Chip removal device and chip removal method

Abstract

The invention relates to the technical field of semiconductors, and discloses a chip removal device and a chip removal method. The chip removing device comprises a positioning module used for identifying and positioning the specific position of a to-be-processed chip on a working platform; the marking module is used for carrying out unique identification marking on the surface of each to-be-processed chip so as to ensure that each unique chip is tracked in the removal process; the detection module is used for detecting and recording specific information of chip surface defects; according to the positioning module, the device can accurately identify and position the position of each chip to be processed on the working platform, so that an accurate basis is provided for subsequent defect detection and removal. The surface of each chip is uniquely identified and marked through the marking module, the device can track each chip in the whole removal process, and the processing continuity and traceability are ensured.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a chip removal device and a chip removal method. Background Art

[0002] In the field of semiconductor manufacturing, various defects will inevitably occur during the production process of chips. These defects will affect the performance of the chips and even cause them to fail. Therefore, it is necessary to perform defect detection and removal processing on the chips to ensure the quality of the chips. Chip removal devices usually include functions of positioning, detecting, and removing defects, which can improve the chip production efficiency, reduce the labor cost, and enhance the product quality.

[0003] Currently, existing chip removal technologies mostly rely on manual operations or simple automated devices for defect detection and removal. Manual detection is not only inefficient but also has large errors, while simple automated devices lack sufficient intelligence and flexibility, and cannot accurately locate defects, implement effective repairs, and track the processed chips. At the same time, the prior art fails to achieve individualized tracking of each chip and selection of optimized processing solutions.

[0004] Existing technologies have certain limitations in dealing with high-precision chip removal tasks. Especially in a large-scale production environment, the deficiencies of existing methods in identifying and positioning specific chips and detecting surface defects will lead to low processing efficiency and low processing accuracy. In addition, the selection and execution of defect processing methods usually lack intelligent judgment and feedback, and lack the ability to track and individually process each independent chip. Therefore, an integrated and intelligent chip removal device is needed to improve the accuracy and efficiency of defect processing and solve the above technical problems. Summary of the Invention

[0005] The present invention provides a chip removal device and a chip removal method for solving the above-mentioned technical problems.

[0006] In a first aspect of the present invention, a chip removal device is provided. The chip removal device includes: A positioning module, which is used to identify and locate the specific position of the chip to be processed on the working platform; A marking module, which is used to perform unique identification marking on the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; A detection module, which is used to detect and record the specific information of the defects on the chip surface; wherein, the specific information of the defects on the chip surface includes the defect type, size, and distribution position; A removal module, which is used to select a corresponding removal tool according to the specific information of the chip surface defects recorded, and perform physical removal or repair operations on the to-be-processed chip after unique identification marking.

[0007] Optionally, in the first implementation manner of the first aspect of the present invention, the marking module is specifically used for: Obtain the identification information of the to-be-processed chip, extract the identification information, and obtain first feature data and second feature data; wherein, the identification information at least includes the manufacturer information of the to-be-processed chip and the chip model of the to-be-processed chip; Based on a preset graphic generation rule, convert the first feature data to generate a corresponding bar code; Based on a preset identification character generation rule, convert the second feature data to generate a corresponding identification character combination; Associate the bar code and the identification character combination to generate a unique identification tracking mark character for the to-be-processed chip; Based on the unique identification tracking mark character, perform unique identification marking on the surface of the to-be-processed chip to ensure tracking each unique chip during the removal process.

[0008] Optionally, in the second implementation manner of the first aspect of the present invention, the extracting the identification information to obtain first feature data and second feature data includes: Extract characters at multiple specified positions from the identification information of the to-be-processed chip to obtain a marked character combination; Based on the marked character combination, adaptively update and sort a standard symbol reference list to generate an updated symbol reference list; Use the updated symbol reference list to encode the identification information of the to-be-processed chip to obtain an encoded character combination; Based on a preset encoding character segmentation rule, segment the encoded character combination to obtain a first encoded string and a second encoded string; Based on a preset encoding string-identification information mapping table, decode and recover data from the first encoded string to obtain first feature data; Based on a preset encoding string-identification information mapping table, decode and recover data from the second encoded string to obtain second feature data.

