Data processing method, probe card needle adjustment method and system

Abstract

The present invention discloses a data processing method, a probe card needle adjustment method and a system, wherein the probe card needle adjustment system includes a tester, a server and a needle adjustment machine, the server is used to establish a communication connection between the wafer tester and the needle adjustment machine, and guide the needle adjustment machine to automatically address abnormal needle tips based on the needle mark test results of the tester, so as to realize information interconnection between devices, shorten the needle adjustment time, improve the accuracy and efficiency of needle tip maintenance, and reduce personnel training requirements.

Description

Technical Field

[0001] The present application relates to the field of wafer probe testing technology, and in particular to a data processing method, a probe card needle adjustment method and a system. Background Art

[0002] After wafer fabrication, wafer probing (CP) testing is typically required. This testing targets every die within the wafer, with the goal of identifying and marking defective dies. The wafer testing process is completed within a tester. The probe card leaves marks (hereinafter referred to as probe marks) when it contacts the wafer pads. The location of these marks is a crucial indicator of the wafer production process, so the probe tip must be aligned closely with the pad center. If the probe card's tip is misaligned with the pad center, the card must be removed from the tester and transferred to a probe adjustment device for tip position inspection and maintenance to ensure that each probe tip is positioned correctly. CN2684374Y details the probe adjustment process.

[0003] The main problems of the existing technology are:

[0004] 1. During wafer testing, the probe card test conditions are mostly high temperature (85 degrees Celsius and above) or low temperature (below 0 degrees Celsius), while the position detection and maintenance of the probe card needle tip are all performed at room temperature (around 25 degrees Celsius). The position of the probe card needle tip will expand due to heat and contract due to cold. Therefore, the needle tip position recorded on the tester will deviate from the position detected by the needle adjustment machine under room temperature conditions, often requiring personnel to spend a lot of time recording abnormal needle tip information.

[0005] 2. Since the testing machine and the needle adjustment machine often come from different equipment manufacturers, the needle tip number in the file output by the testing machine does not correspond to the needle tip position scanned and positioned by the needle adjustment machine, and manual calculation and conversion are required in the middle.

[0006] 3. To confirm the needle tip position, the probe card needs to be installed on the test machine for debugging and checking the needle mark. To adjust the needle tip position, the probe card needs to be installed on the needle adjustment machine. After maintenance, it is necessary to return to the test machine to reconfirm whether the needle mark position is correct. The whole process is repeated many times until the needle mark position meets the specification before normal test production can begin. The whole process requires repeated disassembly and installation of the probe card, which has low operation efficiency and requires high personnel experience. The operation time of a probe card often takes several hours. Summary of the Invention

[0007] The purpose of this application is to solve the problems of low needle adjustment efficiency and long operation time in the prior art. This application provides a server and data processing method for communication between a test machine and an adjustment needle, as well as a probe card needle adjustment method and system.

[0008] To achieve the above objectives, this application adopts the following technical solutions:

[0009] In a first aspect, the present application provides a data processing method, comprising:

[0010] receiving an output file from the testing machine, wherein the output file includes needle tip numbers, needle mark positions, and determination result information corresponding to each needle mark, wherein the determination result information includes normal and abnormal;

[0011] Parsing and processing the output file to generate a parsing file suitable for the needle adjustment machine, wherein the parsing file includes the needle tip number of the abnormal needle tip and the abnormal needle mark position;

[0012] The parsed file is sent to the needle adjustment machine.

[0013] In one embodiment, the output file contains needle tip test data, and the needle tip test data includes one or more parameters of contact resistance, leakage current, needle trace parameters, and needle tip diameter.

[0014] In one embodiment, the processing includes offsetting the needle mark position.

[0015] In one embodiment, the offset processing includes:

[0016] B1) Select multiple calibration points on the wafer to be tested and record the position coordinates of each calibration point at the test temperature;

[0017] B2) establishing a correspondence between the position coordinates and the reference position coordinates of the wafer to be measured at room temperature, and calculating the offset;

[0018] B3) Calculating corrected position information corresponding to each needle mark at room temperature based on the needle mark position of each needle tip in the output file and the offset.

