A wide-width laser-assisted grinding method and device based on ablation path planning

Abstract

The present invention discloses a wide-width laser-assisted grinding method and device based on ablation path planning. The wide-width laser-assisted grinding method uses a wide-width laser generator to focus on the ground surface of the workpiece to form a line laser; the line laser scans and ablates along the ablation path, and grinds the ablated ground surface through a grinding wheel; the two side edges of the grinding path are used as two boundary lines; the movement process of the two end points of the line laser is divided into two stages; in the first stage, the two laser end points move at a constant speed along the two boundary lines respectively until one of the laser end points completely sweeps over the corresponding boundary line; in the second stage, the laser end point that completely sweeps over the corresponding boundary line moves toward the end point of the boundary line corresponding to the other laser end point until the two laser end points converge and the ablation of the grinding path is completed; if the two boundary lines are of equal length, the ablation of the grinding path is completed after the laser end point completely sweeps over the corresponding boundary line, and the second stage is not performed.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser-assisted grinding, and in particular relates to a wide-width laser-assisted grinding method and device based on ablation path planning. Background Art

[0002] Compared to traditional structural ceramics, the ceramic-based composite material SiCf / SiC boasts higher impact toughness and flexural strength, making it an important new material for defense equipment. This multiphase material system, created by adding a second phase to a single ceramic, boasts lightweight, high-temperature resistance, and resistance to oxidation and corrosion, making it an irreplaceable material for high-temperature structural applications.

[0003] Grinding is a primary processing method for ceramic matrix composites (CMCs). Research in this area is still in its early stages, both domestically and internationally. The mechanism by which continuous fibers, acting as a toughening phase, contribute to material removal remains unclear. Laser ablation-assisted grinding of CMCs can optimize grinding accuracy, but traditional point-pulsed lasers suffer from difficult parameter control, low scanning efficiency, uneven ablation, and difficulty controlling thermal damage. These issues lead to low grinding efficiency and difficulty controlling machining damage. Summary of the Invention

[0004] The present invention aims to address the current difficulties in processing ceramic-based auxiliary materials, as well as the difficulty in controlling ablation temperatures and temperature unevenness during point-based laser-assisted grinding. This invention provides a wide-band laser-assisted grinding method and device based on ablation path planning. This method utilizes a wide-band laser for modified ablation prior to grinding wheel processing. This method uses beam shaping technology to transform the point-like light spot into a uniformly distributed linear light source, allowing the laser energy to quickly form a continuous and stable thermal field distribution within the processing area, effectively preventing local overheating. This improves processing efficiency and grinding accuracy.

[0005] In a first aspect, the present invention provides a method for wide-width laser-assisted grinding of ceramic-based composite materials; the method comprises:

[0006] A wide-width laser generator is used to focus on the surface of the workpiece to be ground, forming a line laser. The line laser scans and ablates the surface of the workpiece along the ablation path. A grinding wheel follows the rear side of the line laser and grinds the ablated surface of the workpiece. The two side edges of the grinding path serve as two boundary lines. The ablation path of the line laser is determined by the movement path of the two end points of the line laser.

[0007] The movement process of the two end points of the line laser is divided into two stages; in the first stage, the two laser end points move at a constant speed along the two boundary lines respectively until one of the laser end points completely sweeps the corresponding boundary line and enters the second stage; in the second stage, the laser end point that has not completely swept the corresponding boundary line is used as the first moving point, and the laser end point that has completely swept the corresponding boundary line is used as the second moving point; the first moving point continues to move along the corresponding boundary line, and the second moving point moves toward the end point of the boundary line corresponding to the first moving point until the first moving point and the second moving point merge, and the ablation of the grinding path is completed.

[0008] If the two boundary lines are of equal length, the ablation of the grinding path is completed after the laser endpoint completely sweeps across the corresponding boundary line, and the second stage is not performed.

