Optimization method for semiconductor refrigeration part and semiconductor refrigeration part

Abstract

The invention relates to the technical field of semiconductor refrigeration, and discloses an optimization method for a semiconductor refrigeration part, which comprises the following steps: acquiring the actual working temperature and the theoretical working temperature of the semiconductor refrigeration part; adjusting the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature; and according to the adjusted parameter information of the semiconductor particles, carrying out optimization design on the semiconductor refrigeration part. The size of the current flowing through the semiconductor particles is adjusted by adjusting the parameter information of the semiconductor particles, so that the refrigerating capacity and the heating capacity of the semiconductor refrigerating part are adjusted, and the requirements of different electric appliances are met. In this way, differential design of the semiconductor refrigeration part is achieved according to the cold requirements of different electric appliances, so that the cold requirements of the different electric appliances are met, and the practicability of the semiconductor refrigeration part is improved. The invention further discloses a semiconductor refrigeration part.

Description

Technical Field

[0001] This application relates to the field of semiconductor refrigeration technology, and for example, relates to an optimization method for a semiconductor refrigeration component and a semiconductor refrigeration component. Background Art

[0002] Currently, refrigeration appliances such as refrigerators and freezers are usually used to store items such as food ingredients, and the refrigeration system in the refrigeration appliance is made up of devices such as a compressor, a condenser, and an evaporator, occupying a relatively large space.

[0003] In related technologies, the cold end of a semiconductor refrigeration chip is used to provide a refrigeration function inside the refrigeration appliance. The semiconductor refrigeration chip is composed of a cold end substrate, a hot end substrate, and semiconductor particles disposed between the cold end substrate and the hot end substrate. After producing the cold end substrate, the hot end substrate, and the semiconductor particles according to a preset size, the opposite ends of the semiconductor particles are respectively welded to the cold end substrate and the hot end substrate to form the semiconductor refrigeration chip. The semiconductor refrigeration chip is installed in the refrigeration device to achieve refrigeration.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in related technologies:

[0005] Although the semiconductor refrigeration chip in related technologies can achieve the refrigeration function, since the size of the semiconductor refrigeration chip is uniform, the heat and cold generated by the semiconductor refrigeration chip are also the same. Different refrigeration devices have different refrigeration capacity requirements, and this uniformly sized semiconductor refrigeration chip cannot meet all refrigeration devices that need to install the semiconductor refrigeration chip.

[0006] It should be noted that the information disclosed in the above background art section is only used to enhance the understanding of the background of this application, and thus may include information that does not constitute the prior art known to those of ordinary skill in the art. Summary of the Invention

[0007] To have a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a general review, nor is it intended to identify key / important elements or delineate the protection scope of these embodiments, but rather serves as a preface to the subsequent detailed description.

[0008] The embodiments of the present disclosure provide an optimization method for a semiconductor refrigeration component and a semiconductor refrigeration component, enabling the refrigeration capacity of the semiconductor refrigeration chip to meet the requirements of different refrigeration devices and improving the practicability of the semiconductor refrigeration chip.

[0009] In some embodiments, an optimization method for a semiconductor refrigeration component is provided. The semiconductor refrigeration component includes semiconductor particles, and the method includes: obtaining the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component; adjusting the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature; and optimizing the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0010] Optionally, the step of adjusting the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature includes: calculating the difference ΔT between the actual working temperature and the theoretical working temperature; determining the optimized parameter value of the semiconductor particles according to the difference ΔT; and adjusting the parameter information of the semiconductor particles according to the optimized parameter value.

[0011] Optionally, the step of determining the optimized parameter value of the semiconductor particles according to the difference ΔT includes: determining the difference threshold corresponding to the difference ΔT according to the difference ΔT; and calculating the optimized parameter value of the semiconductor particles according to a preset formula when the difference ΔT is greater than or equal to the difference threshold; where the preset formula is: B = K×ΔT / 2; where B is the optimized parameter value of the semiconductor particles and K is a preset coefficient.

[0012] Optionally, the step of calculating the optimized parameter value of the semiconductor particles according to the preset formula includes: when the difference is the cold-end difference ΔT1, K = 0.1, B1 = 0.1×ΔT1 / 2; B1 is the first optimized parameter value of the semiconductor particles; when the difference is the hot-end difference ΔT2, K = 0.05, B2 = 0.05×ΔT2 / 2; B2 is the second optimized parameter value of the semiconductor particles.