[0019] In one embodiment, the analysis file further includes the needle tip position of each probe, and each needle mark position corresponds to the needle tip position of each probe.

[0020] Furthermore, the present application also provides a server having a processor, a memory, an input port connected to a testing machine, and an output port connected to a needle adjusting machine. The memory stores program instructions that can be executed by the processor to implement the data processing method.

[0021] In a second aspect, the present application provides a probe card needle adjustment method, comprising:

[0022] S31) fixing the probe card to be tested on a three-dimensional mounting platform, scanning and locating the current position of each needle tip on the probe card;

[0023] S32) Based on the needle mark analysis of the tester or based on the parsing file from the server, the needle tip number of the abnormal needle tip is determined, and the position of each needle mark is matched to the current position of each needle tip of the probe card;

[0024] S33) automatically moving the three-dimensional mounting platform so that the abnormal needle tip is exposed within the field of view of the maintenance window, and simultaneously displaying real-time images of each needle tip of the probe card and the location of the abnormal needle mark;

[0025] S34) Repair the abnormal needle tip and adjust the abnormal needle tip to the center of the abnormal needle mark.

[0026] In one embodiment, before step S31), the method further includes:

[0027] S11) placing the probe card under test at the test temperature and leaving it for a set time to allow the probe card to fully expand or cool;

[0028] S12) testing needle marks on a plurality of wafer bonding pads, performing image processing on the needle marks on the wafer bonding pads, identifying and locating each needle mark, and generating an output file, wherein the output file includes needle tip numbers corresponding to each needle mark, needle mark positions, and determination result information;

[0029] S21) parsing and processing the output file to generate a parsing file suitable for the needle adjustment machine, wherein the parsing file includes the needle tip number of the abnormal needle tip and the abnormal needle mark position.

[0030] In one embodiment, step S32) further includes calculating the correction value of each needle tip based on the difference between the current position of each needle tip and the center point of each needle mark position, sorting the correction values ​​of each needle tip, and automatically moving the three-dimensional mounting platform based on the size of each correction value.

[0031] In one embodiment, in step S33), the three-dimensional mounting platform is moved based on the needle tip number of the abnormal needle tip or the abnormal needle mark position or the current position of the abnormal needle tip.

[0032] In one embodiment, after step S34), the method further includes:

[0033] S40) A review step of scanning the real-time position of each needle tip on the probe card and comparing it with the needle mark position corresponding to the needle tip number in the current maintenance window to ensure that each needle tip is located within the corresponding needle mark position and update the record of the comparison result.

[0034] In a third aspect, the present application further provides a probe card needle adjustment system, comprising:

[0035] The testing machine has an image acquisition and processing module for identifying and locating the pin marks on the pads, and generates an output file containing the pin tip number, pin mark position and determination result information corresponding to each pin mark;

[0036] The server is used to parse and process the output file to generate a parsed file suitable for the needle adjustment machine;

[0037] A needle adjustment machine having a camera for locating and scanning the position of the needle tip, a three-dimensional mounting platform for fixing the probe card, and a drive mechanism for driving the three-dimensional mounting platform to move. The needle adjustment machine can automatically locate abnormal needle tips based on the analysis file;

[0038] A processor and a memory, wherein the memory stores program instructions executable by the processor to implement the probe card needle adjustment method.

[0039] This application establishes communication between the testing machine and the needle adjustment machine through the server, and converts the needle mark information and needle tip number and other data obtained during the wafer testing process into information that can be used by the needle adjustment machine, so that the needle adjustment machine can quickly locate abnormal needle tips, saving the time of manual addressing and debugging, improving the recognition rate and accuracy of abnormal needle tips, reducing personnel training requirements, and improving maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic diagram of a needle adjustment system provided in an embodiment of the present application.

