Die pressing plate for bonding circuit connection lead

Abstract

The invention relates to the technical field of mold pressing plates, in particular to a mold pressing plate for circuit connection lead bonding, which comprises a mold pressing plate body, a vacuum pump is fixedly connected to the outer wall of one side of the mold pressing plate body, and a controller is fixedly connected to the outer wall of one side of the mold pressing plate body and located on one side of the vacuum pump. And the output end of the vacuum pump is fixedly connected with an exhaust pipe, the input end of the vacuum pump is fixedly connected with an exhaust pipe, a pressure sensor is fixedly connected to the position, located on one side of the exhaust pipe, of the inner wall of the mold pressing plate body, and the interior of the exhaust pipe is rotationally connected with an electric valve. The electronic component is pressed to the surface of the air suction pipe, so that the electronic component is fixed, the phenomenon that the bonding effect is affected due to movement during lead bonding is avoided, correspondingly, the electronic component is fixed to the air suction pipe by atmospheric pressure, non-contact fixing is achieved, and the situation that the electronic component is crushed when the electronic component is fixed through a movable plate, and the service life of the electronic component is prolonged is avoided. Therefore, the protectiveness of the electronic component is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of die pressing plates, and particularly relates to a die pressing plate for circuit connection wire bonding. Background Art

[0002] A die pressing plate for circuit connection wire bonding is a key tool for assisting the wire bonding process in the fields of semiconductor packaging and microelectronics manufacturing. Its core function is to ensure high-quality electrical connection between the chip and the substrate or lead frame by applying uniform pressure and precise positioning.

[0003] However, the following problems still exist when using traditional devices: The patent with the publication number CN222051698U discloses a wire bonding machine pressing plate mechanism. This wire bonding machine pressing plate mechanism can press electronic components with different thicknesses, has a simple structure and is easy to use, improves the practicability of the device, can also press electronic components with different lengths, and can press the four sides of the electronic components at the same time, improving the stability of the connection of the electronic components.

[0004] In the prior art, the above-mentioned fixing of the electronic component is to use a moving plate to fix on both sides of the electronic component. If the force is not controlled well, it is easy to damage the four sides of the electronic component, resulting in the scrapping of the electronic component. Therefore, we need a die pressing plate for circuit connection wire bonding to solve the problem that the moving plate is easy to damage the electronic component pressing plate when the force is not controlled well, and can avoid damaging the electronic component when fixing the electronic component. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a die pressing plate for circuit connection wire bonding, which has the advantage of being able to avoid damaging the electronic component when fixing the electronic component.

[0006] To achieve the above purpose, the present invention provides the following technical solutions: It includes a die pressing plate body. An outer wall of one side of the die pressing plate body is fixedly connected with a vacuum pump. An outer wall of one side of the die pressing plate body and on the side of the vacuum pump is fixedly connected with a controller. An output end of the vacuum pump is fixedly connected with an exhaust pipe. An input end of the vacuum pump is fixedly connected with a suction pipe. An inner wall of the die pressing plate body and on the side of the suction pipe is fixedly connected with a pressure sensor. An electric valve is rotatably connected inside the suction pipe. A cavity is formed inside the die pressing plate body, and a heat dissipation cavity is formed above the inside of the die pressing plate body.

[0007] Preferably, mounting grooves are formed in the outer walls on both sides of the die pressing plate body, a base is fixedly connected inside the mounting groove, a rotating shaft is rotatably connected inside the base, and a gear is fixedly connected to the outer wall of the rotating shaft.

[0008] Preferably, strip-shaped grooves are formed in the outer walls on both sides of the die pressing plate body on one side of the mounting groove, a sealing plate is slidably connected inside the strip-shaped groove, a second sealing pad is fixedly connected to the outer wall of the bottom of the sealing plate, a groove is formed in the outer wall of one side of the sealing plate, the outer wall of the gear is movably inserted into the groove, cleaning brushes are fixedly connected to the outer walls at both ends of the top of the sealing plate, and the outer wall of the top of the cleaning brush is movably in contact with the upper inner wall of the strip-shaped groove.