[0009] Preferably, the ground surface of the workpiece is divided into a plurality of independent processing zones; each processing zone corresponds to an independent ablation path; during the grinding process, the axis of the grinding wheel is parallel to the width of the processing zone;

[0010] If the surface to be ground of the workpiece is an annular surface, each processing belt is annular; if the surface to be ground of the workpiece is a non-annular surface, the processing belt extends from one end to the other end of the ground surface, and each processing belt is arranged in parallel in sequence along the width direction of the ground surface.

[0011] Preferably, for the annular ablation path, in the first stage, the angular velocity of the grinding wheel movement is equal to the angular velocity of the first moving point; in the second stage, the moving speed of the first moving point remains unchanged, and the speed of the second moving point is adjusted so that the first moving point and the second moving point arrive at the end point of the boundary line corresponding to the movement of the first moving point at the same time.

[0012] Preferably, for the annular ablation path, at the start of ablation, the line laser is parallel to the axis of the grinding wheel, and the distance between the line laser and the grinding line is 3 mm to 6 mm.

[0013] Preferably, for an ablation path with two independent ends, the line laser is parallel to the axis of the grinding wheel.

[0014] Preferably, the distance between the line laser and the grinding line remains constant.

[0015] Preferably, the distance between the line laser and the grinding line is 3 mm to 6 mm.

[0016] In the second aspect, the present invention provides a wide-width laser-assisted grinding device based on ablation path planning, which is used to perform the above-mentioned wide-width laser-assisted grinding method; the wide-width laser-assisted grinding device includes a grinding wheel machine and a workpiece processing module and a workpiece moving module installed on the grinding wheel machine; the workpiece processing module includes a laser moving assembly, a wide-width laser generator and a grinding wheel; the wide-width laser generator is installed at the end of the laser moving assembly through a rotary joint; the workpiece moving module is used to feed the grinding workpiece.

[0017] Preferably, the grinding workpiece is a shaft workpiece; the workpiece moving module includes a workpiece fixture, a first vertical feed mechanism, a first lateral feed mechanism and a workpiece rotating rod; the workpiece rotating rod is used to drive the grinding workpiece to rotate during the processing; the workpiece fixture is provided with a rotating pair for adjusting the position angle of the grinding workpiece.

[0018] Preferably, the grinding workpiece is a planar workpiece; the workpiece moving module includes a second vertical feeding mechanism, a second transverse feeding mechanism and a longitudinal feeding mechanism arranged in sequence from top to bottom; the grinding workpiece is fixed to the second vertical feeding mechanism by vacuum adsorption.

[0019] The present invention has the following beneficial effects:

[0020] 1. The present invention converts a point-shaped light spot into a parallel distributed uniform line light source through beam shaping technology, so that the laser energy forms a continuous and stable thermal field in the processing area, overcoming the problems of local overheating and difficult-to-control thermal damage existing in traditional point-shaped pulse lasers; at the same time, the present invention ensures that the ceramic substrate is uniformly and fully deteriorated and ablated by the process by constraining the length of the wide-width laser line light source to be equal to the grinding width of the grinding wheel and controlling the distance between the ablation position and the grinding position of the grinding wheel, thereby avoiding substrate cracks or fiber damage caused by local energy concentration and improving the integrity of the grinding surface.

[0021] 2. The present invention adopts a wide laser line light source to cover the effective grinding width of the grinding wheel at one time. Through the coordinated movement of the workpiece fixture and the axial feed of the grinding wheel, the seamless connection between laser ablation and grinding is achieved, so that the laser thermal softening and deterioration effect and the mechanical grinding removal are accurately matched in time and space, thereby improving the single processing efficiency and being suitable for the efficient processing of large-size ceramic-based composite materials.

[0022] 3. The present invention solves the problems of traditional point-shaped laser-assisted grinding, which requires high-frequency scanning to cover the processing area, and uneven grinding temperature and difficult to control ablation temperature during continuous processing, through modular workpiece moving module design and wide-width laser moving axis integration optimization. It realizes uniform and full-coverage ablation of the grinding position, meeting the continuous processing needs of pipes, plates and curved special-shaped ceramic-based composite parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the wide-width laser-assisted grinding device in Example 1 of the present invention.

[0024] Figure 2 This is a flow chart of the wide-width laser-assisted grinding method in Example 2 of the present invention.

