Cooling structure for beam line mirror box and assembling method thereof

Abstract

The invention relates to a cooling structure for a beam line mirror box, the beam line mirror box and a cooling structure assembling method, the cooling structure comprises an optical element, a cooling block and a heat exchange medium, the optical element is provided with a heat exchange area, and a heat exchange gap is formed between the first side surface of the cooling block and the heat exchange area to accommodate the heat exchange medium; the heat exchange medium comprises a solid heat exchange medium and a liquid heat exchange medium, the solid heat exchange medium is provided with a heat exchange surface and a turnover surface, the heat exchange surface is attached to the first side surface of the cooling block, the turnover surface is attached to the upper surface of the cooling block, and the heat exchange gap is filled with the liquid heat exchange medium. The solid heat exchange medium can enhance the spreading capacity of the liquid heat exchange medium on the surface of the cooling block, the possibility of generating local bubbles is reduced, when the liquid heat exchange medium is excessively injected or the heat exchange gap becomes small in the assembling and moving process, the liquid heat exchange medium in the gap does not drop preferentially after being extruded out of the heat exchange gap, and therefore the heat exchange efficiency is improved. Therefore, the safety of the system is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of optical technologies, and in particular, to a cooling structure for a beamline mirror box, a beamline mirror box, and a method for assembling a cooling structure for a beamline mirror box. Background Art

[0002] A beamline mirror box is a key component in a diffraction-limited light source (such as a synchrotron radiation source, a free electron laser, etc.), which is used to carry and precisely adjust optical elements (such as mirrors, focusing mirrors, etc.) to control the direction and intensity of the light beam of the light source. To ensure the performance of the diffraction-limited light source, it is required that the optical elements in the beamline mirror box can maintain extremely high static surface shape accuracy under a high thermal load. For this purpose, a cooling system is usually configured in the beamline mirror box to dissipate heat from the optical elements and prevent the optical elements from affecting the optical performance due to thermal deformation. The cooling system generally includes a cooling block, on which a cooling channel is provided, and a flowing cooling liquid is present in the cooling channel. The cooling block is placed on the heat exchange area of the optical element, and there is a heat exchange gap between the cooling block and the optical element. The cooling block is indirectly in contact with the optical element through a liquid heat exchange medium filled in the heat exchange gap to take away the heat generated by the optical element.

[0003] Currently, the assembly of the cooling system mostly adopts the method of first filling the liquid heat exchange medium and then assembling the cooling block. However, in actual assembly, it is usually difficult to accurately control the filling amount of the liquid heat exchange medium and ensure that it spreads and covers the specified area, and it is easy to form bubbles locally, causing the local heat exchange efficiency to change and weakening the thermal deformation control effect; in addition, when there is more liquid heat exchange medium, or when the cooling system is slightly moved during the assembly process for position fine-tuning, resulting in a change in the heat exchange gap, the liquid heat exchange medium is easily extruded and dripped, polluting the internal space of the mirror box and even the optical surface, causing accidents.

[0004] Therefore, how to more safely and reliably achieve the assembly of the liquid heat exchange medium is a technical problem that needs to be studied and solved currently. Summary of the Invention

[0005] The embodiments of the present application provide a cooling structure for a beamline mirror box, a beamline mirror box, and a method for assembling a cooling structure for a beamline mirror box, aiming to improve the operability of filling the liquid heat exchange medium and the filling effect of the liquid heat exchange medium, and reduce the risk of the liquid heat exchange medium overflowing and dripping.

[0006] In a first aspect, an embodiment of the present application provides a cooling structure for a beamline mirror box, including an optical element, a cooling block, and a heat exchange medium. Among them, a heat exchange area is provided on the optical element, a first side surface of the cooling block is disposed opposite to the heat exchange area, and a heat exchange gap is formed between the first side surface of the cooling block and the heat exchange area to accommodate the heat exchange medium. The first side surface of the cooling block is indirectly in contact with the heat exchange area through the heat exchange medium; the heat exchange medium includes a solid heat exchange medium and a liquid heat exchange medium. The solid heat exchange medium has a heat exchange surface and a folded surface integrally connected to the heat exchange surface. The heat exchange surface is attached to the first side surface of the cooling block, and the folded surface is attached to the upper surface of the cooling block. The liquid heat exchange medium is filled in the heat exchange gap.

