Wafer film expanding device and wafer testing equipment

Abstract

The invention provides a wafer film expanding device and wafer testing equipment, and relates to the technical field of wafer testing. According to the wafer film expanding device, buckle structures are additionally arranged on the structure of the wafer film expanding device, each buckle structure is provided with a clamping plate rotationally connected with the second bearing table, the clamping plates have the free state of being separated from the tested wafer and the clamping state of being clamped with a steel ring of the tested wafer, and the clamping plates are arranged to rotate when the second bearing table moves downwards; therefore, the free state is switched to the clamping state so as to support the film expanding pressing plate. Equivalently, the steel ring of the wafer to be tested is pressed tightly in an auxiliary manner by using the buckle structure in the film expansion process, so that the film expansion pressing plate is prevented from being deformed, the uniformity of wafer film expansion is ensured, and the film expansion effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and particularly to a wafer film expanding device and a wafer testing equipment. Background Art

[0002] In currently commonly used film expanding mechanisms, due to process requirements, the front part of the film expanding pressing plate needs to give way to the wafer entry path. And for the convenience of loading and unloading the wafer between the film expanding pressing plate and the wafer supporting plate, there are some areas between the film expanding pressing plate and the wafer supporting plate that are not fixed, and there need to be certain gaps in these areas for the wafer to pass through. These areas are in a cantilever state. Since the film expanding pressing plate is relatively thin, the rigidity of these areas is difficult to ensure. After long-term use, the film expanding pressing plate will be deformed, resulting in uneven film expansion during the pressing process, different chip gaps, and thus affecting the film expanding effect. Summary of the Invention

[0003] An object of the present invention is to provide a wafer film expanding device to solve the technical problem that the film expanding pressing plate in the prior art is prone to deformation, resulting in uneven film expansion.

[0004] A further object of the present invention is to improve the compatibility of the film expanding device.

[0005] Another object of the present invention is to provide a wafer testing equipment having a wafer film expanding device.

[0006] In particular, the present invention provides a wafer film expanding device, including:

[0007] A carrying component, including a first carrying platform and a second carrying platform arranged in sequence from bottom to top, and the second carrying platform is configured to move up and down relative to the first carrying platform controllably;

[0008] A support ring, penetrating the carrying component from top to bottom and connected to the first carrying platform;

[0009] A wafer supporting plate, installed on the second carrying platform and located on the circumferential side of the support ring;

[0010] A film expanding pressing plate, located above the wafer supporting plate and connected to the wafer supporting plate, and a gap is formed between the film expanding pressing plate and the wafer supporting plate. The wafer to be tested is configured to enter from the gap controllably and move above the support ring;

[0011] At least one snap structure, each of the snap structures having a clamping plate, the clamping plate being rotatably connected to the second carrier, the clamping plate having a free state separated from the wafer under test and a clamping state in which it is clamped to the steel ring of the wafer under test, the clamping plate being arranged to rotate when the second carrier moves downward, so as to switch from the free state to the clamping state to support the film expanding pressing plate.

[0012] Optionally, each of the snap structures further includes:

[0013] A bracket, mounted on the first carrier;

[0014] At least one guide wheel, mounted on the top of the bracket and abutting against the clamping plate to guide the clamping plate when the clamping plate rotates.

[0015] Optionally, the clamping plate has at least one plate-shaped cam portion and at least one hook, each of the plate-shaped cam portions abutting against at least one of the guide wheels, the hook being arranged to be clamped to the steel ring of the wafer under test when the clamping plate is in the clamping state.

[0016] Optionally, each of the snap structures further includes:

[0017] A base, mounted on the second carrier;

[0018] A rotating shaft, passing through the clamping plate and rotatably connected to the base at both ends.

[0019] Optionally, each of the snap structures further includes:

[0020] An elastic member, arranged vertically, with one end connected to the bracket and the other end connected to the clamping plate.

[0021] Optionally, it further includes a plurality of first quick-change structures, each of the first quick-change structures including a mounting seat connected to the support ring, at least one of the first quick-change structures including:

[0022] A magnetic member, mounted on the mounting seat, the magnetic member being arranged to adsorb to the first carrier when the mounting seat is located on the first carrier to mount the support ring on the first carrier.

[0023] Optionally, at least one of the first quick-change structures includes:

[0024] A positioning pin, mounted on the mounting seat, the positioning pin being arranged to penetrate into the positioning hole of the first carrier when the mounting seat is located on the first carrier to position the support ring.