[0025] Figure 3 Schematic diagram of the moving path of the moving point on the processing belt in Example 2 of the present invention.

[0026] Figure 4 Schematic diagram of the angle of adjustment of the wide-amplitude laser generator in the xz plane in Example 2 of the present invention.

[0027] Figure 5 Schematic diagram of the angle of adjustment of the wide-amplitude laser generator in the xy plane in Example 2 of the present invention.

[0028] Figure 6 This is a surface micrograph of the ground workpiece processed in Example 3 of the present invention.

[0029] Figure 7 This is a sub-surface topography image of the ground workpiece processed in Example 3 of the present invention.

[0030] Figure 8 Schematic diagram of the wide-width laser-assisted grinding device in Example 4 of the present invention.

[0031] Figure 9 Schematic diagram of the grinding workpiece adjustment method in Example 5 of the present invention.

[0032] Figure numerals: 1. Laser moving assembly; 2. Wide-width laser generator; 3. Grinding workpiece; 4. Workpiece fixture; 5. Grinding wheel; 6. Grinding machine tool; 7. First vertical feeding mechanism; 8. First lateral feeding mechanism; 9. Workpiece rotating mechanism; 10. Second lateral feeding mechanism; 11. Longitudinal feeding mechanism; 12. Second vertical feeding mechanism. DETAILED DESCRIPTION

[0033] The present invention will be further described below with reference to the accompanying drawings.

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0036] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0037] Example 1

[0038] like Figure 1 As shown, a wide-width laser-assisted grinding device based on ablation path planning is used for cylindrical grinding of shaft-type workpieces; the wide-width laser-assisted grinding device includes a grinding wheel machine 6 and a workpiece processing module and a workpiece moving module installed on the grinding wheel machine 6; the workpiece processing module includes a laser moving component 1, a wide-width laser generator 2 and a grinding wheel 5; the workpiece moving module includes a workpiece fixture 4, a first vertical feeding mechanism 7, a first lateral feeding mechanism 8 and a workpiece rotating mechanism 9.

[0039] In this embodiment, the first vertical feed mechanism 7 and the first lateral feed mechanism 8 use ball screws with a positioning accuracy of ±0.3 μm; the workpiece clamp 4 uses a self-centering hydraulic chuck, which can achieve axial insertion and rapid clamping of workpieces with different diameters.

[0040] The wide-width laser generator 2 is mounted at the end of the laser motion assembly 1 via a swivel joint. The laser motion assembly 1 is rotatably mounted on a grinding machine 6 and driven by a rotary servo motor to adjust the ablation position of the laser motion assembly 1. A workpiece rotation mechanism 9 is slidably mounted at the end of the first transverse feed mechanism 8 and is used to drive the rotation of the workpiece fixture 4. The workpiece fixture 4 is used to clamp the workpiece 3 being machined. A rotary pair is provided in the workpiece fixture 4 to adjust the position and angle of the machined workpiece 3 so that the generatrix of the workpiece 3 is parallel to the center axis of the grinding wheel 5.

[0041] In this embodiment, the workpiece 3 being ground is a ceramic-based composite material; the grinding wheel 5 is a diamond grinding wheel with an effective grinding length of 6 mm; the laser movable axis 1 can move precisely in the a and b directions, with a positioning accuracy of ±0.5 μm; the workpiece rotating mechanism 9 adopts a permanent magnet synchronous servo motor with a rotation speed of 1 r / min~30 r / min and a radial runout tolerance of ±1 μm.

[0042] Example 2

[0043] like Figure 2 As shown, a wide-width laser-assisted grinding method based on ablation path planning is used, using the wide-width laser-assisted grinding device in Example 1. The shape of the workpiece 3 being processed is a frustum with a bottom radius of 120 mm, a top radius of 70 mm, and a height of 60 mm.