[0007] In the above solution, the first side surface of the cooling block is indirectly in contact with the heat exchange area of the optical element through the solid heat exchange medium and the liquid heat exchange medium. The solid heat exchange medium has a heat exchange surface and a folded surface integrally connected to the heat exchange surface. Among them, the heat exchange surface of the solid heat exchange medium is attached to the first side surface of the cooling block, and the folded surface of the solid heat exchange medium is attached to the upper surface of the cooling block. This solid heat exchange medium can enhance the spreading ability of the liquid heat exchange medium on the surface of the cooling block, thereby guiding the liquid heat exchange medium to evenly extend and spread in the heat exchange gap between the cooling block and the optical element, reducing the possibility of generating local bubbles, greatly improving the complete coverage ability of the liquid heat exchange medium for small gaps and specific areas, and enhancing the ease of operation of the assembly of the liquid heat exchange medium and the filling effect of the liquid heat exchange medium. In addition, since the solid heat exchange medium has a guiding ability for the liquid heat exchange medium, the folded surface of the solid heat exchange medium can be used as a flow buffer area for the liquid heat exchange medium. When the liquid heat exchange medium is injected in excess, or a small movement occurs during the assembly process due to fine-tuning of the position, resulting in a change in the heat exchange gap, the liquid heat exchange medium in the gap is not preferentially dripped out after being squeezed out of the heat exchange gap, but accumulates on the folded surface and flows back into the heat exchange gap again after the gap size is restored, reducing the risk of the liquid heat exchange medium overflowing and dripping, and improving the system safety.

[0008] In a possible implementation manner of the first aspect, the solid heat exchange medium is a solid indium film.

[0009] In a possible implementation manner of the first aspect, the liquid heat exchange medium is a liquid indium-gallium alloy.

[0010] In a possible implementation manner of the first aspect, the solid heat exchange medium is attached to the surface of the cooling block by electroplating or film pressing.

[0011] In a possible implementation manner of the first aspect, at least part of the upper surface of the cooling block is covered by the folded surface; the effective cooling area on the first side surface of the cooling block is covered by the heat exchange surface.

[0012] In a second aspect, an embodiment of the present application provides a beamline mirror box, and the beamline mirror box includes the cooling structure described in the foregoing first aspect.

[0013] In a third aspect, an embodiment of the present application provides a method for assembling a cooling structure for a beamline mirror box, including the following steps: Obtain a solid heat exchange medium, where the solid heat exchange medium has a heat exchange surface and a folding surface integrally connected to the heat exchange surface; Attach the heat exchange surface to the first side surface of the cooling block, and attach the folding surface to the upper surface of the cooling block; Fix the position of the optical element through a first clamping mechanism; Align the first side surface of the cooling block with the heat exchange area on the optical element, and leave a heat exchange gap, and fix the position of the cooling block through a second clamping mechanism; Drop a liquid heat exchange medium on the folding surface of the solid heat exchange medium, so that the liquid heat exchange medium flows along the solid heat exchange medium and fills the heat exchange gap.

[0014] In a possible implementation manner of the third aspect, after dropping the liquid heat exchange medium on the folding surface of the solid heat exchange medium, the method further includes: When the liquid heat exchange medium in the heat exchange gap begins to accumulate on the folding surface, stop dropping the liquid heat exchange medium.

[0015] In a possible implementation manner of the third aspect, after aligning the first side surface of the cooling block with the heat exchange area on the optical element, the method further includes: Adjust the distance between the cooling block and the heat exchange area, and after the heat exchange gap meets a preset distance threshold condition, fix the position of the cooling block through the second clamping mechanism.

[0016] In a possible implementation manner of the third aspect, the solid heat exchange medium is a solid indium film, the thickness of the solid indium film does not exceed 10 μm, and the solid indium film dissolves itself after assembly.

[0017] The solutions provided in the foregoing second and third aspects are used to implement or cooperate with the implementation of the cooling structure provided in the first aspect, so the same or corresponding beneficial effects can be achieved as those in the first aspect, and details are not described herein again.

