Cutting device for semiconductor device processing

Abstract

The invention relates to the technical field of laser cutting devices, in particular to a cutting device for semiconductor device processing, which comprises a UV (ultraviolet) covering film, a positioning mechanism for fixing the position of the UV covering film, a transmission frame for mounting the UV covering film and transmitting and moving the UV covering film, a laser cutting mechanism and a film expanding and particle taking mechanism, the output mechanism is used for moving the taken crystal grains out of the protective cover; by arranging the laser cutting mechanism, the film expanding and particle taking mechanism and the UV coating film, when a wafer is cut, the wafer is firstly attached to the surface of the UV coating film and cut by the laser cutting mechanism, after cutting is finished, the UV coating film moves to the position of the film expanding and particle taking mechanism along with the movement of the UV coating film, the laser cutting position automatically replaces a new UV coating film, and the cutting efficiency is greatly improved. Cutting treatment is continued, the film expanding and particle taking mechanism synchronously performs film expanding and particle taking at the moment, the process of cutting the UV coating film is omitted, meanwhile, the operation step of manual participation in the whole process is reduced, and the cutting efficiency can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting devices, and specifically provides a cutting device for semiconductor device processing. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor integrated circuits. The cutting methods mainly include blade cutting, laser cutting, and plasma cutting. Since laser cutting is a non-contact cutting method, it can effectively reduce fragmentation and cracking problems, and is suitable for processing fragile, ultra-thin, and complex-structured wafers. It has high precision and accuracy, can support complex cutting patterns and small-spacing separation. Before the wafer is cut, it needs to be covered with a UV film first, and the stretchable property of the UV film is used to separate the cut wafer.

[0003] The entire wafer cutting process includes: First, the wafer is covered with a film, the UV film is cut into the same size as the wafer, then the film-covered wafer is placed inside a laser cutting machine for cutting. After cutting, it is taken out and placed in an area where the film can be expanded to pick up the chips, or the film is expanded manually to pick up the chips. The entire process requires multiple manual operations, which is rather cumbersome and has low production efficiency. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a cutting device for semiconductor device processing to solve the problems mentioned in the above background art.

[0005] To achieve the above object, the present invention adopts the following technical solutions: A cutting device for semiconductor device processing includes a UV film covering the surface of the wafer, which uses the tension of the UV film to peel off the generated chips after cutting; a positioning mechanism for fixing the position of the UV film, the positioning mechanism is set in a positioning manner of at least three points, dividing the UV film into two different regions; a transmission rack for installing and transporting the UV film, the UV film horizontally penetrates the positioning mechanism, and the glue-containing surface is vertically downward, and a protective cover is assembled on the surface of the transmission rack, and an operation opening for placing the wafer is provided on the surface of the protective cover; a laser cutting mechanism for cutting the wafer, which is assembled inside the protective cover through a three-dimensional moving platform, and the cutting range of the laser cutting mechanism is the front region in the moving direction of the UV film; an expanding and chip-picking mechanism for stretching the cut wafer horizontally and vertically, so that the generated chips are separated from the surface of the UV film, and the chip-picking range of the expanding and chip-picking mechanism is the rear region in the moving direction of the UV film; an output mechanism for removing the taken chips from inside the protective cover.

[0006] Preferably, the positioning mechanism includes three groups of positioning plates arranged at equal intervals. The number of each group of positioning plates is two, which are respectively above and below the UV coating film. The surface of the positioning plate is not adhered to the UV coating film. A lifting component is arranged between the positioning plates of the same group to control the distance between the positioning plates of the same group.

[0007] Preferably, a connecting spring is assembled between the positioning plates of the same group to squeeze the positioning plates of this group to increase the squeezing force.

[0008] Preferably, the lifting component includes two connecting plates with different heights. The width of the connecting plate located above is smaller than the width of the connecting plate located below. The length of the upper plate of each group of positioning plates is greater than the length of the lower plate. Each lower plate is fixed to the connecting plate with a shorter width through a connecting short rod, and each upper plate is fixed to the connecting plate with a longer width through a connecting long rod; A threaded rod with a double thread is assembled between the two connecting plates. The two ends of the threaded rod respectively penetrate through the two connecting plates in a threaded manner. A support frame for installing the threaded rod is assembled below the connecting plate. A motor for driving the threaded rod to rotate is assembled on the surface of the support frame. A guide rod one for guiding the moving direction is assembled between the two connecting plates.

[0009] Preferably, the film expanding and grain taking mechanism includes a mounting frame assembled inside the protective cover. The top of the mounting frame is assembled with a moving frame through an electric push rod. An expanding film ball driven by a motor to rotate is assembled inside the moving frame. The expanding film ball is assembled inside the moving frame through a connecting component.

