Wafer thinning and polishing equipment

Abstract

The invention provides wafer thinning and polishing equipment, and belongs to the technical field of semiconductor processing. The round suction cup is arranged under the grinding disc, and a strip-shaped groove penetrating through the peripheral side of the round suction cup is formed in the top of the round suction cup in the radial direction; the lifting plate is vertically and movably arranged at the outward end of the strip-shaped groove at intervals, and a first U-shaped plate is arranged at the top of the lifting plate; the temporary storage frame comprises a first vertical frame and a pair of arc-shaped baffles matched with the peripheral side of the wafer in shape, multiple pairs of supporting strips are arranged in the first vertical frame in the vertical direction in an array mode, and the first vertical frame is arranged in the first U-shaped plate; and the first pushing mechanism is arranged on the side, away from the circular suction cup, of the first U-shaped plate, the telescopic end of the first pushing mechanism is connected with one end of the strip-shaped suction cup through a pushing block, and the strip-shaped suction cup is arranged towards the strip-shaped groove. According to the equipment, automatic feeding and discharging of wafers can be realized in wafer thinning production, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor processing, and particularly relates to a wafer thinning and grinding device. Background Art

[0002] In the process of semiconductor chip production, processes such as wafer thinning, wafer scribing, die bonding, wire bonding, and plastic encapsulation are required. Among them, wafer thinning is to grind the back surface of the wafer to reduce the subsequent overall packaging thickness to meet the requirements of miniature electronic products such as wearable devices and mobile terminals. Existing wafer thinning and grinding devices usually consist of a suction cup and a grinding disc. During grinding, the wafer is fixed above the suction cup, and then the back surface of the wafer is ground by the grinding disc above the suction cup. It is necessary to manually take out the wafer from the wafer storage frame and place it on the suction cup, and take down the wafer and put it back into the wafer storage frame after grinding is completed. It is also necessary to transfer the wafer storage frame, which is quite labor-consuming. There are also some large production lines that commonly use multiple manipulators to achieve the loading, unloading of wafer thinning and grinding, and the transfer of the wafer storage frame to realize the automation of the wafer thinning and grinding process. However, introducing multiple manipulators for production will increase the equipment cost of production and the maintenance cost is relatively high. Therefore, it is necessary to design a wafer thinning and grinding device to realize the automatic loading and unloading of wafer thinning and grinding and balance production efficiency and cost. Summary of the Invention

[0003] To solve the above-mentioned defects of the prior art, the present application provides a wafer thinning and grinding device, which can realize the automatic loading and unloading of wafers in wafer thinning production and improve production efficiency.

[0004] To achieve the above object, the present invention adopts the following technologies: A wafer thinning and grinding device, comprising: A grinding disc, the top of which is connected to the output shaft of a first motor, and the top of the first motor is connected to the telescopic end of a first lifting mechanism; A circular suction cup, arranged directly below the grinding disc, and a first strip-shaped groove penetrating through its circumferential side is formed along the radial direction at the top of the circular suction cup; A lifting plate, which is arranged to move up and down and is spaced at one end of the first strip-shaped groove facing outwards. A first U-shaped plate is provided at the top of the lifting plate. The first U-shaped plate includes a first horizontal section and two first vertical sections. The first horizontal section is perpendicular to the first strip-shaped groove, and the two first vertical sections are arranged on the side of the first horizontal section away from the first strip-shaped groove, and the two first vertical sections are symmetrical with respect to the first strip-shaped groove; The temporary storage frame includes a first vertical frame and a pair of arc-shaped baffles that match the shape of the circumferential side of the crystal. The arc-shaped baffles are symmetrically arranged at one end of the first vertical frame. A plurality of pairs of support bars are arranged in the first vertical frame in a vertical direction. An extension section that matches the arc of the arc-shaped baffle is provided at one end of each support bar close to the arc-shaped baffle. The first vertical frame is arranged in the first U-shaped plate, and the width of the first vertical frame matches the distance between the two first vertical sections. The first pushing mechanism is arranged on the side of the first U-shaped plate away from the circular suction cup. The telescopic direction of the telescopic end of the first pushing mechanism is parallel to the first strip-shaped groove, and the telescopic end of the first pushing mechanism is connected to one end of the strip-shaped suction cup through a push block. The top height of the push block is higher than the top height of the strip-shaped suction cup. The top height of the strip-shaped suction cup matches the top height of the circular suction cup and the top height of the topmost support bar. The strip-shaped suction cup is arranged facing the first strip-shaped groove. When the telescopic end of the first pushing mechanism is fully extended, the strip-shaped suction cup completely enters the first strip-shaped groove. When the telescopic end of the first pushing mechanism is fully retracted, the strip-shaped suction cup is outside the temporary storage frame.

[0005] Furthermore, an arc-shaped limiting plate is arranged on the side of the first U-shaped plate away from the circular suction cup. When the temporary storage frame is in the first U-shaped plate, the arc-shaped limiting plate abuts against the arc-shaped baffle.

[0006] Furthermore, a plurality of guide rods are vertically penetrated through the lifting plate. The guide rods are fixed in a second vertical frame. A receiving groove is opened at the top of the second vertical frame for receiving the first U-shaped plate and the arc-shaped limiting plate. The lifting plate is threadedly connected to a first lead screw. The first lead screw is vertically rotatably connected in the second vertical frame. The top of the first lead screw is connected to the output shaft of a second motor.