[0041] Figure 2 A schematic diagram of a wafer provided in an embodiment of the present application.

[0042] Figure 3 A schematic diagram of the partial structure of the needle marks left on the die after being pierced with a needle on a testing machine according to an embodiment of the present application.

[0043] Figure 4 A schematic diagram of the actual needle tip position scanned on the needle adjustment machine provided in an embodiment of the present application.

[0044] Figure 5 Schematic diagram of the identification of needle mark positions collected by the testing machine provided in an embodiment of the present application.

[0045] Figure 6 This is a schematic diagram of the real-time image of the needle tip and the location of abnormal needle marks collected by the needle adjustment machine provided in an embodiment of the present application.

[0046] Where: 100, wafer; 10, die; 20, alignment mark; 11, calibration point; 2, pad; A1, needle tip number; a1, current position of the needle tip. DETAILED DESCRIPTION

[0047] In order to describe the technical content, structural features, achieved purposes and effects of the invention in detail, the technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. In the following description, for the purpose of explanation, many specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments may also be implemented without these specific details or in the presence of one or more equivalent arrangements. In addition, various exemplary embodiments may be different, but are not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0048] In the description of the present application, unless otherwise specified, “plurality” means two or more.

[0049] An embodiment of the present application provides a probe card needle adjustment method, a needle adjustment system, a server, and a data processing method for the server, wherein the probe card needle adjustment system includes a tester, a server, and a needle adjustment machine, the server is used to establish communication between the wafer tester and the needle adjustment machine, and guide the needle adjustment machine to automatically address abnormal needle tips based on the needle mark test results of the tester, so as to realize information interconnection between the equipment, shorten the needle adjustment time, improve the accuracy and operation efficiency of needle tip maintenance, and reduce personnel training requirements.

[0050] See also Figure 1 , shows a schematic diagram of the structure of the needle adjustment system provided in an embodiment of the present application. The needle adjustment system includes a testing machine, a server and a needle adjustment machine.

[0051] The tester uses a probe card to connect to the pin signal of each die during the wafer probe test and applies a predetermined test signal to check whether each die meets the preset performance standards, such as operating voltage, current consumption, signal timing, and correct execution of specific functions.

[0052] See also Figure 2 In one embodiment, the tester has an image acquisition and processing module that can take high-definition photos of the wafer 100 and identify and locate the needle marks on the pads through automatic image processing technology. Figure 5 , so that the test machine can generate an output file containing the needle tip number, needle mark position and judgment result information corresponding to each needle mark, see Figure 3 、 4 , the judgment result information includes normal and abnormal.

[0053] In the above embodiment, image recognition technology is used to identify abnormal needle tips based on needle mark test results. In other embodiments of the present application, abnormal needle tips can also be identified through performance test data of the testing machine, such as one or more parameters such as contact resistance, leakage current, needle trace parameters, and needle tip diameter. When the testing machine detects that the above needle tip test data is abnormal or deviates from the standard value, it automatically determines that the corresponding needle tip is an abnormal needle tip, and generates an output file based on the needle tip test data.

[0054] The server, which can be a local server or a networked server, can communicate between the tester and the needle adjustment machine via the FTP protocol, and can also parse and process the needle marks fed back by the tester so that the needle adjustment machine can recognize and utilize them. In some embodiments, the server and the needle adjustment machine can be integrated, that is, the computer control system of the needle adjustment machine has the ability to analyze and process the output files of the tester, and the output files received by the needle adjustment machine through the external interface can be automatically converted into usable data information.

[0055] Specifically, the server can parse and process the output file of the testing machine to generate a parsing file suitable for the needle adjustment machine. The parsing file includes the position and / or picture of each needle mark and the judgment result information. The parsing file is in a format that can be recognized by the needle adjustment machine.