[0018] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. Description of the Drawings

[0019] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic diagram of a cooling structure for a beamline mirror box provided by an embodiment of the present application from a top view angle; Figure 2 It is a schematic diagram of a cooling structure for a beamline mirror box provided by an embodiment of the present application from a side view angle; Figure 3 It is a schematic diagram of the normal state of the liquid heat exchange medium in the heat exchange gap provided by an embodiment of the present application; Figure 4 It is a schematic diagram of the state of the liquid heat exchange medium when the heat exchange gap becomes smaller provided by an embodiment of the present application; Figure 5 It is a schematic flow diagram of a method for assembling a cooling structure for a beamline mirror box provided by an embodiment of the present application; Explanation of reference numerals: optical element - 10, cooling block - 20, cooling channel - 21, heat exchange medium - 30, solid heat exchange medium - 31, heat exchange surface - 311, folding surface - 312, liquid heat exchange medium - 32, heat exchange gap - 40. Detailed implementation manners

[0021] In order to make the purpose, technical method and advantages of the present application clearer, the following further details the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] In the description of the embodiments of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application.

[0023] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more such features. In the description of the embodiments of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0024] In the embodiments of the present application, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0025] In the embodiments of the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0026] In the embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent the cases of A alone, A and B existing simultaneously, and B alone. Where A and B may be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. "At least one of the following" and its similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b and c may represent: a alone, b alone, c alone, a and b existing simultaneously, a and c existing simultaneously, b and c existing simultaneously, or a, b and c existing simultaneously, where a, b and c may be single or multiple.

[0027] In the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations, or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0028] The beamline mirror box is a key component in a diffraction-limited light source (such as a synchrotron radiation light source, a free electron laser, etc.), which is used to carry and precisely adjust optical elements (such as mirrors, focusing mirrors, etc.) to control the direction and intensity of the light source beamline. Generally, the beamline mirror box includes a vacuum chamber, optical elements, and a cooling system. Among them, the optical elements and the cooling system are both located in the vacuum chamber. The high-vacuum environment provided by the vacuum chamber can improve the coherence and stability of the beamline. The optical elements refer to devices used to control the transmission and processing of light. Their material is usually single-crystalline silicon. One side of the optical element is an optical surface for receiving and processing the beamline emitted by the light source. Heat exchange areas are provided on other sides of the optical element except the optical surface. The cooling system specifically includes cooling blocks, a cooling block support mechanism, cooling channels, and a coolant circulation and transmission pipeline. The cooling blocks are arranged on the heat exchange areas, and there is a heat exchange gap between the cooling blocks and the heat exchange areas. The heat exchange gap is filled with a liquid heat exchange medium with high thermal conductivity. The cooling blocks are indirectly in contact with the optical elements through the liquid heat exchange medium. The cooling block support mechanism is used to support the cooling blocks. The cooling channels are arranged in the cooling blocks, and the cooling channels are connected to the coolant circulation and transmission pipeline. The coolant circulation and transmission pipeline injects flowing cooling liquid into the cooling channels. The optical elements need to bear a high heat load during operation. The heat generated by the optical elements is first transmitted to the cooling blocks through the liquid heat exchange medium, and then quickly taken away by the flowing cooling liquid in the cooling blocks, so as to cool the optical elements and keep the optical elements working within an ideal temperature range, avoid thermal deformation caused by too high temperature, ensure the accuracy and stability of the optical elements, and thus ensure the transmission efficiency of the beamline and the quality of optical experiments.

[0029] It should be noted that the cooling blocks are on the heat exchange areas of the optical elements and are indirectly in contact with the optical elements through the liquid heat exchange medium, that is, the cooling blocks are not directly in contact with the optical elements. There is a heat exchange gap between the cooling blocks and the heat exchange areas of the optical elements. This heat exchange gap is usually very narrow (about 50 - 200 μm) and is filled with a liquid heat exchange medium with high thermal conductivity. It should be understood that on the one hand, the liquid heat exchange medium can improve the heat exchange efficiency between the cooling blocks and the optical elements, and on the other hand, through its fluidity, it can reduce the transmission of flow-induced vibration generated when the cooling liquid flows in the cooling blocks to the optical elements, and improve the structural stability of the optical elements.

[0030] At present, the assembly of the cooling system mostly adopts the method of first filling the liquid heat exchange medium and then assembling the cooling block, that is, first estimating the filling amount of the liquid heat exchange medium, then injecting the liquid heat exchange medium into the heat exchange area according to the estimated filling amount, and then placing the cooling block on the heat exchange area, and indirectly contacting the heat exchange area of the optical element through the liquid heat exchange medium. However, during actual assembly, it is usually difficult to accurately control the filling amount of the liquid heat exchange medium and ensure that it spreads and covers the designated area, and it is easy to form bubbles locally, causing changes in the local heat exchange efficiency and weakening the thermal deformation control effect; in addition, since the heat exchange gap is usually very narrow, when there is more liquid heat exchange medium, or when the heat exchange gap changes due to the movement of the cooling system, the liquid heat exchange medium is easily squeezed out and dripped, polluting the internal space of the mirror box and even the optical surface, causing accidents.

