Modified silver-coated copper with bionic shell structure and preparation method and application thereof
By using organic modifiers and cross-linking network modifiers to form a biomimetic shell structure for silver-coated copper, the problem of poor stability of silver-coated copper at high temperatures was solved, and a tight connection between the silver layer and the copper core was achieved, thereby improving high-temperature oxidation resistance and conductivity.
CN120243910BActive Publication Date: 2026-06-26SOUTHEAST UNIV
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SOUTHEAST UNIV
- Filing Date
- 2025-05-09
- Publication Date
- 2026-06-26
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Figure CN120243910B_ABST
Abstract
The application discloses modified silver-coated copper with a bionic shell structure and a preparation method and application thereof, and first synthesizes silver-coated copper in a one-step method; then the prepared silver-coated copper is mixed and stirred with an organic modification solution, and a cross-linking network solution is further added for modification; solid-liquid separation, washing and drying are conducted to obtain the modified silver-coated copper. The added organic modifier can be adsorbed on the surface of the silver layer and between the crystal grains, plays a complexing role, improves the conductive performance, and inhibits the electron migration of silver; the added cross-linking network modifier fills the gaps generated in the growth process of the silver layer in cooperation with the organic modifier, so that the silver layer becomes more compact, a bionic shell structure is formed, and the mechanical strength of the silver layer is improved. In addition, the cross-linking network can push the silver layer inward, fill the holes, and reshape the silver layer, so that the compactness between the core and the shell is enhanced. The modified silver-coated copper has a bionic shell structure, strong oxidation resistance, and good stability and integrity of the silver layer at high temperature.
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