[0013] Optionally, the difference threshold includes a first threshold and a second threshold. The step of determining the difference threshold corresponding to the difference ΔT according to the difference ΔT includes: when the difference is the cold-end difference ΔT1, determining the difference threshold corresponding to the cold-end difference ΔT1 as the first threshold; when the difference is the hot-end difference ΔT2, determining the difference threshold corresponding to the hot-end difference ΔT2 as the second threshold; where the first threshold is less than the second threshold.

[0014] Optionally, the parameter information of the semiconductor particles includes a cross-section ratio. The step of adjusting the parameter information of the semiconductor particles according to the optimized parameter value includes: when the actual working temperature is the cold-end actual working temperature, calculating the difference between the cross-section ratio and the optimized parameter value as the adjusted cross-section ratio of the semiconductor particles; when the actual working temperature is the hot-end actual working temperature, calculating the sum of the cross-section ratio and the optimized parameter value as the adjusted cross-section ratio of the semiconductor particles; where the cross-section ratio is the ratio of the height of the semiconductor particles to the cross-sectional area of the semiconductor particles along the current direction.

[0015] Optionally, the step of calculating the difference ΔT between the actual operating temperature and the theoretical operating temperature includes: when the actual operating temperature is the actual cold-end operating temperature and the theoretical operating temperature is the theoretical cold-end operating temperature, calculating the absolute value of the difference between the actual cold-end operating temperature and the theoretical cold-end operating temperature as ΔT1; when the actual operating temperature is the actual hot-end operating temperature and the theoretical operating temperature is the theoretical hot-end operating temperature, calculating the absolute value of the difference between the actual hot-end operating temperature and the theoretical hot-end operating temperature as ΔT2.

[0016] Optionally, the thermoelectric cooler further includes a plate body assembly, and the parameter information of the adjusted semiconductor particles includes the adjusted height value. According to the parameter information of the adjusted semiconductor particles, the steps of optimizing the design of the thermoelectric cooler include: obtaining the target thickness value of the thermoelectric cooler; calculating the difference between the adjusted height value and the target thickness value as the height of the optimized plate body assembly.

[0017] Optionally, before the step of obtaining the actual operating temperature and the theoretical operating temperature of the thermoelectric cooler, it further includes: obtaining the target operating parameters and the target refrigerating capacity of the thermoelectric cooler; determining the parameter information of the semiconductor particles according to the target operating parameters and the target refrigerating capacity; manufacturing a thermoelectric cooling test piece according to the target thickness of the thermoelectric cooler and the parameter information of the semiconductor particles; controlling the thermoelectric cooling test piece to perform a test run according to the target operating parameters.

[0018] In some embodiments, a thermoelectric cooler is provided, which is designed and manufactured by using the optimization method for thermoelectric coolers described in any one of the above embodiments.

[0019] The optimization method for thermoelectric coolers and the thermoelectric cooler provided by the embodiments of the present disclosure can achieve the following technical effects:

[0020] The optimization method for thermoelectric coolers provided by the embodiments of the present disclosure adjusts the parameter information of the semiconductor particles to adjust the magnitude of the current flowing through the semiconductor particles, thereby realizing the adjustment of the refrigerating capacity and the heating capacity of the thermoelectric cooler to meet the requirements of different electrical appliances. In this way, differential design of the thermoelectric cooler is realized according to the cooling requirements of different electrical appliances to meet the cooling requirements of different electrical appliances and improve the practicability of the thermoelectric cooler.

[0021] The above general description and the following description are only exemplary and explanatory, and are not used to limit this application. Description of the Drawings

[0022] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a schematic structural diagram of a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0024] Figure 2 is a schematic structural diagram of another semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0025] Figure 3 is a schematic diagram of the semiconductor refrigeration component provided by an embodiment of the present disclosure being disposed in a heat insulation layer;

[0026] Figure 4 is a schematic flow diagram of an optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0027] Figure 5 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0028] Figure 6 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0029] Figure 7 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0030] Figure 8 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0031] Figure 9 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0032] Figure 10 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0033] Figure 11 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure;

[0034] Figure 12 is a schematic flow diagram of another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure.

[0035] Reference numerals:

[0036] 10. Thermoelectric material; 20. Hot-end substrate; 30. Cold-end substrate; 40. Aluminum plate; 50. Thermal insulation layer. Detailed implementation mode

[0037] In order to more comprehensively understand the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference and illustration only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, numerous details are provided to give a full understanding of the disclosed embodiments. However, one or more embodiments can still be implemented without these details. In other cases, well-known structures and devices may be shown in a simplified manner to simplify the drawings.

