipate this heat at least to air or other fluid or gas to cool the components of the memory subsystem 110 and / or the host system 120 via one or more screws connecting the metal bracket 130 to the host system 120.

[0040] In one example, the metal bracket 130 may be implemented by a triangular metal bracket that is coupled to the ground plane of the PCB on which the memory subsystem 110 is implemented. Heat may be transferred via the ground plane to the metal bracket 130 and dissipated to the host system 120 and / or an external fluid or gas. In this way, the metal bracket 130 acts as a remote heat sink and the temperature of the memory subsystem 110 may be reduced or maintained at a relatively low level to prevent the throughput management unit 122 from reducing the throughput of the memory subsystem 110 in response to detecting that the temperature of one or more components of the memory subsystem 110 exceeds a temperature threshold or reference temperature. This keeps the data rate operating at an optimal or maximum level, which improves the overall efficiency and operation of the device. In some examples, the metal bracket 130 may collect heat dissipated by the memory subsystem controller 115 and / or one or more components of the memory subsystem 110 (e.g., memory components 112A to 112N), and may convert the dissipated heat it collects into electrical energy or power to return the power to one or more devices or components. This increases the efficiency of operating the memory system and reduces the amount of physical resources consumed by the memory subsystem.

[0041] Depending on the embodiment, throughput management unit 122 may include logic (e.g., a set of transient or non-transitory machine instructions such as firmware) or one or more components that cause throughput management unit 122 to perform the operations described herein. Throughput management unit 122 may include a tangible or intangible unit capable of performing the operations described herein.

[0042] For example, throughput management unit 122 may be configured to access a reference temperature for controlling data transfer throughput (the rate of data transfer between a host and a memory subsystem). Throughput management unit 122 measures the temperature of at least one of a processing device or the set of memory components using a temperature sensor (not shown). Heat associated with at least one of the components of memory subsystem 110 may be dissipated at least in part through metal bracket 130, which may include one or more heat sinks, that is thermally coupled to the processing device and the set of memory components. Throughput management unit 122 adjusts or reduces data transfer throughput in response to determining that the measured temperature exceeds the reference temperature. Throughput management unit 122 adjusts or increases data transfer throughput in response to determining that the measured temperature no longer exceeds or fails to exceed the reference temperature.

[0043] In some instances, a printed circuit board (PCB) is provided on which the set of memory components, the processing device (and various other components of memory subsystem 110) are implemented. In some instances, the PCB includes a plurality of layers, each accessible via one or more vias, that include a ground plane. Metal bracket 130 is external to the PCB and coupled to the PCB to facilitate heat dissipation and to ensure that the PCB fits properly and snugly within a memory slot of host system 120 by increasing the length of the PCB by an amount corresponding to the length or height of metal bracket 130. The set of memory components and the processing device are each coupled to metal bracket 130 via the ground plane, where heat is dissipated to metal bracket 130 via the ground plane.

[0044] In some instances, metal bracket 130 is coupled to the ground plane via one or more vias (e.g., thermal vias or holes drilled into the PCB). In some aspects, throughput management unit 122 is implemented by a physical chip having a specified height relative to the top layer of the PCB. The height of metal bracket 130 may be less than or equal to the specified height of the physical chip. In some instances, the set of memory components are implemented by physical chips having a specified height relative to the top layer of the PCB. The height of metal bracket 130 may be less than or equal to the specified height of the physical chip. In some instances, the specified height includes 1.5 millimeters or less.

[0045] In some instances, the PCB includes the set of memory components and an M.2 interface through which the throughput management unit 122 communicates with the host system 120. The metal bracket 130 may be connected to the PCB at an opposite end of the M.2 interface, as shown in more detail below in Figure 2 and 3 In some instances, the metal bracket 130 includes a heat sink.

[0046] Figure 2 FIG. is a diagram of an example physical assembly 200 that includes a metal bracket 130 and a PCB 201, in accordance with some embodiments of the present disclosure. A memory subsystem 110 is implemented on the PCB 201. The PCB 201 includes an interface 220 (e.g., an M.2 interface), a control component 210, and memory components 230. The metal bracket 130, as part of the physical assembly 200, may be triangular in shape, with a base portion 250 physically coupled to the PCB 201 at an edge of the PCB 201. The metal bracket 130 includes a vertex or apex portion 251 where a screw may be connected to the underlying host system 120 at point 252.

