RFID etching antenna production process

Abstract

The invention belongs to the technical field of radio frequency identification, and discloses an RFID etching antenna production process. The preparation method comprises the following steps: pretreating a base material such as polyimide (PI) or polyethylene glycol terephthalate (PET), uniformly coating a composite anti-corrosion layer, performing high-precision ultraviolet laser positioning exposure, performing precise chemical etching under dynamic closed-loop control, subsequently removing photoresist, neutralizing, drying, spraying an anti-oxidation coating and the like. And the manufactured RFID antenna has the advantages of smooth antenna conductive circuit edge, uniform etching depth and excellent signal transmission performance. Compared with a traditional process, nano silicon dioxide particles are introduced into a formula of an anti-corrosion layer material, a galvanometer scanning system is adopted to realize precise laser positioning, and a closed-loop dynamic regulation and control system is formed by utilizing electrochemistry, temperature control and image feedback, so that the etching depth is controlled within + / -2 microns, the production yield is improved to 98.5% or above, and the production cost is reduced. Meanwhile, the consumption of chemical reagents and the environmental pollution are obviously reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency identification (RFID), and particularly to a production process for RFID etched antennas, which is particularly suitable for mass production of ultra-high frequency (UHF) and high frequency (HF) RFID electronic tags. Background Art

[0002] As an important branch in the field of automatic identification, RFID technology has been widely applied in various fields such as logistics management, asset tracking, and intelligent manufacturing. As the core component in a tag, the process quality of an RFID antenna directly affects the working distance, identification stability, and signal transmission efficiency of the tag. Currently, the manufacturing of RFID antennas mainly adopts the etching method, screen printing method, and electroplating method, among which the etching method is commonly used due to its mature process and low cost; however, the traditional etching process has the following main defects:

[0003] First, there is the problem of low etching accuracy: In the traditional process, the stability of the chemical etching solution formula is poor, making it difficult to precisely control the etching depth and edge morphology, resulting in more burrs at the edges of the antenna pattern and affecting the RF signal performance.

[0004] Second, there is the problem of low material utilization rate: Uneven coating of the anti-etching layer and common phenomena of local over-etching or under-etching during the etching process cause material waste and process instability.

[0005] Third, there is the problem of insufficient production yield: Due to the lack of real-time monitoring and automatic adjustment mechanisms, defects such as short circuits and open circuits are likely to occur during mass production, and the yield is often lower than 90%, which is not conducive to large-scale applications.

[0006] Fourth, there are environmental and economic problems: The chemical etching process consumes a large amount of corrosive chemicals, and improper treatment of the waste liquid is likely to cause environmental pollution. At the same time, the cost of consuming chemical reagents is relatively high.

[0007] Existing related technologies at home and abroad, such as patents CN106274008A and CN109255422A, although they have improved the production process, still have not fundamentally solved the above problems. Therefore, there is an urgent need for a production process for RFID etched antennas that can achieve high precision, high stability, and high environmental friendliness. Summary of the Invention

[0008] In order to solve the problems existing in the existing RFID antenna etching process, such as "the edges of the antenna circuit are rough, the etching depth is uneven, resulting in a decline in signal transmission performance; low material utilization rate, large consumption of chemical reagents, high production cost and environmental unfriendliness; in mass production, due to low automation level, open circuits, short circuits and other process defects are likely to occur, and the yield is low." The present invention provides the following technical solutions:

[0009] An RFID etched antenna production process includes the following steps:

[0010] Step S1, Substrate pretreatment

[0011] Select polyimide (PI) or polyethylene terephthalate (PET) as the antenna substrate. Through plasma cleaning and mechanical roughening treatment, remove surface contaminants and oxide layers, and make the substrate surface have appropriate roughness (Ra controlled between 0.3 and 0.8 μm) so that the subsequent anti-corrosion layer has good adhesion.

[0012] Step S2, Anti-corrosion layer coating

[0013] Adopt a composite anti-corrosion material composed of phenolic resin, photosensitizer and nano-silica particles. Through a roll coater or a slot coating device, evenly coat an anti-corrosion layer with a thickness of 5 - 10 μm on the substrate surface. The addition of nano-silica particles can significantly improve the mechanical strength and corrosion resistance of the coating, and at the same time ensure the uniformity of the photosensitive reaction.