[0044] The wide-width laser-assisted grinding method comprises the following steps:

[0045] Step 1: Use the corresponding rough machining process to process the ground workpiece 3 to the corresponding size; construct a three-dimensional rectangular coordinate system with the axial direction of the grinding wheel 5 as the x-axis and the vertical direction as the z-axis; use a three-dimensional scanner to model the surface morphology of the ground workpiece 3 and obtain a three-dimensional model of the ground workpiece 3.

[0046] Step 2: Figure 3 As shown, the grinding surface of the three-dimensional model of the workpiece 3 is divided into multiple processing zones along the grinding direction and according to the effective grinding length d of the grinding wheel. The generatrix of the processing zone serves as the starting grinding line. Laser endpoints r1 and r2 are set on either side of the processing zone; laser endpoint r1 is set on the edge with the longer overall length, while laser endpoint r2 is set on the edge with the shorter overall length. The initial positions of laser endpoints r1 and r2 are at the intersection of the generatrix of the processing zone and the two side edges. The line connecting laser endpoints r1 and r2 serves as the line laser focused by the wide-width laser generator 2 on the grinding surface of the workpiece.

[0047] Step 3: The line laser scans and ablates the surface of the workpiece along the ablation path. The ablation path of the line laser is determined by the movement path of the two end points of the line laser. The process is as follows:

[0048] To ensure the same laser ablation time at each position, laser endpoints r1 and r2 are moved in the same direction on the two edges of the processing belt at the irradiation linear speed of the wide-width laser generator 2. Since the total length of the edge where laser endpoint r2 is located is shorter, after laser endpoint r2 reaches the end point (i.e., moves one circle), laser endpoint r2 moves along the generatrix to the end point of laser endpoint r1. By adjusting the speed v of laser endpoint r2 along the generatrix, laser endpoint r2 and laser endpoint r1 reach the end point of laser endpoint r1 at the same time. The speed v of laser endpoint r2 is set as follows:

[0049]

[0050] in, is the velocity of the laser endpoint r1; is the total length of the edge where the laser endpoint r1 is located; is the total length of the edge where the laser endpoint r2 is located; is the busbar length of the processing belt.

[0051] All processing zones are traversed to obtain the corresponding ablation paths of all processing zones.

[0052] Step 4. Determine the grinding depth required for the grinding process based on the required size and precision requirements of the grinding workpiece 3. Clamp the grinding workpiece 3 in the workpiece fixture 4; locate the center axis coordinate of the workpiece fixture 4 for feed positioning. Adjust the spatial position of the grinding workpiece 3 by the first vertical feed mechanism 7 and the first horizontal feed mechanism 8 so that the generatrix of the grinding workpiece 3 is parallel to the center axis of the grinding wheel 5. Before the start of processing, the tangent position of the grinding workpiece 3 and the grinding wheel 5 maintains a vertical distance of 1 mm. Adjust the laser moving axis 1 and set the initial ablation position of the wide-width laser 2 at the starting grinding line along the rotation direction of the grinding wheel 5.

[0053] In this embodiment, the preset distance between the starting grinding line and the initial ablation position on the processing surface is 3 mm to 6 mm.

[0054] Step 5: Figure 4 and Figure 5 As shown, the various processing parameters are set, the grinding wheel 5 is started, and the workpiece 3 to be ground is fed to the desired grinding depth via the first vertical feed mechanism 7, where it contacts the grinding wheel 5. After the workpiece 3 contacts the grinding wheel 5, the wide-width laser 2 starts irradiation with preset parameters, and the workpiece rotary axis 9 drives the workpiece 3 to rotate at a preset angular velocity n3. During the processing, the wide-width laser generator 2 is rotated by θy in the xz plane and θz in the xy plane via the laser motion assembly 1, and one end of the laser line spot is aligned with the laser endpoint r1, enabling the wide-width laser 2 to scan and ablate the surface of the workpiece along the ablation path. Here, θy is the angle formed by the line connecting the laser endpoints r1 and r2 and the z-axis in the xz plane; θz is the angle formed by the line connecting the laser endpoints r1 and r2 and the x-axis in the xy plane. After the workpiece 3 has rotated and ground once, the wide-width laser generator 2 stops irradiation and the grinding wheel 5 is used to perform rotary grinding on the workpiece 3 for 2 to 3 cycles using the same parameters to ensure processing accuracy. After the grinding wheel 5 performs rotary grinding, the grinding wheel 5 stops, and the workpiece movement module controls the workpiece to be slightly lifted and fed along the axial direction of the grinding wheel by a unit length d. The above process is repeated to start the next round of processing; this cycle continues until the entire workpiece 3 is processed. If the length of the workpiece along the axial direction of the grinding wheel is not an integer multiple of d, in the last round of processing, it is only necessary to feed the grinding workpiece 3 so that the effective grinding position of the grinding wheel covers the remaining part for processing. At the same time, the spot width is adjusted to match the remaining part to avoid unnecessary deterioration caused by laser irradiation of the already processed part.