[0025] Optionally, it further includes a plurality of second quick-change structures, and each of the second quick-change structures includes:

[0026] A fitting installed on the second carrier platform. The fitting has a limiting plate, and an avoidance groove is provided on the limiting plate;

[0027] A knob installed on the wafer support plate. The knob has a connecting rod. The knob is configured to be connected to the fitting when the connecting rod is rotated to be clamped under the limiting plate, and to be disengaged from the fitting when the connecting rod is rotated to be located in the avoidance groove.

[0028] Optionally, it further includes:

[0029] A plurality of lead screws arranged vertically and passing through the first carrier platform and the second carrier platform;

[0030] A first synchronous belt sleeved on the plurality of lead screws;

[0031] A first driving member connected to the first synchronous belt. The first driving member is configured to controllably drive the first synchronous belt to rotate, so as to drive the plurality of lead screws to drive the second carrier platform to move up and down.

[0032] Particularly, the present invention further provides a wafer testing device, including the wafer film expanding device according to any one of the above.

[0033] In the present invention, a buckle structure is newly added to the structure of the wafer film expanding device. Each buckle structure has a clamping plate rotatably connected to the second carrier platform. The clamping plate has a free state separated from the wafer to be measured and a clamping state clamped to the steel ring of the wafer to be measured. The clamping plate is configured to rotate when the second carrier platform moves downward, so as to switch from the free state to the clamping state to support the film expanding pressing plate. It is equivalent to using the buckle structure to assist in pressing the steel ring of the wafer to be measured during the film expanding process, preventing the film expanding pressing plate from deforming, ensuring the uniformity of wafer film expanding, and improving the film expanding effect.

[0034] Furthermore, in the present invention, the second quick-change structure includes a fitting and a knob. The fitting is installed on the second carrier platform. The fitting has a clamping plate, and an avoidance groove is provided on the clamping plate. The knob is installed on the wafer support plate. The knob has a connecting rod. The knob is configured to be connected to the fitting when the connecting rod is rotated to be clamped under the clamping plate, and to be disengaged from the fitting when the connecting rod is rotated to be located in the avoidance groove. The above technical solution realizes the quick replacement of the wafer support plate and the second carrier platform by adding the second quick-change structure, can meet the quick replacement of wafers of different sizes. In addition, only the knob needs to be turned during replacement, and there is no need to disassemble the screws, which improves the replacement efficiency and greatly reduces the difficulty of manual quick replacement.

[0035] Those skilled in the art will better understand the above and other objects, advantages and features of the present invention from the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings. Description of the Drawings

[0036] Some specific embodiments of the present invention will be described in detail hereinafter with reference to the accompanying drawings in an exemplary but not restrictive manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0037] Figure 1 is a schematic structural diagram of a wafer expanding film device according to an embodiment of the present invention from an angle;

[0038] Figure 2 is a schematic structural diagram of a wafer expanding film device according to an embodiment of the present invention from another angle;

[0039] Figure 3 is a schematic structural diagram of a buckle structure mounted on a second carrier according to an embodiment of the present invention;

[0040] Figure 4 is a schematic structural diagram of a buckle structure according to an embodiment of the present invention;

[0041] Figure 5 is a schematic structural diagram of a buckle structure clamped with a steel ring according to an embodiment of the present invention;

[0042] Figure 6 is a schematic structural diagram of a buckle structure separated from a steel ring according to an embodiment of the present invention;

[0043] Figure 7 is a schematic structural diagram of a support ring and a first quick-change structure according to an embodiment of the present invention;

[0044] Figure 8 is a schematic structural diagram of a second quick-change structure according to an embodiment of the present invention.

[0045] Reference Numerals:

[0046] 100 - Wafer film expanding device, 200 - Wafer to be measured, 10 - First carrier, 20 - Second carrier, 21 - Turntable, 22 - Mounting plate, 30 - Support ring, 40 - Wafer support plate, 50 - Film expanding pressing plate, 60 - Buckle structure, 70 - First quick-change structure, 80 - Second quick-change structure, 61 - Clamping plate, 62 - Bracket, 63 - Guide wheel, 64 - Base, 65 - Rotating shaft, 66 - Elastic member, 611 - Plate-shaped cam portion, 612 - Hook, 71 - Mounting seat, 72 - Positioning pin, 73 - Magnetic member, 81 - Fitting member, 811 - Limit plate, 812 - Avoidance groove, 82 - Knob, 821 - Connecting rod, 91 - First synchronous belt, 92 - Lead screw, 93 - First driving member, 94 - Second driving member, 95 - Second synchronous belt, 96 - Crossed roller bearing, 97 - Guide shaft, 98 - First synchronous pulley, 99 - Second synchronous pulley. Detailed implementation manners

[0047] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0048] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0049] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features, that is, include one or more of such features. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. When a certain feature "includes or contains" a certain or certain features it covers, unless otherwise specifically described, this indicates that other features are not excluded and other features may be further included.

