Semiconductor carrier cleaning machine

Abstract

The invention belongs to the technical field of semiconductor special equipment, and discloses a semiconductor carrier cleaning machine which comprises a cleaning machine table, a protective door is hinged to one side of the cleaning machine table, a wafer box is arranged in the cleaning machine table, a cleaning assembly and a drying assembly are arranged in the wafer box, and the cleaning assembly and the drying assembly are arranged in the cleaning machine table. The two sides of the inner wall of the wafer box are fixedly connected with clamping grooves. During cleaning, a first hydraulic cylinder and a first water pump are started, a cleaning seat is driven to move up and down in the wafer box in a reciprocating mode, a water source is sprayed out of a first spray head to flush clamping grooves in the two sides of the inner wall of the wafer box, and after cleaning, an air pump is started to extract external air, and air blowing drying is conducted on the interior of the wafer box. According to the wafer box cleaning device, the interior of the wafer box is flushed with high-pressure water, and then the wafer box is blown and dried, so that water is effectively prevented from remaining on the inner wall of the clamping groove after cleaning, the risk of secondary pollution of the wafer box is avoided, and the cleaning effect is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor special equipment, and specifically relates to a semiconductor carrier cleaning machine. Background Art

[0002] A semiconductor carrier, also known as a wafer carrier or a semiconductor precision carrier, is a precision loading device designed specifically for semiconductor wafers;

[0003] During the semiconductor manufacturing process, the direct contact between the carrier and the wafer makes it extremely easy for the carrier to be contaminated with various impurities and pollutants (such as particles, metal contamination, organic residue, etc.). If these impurities and pollutants are not completely removed from the carrier, they may be transferred to the wafer during subsequent use, thereby affecting the quality and performance of the wafer. Therefore, it is crucial to regularly clean the carrier thoroughly, which can effectively remove impurities and pollutants and ensure the cleanliness of the wafer;

[0004] There are various types of semiconductor carriers, each with its own characteristics and application scenarios. Among them, the front-opening unified pod (FOUP) is a container used to protect, transfer, and store wafers during the semiconductor manufacturing process. It has a compact structure and powerful functions, and can meet various requirements for wafer protection, transfer, and storage;

[0005] Currently, when cleaning the front-opening unified pod (FOUP), a high-pressure water gun is generally used for rinsing. Since the card slots on the left and right sides inside the front-opening unified pod (FOUP) are the main contact surfaces for the wafers, it is particularly crucial to ensure the cleanliness of these card slots during cleaning. However, current cleaning equipment often has difficulty in deeply cleaning the card slots and cannot be dried in time after cleaning, resulting in residual moisture in the card slots and increasing the risk of secondary contamination. Summary of the Invention

[0006] The purpose of the present invention is to provide a semiconductor carrier cleaning machine to solve the problems raised in the above background art.

[0007] To achieve the above purpose, the present invention provides the following technical solution: A semiconductor carrier cleaning machine includes a cleaning machine table. A protective door is hinged on one side of the cleaning machine table. A wafer cassette is arranged inside the cleaning machine table. A cleaning component and a drying component are arranged inside the wafer cassette. Card slots are fixedly connected to both sides of the inner wall of the wafer cassette;

[0008] The cleaning component includes a cleaning seat arranged inside the wafer cassette. A first hydraulic cylinder is installed at the bottom of the cleaning seat. The first hydraulic cylinder is arranged inside the cleaning machine table;

[0009] On both sides of the cleaning base, first nozzles are evenly installed. Each of the first nozzles is fixedly connected through a first connecting pipe. At the bottom end of the first connecting pipe, a first water pipe is fixedly installed. The first water pipe passes through the bottom of the cleaning base and extends outward;

[0010] The drying assembly includes a second nozzle disposed inside the wafer cassette. The second nozzles are evenly installed on both sides inside the cleaning base. Each of the second nozzles is fixedly connected through a second connecting pipe. At the bottom end of the second connecting pipe, a third connecting pipe is fixedly connected. A gas pump is installed at the bottom of the third connecting pipe. The gas pump is disposed inside the cleaning machine table.

[0011] As a further technical solution of the present invention, third nozzles, fourth nozzles, fifth nozzles, and sixth nozzles are evenly installed outside the wafer cassette. The third nozzles, fourth nozzles, fifth nozzles, and sixth nozzles are fixedly connected through a fourth connecting pipe.

