Heating non-combustion device and heating control method thereof

Abstract

The invention relates to a heating non-combustion device and a heating control method thereof. The method includes, in a first stage, controlling the heating assembly to heat the aerosol-forming substrate to raise the temperature of the aerosol-forming substrate from an initial temperature to a first temperature. And in the second stage, the heating assembly is controlled to stop heating the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate is reduced from the first temperature. And in the third stage, the heating assembly is controlled to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate is increased from the current temperature to a third temperature. Wherein the third temperature is greater than or equal to the first temperature. The invention is capable of providing aerosol delivery that does not vary with time and has consistent characteristics.

Description

Technical Field

[0001] The present invention relates to the field of electronic atomization, and particularly to a heat-not-burn device and a heating control method thereof. Background Art

[0002] In a heat-not-burn device, it is desired to generate an aerosol that does not change with time. Especially when the aerosol is for human consumption, during continuous or repeated heating, the fluctuation range of the heating temperature will affect the change of the aerosol-forming substance carrying nicotine and in some cases flavors. Therefore, it is impossible to provide a consistent aerosol delivery with characteristics that do not change with time. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a heat-not-burn device and a heating control method thereof in view of the defect that it is impossible to provide a consistent aerosol delivery with characteristics that do not change with time.

[0004] The technical solution adopted by the present invention to solve its technical problem is: a heating control method for a heat-not-burn device, the heat-not-burn device including a heating component, comprising:

[0005] In the first stage, controlling the heating component to heat the aerosol-forming matrix so that the temperature of the aerosol-forming matrix rises from an initial temperature to a first temperature;

[0006] In the second stage, controlling the heating component to stop heating the aerosol-forming matrix so that the temperature of the aerosol-forming matrix drops from the first temperature;

[0007] In the third stage, controlling the heating component to heat the aerosol-forming matrix so that the temperature of the aerosol-forming matrix rises from the current temperature to a third temperature; wherein, the third temperature is greater than or equal to the first temperature.

[0008] Preferably, in the first stage, the temperature of the aerosol-forming matrix rises in a curve form with time;

[0009] In the second stage, the temperature of the aerosol-forming matrix drops in a curve form;

[0010] In the third stage, the temperature of the aerosol-forming matrix rises in a curve form.

[0011] Preferably, in the step of controlling the heating component to stop heating the aerosol-forming matrix so that the temperature of the aerosol-forming matrix drops from the first temperature in the second stage, it includes:

[0012] In the second stage, control the heating component to stop heating the aerosol-forming substrate for a preset duration, so that the temperature of the aerosol-forming substrate naturally cools down from the first temperature; or

[0013] In the second stage, control the heating component to stop heating the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate drops from the first temperature to the second temperature.

[0014] Preferably, it further includes:

[0015] Control the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate remains within a preset allowable temperature range in the first stage and the third stage;

[0016] Control the heating component to stop heating the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate remains within the allowable temperature range in the second stage.

[0017] Preferably, the allowable temperature range has an upper limit between 450°C and 500°C and a lower limit between 250°C and 300°C;

[0018] The first temperature is between 300°C and 450°C.

[0019] Preferably, the time of the first stage is less than 20 seconds;

[0020] The time of the second stage is less than 2 seconds;

[0021] The time of the third stage is from the end moment of the second stage to 600 seconds.

[0022] In addition, the present invention also provides a heat-not-burn device, including:

[0023] A heating component for heating the aerosol-forming substrate;

[0024] A battery component for supplying power to the heating component;

[0025] A control component, and the control component is configured to:

[0026] In the first stage, control the heating component to heat the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate rises from the initial temperature to the first temperature;

[0027] In the second stage, control the heating component to stop heating the aerosol-forming substrate, so that the temperature of the aerosol-forming substrate drops from the first temperature;

[0028] In the third stage, the heating component is controlled to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate increases from the current temperature to a third temperature; wherein the third temperature is greater than or equal to the first temperature.

[0029] Preferably, the heating assembly comprises a shell and a heating element, the heating element is used for electrically heating to generate infrared light for heating the aerosol-forming matrix, the heating element is at least partially spaced apart from a shell wall of the shell, and the shell allows the infrared light to pass through.

[0030] Preferably, the heating element is located in the shell, and the heating element includes a heating base and an infrared radiation layer coated outside the heating base; the heating element is used to excite the infrared radiation layer to generate infrared light after being energized; at least part of the shell is used to insert an aerosol-forming matrix; or

[0031] The heating elements are arranged at intervals on the outer periphery of the shell, and the interior of the shell is hollow and forms a second accommodating cavity for accommodating the aerosol-forming substrate.

[0032] Preferably, the housing comprises a first tube body and a second tube body sleeved on the periphery of the first tube body;

[0033] A gap is left between the first tube body and the second tube body, and the gap forms a first accommodating cavity for accommodating the heating element;

[0034] The heating element is arranged on the outer periphery of the first tube body and is spaced apart from the outer wall of the first tube body, and a second accommodating cavity for heating the aerosol-forming substrate is formed inside the first tube body;

[0035] The heating element comprises a heating base and an infrared radiation layer coated outside the heating base; the heating component is used for exciting the infrared radiation layer to generate infrared light after being energized.