[0009] Optionally, in the third implementation manner of the first aspect of the present invention, the adaptively updating and sorting a standard symbol reference list based on the marked character combination to generate an updated symbol reference list includes: Obtain a standard symbol reference list, and the standard symbol reference list contains numerical sequence identifiers and corresponding symbols; Retrieve the matching degree between the content of the combination of marked characters and the existing symbols in the standard symbol reference list, and mark the duplicate symbols to obtain the symbols that exclude the active state; Count the usage frequency of the remaining active state symbols, and construct a symbol selection sequence sorted from more to less usage frequency; With reference to the symbol selection sequence, reassign numerical sequence identifiers to the remaining active state symbols. After assigning new numerical sequence identifiers, reassign the symbols that exclude the active state to the unoccupied numerical sequence identifiers in order; Integrate all the re-sorted and newly assigned numerical sequence identifiers and corresponding symbols to generate an updated symbol reference list.

[0010] Optionally, in the fourth implementation manner of the first aspect of the present invention, the chip removal device further includes: a control module, and the control module is used to control the coordinated work of the positioning module, the marking module, the detection module and the removal module based on a preset control program to automatically remove the defects on the chip surface.

[0011] The second aspect of the present invention provides a chip removal method, and the chip removal method includes: Identify and locate the specific position of the chip to be processed on the working platform; Perform unique identification marking on the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; Detect and record the specific information of the defects on the chip surface; wherein, the specific information of the defects on the chip surface includes the defect type, size and distribution position; According to the recorded specific information of the defects on the chip surface, select the corresponding removal tool to perform physical removal or repair operations on the uniquely identified chip to be processed.

[0012] The third aspect of the present invention provides a chip removal device, including: a memory and at least one processor, and instructions are stored in the memory; the at least one processor calls the instructions in the memory so that the chip removal device executes the above-mentioned chip removal method.

[0013] The fourth aspect of the present invention provides a computer-readable storage medium, and instructions are stored in the computer-readable storage medium, and when it runs on a computer, it causes the computer to execute the above-mentioned chip removal method.

[0014] In the technical solution provided by the present invention, the beneficial effects are as follows: The present invention provides a chip removal device and a chip removal method. The chip removal device includes: a positioning module for identifying and positioning the specific position of the chip to be processed on the working platform; a marking module for uniquely identifying and marking the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; a detection module for detecting and recording the specific information of the chip surface defects; a removal module for selecting a corresponding removal tool according to the recorded specific information of the chip surface defects to perform physical removal or repair operations on the uniquely identified chip to be processed. The positioning module of the present invention enables the device to accurately identify and position the position of each chip to be processed on the working platform, thereby providing an accurate basis for subsequent defect detection and removal. By uniquely identifying and marking the surface of each chip through the marking module, the device can track each chip throughout the removal process to ensure the coherence and traceability of the processing. The detection module can detect and record the detailed information of the chip surface defects, such as the type, size, and distribution position of the defects, providing the necessary information for formulating personalized removal or repair strategies. The removal module selects a suitable removal tool according to the detected specific defect information and can perform targeted physical removal or repair operations, which not only improves the processing efficiency but also ensures the quality of the chip surface after processing. The automated operation of the device reduces the dependence on manual detection and processing, reduces the labor cost in the chip production process, and at the same time reduces errors caused by human operations. The automated and intelligent design of the device speeds up the speed of chip defect processing and has significant time efficiency advantages for mass-produced chips. Precise defect positioning and processing can significantly reduce the defect rate of the chip surface and improve the quality and reliability of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. is a schematic diagram of an embodiment of the chip removal device in an embodiment of the present invention; Figure 2 FIG. is a schematic diagram of an embodiment of the chip removal method in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] An embodiment of the present invention provides a chip removal device and a chip removal method. Terms such as "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "comprising" or "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0017] For ease of understanding, the specific process of the embodiment of the present invention will be described below. Please refer to Figure 1 , an embodiment of the chip removal device in the embodiment of the present invention includes: A positioning module, which is used to identify and locate the specific position of the chip to be processed on the working platform; A marking module, which is used to make a unique identification mark on the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; A detection module, which is used to detect and record the specific information of the chip surface defects; wherein, the specific information of the chip surface defects includes defect type, size, and distribution position; A removal module, which is used to select a corresponding removal tool to perform physical removal or repair operations on the uniquely identified chip to be processed according to the recorded specific information of the chip surface defects.