[0014] Step S3, Laser positioning exposure

[0015] Use an ultraviolet laser with a wavelength of 355 nm to perform pattern exposure on the anti-corrosion layer through a high-precision galvanometer scanning system. During the exposure process, the energy density output by the laser is controlled within the range of 80 - 120 mJ / cm 2 range, and ensure that the positioning error does not exceed ±1 μm, so as to form a high-resolution antenna circuit pattern consistent with the designed pattern in the anti-corrosion layer.

[0016] Step S4, Precision etching

[0017] Place the exposed substrate in a pre-prepared dynamic etching solution for chemical etching. The etching solution is mainly prepared by mixing ferric nitrate, phosphoric acid, corrosion inhibitor (such as benzotriazole) and surfactant (such as sodium dodecyl sulfate) in a certain proportion, and the temperature is controlled between 25 and 35 °C. During the etching process, through a closed-loop control system (including an electrochemical sensor, a PID temperature control module and an image feedback system), the etching rate is monitored and adjusted in real time to ensure the uniformity of the etching depth, and the error is controlled within ±2 μm.

[0018] Step S5, Post-treatment

[0019] After etching, perform degumming treatment on the substrate (using organic solvents or special degumming solutions), and then perform neutralization cleaning to remove residual acidic substances. After cleaning, dry the substrate in an oven, and finally spray an antioxidant coating with a polyurethane-graphene composite material to protect the antenna conductive layer and extend the product service life. During the spraying process, the coating thickness is controlled within the range of 0.5 - 1 μm to ensure both the protection effect and no impact on the antenna operation.

[0020] Step S6, Performance Detection

[0021] After the post-treatment is completed, the sheet resistance of the antenna conductive layer is measured by the four-probe method, and the resonance frequency, gain and line defects of the antenna are detected by using a near-field scanner and a machine vision system. The detection standards are as follows: the sheet resistance ≤ 0.1 Ω / square, the deviation of the resonance frequency ≤ ±0.5 MHz, and the defect detection error does not exceed 0.2%.

[0022] Further, the specific composition of the dynamic etching solution is: ferric nitrate 50 - 70 g / L, phosphoric acid 10 - 15 mL / L, benzotriazole 0.1 - 0.3 g / L, sodium dodecyl sulfate 0.2 - 0.5 g / L, and the rest is deionized water.

[0023] The closed-loop control system includes:

[0024] 1) An electrochemical sensor: to monitor the Fe 3+ concentration in the etching solution in real time;

[0025] 2) A temperature control module: adopting a PID control algorithm to achieve the temperature adjustment of the etching tank, and the temperature control accuracy reaches ±0.5 °C;

[0026] 3) An image analysis unit: using a CCD camera to collect the etching process images in real time and comparing them with a preset standard pattern to dynamically adjust the etching time.

[0027] Further, in step S3, the ultraviolet laser adopts a galvanometer scanning system, the scanning speed is 2000 - 5000 mm / s, and the laser spot diameter is 10 - 20 μm.

[0028] Further, in step S5, the antioxidant coating is a polyurethane-graphene composite material, which is sprayed after ultrasonic dispersion treatment, the spraying pressure is 0.2 - 0.4 MPa, and the coating thickness is controlled within 0.5 - 1 μm.

[0029] Further, in step S6, a machine vision system based on deep learning is used to automatically detect the antenna line defects. The defect types include broken wires, short circuits, edge burrs, etc., and the detection accuracy reaches 99.7%.

[0030] The process of the present invention is applicable to the production of ultra-high frequency (UHF) and high frequency (HF) RFID antennas, and can be compatible with the manufacturing requirements of flexible substrates and rigid substrates.

[0031] The RFID etching antenna production process of the present invention has the following remarkable advantages compared with the prior art:

[0032] First: The etching depth error is controlled within ±2 μm, the edge burrs of the antenna line are significantly reduced, and the signal transmission stability is significantly improved;

[0033] II. The application of the composite resist material and the dynamic etching solution formulation increases the material utilization rate by approximately 40% and reduces the consumption of chemical reagents by 30%, thereby reducing the overall production cost;

[0034] III. The real-time monitoring and automatic adjustment of the closed-loop control system improve the process consistency and product yield during mass production, and the yield can reach over 98.5%;

[0035] IV. This process is compatible with flexible and rigid substrates, suitable for the production of UHF and HF RFID antennas, and the product performance meets the requirements of high frequency and high-speed data transmission;

[0036] V. The environmental protection effect is remarkable. By reducing the waste liquid discharge and the usage of harmful chemicals, green manufacturing is achieved.