[0012] As a further technical solution of the present invention, both the fourth nozzle and the fifth nozzle are inclined toward one side of the wafer cassette.

[0013] As a further technical solution of the present invention, negative pressure plates are provided on both sides inside the wafer cassette. Suction plates are evenly installed on the side walls of the two negative pressure plates. Suction holes are formed on both sides of each suction plate;

[0014] At the bottom ends of the two negative pressure plates, fifth connecting pipes are fixedly installed. At the bottom ends of the two fifth connecting pipes, a fixing plate is fixedly installed. The top ends of the fifth connecting pipes are fixedly connected to a water inlet pipe. At the end of the water inlet pipe away from the fixing plate, a third water pump is installed. The output end of the third water pump is connected to a drain pipe. The drain pipe is embedded in the inner wall of the cleaning machine table.

[0015] As a further technical solution of the present invention, a second hydraulic cylinder is installed at the bottom end of the fixing plate. The second hydraulic cylinder is disposed inside the cleaning machine table.

[0016] As a further technical solution of the present invention, a check valve is installed on the outer wall of the drain pipe.

[0017] As a further technical solution of the present invention, mounting plates are provided on both sides of the suction plate. The two mounting plates are slidably connected to the suction plate through a moving assembly. Suction sponges are installed on the sides of the two mounting plates away from the suction plate.

[0018] As a further technical solution of the present invention, a first connecting shaft is fixedly connected to the side of the mounting plate close to the suction plate. The first connecting shaft is embedded inside the suction plate.

[0019] As a further technical solution of the present invention, the moving component includes water turbine blades arranged inside the water absorption plate. Both ends of the water turbine blades are fixedly connected with first rotating shafts. One end of each of the two first rotating shafts away from the water turbine blades is fixedly installed with a first bevel gear. The tops of the two first bevel gears are both meshed and connected with second bevel gears. Second rotating shafts are fixedly installed inside the two second bevel gears. Both ends of the two second rotating shafts are meshed and connected with second connecting shafts. The second connecting shafts are fixedly installed on the side wall of the mounting plate.

[0020] As a further technical solution of the present invention, external threads are provided on the outer walls at both ends of the second rotating shaft, and the two sets of external threads are symmetrically distributed.

[0021] The beneficial effects of the present invention are as follows:

[0022] 1. Through the mutual cooperation of the cleaning component and the drying component in the present invention, during cleaning, the first hydraulic cylinder and the first water pump are started. When the first hydraulic cylinder is started, the cleaning seat is driven to reciprocate up and down inside the wafer cassette through the output end. At the same time, the first water pump is connected to an external water source through the first water pipe and the first connecting pipe, and the water source is sprayed out from the first nozzle to wash the card slots on both sides of the inner wall of the wafer cassette. After cleaning, the air pump is started to extract external gas, which is connected through the third connecting pipe and the second connecting pipe, and air is discharged from the second nozzle to blow and dry the inside of the wafer cassette. When the device cleans the wafer cassette, it first flushes the inside of the wafer cassette with high-pressure water and then blows and dries the wafer cassette, effectively preventing moisture from remaining on the inner wall of the card slot after cleaning, avoiding the risk of secondary contamination of the wafer cassette, and thus improving the cleaning effect.

[0023] 2. Through the setting of the negative pressure plate in the present invention, during cleaning, the third water pump is started, which is connected through the water inlet pipe, the fixing plate and the fifth connecting pipe, so that negative pressure is generated in the water absorption holes, and the water droplets and splashes generated during the flushing process are sucked away from the water absorption holes and discharged into the cleaning machine table for collection. This can not only effectively reduce the splashing of water, but also keep the cleaning environment clean, achieving the effects of saving water resources and improving the cleaning efficiency.