[0047] The control component 210 may include a physical chip or integrated circuit package in which any of the components of the memory subsystem 110 (e.g., the memory subsystem controller 115) may be implemented. The memory components 230 may include one or more physical chips or integrated circuit packages in which any of the memory components 112 are implemented. The memory subsystem 110 communicates with the host system 120 via the interface 220. In some cases, the memory subsystem 110 communicates with the host system 120 at a first throughput or data rate. When the throughput management unit 122 determines that the temperature of the control component 210 and / or the memory components 230 reaches or exceeds a temperature threshold or reference temperature, the throughput management unit 122 may throttle or reduce the data rate such that the memory subsystem 110 communicates with the host system 120 at a second throughput or data transfer rate. This allows the throughput management unit 122 to reduce the operating temperature of the memory subsystem 110 to continue operation without having to shut down any components.

[0048] To increase the time it takes for the memory subsystem 110 to reach the temperature threshold or reference temperature from the ambient temperature, the PCB is connected to the metal bracket 130. The metal bracket 130 is physically thermally coupled to one or more of the control component 210, the memory components 230, and / or the interface 220 via a recessed connection 254 through a ground plane or other internal metal layer of the PCB.

[0049] In some instances, the recessed connection 254 can be formed by placing a notch at the end of the PCB 201, and the notch is rounded to form a semi-circular connection with the specified diameter. The recessed connection 254 can be electrically connected to one or more ground layers of the PCB 201. The metal bracket 130 can include a circular protruding portion 253 that is circular in shape to form a semi-circular connection with the specified diameter. The diameter of the protruding portion 253 can match the diameter of the recessed connection 254. This allows the metal bracket 130 to be tightly and firmly connected to the PCB 201 in a flush manner. Once the metal bracket 130 is physically attached to the PCB 201, thermal epoxy is placed on the protruding portions 253 and 254 to firmly attach the metal bracket 130 to the PCB 201.

[0050] In some instances, the physical assembly 200 includes a first heat sink 260 and a second heat sink 261. The first heat sink 260 can be placed on top of the PCB 201 to physically contact one or more physical components on the top layer of the PCB 201. The first heat sink 260 is also thermally coupled to the metal bracket 130, for example, via the top portion of the protruding portion 253. This further allows the components on the PCB 201 to dissipate heat and transfer the heat to the metal bracket 130 through the first heat sink 260, and then to the host system 120. In this way, heat can be dissipated electrically through the ground plane and dissipated thermally through the PCB 201 and through external physical contact with the first heat sink 260.

[0051] The second heat sink 261 can be placed on the bottom portion of the PCB 201 to physically contact one or more physical components of the PCB 201 from the bottom. The second heat sink 261 is also thermally coupled to the metal bracket 130, for example, via the bottom portion of the protruding portion 253. This further allows the components on the PCB 201 to dissipate heat and transfer the heat to the metal bracket 130 through the second heat sink 261, and then to the host system 120. In this way, heat can be dissipated electrically through the ground plane and dissipated thermally through the PCB 201 and through external physical contact with the second heat sink 261.

[0052] Figure 3 is a block diagram of different views 300 of an example physical assembly 200 of a memory controller having a triangular metal bracket 130 according to some embodiments of the present disclosure. Figure 3 Shows a top view 301 of the physical assembly 200, a side view 302 of the physical assembly 200, a bottom view 303 of the physical assembly 200, a perspective top view 305 of the physical assembly 200, a perspective bottom view 304 of the physical assembly 200, and a cross-sectional view 306 of the physical assembly 200.

[0053] As shown in the top view 301, the physical assembly 200 includes a PCB 320 (which corresponds to the PCB 201 from Figure 2 ), a first heat sink 330 (corresponding to the first heat sink 260), and a triangular metal bracket 310 (corresponding to the metal bracket 130). As shown in the side view 302, the first heat sink 330 is physically coupled to the triangular metal bracket 310 via the top portion 340 of the protruding portion 253( Figure 2 ). The PCB 320 includes an interface at an end opposite to the edge or point where the PCB 320 is coupled to the triangular metal bracket 310 for electronically coupling the PCB 320 to the host system 120.