[0010] Preferably, the connecting component includes a telescopic rod with a semi-circular frame at the end. The expanding film ball is rotatably assembled inside the semi-circular frame. An arc-shaped limiting frame is assembled on the surface of the moving frame. Two groups of limiting rods integrally formed are arranged on the surface of the inner rod of the telescopic rod. Each group of limiting rods respectively abuts against the upper surface and the lower surface of the limiting frame.

[0011] Preferably, a liftable placement table is assembled inside the protective cover for placing the wafer to be cut. A tensioning component is assembled on the surface of the placement table for tensioning the UV coating film so that the UV coating film can be smoothly attached to the surface of the wafer.

[0012] Preferably, the tensioning component includes two tensioning rods with an arc-shaped top. The two tensioning rods are respectively assembled at the symmetrical positions on both sides of the placement table. A guide rod two for guiding is assembled on the surface of the tensioning rod. The guide rod two movably penetrates through the placement table and extends below the placement table. A support spring is assembled between the tensioning rod and the placement table.

[0013] Preferably, a support plate driven by a motor is assembled inside the protective cover. The support plate is located directly below the placement table, and the distance between the support plate and the placement table is less than the distance from the side of the support plate to the axis of the motor output shaft.

[0014] Preferably, the output mechanism is a belt conveyor. The belt conveyor is located directly below the film expanding and grain picking mechanism, and the output end of the belt conveyor extends to the outside of the protective cover.

[0015] The above technical solution has the following advantages or beneficial effects: The present invention provides a cutting device for semiconductor device processing. By setting a laser cutting mechanism, a film expanding and grain picking mechanism, and a UV film laminating, with the adhesive surface of the UV film facing downwards, during the process of cutting a wafer, the wafer is first adhered to the surface of the UV film and is cut at this position by the laser cutting mechanism. After cutting, as the UV film moves to the position of the film expanding and grain picking mechanism, a new UV film is automatically replaced at the laser cutting position, and the cutting process continues. At this time, the film expanding and grain picking mechanism simultaneously expands the film and picks up the grains, automatically peeling and detaching the grains from the surface of the UV film and falling onto the output mechanism at the bottom, omitting the process of cutting the UV film and reducing the manual operation steps in the whole process, which can effectively improve the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the detailed description of the non-restrictive embodiments with reference to the following drawings, the present invention and its features, shapes, and advantages will become more obvious. The same reference numerals indicate the same parts in all the drawings. The drawings are not deliberately drawn to scale, and the emphasis is on showing the gist of the present invention.

[0017] Figure 1 FIG. 1 is a schematic three-dimensional structure diagram of a cutting device for semiconductor device processing provided by the present invention.

[0018] Figure 2 FIG. 2 is Figure 1 a left sectional plan view of FIG. 1.

[0019] Figure 3 FIG. 3 is Figure 1 a right sectional plan view of FIG. 1.

[0020] Figure 4 FIG. 4 is a schematic three-dimensional structure diagram of the inside of the protective cover.

[0021] Figure 5 FIG. 5 is a schematic three-dimensional structure diagram of the installation method of the placement table and the tensioning assembly.

[0022] Figure 6 FIG. 6 is a schematic three-dimensional structure diagram of the positioning mechanism.

[0023] Figure 7 FIG. 7 is Figure 6Schematic perspective view from below.

[0024] Figure 8 It is a schematic perspective view of the film expanding and granule taking mechanism.

[0025] Figure 9 It is a schematic perspective view of the installation of the semi-ring frame.

[0026] In the figure: 1. UV coating; 2. Transmission frame; 3. Protective cover; 4. Operation port; 5. Laser cutting mechanism; 6. Positioning plate; 7. Connecting spring; 8. Connecting plate; 9. Connecting short rod; 10. Belt conveyor; 11. Connecting long rod; 12. Threaded rod; 13. Support frame; 14. Guide rod 1; 15. Mounting frame; 16. Moving frame; 17. Film expanding ball; 18. Semi-ring frame; 19. Telescopic rod; 20. Limiting frame; 21. Limiting rod; 22. Placing table; 23. Tensioning rod; 24. Guide rod 2; 25. Support spring; 26. Support plate. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] In order to enable those skilled in the art of this technology to better understand the solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] Figure 1 A cutting device for semiconductor device processing is disclosed, which is used for horizontally and vertically cutting a wafer to make it into several grains of the same size. It should be noted that this cutting device for semiconductor device processing is aimed at the invisible cutting method in laser cutting. The laser focuses the focal point inside the wafer to form a modified layer. When the modified layer is completely formed, it cooperates with the UV coating 1 to separate the wafer.