[0036] The implementation of the heating-without-combustion device and the heating control method thereof of the present invention has at least the following beneficial effects: by controlling the heating component to stop heating the aerosol-forming substrate in the second stage, so that the temperature of the aerosol-forming substrate drops from the first temperature, it can prevent burning and ensure that the aerosol-forming substrate continues to generate aerosol at the optimal temperature during the entire puffing process. Moreover, by raising the temperature again in the third stage, the heat conduction rate from the heating component to the aerosol-forming substrate is increased, thereby providing aerosol transmission with consistent characteristics that do not change over time. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0038] Figure 1Schematic flow chart of the heating control method of the heat-not-burn device according to Embodiment 1 of the present invention;

[0039] Figure 2 Schematic diagram of the temperature distribution of the aerosol-forming substrate in Embodiment 1 of the present invention;

[0040] Figure 3 Schematic structural diagram of the heat-not-burn device according to Embodiment 1 of the present invention;

[0041] Figure 4 Circuit diagram of the heat-not-burn device according to Embodiment 1 of the present invention;

[0042] Figure 5 Schematic structural diagram of the heating component in Embodiment 1 of the present invention;

[0043] Figure 6 is Figure 5 Cross-sectional view of the shown heating component;

[0044] Figure 7 is Figure 5 Exploded schematic structural diagram of the shown heating component;

[0045] Figure 8 is Figure 7 Cross-sectional view of the shown heating element in the horizontal direction;

[0046] Figure 9 Schematic structural diagram of the heating component in Embodiment 2 of the present invention;

[0047] Figure 10 is Figure 9 Schematic structural diagram of the shown heating component from another angle;

[0048] Figure 11 is Figure 9 Cross-sectional view of the shown heating component;

[0049] Figure 12 is Figure 9 Exploded schematic structural diagram of the shown heating component.

[0050] In the figure: 1 - outer shell, 11 - heating component, 3 - battery component, 4 - control component, 5 - aerosol-forming substrate, 20 - temperature measuring element, 111 - housing, 112 - heating element, 113 - base, 1110 - opening, 1111 - tubular body, 1112 - spire structure, 1113 - first accommodating cavity, 1114 - gap, 1120 - heating part, 112d - first free end, 112e - second free end, 112a - first heating part, 112b - second heating part, 1121 - conductive part, 1122 - heating matrix, 1124 - infrared radiation layer, 1123 - antioxidant layer, 111a - first tube body, 111b - second tube body, 1115 - second accommodating cavity. Detailed implementation manners

[0051] For a clearer understanding of the technical features, objectives, and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

[0052] In the following description, specific details such as specific system architectures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. However, those skilled in the art should understand that the present invention can also be implemented in other embodiments without these specific details. In other cases, the detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present invention.

[0053] Figure 1 is a flowchart of the heating control method of the heat-not-burn device according to the first embodiment of the present invention. The heating control method of the heat-not-burn device in this embodiment is applied to the control component 4 in the heat-not-burn device. It should be understood that the heat-not-burn device further includes a heating component 11 and a battery component 3. Among them, the battery component 3 is used to supply energy to the heating component 11, and the battery component 3 can be a battery, such as: a rechargeable lithium-ion battery, a nickel-metal hydride battery, a nickel-cadmium battery, or a lithium-based battery. The heating component 11, also known as a heater, can have various forms, such as: a heating sheet, a heating needle, a heating rod, a heating wire, or a heating filament. Alternatively, the heating component 11 can also be a combination of two or more different forms of the heating component 11 as described above.

[0054] Combined with Figure 2 , the heating control method of the heat-not-burn device in this embodiment specifically includes the following steps:

[0055] S10. In the first stage, control the heating component 11 to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate rises from the initial temperature to the first temperature.

[0056] In this step, the first stage is a time period from 0 to t1, and this stage is a rapid heating-up stage. In this stage, the allowable temperature setting principle is the temperature at which the desired volatile compounds in the aerosol-forming substrate can quickly volatilize, but lower than the temperature of the undesired compounds with a higher vaporization temperature. The first temperature is between 250°C and 500°C under normal atmospheric pressure and ambient temperature. As Figure 2 shown in the first stage, the temperature of the aerosol-forming substrate rises rapidly in a curve shape over time. In one embodiment, the normal atmospheric pressure can be the standard atmospheric pressure, and the normal temperature is between 15 and 25 degrees Celsius.

[0057] S20. In the second stage, control the heating component 11 to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate drops from the first temperature.

[0058] Alternatively, in the second stage, the heating component 11 can be controlled to stop heating the aerosol-forming substrate for a preset duration, so that the temperature of the aerosol-forming substrate naturally cools down from the first temperature. It is also possible to control the heating component 11 to stop heating the aerosol-forming substrate until the temperature of the aerosol-forming substrate drops from the first temperature to the second temperature, and when the second temperature is reached, the second stage ends.

[0059] In this step, the second stage is the time period from t1 to t2. This stage is a rapid cooling stage. In this stage, in principle, the consistency of the volatilization of the compound is expected, and rapid cooling is achieved by stopping the energy supply and allowing the temperature of the aerosol-forming substrate to naturally cool, thereby reducing the atomization temperature and avoiding burning and affecting the taste when the atomization temperature continues to rise. Therefore, the process of temperature drop needs to take into account both the consistency of compound volatilization and the comfortable atomization temperature. As Figure 2 shown in the second stage, the temperature of the aerosol-forming substrate drops rapidly in a curve shape over time.

[0060] S30. In the third stage, control the heating component 11 to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate rises from the current temperature to the third temperature. Among them, the third temperature is greater than or equal to the first temperature.

[0061] In this step, the third stage is the time period from t2 to t3. This stage is a heating stage. In this stage, in principle, the reasonable volatilization of the compound is expected, and the consistency of the taste volatilization of the device is maintained. As Figure 2 shown in the third stage, the temperature of the aerosol-forming substrate rises in a curve shape over time, and the rising trend of the temperature in this stage is less than the rising trend of the temperature in the first stage.