[0038] In the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings, terms such as "first" and "second" are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of the present disclosure described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.

[0039] Unless otherwise specified, the term "plurality" means two or more.

[0040] In the embodiments of the present disclosure, the character " / " represents an "or" relationship between the front and rear objects, or represents a division sign. For example, A / B means: A or B, or means A divided by B.

[0041] The term "and / or" is a description of the association relationship of an object, indicating that three relationships can exist. For example, A and / or B means: A or B, or, these three relationships of A and B.

[0042] The term "correspond to" can refer to an association relationship or a binding relationship. A corresponding to B means that there is an association relationship or a binding relationship between A and B.

[0043] In the embodiments of the present disclosure, the working principle of thermoelectric refrigeration (also known as thermoelectric cooling) is based on the Peltier effect. The thermoelectric semiconductor material (also known as thermoelectric material 10) is made into a thermoelectric refrigeration chip (thermoelectric cooler, TEC), that is, a thermoelectric cooling sheet. When direct current passes through the thermoelectric material 10 and the electrodes, heat is absorbed at one end electrode and heat is released at the other end electrode. Its working effect is like transporting heat from one end to the other end, similar to a heat pump. To achieve heating of one end substrate of the thermoelectric material 10 as the hot-end substrate 20. The other end substrate of the thermoelectric material is cooled as the cold-end substrate 30.

[0044] Combined with Figure 1As shown, traditional semiconductor refrigeration components are all TEC bare devices, that is, the semiconductor refrigeration component only includes a semiconductor refrigeration chip. The semiconductor refrigeration chip includes thermoelectric materials 10, a cold-end substrate 30, and a hot-end substrate 20. The size of the semiconductor refrigeration chip is basically fixed, especially the thickness, which is often about 4 mm. For general equipment that uses semiconductor refrigeration components for refrigeration (such as refrigerators and wine cabinets, etc.), the equipment needs to be insulated, and the thickness of the insulation layer 50 is much greater than the thickness of the semiconductor refrigeration component. This makes the overall thickness of the entire semiconductor refrigeration chip the same as the thickness of the insulation layer 50. However, this requires adding components and combining Figure 2 and Figure 3 As shown, aluminum plates 40 with high thermal conductivity are usually used to make the overall thickness of the semiconductor refrigeration component reach the thickness of the insulation layer 50, which is convenient for installation. And it can enhance the assembly strength of the semiconductor refrigeration component and reduce the damage problem of the semiconductor refrigeration component.

[0045] After studying the operation of the semiconductor refrigeration component, it is found that since the refrigeration capacity of semiconductor particles is related to the magnitude of the current flowing through the semiconductor particles, and the magnitude of the current flowing through the semiconductor particles is related to the size information of the semiconductor particles. Therefore, by adjusting the size of the semiconductor particles, it is possible to adjust the magnitude of the current flowing through the semiconductor particles, and then adjust the refrigeration capacity of the semiconductor particles to meet the cooling requirement of the electrical appliance.

[0046] Combined with Figures 1 to 3 the semiconductor refrigeration component shown, the present disclosure provides an optimization method for the semiconductor refrigeration component. As Figure 4 shown, it includes:

[0047] S401, obtaining the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component.

[0048] S402, adjusting the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature.

[0049] S403, optimizing the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0050] The optimization method for the semiconductor refrigeration component provided by the embodiments of the present disclosure adjusts the parameter information of the semiconductor particles to adjust the magnitude of the current flowing through the semiconductor particles, and then realizes the adjustment of the refrigeration capacity and heating capacity of the semiconductor refrigeration component to meet the requirements of different electrical appliances. In this way, differential design of the semiconductor refrigeration component is realized according to the cooling requirements of different electrical appliances to meet the cooling requirements of different electrical appliances and improve the practicability of the semiconductor refrigeration component.

[0051] Specifically, when the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component are the same or close, it means that the requirements of the electrical appliance are met.

[0052] Combination Figure 5 As shown, another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure includes:

[0053] S501, obtain the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component.

[0054] S502, calculate the difference ΔT between the actual working temperature and the theoretical working temperature.

[0055] S503, determine the optimized parameter value of the semiconductor particles according to the difference ΔT.

[0056] S504, adjust the parameter information of the semiconductor particles according to the optimized parameter value.

