Cutting device for processing semiconductor devices

Abstract

The present invention relates to the technical field of laser cutting devices, and specifically proposes a cutting device for semiconductor device processing, comprising a UV coating, a positioning mechanism for fixing the position of the UV coating, a transmission frame for installing the UV coating and transporting it, a laser cutting mechanism, a film expanding and particle taking mechanism, and an output mechanism for moving the removed crystal grains out of the interior of a protective cover. The present invention provides a laser cutting mechanism, a film expanding and particle taking mechanism, and a UV coating. When cutting a wafer, the wafer is first adhered to the surface of the UV coating and cut by the laser cutting mechanism. After the cutting is completed, as the UV coating moves to the position of the film expanding and particle taking mechanism, the laser cutting position automatically replaces the new UV coating and continues the cutting process. At this time, the film expanding and particle taking mechanism simultaneously expands the film and takes particles, thereby omitting the process of cutting the UV coating and reducing the number of manual operation steps in the entire process, thereby effectively improving the cutting efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting devices, and in particular proposes a cutting device for processing semiconductor devices. Background Art

[0002] A wafer refers to a silicon chip used in the production of silicon semiconductor integrated circuits. Its cutting methods mainly include blade cutting, laser cutting and plasma cutting. Since laser cutting is non-contact cutting, it can effectively reduce fragmentation and cracking problems. It is suitable for processing fragile or ultra-thin wafers with complex structures. It has high precision and accuracy and can support complex cutting patterns and small pitch separation. Before the wafer is cut, it needs to be covered with UV film, and the stretchable properties of the UV film are used to separate the cut wafers.

[0003] The entire wafer cutting process includes: first, laminating the wafer, cutting the UV film into the same size as the wafer, then placing the laminating wafer inside the laser cutting machine for cutting, and after cutting, taking it out and placing it in an area where the film can be expanded to remove the grains, or manually expanding the film to remove the grains. The entire process requires multiple manual coordination, which is relatively cumbersome and has low production efficiency. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a cutting device for semiconductor device processing, which is used to solve the problems mentioned in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention adopts the following technical solutions: a cutting device for semiconductor device processing, comprising a UV coating adhered to the surface of a wafer, and utilizing the tension of the UV coating to peel off the grains produced after cutting; a positioning mechanism for fixing the position of the UV coating, wherein the positioning mechanism is configured to have at least three-point positioning, dividing the UV coating into two different areas; a transport frame for installing the UV coating and transporting it, wherein the UV coating passes through the positioning mechanism laterally with the adhesive surface facing vertically downward, and the surface of the transport frame is equipped with a protective cover, wherein the surface of the protective cover is provided with an operating port for placing the wafer; a laser cutting mechanism for cutting the wafer, which is assembled inside the protective cover via a three-dimensional movable platform, wherein the cutting range of the laser cutting mechanism is the front area in the moving direction of the UV coating; a film expansion and grain removal mechanism for stretching the cut wafer laterally and longitudinally to separate the produced grains from the surface of the UV coating, wherein the grain removal range of the film expansion and grain removal mechanism is the rear area in the moving direction of the UV coating; and an output mechanism for moving the removed grains out of the interior of the protective cover.

[0006] Preferably, the positioning mechanism includes three groups of equidistantly arranged positioning plates, and each group of the positioning plates is provided with two, respectively above and below the UV coating. The surface of the positioning plates is not adhered to the UV coating, and a lifting assembly is provided between the positioning plates in the same group to control the distance between the positioning plates in the same group.

[0007] Preferably, connecting springs are installed between the positioning plates in the same group to squeeze the positioning plates in the group to increase the squeezing force.

[0008] Preferably, the lifting assembly includes two connecting plates of different heights, the width of the upper connecting plate is smaller than the width of the lower connecting plate, the length of the upper plate of each group of positioning plates is larger than the length of the lower plate, each lower plate is fixed to the connecting plate with shorter width by connecting short rods, and each upper plate is fixed to the connecting plate with longer width by connecting long rods; a threaded rod with bidirectional threads is installed between the two connecting plates, and the two ends of the threaded rod are respectively threaded through the two connecting plates, and a support frame for installing the threaded rod is installed under the connecting plate, and a motor for driving the threaded rod to rotate is installed on the surface of the support frame, and a guide rod 1 for guiding its moving direction is installed between the two connecting plates.

[0009] Preferably, the film expanding and particle taking mechanism includes a mounting frame assembled inside the protective cover, the top of the mounting frame is equipped with a movable frame through an electric push rod, the inner side of the movable frame is equipped with a film expanding ball driven to rotate by a motor, and the film expanding ball is assembled on the inner side of the movable frame through a connecting assembly.