[0062] In this embodiment, it should be noted that the selected first temperature and second temperature can ensure that the heat-not-burn device continuously generates aerosol in the first, second, and third stages. Moreover, the first temperature, second temperature, and third temperature can all be determined based on the temperature range corresponding to the volatilization temperature of the aerosol-forming substances in the substrate.

[0063] In this embodiment, by controlling the heating component 11 to stop heating the aerosol-forming substrate in the second stage, so that the temperature of the aerosol-forming substrate drops from the first temperature, it can not only prevent burning, but also ensure that the aerosol-forming substrate continuously generates aerosol at the optimal temperature throughout the suction process. Moreover, by heating up again in the third stage, the heat conduction rate of the heating component 11 to the aerosol-forming substrate is increased. Therefore, aerosol delivery with consistent characteristics that do not change over time can be provided.

[0064] In some embodiments, the heating control method of the heat-not-burn device of the present invention further includes:

[0065] Control the heating component 11 to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate remains within a preset allowable temperature range in the first and third stages, and control the heating component 11 to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate remains within a preset allowable temperature range in the second stage.

[0066] It can be understood that whether by setting a preset duration or by setting a second temperature, it is necessary to ensure that the temperature of the heating component 11 also remains within a preset allowable temperature range in the second stage.

[0067] In this embodiment, the allowable temperature range depends on the aerosol-forming substrate. The aerosol-forming substrate releases some volatile compounds at different temperatures, and some of the volatile compounds released from the aerosol-forming substrate are formed only through the heating process. Each volatile compound is released when it is above its specific release temperature. By controlling the maximum operating temperature below the release temperature of some volatile compounds, the release or formation of these components can be avoided. The maximum operating temperature is also selected to ensure that the substrate does not burn under normal operating conditions.

[0068] The allowable temperature range has an upper limit between 450°C and 500°C and a lower limit between 250°C and 300°C. The first temperature can be between 300°C and 450°C. In addition, the time of the first stage is less than 20 seconds. The time of the second stage is less than 2 seconds. The time of the third stage is from the end time t2 of the second stage to 600 seconds. Preferably, compared with other heating methods, when the heating method of the non-combustible heating device is infrared heating, the time of the first stage is shorter and can be less than 10 seconds.

[0069] In an alternative embodiment, in the second and third stages, the heating component 11 is controlled to heat the aerosol-forming substrate in the following manner so that the temperature of the aerosol-forming substrate reaches the target temperature (the second temperature corresponds to the second stage and the third temperature corresponds to the third stage):

[0070] Detect the temperature of the aerosol-forming substrate to obtain a temperature detection value;

[0071] Perform a PID calculation on the temperature detection value and the target temperature to obtain first heating control information;

[0072] Control the heating component 11 to perform periodic heating according to the first heating control information.

[0073] In this embodiment, first, the temperature of the aerosol-forming substrate is detected, and then the detected temperature value and the target temperature are used as the PID inputs. After PID calculation, the first heating control information is output. Finally, it is converted into a heating duty ratio through an internally preset algorithm, and the heating component 11 is heated periodically.

[0074] In another alternative embodiment, in the first and third stages, the energy supply to the heating component 11 is controlled in the following manner to bring the temperature of the aerosol-forming substrate to the target temperature (the second stage corresponds to the second temperature, and the third stage corresponds to the third temperature):

[0075] Detect the resistance value of the heating component 11 to obtain a resistance value detection value;

[0076] Perform a PID calculation on the resistance value detection value and the target resistance value to obtain the second heating control information, where the target resistance value is determined by the corresponding target temperature;

[0077] Control the heating component 11 to be heated periodically according to the second heating control information.

[0078] In this embodiment, first, the resistance value of the heating component 11 is detected, and then the detected resistance value and the target resistance value (obtained by inverse calculation from the target temperature) are used as the PID inputs. After PID calculation, the second heating control information is output. Finally, it is converted into a heating duty ratio through an internally preset algorithm, and the heating component 11 is heated periodically.

[0079] The above describes two implementation methods for heating control of the heating component 11 in the second and third stages. For the first stage (rapid heating stage), in some other embodiments, in order to further shorten the preheating time, heating can be performed at a constant power or maximum power within an initial preset time, and then PID adjustment is performed to make the temperature in the first stage reach the first temperature, so as to avoid a large overshoot situation. That is, when controlling the heating of the heating component 11 in the first stage, integral adjustment is not performed within the initial preset time, or when the deviation between the detected temperature value and the target temperature value is greater than a certain set value, the integral term is not included, so as to reduce the influence of the integral term during the heating process and achieve a smooth transition in the temperature control stage.

[0080] In addition, during the process of heating control of the heating component 11, if heating control is performed once in each heating cycle, then when the selected heating cycle is relatively large, the temperature change range of the heating component 11 within a single heating cycle will be relatively large; when the selected heating cycle is relatively small, although the temperature change range of the heating component 11 within a single heating cycle is relatively small, limited by the performance of the microprocessor performing PID control, it may not be able to meet the requirements of real-time data acquisition and processing. Therefore, in actual control, the control cycle can be set to an integer multiple of the heating cycle, that is, control cycle = heating cycle * N, where N is an integer and N >= 1, which can effectively ensure the synchronization of heating and control.

[0081] Furthermore, in an alternative embodiment, the temperature detection value can be obtained in the following manner:

[0082] During the stop period of the heating cycle of the heating component 11, the resistance value of the heating component 11 is detected to obtain a resistance value detection value;

[0083] Determine the temperature detection value of the aerosol-forming substrate according to the resistance value detection value.