[0030] Such as Figure 1 And Figure 4As shown, the UV film 1 is installed through the transfer rack 2. Rotatable rollers are provided at both ends of the transfer rack 2. One end of the UV film 1 is fixed on one of the rollers and wound up, and the other end is fixed on the surface of the other roller. A motor (not shown in the figure) is assembled on the surface of the transfer rack 2 at the position of the roller for winding, so as to drive the roller to rotate and wind up the UV film 1, thereby moving the UV film 1. The sticky side of the UV film 1 faces downward. A protective cover 3 is assembled above the transfer rack 2, and a horizontal groove through which the UV film 1 can pass is provided on the surface of the protective cover 3.

[0031] As Figure 4 , Figure 6 and Figure 7 shown, three groups of positioning plates 6 are equidistantly assembled on the surface of the UV film 1. The number of each group of positioning plates 6 is set to two, and they are respectively located above and below the UV film 1. To ensure the normal movement of the UV film 1, a coating that will not stick to the UV film 1 needs to be sprayed on the surface of the positioning plates 6. The length of the positioning plate 6 located above is greater than the length of the positioning plate 6 located below. Two connecting plates 8 for installing and connecting the positioning plates 6 are provided below the UV film 1. The heights and widths of the two connecting plates 8 are different. The width of the connecting plate 8 located above is smaller than the width of the connecting plate 8 located below. The positioning plate 6 with a shorter length is fixed on the connecting plate 8 with a shorter width through a connecting short rod 9, and the positioning plate 6 with a longer length is fixed on the connecting plate 8 with a longer width through a connecting long rod 11. In this embodiment, both the connecting long rod 11 or the connecting short rod 9 on the surface of the positioning plate 6 are two groups, and are respectively located on both sides of the UV film 1.

[0032] The three groups of positioning plates 6 divide the UV film 1 into two different regions, which are respectively used for two working steps of laser cutting and film expansion and particle extraction. It should be noted that laser cutting is located in the front region of the moving direction of the UV film 1, and film expansion and particle extraction are located in the rear region of the moving direction of the UV film 1. That is, when the wafer moves with the UV film 1, it needs to be laser cut first and then film expanded and particle extracted.

[0033] The three groups of positioning plates 6 can ensure that the working state of the UV film 1 in the two regions remains stable and will not interfere with each other. When the UV film 1 needs to move horizontally, the three groups of positioning plates 6 need to move longitudinally. At this time, a threaded rod 12 with double threads between the two connecting plates 8 is used in cooperation. When the threaded rod 12 rotates, the connecting plate 8 above moves downward, and the connecting plate 8 below moves upward, so that a larger space is generated between the positioning plates 6 of the same group, facilitating the UV film 1 to drive the wafer to move.

[0034] A support frame 13 for mounting a threaded rod 12 is assembled below the connecting plate 8. The threaded rod 12 is driven to rotate by a motor, and the motor is assembled on the surface of the support frame 13. A first guide rod 14 is fixed on the surface of the upper connecting plate 8. The first guide rod 14 movably penetrates through the lower connecting plate 8 and the support frame 13, ensuring that the two connecting plates 8 can only move longitudinally during movement. To ensure safety in use, a connecting spring 7 can be assembled on the surface of the first guide rod 14 for cooperation to provide longitudinal support force.

[0035] As Figure 1 , Figure 4 and Figure 5 shown, for the convenience of the film sticking operation of the wafer, a longitudinally movable placement table 22 is assembled within the laser cutting area. At the same time, an operation opening 4 is provided at the corresponding position of the protective cover 3. The staff places the wafer on the surface of the placement table 22 through the operation opening 4 (it can also be placed by existing mechanical equipment such as a manipulator). The wafer needs to be completely placed on the placement table 22. A flange is provided at the position where the placement table 22 contacts the protective cover 3, and a vertical groove (not shown in the figure) is provided at the corresponding position of the protective cover 3. The placement table 22 can slide longitudinally along the vertical groove. A rotatable support plate 26 is provided below the placement table 22. A protruding circular shaft is provided on the side of the support plate 26, and the circular shaft is movably installed on the inner wall of the protective cover 3. The support plate 26 is driven to rotate by a motor (not shown in the figure). The distance between the support plate 26 and the placement table 22 is less than the distance from the side of the support plate 26 to the axis of the motor output shaft. When the support plate 26 rotates to a certain angle, the placement table 22 can be lifted, and continuous rotation can make the wafer adhere to the surface of the UV film 1. Since the laser cutting equipment itself has a positioning system and can adaptively adjust the position, the accuracy requirement for placing the wafer is not high. Similarly, it should be noted that the surface of the placement table 22 also needs to be sprayed with a coating that will not adhere to the UV film 1 to ensure that the placement table 22 can fall stably and will not damage the UV film 1.