[0024] 3. Through the setting of the extrusion water absorption sponge in the present invention, during negative pressure, when water is sucked into the water absorption plate, it drives the water turbine blades to rotate. The rotation of the water turbine blades drives the rotation of the first rotating shaft. The rotation of the first rotating shaft drives the rotation of the first bevel gear. The rotation of the first bevel gear drives the rotation of the second bevel gear. The rotation of the second bevel gear drives the rotation of the second rotating shaft. The rotation of the second rotating shaft drives the second connecting shafts at both ends to reciprocate. The movement of the second connecting shafts drives the movement of the mounting plate. The movement of the mounting plate drives the movement of the water absorption sponge, so that the water absorption sponge is pressed against the inner wall of the card slot, facilitating the extrusion of the water inside the water absorption sponge and maintaining the water absorption capacity of the water absorption sponge. Description of the Drawings

[0025] Figure 1 is the overall structural schematic diagram of the present invention;

[0026] Figure 2 is the cross-sectional schematic diagram of the overall structure of the present invention;

[0027] Figure 3 is the cross-sectional schematic diagram of the structure at the cleaning machine table of the present invention;

[0028] Figure 4 is the structural schematic diagram at the negative pressure plate of the present invention;

[0029] Figure 5 is the cross-sectional schematic diagram of the structure at the negative pressure plate of the present invention;

[0030] Figure 6 For the present invention Figure 5 the enlarged schematic diagram of the structure at position A;

[0031] Figure 7 is the cross-sectional schematic diagram of the structure at the water absorption plate of the present invention;

[0032] Figure 8 is the structural schematic diagram at the mounting plate of the present invention;

[0033] Figure 9 is the structural schematic diagram at the first spray head and the second spray head of the present invention;

[0034] Figure 10 is the structural schematic diagram at the third spray head and the fourth spray head of the present invention.

[0035] In the figure: 1. Cleaning machine table; 2. Protection door; 3. Wafer cassette; 4. Card slot; 5. Cleaning base; 6. First spray head; 7. First connecting pipe; 8. First water pipe; 9. First hydraulic cylinder; 10. Second spray head; 11. Second connecting pipe; 12. Third connecting pipe; 13. Air pump; 14. Third spray head; 15. Fourth spray head; 16. Fifth spray head; 17. Sixth spray head; 18. Fourth connecting pipe; 19. Negative pressure plate; 20. Water absorption plate; 21. Water absorption hole; 22. Fifth connecting pipe; 23. Fixed plate; 24. Water inlet pipe; 25. Third water pump; 26. Drain pipe; 27. Check valve; 28. Second hydraulic cylinder; 29. Mounting plate; 30. Water absorption sponge; 31. First connecting shaft; 32. Water turbine blade; 33. First rotating shaft; 34. First bevel gear; 35. Second bevel gear; 36. Second rotating shaft; 37. Second connecting shaft. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] As Figures 1 to 10 shown, in the embodiment of the present invention, a semiconductor carrier cleaning machine includes a cleaning machine table 1, a protective door 2 is hinged on one side of the cleaning machine table 1, a wafer cassette 3 is arranged inside the cleaning machine table 1, a cleaning component and a drying component are arranged inside the wafer cassette 3, and clamping grooves 4 are fixedly connected to both sides of the inner wall of the wafer cassette 3;

[0038] The cleaning component includes a cleaning seat 5 arranged inside the wafer cassette 3, a first hydraulic cylinder 9 is installed at the bottom of the cleaning seat 5, and the first hydraulic cylinder 9 is arranged inside the cleaning machine table 1;

[0039] A first spray head 6 is uniformly installed on both sides of the cleaning seat 5, each first spray head 6 is fixedly connected through a first connecting pipe 7, the bottom end of the first connecting pipe 7 is fixedly installed with a first water pipe 8, and the first water pipe 8 passes through the bottom of the cleaning seat 5 and extends outwards;

[0040] The drying component includes a second spray head 10 arranged inside the wafer cassette 3, the second spray head 10 is uniformly installed on both sides inside the cleaning seat 5, each second spray head 10 is fixedly connected through a second connecting pipe 11, the bottom end of the second connecting pipe 11 is fixedly connected with a third connecting pipe 12, and an air pump 13 is installed at the bottom of the third connecting pipe 12, and the air pump 13 is arranged inside the cleaning machine table 1.