[0007] Furthermore, the arc-shaped limiting plate is fixed to the two side walls of the receiving groove, and the first U-shaped plate is fixedly connected to the top surface of the lifting plate.

[0008] Furthermore, the bottom of the circular suction cup is connected to the telescopic end of a second lifting mechanism arranged vertically upward.

[0009] Furthermore, a first conveying mechanism is arranged at intervals below the first pushing mechanism. The conveying direction of the first conveying mechanism is parallel to the length direction of the first strip-shaped groove. A pair of second pushing mechanisms parallel to the first pushing mechanism are arranged below the circular suction cup. The telescopic ends of the second pushing mechanisms are vertically connected with vertical push plates. When the temporary storage frame descends to the maximum limit, the two vertical push plates respectively face the ends of the two side walls of the first vertical frame away from the arc-shaped baffle, and the bottom height of the temporary storage frame matches the top height of the first conveying mechanism.

[0010] Further, a second conveying mechanism parallel to the first conveying mechanism is provided on one side of the first conveying mechanism for conveying the temporary storage frame. One end of the second conveying mechanism is vertically provided with an alignment plate, and the inner side of the alignment plate facing inward is aligned with the inner side of the first horizontal section. A linear mechanism is horizontally provided above the second conveying mechanism. One end of the movable end of the linear mechanism far from the outer side of the second conveying mechanism is perpendicularly connected to one end of a rectangular block. The moving direction of the movable end of the linear mechanism is perpendicular to the conveying direction of the second conveying mechanism. A second U-shaped plate is provided at the top of the first vertical frame. The second U-shaped plate includes a second horizontal section and a pair of second vertical sections vertically provided at the bottom of the second horizontal section. The second vertical sections are connected to the top of the first vertical frame and are parallel to the alignment plate. The rectangular block is matched with the height of the second U-shaped plate on the temporary storage frame placed on the second conveying mechanism, and the size of the rectangular block is matched with the internal size of the second U-shaped plate. When the first vertical frame of the temporary storage frame placed on the second conveying mechanism abuts against the alignment plate on the side far from the arc-shaped baffle, the second U-shaped plate is aligned with the rectangular block. When the lifting plate rises to the maximum limit, the top height of the first U-shaped plate is higher than the top height of the second conveying mechanism.

[0011] Further, baffles are provided on both sides of the second conveying mechanism. The distance between the two baffles is matched with the width of the first vertical frame. A notch is opened at the top of one baffle close to the alignment plate end on the inner side of the second conveying mechanism, and the height of the bottom of the notch is matched with the top height of the second conveyor belt.

[0012] The beneficial effects of the present invention are as follows: 1. Using this equipment can realize the automatic loading and unloading of wafers during the wafer thinning production process, reduce labor, and improve production efficiency; 2. Through the cooperation of the second conveying mechanism and the linear mechanism, the temporary storage frame and the wafer to be thinned can be transferred into the first U-shaped plate to realize the automatic loading of the temporary storage frame. By driving the temporary storage frame to descend with the lifting plate and the cooperation of the first conveying mechanism and the second pushing mechanism, the temporary storage frame and the thinned wafer can be transferred to realize the automatic unloading of the temporary storage frame; 3. The rectangular block for transferring the temporary storage frame can automatically rise and fall in the second strip-shaped groove, avoiding the first U-shaped plate on the top of the temporary storage frame. It is not necessary to turn off the second conveying mechanism when transferring the temporary storage frame on the second conveying mechanism, which can improve the continuity of conveying the temporary storage frame and further improve production efficiency. Description of the Drawings

[0013] Figure 1 It is a three-dimensional view of the overall structure of the equipment in the embodiment of the present application.

[0014] Figure 2 It is a three-dimensional view of the overall structure when the temporary storage frame is placed in the first U-shaped plate of the equipment in the embodiment of the present application.

[0015] Figure 3It is a three-dimensional view of the overall structure of the device according to an embodiment of the present application from another perspective.

[0016] Figure 4 It is a three-dimensional view of the structure of the temporary storage box in the device according to an embodiment of the present application.

[0017] Figure 5 It is a three-dimensional view of a partial structure of the device according to an embodiment of the present application.

[0018] Figure 6 It is a rear view of the device according to an embodiment of the present application.

[0019] Figure 7 It is a three-dimensional view of the result when the lifting plate of the device according to an embodiment of the present application descends to the lowest position.

[0020] Figure 8 It is Figure 7 the enlarged view of part A in

[0021] Figure 9 It is a three-dimensional view of the structure in which the linear mechanism of the device according to an embodiment of the present application drives the temporary storage box to move into the first U-shaped plate.

[0022] Figure 10 It is a three-dimensional view of the structure in which the first linear mechanism of the device according to an embodiment of the present application drives the temporary storage box to transfer.

[0023] Figure 11 It is a three-dimensional view of the connection structure of the guide bar and the guide plate in the device according to an embodiment of the present application.

[0024] Figure 12 It is Figure 10 the enlarged view of part B in

[0025] Figure 13 It is a three-dimensional view of a partial structure of the linear mechanism in the device according to an embodiment of the present application.