[0036] To enable the wafer to fit flat on the surface of the UV film 1, a tensioning assembly is assembled on the surface of the placement table 22. Specifically, tensioning rods 23 are provided above both sides of the placement table 22. The top of the tensioning rod 23 is arc-shaped to avoid damaging the UV film 1. At the same time, the positions on both sides of the placement table 22 are lower than the middle position. A second guide rod 24 for guiding is assembled on the surface of the tensioning rod 23. The bottom of the second guide rod 24 movably penetrates through the placement table 22. A support spring 25 is sleeved on the surface of the second guide rod 24, and both ends of the support spring 25 abut against the surface of the placement table 22 and the tensioning rod 23 respectively.

[0037] When the placement table 22 moves upward, the tension rod 23 will first abut against the surface of the UV coating film 1. The UV coating film 1 will be first lifted up and gradually tensioned. The UV coating film 1 will also exert extrusion on the tension rod 23. At this time, the support spring 25 will be compressed. The greater the compression of the support spring 25 at this time, the higher the tension degree of the UV coating film 1 will be, until the wafer contacts and adheres to the UV coating film 1. At this time, the laser cutting mechanism 5 can be used for cutting (refer to Figure 3 ). The laser cutting mechanism 5 is assembled through a three-dimensional moving platform. After the cutting is completed, the support plate 26 rotates back, and the placement table 22 returns to the initial position. At the same time, the positioning plate 6 will gradually move away from the UV coating film 1. As the UV coating film 1 moves, the wafer moves to the area for film expansion and grain picking.

[0038] As Figure 2 , Figure 8 and Figure 9 shown, an installation frame 15 is assembled inside the protective cover 3. A through hole is provided in the middle of the installation frame 15. A moving frame 16 is installed at this through hole position. The moving frame 16 is lifted and lowered by an electric push rod. An expansion rod 19 driven by a motor to rotate is assembled inside the moving frame 16. An expansion ball 17 is assembled at the end of the expansion rod 19. A limiting rod 21 is integrally formed on the surface of the inner rod of the expansion rod 19. There are two groups of limiting rods 21, and the number of each group is two. An arc-shaped limiting frame 20 is assembled on the surface of the moving frame 16. When the expansion rod 19 rotates, the limiting rod 21 abuts against the surface of the limiting frame 20, and the overall length of the expansion rod 19 will also change.

[0039] That is, when the wafer moves to the position for film expansion and grain picking, the laser cutting area will enter a new UV coating film 1. The positioning plate 6 is re-positioned and fixed. The laser cutting area repeats the previous operation. The electric push rod drives the moving frame 16 to descend, and the expansion ball 17 abuts against the surface of the UV coating film 1. It should be noted that the diameter of the expansion ball 17 itself is larger than the diameter of the wafer. If there is a slight deviation in the placement position of the wafer each time, the expansion ball 17 can still expand the UV coating film 1 at the position of the wafer. At this time, the surface of the UV coating film 1 is gradually stretched, and the grains are separated from each other, and the contact area between the UV coating film 1 and each grain gradually decreases until the grains are separated from the surface of the UV coating film 1. And the motor drives the expansion rod 19 to rotate. When rotating at a position deviated from the center, the length of the expansion rod 19 will be longer to adapt to the film expansion of the UV coating film 1 at both side positions, so as to ensure that each grain can be removed. A belt conveyor 10 is assembled at the position where the grains fall. The output end of the belt conveyor 10 extends to the outside of the protective cover 3 to transport the grains out of the inside of the protective cover 3. When this process ends, the previous laser cutting process has also ended.

[0040] However, during the rotation of the telescopic rod 19, since the film expanding ball 17 abuts against the surface of the UV coating film 1 and there is a large frictional force between the two, the UV coating film 1 may be broken during rotation. Therefore, a semi-circular frame 18 is assembled at the end of the telescopic rod 19, and the film expanding ball 17 is rotatably installed on the surface of the semi-circular frame 18, so that the film expanding ball 17 itself rotates when the telescopic rod 19 rotates, reducing the frictional force and avoiding the breakage of the UV coating film 1, ensuring the stability of grain picking.