[0056] The server has a processor, a memory, an input port connected to a tester, and an output port connected to a needle adjustment machine. The memory stores program instructions executable by the processor. When these program instructions are executed, the processor can perform the following data processing method, including:

[0057] receiving an output file from the testing machine, wherein the output file includes needle tip number a1, needle mark position, and determination result information corresponding to each needle mark, wherein the determination result information includes normal and abnormal;

[0058] The output file is parsed and processed to generate a parsing file suitable for the needle adjustment machine. The parsing file includes the needle tip position of each probe, the position of each needle mark, the needle tip number of the abnormal needle tip, and the position of the abnormal needle mark. In the parsing file, each needle mark position corresponds to the needle tip position of each probe:

[0059] The parsed file is sent to the needle adjustment machine.

[0060] In order to overcome the position change of the probe card caused by the temperature difference between the test temperature and the probe adjustment environment, in one embodiment, the server further includes offset processing of the probe mark position in the output file. The offset processing can be implemented in a variety of ways. The offset processing in this embodiment includes the following steps:

[0061] B1) selecting a plurality of calibration points 11 on the wafer to be tested, and recording the position coordinates of each calibration point at the test temperature;

[0062] B2) Corresponding the position coordinates with the reference position coordinates of the wafer under test at room temperature, and calculating the offset. The reference position is obtained from the design drawing or from visual recognition and positioning of the wafer by the test machine at room temperature.

[0063] B3) Calculating corrected position information corresponding to each needle mark at room temperature based on the needle mark position of each needle tip in the output file and the offset.

[0064] That is to say, a reference coordinate system is established at room temperature (25°C), and the coordinate matrix P of each calibration point is recorded. Pref , then collect the coordinates of each calibration point at the test temperature (low or high temperature), and record the coordinate matrix P max / P min , perform deformation modeling and coordinate mapping. Randomly retain 20% of the calibration points as a validation set, calculate the reprojection error, and if the error is within the allowable threshold, establish the offset correspondence between the coordinate positions on the probe card at room temperature and the test temperature.

[0065] In one embodiment, the analysis file includes the corrected position information and / or pictures of each needle mark and the determination result information. The analysis file can be viewed through the display device of the needle adjustment machine so that maintenance personnel can quickly understand the situation of the abnormal needle tip.

[0066] The needle adjustment machine has a camera for locating and scanning the position of the probe tip, a three-dimensional mounting platform for fixing the probe card, and a drive mechanism for driving the three-dimensional mounting platform. Since the probe card needle tip is very small, in order to facilitate maintenance and inspection by staff, the needle adjustment machine also has an optical microscope or imaging display device for magnifying and displaying the probe card needle tip, which can display the real-time image of each needle tip. Figure 6 The needle adjustment machine can automatically locate the abnormal needle tip based on the analysis file, and the driving mechanism drives the three-dimensional installation platform to move, so as to automatically move the abnormal needle tip into the field of view of the maintenance window, saving time for manual adjustment of the position and searching for the abnormal needle tip.

[0067] The probe card needle adjustment system of the present application also includes a processor and memory, which stores program instructions executable by the processor to implement the following needle adjustment method. This document does not limit the use of one or more processors and memories. The needle adjustment system can use multiple processors and memories to achieve coordinated control of the test machine, needle adjustment machine, and server, thereby implementing the following needle adjustment method. In some simplified systems, the server and needle adjustment machine are integrated, and the control system of the needle adjustment machine completes the work of the processor and memory.

[0068] A probe card needle adjustment method, comprising:

[0069] S11) placing the probe card under test at the test temperature and leaving it for a set time to allow the probe card to fully expand or cool;

[0070] S12) Test needle marks on several bonding pads 2 of wafer 100, perform image processing on the needle marks on the wafer bonding pads, identify and locate each needle mark, see Figure 5 , generating an output file, wherein the output file includes the needle tip number, needle mark position and determination result information corresponding to each needle mark, Figure 3 The figure shows the needle mark position diagram, in which A1, A2, B1...Kn represent the needle tip number corresponding to each needle mark; Figure 5 The top row shows the images of each pad on the die after the test machine has tested the needle mark. The bottom row shows the images after the needle mark has been identified and located. It can be seen that in the four photos on the left and middle, there is a needle mark in the center of each pad, while the two photos on the right have no needle mark on the pad in the middle. The image acquisition and processing module in the test machine can successfully identify the abnormal needle mark location, i.e. Figure 5 The position is in the red box area in the lower right corner, and the needle tip number is obtained at the same time;