[0010] Preferably, the connecting assembly includes a telescopic rod with a semi-ring frame at the end, the membrane expansion ball is rotatably assembled inside the semi-ring frame, the surface of the movable frame is equipped with an arc-shaped limit frame, and the inner rod surface of the telescopic rod is provided with two sets of integrally formed limit rods, and each set of limit rods is respectively against the upper surface and lower surface of the limit frame.

[0011] Preferably, the interior of the protective cover is equipped with a liftable storage table for placing the wafer to be cut, and the surface of the storage table is equipped with a tensioning assembly for tensioning the UV coating so that the UV coating can fit smoothly on the wafer surface.

[0012] Preferably, the tensioning assembly includes two tensioning rods with arc-shaped tops, and the two tensioning rods are respectively installed at two symmetrical sides of the storage table. The surface of the tensioning rod is equipped with a guide rod 2 for guiding, and the guide rod 2 is movable through the storage table and extends to the bottom of the storage table. A support spring is installed between the tensioning rod and the storage table.

[0013] Preferably, the interior of the protective cover is equipped with a support plate driven by a motor, the support plate is located directly below the storage table, and the distance between the support plate and the storage table is smaller than the distance from the side of the support plate to the axis of the motor output shaft.

[0014] Preferably, the output mechanism is a belt conveyor, which is located directly below the film expanding and particle taking mechanism, and the output end of the belt conveyor extends to the outside of the protective cover.

[0015] The above technical solution has the following advantages or beneficial effects: The present invention provides a cutting device for semiconductor device processing, which is provided with a laser cutting mechanism, a film expansion and particle removal mechanism and a UV coating, with the sticky side of the UV coating facing downward. During the wafer cutting process, the wafer is first attached to the surface of the UV coating and cut at this position by the laser cutting mechanism. After the cutting is completed, as the UV coating moves to the position of the film expansion and particle removal mechanism, the laser cutting position automatically replaces the new UV coating and continues the cutting process. The film expansion and particle removal mechanism simultaneously expands the film and removes the particles, automatically peeling the particles off from the surface of the UV coating and dropping them onto the output mechanism at the bottom, omitting the process of cutting the UV coating and reducing the number of manual operation steps in the entire process, which can effectively improve the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention and its features, configurations and advantages will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings, in which like reference numerals indicate like parts throughout the drawings, which are not drawn to scale, with emphasis placed on illustrating the subject matter of the present invention.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of a cutting device for semiconductor device processing provided by the present invention.

[0018] Figure 2 yes Figure 1 Left sectional plan view.

[0019] Figure 3 yes Figure 1 Right sectional plan view.

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure inside the protective cover.

[0021] Figure 5 It is a three-dimensional structural diagram of the installation method of the storage table and tensioning components.

[0022] Figure 6 It is a three-dimensional structural diagram of the positioning mechanism.

[0023] Figure 7 yes Figure 6Schematic diagram of the three-dimensional structure viewed from above.

[0024] Figure 8 It is a three-dimensional structural diagram of the film expanding and particle taking mechanism.

[0025] Figure 9 It is a schematic diagram of the three-dimensional structure of the installation of the semi-ring frame.

[0026] In the figure: 1. UV laminating; 2. Transfer frame; 3. Protective cover; 4. Operation port; 5. Laser cutting mechanism; 6. Positioning plate; 7. Connecting spring; 8. Connecting plate; 9. Connecting short rod; 10. Belt conveyor; 11. Connecting long rod; 12. Threaded rod; 13. Support frame; 14. Guide rod 1; 15. Mounting frame; 16. Moving frame; 17. Expanding ball; 18. Semi-ring frame; 19. Telescopic rod; 20. Limiting frame; 21. Limiting rod; 22. Storage table; 23. Tensioning rod; 24. Guide rod 2; 25. Support spring; 26. Support plate. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0029] Figure 1 Disclosed is a cutting device for semiconductor device processing, which is used to cut a wafer horizontally and vertically to make it into several grains of the same size. It should be noted that the cutting device for semiconductor device processing is aimed at the invisible cutting method in laser cutting. The laser is focused on the inside of the wafer to form a modified layer. When the modified layer is completely formed, it cooperates with the UV coating 1 to separate the wafer.