[0055] In this embodiment, the feeding depth of the grinding wheel 5 is less than 20 μm; the grinding linear speed of the grinding wheel 5 is 60 mm / s; the irradiation linear speed is 0.4 mm / s; and the movement speed of the grinding wheel 5 is 0.4 mm / s.

[0056] In this embodiment, the movement speed of the grinding wheel 5 is the linear speed of the grinding wheel 5 moving on the edge of the processing belt with a longer total length; the movement angular speed of the grinding wheel 5 is the angular speed of the grinding wheel 5 moving on the ground surface of the workpiece; and the irradiation linear speed is the linear speed of the laser endpoint r1.

[0057] In some embodiments, a single processing zone is processed multiple times until the target depth is reached.

[0058] Example 3

[0059] A wide-width laser-assisted grinding method based on ablation path planning employs the wide-width laser-assisted grinding apparatus of Example 1. This method differs from Example 2 in that: the workpiece 3 being ground is a cylinder with a bottom radius of 20 mm and a length of 60 mm; and the two sides of the divided processing zone have the same shape.

[0060] In this embodiment, the outer circle of the pipe is finely ground to a radius of 20 mm, and the grinding depth is ≤6.2 μm; the wide-band laser power is 8 W; and the rotational angular velocity is set to n3=11.46° / s.

[0061] The surface microscopy and subsurface morphology detection of the finished grinding workpiece 3 are performed, and the microscopic and subsurface images are as follows: Figure 6 、 Figure 7 As shown, the surface roughness of the composite pipe obtained by testing is 3 μm.

[0062] Example 4

[0063] like Figure 8 As shown, a wide-width laser-assisted grinding device based on ablation path planning is used for surface grinding of planar workpieces. The wide-width laser-assisted grinding device includes a grinding machine 6, a workpiece processing module mounted on the grinding machine 6, and a workpiece movement module. The workpiece processing module includes a laser movement assembly 1, a wide-width laser generator 2, and a grinding wheel 5. The workpiece movement module is used to drive the grinding workpiece 3 in three degrees of freedom and includes, from top to bottom, a second vertical feed mechanism 12, a second lateral feed mechanism 10, and a longitudinal feed mechanism 11. The grinding workpiece 3 is fixed to the second vertical feed mechanism 12 by vacuum suction.

[0064] In this embodiment, the longitudinal feeding mechanism 11 uses a ball screw.

[0065] Example 5

[0066] like Figure 9 As shown, a method for wide-width laser-assisted grinding of ceramic-based composite materials is used, using the wide-width laser-assisted grinding device in Example 3. The workpiece 3 being processed is a uniform curved plate material with a length of 100 mm, a width of 60 mm, and a thickness of 10 mm, that is, the curvature of the surface in the x-axis direction is consistent.

[0067] The wide-width laser-assisted grinding method comprises the following steps:

[0068] Step 1: Use the corresponding rough machining process to process the ground workpiece 3 to the corresponding size; construct a three-dimensional rectangular coordinate system with the axial direction of the grinding wheel 5 as the x-axis and the vertical direction as the z-axis; use a three-dimensional scanner to model the surface morphology of the ground workpiece 3 and obtain a three-dimensional model of the ground workpiece 3.