[0071] S21) The server downloads the output file of the testing machine via the FTP network, and parses and processes the output file to generate a parsed file suitable for the needle adjustment machine, wherein the parsed file includes the needle tip number and needle mark position of each needle tip, the needle tip number and abnormal needle mark position of each abnormal needle tip, where the needle mark position here can adopt the aforementioned corrected position information, which is obtained based on the needle mark position of the output file after temperature offset correction. The calculation method of the offset correction has been introduced above and will not be repeated here;

[0072] S31) The probe card to be tested is fixed on the three-dimensional mounting platform of the needle adjustment machine by manual or mechanical feeding, and the current position of each needle tip on the probe card is scanned and located by a high-definition camera. The current position in this embodiment can be intuitively displayed by real-time image, and can also be displayed by extracting features from the image and then reconstructing the image, such as Figure 4 As shown, a1, a2...kn are needle tip numbers, corresponding to the position numbers in the needle mark position diagram, respectively. The numbers of a1 and A1, a2 and A2, and b1 and B1 correspond one to one;

[0073] S32) Based on the needle mark analysis of the tester or based on the parsing file from the server, the needle tip number of the abnormal needle tip is determined, and the needle mark position of each needle tip is matched to the current position of each needle tip on the probe card;

[0074] S33) automatically moves the three-dimensional mounting platform to expose the abnormal needle tip to the field of view of the maintenance window, and simultaneously displays the real-time image of each needle tip of the probe card and the position of the abnormal needle mark, see Figure 6 , where the abnormal needle mark position is indicated by a blue frame, the white dot is the real-time image of the normal needle tip, the yellow dot is the current position of the abnormal needle tip, the red cross mark represents the center point of the needle tip, and the green cross mark represents the center point of the needle mark position, which is also the standard position of the needle tip. It can be seen that the center position of the abnormal needle tip is not in the exact center of the needle mark position;

[0075] S34) Manually repair the abnormal needle tip, please continue to refer to Figure 6 Since the probe card needle adjustment system has already marked the needle mark position of the abnormal needle tip and the current position of the abnormal needle tip, it is only necessary to manually adjust the abnormal needle tip to the green cross alignment mark in the center of the blue frame; S40) Review step, scan the real-time position of each needle tip on the probe card and compare it with the standard position of the needle tip corresponding to the needle tip number in the current maintenance window. If the comparison result shows that the current position of the needle tip is within the standard position threshold range, manually or automatically proceed to the next abnormal needle tip for maintenance, and record the maintenance data;

[0076] S41) Check whether all abnormal needle tips have been repaired. If so, the repair is terminated. Otherwise, the steps S31 to S40 are circulated until the current positions of all needle tips correspond to their standard positions.

[0077] In one embodiment, after the needle adjustment machine takes a photo scan of the current position of each needle tip, the correction value of each needle tip can be calculated based on the difference between the current position of each needle tip and the center point of each needle mark position, that is, the correction value of each needle tip can be calculated. Figure 6 The distance between the red and green crosshairs is recorded, recording the difference between the current actual position of each needle tip and the reference position. In some embodiments, the correction values ​​of each needle tip can be sorted from largest to smallest, and correction values ​​exceeding a set threshold are set as abnormal, automatically identifying needle tips requiring position adjustment. In some embodiments, the three-dimensional mounting platform can be automatically moved based on the magnitude of each correction value, that is, needle tips are repaired in descending order of correction values, or random repairs can be performed according to the maintenance personnel's selection.