[0054] As shown in the bottom view 303, the physical assembly 200 includes a second heat sink 350 (corresponding to the second heat sink 261) and a triangular metal bracket 310 (corresponding to the metal bracket 130). The second heat sink 350 is coupled to the triangular metal bracket 310 via the bottom portion of the protruding portion 253( Figure 2 ). The first heat sink 330 and the second heat sink 350 may cover only a part or less than all of the PCB 320.

[0055] The PCB 320 may have a certain width measured from the first side 321 and the second side 322 of the PCB 320, where the first side 321 and the second side 322 are adjacent to the edge 323 of the PCB 320, and the PCB 320 is connected to the triangular metal bracket 310 at the edge 323. That is, the width of the PCB 320 is the distance between the first side 321 and the second side 322 and corresponds to the width of the base portion of the triangular metal bracket 310. The length of the PCB 320 is measured between the opposite other edge 324 of the PCB (where the interface of the PCB 320 is placed) and the edge 323 of the PCB connected to the triangular metal bracket 310. The length of the PCB 320 may be a first length smaller than the minimum length associated with the slot of the host system 120. For example, the first length may be 30 mm or 42 mm and the minimum length associated with the slot of the host system 120 may be 80 mm.

[0056] The size of the base portion of the triangular metal bracket 310 connected to the PCB 320 may be the same as the width of the PCB 320. The top of the triangular metal bracket 310 may correspond to the vertex or apex of the triangular metal bracket 310, which may be smaller than the size of the base portion. The distance between the point 252 of the triangular metal bracket 310 and the base portion 250 may be specified to allow the PCB 320 to have a length long enough to be assembled in the slot of the host system 120, and the length may be 80 millimeters. That is, the height of the triangular metal bracket 310 may be made such that when combined with the length of the PCB 320, it matches the size of the slot of the host system 120.

[0057] Figure 4A is a flowchart of an example method for performing data throughput management and heat dissipation according to some embodiments of the present disclosure. The method 400 may be executed by processing logic, which may include hardware (e.g., a processing device, circuitry, dedicated logic, programmable logic, microcode, hardware of a device, an integrated circuit, etc.), software (e.g., instructions running or executing on a processing device), or a combination thereof. In some embodiments, the method 400 is executed by Figure 1 the throughput management unit 122. Although the processes are shown in a particular order or sequence, the order of the processes may be modified unless otherwise specified. Accordingly, the illustrated embodiments should be understood as merely examples, and the illustrated processes may be executed in a different order, and some processes may be executed in parallel. Additionally, one or more processes may be omitted in various embodiments. Thus, not all processes are required in every embodiment. Other process flows are possible.

[0058] Now referring to Figure 4A , the method (or process) 400 begins at operation 410, where the throughput management unit 122 of the memory subsystem (e.g., the memory subsystem 110) measures the temperature of at least one of the processing devices or a set of memory components implemented on the PCB, where the triangular metal bracket is physically attached to the edge of the PCB at the base portion of the triangular metal bracket. The triangular metal bracket is thermally coupled to the set of memory components and the processing device via the base portion, and is configured to dissipate heat from the processing device and the set of memory components to at least one host device (e.g., a motherboard) through the vertex portion of the triangular metal bracket. Then, at operation 415, the throughput management unit 122 adjusts the data transfer rate based on the measured temperature, e.g., by comparing the measured temperature with a reference temperature and reducing the data transfer rate in response to determining that the temperature exceeds the reference temperature (by more than a specified amount).