[0009] Preferably, an air suction pipe is fixedly connected to the upper inner wall of the cavity, the outer wall of the air suction pipe is fixedly connected through the inside of the heat dissipation cavity, ceramic fiber is movably in contact with the outer wall of the top of the die pressing plate body, a silica gel layer is fixedly connected to the outer wall of the top of the ceramic fiber, and the outer wall of the bottom of the ceramic fiber is movably in contact with the outer wall of the top of the air suction pipe.

[0010] Preferably, an electronic component is fixedly connected to the outer wall of the top of the silica gel layer, solder balls are welded to the outer wall of the top of the electronic component, and lead bodies are welded to the outer walls of the tops of the two solder balls.

[0011] Preferably, a socket is fixedly connected to the lower inner wall of the cavity, a housing is fixedly connected to the upper inner wall of the cavity, a T-shaped push rod is slidably connected inside the housing, a mounting plate is fixedly connected to the outer wall of the bottom of the T-shaped push rod, a heating plate is fixedly connected inside the mounting plate, a plug is electrically connected to the outer wall of the bottom of the heating plate, the outer wall of the bottom of the plug is movably inserted into the inside of the socket, and a power cord is electrically connected to the outer wall of the bottom of the socket.

[0012] Preferably, an air inlet is formed in the inner wall of the heat dissipation cavity close to one side of the exhaust pipe, the outer wall of one side of the air inlet is fixedly connected to one end of the outer wall of the exhaust pipe, and heat dissipation holes are formed in the outer wall of the other side of the heat dissipation cavity.

[0013] Preferably, a first sealing pad is fixedly connected to the outer wall of the T-shaped push rod, a first return spring is fixedly connected to the outer wall of the top of the T-shaped push rod, the outer wall of the top of the first return spring is fixedly connected to the upper inner wall of the housing, and a through hole is formed in the lower inner wall of the housing.

[0014] Preferably, an elastic block is connected to the outer wall of the bottom of the T-shaped push rod, a one-way valve is fixedly connected to the upper outer wall of one side of the housing, a connection hole is formed in the outer wall of the top of the T-shaped push rod, and the outer surface of the bottom of the connection hole is connected through the inside of the T-shaped push rod.

[0015] Preferably, a square groove is formed in the outer wall of one side of the T-shaped push rod, and a movable rod is slidably connected inside the square groove. A U-shaped frame is fixedly connected to the inner wall of the T-shaped push rod outside the square groove. The outer wall of the U-shaped frame is slidably connected to the inside of the movable rod. A second return spring is fixedly connected to the inner wall of the U-shaped frame, and the outer wall of one end of the second return spring is fixedly connected to the inside of the movable rod.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: By pressing the electronic component against the surface of the suction pipe, the fixing of the electronic component is completed, avoiding movement during wire bonding and affecting the bonding effect. Correspondingly, the electronic component is fixed on the suction pipe by atmospheric pressure, realizing non-contact fixing and preventing the electronic component from being damaged when using the moving plate to fix the electronic component, thereby increasing the protection of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the present invention.

[0018] Figure 2 It is a schematic structural diagram of the controller of the present invention.

[0019] Figure 3 It is a schematic structural diagram of the silica gel layer of the present invention.

[0020] Figure 4 It is a schematic internal structure diagram of the mold pressing plate body of the present invention.

[0021] Figure 5 It is a schematic structural diagram of the cavity of the present invention.

[0022] Figure 6 For the present invention Figure 4 The enlarged structural diagram at position A.

[0023] Figure 7 It is a schematic structural diagram of the suction pipe of the present invention.

[0024] Figure 8 It is a schematic structural diagram of the mounting plate of the present invention.

[0025] Figure 9 It is a schematic internal structure diagram of the housing of the present invention.