[0037] The present invention provides an RFID etching antenna production process with reasonable structure, simple operation, low cost, environmental protection and high efficiency, having broad market application prospects and promotion value. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0039] Figure 1 is the overall flowchart of the RFID etching antenna production process of the present invention;

[0040] Figure 2 is the structural schematic diagram of the substrate pretreatment and resist layer coating equipment;

[0041] Figure 3 is the laser positioning exposure system and galvanometer scanning schematic diagram;

[0042] Figure 4 is the structural diagram of the precision etching closed-loop control system;

[0043] Figure 5 is the flowchart of the post-treatment process (resist removal, neutralization, drying and antioxidant spraying);

[0044] Figure 6 is the schematic diagram of the product performance detection system;

[0045] Figure 7 is the comparative scanning electron microscope (SEM) photo of the etching edge quality between the process of the present invention and the traditional process. DETAILED DESCRIPTION OF THE INVENTION

[0046] The following is a detailed description of the implementation details of the RFID etching antenna production process of the present invention in combination with specific embodiments, so that those of ordinary skill in the art can implement the present invention.

[0047] Embodiment 1: Production process of UHF RFID antenna

[0048] As Figures 1 - 7 shown, a production process of an RFID etching antenna includes the following steps:

[0049] Step S1, Substrate pretreatment

[0050] 1) Select a PI film with a thickness of 50 μm as the substrate. 2) Use a plasma cleaning device, set the power to 200 W, and the treatment time to 5 min to remove oil stains, dust, and oxide layers on the substrate surface. 3) Subsequently, mechanically roughen the substrate surface using fine sandpaper or ultrasonic cleaning to adjust the surface roughness Ra to about 0.5 μm to ensure the adhesion of the anti-corrosion layer.

[0051] Step S2, Anti-corrosion layer coating

[0052] 1) Prepare a composite anti-corrosion material: Mix phenolic resin and photosensitizer in a ratio of 6:3, and then add 10 wt% of nano-silica particles, and mix well after ultrasonic dispersion. 2) Use a slot coater to evenly coat the mixed solution on the surface of the pretreated PI film, and control the coating thickness to about 8 μm. 3) Send the coated substrate into an oven, set the temperature to 80 °C, and dry for 10 min to form a uniform and firm anti-corrosion layer.

[0053] Step S3, Laser positioning exposure

[0054] 1) Place the dried substrate on a laser exposure platform, and the system pre-loads the RFID antenna design pattern. 2) Use a 355 nm ultraviolet laser and perform pattern exposure through a high-precision galvanometer scanning system. 3) Set the exposure energy density to 100 mJ / cm 2 , and the scanning speed to 3000 mm / s to ensure that every detail in the pattern is accurately transferred to the anti-corrosion layer, and the positioning error is less than 1 μm.

[0055] Step S4, Precision etching

[0056] 1) Configure an etching tank, add the prepared etching solution to the tank, and its formula is: ferric nitrate 60 g / L, phosphoric acid 12 mL / L, benzotriazole 0.2 g / L, sodium dodecyl sulfate 0.3 g / L, and the rest is deionized water. 2) Quickly place the exposed substrate into the etching tank, strictly control the temperature in the tank at 30 °C, and use a closed-loop control system to monitor Fe 3+Concentration and temperature. 3) The etching time is controlled at 5 min. During this period, real-time etching images are collected through an image feedback system. By comparing with the preset standard, the etching solution flow rate and temperature are automatically adjusted to ensure uniform etching depth, with the error controlled within ±1.8 μm.

[0057] Step S5, Post-treatment

[0058] 1) Immediately transfer the etched substrate to a degumming tank and soak it in acetone or a special degumming solution for 3 min to remove the residual resist layer. 2) Subsequently, place the substrate in a 5% NaOH solution for neutralization cleaning, and then thoroughly rinse it with deionized water. 3) Place the substrate in an oven with the temperature set at 100 °C and dry it for 10 min. 4) Finally, use a spraying device to spray a polyurethane-graphene composite material onto the surface of the substrate at a spraying pressure of 0.3 MPa to form an antioxidant protective layer with a thickness of 0.8 μm.

[0059] Step S6, Performance Testing

[0060] 1) Measure the sheet resistance of the antenna conductive layer using the four-probe method, and the result is 0.05 Ω / □; 2) Use a near-field scanner to detect the antenna resonance frequency, and the test result shows that the frequency deviation is within ±0.3 MHz; 3) Use a machine vision system based on deep learning to automatically detect the antenna circuit, confirm that there are no defects such as broken wires, short circuits, and edge burrs, and the qualification rate reaches over 99%.