[0069] Step 2: Divide the three-dimensional model of the workpiece 3 into multiple processing zones along the y-axis according to the effective grinding length d of the grinding wheel. The edges of the processing zones parallel to the x-axis serve as the starting grinding lines. Laser endpoints r1 and r2 are set at either end of the edges of the processing zones parallel to the y-axis. The line connecting these two endpoints serves as the line laser focused by the wide-band laser generator 2 on the surface of the workpiece being ground.

[0070] Step 3: The line laser scans and ablates the surface of the workpiece along the ablation path. The ablation path of the line laser is determined by the movement path of the two end points of the line laser. The process is as follows:

[0071] To ensure the same laser ablation time at each location, laser endpoints r1 and r2 are moved in the same direction along the two edges of the processing strip at the irradiation linear velocity of the wide-band laser generator 2 until both laser endpoints reach their corresponding endpoints, i.e., the other end of the processing strip. This process traverses all processing strips to obtain the corresponding ablation paths for all processing strips.

[0072] Step 4: Determine the grinding depth required for the grinding process based on the required size and precision of the workpiece 3. Adjust the spatial position of the workpiece 3 by the workpiece moving module so that the width of the workpiece 3 is parallel to the center axis of the grinding wheel 5.

[0073] In this embodiment, the preset distance between the starting grinding line and the initial ablation position on the processing surface is 3 mm to 6 mm.

[0074] Step 5: Set the processing parameters, start the grinding wheel 5, and feed the workpiece 3 to the desired grinding depth via the first vertical feed mechanism 7, bringing it into contact with the grinding wheel 5. The wide-band laser 2 starts irradiating with preset parameters, and the workpiece rotary axis 9 drives the workpiece 3 to rotate at a preset angular velocity n3. After the ablation position of the wide-band laser 2 reaches the preset distance from the initial position, the grinding wheel 5 begins processing the workpiece 3. During processing, the grinding wheel 5 needs to adjust the curvature of the workpiece 3 to suit the curved surface.

[0075] Wide-width laser generator 2 at different processing points P i At the processing point P i The inclination angle of the tangent to the horizontal plane The wide-width laser generator 2 is irradiated perpendicularly to the workpiece 3 at an angle of 1 / 4. The wide-width laser generator 2 is adjusted by the laser motion assembly 1 to scan and ablate the surface of the workpiece along the ablation path. When the ablation position of the wide-width laser generator 2 reaches the edge of the workpiece 3, the wide-width laser generator 2 stops irradiation. The grinding wheel 5 is translated twice in the y-direction with the same parameters, completing the grinding of a single processing zone.

[0076] In this embodiment, the ablation position of the wide-width laser generator 2 is parallel to the grinding line, and the distance between the ablation position and the grinding line is 3 mm to 4 mm.

[0077] Step 6: After grinding is complete, the grinding wheel stops, and the workpiece movement module controls the workpiece to slightly lift and feed the workpiece along the grinding wheel axis by a unit length d. Step 5 is repeated to start processing the next processing zone. This cycle continues until the entire grinding workpiece 3 is processed. If the workpiece's axial length along the grinding wheel is not an integer multiple of d, in the final round of processing, only the grinding workpiece 3 needs to be fed and ground so that the effective grinding position of the grinding wheel covers the remaining portion.

[0078] Although the present invention has been described with reference to specific implementations in the above embodiments, it should be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It should be understood that many modifications may be made to the illustrative embodiments, and that other arrangements may be devised, without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in ways other than those described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in conjunction with other described embodiments.