[0026] Figure 10 It is a schematic internal structure diagram of the T-shaped push rod of the present invention.

[0027] Figure 11 For the present invention Figure 10 The enlarged structural diagram at position B.

[0028] Figure 12 It is a schematic cross-sectional view structure diagram of the movable rod of the present invention.

[0029] In the figure: 1. Mold pressing plate body; 11. Controller; 12. Vacuum pump; 13. Exhaust pipe; 14. Cavity; 15. Suction pipe; 16. Extraction pipe; 17. Pressure sensor; 18. Electric valve; 2. Electronic component; 21. Solder ball; 22. Lead body; 3. Sealing plate; 31. Cleaning brush; 32. Sealing gasket II; 33. Rotating shaft; 34. Gear; 35. Groove; 4. Power cord; 41. Mounting plate; 42. Socket; 43. Plug; 44. Heating plate; 5. Silicone layer; 51. Ceramic fiber; 6. Housing; 61. First reset spring; 62. T-shaped push rod; 63. Through hole; 64. Sealing gasket I; 7. Heat dissipation cavity; 71. Heat dissipation hole; 72. Air inlet; 8. Check valve; 81. Connection hole; 82. Elastic block; 83. Movable rod; 84. U-shaped frame; 85. Second reset spring. Specific implementation mode

[0030] In order to clearly and completely describe the purpose, technical solution of the present invention, and make the advantages more clear, the following further details the embodiments of the present invention with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, not to limit the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] Embodiment 1, please refer to Figures 1 to 12 , the present invention provides a technical solution for a mold pressing plate for circuit connection wire bonding: including a mold pressing plate body 1, an outer wall of one side of the mold pressing plate body 1 is fixedly connected with a vacuum pump 12, an outer wall of one side of the mold pressing plate body 1 located on one side of the vacuum pump 12 is fixedly connected with a controller 11, an output end of the vacuum pump 12 is fixedly connected with an exhaust pipe 13, an input end of the vacuum pump 12 is fixedly connected with an extraction pipe 16, an inner wall of the mold pressing plate body 1 located on one side of the extraction pipe 16 is fixedly connected with a pressure sensor 17, an electric valve 18 is rotatably connected inside the extraction pipe 16, a cavity 14 is opened inside the mold pressing plate body 1, a heat dissipation cavity 7 is opened above the inside of the mold pressing plate body 1, mounting grooves are opened on outer walls of both sides of the mold pressing plate body 1, a base is fixedly connected inside the mounting grooves, a rotating shaft 33 is rotatably connected inside the base, a gear 34 is fixedly connected to an outer wall of the rotating shaft 33, a strip-shaped groove is opened on an outer wall of both sides of the mold pressing plate body 1 located on one side of the mounting grooves, a sealing plate 3 is slidably connected inside the strip-shaped groove, a sealing gasket II 32 is fixedly connected to an outer wall of the bottom of the sealing plate 3, a groove 35 is opened on an outer wall of one side of the sealing plate 3, and an outer wall of the gear 34 is movably inserted into the groove 35, cleaning brushes 31 are fixedly connected to outer walls of both ends of the top of the sealing plate 3, and an outer wall of the top of the cleaning brushes 31 is in movable contact with an upper inner wall of the strip-shaped groove.