[0057] S505, perform an optimized design on the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0058] In this embodiment, by the difference between the actual working temperature and the theoretical working temperature, that is, to determine the difference between the current refrigeration temperature of the semiconductor particles and the target refrigeration temperature of the electrical appliance, and to determine the difference between the current heating temperature of the semiconductor particles and the target heating temperature of the electrical appliance, so as to determine whether the current working temperature of the semiconductor particles can meet the requirements of the electrical appliance. If not, it is necessary to adjust the size parameter of the semiconductor particles according to the difference ΔT, and then adjust the current flowing through the semiconductor particles, so as to adjust the refrigeration capacity and heating capacity of the semiconductor particles, so as to change the refrigeration temperature and heating temperature of the semiconductor particles to meet the working temperature required by the electrical appliance and improve the practicability of the semiconductor refrigeration component.

[0059] Specifically, when the current refrigeration temperature of the semiconductor particles is the same as or close to the target refrigeration temperature of the electrical appliance, and the current heating temperature of the semiconductor particles is the same as or close to the target heating temperature of the electrical appliance, that is, the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component are the same as or close to each other.

[0060] Exemplarily, when the difference between the current refrigeration temperature of the semiconductor particles and the target refrigeration temperature of the electrical appliance tends to zero, and the difference between the current heating temperature of the semiconductor particles and the target heating temperature of the electrical appliance tends to zero, that is, the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component are the same as or close to each other.

[0061] Combination Figure 6 As shown, another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure includes:

[0062] S601, obtain the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component.

[0063] S602, calculate the difference ΔT between the actual working temperature and the theoretical working temperature.

[0064] S603. Determine the difference threshold corresponding to the difference ΔT according to the difference ΔT.

[0065] S604. When the difference ΔT is greater than or equal to the difference threshold, calculate the optimized parameter value of the semiconductor particles according to a preset formula; where the preset formula is: B = K×ΔT / 2; where B is the optimized parameter value of the semiconductor particles and K is a preset coefficient.

[0066] S605. Adjust the parameter information of the semiconductor particles according to the optimized parameter value.

[0067] S606. Optimize the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0068] In this embodiment, when the refrigeration temperature and the heating temperature of the semiconductor particles do not meet the operating temperature required by the electrical appliance, calculate the optimized parameter value of the semiconductor particles, so as to adjust the size parameter of the semiconductor particles according to the optimized parameter value, and then make the refrigeration temperature and the heating temperature of the semiconductor particles meet the operating temperature required by the electrical appliance, improving the practicability of the semiconductor refrigeration component.

[0069] Combined with Figure 7 As shown, another optimization method for a semiconductor refrigeration component provided by an embodiment of the present disclosure includes:

[0070] S701. Obtain the actual operating temperature and the theoretical operating temperature of the semiconductor refrigeration component.

[0071] S702. Calculate the difference ΔT between the actual operating temperature and the theoretical operating temperature.

[0072] S703. Determine the difference threshold corresponding to the difference ΔT according to the difference ΔT.

[0073] S704. When the difference ΔT is greater than or equal to the difference threshold and the difference is the cold-end difference ΔT1, K = 0.1, B1 = 0.1×ΔT1 / 2; B1 is the first optimized parameter value of the semiconductor particles.

[0074] S705. When the difference ΔT is greater than or equal to the difference threshold and the difference is the hot-end difference ΔT2, K = 0.05, B2 = 0.05×ΔT2 / 2; B2 is the second optimized parameter value of the semiconductor particles.

[0075] S706. Adjust the parameter information of the semiconductor particles according to the optimized parameter value.

[0076] S707. Optimize the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0077] In this embodiment, when the cold-end difference ΔT1 of the semiconductor particles is greater than the difference threshold, it indicates that the refrigeration temperature of the semiconductor particles does not meet the operating temperature required by the electrical appliance. Therefore, it is necessary to calculate the optimized parameter values of the semiconductor particles, so as to adjust the size parameters of the semiconductor particles according to the optimized parameter values, and then make the refrigeration temperature and heating temperature of the semiconductor particles meet the operating temperature required by the electrical appliance, improving the practicability of the semiconductor refrigeration component.

[0078] Furthermore, the K values corresponding to the cold-end temperature difference and the hot-end temperature difference are set differently because after adjusting the size parameters of the semiconductor particles, the temperature change at the hot end is greater than that at the cold end. Therefore, the K value corresponding to the hot-end temperature difference is designed to be greater than the K value corresponding to the cold-end temperature difference, so as to reduce the problem that the temperature change at the hot end is large after adjusting the size parameters of the semiconductor particles, resulting in the need for reverse adjustment. To reduce the number of adjustments and the complexity of optimizing the semiconductor refrigeration component.