[0061] Example 2: Production Process of HF RFID Antenna

[0062] As Figures 1 - 7 shown, a production process of an RFID etched antenna includes the following steps:

[0063] Step S1, Substrate Pretreatment

[0064] 1) Select a PET film with a thickness of 75 μm. After being treated by plasma cleaning (power 150 W, time 4 min), use ultrasonic cleaning and slight polishing to adjust the surface roughness Ra to 0.4 μm.

[0065] Step S2, Resist Layer Coating

[0066] 1) Use the same composite resist material as in Example 1, but by adjusting the coating equipment parameters, control the coating thickness at about 6 μm; 2) Lower the drying temperature to 70 °C and extend the drying time to 12 min to meet the thermal stability requirements of the PET material.

[0067] Step S3, Laser Positioning Exposure

[0068] 1) Set the exposure energy density to 90 mJ / cm 2, the scanning speed is adjusted to 2500 mm / s, the laser spot diameter is controlled within 12 μm, and an antenna pattern with a width of about 80 μm is formed; 2) Ensure that the pattern accuracy after exposure meets the design requirements, and the positioning error is controlled within ±1.2 μm.

[0069] Step S4, Precision Etching

[0070] 1) Adjust the etching solution formula to: 55 g / L of ferric nitrate, 10 mL / L of phosphoric acid, 0.15 g / L of benzotriazole, 0.25 g / L of sodium dodecyl sulfate, and keep the temperature at 28 °C; 2) Control the etching time at 4.5 min, and the closed-loop control system monitors and adjusts the etching process to ensure that the etching depth error does not exceed ±1.5 μm.

[0071] Step S5, Post-treatment

[0072] 1) The steps of degumming, neutralizing, and drying are the same as in Example 1, but the drying temperature is set at 90 °C and the time is extended to 12 min; 2) When spraying the antioxidant coating, control the coating thickness at about 0.6 μm and the spraying pressure at 0.25 MPa.

[0073] Step S6, Performance Testing

[0074] 1) The sheet resistance measured by the four-probe method is 0.06 Ω / □; 2) The deviation of the antenna resonance frequency is controlled within ±0.5 MHz; 3) Using the automatic detection system, the qualified rate reaches 98.7%.

[0075] Experimental Data Comparison and Analysis

[0076] To verify the superiority of the process of the present invention, Example 1 (the present invention) is compared with the traditional etching process, and the specific data is shown in Table 1 below:

[0077] Table 1 Comparison Table of RFID Antenna Etching Process Performance

[0078] Index Traditional process The present invention (Example 1) Improvement rate Etching depth error (μm) ±5.0 ±1.8 Improved by approximately 64% Edge burr rate (%) 8.2 0.5 Reduced by approximately 93% Production yield rate (%) 89 99 Improved by approximately 11% Material utilization rate (%) – Increased by approximately 40% – Consumption of chemical reagents – Reduced by approximately 30% – Sheet resistance of conductive layer (Ω / □) 0.12 0.05 Reduced by approximately 58% Resonant frequency deviation (MHz) ±1.2 ±0.3 Improved by approximately 75%

[0079] As can be seen from the data in Table 1, by introducing composite resist materials, laser positioning exposure, and closed-loop dynamic regulation technology, the present invention significantly improves the etching accuracy and antenna performance, while greatly reducing the production cost and environmental pollution risk, and has obvious technical advantages and economic benefits.

[0080] Further Explanation of Technical Details:

[0081] 1. Closed-loop dynamic regulation system, which consists of the following modules: 1) Electrochemical sensor: Real-time detection of Fe in the etching solution 3+Ion concentration with a response time of less than 1 second; 2) PID temperature controller: Combining a thermocouple with a heater to ensure a constant etching bath temperature with an error controlled within ±0.5°C; 3) Image feedback system: Using a CCD camera with a resolution of 20 million pixels to capture images of the etching process every second, and comparing them with a standard pattern using a pre-trained image recognition algorithm to automatically adjust the etching time and liquid flow parameters.

[0082] 2. Optimization of composite resist materials: To improve the stability of the resist layer, the present invention adds 10 wt% of nano-silica particles with a particle size controlled between 50 - 100 nm to the traditional phenolic resin-based resist material. After ultrasonic dispersion and thorough mixing, it can effectively enhance the mechanical strength of the coating and reduce local over-etching or under-etching phenomena caused by uneven coating.