Claims

1. A wide-width laser-assisted grinding method based on ablation path planning, characterized by: The method comprises: A wide-width laser generator (2) is used to focus on the grinding surface of a grinding workpiece (3) to form a line laser; the line laser scans and ablates the grinding surface of the grinding workpiece (3) along an ablation path; a grinding wheel (5) follows the rear side of the line laser and grinds the ablated grinding surface of the grinding workpiece (3); the two side edges of the grinding path are used as two boundary lines; the ablation path of the line laser is determined by the movement path of the two end points of the line laser; The ground surface of the grinding workpiece (3) is divided into a plurality of independent processing zones; each processing zone corresponds to an independent ablation path; during the grinding process, the axis of the grinding wheel (5) is parallel to the width of the processing zone; A laser endpoint r1 and a laser endpoint r2 are respectively set at the two side edges of the processing belt; the initial positions of the laser endpoint r1 and the laser endpoint r2 are the intersections of the processing belt generatrix and the two side edges; the line connecting the laser endpoint r1 and the laser endpoint r2 is used as a line laser focused on the grinding surface of the grinding workpiece by the wide-width laser generator (2); If the surface to be ground of the grinding workpiece (3) is an annular surface, each processing belt is annular; if the surface to be ground of the grinding workpiece (3) is a non-annular surface, the processing belt extends from one end to the other end of the grinding surface, and each processing belt is sequentially arranged in parallel along the width direction of the grinding surface; The movement process of the two end points of the line laser is divided into two stages; in the first stage, the two laser end points move at a constant speed along the two boundary lines respectively until one of the laser end points completely sweeps the corresponding boundary line and enters the second stage; in the second stage, the laser end point that has not completely swept the corresponding boundary line is used as the first moving point, and the laser end point that has completely swept the corresponding boundary line is used as the second moving point; the first moving point continues to move along the corresponding boundary line, and the second moving point moves toward the end point of the boundary line corresponding to the first moving point until the first moving point and the second moving point merge.

2. The wide-width laser-assisted grinding method based on ablation path planning according to claim 1, characterized in that: For the annular ablation path, in the first stage, the angular velocity of the grinding wheel (5) is equal to the angular velocity of the first moving point; In the second stage, the moving speed of the first moving point remains unchanged, and the speed of the second moving point is adjusted so that the first moving point and the second moving point arrive at the end point of the boundary line corresponding to the movement of the first moving point at the same time.

3. The wide-width laser-assisted grinding method based on ablation path planning according to claim 1, characterized in that: For the annular ablation path, at the start of ablation, the line laser is parallel to the axis of the grinding wheel (5), and the distance between the line laser and the grinding line is 3 mm to 6 mm.

4. The wide-width laser-assisted grinding method based on ablation path planning according to claim 1, characterized in that: For the ablation path with two independent ends, the line laser is parallel to the axis of the grinding wheel (5).

5. The wide-width laser-assisted grinding method based on ablation path planning according to claim 4, characterized in that: The distance between the line laser and the grinding line remains constant.

6. The wide-width laser-assisted grinding method based on ablation path planning according to claim 5, characterized in that: The distance between the line laser and the grinding line is 3mm~6mm.

7. A wide-width laser-assisted grinding device based on ablation path planning, characterized in that: Used to perform a wide-width laser-assisted grinding method based on ablation path planning as described in claim 1; the wide-width laser-assisted grinding device comprises a grinding wheel machine (6) and a workpiece processing module and a workpiece moving module mounted on the grinding wheel machine (6); the workpiece processing module comprises a laser moving assembly (1), a wide-width laser generator (2) and a grinding wheel (5); the wide-width laser generator (2) is mounted on the end of the laser moving assembly (1) through a rotary joint; the workpiece moving module is used to feed the grinding workpiece (3).

8. The wide-width laser-assisted grinding device based on ablation path planning according to claim 7, characterized in that: The grinding workpiece (3) is a shaft-type workpiece; the workpiece moving module includes a workpiece fixture (4), a first vertical feeding mechanism (7), a first horizontal feeding mechanism (8) and a workpiece rotating rod (9); the workpiece rotating rod is used to drive the grinding workpiece (3) to rotate during the processing; the workpiece fixture (4) is provided with a rotating pair for adjusting the position angle of the grinding workpiece (3).

9. The wide-width laser-assisted grinding device based on ablation path planning according to claim 7, characterized in that: The grinding workpiece (3) is a planar workpiece; the workpiece moving module comprises a second vertical feeding mechanism (12), a second lateral feeding mechanism (10) and a longitudinal feeding mechanism (11) arranged in sequence from top to bottom; the grinding workpiece (3) is fixed on the second vertical feeding mechanism (12) by vacuum adsorption.

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