[0079] Specifically, if the hot-end temperature is high, that is, the hot-end temperature difference ΔT2 is greater than the difference threshold, it is because the refrigeration capacity of the semiconductor refrigeration component is too large and does not match the heat dissipation capacity. Then, the size parameters of the particles should be increased to reduce its refrigeration capacity, thereby reducing its heat dissipation to match the heat dissipation system.

[0080] If the hot-end temperature is within the expected range and the cold-end temperature is too high, it is due to too small refrigeration capacity. In subsequent designs, the size parameters of the particles should be reduced to increase the refrigeration capacity of the device so that it can meet the refrigeration capacity required by the electrical appliance.

[0081] Combined with Figure 8 As shown, another optimization method for the semiconductor refrigeration component provided by the embodiment of the present disclosure, the difference threshold includes a first threshold and a second threshold, and the optimization method includes:

[0082] S801, obtain the actual operating temperature and the theoretical operating temperature of the semiconductor refrigeration component.

[0083] S802, calculate the difference ΔT between the actual operating temperature and the theoretical operating temperature.

[0084] S803, when the difference is the cold-end difference ΔT1, determine that the difference threshold corresponding to the cold-end difference ΔT1 is the first threshold.

[0085] S804, when the difference is the hot-end difference ΔT2, determine that the difference threshold corresponding to the hot-end difference ΔT2 is the second threshold; where the first threshold is less than the second threshold.

[0086] S805. When the difference ΔT is greater than or equal to the difference threshold, calculate the optimized parameter value of the semiconductor particles according to a preset formula; where the preset formula is: B = K×ΔT / 2; where B is the optimized parameter value of the semiconductor particles and K is a preset coefficient.

[0087] S806. Adjust the parameter information of the semiconductor particles according to the optimized parameter value.

[0088] S807. Optimize the design of the semiconductor refrigeration element according to the adjusted parameter information of the semiconductor particles.

[0089] In this embodiment, by setting different difference thresholds corresponding to the cold-end difference and the hot-end difference, to adapt to the situation that after adjusting the size parameter of the semiconductor particles, the change range of the hot-end temperature of the semiconductor refrigeration element is greater than that of the cold-end temperature. To reduce the problem that after adjusting the size parameter of the semiconductor particles, the temperature change at the hot end is large, resulting in the need for reverse adjustment. To reduce the number of adjustments and the complexity of optimizing the semiconductor refrigeration element.

[0090] Optionally, the value range of the first threshold is 0.5°C to 1.5°C. The specific values of the first threshold include: 0.5°C, 1°C, and 1.5°C.

[0091] Optionally, the value range of the first threshold is 1.5°C to 2.5°C. The specific values of the first threshold include: 1.5°C, 2°C, and 2.5°C.

[0092] Combined with Figure 9 As shown, the embodiments of the present disclosure provide another optimization method for a semiconductor refrigeration element. The parameter information of the semiconductor particles includes the cross-sectional ratio. The optimization method includes:

[0093] S901. Obtain the actual operating temperature and the theoretical operating temperature of the semiconductor refrigeration element.

[0094] S902. Calculate the difference ΔT between the actual operating temperature and the theoretical operating temperature.

[0095] S903. Determine the optimized parameter value of the semiconductor particles according to the difference ΔT.

[0096] S904. When the actual operating temperature is the cold-end actual operating temperature, calculate the difference between the cross-sectional ratio and the optimized parameter value as the adjusted cross-sectional ratio of the semiconductor particles;

[0097] S905. When the actual operating temperature is the hot-end actual operating temperature, calculate the sum of the cross-sectional ratio and the optimized parameter value as the adjusted cross-sectional ratio of the semiconductor particles; where the cross-sectional ratio is the ratio between the height of the semiconductor particles and the cross-sectional area of the semiconductor particles along the current direction.

[0098] S906. Optimize the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0099] In this embodiment, by adjusting the cross-sectional ratio of the semiconductor particles, the size information of the semiconductor particles, that is, the parameter information of the semiconductor particles, is adjusted to adjust the magnitude of the current flowing through the semiconductor particles, thereby adjusting the refrigerating capacity and heating capacity of the semiconductor refrigeration component to meet the requirements of different electrical appliances.