[0018] Specifically, in the embodiment of the present invention, the chip removal device is used to accurately remove or repair the defects on the surface of electronic chips. The following is a description of the specific functions and operation processes of the main modules of this device: Positioning module Function: The positioning module is responsible for accurately identifying and determining the specific position of each chip to be processed on the working platform. This step is a prerequisite for all subsequent processing operations, ensuring precise positioning ability.

[0019] Example: This module uses a machine vision system combined with image processing software. The camera captures the position and orientation of the chip on the working platform, and then the accurate coordinates of the chip are calculated through image recognition algorithms.

[0020] Marking module Function: The responsibility of the marking module is to make a unique identification mark on each chip to be processed, so that each chip can be independently tracked during the removal process.

[0021] For example, a unique serial number or QR code can be marked on the surface or edge of the chip through laser marking, ink jet coding or micro-etching technology.

[0022] Detection module Function: The detection module is used to scan the chip surface and record the defect information thereon, such as the type of defect (scratches, cracks, chips, etc.), size (large, medium, small), and the specific distribution location (the edge or central area of the chip), etc.

[0023] For example, a high-resolution scanning device is used, combined with defect recognition software to finely detect the chip surface, automatically identify different types of defects and generate a detailed report.

[0024] Removal module Function: The removal module decides to use appropriate tools (such as lasers, chemical etchants or precision grinding tools) to remove or repair defects based on the chip surface defect information provided by the detection module.

[0025] For example, if the defect is a small particle on the surface, the removal module uses a fine dust suction device to remove it; if it is a small crack, a precision laser tool is used for fine repair.

[0026] Through the collaborative work of the above modules, the chip removal device can automatically perform defect detection and repair operations on the chip, significantly improving production efficiency and processing quality. The whole process is automatically completed by the machine, greatly reducing the probability of human errors, and is applicable to large-scale electronic chip production and quality control processes.

[0027] Another embodiment of the chip removal device in the embodiment of the present invention includes: The marking module is specifically used for: Obtain the identification information of the chip to be processed, extract the identification information, and obtain first feature data and second feature data; wherein, the identification information at least includes the manufacturer information of the chip to be processed and the chip model of the chip to be processed; Based on a preset graphic generation rule, convert the first feature data to generate a corresponding bar code; Based on a preset identification character generation rule, convert the second feature data to generate a corresponding combination of identification characters; Associate the bar code and the combination of identification characters to generate a unique identification tracking mark character for the chip to be processed; Based on the unique identification tracking mark character, perform a unique identification mark on the surface of the chip to be processed to ensure tracking each unique chip during the removal process.

[0028] Specifically, in the chip removal device described in the embodiments of the present invention, the marking module is responsible for generating and applying a unique identification tracking mark character to the chip to be processed. The following are the detailed implementation steps: Obtain the identification information of the chip to be processed Information extraction: Obtain the identification information of each chip to be processed, which usually includes the manufacturer of the chip and the specific chip model. The information extraction is achieved by reading the existing code on the chip or obtaining it from the supporting manufacturing data.

[0029] Convert the first feature data Graphic barcode generation: Convert the extracted first feature data, that is, the manufacturer information of the chip, into a barcode format according to the preset graphic generation rules. This barcode encodes the source information of the chip.

[0030] Convert the second feature data Identification character combination generation: At the same time, the second feature data, that is, the chip model, is converted into a specific character combination according to the preset identification character generation rules. This set of characters provides a unique character representation for the chip model.

[0031] Associate the barcode and the identification character combination Generate a unique tracking mark character: Next, logically associate the generated barcode with the identification character combination to form a comprehensive tracking mark character. In this way, the mark character will contain the complete identification information of the chip.

[0032] Apply the unique tracking mark character The unique identification mark of the chip to be processed: Finally, use a suitable marking device (such as a laser engraving machine or an inkjet printer) to apply this unique tracking mark character on the surface of each chip to be processed. This kind of marking ensures that each unit can be independently tracked during the chip defect detection and removal process.