[0026] Reference numerals: grinding disc - 1, circular suction cup - 2, lifting plate - 3, first U-shaped plate - 4, temporary storage box - 5, first pushing mechanism - 6, arc-shaped limiting plate - 7, second lifting mechanism - 8, first conveying mechanism - 9, second pushing mechanism - 10, second conveying mechanism - 11, linear mechanism - 12, first motor - 101, first lifting mechanism - 102, support frame - 103, first strip-shaped groove - 201, second vertical frame - 301, guide rod - 302, first lead screw - 303, second motor - 304, accommodation groove - 3011, first horizontal section - 401, first vertical section - 402, first vertical frame - 501, arc-shaped baffle - 502, support strip - 503, second U-shaped plate - 504, second horizontal section - 5041, second vertical section - 5042, push block - 601, strip-shaped suction cup - 602, vertical push plate - 1001, alignment plate - 1101, baffle - 1102, notch - 1103, movable block - 1201, rectangular block - 1202, second lead screw - 1203, guide rail - 1204, support plate - 1205, second strip-shaped groove - 1206, guide strip - 13, inclined plane - 1301, rotating shaft - 1302, guide plate - 14, torsion spring - 1401, through groove - 1207, cross plate - 1208, slider - 1209, spring - 1210, connecting piece - 1211, vertical plate - 1212, guide post - 1213, third motor - 1214. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will describe the embodiments of the present invention in detail with reference to the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0028] An embodiment of the present application provides a wafer thinning and grinding device, as Figures 1 - 9 shown, including a grinding disc 1, a circular suction cup 2, a lifting plate 3, a temporary storage box 5, a first pushing mechanism 6, etc.

[0029] Specifically, the top of the grinding disc 1 is connected to the output shaft of a first motor 101. The top of the first motor 101 is connected to the telescopic end of a first lifting mechanism 102. The first lifting mechanism 102 is fixed to the top of a support frame 103. The telescopic end of the first lifting mechanism 102 passes through the top of the support frame 103 and is connected to the first motor 101. A circular suction cup 2 is arranged directly below the grinding disc 1 and is used to adsorb and fix the wafer to be thinned and polished. A first strip-shaped groove 201 penetrating its circumferential side is formed in the radial direction at the top of the circular suction cup 2. A lifting plate 3 is arranged to move up and down, and the lifting plate 3 is spaced at one end of the first strip-shaped groove 201 facing outward. A first U-shaped plate 4 is arranged at the top of the lifting plate 3. The first U-shaped plate 4 includes a first horizontal section 401 and two first vertical sections 402. The first horizontal section 401 is perpendicular to the first strip-shaped groove 201. The two first vertical sections 402 are arranged on the side of the first horizontal section 401 away from the first strip-shaped groove 201, and the two first vertical sections 402 are symmetric with respect to the first strip-shaped groove 201. The temporary storage frame 5 includes a first vertical frame 501 and a pair of arc-shaped baffles 502 matching the shape of the circumferential side of the wafer. The arc-shaped baffles 502 are symmetrically arranged at one end of the first vertical frame 501. A plurality of pairs of support bars 503 are arranged in the first vertical frame 501 in the vertical direction in an array for supporting the wafer. The ends of the support bars 503 close to the arc-shaped baffles 502 are all provided with extension sections matching the radian of the arc-shaped baffles 502 for increasing the contact area with the wafer placed above it. The first vertical frame 501 is arranged in the first U-shaped plate 4, and the width of the first vertical frame 501 matches the distance between the two first vertical sections 402. A first pushing mechanism 6 is arranged on the side of the first U-shaped plate 4 away from the circular suction cup 2. The telescopic direction of the telescopic end of the first pushing mechanism 6 is parallel to the first strip-shaped groove 201. The telescopic end of the first pushing mechanism 6 is connected to one end of a strip-shaped suction cup 602 through a push block 601. The top height of the push block 601 is higher than the top height of the strip-shaped suction cup 602 and is used to push the wafer in the temporary storage frame 5. The strip-shaped suction cup 602 faces the first strip-shaped groove 201. When the lifting plate 3 rises to the highest position, the top height of the strip-shaped suction cup 602 matches the top height of the circular suction cup 2 and the top height of the bottommost support bar 503. When the telescopic end of the first pushing mechanism 6 is fully extended, the strip-shaped suction cup 602 completely enters the first strip-shaped groove 201. When the telescopic end of the first pushing mechanism 6 is fully retracted, the strip-shaped suction cup 602 is outside the temporary storage frame 5.