[0032] It avoids that when the electronic component 2 is fixed by vacuum adsorption, the electronic component 2 will be slightly moved in the initial stage of fixation. Correspondingly, by limiting the electronic component 2, it can prevent the electronic component 2 from moving slightly when fixed, thereby increasing the stability of the electronic component 2. Then, the bottom of the blocking plate 3 has a sealing effect. When the blocking plate 3 is adjusted according to the width of the electronic component 2, the suction pipe 15 that is not below the electronic component 2 can be blocked to prevent gas from entering from the suction pipe 15 during vacuum adsorption and affecting the fixing effect of the electronic component 2. Then, the blocking plate 3 has a cleaning effect. When the blocking plate 3 moves, the inner wall of the mold pressing plate body 1 can be cleaned to prevent welding, glue, and metal debris from adhering to the mold pressing plate body 1 during the bonding process. Timely cleaning reduces the residual additives that cause short circuits in the electronic component 2. Then, the bottom of the blocking plate 3 is in close contact with the top of the silicone layer 5, so that the silicone layer 5 can be stably pressed above the suction pipe 15. The electronic component 2 is pressed against the surface of the air intake pipe 15, thereby completing the fixation of the electronic component 2, avoiding movement during wire bonding that would affect the bonding effect. Accordingly, the electronic component 2 is fixed to the air intake pipe 15 by atmospheric pressure, thereby achieving non-contact fixation and preventing the electronic component 2 from being crushed by a movable plate, thereby increasing the protection of the electronic component 2.

[0033] Embodiment 2, on the basis of embodiment 1, an air intake pipe 15 is fixedly connected to the upper part of the inner wall of the cavity 14, the outer wall of the air intake pipe 15 is fixedly connected to the inside of the heat dissipation cavity 7, the outer wall of the top of the mold platen body 1 is movably in contact with the ceramic fiber 51, the outer wall of the top of the ceramic fiber 51 is fixedly connected to the silicone layer 5, the outer wall of the bottom of the ceramic fiber 51 is movably in contact with the outer wall of the top of the air intake pipe 15, the outer wall of the top of the silicone layer 5 is fixedly connected to the electronic component 2, the outer wall of the top of the electronic component 2 is welded to the solder ball 21, and the outer walls of the tops of the two solder balls 21 are welded to the lead body 22.

[0034] The elastic buffering vacuum adsorption force of the silicone layer 5 itself can reduce the local stress concentration of the electronic component 2, thereby offsetting the slight deformation of the electronic component 2 caused by vacuum adsorption through the deformation ability of the silicone layer 5, and maintaining the flatness of the electronic component 2. The ceramic fiber 51 is in active contact with the suction pipe 15, and the ceramic fiber 51 is pressed on the top of the suction pipe 15 through the sealing plate 3. When the sealing plate 3 needs to be replaced, the sealing plate 3 can be moved to the two ends of the mold pressing plate body 1 to release the contact between the sealing plate 3 and the silicone layer 5, so that the silicone layer 5 can be replaced, thereby correspondingly improving the efficiency of replacing the silicone layer 5.

[0035] Embodiment 3, based on Embodiment 1, a socket 42 is fixedly connected to the lower part of the inner wall of the cavity 14, and a housing 6 is fixedly connected to the upper part of the inner wall of the cavity 14. A T-shaped push rod 62 is slidably connected inside the housing 6. An outer wall at the bottom of the T-shaped push rod 62 is fixedly connected to a mounting plate 41. A heating plate 44 is fixedly connected inside the mounting plate 41. A wire of the outer wall at the bottom of the heating plate 44 is connected to a plug 43. The outer wall at the bottom of the plug 43 is movably inserted into the inside of the socket 42. A wire of the outer wall at the bottom of the socket 42 is connected to a power cord 4. A sealing gasket 64 is fixedly connected to the outer wall of the T-shaped push rod 62. A first return spring 61 is fixedly connected to the outer wall at the top of the T-shaped push rod 62. The outer wall at the top of the first return spring 61 is fixedly connected to the upper part of the inner wall of the housing 6. A through hole 63 is formed in the lower part of the inner wall of the housing 6.

[0036] By supplying power to the heating plate 44, the heating plate 44 can work and dissipate heat. When the heat is transferred from the mold pressing plate body 1 to the electronic component 2, the electronic component 2 can be preheated, avoiding the thermal stress concentration caused by the temperature difference when the solder balls 21 and the lead bodies 22 are directly bonded at room temperature, which may lead to component cracking, delamination or lead detachment. Correspondingly, by preheating the electronic component 2 through the mold pressing plate body 1, the electronic component 2 and the solder balls 21 and the lead bodies 22 can reach a similar temperature before bonding, reducing the temperature gradient, thereby reducing the thermal stress and improving the reliability of the bonding.