[0050] Unless otherwise clearly defined and limited, terms such as "connection" and "installation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. Those of ordinary skill in the art should be able to understand the specific meanings of the above terms in the present invention according to specific circumstances.

[0051] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as those commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0052] The wafer film expanding device is used after the cutting process to evenly stretch the film of the wafer to be measured, so that the cut wafers to be measured are separated and evenly spaced apart by a certain distance. Its main function is to evenly stretch the film so that the spacing between the wafers to be measured is uniform, facilitating subsequent operations such as picking up, positioning, and detecting the wafers to be measured. The action process of the current wafer film expanding device is mainly that the pulling mechanism sends the wafer to be measured onto the wafer film expanding device, the film expanding pressing plate presses down on the steel ring of the wafer to be measured, and the supporting ring below supports the wafer to be measured, thereby realizing the stretching of the film.

[0053] Figure 1 It is a schematic structural diagram of a wafer film expanding device 100 according to an embodiment of the present invention from one angle. Figure 2 It is a schematic structural diagram of a wafer film expanding device 100 according to an embodiment of the present invention from another angle. Figure 3 It is a schematic structural diagram of a buckle structure 60 installed on a second carrier 20 according to an embodiment of the present invention. Figure 4 It is a schematic structural diagram of a buckle structure 60 according to an embodiment of the present invention. Figure 5 It is a schematic structural diagram of the buckle structure 60 being clamped with a steel ring according to an embodiment of the present invention. Figure 6 It is a schematic structural diagram of the buckle structure 60 being disengaged from the steel ring according to an embodiment of the present invention.

[0054] Such as Figures 1 to 6As shown, in a specific embodiment, the wafer expanding device 100 includes a carrying component, a support ring 30, a wafer support plate 40, an expanding press plate 50, and at least one snap structure 60. The carrying component includes a first carrying platform 10 and a second carrying platform 20 arranged in sequence from bottom to top, and the second carrying platform 20 is configured to move up and down relative to the first carrying platform 10 in a controlled manner. The support ring 30 penetrates the carrying component from top to bottom and is connected to the first carrying platform 10. The wafer support plate 40 is mounted on the second carrying platform 20 and is located on the circumferential side of the support ring 30. The expanding press plate 50 is located above the wafer support plate 40 and is connected to the wafer support plate 40, and a gap is formed between the expanding press plate 50 and the wafer support plate 40. The measured wafer 200 is configured to enter and move above the support ring 30 from the gap under control. Each snap structure 60 has a clamping plate 61, and the clamping plate 61 is rotatably connected to the second carrying platform 20. The clamping plate 61 has a free state separated from the measured wafer 200 and a clamping state in which it is clamped to the steel ring of the measured wafer 200. The clamping plate 61 is configured to rotate when the second carrying platform 20 moves downward, so as to switch from the free state to the clamping state to support the expanding press plate 50.

[0055] In this embodiment, the snap structure 60 is newly added to the structure of the wafer expanding device 100. It is equivalent to using the snap structure 60 to assist in pressing the steel ring of the measured wafer 200 during the expanding process, preventing the expanding press plate 50 from deforming, ensuring the uniformity of wafer expansion, and improving the expanding effect. In addition, by using the snap structure 60 to assist in expanding the film, the requirement for the stiffness of the expanding press plate 50 can be reduced, and the service life of the expanding press plate 50 is increased.

[0056] In this embodiment, the rotational power of the snap structure 60 is provided when the second carrying platform 20 moves along the Z-axis, which is linked to the downward pressure along the Z-axis. No additional power is required, the structure is simple and delicate, and no additional space is occupied.