[0030] In actual use, the lifting plate 3 is raised to the highest position, the temporary storage frame 5 with multiple wafers is placed in the first U-shaped plate 4, and the first vertical frame 501 abuts against the first horizontal section 401 of the first U-shaped plate 4. At this time, the height of the bottom of the wafer on the support bar 503 at the bottom of the temporary storage frame 5 will match the height of the top of the strip-shaped suction cup 602. Then, the telescopic end of the first pushing mechanism 6 is controlled to push out. When the push block 601 abuts against the bottom wafer, the strip-shaped suction cup 602 is controlled to open to adsorb the wafer. Specifically, distance sensors can be arranged on both sides of the push block 601 to determine whether the push block 601 abuts against the wafer. As the first pushing mechanism 6 drives the strip-shaped suction cup 602 to continue moving forward, the strip-shaped suction cup 602 will completely enter the first strip-shaped groove 201 on the circular suction cup 2, and the wafer will reach directly above the circular suction cup 2. At this time, the circular suction cup 2 is controlled to adsorb the wafer, and then the first lifting mechanism 102 is controlled to drive the grinding disc 1 to descend until it abuts against the wafer, and the first motor 101 is turned on to start grinding. After the thinning grinding is completed, the first lifting mechanism 102 is controlled to drive the grinding disc 1 to rise, then the circular suction cup 2 is turned off, and the telescopic end of the first pushing mechanism 6 is controlled to retract, so that the ground wafer can return above the bottom support bar 503, completing the automatic blanking of the wafer. Then, the lifting plate 3 is controlled to move downward by a first preset distance, so that the next wafer from bottom to top descends to match the height of the top of the strip-shaped suction cup 602, and repeating the above steps can realize the thinning grinding of multiple wafers in the temporary storage frame 5 and make the thinned and ground wafers all automatically return to the temporary storage frame 5 to achieve automatic blanking.

[0031] Specifically, the upper part of the end of the push block 601 close to the strip-shaped suction cup 602 is arc-shaped and matches the circumferential shape of the wafer. When the push block 601 abuts against the wafer, it can increase the contact area with the circumferential side of the wafer and improve the stability during the pushing process.

[0032] Preferably, referring to Figure 1 , an arc-shaped limiting plate 7 is provided on the side of the first U-shaped plate 4 away from the circular suction cup 2. When the temporary storage frame 5 is in the first U-shaped plate 4, the arc-shaped limiting plate 7 abuts against the arc-shaped baffle 502. Because the arc-shaped limiting plate 7 and the first U-shaped plate simultaneously abut against the temporary storage frame 5, the temporary storage frame 5 can be prevented from moving in the horizontal direction, thereby avoiding the movement of the temporary storage frame 5 in the horizontal direction caused by the vibration generated during the wafer grinding process.

[0033] Specifically, referring to Figure 5, a plurality of guide rods 302 are vertically penetrated through the lifting plate 3, and the guide rods 302 are fixed in a second vertical frame 301. A receiving groove 3011 is formed at the top of the second vertical frame 301 for receiving the first U-shaped plate 4 and the arc-shaped limiting plate 7. The lifting plate 3 is threadedly connected to a first lead screw 303. The first lead screw 303 is vertically rotatably connected in the second vertical frame 301, and the top of the first lead screw 303 is connected to the output shaft of a second motor 304. When it is necessary to control the lifting of the lifting plate 3, control the second motor 304 to drive the first lead screw 303 to rotate, and the lifting plate 3 can be moved up and down along the guide rod 302. More specifically, refer to Figure 5 , the arc-shaped limiting plate 7 is fixed in the receiving groove 3011, and the first U-shaped plate 4 is fixedly connected to the lifting plate 3. When the lifting plate 3 descends, the first U-shaped plate 4 will descend synchronously with the lifting plate 3. The bottom of the first vertical frame 501 of the temporary storage frame 5 in the first U-shaped plate 4 will always abut against the first U-shaped plate 4, and the arc-shaped limiting plate 7 will reach the height of the arc-shaped baffle 502, thereby realizing that the arc-shaped plate and the first U-shaped plate alternately fix the temporary storage frame 5, further improving the stability of the temporary storage frame 5 during the moving process.

[0034] Preferably, refer to Figure 3 、 Figure 6 , the bottom of the circular suction cup 2 is connected to the telescopic end of a second lifting mechanism 8. Before the first pushing mechanism 6 pushes the wafer out of the temporary storage frame 5 through the strip-shaped suction cup 602, the telescopic end of the second lifting mechanism 8 can be controlled to drive the circular suction cup 2 to descend below the strip-shaped suction cup 602. After the first pushing mechanism 6 transfers the wafer to directly above the circular suction cup 2 through the strip-shaped suction cup 602, control the second lifting mechanism 8 to drive the circular suction cup 2 to rise until it abuts against the wafer, and then control the circular suction cup 2 to adsorb the wafer. By this way, the wafer is prevented from being rubbed by the circular suction cup 2 during the process of being completely pushed to directly above the circular suction cup 2, thereby reducing wafer wear.

[0035] Preferably, refer to Figure 6 、 Figure 7 , a first conveying mechanism 9 is arranged at intervals below the first pushing mechanism 6. The conveying direction of the first conveying mechanism 9 is parallel to the length direction of the first strip-shaped groove 201. A pair of second pushing mechanisms 10 parallel to the first pushing mechanism 6 are arranged below the circular suction cup 2. The telescopic ends of the second pushing mechanisms 10 are vertically connected with vertical pushing plates 1001. When the temporary storage frame 5 descends to the maximum limit, the two vertical pushing plates 1001 respectively face the ends of the two side walls of the first vertical frame 501 away from the arc-shaped baffle 502, and the bottom height of the temporary storage frame 5 matches the top height of the first conveying mechanism 9. At this time, control the telescopic ends of the second pushing mechanisms 10 to push out, and the temporary storage frame 5 that has descended to the lowest position and the wafer that has been thinned and polished in the temporary storage frame 5 can be pushed above the first conveying mechanism 9 through a pair of vertical pushing plates 1001, and the blanking and conveying of the temporary storage frame 5 are completed through the first conveying mechanism 9.