[0031] Based on this, the embodiments of the present application provide a cooling structure for a beamline mirror box, a beamline mirror box, and a method for assembling a cooling structure for a beamline mirror box, aiming to improve the ease of operation of assembling the liquid heat exchange medium and the filling effect of the liquid heat exchange medium, and reduce the risk of the liquid heat exchange medium overflowing and dripping.

[0032] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic diagram of a cooling structure for a beamline mirror box provided by an embodiment of the present application from a top view angle, Figure 2 and Figure 1 which is a schematic diagram of a cooling structure for a beamline mirror box provided by an embodiment of the present application from a side view angle. The following will describe a cooling structure for a beamline mirror box provided by an embodiment of the present application in conjunction with Figure 2 .

[0033] As Figure 1 and Figure 2 shown, the cooling structure includes an optical element 10, a cooling block 20, and a heat exchange medium 30. Among them, a heat exchange area is provided on the optical element 10, the first side surface of the cooling block 20 is disposed opposite to the heat exchange area, and there is a heat exchange gap 40 between the first side surface of the cooling block 20 and the heat exchange area to accommodate the heat exchange medium; the heat exchange medium 30 includes a solid heat exchange medium 31 and a liquid heat exchange medium 32. The solid heat exchange medium 31 has a heat exchange surface 311 and a folded surface 312 integrally connected to the heat exchange surface 311. The heat exchange surface 311 is attached to the first side surface of the cooling block 20, the folded surface 312 is attached to the upper surface of the cooling block 20, and the liquid heat exchange medium 32 is filled in the heat exchange gap 40.

[0034] In the embodiment of the present application, the cooling block 20 is indirectly in contact with the optical element 10 through the solid heat exchange medium 31 and the liquid heat exchange medium 32. The solid heat exchange medium 31 has a heat exchange surface 311 and a folded surface 312 integrally connected to the heat exchange surface 311. Among them, the heat exchange surface 311 of the solid heat exchange medium 31 is attached to the first side surface of the cooling block 20, and the folded surface 312 of the solid heat exchange medium 31 is attached to the upper surface of the cooling block 20. The solid heat exchange medium 31 can enhance the spreading ability of the liquid heat exchange medium 32 on the surface of the cooling block 20, so as to guide the liquid heat exchange medium 32 to uniformly spread out in the heat exchange gap 40 between the cooling block 20 and the optical element 10, reduce the possibility of generating local bubbles, greatly improve the complete coverage ability of the liquid heat exchange medium 32 for small gaps and specific areas, and improve the ease of operation of filling the liquid heat exchange medium 32 and the filling effect of the liquid heat exchange medium 32. In addition, since the solid heat exchange medium 31 has a guiding ability for the liquid heat exchange medium 32, the folded surface 312 of the solid heat exchange medium 31 can be used as a flow buffer area for the liquid heat exchange medium 32. When the liquid heat exchange medium 32 is injected excessively, or the heat exchange gap 40 becomes smaller during the operation of the cooling system, the liquid heat exchange medium 32 in the gap is squeezed out of the heat exchange gap 40 and no longer drips preferentially, but accumulates on the folded surface 312 and flows back into the heat exchange gap 40 again after the gap size is restored, further improving the system safety.