[0059] Figure 4B401 is a flowchart of an example method for manufacturing a physical assembly of a memory subsystem having a triangular metal bracket according to some embodiments of the present disclosure. Method 401 may be performed by processing logic, which may include hardware (e.g., a processing device, a circuit system, a dedicated logic, a programmable logic, a microcode, hardware of a device, an integrated circuit, etc.), software (e.g., instructions running or executed on a processing device), or a combination thereof. Although the processes are shown in a particular order or sequence, the order of the processes may be modified unless otherwise specified. Therefore, the illustrated embodiments should be understood to be merely examples, and the illustrated processes may be performed in a different order, and some processes may be performed in parallel. In addition, one or more processes may be omitted in various embodiments. Therefore, not all processes are required in every embodiment. Other process flows are possible.

[0060] Reference Figure 4B , the method (or process) 401 begins at operation 406, where a processing device is placed on a first portion of a PCB and at operation 411, a set of memory components 112 are placed on a second portion of the PCB. Next, at operation 416, a metal bracket 130 is physically attached to the PCB by fitting a circular protruding portion of a base of the metal bracket 130 to a circular recessed portion of the PCB. The metal bracket 130 is configured to dissipate heat from the processing device and the set of memory components to at least one host device through the vertex portion of the triangular metal bracket. At operation 421, the processing device and the set of memory components are coupled to the metal bracket 130 through a ground layer of the PCB.

[0061] In view of the above disclosure, various examples are described below. It should be noted that one or more features of the examples, whether isolated or in combination, should be considered within the disclosure of this application.

[0062] Example 1. A system comprising: a printed circuit board (PCB), comprising: a set of memory components of a memory subsystem; and a processing device, which is operably coupled to the set of memory components; and a triangular metal bracket, which includes a base portion and an apex portion, the triangular metal bracket is physically attached to an edge of the PCB at the base portion, the triangular metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion, and the triangular metal bracket is configured to dissipate heat from the processing device and the set of memory components to at least one host device through the apex portion, wherein the processing device is configured to perform operations including the following: measuring the temperature of the processing device or at least one of the set of memory components; and adjusting a data transfer rate based on the measured temperature of the processing device or at least one of the set of memory components.

[0063] Example 2. A system according to Example 1, wherein the PCB includes the set of memory components and an M.2 interface through which the processing device communicates with the host device, and the M.2 interface is implemented on the PCB at an end opposite to the edge of the PCB to which the triangular metal bracket is physically attached.

[0064] Example 3. The system of any of examples 1-2, wherein the PCB comprises a plurality of layers, the plurality of layers including a ground layer, and wherein the set of memory components and the processing device are both coupled to the triangular metal bracket through the ground layer.

[0065] Example 4. The system of any of examples 1 to 3, wherein the triangular metal bracket is physically attached to the edge of the PCB using thermal epoxy.

[0066] Example 5. A system according to any one of Examples 1 to 4, wherein the edge of the PCB includes a circular recessed portion, wherein the base portion of the triangular metal bracket includes a circular protrusion, and wherein the circular protrusion is configured to fit within the circular recessed portion to physically attach the triangular metal bracket to the edge of the PCB.

[0067] Example 6. The system of Example 5, wherein the base portion of the triangular metal bracket is sized to correspond to a width of the PCB, the width being measured from first and second sides of the PCB adjacent to the edge of the PCB.

[0068] Example 7. A system according to any of Examples 5 to 6, wherein a length of the PCB measured between another opposite edge of the PCB and the edge of the PCB corresponds to a first length that is less than a minimum length associated with a slot of the host device.

[0069] Example 8. The system of Example 7, wherein a height of the triangular metal bracket measured between the base portion and the apex portion corresponds to the minimum length associated with the slot when combined with the length of the PCB.

[0070] Example 9. The system of any of Examples 7-8, wherein the minimum length comprises 80 mm, and wherein the length of the PCB comprises 30 mm or 42 mm.

[0071] Example 10. The system of any of examples 1-9, wherein the apex portion is configured to be physically attached to the host device via screws and configured to dissipate heat to the host device via the screws.

[0072] Example 11. The system of any of examples 1-10, wherein the triangular metal bracket is configured to increase the stiffness of the PCB and absorb vibrations.

[0073] Example 12. The system of any of Examples 1 to 11, wherein the triangular metal bracket comprises a heat sink.

[0074] Example 13. The system of any of examples 1-12, comprising: a heat sink thermally coupled to one or more components of the PCB and to the triangular metal bracket via the base portion.