[0057] When the expanding press plate 50 does not move downward, when the clamping plate 61 of the snap structure 60 is in the outward-expanded state, it does not contact the measured wafer 200, that is, it is in the free state. Refer to Figure 6 . When the second carrying platform 20 drives the expanding press plate 50 to move downward, it will also drive the rotation axis of the clamping plate 61 to move downward, thereby driving the clamping plate 61 to rotate clockwise until it is clamped to the steel ring of the measured wafer 200, that is, it is in the clamping state. Refer to Figure 5 .

[0058] In some embodiments, both the first carrying platform 10 and the second carrying platform 20 are square. The second carrying platform 20 includes a turntable 21 and a mounting plate 22, and the turntable 21 is rotatably connected to the mounting plate 22. The wafer support plate 40 is mounted above the turntable 21.

[0059] In some embodiments, each snap structure 60 further includes a bracket 62 and at least one guide wheel 63. The bracket 62 is mounted on the first carrier 10. At least one guide wheel 63 is mounted on the top of the bracket 62 and abuts against the clamping plate 61 to guide the clamping plate 61 when the clamping plate 61 rotates, so that the clamping plate 61 rotates more smoothly.

[0060] In some embodiments, the clamping plate 61 has at least one plate-shaped cam portion 611 and at least one hook 612. Each plate-shaped cam portion 611 abuts against at least one guide wheel 63, and the hook 612 is configured to be clamped with the steel ring of the wafer 200 to be measured when the clamping plate 61 is in the clamped state. See Figure 5 .

[0061] In some embodiments, each snap structure 60 includes two guide wheels 63, and the two guide wheels 63 are arranged at intervals. The clamping plate 61 includes two plate-shaped cam portions 611 and two hooks 612. Each guide wheel 63 corresponds to a clamping plate 61 and a plate-shaped cam portion 611. In this embodiment, by providing two hooks 612, the stability of the snap structure 60 clamped with the steel ring can be improved, and the deformation of the film expanding pressing plate 50 can be avoided.

[0062] In some embodiments, each snap structure 60 further includes a base 64 and a rotating shaft 65. The base 64 is mounted on the second carrier 20. The rotating shaft 65 passes through the clamping plate 61 and is rotatably connected to the base 64 at both ends. In this embodiment, the base 64 is split into two parts and is respectively mounted on opposite sides of the clamping plate 61. In other embodiments, the base 64 can also be provided as an integral body, which is equivalent to connecting the two parts in this embodiment, and can be specifically determined according to design requirements.

[0063] See Figure 3 and Figure 4 , the base 64 is mounted on the second carrier 20 by bolts, so that the base 64 can be driven to move downward when the second carrier 20 moves downward.

[0064] In some embodiments, each snap structure 60 further includes an elastic member 66. The elastic member 66 is arranged vertically, and one end is connected to the bracket 62 and the other end is connected to the clamping plate 61. In this embodiment, by providing the elastic member 66, the stability of the clamping plate 61 when rotating can be improved.

[0065] Figure 7 is a schematic structural diagram of the support ring 30 and the first quick-change structure 70 according to an embodiment of the present invention. As Figure 7As shown, the wafer expanding film device 100 further includes a plurality of first quick-change structures 70. Each first quick-change structure 70 includes a mounting base 71 connected to the support ring 30. At least one first quick-change structure 70 includes a magnetic member 73. The magnetic member 73 is mounted on the mounting base 71 and is configured to adsorb to the first carrier 10 when the mounting base 71 is located on the first carrier 10, so as to mount the support ring 30 on the first carrier 10. Here, the magnetic member 73 is a magnet. In this embodiment, the support ring 30 is mounted by means of magnet adsorption, which is convenient for disassembly and assembly. When disassembling, there is no need to loosen the screws, and the support ring 30 can be directly removed, improving the replacement efficiency of the support ring 30.

[0066] In some embodiments, at least one first quick-change structure 70 includes a positioning pin 72. The positioning pin 72 is mounted on the mounting base 71 and is configured to penetrate into the positioning hole of the first carrier 10 when the mounting base 71 is located on the first carrier 10, so as to position the support ring 30. In this embodiment, by providing the positioning pin 72, the support ring 30 can be positioned when the support ring 30 is mounted, making the installation more convenient.

[0067] In some embodiments, the plurality of first quick-change structures 70 can be arranged at intervals on the circumferential side of the support ring 30. Among the mounting bases 71 of two adjacent first quick-change structures 70, a magnetic member 73 is mounted in one mounting base 71, and a positioning pin 72 is mounted in the other mounting base 71. In other embodiments, a magnetic member 73 and a positioning pin 72 can also be mounted in each mounting base 71, and the specific selection is made according to the design requirements.