[0037] Embodiment 4, based on Embodiment 1, an air inlet 72 is formed in the inner wall of the heat dissipation cavity 7 close to one side of the exhaust pipe 13. The outer wall on one side of the air inlet 72 is fixedly connected to the outer wall of one end of the exhaust pipe 13. A heat dissipation hole 71 is formed in the outer wall on the other side of the heat dissipation cavity 7.

[0038] Through the connection between the exhaust pipe 13 and the air inlet 72, the gas sucked in by the vacuum pump 12 can enter the inside of the heat dissipation cavity 7 through the air inlet 72 and finally be discharged from the heat dissipation hole 71. Thus, when the gas enters the inside of the heat dissipation cavity 7, the flow of the gas inside the heat dissipation cavity 7 can be accelerated, thereby driving the heat on the ceramic fiber 51, reducing the heat received by the ceramic fiber 51, and thus reducing the aging efficiency of the ceramic fiber 51 due to heat.

[0039] Embodiment 5. On the basis of Embodiment 1, an elastic block 82 is connected to the outer wall of the bottom of the T-shaped push rod 62, a one-way valve 8 is fixedly connected to the upper part of the outer wall of one side of the housing 6, a connection hole 81 is formed in the outer wall of the top of the T-shaped push rod 62, and the outer surface of the bottom of the connection hole 81 is connected through the interior of the T-shaped push rod 62. A square groove is formed in the outer wall of one side of the T-shaped push rod 62, a movable rod 83 is slidably connected to the interior of the square groove, a U-shaped bracket 84 is fixedly connected to the inner wall of the T-shaped push rod 62 on the outer wall of the square groove, the outer wall of the U-shaped bracket 84 is slidably connected to the interior of the movable rod 83, and a second return spring 85 is fixedly connected to the inner wall of the U-shaped bracket 84. One end of the second return spring 85 is fixedly connected to the interior of the movable rod 83.

[0040] By exhausting the air inside the T-shaped push rod 62, when the pressure inside the cavity 14 is lower than the preset value, the adsorption force of the suction pipe 15 on the electronic component 2 is increased, causing the electronic component 2 to deform. Correspondingly, when the low pressure inside the cavity 14 exceeds the preset value, gas can be injected into the cavity 14 to reduce the low pressure inside the cavity 14, thereby protecting the electronic component 2.

[0041] The working principle and usage process of the present invention: During operation, when bonding the circuit connection leads, first, the electronic component 2 is placed on the top of the mold pressing plate body 1, and then the operator rotates the circular handle on the rotating shaft 33 by hand. When the circular handle is stressed and rotates, the rotating shaft 33 will drive the gear 34 to rotate accordingly. Then, by using the movable insertion between the gear 34 and the groove 35, when the gear 34 rotates, it will drive the groove 35 to move, so that the plugging plate 3 drives the sealing gasket 32 and the cleaning brush 31 to move inside the square groove. When the opposite ends of the two plugging plates 3 contact the outer wall of the electronic component 2, the rotation of the circular handle can be stopped. At this time, the plugging plate 3 contacts the electronic component 2 to play a limiting role for the electronic component 2, avoiding the slight displacement of the electronic component 2 in the initial stage of fixation when using the vacuum adsorption effect to fix the electronic component 2. Correspondingly, by limiting the electronic component 2, the slight movement of the electronic component 2 during fixation can be prevented, thereby increasing the stability of the electronic component 2. Moreover, the bottom of the plugging plate 3 has a sealing effect. When the plugging plate 3 adjusts according to the width of the electronic component 2, it can block the suction pipe 15 that is not below the electronic component 2, preventing gas from continuously entering through the suction pipe 15 during vacuum adsorption and affecting the fixation effect of the electronic component 2. In addition, the plugging plate 3 has a cleaning function. When the plugging plate 3 moves, it can clean the inner wall of the mold pressing plate body 1, preventing welding, glue, and metal debris from adhering to the mold pressing plate body 1 during the bonding process, and reducing the short circuit of the electronic component 2 caused by the residual additives through timely cleaning. By using the tight contact between the bottom of the plugging plate 3 and the top of the silica gel layer 5, the silica gel layer 5 can be stably pressed above the suction pipe 15.