[0084] In this embodiment, it should be noted first that since the heating component 11 is periodically heated and controlled according to a duty cycle signal, each heating cycle includes two parts: a heating period and a stop period, and the resistance value of the heating component 11 is detected during the stop period. After obtaining the resistance value detection value, the temperature detection value corresponding to this resistance value detection value is calculated according to the corresponding relationship between the resistance value and the temperature.

[0085] Furthermore, after determining the temperature detection value of the aerosol-forming substrate according to the resistance value detection value, it further includes: according to the hot and cold machine state of the heating component 11, the temperature detection value is compensated to realize the compensation processing of the first temperature.

[0086] In this embodiment, it should be noted first that when there is a field distribution in the temperature of the heating component 11, as the heating time increases and the heat conduction of the substrate of the heating component 11 increases, at the same resistance value, the temperature will have a certain downward process, and this process is related to the heat conduction of the substrate of the heating component 11. That is to say, when the heating component 11 itself is in a hot machine state, its volatilization situation is different from that in the cold machine state. In order to achieve the atomization temperature that takes into account the consistency of compound volatilization and comfort, a compensation algorithm is added inside. This algorithm is for the temperature drop caused by heat conduction, and the related items are time and the target temperature. That is, the actual temperature detection value T = F(R Heater ) + f(t, T 目标 ), which can ensure that the entire suction stage is basically the same as the cold machine state; where R HeaterR is the current resistance value of the heating element 112, t is the time from receiving the start signal to the current time, T is the current target temperature, and other parameters in F(R Heater ), f(t, T 目标 ) are obtained by linear fitting or quadratic fitting.

[0087] Furthermore, the heating control method of the heat-not-burn device of the present invention further includes:

[0088] Compensating the first temperature and / or the second temperature according to the ambient temperature. Or, dynamically adjusting the time (preset duration) of the second stage according to the ambient temperature.

[0089] In this embodiment, when the external ambient temperature changes, in order to maintain the experience during the product suction stage, it is also necessary to compensate the target temperature (the first temperature and / or the second temperature). For example, when the ambient temperature in winter (such as the ambient temperature is lower than 15 degrees Celsius) is relatively low, the target temperature will be increased to maintain the temperature sucked into the mouth; when the temperature in summer is relatively high (such as the ambient temperature is higher than 25 degrees Celsius), the target temperature will be decreased to maintain the temperature sucked into the mouth.

[0090] Optionally, when the ambient temperature changes, in order to maintain the experience during the product suction stage, the time t2 of the second stage can also be dynamically adjusted; for example: when the ambient temperature in winter is relatively low, t2 is decreased to prevent the temperature from dropping too fast and maintain the temperature sucked into the mouth; when the temperature in summer is relatively high, t2 is increased to maintain the temperature sucked into the mouth.

[0091] Furthermore, in order to improve the safety performance of use, the heating control method of the heat-not-burn device of the present invention further includes:

[0092] Judging whether the temperature detection value is within a preset range. When it is not within the preset range, controlling the heating component 11 to stop heating, where the upper limit of the preset range is between 450°C and 500°C, and the lower limit is between 250°C and 300°C;

[0093] Or, judging whether the energy supply of the heating component 11 within a preset period exceeds a preset energy value. When it exceeds the preset energy value, controlling the heating component 11 to stop heating.

[0094] In this embodiment, during the entire temperature control stage, the temperature value is calculated by real-time detection of the resistance value of the heating component 11. When the resistance detection value or temperature detection value of the heating component 11 exceeds the specified upper and lower limits under abnormal circumstances, the device will be shut down in an emergency to avoid safety risks. In addition, when the supply energy of the heating component 11 within a preset period of time (unit time) is greater than the preset energy under ambient temperature, the device will also be shut down in an emergency to avoid safety risks. For example, under normal circumstances, the energy supply of the heating component 11 is between 0.5 and 2.0W. When it exceeds 3.0W within a preset period of time (for example, 1 to 5S), it will be shut down in an emergency.

[0095] like Figure 3 The structure diagram of the heating-not-burning device of the first embodiment of the present invention is shown. The heating-not-burning device of this embodiment includes a housing 1, a heating component 11 accommodated in the housing 1, a control component 4 and a battery component 3 for supplying energy to the heating component 11. The control component 4 is used to execute the heating control method of the heating-not-burning device as described above. In this embodiment, the aerosol-forming matrix 5 is at least partially inserted into the housing 1 from one end of the housing 1, and the heating component 11 is inserted into the interior of the aerosol-forming matrix 5 for heating. The heating component 11 includes a heating element 112 and a base 113 for fixing the heating element 112. The aerosol-forming matrix 5 can be cylindrical. Specifically, the aerosol-forming matrix 5 can be a solid material in the form of silk strips, sheets, particles or one-piece molding made of leaves and / or stems of plants, and aroma components can be further added to the solid material.

[0096] Alternatively, the heating method of the heating device includes but is not limited to resistive heating, infrared heating, etc., and the specific structure of the heating device is determined by the corresponding heating method.

[0097] In this embodiment, by controlling the heating component 11 to stop heating the aerosol-forming substrate 5 in the second stage, so that the temperature of the aerosol-forming substrate 5 drops from the first temperature, it can prevent burning and ensure that the aerosol-forming substrate 5 continues to generate aerosol at the optimal temperature during the entire puffing process. Moreover, by raising the temperature again in the third stage, the heat conduction rate from the heating component 11 to the aerosol-forming substrate 5 is increased, thereby providing aerosol transmission with consistent characteristics that do not change with time.