[0035] Exemplarily, the optical element 10 has a cubic configuration and is made of single-crystalline silicon. One side surface of the optical element 10 is an optical surface, and the light source emits a light beam line towards this optical surface. Heat exchange regions are provided on two side surfaces adjacent to the optical surface of the optical element 10. The cooling block 20 has a cubic configuration and is made of a material with a relatively high thermal conductivity (such as oxygen-free copper). At least one side surface of the cooling block 20 is covered with a solid heat exchange medium 31. In the embodiment of the present application, the part of the first side surface of the cooling block 20 covered by the solid heat exchange medium 31 is called the heat exchange surface 311. The upper side of the heat exchange surface 311 has a surface that is folded towards the upper surface of the cooling block 20. In the embodiment of the present application, this folded surface is called the folded surface 312. A part of the upper surface of the cooling block 20 is covered by the folded surface 312. The aforementioned heat exchange surface 311 and folded surface 312 are an integrally formed structure. The cooling block 20 is connected to the cooling block support mechanism. The cooling block 20 can approach the heat exchange region of the optical element 10 under the drive of the cooling block support mechanism and can move up and down to adjust the heat exchange area between the cooling block 20 and the optical element 10. When it is necessary to inject the liquid heat exchange medium 32 into the heat exchange gap 40, the liquid heat exchange medium 32 can be dripped onto the folded surface 312 of the solid heat exchange medium 31, and then flow into the heat exchange gap 40 of the optical element 10 along the folded surface 312 and the heat exchange surface 311 of the solid heat exchange medium 31 in sequence to fill the heat exchange gap 40. Specifically, the solid heat exchange medium 31 is made of a material that has good wettability with the liquid heat exchange medium 32. For example, a metal solid with a high surface tension (surface energy) is selected as the solid heat exchange medium 31. Under the action of good wettability, the liquid heat exchange medium 32 can spread evenly along the solid heat exchange medium 31, fill the heat exchange gap 40 between the cooling block 20 and the optical element 10, and is not likely to generate local bubbles, improving the filling effect of the liquid heat exchange medium 32.

[0036] As Figure 1 and Figure 2 shown, in the embodiment of the present application, the heat exchange surface 311 and the folded surface 312 of the solid heat exchange medium 31 are an integrally formed structure. The solid heat exchange medium 31 can be attached to the surface of the cooling block 20 by electroplating or thin film pressing. When the liquid heat exchange medium 32 drops onto the surface of the solid heat exchange medium 31, it will only spread along the surface of the solid heat exchange medium 31 and uniformly adhere to the surface of the solid heat exchange medium 31.

[0037] It should be understood that at least part of the upper surface of the cooling block 20 is covered by the folded surface 312. Specifically, the size and shape of the folded surface 312 can be flexibly set according to actual needs. An effective cooling region is designed on the first side surface of the cooling block 20, and this effective cooling region is covered by the heat exchange surface 311 to ensure that heat can be fully exchanged between the effective cooling region of the cooling block 20 and the heat exchange region of the optical element 10 through the heat exchange medium.

[0038] As Figure 1 and Figure 2 shown, in the embodiment of the present application, the first side surface of the cooling block 20 is completely covered by the heat exchange surface 311 of the solid heat exchange medium 31, and the edge of the upper surface of the cooling block 20 close to the first side surface of the cooling block 20 is completely covered by the folded surface 312 of the solid heat exchange medium 31, ensuring that the liquid heat exchange medium 32 can completely cover the first side surface of the cooling block 20.

[0039] Please refer to Figure 3 and Figure 4 , Figure 3 which is a schematic diagram of the normal state of the liquid heat exchange medium 32 in the heat exchange gap 40 provided by the embodiment of the present application. Figure 4 which is a schematic diagram of the state of the liquid heat exchange medium 32 in the heat exchange gap 40 when it becomes smaller. Under normal circumstances, the state of the liquid heat exchange medium 32 after being filled is as Figure 3 shown. When the cooling system is in motion or encounters unforeseeable problems, the heat exchange gap 40 changes, and the liquid heat exchange medium 32 is extruded. In the traditional cooling structure, the extruded liquid heat exchange medium 32 will flow out and drip under the action of gravity, resulting in contamination of the mirror box. However, in the embodiment of the present application, as Figure 4 shown, due to the introduction of the folding design, the extruded liquid heat exchange medium 32 preferentially accumulates and is stored on the folded surface 312 of the solid heat exchange medium 31 and will not flow out. Moreover, when the heat exchange gap 40 between the cooling block 20 and the optical element 10 returns to normal, under the action of gravity, the liquid heat exchange medium 32 will flow down again from the folded surface 312 and fill the heat exchange gap 40, reducing the probability of contamination risks.

[0040] In the embodiment of the present application, the cooling block 20 can be made of a metal material with good heat dissipation performance such as copper or aluminum.