[0083] 3. Laser exposure system: Adopting a 355 nm ultraviolet laser combined with a galvanometer scanning technology, it can not only achieve high-speed and high-precision pattern transfer, but also flexibly adjust the exposure parameters according to different antenna designs to ensure uniform energy distribution within the exposure area, thus realizing the formation of high-resolution patterns.

[0084] 4. Post-treatment process: In the post-treatment stage, the de-gluing step uses the acetone immersion method or the special de-gluing liquid immersion method, and the time is strictly controlled within 3 - 5 minutes; neutralization cleaning uses a 5% NaOH solution to ensure complete removal of residual acidic substances; the drying process uses an efficient oven with the temperature controlled at about 100°C; the anti-oxidation coating selects a polyurethane-graphene composite material to form a uniform film by spraying, which can protect the conductive layer without affecting the antenna signal.

[0085] 5. Machine vision inspection system: The inspection system is based on a deep learning algorithm. By establishing a defect recognition model with a large amount of training data, it can automatically detect tiny defects such as broken wires, short circuits, and edge burrs, and output defect position and size data to ensure product quality.

[0086] 6. Environmental protection and energy-saving measures: By optimizing the etching solution formula and the closed-loop recycling system, the number of times the waste liquid can be recycled is increased from 3 times in the traditional process to 8 times, and the waste liquid discharge is reduced by 60%; at the same time, low-energy-consuming equipment and optimized process parameters are adopted during the production process, and the overall energy consumption is reduced by about 25%.

[0087] Other embodiments

[0088] In addition to the above embodiments, the present invention can also appropriately adjust the process parameters according to the application requirements of different RFID tags. For example: 1) For the production of flexible RFID antennas, the substrate can be selected as polyester film (PET), and the coating thickness and drying temperature can be correspondingly reduced; 2) For the production of high-frequency (HF) RFID antennas, the laser exposure energy can be appropriately increased and the spot diameter can be reduced to achieve more precise pattern transfer; 3) For RFID antennas in special application environments, anti-ultraviolet or moisture-proof coatings can be added in the post-treatment stage to extend the service life of the product.

[0089] The following is a detailed record of the key process parameters, test data, and economic benefit analysis during the implementation process of the present invention:

[0090] 1) Process parameter record form: Substrate type: PI film, PET film; Surface roughness: Ra 0.3 - 0.8 μm; Anti-corrosion layer thickness: 5 - 10 μm; Laser exposure energy density: 80 - 120 mJ / cm 2 ; Galvo scanning speed: 2000 - 5000 mm / s; Etching solution formula: Ferric nitrate 50 - 70 g / L, Phosphoric acid 10 - 15 mL / L, Benzotriazole 0.1 - 0.3 g / L, Sodium dodecyl sulfate 0.2 - 0.5 g / L; Etching temperature: 25 - 35 °C; Etching time: 4.5 - 5 min Post-treatment process: Debonding for 3 - 5 min, neutralization cleaning, drying, spraying of antioxidant coating; Performance detection standard: Sheet resistance ≤ 0.1 Ω / square, Resonant frequency deviation ≤ ±0.5 MHz.

[0091] 2) Test data analysis: By comparing the test data of the traditional process and the process of the present invention under different process parameters, it is found that the process of the present invention has significant improvements in the etching depth uniformity, reduction of edge burrs, reduction of the sheet resistance of the conductive layer, and RF signal transmission performance. The economic benefit analysis shows that the cost per unit product is reduced by about 30%, and the production yield is increased by more than 10%, having strong market competitiveness.

[0092] 3) Environmental benefit analysis: By optimizing the etching solution formula and introducing a closed-loop recycling system, the present invention increases the number of times of waste liquid recycling from the traditional 3 times to 8 times, effectively reducing the waste liquid discharge volume and reducing environmental pollution, which is in line with the concept of green manufacturing.

[0093] In summary, the RFID etching antenna production process provided by the present invention, by improving substrate pretreatment, resist layer formulation, laser exposure technology and dynamic etching control system, not only effectively solves the problems of low etching accuracy, large material waste and insufficient production yield in the traditional process, but also greatly reduces the production cost and environmental pollution risk, and has extremely high industrial application value and promotion prospects. Its structure is reasonable, process parameters are precise, operation is simple, cost is low, and it meets the environmental protection requirements, and is applicable to the production and manufacturing of various RFID tags. Through the comprehensive application of a number of innovative technologies, not only the process accuracy and product yield of the antenna are significantly improved, but also the consumption of chemical reagents and production energy consumption are greatly reduced, providing a solid technical support for the wide application of RFID technology in the fields of logistics, retail, intelligent manufacturing, etc.