[0098] Furthermore, the control component 4 includes a detection module and a microprocessor, wherein the detection module is used to detect the temperature / resistance of the aerosol-forming matrix to obtain a temperature / resistance detection value; the microprocessor is used to perform PID calculation on the temperature / resistance detection value and the target temperature / target resistance to obtain heating control information, and control the heating component 11 to perform periodic heating according to the heating control information; wherein the target resistance is determined by the target temperature.

[0099] Figure 4 This is the circuit diagram of the heat-not-burn device according to the first embodiment of the present invention. The heat-not-burn device of this embodiment includes a heating component Heater, a battery component (not shown), and a control component. The control component includes a microprocessor U1 and a detection module. Among them, the detection module includes: a first switching tube Q1, a second switching tube Q2, a third switching tube Q3, and a reference resistor R1. Among them, the first ends of the first switching tube Q1 and the second switching tube Q2 are respectively connected to the positive terminal BAT+ of the battery component. The second end of the first switching tube Q1 is connected to the first end of the reference resistor R1. The second end of the reference resistor R1 and the second end of the second switching tube Q2 are respectively connected to the first end of the heating component Heater. The second end of the heating component Heater is connected to the first end of the third switching tube Q3. The second end of the third switching tube Q3 is grounded. The first input terminal of the microprocessor U1 is connected to the second end of the first switching tube Q1. The second input terminal of the microprocessor U1 is connected to the second end of the reference resistor R1. The third input terminal of the microprocessor U1 is connected to the second end of the heating component Heater. The first output terminal of the microprocessor U1 is connected to the control terminal of the first switching tube Q1. The second output terminal of the microprocessor U1 is connected to the control terminal of the second switching tube Q2. The third output terminal of the microprocessor U1 is connected to the control terminal of the third switching tube Q3.

[0100] Moreover, in this embodiment, the first switching tube Q1 is an NPN-type triode, and the first end of the first switching tube Q1 is the collector, the second end of the first switching tube Q1 is the emitter, and the control terminal of the first switching tube Q1 is the base. The second switching tube Q2 is a P-type field effect transistor. The first end of the second switching tube Q2 is the source, the second end of the second switching tube Q2 is the drain, and the control terminal of the second switching tube Q2 is the gate. The third switching tube Q3 is an N-type field effect transistor. The first end of the third switching tube Q3 is the drain, the second end of the third switching tube Q3 is the source, and the control terminal of the third switching tube Q3 is the gate. It should be understood that in other embodiments, the three switching tubes can also be other types of switching tubes.

[0101] The working principle of this circuit is described below:

[0102] First of all, it should be noted that the reference resistor R1 is a high-precision resistor. To be compatible with the measurement accuracy and the heat generation of the reference resistor R1, the value range of the resistance value of R1 is generally between 1 times R Heater and 10 times R Heater The output voltage range of the battery component is 2.8V to 4.2V.

[0103] When the microprocessor U1 controls the second switching transistor Q2 and the third switching transistor Q3 to conduct, and at the same time controls the first switching transistor Q1 to cut off, the battery assembly forms a heating path through the second switching transistor Q2, the heating component Heater, and the third switching transistor Q3 to heat the heating component Heater. Moreover, the microprocessor U1 can approximately calculate the current I in the heating path by collecting the voltage at the third input terminal of the collector, that is, I = VMEAS3 / R Q3 , where R Q3 is the internal resistance when the third switching transistor Q3 conducts. Among them, VMEAS3 is the voltage at the third input terminal of the microprocessor U1. Therefore, it is possible to determine whether overcurrent occurs based on this current I and perform overcurrent protection when overcurrent occurs.

[0104] When the microprocessor U1 controls the first switching transistor Q1 and the third switching transistor Q3 to conduct, and at the same time controls the second switching transistor Q2 to cut off, the battery assembly forms a resistance measurement path through the first switching transistor Q1, the reference resistor R1, the heating component Heater, and the third switching transistor Q3. At this time, a voltage V1 is formed on the reference resistor R1, and a voltage V2 is formed on the heating component Heater. The microprocessor U1 determines V1 by collecting the voltages at its first input terminal and second input terminal, that is, V1 = MEAS1 - MEAS2. The microprocessor U1 determines V2 by collecting the voltages at its second input terminal and third input terminal, that is, V2 = MEAS2 - MEAS3. Then, the resistance R of the heating component Heater is deduced according to the following formula Heater , that is, R Heater = (MEAS2 - MEAS3) * R1 / (MEAS1 - MEAS2). Among them, MEAS1 is the voltage at the first input terminal of the microprocessor U1, and MEAS2 is the voltage at the second input terminal of the microprocessor U1.

[0105] It should also be noted that within a single heating cycle, the microprocessor U1 controls the enabling of the second switching transistor Q2 according to the duty cycle conduction time to achieve the heating control of the heating component. During the off stage of the second switching transistor Q2, part or all of the time of this off stage can be selected to control the enabling of the first switching transistor Q1, so as to deduce R Heater . To avoid large fluctuations in the temperature of the aerosol-forming substrate during the process of the second switching transistor Q2 turning on to being prohibited and the passing process, the single heating cycle time can be selected between 1mS and 50mS.

[0106] Figure 5 The structural schematic diagram of the heating component of the infrared heating method is shown. The heating component can be partially inserted into the aerosol-forming substrate. Specifically, the heating component can be at least partially inserted into the medium section of the aerosol-forming substrate and generate infrared light to heat the medium section of the aerosol-forming substrate in the energized state, so that aerosol is generated after being heated.