[0036] Preferably, see Figure 4 , Figures 7 - 9 A second conveying mechanism 11 is provided on one side of the first conveying mechanism 9 and is parallel to the first conveying mechanism 9, and is used to convey the temporary storage frame 5. An alignment plate 1101 is vertically provided at one end of the second conveying mechanism 11, and the inner side of the alignment plate 1101 is aligned with the inner side of the first transverse section 401. A straight mechanism 12 is horizontally provided above the second conveying mechanism 11, and the movable end of the straight mechanism 12 is vertically connected to one end of a rectangular block 1202 at a side away from the outer side of the second conveying mechanism 11, and the moving direction of the movable end of the straight mechanism 12 is perpendicular to the conveying direction of the second conveying mechanism 11. A second U-shaped plate 504 is provided on the top of the first vertical frame 501, and the second U-shaped plate 504 includes a second transverse section 5041 and a second transverse section 5041 vertically provided on the second transverse section A pair of second vertical sections 5042 at the bottom of 5041, the second vertical section 5042 is connected to the top of the first vertical frame 501, and the second vertical section 5042 is parallel to the alignment plate 1101, the rectangular block 1202 matches the height of the second U-shaped plate 504 on the temporary storage frame 5 placed on the second conveying mechanism 11, and the size of the rectangular block 1202 matches the internal size of the second U-shaped plate 504, when the first vertical frame 501 of the temporary storage frame 5 placed on the second conveying mechanism 11 abuts against the alignment plate 1101 on one side away from the arc baffle 502, the second U-shaped plate 504 is aligned with the rectangular block 1202, and when the lifting plate 3 rises to the maximum limit, the top height of the first U-shaped plate 4 is higher than the top height of the second conveying mechanism 11. When it is necessary to put the temporary storage frame 5 into the first U-shaped plate 4, the conveying mechanism is controlled to drive the temporary storage frame 5 conveyed above it to move toward the alignment plate 1101. When the temporary storage frame 5 close to the alignment plate 1101 abuts against the alignment plate 1101, the movable end of the linear mechanism 12 is controlled to drive the rectangular block 1202 to move toward the first U-shaped plate 4. During the movement, because the second U-shaped plate 504 abutting the top of the temporary storage frame 5 abutting against the alignment plate 1101 is aligned with the rectangular block 1202, the rectangular block 1202 will enter the second U-shaped plate 504, and the movable end of the linear mechanism 12 will abut against the second U-shaped plate 504 and push The second U-shaped plate 504 and the temporary storage frame 5 move toward the first U-shaped plate 4. When the temporary storage frame 5 moves to the top of the second U-shaped plate 504, the lifting plate 3 is controlled to move upward to the maximum limit. At this time, the temporary storage frame 5 will enter the second U-shaped plate 504, and then the linear mechanism 12 is controlled to drive the rectangular block 1202 to move toward the second conveying mechanism 11. Because the temporary storage frame 5 is blocked by the vertical section of the second U-shaped plate 504 and will not move with the rectangular block 1202, the rectangular block 1202 can be separated from the second U-shaped plate 504, so that the temporary storage frame 5 drops to the top of the lifting plate 3, and the loading of the temporary storage frame 5 is completed.

[0037] For details, see Figure 7, baffles 1102 are provided on both sides of the second conveying mechanism 11. The distance between the two baffles 1102 matches the width of the first vertical frame 501, which is used to prevent the temporary storage frame 5 from tilting during the movement on the second conveying mechanism 11. A notch 1103 is provided at the top of one baffle 1102 on the inner side of the second conveying mechanism 11 near one end of the alignment plate 1101. The height of the bottom of the notch 1103 matches the height of the top of the second conveyor belt, which is used to prevent blocking the temporary storage frame 5 from moving towards the first U-shaped plate 4.

[0038] Specifically, referring to Figure 10 , Figure 12 , the linear mechanism includes a movable block 1201, a guiding slide rail 1204, and a second lead screw 1203. The guiding slide rail 1204 is installed above the second conveying mechanism 11 and the first U-shaped plate 4 through a pair of support plates 1205. The length direction of the guiding slide rail 1204 is parallel to the width direction of the second conveying mechanism 11. A chute is provided at the bottom of the guiding slide rail 1204 along the length direction. The second lead screw 1203 is rotatably arranged between the pair of support plates 1205. The movable block 1201 is the movable end of the linear mechanism and is slidably arranged in the chute. The second lead screw 1203 is threadedly connected to the movable block 1201. One end of the second lead screw 1203 is connected to the output shaft of a third motor 1214. When it is necessary to control the movable end of the linear mechanism to drive the rectangular block 1202 to move, by controlling the third motor 1214 to drive the second lead screw 1203 to rotate, the movable block 1201 and the rectangular block 1202 can be driven to move along the chute, thereby driving the transfer of the temporary storage frame 5.