[0033] For example, if a chip comes from the manufacturer "Core Technology" and the model is "XKJ1234", the first data feature (manufacturer information) will generate a barcode, and the second data feature (chip model) is converted into a series of character combinations such as "XKJ-1-2-3-4". Then the two are combined to form a unique mark, such as the character combination is placed below the barcode. After application, this mark can be recognized by a scanning device during the chip processing to track the processing status of the chip.

[0034] In this way, the marking module in this embodiment not only significantly improves the traceability of the chip processing process, but also enhances the automation and informatization level of the entire production process.

[0035] In the embodiments of the present invention, beneficial effects: Unique identification and tracking: By generating unique identification and tracking marker characters on the chip to be processed, each unique chip can be tracked and identified during the chip removal process, ensuring accurate tracking and processing of each chip.

[0036] Identification information extraction and conversion: By obtaining the identification information of the chip to be processed, such as manufacturer information and chip model, and based on preset graphic generation rules and identification character generation rules, the identification information is converted into corresponding barcodes and combinations of identification characters, facilitating the unique identification and tracking of the chip.

[0037] Automated marking process: The application of the marking module can realize the fully automated process of extracting, converting, and generating marker characters for the identification information of the chip to be processed, reducing manual intervention and improving production efficiency and accuracy.

[0038] Generally speaking, the embodiments of the present invention provide a method for uniquely identifying and marking a chip to be processed through unique identification and tracking marker characters, so as to ensure accurate tracking and processing of each chip during the chip removal process, and improve the efficiency and accuracy of production management.

[0039] Another embodiment of the chip removal device in the embodiments of the present invention includes: The extraction of the identification information to obtain first feature data and second feature data includes: Extract characters at multiple specified positions from the identification information of the chip to be processed to obtain a combination of marker characters; Based on the combination of marker characters, adaptively update and sort the standard symbol reference list to generate an updated symbol reference list; Use the updated symbol reference list to encode the identification information of the chip to be processed to obtain an encoded character combination; Based on the preset encoding character segmentation rule, segment the encoded character combination to obtain a first encoded string and a second encoded string; Based on the preset encoding string-identification information mapping table, decode and recover the data of the first encoded string to obtain first feature data; Based on the preset encoding string-identification information mapping table, decode and recover the data of the second encoded string to obtain second feature data.

[0040] Specifically, in the embodiments of the present invention, the process of extracting and encoding the identification information of the chip to be processed allows the original identification information to be converted into feature data for subsequent generation of unique tracking markers. The implementation process is detailed as follows: Extract the combination of marker characters Extract characters from identification information: Extract characters from the original identification information of the chip to be processed at specified positions. These characters are usually located in specific areas of barcodes, QR codes, or chip encodings and are explicitly assigned during the production process.

[0041] Generate a symbol reference list Adaptive update sorting: Select a standard symbol reference list, which is a complete set of allowed characters, such as ASCII codes or other predefined character sets. Then adjust the character sorting according to the extracted marked character combinations to generate an updated symbol reference list.

[0042] Encode identification information Encode the identification information: Use the above updated symbol reference list to encode all or part of the identification information of the chip to be processed to obtain an encoded character combination containing all necessary information.

[0043] Split the encoded character combination Split the character combination: Split the encoded character combination into two parts according to preset rules to form a first encoded string and a second encoded string. The split can be performed based on rules such as the number of characters, specific delimiter symbols, or character types.

[0044] Decode the first feature data Decode the first set of encoded strings: Based on a preset encoded string - identification information mapping table, decode the first encoded string obtained by splitting back into the original data form to obtain the first feature data for marking, which is the manufacturer information.

[0045] Decode the second feature data Decode the second set of encoded strings: Similarly, decode the second encoded string according to the preset mapping table to restore it to the second feature data, which is usually the key information describing the specific chip model.

[0046] Furthermore, in the embodiments of the present invention, the process of extracting and encoding the identification information of a semiconductor chip specifically includes the following detailed steps: Extract the marked character combination Function: Extract specific characters from the identification information of the chip to be processed to form an initial character combination.

[0047] Implementation process: Identify and read the identification information on the chip, which usually exists in the form of barcodes, QR codes, or other encodings.

[0048] Extract characters from specific positions of the identification information according to predetermined character extraction rules. For example, extract the first 4 characters and the last 4 characters from a barcode, or extract characters from a specific area of a QR code.