[0042] It should be noted that: in the absence of external driving force, the round handle will remain stationary and will not drive the rotating shaft 33 to rotate at will.

[0043] After the electronic component 2 is limited by the blocking plate 3, the vacuum pump 12 can be started to work, and then the vacuum pump 12 moves to make the air in the cavity 14 be exhausted by the exhaust pipe 16. When a low-pressure environment is formed inside the cavity 14, the pressure inside the cavity 14 is lower than the external atmospheric pressure. The external air pressure acts on the electronic component 2 through the suction pipe 15, so that the electronic component 2 is pressed against the surface of the suction pipe 15, thereby completing the fixing of the electronic component 2, avoiding movement during wire bonding, which affects the bonding effect, and correspondingly, the electronic component 2 is sucked by the atmosphere. The electronic components 2 are fixed on the suction pipe 15 by pressure to achieve non-contact fixation, which prevents the electronic components 2 from being crushed by the movable plate, thereby increasing the protection of the electronic components 2. The pressure sensor 17 can be set to detect the air pressure inside the cavity 14 in real time. When the air pressure exceeds the preset value, the pressure sensor 17 transmits the detected information to the controller 11. When the controller 11 receives the signal, it can send a control signal to control the electric valve 18 to close, thereby stopping the suction pipe 16 from continuing to evacuate the cavity 14.

[0044] Then, through the silicone layer 5 and ceramic fiber 51 arranged above the suction pipe 15, when the silicone layer 5 is fitted with the electronic component 2 and then the electronic component 2 is fixed by vacuum adsorption, the silicone layer 5 and the ceramic fiber 51 have the characteristics of elasticity and high temperature resistance. The elasticity of the silicone layer 5 itself buffers the vacuum adsorption force, thereby reducing the local stress concentration of the electronic component 2, so that the deformation ability of the silicone layer 5 offsets the slight deformation of the electronic component 2 caused by vacuum adsorption, and maintains the flatness of the electronic component 2. Then, the ceramic fiber 51 is in active contact with the suction pipe 15, and the ceramic fiber 51 is pressed on the top of the suction pipe 15 through the sealing plate 3. When the sealing plate 3 needs to be replaced, the sealing plate 3 can be moved to the two ends of the mold pressing plate body 1 to release the contact between the sealing plate 3 and the silicone layer 5, so that the silicone layer 5 can be replaced, which correspondingly improves the efficiency of replacing the silicone layer 5.

[0045] While evacuating the interior of the cavity 14 through the exhaust pipe 16, the air below the interior of the housing 6 is discharged through the T-shaped push rod 62, causing the T-shaped push rod 62 to push the mounting plate 41 downward under the action of low pressure. During the downward movement of the mounting plate 41, the heating plate 44 and the plug 43 can be driven to move downward accordingly. When the plug 43 is inserted into the socket 42 connected to the power cord 4, the heating plate 44 can be powered, enabling the heating plate 44 to operate and emit heat. When the heat is transferred from the mold pressing plate body 1 to the electronic component 2, the electronic component 2 can be preheated, avoiding the concentration of thermal stress caused by the temperature difference when the solder balls 21 and the lead bodies 22 are directly bonded at room temperature, which may lead to component cracking, delamination, or lead detachment. Correspondingly, by preheating the electronic component 2 through the mold pressing plate body 1, the electronic component 2, the solder balls 21, and the lead bodies 22 reach a similar temperature before bonding, reducing the temperature gradient, thereby reducing thermal stress and improving the reliability of bonding.