[0041] In the embodiment of the present application, the liquid heat exchange medium 32 can be a liquid indium gallium alloy. The indium gallium alloy is in a liquid state at room temperature and has good fluidity. At the same time, the liquid indium gallium alloy has a very high thermal conductivity, and this high thermal conductivity helps to quickly conduct heat and improve the thermal management efficiency. In addition, the thermal conductivity of the liquid indium gallium alloy increases with the increase of the indium mass fraction. Therefore, in specific implementation, those skilled in the art can set the indium mass fraction in the liquid indium gallium alloy according to actual needs. Exemplarily, the liquid indium gallium alloy can specifically be a gallium indium tin alloy. Of course, those skilled in the art can also select other types of liquid indium gallium alloys according to actual needs, and the embodiment of the present application does not limit the specific type of the liquid indium gallium alloy.

[0042] In the embodiments of the present application, the solid heat exchange medium 31 may be a solid indium film (or indium foil). As a metal, indium has good thermal conductivity, and its softness and ductility are excellent. Therefore, it can be made into an ultra-thin film and attached to the cooling block 20 to fill the micron-level unevenness on the surface of the cooling block 20, reducing the air gap (the main source of thermal resistance of traditional interface materials). The ultra-thin form can ensure uniform heat diffusion at the interface, avoid local hot spots, improve the interface heat transfer efficiency, and has good wettability to liquids. Therefore, it can guide the dripping liquid heat exchange medium 32. The indium film can be plated on the cooling block 20 (copper or aluminum substrate) by electroplating, or attached to the cooling block 20 by means of film pressing. It should be noted that the solid heat exchange medium 31 can also use other materials with both high thermal conductivity and ductility, and the embodiments of the present application do not limit this.

[0043] In a possible implementation scenario, the thickness of the indium film / foil selected for assisting the assembly of liquid indium gallium alloy does not exceed 10 μm. Because the indium film / foil will gradually dissolve in indium gallium during the long-term service process after assembly, and will be completely replaced by indium gallium later and completely fill the specified position. That is to say, the indium film / foil will dissolve by itself after the assembly is completed. The dissolution process will cause changes in the indium gallium content, which may reduce the fluidity of indium gallium. Therefore, to avoid this problem, the indium film / foil should not be selected with too large a thickness, and only ensure that it can play a role during the assembly process, and it does not need to play a long-term role after the assembly. Therefore, it is recommended to select an indium film / foil with a relatively thin thickness as much as possible or directly electroplate an indium film / foil with a micron-level thickness during the assembly process. The actual thickness of the indium gallium in the gap is about in the order of hundreds of microns, and the incorporation of an indium film / foil with a thickness of several microns or even sub-microns will not have a significant impact on its fluidity.

[0044] The embodiments of the present application further provide a beamline mirror box, and the beamline mirror box includes the cooling structure described in any one of the foregoing embodiments.

[0045] In a possible implementation, the beamline mirror box includes a vacuum box body, an optical element 10, a heat exchange medium 30, and a cooling system. Among them, the optical element 10 and the cooling system are both located in the vacuum box body; an optical surface is provided on the side surface of the optical element 10, and a heat exchange area is provided on the optical element 10; the heat exchange medium 30 includes a solid heat exchange medium 31 and a liquid heat exchange medium 32; the cooling system includes a cooling block 20, a cooling block support mechanism, a cooling channel 21, and a coolant circulation transmission pipeline. The first side surface of the cooling block 20 is oppositely arranged with the heat exchange area, and there is a heat exchange gap 40 between the first side surface of the cooling block 20 and the heat exchange area to accommodate the heat exchange medium. The cooling block support mechanism is used to support the cooling block 20. The cooling channel 21 is arranged in the cooling block 20, and the cooling channel 21 is connected to the coolant circulation transmission pipeline. The coolant circulation transmission pipeline injects flowing cooling liquid into the cooling channel 21, and the cooling liquid is deionized water or liquid nitrogen, etc. The solid heat exchange medium 31 has a heat exchange surface 311 and a folding surface 312 integrally connected to the heat exchange surface 311. The heat exchange surface 311 is attached to the first side surface of the cooling block 20, and the folding surface 312 is attached to the upper surface of the cooling block 20. The liquid heat exchange medium 32 is filled in the heat exchange gap 40 between the cooling block 20 and the optical element 10.