[0049] Example: Extract the first 4 characters "1234" and the last 4 characters "5678" from the barcode "1234ABCD5678" on the chip to form the initial character combination "12345678".

[0050] Generate a symbol reference list Function: Generate and adaptively update a standard symbol reference list for subsequent coding processing.

[0051] Implementation process: Select a standard symbol reference list, such as the ASCII character set, which contains all possible characters.

[0052] According to the extracted marked character combination, perform an adaptive sorting on the symbol reference list. For example, prioritize the arrangement of commonly used characters or characters that appear frequently.

[0053] Example: If the characters "1" and "5" appear most frequently in the extracted marked character combination, then place "1" and "5" at the front in the symbol reference list, such as "15ABC...".

[0054] Encode identification information Function: Use the updated symbol reference list to encode the identification information of the chip to be processed and generate an encoded character combination.

[0055] Implementation process: Perform an encoding conversion on the extracted identification character combination according to the updated symbol reference list.

[0056] The position of each character in the symbol reference list determines its encoding value. Through searching and replacement, a new encoded character combination is generated.

[0057] Example: Convert each character in "12345678" according to the symbol reference list. For example, "1" corresponds to the encoding "001", generating the encoded character combination "001002003...".

[0058] Split the encoded character combination Function: Split the encoded character combination to form a first encoded string and a second encoded string.

[0059] Implementation process: Split the encoded character combination into two parts according to a preset rule. The splitting rule can be the number of characters, a specific delimiter symbol, or the character type, etc.

[0060] Example: Split the encoded character combination "001002003..." into two parts by every 6 characters, obtaining "001002" and "003...", which are used as the first encoded string and the second encoded string respectively.

[0061] Decode the first feature data Function: Decode the first encoded string back to the original data form to obtain the first feature data.

[0062] Implementation process: Based on the preset encoded string - identification information mapping table, decode the first encoded string to restore the original data.

[0063] Example: Decode "001002" according to the mapping table, restore it to the original character "12", and obtain the first feature data as "12".

[0064] Decode the second feature data Function: Decode the second encoded string back to the original data form to obtain the second feature data.

[0065] Implementation process: Similarly, based on the preset mapping table, decode the second encoded string to restore the original data.

[0066] Example: Decode "003..." according to the mapping table, restore it to the original character "34...", and obtain the second feature data as "34...".

[0067] Through this process, the original identification information is converted into a machine-readable format, thus providing a structured data source for chip marking. This system's extraction and encoding method enables the generation of a unique tracking mark for each chip from complex information and ensures the uniqueness and traceability of the mark. In the modernization and automation process of the electronics manufacturing business, this provides important technical support for quality control and supply chain management.

[0068] In the embodiments of the present invention, beneficial effects: Extraction and encoding processing of identification information: By extracting characters at specific positions from the original identification information of the chip to be processed and performing encoding processing, the original identification information is converted into a machine-readable format, providing a structured and easily processed data source for subsequent generation of unique tracking marks.

[0069] Structured feature data extraction: By decoding the encoded character combinations, the first feature data and the second feature data are obtained. These data usually contain specific feature information such as manufacturer information and chip model, which helps to identify the uniqueness of each chip.

[0070] Adaptive symbol reference list: Through the updated symbol reference list generated by adaptive update sorting, it can dynamically adjust the character sorting according to the specific identification information of the chip to be processed, ensuring the accuracy and uniqueness of encoding.

[0071] Traceability and uniqueness of unique tracking tags: Converting the original identification information into machine-readable feature data and generating unique identification tracking tag characters ensures the uniqueness and traceability of each chip, providing technical support for quality control and supply chain management.

[0072] In summary, the extraction and encoding method of this system provides strong support for the unique tracking tags of each chip, ensuring the uniqueness and traceability of the tags, which is of great significance in modern and automated electronic manufacturing operations.