[0107] In some embodiments, as Figure 5 shown, the detection module of the control component 4 is a temperature measuring element 20 disposed on the housing 111 of the heating component 11, which can be a thermocouple for temperature measurement, or a resistance circuit with TCR. When passing current, the corresponding resistance is detected to represent the temperature of the heating element 112, and thus the temperature of the aerosol-forming substrate. Moreover, in actual use, even if the aerosol-forming substrate is not inserted, the temperature of the heating component 11 after power-on can be controlled according to the corresponding temperature control curve of the present invention.

[0108] As Figures 5 to 7 shown, in this embodiment, the heating component 11 is a central heating structure, that is, the heating component 11 is located at the center of the aerosol-forming substrate in the use state. The heating component 11 includes: a heating element 112, a housing 111, and a base 113. The heating element 112 is at least partially spaced from the housing 111, the heating element 112 is located inside the housing 111, and at least part of the housing 111 is used for inserting the aerosol-forming substrate. The heating element 112 is energized to generate infrared light. For example, a gap 1114 is left between the housing 111 and the heating element 112, and the gap 1114 can be filled with air, that is, the air inside the housing communicates with the air outside the housing. Of course, it can be understood that in some other embodiments, the gap 1114 can also be filled with a reducing gas or an inert gas, and at this time, the inside of the housing is a sealed space. The housing 111 houses at least part of the heating element 112 and can transmit the infrared light generated by the heating element 112 to heat the aerosol-forming substrate. Specifically, the housing 111 can transmit the infrared light generated by the heating element 112, so that at least part of the infrared light generated by the heating element 112 is absorbed by the aerosol to heat the aerosol-forming substrate. The base 113 is disposed at the opening 1110 of the housing 111.

[0109] In this embodiment, the housing 111 can be made of a glass material. For example, the housing 111 can be quartz glass. Or, in some other embodiments, the housing 111 is not limited to quartz glass and can also be other window materials that can transmit infrared light, such as infrared-transmitting glass, transparent ceramics, diamond, etc.

[0110] In this embodiment, the housing 111 is a hollow tube, that is, a tube made of transparent quartz glass. The housing 111 has a longitudinal structure and has two ends distributed along the axis. The longitudinal structure means that the dimension of the housing 111 in one direction (for example, the length direction) is greater than the dimension in another direction (for example, the thickness direction). Specifically, the housing 111 includes a tubular body 1111 with a circular cross-section and a spire structure 1112 provided at one end of the tubular body 1111. Of course, it can be understood that in some other embodiments, the cross-section of the tubular body 1111 is not limited to being circular. The tubular body 1111 is a hollow structure with an opening 1110 at one end. The spire structure 1112 is provided at the end of the tubular body 1111 away from the opening 1110. By providing the spire structure 1112, it is convenient for at least part of the heating assembly 11 to be inserted into and removed from the aerosol-forming substrate. In this embodiment, a first accommodation cavity 1113 is formed inside the housing 111, and the first accommodation cavity 1113 is a columnar cavity. In this embodiment, the tubular body 1111 is a cylinder and the spire structure 1112 is a cone. In other embodiments, the housing 111 may also be in other forms, such as a triangular prism shape, a cuboid shape or other shapes. In some other embodiments, the heating element 112 may also be spaced apart and provided on the outer periphery of the housing 111, and a second accommodation cavity for accommodating the aerosol-forming substrate may be formed inside the housing 111.

[0111] As Figure 7 shown, in this embodiment, the heating element 112 may be one and may be longitudinally arranged, having a first free end 112d and a second free end 112e. In this embodiment, the heating element 112 is a strip with a circular cross-section (solid round wire). At least part of the heating element 112 is bent, and an overall columnar heating part 1120 is formed. Specifically, it may be bent to form a helical columnar heating part 1120. It can be understood that in some other embodiments, the heating element 112 is not limited to being a strip, and may be a longitudinal sheet or a mesh. The heating part 1120 is not limited to being columnar, and may also be sheet-shaped, mesh-shaped or strip-shaped. In some embodiments, the heating element 112 may be wound to form a single-helical, double-helical, M-shaped, N-shaped or other-shaped heating part 1120. Of course, it can be understood that in some other embodiments, the heating element 112 is not limited to being one, and may be two or more than two. It should be noted that in some other embodiments, the heating element 112 may also be a metal sheet or a metal needle.

[0112] In this embodiment, the heating part 1120 includes a first heating part 112a and a second heating part 112b; one end of the first heating part 112a and the second heating part 112b are connected. In this embodiment, the first heating part 112a and the second heating part 112b are of an integrally formed structure and can be formed by bending a heating element 112. It can be understood that in some other embodiments, the first heating part 112a and the second heating part 112b can also be of a split structure, and the first heating part 112a and the second heating part 112b can be two heating elements 112 connected together by welding, riveting or other means. It can be understood that in some other embodiments, the second heating part 112b can also be omitted, and a non-heating conductive rod can be used instead.

[0113] In this embodiment, a conductive part 1121 is provided at one end of the heating part 1120. The conductive part 1121 is connected to the heating part 1120, can be led out from one end of the housing 111, and passes through the base 113 to be conductively connected to the power supply component in the control component. In this embodiment, there can be two conductive parts 1121. The two conductive parts 1121 can be arranged at intervals, are respectively connected to the heating part 1120, and pass through the housing 111 from the same end of the housing 111. In this embodiment, the conductive part 1121 can be fixed to the heating part 1120 by welding. Of course, it can be understood that in some other embodiments, the heating part 1120 and the conductive part 1121 can be integrally formed. The first free end 112d and the second free end 112e of the heating element 112 can respectively form two conductive parts 1121, that is, the first free end 112d of the first heating part 112a forms one of the conductive parts 1121; the second free end 112e of the second heating part 112b forms the other conductive part 1121. In some other embodiments, the conductive part 1121 can be a lead wire with a resistance smaller than that of the heating part, such as a lead wire made of silver or aluminum material, which can be welded to the heating part 1120. Of course, it can be understood that in some other embodiments, the conductive part 1121 is not limited to being a lead wire and can be other conductive structures.