[0094] Although the specific embodiments of the present invention have been described above, those skilled in the art should understand that these specific embodiments are only illustrative. Without departing from the principles and essence of the present invention, those skilled in the art can make various omissions, substitutions and changes to the details of the above methods and systems. For example, combining the above method steps, thus performing substantially the same function in a substantially the same way to achieve substantially the same result, belongs to the scope of the present invention. Therefore, the scope of the present invention is only defined by the appended claims.

Claims

1. An RFID etching antenna production process, characterized in that, It includes the following steps: Step S1, Substrate pretreatment: The polyimide (PI) or polyethylene terephthalate (PET) substrate is subjected to plasma cleaning and mechanical roughening treatment to control the surface roughness Ra within 0.3 - 0.8 μm; Step S2, Anti - corrosion layer coating: A composite anti - corrosion material composed of phenolic resin, photosensitizer and nano - silica particles is used to evenly coat an anti - corrosion layer with a thickness of 5 - 10 μm on the substrate surface through a roll coater; Step S3: Laser positioning exposure: Use a UV laser with a wavelength of 355 nm, cooperate with a galvanometer scanning system to perform pattern exposure on the resist layer, and set the exposure energy density to 80 - 120 mJ / cm 2 , and the positioning error does not exceed ±1 μm; Step S4, Precision etching: The exposed substrate is immersed in a dynamic etching solution prepared from ferric nitrate, phosphoric acid, corrosion inhibitor (benzotriazole) and surfactant (sodium dodecyl sulfate), and chemical etching is carried out in a constant - temperature environment of 25 - 35°C. The etching rate is adjusted in real - time using a closed - loop control system to ensure that the etching depth error does not exceed ±2 μm; Step S5, Post - treatment: The substrate after etching is degummed, neutralized and cleaned, dried, and an antioxidant coating is sprayed using a polyurethane - graphene composite material, and the coating thickness is controlled within 0.5 - 1 μm; Step S6, Performance detection: The sheet resistance of the conductive layer is measured using the four - probe method, and the antenna line defects are detected using a near - field scanning and machine vision system to ensure that the product performance meets the preset standards.

2. The production process of an RFID etched antenna according to claim 1, characterized in that, The specific composition of the dynamic etching solution is: 50 - 70 g / L of ferric nitrate, 10 - 15 mL / L of phosphoric acid, 0.1 - 0.3 g / L of benzotriazole, 0.2 - 0.5 g / L of sodium dodecyl sulfate, and the rest is deionized water.

3. The production process of an RFID etched antenna according to claim 1, characterized in that, The closed - loop control system includes: 1) Electrochemical sensor: Real-time monitoring of the Fe concentration in the etching solution 3+ concentration; 2) Temperature control module: Using the PID control algorithm to achieve the adjustment of the etching tank temperature, and the temperature control accuracy reaches ±0.5°C; 3) Image analysis unit: Using a CCD camera to collect the etching process images in real - time and compare them with the preset standard pattern to dynamically adjust the etching time.

4. The production process of an RFID etched antenna according to claim 1, characterized in that In step S3, the ultraviolet laser uses a galvanometer scanning system, the scanning speed is 2000 - 5000 mm / s, and the laser spot diameter is 10 - 20 μm.

5. A production process of an RFID etched antenna according to claim 1, characterized in that, In step S5, the antioxidant coating is a polyurethane - graphene composite material, which is sprayed after ultrasonic dispersion treatment, the spraying pressure is 0.2 - 0.4 MPa, and the coating thickness is controlled within 0.5 - 1 μm.

6. A production process of an RFID etched antenna according to claim 1, characterized in that, In step S6, a machine vision system based on deep learning is used to automatically detect antenna line defects, and the defect types include broken wires, short circuits, edge burrs, etc., and the detection accuracy reaches 99.7%.

7. A production process of an RFID etched antenna according to claim 1, characterized in that, The process of the present invention is applicable to the production of ultra - high - frequency (UHF) and high - frequency (HF) RFID antennas, and can be compatible with the manufacturing requirements of flexible substrates and rigid substrates.

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