[0073] Another embodiment of the chip removal device in the embodiment of the present invention includes: Based on the combination of the tag characters, adaptively update and sort the standard symbol reference list to generate an updated symbol reference list, including: Obtain the standard symbol reference list, and the standard symbol reference list contains numerical sequence identifiers and corresponding symbols; Retrieve the matching degree between the content of the combination of the tag characters and the existing symbols in the standard symbol reference list, and mark the duplicate symbols to obtain the symbols that exclude the active state; Count the usage frequencies of the remaining active state symbols, and construct a symbol selection sequence sorted from more to less usage frequencies; Referring to the symbol selection sequence, reassign numerical sequence identifiers to the remaining active state symbols. After assigning new numerical sequence identifiers, assign the symbols that exclude the active state to the unoccupied numerical sequence identifiers in order; Integrate all the re-sorted and newly assigned numerical sequence identifiers and corresponding symbols to generate an updated symbol reference list.

[0074] Specifically, in the embodiment of the present invention, the chip removal device includes a process aimed at updating the standard symbol reference list according to the combination of tag characters. The following are the specific steps to implement this process: Obtain the standard symbol reference list Symbol list acquisition: First, obtain a predefined standard symbol reference list, which contains a series of numerical sequence identifiers, and each numerical sequence identifier corresponds to a unique symbol (such as letters, numbers, special characters, etc.).

[0075] Retrieve the symbol matching degree Symbol matching retrieval: Check the presence and matching degree of each character in the combination of the tag characters in the standard symbol reference list. If a symbol appears repeatedly in the character combination, mark the corresponding symbol in the list to indicate that the symbol is temporarily not in the active state.

[0076] Count the usage frequencies Frequency statistics: For the remaining symbols that are in the active state (i.e., not marked), count their usage frequencies in the marked character combinations.

[0077] Construct a sequence sorted by frequency Construct a sorted sequence: According to the statistical results, construct a new symbol selection sequence in descending order of usage frequency.

[0078] Reassign numerical sequence identifiers Reassignment of numerical sequence identifiers: According to the new symbol selection sequence, reassign a numerical sequence identifier to each active symbol. This can optimize the order of the symbol reference list so that symbols with higher usage frequencies have lower numerical sequence identifiers.

[0079] Reassign numerical sequence identifiers to symbols in the excluded state Reassign numerical sequence: For the symbols marked as excluded from the active state during the previous retrieval process, reassign the unoccupied numerical sequence identifiers to these symbols according to the new sorting results.

[0080] Generate an updated reference list Integrate and generate a new list: Integrate the entire re-sorting and newly assigned numerical sequence identifiers and corresponding symbols obtained in the above process to generate an updated and brand-new symbol reference list.

[0081] Furthermore, in the embodiment of the present invention, the chip removal device includes a process of updating the standard symbol reference list according to the marked character combination. The specific steps are as follows: Obtain the standard symbol reference list Function: Obtain a predefined standard symbol reference list containing symbols and corresponding numerical sequence identifiers.

[0082] Implementation process: Read the predefined standard symbol reference list from the storage system. This list includes all possible characters and their corresponding numerical sequence identifiers, such as letters, numbers, special characters, etc.

[0083] The symbol reference list can be predefined, for example: {A: 1, B: 2,..., Z: 26, 0: 27, 1:28,..., 9: 36, @: 37, #: 38,...}.

[0084] Retrieve the symbol matching degree Function: Check the existence and matching degree of the characters in the marked character combination in the standard symbol reference list.

[0085] Implementation process: Traverse each character in the marked character combination and check whether it exists in the standard symbol reference list.

[0086] For symbols that repeatedly appear in a character combination, mark them in a list to identify that the symbol is temporarily not active.

[0087] Example: If the marked character combination is "ABCA1234", then mark "A" in the symbol reference list to mark its repeated occurrence.

[0088] Statistical usage frequency Function: To count the usage frequency of active symbols in the marked character combination.

[0089] Implementation process: Traverse each character in the marked character combination and count its occurrence frequency.

[0090] Only count symbols that are not marked as inactive.

[0091] Example: For the marked character combination "ABCA1234", the statistical result is: A: 2 times, B: 1 time, C: 1 time, 1: 1 time, 2: 1 time, 3: 1 time, 4: 1 time.

[0092] Construct a sequence sorted by frequency Function: To construct a new symbol selection sequence according to the usage frequency.

[0093] Implementation process: Sort in descending order according to the usage frequency of symbols and construct a new symbol selection sequence.

[0094] Example: The sorted sequence is: [A, 1, 2, 3, 4, B, C].