[0075] Example 14. The system of example 13, wherein the heat sink is thermally coupled to the one or more components of the PCB via a top portion of the PCB.

[0076] Example 15. The system of Example 14, wherein the heat sink is a first heat sink comprising a second heat sink thermally coupled to a bottom portion of the PCB and thermally coupled to the triangular metal bracket via the base portion.

[0077] Example 16. A method comprising: measuring the temperature of at least one of a processing device or a set of memory components implemented on a printed circuit board (PCB), a triangular metal bracket being physically attached to an edge of the PCB at a base portion of the triangular metal bracket, the triangular metal bracket being thermally coupled to the set of memory components and the processing device of the PCB via the base portion, and the triangular metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least one host device through a vertex portion of the triangular metal bracket; and adjusting a data transfer rate based on the measured temperature of the processing device or the at least one of the set of memory components.

[0078] Example 17. A method according to Example 16, wherein the PCB includes the set of memory components and an M.2 interface through which the processing device communicates with the host device, and the M.2 interface is implemented on the PCB at an end opposite to the edge of the PCB to which the triangular metal bracket is physically attached.

[0079] Example 18. The method of any of Examples 16-17, wherein the PCB comprises a plurality of layers, the plurality of layers including a ground layer, and wherein the set of memory components and the processing device are both coupled to the triangular metal bracket through the ground layer.

[0080] Example 19. The method of any of Examples 16-18, wherein the triangular metal bracket is physically attached to the edge of the PCB using thermal epoxy.

[0081] Example 20. A method for manufacturing a PCB including a memory system, the method comprising: placing a processing device on a first portion of the PCB; placing a group of memory components of the memory system on a second portion of the PCB; physically attaching the triangular metal bracket to the PCB by fitting a circular protruding portion of a base of the triangular metal bracket to a circular recessed portion of the PCB, the triangular metal bracket being configured to dissipate heat from the processing device and the group of memory components to at least one host device through a vertex portion of the triangular metal bracket; and coupling the processing device and the group of memory components to the triangular metal bracket through a ground layer of the PCB.

[0082] Methods and computer-readable storage media having instructions for performing any of the above examples.

[0083] Figure 5 An example machine in the form of a computer system 500 is illustrated within which a set of instructions may be executed for causing the machine to perform any one or more of the methodologies discussed herein. In some embodiments, the computer system 500 may correspond to a host system (e.g., Figure 1 1) a host system 120 that includes, is coupled to, or utilizes a memory subsystem (e.g., Figure 1 The memory subsystem 110 of the controller may be used to execute the operation of the controller (for example, to execute the operating system to execute the corresponding Figure 1 In some embodiments, the machine may be connected (e.g., using a network) to other machines in a local area network (LAN), an intranet, an extranet, and / or the Internet. The machine may operate in the capacity of a server or a client user machine in a client-server network environment, as a peer machine in a peer-to-peer (or distributed) network environment, or as a server or a client user machine in a cloud computing infrastructure or environment.

[0084] The machine may be a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a cellular phone, a network appliance, a server, a network router, a network switch or bridge, or any machine capable of executing a set of instructions (sequential or otherwise) that specify actions to be taken by that machine. Furthermore, while a single machine is described, the term "machine" shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein.

[0085] The example computer system 500 includes a processing device 502, a main memory 504 (e.g., read-only memory (ROM, flash memory, dynamic random access memory (DRAM)) (e.g., synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), etc.), a static memory 506 (e.g., flash memory, static random access memory (SRAM)), etc.), and a data storage device 518, which communicate with each other via a bus 530.

[0086] The processing device 502 represents one or more general-purpose processing devices, such as a microprocessor, a central processing unit, or the like. More specifically, the processing device 502 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets or a processor that implements a combination of instruction sets. The processing device 502 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, or the like. The processing device 502 is configured to execute instructions 526 for performing the operations and steps discussed herein. The computer system 500 may further include a network interface device 508 for communicating over a network 520.