[0068] In some embodiments, each mounting base 71 is provided with a bolt hole, which is used as a backup. When the support ring 30 does not need to be frequently replaced, the support ring 30 can be fixed to the first carrier 10 through the bolt hole.

[0069] Figure 8 It is a schematic structural diagram of a second quick-change structure 80 according to an embodiment of the present invention. As Figure 8 shown, in some embodiments, the wafer expanding film device 100 further includes a plurality of second quick-change structures 80. Each second quick-change structure 80 includes a mating member 81 and a knob 82. The mating member 81 is mounted on the second carrier 20. The mating member 81 has a limiting plate 811, and the limiting plate 811 has an avoidance groove 812. The knob 82 is mounted on the wafer support plate 40. The knob 82 has a connecting rod 821. The knob 82 is configured to be connected to the mating member 81 when the connecting rod 821 is rotated to be clamped below the limiting plate 811, and to be disengaged from the mating member 81 when the connecting rod 821 is rotated to be located in the avoidance groove 812.

[0070] In this embodiment, by adding a second quick-change structure 80, the quick replacement of the wafer support plate 40 and the second carrier 20 is achieved, which can meet the quick replacement of wafers of different sizes, such as the replacement of 6-inch and 8-inch wafers. In addition, when replacing, only the knob 82 needs to be turned, and there is no need to disassemble the screws, which improves the replacement efficiency, greatly reduces the difficulty of manual quick replacement, and can reduce problems such as missing locking and non-locking that are prone to occur when manually disassembling and assembling screws, thus greatly improving the quality of mold change.

[0071] In some embodiments, referring to Figure 1 and Figure 2 , the wafer film expanding device 100 further includes a plurality of lead screws 92, a first synchronous belt 91 and a first driving member 93. The plurality of lead screws 92 are arranged vertically and penetrate through the first carrier 10 and the second carrier 20. The first synchronous belt 91 is sleeved on the plurality of lead screws 92. The first driving member 93 is connected to the first synchronous belt 91, and the first driving member 93 is configured to controllably drive the first synchronous belt 91 to rotate, so as to drive the plurality of lead screws 92 to drive the second carrier 20 to move up and down. Here, the first driving member 93 is a servo motor.

[0072] In some embodiments, the number of lead screws 92 is four, and the four lead screws 92 are located at the four corners of the first carrier 10 and the second carrier 20. A first synchronous pulley 98 is sleeved on each lead screw 92, the first synchronous belt 91 is sleeved on the first synchronous pulleys 98 of the four lead screws 92, and the first driving member 93 drives the first synchronous pulley 98 to drive, so as to drive the lead screw 92 to drive the second carrier 20 to move up and down.

[0073] In some embodiments, the wafer film expanding device 100 further includes a second synchronous belt 95, a second synchronous pulley 99, a second driving member 94, a crossed roller bearing 96 and a guide shaft 97. The crossed roller bearing 96 is installed on the first carrier 10, the second synchronous pulley 99 is connected to the crossed roller bearing 96, and is connected to the turntable 21 through at least one guide shaft 97. The second synchronous belt 95 is sleeved on the second synchronous pulley 99. The second driving member 94 is connected to the second synchronous belt 95 and is configured to drive the second synchronous belt 95 to drive the second synchronous pulley 99 to rotate, so as to drive the turntable 21 to rotate relative to the mounting plate 22 through the guide shaft 97, thereby adjusting the position of the wafer under test 200. This embodiment can meet the feeding requirements of the wafer under test 200 for rotating 90° or 180° and other angles through the above components, and can also be adjusted when the wafer under test 200 enters above the support ring 30, with stronger applicability and can meet more test requirements of the wafer under test 200. Here, the second driving member 94 is a servo motor.

[0074] In this embodiment, the first driving member 93 drives the first synchronous belt 91 to rotate, and the second synchronous belt 95 drives the lead screw 92 to operate, converting the rotational motion into a linear motion, thereby realizing the up and down motion of the second carrier 20 in the Z-axis direction. Additionally, the second driving member 94 drives the second synchronous belt 95 to rotate, realizing the rotational motion in the R-axis direction. Through the motions in the two directions of the Z-axis and the R-axis, the functions of film expansion and wafer angle correction are achieved.