[0046] It should be noted that the beamline mirror box provided in this application can be applied to an optical transmission system. The optical transmission system may further include a light source (such as a synchrotron radiation light source). The beamline mirror box is arranged outside the light source, and the light emitted by the light source is processed into a beam that meets the experimental requirements through the optical element 10 in the mirror box. Specifically, the light emitted by the light source is called "white light", which contains a wide range of wavelengths from infrared rays to X-rays. According to the experimental requirements, these lights are processed (including steps such as spectral splitting, collimation, and focusing) through the optical element 10 of the beamline mirror box to form monochromatic light with specific spectral energy, photon flux, energy resolution, polarization characteristics, beam spot size, and other parameters, and the monochromatic light is transmitted to the experimental sample.

[0047] Please refer to Figure 5 , Figure 5 is a schematic flow chart of a cooling structure assembly method for a beamline mirror box provided by an embodiment of this application. As Figure 5 shown, a cooling structure assembly method for a beamline mirror box provided by an embodiment of this application includes the following steps S1 - S5: S1. Obtain the solid heat exchange medium 31, and the solid heat exchange medium 31 has a heat exchange surface 311 and a folding surface 312 integrally connected to the heat exchange surface 311; S2. Attach the heat exchange surface 311 to the first side surface of the cooling block 20, and attach the folding surface 312 to the upper surface of the cooling block 20; S3. Fix the position of the optical element 10 through the first clamping mechanism; S4. Oppose the first side surface of the cooling block 20 to the heat exchange area on the optical element 10, and reserve a heat exchange gap 40, and fix the position of the cooling block 20 through the second clamping mechanism; S5. Drop the liquid heat exchange medium 32 on the folding surface 312 of the solid heat exchange medium 31, so that the liquid heat exchange medium 32 flows along the solid heat exchange medium 31 and fills the heat exchange gap 40.

[0048] In a possible implementation manner, after dropping the liquid heat exchange medium 32 on the folding surface 312 of the solid heat exchange medium 31, it further includes: when the liquid heat exchange medium 32 in the heat exchange gap 40 starts to accumulate on the folding surface 312, stop dropping the liquid heat exchange medium 32.

[0049] In a possible implementation manner, after opposing the first side surface of the cooling block 20 to the heat exchange area on the optical element 10, it further includes: adjusting the distance of the heat exchange gap 40 between the cooling block 20 and the heat exchange area, and after the heat exchange gap 40 meets the preset distance threshold condition, fix the position of the cooling block 20 through the second clamping mechanism.

[0050] In a possible implementation manner, the solid heat exchange medium 31 is an indium film, and the liquid heat exchange medium 32 is an indium gallium alloy. During the implementation of the cooling structure assembly, the indium film can be connected to the surface of the cooling block 20 by electroplating or pressing. Taking electroplating as an example, first electroplate the indium film on the first side surface of the cooling block 20. At this time, there is a vacant part on the upper side of the indium film, and then fold the vacant part towards the upper surface of the cooling block 20 and electroplate it on the upper surface of the cooling block 20. In this way, the fitted indium film includes a heat exchange surface 311 fitted on the side surface of the cooling block 20 and a folding surface 312 fitted on the upper surface of the cooling block 20. Then, fix the optical element 10 through the first clamping mechanism, and fix the cooling block 20 on the heat exchange area of the optical element 10 through the second clamping mechanism, and ensure that there is a heat exchange gap 40 between the cooling block 20 and the optical element 10; then, estimate the approximate amount of indium gallium alloy, drop the indium gallium alloy on the folding surface 312 of the indium film, and the indium gallium alloy flows into and fills the heat exchange gap 40 under the action of gravity. Since the indium film has good wettability to the indium gallium alloy, the indium gallium alloy can spread evenly and rapidly on the heat exchange surface 311 of the indium film, and then fill the heat exchange gap 40 between the cooling block 20 and the optical element 10, and it is not easy to generate local bubbles. When the gap is filled, the indium gallium alloy starts to accumulate on the folding surface 312, indicating that the indium gallium alloy filling is sufficient, and the indium gallium alloy filling can be stopped.

[0051] In a possible implementation scenario, the thickness of the indium film / foil selected for assisting the assembly of the liquid indium gallium alloy does not exceed 10 μm. Because the indium film / foil will gradually dissolve in indium gallium during the long-term service after assembly, and will be completely replaced by indium gallium later, and completely fill the specified position. The dissolution process causes changes in the indium gallium content, which may reduce the fluidity of indium gallium. Therefore, to avoid this problem, the indium film / foil should not be selected with too large a thickness, and only ensure that it can play a role during the assembly process, and it does not need to play a long-term role after assembly. Therefore, it is recommended to select an indium film / foil with a relatively thin thickness as much as possible or directly electroplate an indium film / foil with a micron-level thickness during the assembly process. The actual thickness of indium gallium in the gap is about in the order of hundreds of microns, and the incorporation of an indium film / foil with a thickness of several microns or even sub-microns will not have a significant impact on its fluidity.