[0087] The data storage device 518 may include a machine-readable storage medium 524 (also referred to as a computer-readable medium) having stored thereon one or more sets of instructions 526 or software embodying any one or more of the methodologies or functions described herein. The instructions 526 may also reside, in whole or in part, within the main memory 504 and / or within the processing device 502 during execution by the computer system 500, the main memory 504 and the processing device 502 also constituting machine-readable storage media. The machine-readable storage medium 524, the data storage device 518, and / or the main memory 504 may correspond to Figure 1 Memory subsystem 110.

[0088] In one embodiment, instructions 526 include implementing Figure 1 The functionality of the throughput management unit 122 of the present disclosure is provided. Although the machine-readable storage medium 524 is shown as a single medium in the example embodiment, the term "machine-readable storage medium" should be considered to include a single medium or multiple media storing one or more sets of instructions. The term "machine-readable storage medium" should also be considered to include any medium capable of storing or encoding a set of instructions for execution by a machine and causing the machine to perform any one or more methodologies of the present disclosure. Therefore, the term "machine-readable storage medium" should be considered to include, but not be limited to, solid-state memory, optical media, and magnetic media.

[0089] Some portions of the foregoing detailed description have been presented in terms of algorithms and symbolic representations of operations on data bits within a computer memory. These algorithmic descriptions and representations are the means used by those skilled in the data processing arts to most effectively convey the substance of their work to others skilled in the art. An algorithm is herein and generally considered to be a self-consistent sequence of operations leading to a desired result. The operations are those requiring physical manipulation of physical quantities. Typically, but not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, combined, compared, and otherwise manipulated. It has proven convenient at times, primarily for common usage reasons, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.

[0090] It should be remembered, however, that all of these and similar terms are associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. The present disclosure may be directed to the actions and processes of a computer system or similar electronic computing device that manipulates and transforms data represented as physical (electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system's memories or registers or other such information storage systems.

[0091] The present disclosure also relates to an apparatus for performing the operations described herein. This apparatus may be specially constructed for the intended purpose, or it may comprise a general purpose computer selectively activated or reconfigured by a computer program stored in the computer. This computer program may be stored in a computer-readable storage medium, such as, but not limited to, any type of disk, including floppy disks, optical disks, CD-ROMs, and magneto-optical disks; read-only memory (ROM); random access memory (RAM), erasable programmable read-only memory (EPROM); EEPROM; magnetic or optical cards; or any type of medium suitable for storing electronic instructions, each coupled to a computer system bus.

[0092] The algorithms and displays presented herein are not inherently related to any particular computer or other device. Various general purpose systems may be used with programs according to the teachings herein, or it may prove convenient to build more specialized equipment to perform the methods. The structures of various these systems will appear as described in the above description. In addition, the present disclosure is not described with reference to any particular programming language. It will be appreciated that various programming languages ​​may be used to implement the teachings of the present disclosure as described herein.

[0093] The present disclosure may be provided as a computer program product or software that may include a machine-readable medium having instructions stored thereon, which instructions may be used to program a computer system (or other electronic device) to perform a method according to the present disclosure. The machine-readable medium includes any mechanism for storing information in a form readable by a machine (e.g., a computer). In some embodiments, the machine-readable (e.g., computer-readable) readable medium includes a machine-readable (e.g., computer-readable) storage medium, such as a read-only memory (ROM), a random access memory (RAM), a disk storage medium, an optical storage medium, a flash memory component, and the like.

[0094] In the foregoing description, embodiments of the present disclosure have been described with reference to specific example embodiments thereof. It will be apparent that various modifications may be made to the present disclosure without departing from the broader spirit and scope of the embodiments of the present disclosure as set forth in the appended claims. Accordingly, the description and drawings should be regarded in an illustrative rather than a restrictive sense.

Claims

1. A system, comprising: A printed circuit board (PCB), comprising: A set of memory components of a memory subsystem; and A processing device operatively coupled to the set of memory components; and A metal bracket, comprising a base portion and a vertex portion, the metal bracket being physically attached to an edge of the PCB at the base portion, the metal bracket being thermally coupled to the set of memory components and the processing device of the PCB via the base portion, and the metal bracket being configured to dissipate heat from the processing device and the set of memory components through the vertex portion, Wherein the processing device is configured to perform operations including: Measuring the temperature of at least one of the processing device or the set of memory components; and Adjusting a data transfer rate based on the measured temperature of at least one of the processing device or the set of memory components.