[0100] Specifically, the cross-sectional ratio of the semiconductor particles can be reduced by reducing the length of the semiconductor particles or increasing the cross-sectional area along the current direction. The cross-sectional ratio of the semiconductor particles can be increased by increasing the length of the semiconductor particles or reducing the cross-sectional area along the current direction.

[0101] Combined with Figure 10 As shown, another optimization method for the semiconductor refrigeration component provided by the embodiment of the present disclosure includes:

[0102] S1001. Obtain the actual working temperature and theoretical working temperature of the semiconductor refrigeration component.

[0103] S1002. When the actual working temperature is the actual cold-end working temperature and the theoretical working temperature is the theoretical cold-end working temperature, calculate the absolute value of the difference between the actual cold-end working temperature and the theoretical cold-end working temperature as ΔT1.

[0104] S1003. When the actual working temperature is the actual hot-end working temperature and the theoretical working temperature is the theoretical hot-end working temperature, calculate the absolute value of the difference between the actual hot-end working temperature and the theoretical hot-end working temperature as ΔT2.

[0105] S1004. Determine the optimized parameter value of the semiconductor particles according to the difference ΔT.

[0106] S1005. Adjust the parameter information of the semiconductor particles according to the optimized parameter value.

[0107] S1006. Optimize the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

[0108] In this embodiment, by calculating the absolute value of the difference between the actual working temperature and the theoretical working temperature, the difference between the refrigerating temperature and heating temperature of the current semiconductor refrigeration component and the target working temperature of the electrical appliance is determined, thereby determining whether the current semiconductor refrigeration component meets the requirements of the electrical appliance and improving the accuracy of adjusting the semiconductor refrigeration component.

[0109] Combined with Figure 11As shown, an embodiment of the present disclosure provides another optimization method for a semiconductor refrigeration component. The semiconductor refrigeration component further includes a plate body assembly. The parameter information of the adjusted semiconductor particles includes the adjusted height value. The optimization method includes:

[0110] S1101, obtain the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component.

[0111] S1102, adjust the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature to obtain the adjusted height value.

[0112] S1103, obtain the target thickness value of the semiconductor refrigeration component.

[0113] S1104, calculate the difference between the adjusted height value and the target thickness value as the height of the optimized plate body assembly.

[0114] In this embodiment, by determining the height of the optimized plate body assembly according to the adjusted height value and the target thickness value of the semiconductor refrigeration component, the sum of the height of the optimized plate body assembly and the adjusted height value of the semiconductor particles can meet the overall thickness of the semiconductor refrigeration component to reach the thickness of the thermal insulation layer, which is convenient for installation. Moreover, it can enhance the assembly strength of the semiconductor refrigeration component and reduce the damage of the semiconductor refrigeration component.

[0115] Exemplarily, the target thickness value is the thickness of the thermal insulation layer of the electrical appliance.

[0116] Combined with Figure 12 As shown, an embodiment of the present disclosure provides another optimization method for a semiconductor refrigeration component. The optimization method includes:

[0117] S1201, obtain the target working parameters and the target refrigerating capacity of the semiconductor refrigeration component.

[0118] S1202, determine the parameter information of the semiconductor particles according to the target working parameters and the target refrigerating capacity.

[0119] S1203, fabricate a semiconductor refrigeration test piece according to the target thickness of the semiconductor refrigeration component and the parameter information of the semiconductor particles.

[0120] S1204, control the semiconductor refrigeration test piece to perform a test run according to the target working parameters.

[0121] S1205, obtain the actual working temperature and the theoretical working temperature of the semiconductor refrigeration test piece according to the operation result.

[0122] S1206, adjust the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature.

[0123] S1207. Obtain the target thickness value of the semiconductor refrigeration component.

[0124] S1208. Calculate the difference between the adjusted height value and the target thickness value as the height of the optimized plate component.

[0125] In this embodiment, by first determining the parameter information of the semiconductor particles according to the target working parameters and the target refrigerating capacity, a semiconductor refrigeration test piece can be manufactured, and the semiconductor refrigeration test piece can be tested and run to determine whether the actual working temperature of the current semiconductor refrigeration test piece can meet the target refrigerating capacity of the electrical appliance, that is, to determine whether the refrigerating capacity of the semiconductor refrigeration test piece can meet the cooling requirement of the electrical appliance. In this way, in the case where the refrigerating capacity of the semiconductor refrigeration test piece does not meet the cooling requirement of the electrical appliance, the semiconductor refrigeration test piece can be adjusted until the cooling requirement of the electrical appliance is met. The differential design of the semiconductor refrigeration component for different electrical appliances is realized, and the practicability of the semiconductor refrigeration component is improved.