[0052] Based on the solution of the embodiment of the present application, the filling operation of the liquid heat exchange medium 32 becomes simple and has high fault tolerance. Only a fixed amount of the liquid heat exchange medium 32 needs to be dropped in the area of the fixed folding surface 312, without moving the dropping area or strictly requiring the dropping speed; the solid heat exchange medium 31 is used as the path guide for the liquid heat exchange medium 32, so that the liquid heat exchange medium 32 can better completely cover and fill the specified area; first assemble and then fill, which can more accurately control the gap size, and greatly improve the safety, reducing the dripping risk during the assembly process; setting the folding surface 312 can also be used as a flow buffer area for the liquid heat exchange medium 32. When the liquid heat exchange medium 32 is injected in excess, or the interface gap becomes smaller during the movement process, the liquid heat exchange medium 32 in the gap will not drip first after being extruded, but will flow onto the folding surface 312 and accumulate, and can flow back into the gap when the gap size is restored, further improving the system safety.

[0053] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the above implementation manner. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present application, and these equivalent deformations or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A cooling structure for a beamline mirror box, characterized in that, It includes an optical element, a cooling block and a heat exchange medium. Among them, a heat exchange area is provided on the optical element. The first side surface of the cooling block is disposed opposite to the heat exchange area. There is a heat exchange gap between the first side surface of the cooling block and the heat exchange area to accommodate the heat exchange medium. The first side surface of the cooling block is indirectly in contact with the heat exchange area through the heat exchange medium; The heat exchange medium includes a solid heat exchange medium and a liquid heat exchange medium. The solid heat exchange medium has a heat exchange surface and a folded surface integrally connected to the heat exchange surface. The heat exchange surface is attached to the first side surface of the cooling block, and the folded surface is attached to the upper surface of the cooling block. The liquid heat exchange medium is filled in the heat exchange gap.

2. The cooling structure according to claim 1, wherein The solid heat exchange medium is a solid indium film.

3. The cooling structure according to claim 1, wherein The liquid heat exchange medium is a liquid indium-gallium alloy.

4. The cooling structure according to claim 1, characterized in that The solid heat exchange medium is attached to the surface of the cooling block by electroplating or thin film pressing.

5. The cooling structure according to claim 1, wherein At least part of the upper surface of the cooling block is covered by the folded surface; the effective cooling area on the first side surface of the cooling block is covered by the heat exchange surface.

6. A beamline mirror box, characterized in that, The beam line mirror box includes the cooling structure according to any one of claims 1-5.

7. A method for assembling a cooling structure for a beamline mirror box, characterized in that, It includes the following steps: Obtain a solid heat exchange medium, which has a heat exchange surface and a folded surface integrally connected to the heat exchange surface; Attach the heat exchange surface to the first side surface of the cooling block, and attach the folded surface to the upper surface of the cooling block; Fix the position of the optical element through the first clamping mechanism; Oppose the first side surface of the cooling block to the heat exchange area on the optical element, and reserve a heat exchange gap, and fix the position of the cooling block through the second clamping mechanism; Drop the liquid heat exchange medium on the folded surface of the solid heat exchange medium, so that the liquid heat exchange medium flows along the solid heat exchange medium and fills the heat exchange gap.

8. The method according to claim 7, wherein After dropping the liquid heat exchange medium on the folded surface of the solid heat exchange medium, the method further includes: When the liquid heat exchange medium in the heat exchange gap begins to accumulate on the folded surface, stop dropping the liquid heat exchange medium.

9. The method according to claim 7, characterized in that, After opposing the first side surface of the cooling block to the heat exchange area on the optical element, the method further includes: Adjust the distance between the cooling block and the heat exchange area, and after the heat exchange gap meets the preset distance threshold condition, fix the position of the cooling block through the second clamping mechanism.

10. The method according to claim 7, characterized in that, The solid heat exchange medium is a solid indium film, the thickness of the solid indium film does not exceed 10 μm, and the solid indium film dissolves itself after assembly is completed.

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