[0041] One end of the first water pipe 8 far from the first connecting pipe 7 is connected to an external first water pump. During cleaning, water is supplied from an external water source through the first water pump to clean the wafer cassette 3;

[0042] The second spray heads 10 and the second connecting pipes 11 are arranged in a staggered manner;

[0043] During cleaning, the first hydraulic cylinder 9 and the first water pump are started. When the first hydraulic cylinder 9 is started, the cleaning seat 5 is driven to reciprocate up and down inside the wafer cassette 3 through the output end;

[0044] At the same time, the external water source is connected through the first water pump, the first water pipe 8 and the first connecting pipe 7, and water is sprayed from the first spray heads 6 to wash the clamping grooves 4 on both sides of the inner wall of the wafer cassette 3;

[0045] After cleaning, the air pump 13 is started to extract external gas, which is connected through the third connecting pipe 12 and the second connecting pipe 11, and air is discharged from the second spray heads 10 to blow-dry the inside of the wafer cassette 3;

[0046] When the device cleans the wafer cassette 3, it first rinses the inside of the wafer cassette 3 with high-pressure water and then blows air to dry the wafer cassette 3, effectively preventing residual moisture on the inner wall of the card slot 4 after cleaning and avoiding the risk of secondary contamination of the wafer cassette 3, thereby improving the cleaning effect.

[0047] The inner wall of the cleaning machine table 1 is provided with through holes, and the lower part of the through holes is hollow for storing the water source after cleaning, which is convenient for recycling.

[0048] As Figure 2 、 Figure 3 and Figure 10 shown, the outside of the wafer cassette 3 is evenly installed with a third nozzle 14, a fourth nozzle 15, a fifth nozzle 16 and a sixth nozzle 17. The third nozzle 14, the fourth nozzle 15, the fifth nozzle 16 and the sixth nozzle 17 are fixedly connected by a fourth connecting pipe 18.

[0049] The third nozzle 14 is arranged at the top of the wafer cassette 3, the sixth nozzle 17 is arranged on the left and right sides of the wafer cassette 3, and the fourth nozzle 15 and the fifth nozzle 16 are arranged on the front and back sides of the wafer cassette 3. Through the arrangement of the third nozzle 14, the fourth nozzle 15, the fifth nozzle 16 and the sixth nozzle 17, the entire outside of the wafer cassette 3 can be rinsed, thus ensuring the comprehensiveness of the cleaning of the wafer cassette 3;

[0050] The end of the fourth connecting pipe 18 is connected to an external second water pump. During cleaning, the outside of the wafer cassette 3 is rinsed by connecting the second water pump to the water source;

[0051] Preferably, there are also two groups of the third nozzle 14, the fourth nozzle 15, the fifth nozzle 16 and the sixth nozzle 17. One group is connected to the second water pump to rinse the wafer cassette 3, and the other group is connected to the second air pump 13 for drying the outside of the wafer cassette 3;

[0052] Preferably, the inner wall of the cleaning machine table 1 can also be provided with electric heating wires, which helps to improve the drying effect of the wafer cassette 3.

[0053] As Figure 2 、 Figure 3 and Figure 10 shown, both the fourth nozzle 15 and the fifth nozzle 16 are inclined towards one side of the wafer cassette 3.

[0054] The inclined fourth nozzle 15 and fifth nozzle 16 can more directly direct the water flow towards the surface of the wafer cassette 3, enhancing the impact force and effectively removing stubborn dirt;

[0055] At the same time, the inclination angle helps the water flow to cover all corners of the wafer cassette 3, reducing the cleaning blind spots.

[0056] As Figure 4 andFigure 5 As shown in the figure, negative pressure plates 19 are provided on both sides inside the wafer cassette 3. Water absorption plates 20 are evenly installed on the side walls of the two negative pressure plates 19. Water absorption holes 21 are formed on both sides of each water absorption plate 20.

[0057] At the bottom ends of the two negative pressure plates 19, fifth connecting pipes 22 are fixedly installed. At the bottom ends of the two fifth connecting pipes 22, a fixing plate 23 is fixedly installed. The top ends of the fifth connecting pipes 22 are fixedly connected to a water inlet pipe 24. One end of the water inlet pipe 24 away from the fixing plate 23 is provided with a third water pump 25. The output end of the third water pump 25 is connected to a drain pipe 26. The drain pipe 26 is embedded in the inner wall of the cleaning machine table 1.