[0041] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0042] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "connected", "installed", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0043] The above describes the preferred embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and the devices and structures not described in detail should be understood to be implemented in a common manner in the art; any person skilled in the art can make many possible changes and modifications without departing from the technical solution of the present invention, or modify it into an equivalent embodiment with equivalent changes, which does not affect the essence of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still fall within the scope of the protection of the technical solution of the present invention.

Claims

1. A cutting device for semiconductor device processing, characterized in that Including: A UV film attached to the surface of the wafer, using the tension of the UV film to peel off the diced grains; A positioning mechanism for fixing the position of the UV film, the positioning mechanism is set in a positioning method of at least three-point positioning, dividing the UV film into two different regions; A transmission rack for installing and conveying the UV film, the UV film horizontally penetrates the positioning mechanism, and the glue-containing surface is vertically downward, and a protective cover is assembled on the surface of the transmission rack, and an operation opening for placing the wafer is provided on the surface of the protective cover; A laser cutting mechanism for cutting the wafer, assembled inside the protective cover through a three-dimensional moving platform, and the cutting range of the laser cutting mechanism is the front region in the moving direction of the UV film; A film expanding and grain taking mechanism for stretching the diced wafer horizontally and vertically, so that the generated grains are separated from the surface of the UV film, and the grain taking range of the film expanding and grain taking mechanism is the rear region in the moving direction of the UV film; An output mechanism for moving the taken grains out of the inside of the protective cover.

2. A cutting device for semiconductor device processing according to claim 1, characterized in that: The positioning mechanism includes three groups of equally spaced positioning plates, and the number of each group of positioning plates is set to two, respectively above and below the UV film. The surface of the positioning plate is not adhered to the UV film, and a lifting component is arranged between the positioning plates of the same group for controlling the distance between the positioning plates of the same group.

3. A cutting device for semiconductor device processing according to claim 2, characterized in that: A connecting spring is assembled between the positioning plates of the same group for squeezing the positioning plates of this group to increase the squeezing force.

4. A cutting device for semiconductor device processing according to claim 2, characterized in that: The lifting component includes two connecting plates with different heights. The width of the connecting plate located above is smaller than the width of the connecting plate located below. The length of the upper plate of each group of positioning plates is greater than the length of the lower plate. Each lower plate is fixed to the connecting plate with a shorter width through a connecting short rod, and each upper plate is fixed to the connecting plate with a longer width through a connecting long rod; A threaded rod with a double thread is assembled between the two connecting plates. The two ends of the threaded rod respectively penetrate through the two connecting plates in a threaded manner. A support frame for installing the threaded rod is assembled below the connecting plate, and a motor for driving the threaded rod to rotate is assembled on the surface of the support frame. A guide rod one for guiding the moving direction is assembled between the two connecting plates.

5. A cutting device for semiconductor device processing according to claim 1, characterized in that: The film expanding and grain taking mechanism includes an installation frame assembled inside the protective cover. A moving frame is assembled at the top of the installation frame through an electric push rod. An expanding film ball driven by a motor to rotate is assembled inside the moving frame, and the expanding film ball is assembled inside the moving frame through a connecting component.

6. A cutting device for semiconductor device processing according to claim 5, characterized in that: The connecting component includes a telescopic rod with a semi-circular frame at the end. The expanding film ball is rotatably assembled inside the semi-circular frame. An arc-shaped limiting frame is assembled on the surface of the moving frame. Two groups of limiting rods are integrally formed on the surface of the inner rod of the telescopic rod, and each group of limiting rods respectively abuts against the upper surface and the lower surface of the limiting frame.

7. A cutting device for semiconductor device processing according to claim 1, characterized in that: A liftable placement table is assembled inside the protective cover for placing the wafer to be cut. A tensioning component is assembled on the surface of the placement table for tensioning the UV film so that the UV film can be smoothly attached to the surface of the wafer.

8. A cutting device for semiconductor device processing according to claim 7, characterized in that: The tensioning assembly includes two tensioning rods with arc-shaped tops. The two tensioning rods are respectively assembled at symmetrical positions on both sides of the placement table. A second guide rod for guiding is assembled on the surface of the tensioning rod. The second guide rod movably penetrates through the placement table and extends below the placement table. A support spring is assembled between the tensioning rod and the placement table.

9. A cutting device for semiconductor device processing according to claim 7, characterized in that: A support plate driven by a motor is assembled inside the protective cover. The support plate is located directly below the placement table. The distance between the support plate and the placement table is less than the distance from the side of the support plate to the axis of the motor output shaft.

10. A cutting device for semiconductor device processing according to claim 1, characterized in that: The output mechanism is a belt conveyor. The belt conveyor is located directly below the film expanding and grain taking mechanism. The output end of the belt conveyor extends outside the protective cover.

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