[0126] Specifically, when designing and manufacturing the semiconductor particles, the material parameter information of the semiconductor particles is already known, including the Seebeck coefficient A, the resistivity B, and the thermal conductivity C of the semiconductor particles. In addition, the height L of the semiconductor particles and the cross-sectional area S of the semiconductor particles along the current direction are pre-designed. Each pair of semiconductor particles consists of a P-type semiconductor and an N-type semiconductor.

[0127] Specifically, the target working parameters include a preset current value I.

[0128] Specifically, the value range of the preset current value is from 0.1 ampere to 10 amperes.

[0129] Formula 1: A = |A N | + |A P |; where A is the Seebeck coefficient of the semiconductor particles, A N is the Seebeck coefficient of the N-type semiconductor particles, and A P is the Seebeck coefficient of the P-type semiconductor particles.

[0130] Formula 2: where R is the resistance value of the semiconductor particles, B N is the resistivity of the N-type semiconductor particles, B P is the resistivity of the P-type semiconductor particles, L N is the height of the N-type semiconductor particles, L P is the height of the P-type semiconductor particles, S N is the cross-sectional area of the N-type semiconductor particles along the current direction, and S P is the cross-sectional area of the P-type semiconductor particles along the current direction.

[0131] Formula 3: Among them, C N is the thermal conductivity of N-type semiconductor particles, and C P is the thermal conductivity of P-type semiconductor particles. J is the first parameter.

[0132] Formula 4: T = T H - T C ; among them, T H is the theoretical temperature of the hot end of the semiconductor refrigeration device, and T C is the theoretical temperature of the cold end of the semiconductor refrigeration device. T is the second parameter.

[0133] Formula 5: Among them, q c is the refrigerating capacity of each pair of semiconductor particles, and I is the preset current value.

[0134] Formula 6: Among them, Q C is the target refrigerating capacity of the semiconductor refrigeration device, and n is the number of pairs of semiconductor particles.

[0135] According to Formula 1, Formula 2, Formula 3, Formula 4, Formula 5 and Formula 6, the number of pairs of semiconductor particles n is calculated.

[0136] In some embodiments, a semiconductor refrigeration device is provided, which is designed and manufactured by using the optimization method for the semiconductor refrigeration device described in any one of the above embodiments.

[0137] The semiconductor refrigeration device provided by the embodiments of the present disclosure is designed and manufactured by using the optimization method for the semiconductor refrigeration device described in any one of the above embodiments, so as to adjust the parameter information of the semiconductor particles according to the cooling requirements of different electrical appliances, perform differential design for different electrical appliances, and improve the practicability of the semiconductor refrigeration device.

[0138] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure, enabling those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. Embodiments only represent possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terms used in this application are only for describing embodiments and do not limit the claims. As used in the description of embodiments and claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to also include the plural forms. Similarly, as used in this application, the term "and / or" refers to any and all possible combinations of one or more of the associated listed items. Additionally, when used in this application, the term "comprise" and its variants "comprises" and / or "comprising" etc. mean the presence of the stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups of these. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, or apparatus comprising the element. Herein, what each embodiment focuses on can be the differences from other embodiments, and the same or similar parts among the embodiments can be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method parts disclosed in the embodiments, the relevant parts can refer to the description of the method parts.

[0139] Those skilled in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner can depend on the specific application and design constraints of the technical solution. The technician can use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of the embodiments of the present disclosure. The technician can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0140] In the embodiments disclosed in this article, the disclosed methods, products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units can be merely a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Additionally, the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect coupling or communication connection of devices or units can be in electrical, mechanical, or other forms. The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. Additionally, in the embodiments of this disclosure, the various functional units can be integrated in one processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0141] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to the embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram can represent a module, a program segment, or a part of code that contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions marked in the block can occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, which can depend on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks can also occur in a different order than that disclosed in the description. Sometimes, there is no specific order between different operations or steps. For example, two consecutive operations or steps can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, which can depend on the functions involved. Each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. An optimization method for a semiconductor refrigeration component, the semiconductor refrigeration component including semiconductor particles, characterized in that, Including: Obtain the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component; Adjust the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature; Optimize the design of the semiconductor refrigeration component according to the adjusted parameter information of the semiconductor particles.