[0039] When transferring the temporary storage frame 5 from the second conveying mechanism 11 to the first U-shaped plate 4 in the above manner, it is necessary to control the second conveying mechanism 11 to adjust the conveyance of the temporary storage frame 5 to prevent the first U-shaped plate 4 on the top of the subsequent temporary storage frame 5 from blocking the rectangular block 1202. It is necessary to wait for the linear mechanism to drive the rectangular block 1202 to reset before continuing to control the second conveying mechanism 11 to convey the temporary storage frame 5 to the alignment plate 1101, which will affect the continuity of the conveyance of the temporary storage frame 5 by the second conveying mechanism 11 and the production efficiency.

[0040] In an embodiment, referring to Figures 10 - 13, second strip grooves 1206 are formed along the length direction on both sides of the guiding slide rail 1204. Guide bars 13 parallel to the second strip grooves 1206 are arranged in the second strip grooves 1206. The guide bars 13 are arranged directly above the second conveying mechanism 11. One end of the guide bar 13 away from the first U-shaped plate 4 is an inclined surface 1301 with the bottom inclined towards the U-shaped plate. One end of the guide bar 13 with the inclined surface 1301 is rotatably connected to a guide plate 14 through a rotating shaft 1302. The rotating shaft 1302 is perpendicular to the side surface of the guiding slide rail 1204. A torsion spring 1401 is arranged outside the rotating shaft 1302. Two ends of the torsion spring 1401 are respectively connected to the guide plate 14 and the guide bar 13. When the guide plate 14 rotates upwards to abut against the top of the second strip groove 1206, the top of the guide plate 14 inclines towards the direction away from the first U-shaped plate 4, and the torsion spring 1401 is in a natural state; a through groove 1207 penetrating through both ends of the movable block 1201 is formed on the movable block 1201. A cross plate 1208 is slidably connected in the through groove 1207 along the vertical direction. A slider 1209 is connected to the bottom of the cross plate 1208. The slider 1209 passes through the bottom of the movable block 1201 and is connected to a rectangular block 1202. Connecting pieces 1211 are arranged at both ends of the movable block 1201. Springs 1210 are connected to the bottoms of the connecting pieces 1211. The bottoms of the springs 1210 are respectively connected to both ends of the top of the cross plate 1208. Vertical plates 1212 are arranged at both ends of the cross plate 1208. Guide columns 1213 are connected to the tops of the inner sides of the vertical plates 1212. The two guide columns 1213 are respectively located in the two second strip grooves 1206. The distance between the guide bar 13 and the bottom of the second strip groove 1206 matches the diameter of the guide column 1213. The distance between the guide bar 13 and the top of the second strip groove 1206 is greater than the diameter of the guide column 1213. When the guide column 1213 is located below the guide bar 13, the rectangular block 1202 is aligned with the second U-shaped plate 504 on the temporary storage frame 5 of the alignment plate 1101 above the second conveying mechanism 11, and the spring 1210 is in a stretched state, so that the cross plate 1208 and the slider 1209 have a tendency to move upwards. When the guide column 1213 abuts against the top of the wall body of the second strip groove 1206, the spring 1210 is in a natural state, and the bottom height of the rectangular block 1202 is higher than the top height of the second U-shaped plate 504 of the temporary storage frame 5 above the second conveying mechanism 11. Specifically, when the guide column 1213 abuts against the bottom of the second strip groove 1206, the pulling force of the spring 1210 on the cross plate 1208 is less than the gravity of the temporary storage frame 5 with wafers placed thereon, so that the temporary storage frame 5 is hung on the rectangular block 1202, and during the movement towards the first U-shaped plate 4, the guide column 1213 always abuts against the bottom of the second strip groove 1206, and the bottom height of the temporary storage frame 5 remains unchanged.

[0041] During the process of transferring the temporary storage box 5 on the second conveying mechanism 11 to the first U-shaped plate 4 through this embodiment, when transferring the first temporary storage box 5, the control movable block 1201 drives the rectangular block 1202 to move towards the first U-shaped plate 4. At this time, the guide post 1213 is located below the guide strip 13. The rectangular block 1202 can penetrate into the second U-shaped plate 504 at the top of the temporary storage box 5 and push the temporary storage box 5 away from the second conveying mechanism 11. When the temporary storage box 5 disengages from the second conveying mechanism 11, since the gravity of the temporary storage box 5 can overcome the pulling force of the spring 1210 on the cross plate 1208, the guide post 1213 will not rise and still move horizontally. When the temporary storage box 5 reaches directly above the first U-shaped plate 4, the lifting plate 3 that has descended to the bottommost position is controlled to rise to the highest position. At this time, the temporary storage box 5 will be located within the second U-shaped plate 504. By controlling the movable block 1201 to retract, it can disengage from the second U-shaped plate 504 at the top of the temporary storage box 5. At this time, the cross plate 1208 will be pulled upward by the spring 1210 to move until it abuts against the top of the second strip-shaped groove 1206. Continuing to control the movable block 1201 to move towards the second conveying mechanism 11, the guide post 1213 will push the guide plate 14 to rotate downward, and then reach the side of the guide plate 14 away from the first U-shaped plate 4. The guide plate 14 will rotate upward to reset under the drive of the torsion spring 1401 and abut against the top of the second strip-shaped groove 1206. Then, the movable block 1201 is made to continue moving towards the second U-shaped plate 504. Since the guide plate 14 cannot continue to rotate upward, the guide post 1213 can only move rightward and downward along the guide plate 14 and the inclined surface 1301 to below the guide strip 13, and again align the rectangular block 1202 with the second U-shaped plate 504 at the top of the next temporary storage box 5 to be transferred, and transfer the next temporary storage box 5. Through this method, it is not necessary to turn off the second conveying mechanism 11 when transferring the temporary storage box 5 on the second conveying mechanism 11, which can improve the continuity of conveying the temporary storage box 5 and further improve the production efficiency.