[0114] As Figure 8 shown, in this embodiment, the heating part 1120 includes a heating matrix 1122 and an infrared radiation layer 1124. The heating matrix 1122 can generate heat in the energized state. The infrared radiation layer 1124 is coated on the outer surface of the heating matrix 1122. The heating matrix 1122 can excite the infrared radiation layer 1124 to generate and radiate infrared light in the state of being heated by electricity. In this embodiment, the heating matrix 1122 and the infrared radiation layer 1124 are concentrically distributed on the cross-section of the heating part 1120.

[0115] In this embodiment, the heating substrate 1122 may be in the shape of a strip as a whole, and the cross section may be circular. Specifically, the heating substrate 1122 may be a heating wire. Of course, it is understandable that in some other embodiments, the heating substrate 1122 may also be in the shape of a sheet, that is, the heating substrate 1122 may be a heating sheet. The heating substrate 1122 includes a metal substrate with high temperature oxidation resistance, and the metal substrate may be a metal wire. Specifically, the heating substrate 1122 may be a nickel-chromium alloy substrate (such as a nickel-chromium alloy wire), an iron-chromium-aluminum alloy substrate (such as an iron-chromium-aluminum alloy wire), or other metal materials with good high temperature oxidation resistance, high stability, and not easy to deform. In this embodiment, the radial dimension of the heating substrate 1122 may be 0.15mm-0.8mm. The metal wire may be bent or wound into various shapes, such as a spiral, a mesh, an M shape, or an N shape. The heating element after bending or winding is in the shape of a column, a spiral segment, a mesh, or other three-dimensional or planar shapes with bending.

[0116] In this embodiment, the heating portion 1120 further includes an anti-oxidation layer 1123, which is formed between the heating substrate 1122 and the infrared radiation layer 1124. Specifically, the anti-oxidation layer 1123 may be an oxide film, and the heating substrate 1122 undergoes high-temperature heat treatment and forms a dense oxide film on its own surface, and the oxide film forms the anti-oxidation layer 1123. Of course, it is understandable that in some other embodiments, the anti-oxidation layer 1123 is not limited to the oxide film formed by itself, and in some other embodiments, it may be an anti-oxidation coating applied to the outer surface of the heating substrate 1122. By forming the anti-oxidation layer 1123, it is ensured that the heating substrate 1122 is not or rarely oxidized when heated in an air environment, thereby improving the stability of the heating substrate 1122, and thus there is no need to evacuate the first accommodating chamber 1113 or fill it with reducing gas, thereby simplifying the assembly process of the entire heating component 11 and saving manufacturing costs. In this embodiment, the thickness of the anti-oxidation layer 1123 can be selected to be 1um-150um. When the thickness of the anti-oxidation layer 1123 is less than 1um, the heating substrate 1122 is easily oxidized. When the thickness of the anti-oxidation layer 1123 is greater than 150um, the heat conduction between the heating substrate 1122 and the infrared radiation layer 1124 will be seriously affected.

[0117] In this embodiment, the infrared radiation layer 1124 may be an infrared layer. The infrared layer may be an infrared layer forming matrix formed on a side of the anti-oxidation layer 1123 away from the heating matrix 1122 under high temperature heat treatment. In this embodiment, the infrared layer forming matrix may be silicon carbide, spinel or a composite matrix thereof.

[0118] Of course, it can be understood that in some other embodiments, the infrared radiation layer 1124 is not limited to being an infrared layer. In some other embodiments, the infrared radiation layer 1124 may be a composite infrared layer. In this embodiment, the infrared layer may be formed on the side of the antioxidant layer 1123 away from the heating matrix 1122 by means such as dip coating, spraying, brushing, etc. The thickness of the infrared radiation layer 1124 may be 10 μm - 300 μm. When the thickness of the infrared radiation layer 1124 is within 10 μm - 300 μm, its infrared light effect is better, and the atomization efficiency and atomization taste of the aerosol-forming matrix 200 are better. Of course, it can be understood that in some other embodiments, the thickness of the infrared radiation layer 1124 is not limited to 10 μm - 300 μm.

[0119] In this embodiment, different from the heating element of the existing electronic atomization device, the maximum operating temperature range of the heating element 112 may be 500°C - 1300°C, that is, during the entire operation of the heating element 112, its maximum operating temperature may be any temperature within 500°C - 1300°C, which can be specifically determined according to the temperature control requirements. Generally, the maximum operating temperature of the heating element in the prior art is only within 400°C.