[0058] The water inlet pipe 24 is connected to the input end of the third water pump 25;

[0059] The inner cavities of the fixing plate 23, the fifth connecting pipe 22 and the water absorption hole 21 are communicated;

[0060] During cleaning, the third water pump 25 is started. Through the connection of the water inlet pipe 24, the fixing plate 23 and the fifth connecting pipe 22, negative pressure is generated in the water absorption holes 21, and the water droplets and splashes generated during the flushing process are sucked away from the water absorption holes 21 and discharged into the cleaning machine table 1 for collection. This can not only effectively reduce water splashing, but also keep the cleaning environment clean, achieving the effects of saving water resources and improving cleaning efficiency.

[0061] As Figure 3 and Figure 4 shown, a second hydraulic cylinder 28 is installed at the bottom end of the fixing plate 23. The second hydraulic cylinder 28 is arranged inside the cleaning machine table 1.

[0062] During cleaning, the fixing plate 23 is driven by the second hydraulic cylinder 28 to reciprocate up and down. The movement of the fixing plate 23 drives the movement of the fifth connecting pipe 22. The movement of the fifth connecting pipe 22 drives the movement of the negative pressure plate 19. The movement of the negative pressure plate 19 drives the movement of the water absorption plate 20, so that the water absorption plate 20 reciprocates between the clamping grooves 4, which helps to suck away the water and impurities generated during flushing, thereby improving the cleaning efficiency.

[0063] As Figure 4 shown, a one-way valve 27 is installed on the outer wall of the drain pipe 26.

[0064] The end of the drain pipe 26 is embedded in the hollow part inside the cleaning machine table 1, and the water and impurities generated during flushing are introduced into storage for subsequent unified treatment;

[0065] The one-way valve 27 can prevent the backflow of water source and improve the stability during operation.

[0066] As Figure 5 , Figure 6 and Figure 7As shown, mounting plates 29 are provided on both sides of the water absorption plate 20. The two mounting plates 29 are slidably connected to the water absorption plate 20 through a moving component. Water absorption sponges 30 are installed on the sides of the two mounting plates 29 away from the water absorption plate 20.

[0067] During cleaning, the movement of the water absorption plate 20 drives the movement of the water absorption sponge 30. During the movement, the water absorption sponge 30 contacts the inner wall of the card slot 4. It can not only play a buffering role between the water absorption plate 20 and the inner wall of the card slot 4, preventing the water absorption plate 20 from scratching or wearing the inner wall of the card slot 4 during reciprocating movement, but also quickly absorb the excess water on the inner wall of the card slot 4, which helps to speed up the cleaning speed and thus improve the cleaning efficiency.

[0068] As Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, a first connecting shaft 31 is fixedly connected to the side of the mounting plate 29 close to the water absorption plate 20, and the first connecting shaft 31 is embedded inside the water absorption plate 20.

[0069] The first connecting shaft 31 is hollow;

[0070] When the water absorption plate 20 absorbs water under negative pressure, the excess water inside the water absorption sponge 30 can be sucked through the first connecting shaft 31, preventing the water inside the water absorption sponge 30 from becoming saturated after being used for a period of time. Sucking away the excess water can maintain the water absorption capacity of the water absorption sponge 30;

[0071] Preferably, after cleaning, the water absorption plate 20 can still be made to be under negative pressure and move in the above manner, and the residual water inside the card slot 4 can be sucked away, facilitating quick drying.

[0072] As Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, the moving component includes water turbine blades 32 arranged inside the water absorption plate 20. Both ends of the water turbine blades 32 are fixedly connected with first rotating shafts 33. First bevel gears 34 are fixedly installed at the ends of the two first rotating shafts 33 away from the water turbine blades 32. Second bevel gears 35 are meshed and connected to the tops of the two first bevel gears 34. Second rotating shafts 36 are fixedly installed inside the two second bevel gears 35. Second connecting shafts 37 are meshed and connected to both ends of the two second rotating shafts 36, and the second connecting shafts 37 are fixedly installed on the side walls of the mounting plates 29.