[0030] like Figure 1 and Figure 4As shown, the UV coating 1 is installed through a transmission frame 2. Rotatable rollers are provided at both ends of the transmission frame 2. One end of the UV coating 1 is fixed on one of the rollers and rolled up, and the other end is fixed on the surface of the other roller. A motor (not shown in the figure) is installed on the surface of the transmission frame 2 and is installed at the roller position for rolling up to drive the roller to rotate and roll up the UV coating 1, thereby moving the UV coating 1. The sticky side of the UV coating 1 faces downward. A protective cover 3 is installed on the top of the transmission frame 2, and a transverse groove for the UV coating 1 to pass through is provided on the surface of the protective cover 3.

[0031] like Figure 4 、 Figure 6 and Figure 7 As shown, three groups of positioning plates 6 are equidistantly installed on the surface of the UV coating 1, and each group of positioning plates 6 is set to two, and are respectively located above and below the UV coating 1. To ensure the normal movement of the UV coating 1, the surface of the positioning plate 6 needs to be sprayed with a coating that will not stick to the UV coating 1. The length of the positioning plate 6 located above is greater than the length of the positioning plate 6 located below. Two connecting plates 8 for installing and connecting the positioning plates 6 are provided below the UV coating 1. The heights and widths of the two connecting plates 8 are different. The width of the connecting plate 8 located above is smaller than the width of the connecting plate 8 located below. The shorter positioning plate 6 is fixed to the shorter connecting plate 8 by connecting short rods 9, and the longer positioning plate 6 is fixed to the longer connecting plate 8 by connecting long rods 11. In this embodiment, there are two groups of connecting long rods 11 or connecting short rods 9 on the surface of the positioning plate 6, which are respectively located on both sides of the UV coating 1.

[0032] The three sets of positioning plates 6 divide the UV coating 1 into two different areas, which are used for the two working steps of laser cutting and film expansion and particle removal. It should be noted that laser cutting is located in the front area of ​​the moving direction of the UV coating 1, and film expansion and particle removal is located in the rear area of ​​the moving direction of the UV coating 1, that is, when the wafer moves with the UV coating 1, it needs to be laser cut first and then film expansion and particle removal.

[0033] The three groups of positioning plates 6 can ensure that the working conditions of the UV coating 1 in the two areas remain stable and will not be interfered with by each other. When the UV coating 1 needs to move horizontally, the three groups of positioning plates 6 need to move longitudinally. At this time, they are used in conjunction with the double-headed threaded rod 12 set between the two connecting plates 8. When the threaded rod 12 rotates, the upper connecting plate 8 moves downward and the lower connecting plate 8 moves upward, so that a larger space is created between the positioning plates 6 in the same group, which is convenient for the UV coating 1 to drive the wafer to move.

[0034] A support frame 13 for installing a threaded rod 12 is assembled below the connecting plate 8. The threaded rod 12 is driven to rotate by a motor. The motor is assembled on the surface of the support frame 13. A guide rod 14 is fixed on the surface of the connecting plate 8 located above. The guide rod 14 movably passes through the connecting plate 8 located below and the support frame 13 to ensure that the two connecting plates 8 will only move longitudinally when moving. To ensure safe use, a connecting spring 7 can be assembled on the surface of the guide rod 14 to provide longitudinal support force.

[0035] like Figure 1 、 Figure 4 and Figure 5 As shown, in order to facilitate the film lamination operation of the wafer, a longitudinally movable storage table 22 is assembled in the laser cutting area, and an operation port 4 is opened at the corresponding position of the protective cover 3. The staff places the wafer on the surface of the storage table 22 through the operation port 4 (it can also be placed by existing mechanical equipment such as a robot). The wafer needs to be completely placed on the storage table 22. A flange is provided at the position where the storage table 22 contacts the protective cover 3, and a vertical groove (not shown in the figure) is provided at the corresponding position of the protective cover 3. The storage table 22 can slide longitudinally along the vertical groove, and a rotatable support plate 26 is provided under the storage table 22. A protruding circular shaft is provided on the side of the support plate 26, and the circular shaft is movably mounted on the protective cover 3. On the inner wall, the support plate 26 is driven to rotate by a motor (not shown in the figure). The distance between the support plate 26 and the storage table 22 is less than the distance from the side of the support plate 26 to the axis of the motor output shaft. When the support plate 26 is rotated to a certain angle, the storage table 22 can be lifted up. Continuous rotation can make the wafer fit on the surface of the UV coating 1. Since the laser cutting equipment itself has a positioning system and can adaptively adjust the position, the accuracy requirements for placing the wafer are not high. It should also be noted that the surface of the storage table 22 also needs to be sprayed with a coating that will not stick to the UV coating 1 to ensure that the storage table 22 can fall stably and will not damage the UV coating 1.