[0075] This embodiment also provides a wafer testing device, and the wafer testing device includes the above-mentioned wafer film expanding device 100. Regarding the wafer film expanding device 100, details are not elaborated here one by one.

[0076] This embodiment designs a new wafer film expanding device 100. On the basis of realizing the basic wafer film expansion, a buckle structure 60 is added to ensure the uniformity of film stretching during the wafer film expansion process and increase the service life of the overall mechanism. Additionally, the convenience of changing the wafer type between 6-inch and 8-inch wafers is optimized, reducing the type-changing time, lowering the type-changing difficulty, and improving the overall efficiency of the device.

[0077] At this point, those skilled in the art should recognize that although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and determined to cover all these other variations or modifications.

Claims

1. A wafer film expanding device, characterized in that, Comprising: A carrying component, including a first carrying platform and a second carrying platform arranged in sequence from bottom to top, and the second carrying platform is configured to move up and down relative to the first carrying platform in a controlled manner; A support ring, penetrating the carrying component from top to bottom and connected to the first carrying platform; A wafer support plate, mounted on the second carrying platform and located on the circumferential side of the support ring; A film expanding pressing plate, located above the wafer support plate and connected to the wafer support plate, and a gap is formed between the film expanding pressing plate and the wafer support plate, and the measured wafer is configured to enter and move above the support ring from the gap under control; At least one snap structure, each snap structure having a clamping plate, the clamping plate is rotatably connected to the second carrying platform, the clamping plate has a free state separated from the measured wafer and a clamping state clamped to the steel ring of the measured wafer, and the clamping plate is configured to rotate when the second carrying platform moves downward, so as to switch from the free state to the clamping state to support the film expanding pressing plate.

2. The wafer film expanding device according to claim 1, wherein Each of the snap structures further includes: A bracket, mounted on the first carrying platform; At least one guide wheel, mounted on the top of the bracket and abutted against the clamping plate to guide the clamping plate when the clamping plate rotates.

3. The wafer film expanding device according to claim 2, wherein The clamping plate has at least one plate-shaped cam portion and at least one hook, each plate-shaped cam portion abuts against at least one of the guide wheels, and the hook is configured to be clamped to the steel ring of the measured wafer when the clamping plate is in the clamping state.

4. The wafer film expanding device according to claim 3, wherein, Each of the snap structures further includes: A base, mounted on the second carrying platform; A rotating shaft, penetrating the clamping plate and rotatably connected to the base at both ends respectively.

5. The wafer expanding film device according to claim 4, characterized in that, Each of the snap structures further includes: An elastic member, arranged vertically, with one end connected to the bracket and the other end connected to the clamping plate.

6. The wafer film expanding device according to any one of claims 1-5, characterized in that, It further includes a plurality of first quick-change structures, each first quick-change structure includes a mounting seat connected to the support ring, and at least one of the first quick-change structures includes: A magnetic member, mounted on the mounting seat, and the magnetic member is configured to adsorb to the first carrying platform when the mounting seat is located on the first carrying platform to mount the support ring on the first carrying platform.

7. The wafer film expanding device according to claim 6, wherein At least one of the first quick-change structures includes: A positioning pin, mounted on the mounting seat, and the positioning pin is configured to penetrate into the positioning hole of the first carrying platform when the mounting seat is located on the first carrying platform to position the support ring.

8. The wafer film expanding device according to any one of claims 1-5, characterized in that, It further includes a plurality of second quick-change structures, each second quick-change structure includes: A fitting, mounted on the second carrying platform, the fitting has a limiting plate, and the limiting plate has an avoidance groove; A knob, mounted on the wafer support plate, the knob has a connecting rod, and the knob is configured to be connected to the fitting when the connecting rod is rotated to be clamped under the limiting plate, and to be disengaged from the fitting when the connecting rod is rotated to be located in the avoidance groove.

9. The wafer expanding film device according to any one of claims 1-5, characterized in that, It further includes: A plurality of lead screws are arranged vertically and penetrate through the first bearing platform and the second bearing platform; A first synchronous belt is sleeved on the plurality of lead screws; A first driving member is connected to the first synchronous belt. The first driving member is configured to controllably drive the first synchronous belt to rotate, so as to drive the plurality of lead screws to drive the second bearing platform to move up and down.

10. A wafer testing device, characterized in that, It includes the wafer film expanding device according to any one of claims 1-9.

Images