[0073] When in negative pressure, when water is sucked into the water absorption plate 20, it drives the water turbine blade 32 to rotate. The rotation of the water turbine blade 32 drives the rotation of the first rotating shaft 33. The rotation of the first rotating shaft 33 drives the rotation of the first bevel gear 34. The rotation of the first bevel gear 34 drives the rotation of the second bevel gear 35. The rotation of the second bevel gear 35 drives the rotation of the second rotating shaft 36. The rotation of the second rotating shaft 36 drives the second connecting shafts 37 at both ends to reciprocate. The movement of the second connecting shafts 37 drives the movement of the mounting plate 29. The movement of the mounting plate 29 drives the movement of the water absorption sponge 30, causing the water absorption sponge 30 to be squeezed against the inner wall of the card slot 4, facilitating the extrusion of the water inside the water absorption sponge 30.

[0074] The first connecting shaft 31 is in a sliding connection with the water absorption plate 20;

[0075] When the mounting plate 29 moves, it drives the first connecting shaft 31 to slide inside the water absorption plate 20, so that it can also suck away the excess water inside the water absorption sponge 30 through the mounting plate 29 during the movement.

[0076] Working principle and usage process:

[0077] During cleaning, start the first hydraulic cylinder 9 and the first water pump. When the first hydraulic cylinder 9 starts, it drives the cleaning seat 5 to reciprocate up and down inside the wafer cassette 3 through the output end;

[0078] At the same time, connect to the external water source through the first water pump, connect through the first water pipe 8 and the first connecting pipe 7, and spray water from the first nozzle 6 to wash the card slots 4 on both sides of the inner wall of the wafer cassette 3;

[0079] At the same time, start the second water pump connected to the fourth connecting pipe 18, and wash the entire outer wall of the wafer cassette 3 through the third nozzle 14, the fourth nozzle 15, the fifth nozzle 16 and the sixth nozzle 17;

[0080] During cleaning, start the third water pump 25, connect through the water inlet pipe 24, the fixing plate 23 and the fifth connecting pipe 22, so that the water absorption holes 21 generate negative pressure, suck away the water droplets and splashes generated during the flushing process from the water absorption holes 21 and discharge them into the cleaning machine table 1 for collection;

[0081] At the same time, drive the fixing plate 23 to reciprocate up and down through the second hydraulic cylinder 28. The movement of the fixing plate 23 drives the movement of the fifth connecting pipe 22. The movement of the fifth connecting pipe 22 drives the movement of the negative pressure plate 19. The movement of the negative pressure plate 19 drives the movement of the water absorption plate 20, causing the water absorption plate 20 to reciprocate between the card slots 4, which helps to suck away the water and impurities generated during flushing;

[0082] Meanwhile, the movement of the water absorption plate 20 drives the movement of the water absorption sponge 30. During the movement, the water absorption sponge 30 contacts the inner wall of the card slot 4, which can not only play a buffering role between the water absorption plate 20 and the inner wall of the card slot 4, preventing the water absorption plate 20 from scratching or wearing the inner wall of the card slot 4 during the reciprocating movement, but also quickly absorb the excess water on the inner wall of the card slot 4;

[0083] After cleaning, the external gas is extracted by starting the air pump 13 and the second air pump 13. When the air pump 13 is started, it is connected through the third connecting pipe 12 and the second connecting pipe 11, and air is discharged from the second nozzle 10 to blow-dry the inside of the wafer cassette 3. When the second air pump 13 is started, it is connected through another group of third nozzles 14, fourth nozzles 15, fifth nozzles 16 and sixth nozzles 17 to blow-dry the outer wall of the wafer cassette 3.