[0046] Furthermore, through the connection between the exhaust pipe 13 and the air inlet 72, the gas inhaled by the vacuum pump 12 can enter the interior of the heat dissipation cavity 7 through the air inlet 72 and finally be discharged from the heat dissipation holes 71. Thus, when the gas enters the interior of the heat dissipation cavity 7, the gas flow inside the heat dissipation cavity 7 can be accelerated, driving the heat on the ceramic fiber 51, thereby reducing the heat received by the ceramic fiber 51 and reducing the aging efficiency of the ceramic fiber 51 due to heat.

[0047] It should be noted that: when the vacuum pump 12 inhales gas through the exhaust pipe 16 and then discharges the gas through the compression and exhaust processes, a vacuum is formed inside the pump body. When the intake of gas through the exhaust pipe 16 stops, the gas inside the pump body has been compressed and stored in a closed space. Therefore, the exhaust pipe 13 can still continue to exhaust.

[0048] When the pressing force inside the cavity 14 exceeds the preset value, due to the strengthening of the low pressure, the T-shaped push rod 62 will exert pressure on the elastic block 82, causing the T-shaped push rod 62 to drive the movable rod 83 downward. When the movable rod 83 moves into contact with the housing 6, the housing 6 can be used to squeeze the movable rod 83, enabling the movable rod 83 to enter the interior of the T-shaped push rod 62, thereby discharging the air inside the T-shaped push rod 62. This avoids the increase in the adsorption force of the suction pipe 15 on the electronic component 2 and the deformation of the electronic component 2 when the pressure inside the cavity 14 is lower than the preset value. Correspondingly, when the low pressure inside the cavity 14 exceeds the preset value, gas can be injected into the cavity 14 to reduce the low pressure inside the cavity 14, thereby protecting the electronic component 2.

[0049] It should be noted that: through the setting of the one-way valve 8, only air is allowed to enter through the one-way valve 8; Through the plugging block provided on one side of the controller 11, after the electronic component 2 finishes working, the plugging block can be pulled out to allow air to enter the interior of the cavity 14.

[0050] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A die pressing plate for wire bonding in circuit connection, comprising a die pressing plate body (1), characterized in that: On one side of the outer wall of the mold pressing plate body (1), a vacuum pump (12) is fixedly connected. On one side of the outer wall of the mold pressing plate body (1) and located on the side of the vacuum pump (12), a controller (11) is fixedly connected. The output end of the vacuum pump (12) is fixedly connected with an exhaust pipe (13), and the input end of the vacuum pump (12) is fixedly connected with an air extraction pipe (16). On one side of the inner wall of the mold pressing plate body (1) where the air extraction pipe (16) is located, a pressure sensor (17) is fixedly connected. Inside the air extraction pipe (16), an electric valve (18) is rotatably connected. Inside the mold pressing plate body (1), a cavity (14) is formed, and above the inside of the mold pressing plate body (1), a heat dissipation cavity (7) is formed.

2. The die pressing plate for wire bonding in circuit connection according to claim 1, wherein: On the outer walls on both sides of the mold pressing plate body (1), installation grooves are formed. Inside the installation grooves, a base is fixedly connected. Inside the base, a rotating shaft (33) is rotatably connected. On the outer wall of the rotating shaft (33), a gear (34) is fixedly connected.

3. The die pressing plate for circuit connection wire bonding according to claim 2, characterized in that: On the outer walls on both sides of the mold pressing plate body (1) and located on one side of the installation grooves, strip-shaped grooves are formed. Inside the strip-shaped grooves, a sealing plate (3) is slidably connected. On the outer wall at the bottom of the sealing plate (3), a second sealing gasket (32) is fixedly connected. On one side of the outer wall of the sealing plate (3), a groove (35) is formed. Inside the groove (35), the outer wall of the gear (34) is movably inserted. At both ends of the top of the sealing plate (3), cleaning brushes (31) are fixedly connected. The outer wall at the top of the cleaning brushes (31) is in movable contact with the upper inner wall of the strip-shaped groove.