[0120] Figures 9 to 12The structure of the heating component in the second embodiment of the present invention is shown. In this embodiment, the housing 111 includes a first tube body 111a and a second tube body 111b; the first tube body 111a is a hollow structure with both ends penetrating. The first tube body 111a can be cylindrical, and its inner diameter can be slightly larger than the outer diameter of the aerosol-forming substrate. A second accommodation cavity 1115 can be formed inside the first tube body 111a for accommodating the aerosol-forming substrate and forming a heating space for heating the medium section of the aerosol-forming substrate. The axial length of the first tube body 111a can be greater than the axial length of the second tube body 111b. The second tube body 111b can be sleeved on the outer periphery of the first tube body 111a. The second tube body 111b can be cylindrical, and the radial dimension of the second tube body 111b can be greater than the radial dimension of the first tube body 111a, that is, there is a gap between the second tube body 111b and the first tube body 111a, and this gap can form a first accommodation cavity 1113 for accommodating the heating element 112. The heating element 112 is arranged on the outer periphery of the first tube body 111a and is spaced from the outer wall of the first tube body 111a. In some embodiments, the heating element 112 is wound around the outer periphery of the first tube body 111a, and a gap 1114 is left between the whole and the inner wall of the second tube body 111b and the outer wall of the first tube body 111a (that is, the heating element 112 is at least partially spaced from the housing 111), so that a certain temperature difference can be formed between the inner wall of the first accommodation cavity 1113 and the heating element 112, playing a heat insulation role. In some embodiments, a reflective layer can be provided on the inner wall of the second tube body 111b for reflecting the heat of the heating element 112 and radiating it to the aerosol-forming substrate, enhancing the heating efficiency.

[0121] In some other embodiments, the heating element 112 is not limited to being entirely spaced from the first tube body 111a or the second tube body 111b. In some other embodiments, the heating element 112 can also be partially spaced from the first tube body 111a, and the radial dimension of a partial section of the heating part 1120 can be equivalent to the outer diameter of the first tube body 111a, which can play a limiting role. In some embodiments, the heating element 112 can also be partially spaced from the second tube body 111b, and the radial dimension of a partial section of the heating part 1120 can be equivalent to the radial dimension of the second tube body 111b.

[0122] It can be understood that the above embodiments only represent the preferred embodiments of the present invention, and the description is relatively specific and detailed, but it cannot be construed as a limitation on the scope of the patent of the present invention.

[0123] It should be noted that, for those of ordinary skill in the art, without departing from the concept of the present invention, the above technical features can be freely combined, and several modifications and improvements can also be made, all of which fall within the protection scope of the present invention; therefore, all equivalent transformations and modifications made to the scope of the claims of the present invention shall fall within the scope covered by the claims of the present invention.

Claims

1. A heating control method for a heat-not-burn device, the heat-not-burn device comprising a heating assembly, characterized in that, Comprising: In the first stage, control the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate rises from an initial temperature to a first temperature; In the second stage, control the heating component to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate drops from the first temperature; In the third stage, control the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate rises from the current temperature to a third temperature; wherein the third temperature is greater than or equal to the first temperature.

2. The heating control method of the heat-not-burn device according to claim 1, wherein: In the first stage, the temperature of the aerosol-forming substrate rises in a curve form over time; In the second stage, the temperature of the aerosol-forming substrate drops in a curve form; In the third stage, the temperature of the aerosol-forming substrate rises in a curve form.

3. The heating control method of the heat-not-burn device according to claim 1, wherein In the step of, in the second stage, controlling the heating component to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate drops from the first temperature, it includes: In the second stage, control the heating component to stop heating the aerosol-forming substrate for a preset duration so that the temperature of the aerosol-forming substrate naturally cools down from the first temperature; or In the second stage, control the heating component to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate drops from the first temperature to a second temperature.

4. The heating control method of the heat-not-burn device according to claim 1, characterized in that Further comprising: Control the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate remains within a preset allowable temperature range in the first stage and the third stage; Control the heating component to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate remains within the allowable temperature range in the second stage.

5. The heating control method of the heat-not-burn device according to claim 4, wherein The allowable temperature range has an upper limit between 450°C - 500°C and a lower limit between 250°C - 300°C; The first temperature is between 300°C - 450°C.

6. The heating control method of the heat-not-burn device according to claim 1, wherein: The time of the first stage is less than 20 seconds; The time of the second stage is less than 2 seconds; The time of the third stage is from the end moment of the second stage to 600 seconds.

7. A heat-not-burn device, characterized in that, Comprising: A heating component for heating the aerosol-forming substrate; A battery component for supplying power to the heating component; A control component, and the control component is configured to: In the first stage, control the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate rises from an initial temperature to a first temperature; In the second stage, control the heating component to stop heating the aerosol-forming substrate so that the temperature of the aerosol-forming substrate drops from the first temperature; In the third stage, control the heating component to heat the aerosol-forming substrate so that the temperature of the aerosol-forming substrate rises from the current temperature to a third temperature; wherein the third temperature is greater than or equal to the first temperature.

8. The heat-not-burn device according to claim 7, wherein The heating component includes a housing and a heating element. The heating element is used to generate infrared light for heating an aerosol-forming substrate by being energized. The heating element is at least partially spaced from the housing wall of the housing, and the housing allows the infrared light to pass through.

9. The heat-not-burn device according to claim 8, wherein, The heating element is located inside the housing. The heating element includes a heating substrate and an infrared radiation layer coated on the outside of the heating substrate. The heating element is used to excite the infrared radiation layer to generate infrared light after being energized. At least part of the housing is used to insert an aerosol-forming substrate; or The heating element is spaced outside the housing. The interior of the housing is hollow and forms a second accommodation cavity for accommodating an aerosol-forming substrate.

10. The heat-not-burn device according to claim 8, characterized in that, The housing includes a first tube body and a second tube body sleeved on the outer periphery of the first tube body; A gap is left between the first tube body and the second tube body, and the gap forms a first accommodation cavity for accommodating the heating element; The heating element is disposed on the outer periphery of the first tube body and is spaced from the outer wall of the first tube body. A second accommodation cavity for heating an aerosol-forming substrate is formed inside the first tube body; The heating element includes a heating substrate and an infrared radiation layer coated on the outside of the heating substrate. The heating component is used to excite the infrared radiation layer to generate infrared light after being energized.

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