2. The system according to claim 1, wherein the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with a host device, and the M.2 interface is implemented on the PCB at an end opposite to the edge of the PCB to which the metal bracket is physically attached.

3. The system according to claim 1, wherein the PCB includes a plurality of layers, the plurality of layers including a ground layer, and wherein the set of memory components and the processing device are both coupled to the metal bracket through the ground layer.

4. The system according to claim 1, wherein the metal bracket is a triangular metal bracket, and wherein the triangular metal bracket is physically attached to the edge of the PCB using thermal epoxy.

5. The system according to claim 1, wherein the edge of the PCB includes a circular recessed portion, wherein the base portion of the metal bracket includes a circular protruding portion, and wherein the circular protruding portion is configured to fit within the circular recessed portion to physically attach the metal bracket to the edge of the PCB.

6. The system according to claim 5, wherein the size of the base portion of the metal bracket corresponds to the width of the PCB, the width being measured from the first and second sides of the PCB adjacent to the edge of the PCB.

7. The system according to claim 5, wherein the length of the PCB measured between the opposite edge of the PCB and the edge of the PCB corresponds to a first length, the first length being less than the minimum length associated with a slot of a host device.

8. The system according to claim 7, wherein the height of the metal bracket measured between the base portion and the vertex portion corresponds to the minimum length associated with the slot when combined with the length of the PCB.

9. The system according to claim 7, wherein the minimum length includes 80 millimeters, and wherein the length of the PCB includes 30 millimeters or 42 millimeters.

10. The system according to claim 1, wherein the vertex portion is configured to be physically attached to the host device via a screw and is configured to dissipate heat to the host device via the screw.

11. The system according to claim 1, wherein the metal bracket is configured to increase the stiffness of the PCB and absorb vibrations.

12. The system according to claim 1, wherein the metal bracket includes a heat sink.

13. The system according to claim 1, comprising: a heat sink thermally coupled to one or more components of the PCB and thermally coupled to the metal bracket via the base portion.

14. The system according to claim 13, wherein the heat sink is thermally coupled to the one or more components of the PCB via the top portion of the PCB.

15. The system according to claim 14, wherein the heat sink is a first heat sink, and the heat sink includes a second heat sink thermally coupled to the bottom portion of the PCB and thermally coupled to the metal bracket via the base portion.

16. A method, comprising: measuring the temperature of at least one of a processing device or a set of memory components implemented on a printed circuit board (PCB), a metal bracket being physically attached to an edge of the PCB at a base portion of the metal bracket, the metal bracket being thermally coupled to the set of memory components and the processing device of the PCB via the base portion, and the metal bracket being configured to dissipate heat from the processing device and the set of memory components through a vertex portion of the metal bracket; and adjusting a data transfer rate based on the measured temperature of at least one of the processing device or the set of memory components.

17. The method according to claim 16, wherein the PCB includes an M.2 interface through which the set of memory components and the processing device communicate with a host device, the M.2 interface being implemented on the PCB at an end opposite to the edge of the PCB to which the metal bracket is physically attached.

18. The method according to claim 16, wherein the PCB includes a plurality of layers, the plurality of layers including a ground layer, and wherein the set of memory components and the processing device are both coupled to the metal bracket through the ground layer.

19. The method according to claim 16, wherein the metal bracket includes a triangular metal bracket physically attached to the edge of the PCB using a thermal epoxy.

20. A method of manufacturing a printed circuit board (PCB) including a memory system, the method comprising: placing a processing device on a first portion of the PCB; placing a set of memory components of the memory system on a second portion of the PCB; physically attaching the metal bracket to the PCB by fitting a circular protruding portion of a base of the metal bracket into a circular recessed portion of the PCB, the metal bracket being configured to dissipate heat from the processing device and the set of memory components through a vertex portion of the metal bracket; and Couple the processing device and the set of memory components to the metal bracket through a ground plane of the PCB.

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