[0036] In order to make the wafer fit flatly on the surface of the UV coating 1, the surface of the storage table 22 is equipped with a tensioning assembly. Specifically, tensioning rods 23 are arranged above both sides of the storage table 22, and the top of the tensioning rod 23 is arranged in an arc shape to avoid damaging the UV coating 1. At the same time, the positions on both sides of the storage table 22 are lower than the middle position, and a guide rod 24 for guiding is assembled on the surface of the tensioning rod 23. The bottom of the guide rod 24 is movable and passes through the storage table 22. The surface of the guide rod 24 is sleeved with a support spring 25, and the two ends of the support spring 25 are respectively against the surface of the storage table 22 and the tensioning rod 23.

[0037] When the storage table 22 moves upward, the tensioning rod 23 will first come into contact with the surface of the UV film 1, and the UV film 1 will be lifted up and gradually tightened. The UV film 1 will also squeeze the tensioning rod 23, and the support spring 25 will be compressed. At this time, the elastic force of the support spring 25 will be greater, and the tension of the UV film 1 will be higher, until the wafer contacts and adheres to the UV film 1. At this time, the laser cutting mechanism 5 can be used for cutting (see Figure 3 ), the laser cutting mechanism 5 is assembled through a three-dimensional mobile platform. When the cutting is completed, the support plate 26 rotates and the storage table 22 returns to the initial position. At the same time, the positioning plate 6 will gradually move away from the UV coating 1. As the UV coating 1 moves, the wafer moves to the film expansion and grain removal area.

[0038] like Figure 2 、 Figure 8 and Figure 9 As shown, a mounting frame 15 is assembled inside the protective cover 3, and a through-hole is set in the middle of the mounting frame 15. A movable frame 16 is installed at the through-hole position. The movable frame 16 is raised and lowered by an electric push rod. The interior of the movable frame 16 is equipped with a telescopic rod 19 driven to rotate by a motor, and a film expansion ball 17 is installed at the end of the telescopic rod 19. An integrally formed limit rod 21 is provided on the inner rod surface of the telescopic rod 19. There are two groups of limit rods 21, and each group has two. An arc-shaped limit frame 20 is assembled on the surface of the movable frame 16. When the telescopic rod 19 rotates, the limit rod 21 rests on the surface of the limit frame 20, and the overall length of the telescopic rod 19 will also change.

[0039] That is, when the wafer moves to the position for film expansion and grain removal, the laser cutting area will enter the new UV coating 1, the positioning plate 6 will be re-positioned and fixed, the laser cutting area will repeat the previous operation, the electric push rod will drive the moving frame 16 to descend, and the film expansion ball 17 will be against the surface of the UV coating 1. It should be noted that the diameter of the film expansion ball 17 itself is larger than the diameter of the wafer. If there is a slight deviation in the placement position of the wafer each time, the film expansion ball 17 can still expand the UV coating 1 at the wafer position. At this time, the surface of the UV coating 1 is gradually stretched, and the grains will be separated. The contact area between the UV coating 1 and each crystal grain gradually decreases until the crystal grain is separated from the surface of the UV coating 1, and the motor drives the telescopic rod 19 to rotate. When rotating away from the center position, the length of the telescopic rod 19 will also be longer to adapt to the expansion of the UV coating 1 on both sides, thereby ensuring that each crystal grain can be removed. A belt conveyor 10 is installed at the position where the crystal grain falls, and the output end of the belt conveyor 10 extends to the outside of the protective cover 3 to transport the crystal grain out of the inside of the protective cover 3. When this process is completed, the previous laser cutting process has also ended.

[0040] However, during the rotation of the telescopic rod 19, the film expansion ball 17 will press against the surface of the UV coating 1, and there will be a large friction between the two. Therefore, the UV coating 1 may be broken during rotation. Therefore, a semi-ring frame 18 is assembled at the end of the telescopic rod 19, and the film expansion ball 17 is rotatably installed on the surface of the semi-ring frame 18, so that the film expansion ball 17 also rotates when the telescopic rod 19 rotates, reducing friction, avoiding the breakage of the UV coating 1, and ensuring the stability of particle collection.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0042] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "connected," "installed," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0043] The above describes the preferred embodiments of the present invention. It should be understood that the present invention is not limited to the above-mentioned specific embodiments, and the devices and structures that are not described in detail should be understood to be implemented in a common manner in the art; any technician familiar with the art can make many possible changes and modifications without departing from the technical solution of the present invention, or modify them into equivalent embodiments with equivalent changes, which does not affect the essential content of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention that do not depart from the content of the technical solution of the present invention are still within the scope of protection of the technical solution of the present invention.