[0078] In order to improve the timeliness of finding and locating abnormal probes, in this application, the three-dimensional mounting platform that fixes the probe card to be repaired is automatically moved. There are multiple ways to choose the movement path of the three-dimensional mounting platform, such as the software automatically planning the optimal movement path based on the positions of multiple abnormal needle tips. In one embodiment, the three-dimensional mounting platform can also be moved in sequence based on the needle tip number of the abnormal needle tip. Alternatively, the three-dimensional mounting platform can be moved based on the needle mark position. It can also be moved to the three-dimensional mounting platform of the nearest abnormal needle tip based on the current position of the abnormal needle tip.

[0079] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims, the description, and their equivalents.

Claims

1. A data processing method, characterized in that: include: receiving an output file from the testing machine, wherein the output file includes needle tip numbers, needle mark positions, and determination result information corresponding to each needle mark, wherein the determination result information includes normal and abnormal; Parsing and processing the output file to generate a parsing file suitable for the needle adjustment machine, wherein the parsing file includes the needle tip number of the abnormal needle tip, the abnormal needle mark position, and the needle tip position of each probe; The parsed file is sent to the needle adjustment machine.

2. The data processing method according to claim 1, wherein: The output file contains needle tip test data, and the needle tip test data includes one or more parameters of contact resistance, leakage current, needle trace parameters, and needle tip diameter.

3. The data processing method according to claim 1, wherein: The processing includes offsetting the position of the needle mark.

4. A server comprising a processor, a memory, an input port connected to a testing machine, and an output port connected to a needle adjusting machine, wherein the memory stores program instructions executable by the processor to implement the method according to any one of claims 1 to 3.

5. A probe card needle adjustment method, characterized in that: include: S11) placing the probe card under test at the test temperature and leaving it for a set time to allow the probe card to fully expand or cool; S12) testing needle marks on a plurality of wafer bonding pads, performing image processing on the needle marks on the wafer bonding pads, identifying and locating each needle mark, and generating an output file, wherein the output file includes needle tip numbers corresponding to each needle mark, needle mark positions, and determination result information; S21) parsing and processing the output file to generate a parsing file suitable for the needle adjustment machine, wherein the parsing file includes the needle tip number of the abnormal needle tip and the abnormal needle mark position; S31) fixing the probe card to be tested on a three-dimensional mounting platform, scanning and locating the current position of each needle tip on the probe card; S32) Based on the needle mark analysis of the tester or based on the parsing file from the server, the needle tip number of the abnormal needle tip is determined, and the position of each needle mark is matched to the current position of each needle tip of the probe card; S33) automatically moving the three-dimensional mounting platform based on the needle tip number of the abnormal needle tip or the abnormal needle mark position or the current position of the abnormal needle tip, so that the abnormal needle tip is exposed within the field of view of the maintenance window, and simultaneously displaying the real-time image of each needle tip of the probe card and the abnormal needle mark position; S34) Repair the abnormal needle tip and adjust the abnormal needle tip to the center of the abnormal needle mark.

6. The needle adjustment method according to claim 5, characterized in that: After step S34), the method further includes: S40) A review step of scanning the real-time position of each needle tip on the probe card and comparing it with the needle mark position corresponding to the needle tip number in the current maintenance window to ensure that each needle tip is located within the corresponding needle mark position and update the record of the comparison result.

7. A probe card needle adjustment system, characterized in that: include: The testing machine has an image acquisition and processing module for identifying and locating the pin marks on the pads, and generates an output file containing the pin tip number, pin mark position and determination result information corresponding to each pin mark; The server is used to parse and process the output file to generate a parsed file suitable for the needle adjustment machine; A needle adjustment machine having a camera for locating and scanning the position of the needle tip, a three-dimensional mounting platform for fixing the probe card, and a drive mechanism for driving the three-dimensional mounting platform to move. The needle adjustment machine can automatically locate abnormal needle tips based on the analysis file; A processor and a memory, wherein the memory stores program instructions executable by the processor to implement the needle adjustment method as described in any one of claims 5-6.

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