2. The optimization method for a semiconductor refrigeration component according to claim 1, wherein, The steps of adjusting the parameter information of the semiconductor particles according to the actual working temperature and the theoretical working temperature include: Calculate the difference ΔT between the actual working temperature and the theoretical working temperature; Determine the optimized parameter value of the semiconductor particles according to the difference ΔT; Adjust the parameter information of the semiconductor particles according to the optimized parameter value.

3. The optimization method for a semiconductor refrigeration component according to claim 2, wherein The steps of determining the optimized parameter value of the semiconductor particles according to the difference ΔT include: Determine the difference threshold corresponding to the difference ΔT according to the difference ΔT; When the difference ΔT is greater than or equal to the difference threshold, calculate the optimized parameter value of the semiconductor particles according to the preset formula; Wherein, the preset formula is: B = K×ΔT / 2; where B is the optimized parameter value of the semiconductor particles and K is the preset coefficient.

4. The optimization method for a semiconductor refrigeration component according to claim 3, wherein The steps of calculating the optimized parameter value of the semiconductor particles according to the preset formula include: When the difference is the cold-end difference ΔT1, K = 0.1, B1 = 0.1×ΔT1 / 2; B1 is the first optimized parameter value of the semiconductor particles; When the difference is the hot-end difference ΔT2, K = 0.05, B2 = 0.05×ΔT2 / 2; B2 is the second optimized parameter value of the semiconductor particles.

5. The optimization method for a semiconductor refrigeration component according to claim 3, characterized in that, The difference threshold includes a first threshold and a second threshold. The steps of determining the difference threshold corresponding to the difference ΔT according to the difference ΔT include: When the difference is the cold-end difference ΔT1, determine that the difference threshold corresponding to the cold-end difference ΔT1 is the first threshold; When the difference is the hot-end difference ΔT2, determine that the difference threshold corresponding to the hot-end difference ΔT2 is the second threshold; Wherein, the first threshold is less than the second threshold.

6. The optimization method for a semiconductor refrigeration component according to claim 2, characterized in that The parameter information of the semiconductor particles includes the cross-section ratio. The steps of adjusting the parameter information of the semiconductor particles according to the optimized parameter value include: When the actual working temperature is the cold-end actual working temperature, calculate the difference between the cross-section ratio and the optimized parameter value as the adjusted cross-section ratio of the semiconductor particles; When the actual working temperature is the hot-end actual working temperature, calculate the sum of the cross-section ratio and the optimized parameter value as the adjusted cross-section ratio of the semiconductor particles; Wherein, the cross-section ratio is the ratio between the height of the semiconductor particles and the cross-sectional area of the semiconductor particles along the current direction.

7. The optimization method for a semiconductor refrigeration component according to claim 2, wherein, The steps of calculating the difference ΔT between the actual working temperature and the theoretical working temperature include: When the actual working temperature is the cold-end actual working temperature and the theoretical working temperature is the cold-end theoretical working temperature, calculate the absolute value of the difference between the cold-end actual working temperature and the cold-end theoretical working temperature as ΔT1; When the actual working temperature is the hot-end actual working temperature and the theoretical working temperature is the hot-end theoretical working temperature, calculate the absolute value of the difference between the hot-end actual working temperature and the hot-end theoretical working temperature as ΔT2.

8. The optimization method for a semiconductor refrigeration component according to any one of claims 1 to 7, wherein the semiconductor refrigeration component further comprises a plate body assembly, characterized in that The parameter information of the adjusted semiconductor particles includes the adjusted height value. The steps of optimizing the design of the semiconductor refrigeration component according to the parameter information of the adjusted semiconductor particles include: Obtain the target thickness value of the semiconductor refrigeration component; Calculate the difference between the adjusted height value and the target thickness value as the height of the optimized plate body assembly.

9. The optimization method for a semiconductor refrigeration component according to any one of claims 1 to 7, characterized in that, Before the step of obtaining the actual working temperature and the theoretical working temperature of the semiconductor refrigeration component, it further includes: Obtain the target working parameters and the target refrigerating capacity of the semiconductor refrigeration component; Determine the parameter information of the semiconductor particles according to the target working parameters and the target refrigerating capacity; Fabricate a semiconductor refrigeration test piece according to the target thickness of the semiconductor refrigeration component and the parameter information of the semiconductor particles; Control the semiconductor refrigeration test piece to perform test operation according to the target working parameters.

10. A semiconductor refrigeration component, characterized in that It is designed and fabricated by using the optimization method for semiconductor refrigeration components described in any one of claims 1 to 9.

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