[0084] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Semiconductor carrier cleaning machine, including a cleaning machine table (1), characterized in that: One side of the cleaning machine (1) is hinged with a protective door (2). Inside the cleaning machine (1), there is a wafer cassette (3). Inside the wafer cassette (3), there are a cleaning component and a drying component. On both sides of the inner wall of the wafer cassette (3), there are fixed connection card slots (4); The cleaning component includes a cleaning base (5) arranged inside the wafer cassette (3). At the bottom of the cleaning base (5), a first hydraulic cylinder (9) is installed, and the first hydraulic cylinder (9) is arranged inside the cleaning machine (1); On both sides of the cleaning base (5), first spray nozzles (6) are evenly installed. Between each of the first spray nozzles (6), they are fixedly connected through a first connecting pipe (7). At the bottom end of the first connecting pipe (7), a first water pipe (8) is fixedly installed. The first water pipe (8) passes through the bottom of the cleaning base (5) and extends outwards; The drying component includes second spray nozzles (10) arranged inside the wafer cassette (3). The second spray nozzles (10) are evenly installed on both sides inside the cleaning base (5). Between each of the second spray nozzles (10), they are fixedly connected through a second connecting pipe (11). At the bottom end of the second connecting pipe (11), a third connecting pipe (12) is fixedly connected. At the bottom of the third connecting pipe (12), an air pump (13) is installed, and the air pump (13) is arranged inside the cleaning machine (1). During cleaning, the wafer cassette is buckled upside down on the cleaning table. At this time, the bottom cleaning base (5) extends out through the hydraulic cylinder (9), and the inner groove of the wafer cassette is cleaned through the spray nozzles (10) on the cleaning base (5). After cleaning, the spray nozzles (10) on the cleaning base blow high-pressure hot air to blow away and dry the moisture on the inner wall of the wafer cassette (3) and the card slots.

2. The semiconductor carrier cleaning machine according to claim 1, wherein: Outside the wafer cassette (3), third spray nozzles (14), fourth spray nozzles (15), fifth spray nozzles (16), and sixth spray nozzles (17) are evenly installed. The third spray nozzles (14), fourth spray nozzles (15), fifth spray nozzles (16), and sixth spray nozzles (17) are fixedly connected through a fourth connecting pipe (18).

3. The semiconductor carrier cleaning machine according to claim 2, wherein: Both the fourth spray nozzle (15) and the fifth spray nozzle (16) are inclined towards one side of the wafer cassette (3).

4. The semiconductor carrier cleaning machine according to claim 1, wherein: On both sides inside the wafer cassette (3), there are negative pressure plates (19). On the side walls of the two negative pressure plates (19), water absorption plates (20) are evenly installed. On both sides of each water absorption plate (20), water absorption holes (21) are opened; At the bottom ends of the two negative pressure plates (19), fifth connecting pipes (22) are fixedly installed. At the bottom ends of the two fifth connecting pipes (22), a fixing plate (23) is fixedly installed. At the top ends of the fifth connecting pipes (22), a water inlet pipe (24) is fixedly connected. At one end of the water inlet pipe (24) away from the fixing plate (23), a third water pump (25) is installed. The output end of the third water pump (25) is connected to a drain pipe (26), and the drain pipe (26) is embedded in the inner wall of the cleaning machine (1).

5. The semiconductor carrier cleaning machine according to claim 4, wherein: At the bottom end of the fixing plate (23), a second hydraulic cylinder (28) is installed, and the second hydraulic cylinder (28) is arranged inside the cleaning machine (1).

6. The semiconductor carrier cleaning machine according to claim 4, wherein: A one-way valve (27) is installed on the outer wall of the drain pipe (26).

7. The semiconductor carrier cleaning machine according to claim 4, wherein: Both sides of the water absorption plate (20) are provided with mounting plates (29). The two mounting plates (29) are slidably connected to the water absorption plate (20) through a moving component. Absorbent sponges (30) are installed on the sides of the two mounting plates (29) away from the water absorption plate (20).

8. The semiconductor carrier cleaning machine according to claim 7, wherein: A first connecting shaft (31) is fixedly connected to the side of the mounting plate (29) close to the water absorption plate (20). The first connecting shaft (31) is embedded inside the water absorption plate (20).

9. The semiconductor carrier cleaning machine according to claim 8, wherein: The moving component includes water turbine blades (32) arranged inside the water absorption plate (20). Both ends of the water turbine blades (32) are fixedly connected with first rotating shafts (33). First bevel gears (34) are fixedly installed at the ends of the two first rotating shafts (33) away from the water turbine blades (32). Second bevel gears (35) are meshed and connected to the tops of the two first bevel gears (34). Second rotating shafts (36) are fixedly installed inside the two second bevel gears (35). Second connecting shafts (37) are meshed and connected to both ends of the two second rotating shafts (36). The second connecting shafts (37) are fixedly installed on the side walls of the mounting plates (29).

10. The semiconductor carrier cleaning machine according to claim 9, wherein: Reciprocating threads are provided on the outer walls at both ends of the second rotating shaft (36). The two sets of reciprocating threads are symmetrically distributed.

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