4. A mold pressing plate for circuit connection wire bonding according to claim 1, characterized in that: Above the inner wall of the cavity (14), an air suction pipe (15) is fixedly connected. The outer wall of the air suction pipe (15) is fixedly connected through the inside of the heat dissipation cavity (7). On the outer wall at the top of the mold pressing plate body (1), ceramic fiber (51) is in movable contact. On the outer wall at the top of the ceramic fiber (51), a silica gel layer (5) is fixedly connected. The outer wall at the bottom of the ceramic fiber (51) is in movable contact with the outer wall at the top of the air suction pipe (15).

5. A mold pressing plate for wire bonding in circuit connection according to claim 4, characterized in that: On the outer wall at the top of the silica gel layer (5), an electronic component (2) is fixedly connected. On the outer wall at the top of the electronic component (2), solder balls (21) are welded. On the outer walls at the top of the two solder balls (21), a lead body (22) is welded.

6. The die pressing plate for circuit connection wire bonding according to claim 1, characterized in that: Below the inner wall of the cavity (14), a socket (42) is fixedly connected. Above the inner wall of the cavity (14), a housing (6) is fixedly connected. Inside the housing (6), a T-shaped push rod (62) is slidably connected. On the outer wall at the bottom of the T-shaped push rod (62), a mounting plate (41) is fixedly connected. Inside the mounting plate (41), a heating plate (44) is fixedly connected. The outer wall at the bottom of the heating plate (44) is electrically connected to a plug (43). The outer wall at the bottom of the plug (43) is movably inserted into the inside of the socket (42). The outer wall at the bottom of the socket (42) is electrically connected to a power cord (4).

7. A mold pressing plate for wire bonding in circuit connection according to claim 1, characterized in that: An air inlet (72) is formed in the inner wall of the heat dissipation cavity (7) on the side close to the exhaust pipe (13). The outer wall on one side of the air inlet (72) is fixedly connected to the outer wall of one end of the exhaust pipe (13). A heat dissipation hole (71) is formed in the outer wall on the other side of the heat dissipation cavity (7).

8. A mold pressing plate for wire bonding in circuit connection according to claim 6, characterized in that: A first sealing gasket (64) is fixedly connected to the outer wall of the T-shaped push rod (62). A first return spring (61) is fixedly connected to the outer wall at the top of the T-shaped push rod (62). The outer wall at the top of the first return spring (61) is fixedly connected to the upper part of the inner wall of the housing (6). A through hole (63) is formed in the lower part of the inner wall of the housing (6).

9. A mold pressing plate for wire bonding in circuit connection according to claim 8, characterized in that: An elastic block (82) is connected to the outer wall at the bottom of the T-shaped push rod (62). A one-way valve (8) is fixedly connected to the upper part of the outer wall on one side of the housing (6). A connection hole (81) is formed in the outer wall at the top of the T-shaped push rod (62). The outer surface at the bottom of the connection hole (81) is connected through the interior of the T-shaped push rod (62).

10. A mold pressing plate for circuit connection wire bonding according to claim 9, characterized in that: A square groove is formed in the outer wall on one side of the T-shaped push rod (62). A movable rod (83) is slidably connected to the interior of the square groove. A U-shaped bracket (84) is fixedly connected to the outer wall of the inner wall of the T-shaped push rod (62) located on the outer wall of the square groove. The outer wall of the U-shaped bracket (84) is slidably connected to the interior of the movable rod (83). A second return spring (85) is fixedly connected to the inner wall of the U-shaped bracket (84). One end of the outer wall of the second return spring (85) is fixedly connected to the interior of the movable rod (83).

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