[0042] The above are only the preferred embodiments of the present invention and do not represent the only or limit the present invention. Those skilled in the art should understand that without departing from the scope of the present invention, various changes or equivalent replacements made to the present invention all fall within the scope of protection of the present invention.

Claims

1. A wafer thinning and polishing device, characterized in that, Comprising: A grinding disc (1), the top of which is connected to the output shaft of a first motor (101), and the top of the first motor (101) is connected to the telescopic end of a first lifting mechanism (102) arranged vertically downward; A circular suction cup (2) is arranged directly below the grinding disc (1), and a first strip-shaped groove (201) penetrating through its circumferential side is opened along the radial direction at the top of the circular suction cup (2); A lifting plate (3) is arranged to move vertically and is spaced at one end of the first strip-shaped groove (201) facing outward. A first U-shaped plate (4) is arranged on the top of the lifting plate (3). The first U-shaped plate (4) includes a first horizontal section (401) and two first vertical sections (402). The first horizontal section (401) is arranged perpendicular to the first strip-shaped groove (201), and the two first vertical sections (402) are arranged on the side of the first horizontal section (401) away from the first strip-shaped groove (201), and the two first vertical sections (402) are symmetrical with respect to the first strip-shaped groove (201); A temporary storage frame (5) includes a first vertical frame (501) and a pair of arc-shaped baffles (502) symmetrically arranged at one end of the first vertical frame (501). A plurality of pairs of support bars (503) are arranged in the first vertical frame (501) in an array along the vertical direction. The ends of the support bars (503) close to the arc-shaped baffles (502) are all provided with extension sections matching the radian of the arc-shaped baffles (502); when the first vertical frame (501) is arranged in the first U-shaped plate (4), the width of the first vertical frame (501) matches the distance between the two first vertical sections (402); A first pushing mechanism (6) is arranged on the side of the first U-shaped plate (4) away from the circular suction cup (2). The telescopic direction of its telescopic end is parallel to the first strip-shaped groove (201), and the telescopic end is connected to one end of a strip-shaped suction cup (602) through a push block (601). The top height of the push block (601) is higher than the top height of the strip-shaped suction cup (602). The strip-shaped suction cup (602) faces the first strip-shaped groove (201). When the lifting plate (3) rises to the highest position, the top height of the strip-shaped suction cup (602) matches the top height of the circular suction cup (2) and the top height of the bottommost support bar (503); 2. The wafer thinning and polishing equipment according to claim 1, wherein An arc-shaped limiting plate (7) is arranged on the side of the first U-shaped plate (4) away from the circular suction cup (2). When the temporary storage frame (5) is in the first U-shaped plate (4), the arc-shaped limiting plate (7) abuts against the arc-shaped baffle (502); 3. A wafer thinning and polishing device according to claim 2, characterized in that, A plurality of guide rods (302) are vertically penetrated through the lifting plate (3). The guide rods (302) are fixed in a second vertical frame (301). A receiving groove (3011) is opened at the top of the second vertical frame (301) for receiving the first U-shaped plate (4) and the arc-shaped limiting plate (7). The lifting plate (3) is threadedly connected to a first lead screw (303). The first lead screw (303) is vertically rotatably connected in the second vertical frame (301), and the top of the first lead screw (303) is connected to the output shaft of a second motor (304); 4. A wafer thinning and polishing device according to claim 3, wherein, The arc-shaped limiting plate (7) is fixed to the two wall bodies of the receiving groove (3011), and the first U-shaped plate (4) is fixedly connected to the top surface of the lifting plate (3).

5. A wafer thinning and polishing device according to claim 1, characterized in that, The bottom of the circular suction cup (2) is connected to the telescopic end of a second lifting mechanism (8) arranged vertically upward.

6. The wafer thinning and polishing equipment according to claim 1, characterized in that, A first conveying mechanism (9) is arranged at an interval below the first pushing mechanism (6). The conveying direction of the first conveying mechanism (9) is parallel to the length direction of the first strip-shaped groove (201). A pair of second pushing mechanisms (10) parallel to the first pushing mechanism (6) are arranged below the circular suction cup (2). The telescopic ends of the second pushing mechanisms (10) are vertically connected with vertical pushing plates (1001). When the temporary storage frame (5) descends to the maximum limit, the two vertical pushing plates (1001) respectively face the ends of the two side walls of the first vertical frame (501) far away from the arc-shaped baffle (502), and the bottom height of the temporary storage frame (5) matches the top height of the first conveying mechanism (9).