Claims

1. A cutting device for semiconductor device processing, characterized in that: include: The UV film attached to the surface of the wafer uses the tension of the UV film to peel off the dies produced after cutting; A positioning mechanism for fixing the position of the UV coating, wherein the positioning mechanism is configured to use at least three-point positioning to divide the UV coating into two different areas; A transport frame for installing and transporting the UV film, wherein the UV film extends horizontally through the positioning mechanism with the adhesive surface facing downward. A protective cover is provided on the surface of the transport frame, wherein an operating port for placing wafers is provided on the surface of the protective cover; A laser cutting mechanism for cutting wafers is assembled inside the protective cover via a three-dimensional moving platform, wherein the cutting range of the laser cutting mechanism is the front area in the moving direction of the UV coating; The film expansion and grain taking mechanism is used to stretch the cut wafers horizontally and vertically, so that the generated grains are separated from the surface of the UV coating. The grain taking range of the film expansion and grain taking mechanism is the rear area in the moving direction of the UV coating; An output mechanism for moving the removed die out of the protective cover.

2. A semiconductor device processing cutting device according to claim 1, characterized in that: The positioning mechanism includes three groups of positioning plates arranged at equal distances, and each group of the positioning plates is provided with two, respectively above and below the UV coating. The surfaces of the positioning plates are not adhered to the UV coating. A lifting assembly is provided between the positioning plates in the same group to control the distance between the positioning plates in the same group.

3. A semiconductor device processing cutting device according to claim 2, characterized in that: Connecting springs are installed between the positioning plates in the same group and are used to squeeze the positioning plates in the group to increase the squeezing force.

4. A semiconductor device processing cutting device according to claim 2, characterized in that: The lifting assembly includes two connecting plates of different heights, the width of the upper connecting plate is smaller than the width of the lower connecting plate, the length of the upper plate of each set of positioning plates is larger than the length of the lower plate, each lower plate is fixed to the shorter connecting plate by connecting short rods, and each upper plate is fixed to the longer connecting plate by connecting long rods; A threaded rod with bidirectional threads is installed between the two connecting plates, and both ends of the threaded rod are threaded through the two connecting plates respectively. A support frame for installing the threaded rod is installed under the connecting plate, and a motor for driving the threaded rod to rotate is installed on the surface of the support frame. A guide rod 1 is installed between the two connecting plates for guiding its moving direction.

5. The semiconductor device processing cutting device according to claim 1, wherein: The film expanding and particle taking mechanism includes a mounting frame assembled inside the protective cover, the top of the mounting frame is equipped with a movable frame through an electric push rod, the inner side of the movable frame is equipped with a film expanding ball driven to rotate by a motor, and the film expanding ball is assembled on the inner side of the movable frame through a connecting assembly.

6. A semiconductor device processing cutting device according to claim 5, characterized in that: The connecting assembly includes a telescopic rod with a semi-ring frame at the end, the membrane expansion ball is rotatably assembled inside the semi-ring frame, the surface of the movable frame is equipped with an arc-shaped limit frame, and the inner rod surface of the telescopic rod is provided with two sets of integrally formed limit rods, and each set of the limit rods is respectively against the upper surface and the lower surface of the limit frame.

7. The semiconductor device processing cutting device according to claim 1, wherein: The interior of the protective cover is equipped with a liftable storage table for placing the wafers to be cut. The surface of the storage table is equipped with a tensioning assembly for tensioning the UV coating so that the UV coating can fit smoothly on the wafer surface.

8. The semiconductor device processing cutting device according to claim 7, characterized in that: The tensioning assembly includes two tensioning rods with arc-shaped tops, and the two tensioning rods are respectively installed on both sides of the storage table symmetrically. The surface of the tensioning rod is equipped with a guide rod 2 for guiding. The guide rod 2 is movable through the storage table and extends to the bottom of the storage table. A support spring is installed between the tensioning rod and the storage table.

9. The semiconductor device processing cutting device according to claim 7, wherein: A support plate driven by a motor is installed inside the protective cover. The support plate is located directly below the storage table. The distance between the support plate and the storage table is smaller than the distance from the side of the support plate to the axis of the motor output shaft.

10. The semiconductor device processing cutting device according to claim 1, wherein: The output mechanism is a belt conveyor, which is located directly below the film expanding and particle taking mechanism, and the output end of the belt conveyor extends to the outside of the protective cover.

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