7. A wafer thinning and polishing device according to claim 6, characterized in that, A second conveying mechanism (11) parallel to it is arranged on one side of the first conveying mechanism (9) for conveying the temporary storage frame (5). A positioning plate (1101) is vertically arranged at one end of the second conveying mechanism (11). The inner side of the positioning plate (1101) is aligned with the inner side of the first horizontal section (401). A linear mechanism (12) is horizontally arranged above the second conveying mechanism (11). One end of the movable end of the linear mechanism (12) far away from the outer side of the second conveying mechanism (11) is vertically connected with one end of a rectangular block (1202). The moving direction of the movable end of the linear mechanism (12) is perpendicular to the conveying direction of the second conveying mechanism (11). A second U-shaped plate (504) is arranged at the top of the first vertical frame (501). The second U-shaped plate (504) includes a second horizontal section (5041) and a pair of second vertical sections (5042) vertically arranged at the bottom of the second horizontal section (5041). The second vertical sections (5042) are connected to the top of the first vertical frame (501), and the second vertical sections (5042) are parallel to the positioning plate (1101). The rectangular block (1202) matches the height of the second U-shaped plate (504) on the temporary storage frame (5) placed on the second conveying mechanism (11), and the size of the rectangular block (1202) matches the internal size of the second U-shaped plate (504). When the side of the first vertical frame (501) of the temporary storage frame (5) placed on the second conveying mechanism (11) far away from the arc-shaped baffle (502) abuts against the positioning plate (1101), the second U-shaped plate (504) is aligned with the rectangular block (1202). When the lifting plate (3) rises to the maximum limit, the top height of the first U-shaped plate (4) is higher than the top height of the second conveying mechanism (11).

8. A wafer thinning and polishing device according to claim 7, characterized in that, Baffles (1102) are arranged on both sides of the second conveying mechanism (11). The distance between the two baffles (1102) matches the width of the first vertical frame (501). A notch (1103) is opened at the top of one baffle (1102) close to the positioning plate (1101) at one end inside the second conveying mechanism (11). The height of the bottom of the notch (1103) matches the top height of the second conveyor belt.

9. The wafer thinning and polishing equipment according to claim 7, wherein The linear mechanism includes a movable block (1201), a guiding slide rail (1204), and a second lead screw (1203). The guiding slide rail (1204) is mounted above the second conveying mechanism (11) through a pair of support plates (1205). The length direction of the guiding slide rail (1204) is parallel to the width direction of the second conveying mechanism (11). A chute is formed at the bottom of the guiding slide rail (1204) along the length direction. The second lead screw (1203) is rotatably arranged between the pair of support plates (1205). The movable block (1201) is slidably arranged in the chute. The second lead screw (1203) is threadedly connected to the movable block (1201). One end of the second lead screw (1203) is connected to the output shaft of a third motor (1214).

10. A wafer thinning and polishing device according to claim 9, wherein, On both sides of the guiding slide rail (1204), second strip-shaped grooves (1206) are provided along the length direction. Guide strips (13) parallel to them are arranged in the second strip-shaped grooves (1206). The guide strips (13) are arranged directly above the second conveying mechanism (11). One end of the guide strip (13) away from the first U-shaped plate (4) is an inclined surface (1301) with the bottom inclined towards the first U-shaped plate (4). One end of the guide strip (13) is rotatably connected to a guide plate (14) through a rotating shaft (1302). The rotating shaft (1302) is perpendicular to the side surface of the guiding slide rail (1204). A torsion spring (1401) is arranged outside the rotating shaft (1302). Two ends of the torsion spring (1401) are respectively connected to the guide plate (14) and the guide strip (13). When the guide plate (14) rotates upwards to abut against the top of the second strip-shaped groove (1206), the top of the guide plate (14) is inclined away from the first U-shaped plate (4), and the torsion spring (1401) is in a natural state. A through groove (1207) penetrating through both ends of the movable block (1201) is provided on the movable block (1201). A cross plate (1208) is slidably connected in the through groove (1207). A slider (1209) is connected to the bottom of the cross plate (1208). The slider (1209) passes through the bottom of the movable block (1201) and is connected to a rectangular block (1202). Connecting pieces (1211) are arranged at both ends of the movable block (1201). The bottoms of the connecting pieces (1211) are respectively connected to both ends of the top of the cross plate (1208) through springs (1210). Guide columns (1213) are connected to both ends of the cross plate (1208) through vertical plates (1212). The two guide columns (1213) are respectively arranged in the two second strip-shaped grooves (1206). The distance between the guide strip (13) and the bottom of the second strip-shaped groove (1206) matches the diameter of the guide column (1213). The distance between the guide strip (13) and the top of the second strip-shaped groove (1206) is greater than the diameter of the guide column (1213). When the guide column (1213) is located below the guide strip (13), the rectangular block (1202) is aligned with the second U-shaped plate (504) on the temporary storage frame (5) of the alignment plate (1101) above the second conveying mechanism (11), and the spring (1210) is in a stretched state. When the guide column (1213) abuts against the top of the wall of the second strip-shaped groove (1206), the spring (1210) is in a natural state, and the bottom height of the rectangular block (1202) is higher than the top height of the second U-shaped plate (504) of the temporary storage frame (5) above the second conveying mechanism (11).

Images