[0095] Reassign numerical sequence identifiers Function: To reassign numerical sequence identifiers to symbols according to the new symbol selection sequence.

[0096] Implementation process: According to the new symbol selection sequence, assign new numerical sequence identifiers to symbols starting from 1 in turn.

[0097] Assign lower numerical sequence identifiers to symbols with higher usage frequencies.

[0098] Example: The new assignment result is: {A: 1, 1: 2, 2: 3, 3: 4, 4: 5, B: 6, C: 7}.

[0099] Reassign numerical sequence identifiers to symbols with exclusion status Function: To reassign numerical sequence identifiers to symbols that were previously marked as having an exclusion status.

[0100] Implementation process: Assign unoccupied sequence identifiers to the symbols in the excluded state according to the new sorting result.

[0101] Example: If the unused sequence identifiers in the new symbol selection sequence are 8, 9, 10..., then assign these identifiers to the previously marked symbols, such as "@, #,...".

[0102] Generate an updated reference list Function: Integrate the re-sorted and newly assigned sequence identifiers and corresponding symbols to generate an updated symbol reference list.

[0103] Implementation process: Integrate the new symbol selection sequence and its assigned sequence identifiers into a new standard symbol reference list.

[0104] Example: The generated new list is: {A: 1, 1: 2, 2: 3, 3: 4, 4: 5, B: 6, C: 7, @: 8, #: 9,...}.

[0105] Through these detailed steps, the embodiments of the present invention can efficiently update the standard symbol reference list according to the marked character combinations, ensure the optimized allocation of symbols and sequence identifiers, improve the efficiency and accuracy of the encoding and decoding processes, and are applicable to data identification and management applications in semiconductor chip detection.

[0106] Specific implementation process example Taking the marked character combination "ABCA1234" as an example, the process of updating the standard symbol reference list is specifically described as follows: Obtain the standard symbol reference list Read the standard symbol reference list: {A: 1, B: 2, C: 3,..., Z: 26, 0: 27, 1: 28,..., 9: 36}.

[0107] Retrieve the symbol matching degree Check the characters in "ABCA1234": A: Appears 2 times, marked as inactive.

[0108] B: Appears 1 time.

[0109] C: Appears 1 time.

[0110] 1, 2, 3, 4: Each appears 1 time.

[0111] Statistical usage frequency Statistical frequency: A: 2 times.

[0112] B: once.

[0113] C: once.

[0114] 1: once.

[0115] 2: once.

[0116] 3: once.

[0117] 4: once.

[0118] Construct a sequence sorted by frequency The sorted sequence is: [A, 1, 2, 3, 4, B, C].

[0119] Reassign sequence identifiers New assignment result: A: 1 1: 2 2: 3 3: 4 4: 5 B: 6 C: 7 Reassign sequence identifiers for exclusion status symbols Symbols for exclusion status: @: 8 #: 9 Generate an updated reference list The newly generated list: {A: 1, 1: 2, 2: 3, 3: 4, 4: 5, B: 6, C: 7, @: 8, #: 9}.

[0120] Through the above steps, the adaptive update and sorting of the symbol reference list are achieved. This dynamic update method can enhance the efficiency of the encoding process. Especially when dealing with changes in the order and frequency of a large amount of data, it can improve the speed and accuracy of encoding and decoding operations. Applying this process in the chip removal device ensures the up-to-dateness of the identification symbols and the flexibility of the marked character combinations to meet various change requirements in the production process.

[0121] In the embodiments of the present invention, the beneficial effects are: Adaptive update and sorting: By retrieving the content of the marked character combination and matching it with the standard symbol reference list, and dynamically updating and reordering the symbol reference list according to the active status and usage frequency of the symbols, it better adapts to the actual changes and complexities of the identification information, improving the flexibility and adaptability of the encoding operation.

[0122] Improving the speed and accuracy of encoding operations: By adopting a dynamically updated method, the symbol reference list can be sorted and adjusted according to the actual situation, ensuring the up-to-dateness and flexibility of the symbols, thereby improving the speed and accuracy of encoding and decoding operations.

[0123] Adapting to the requirements of complex production processes: Applying this self-adaptive update and sorting process in the chip removal device can ensure that the identification symbols can flexibly adapt to various change requirements that occur in the production process, improving the efficiency and accuracy of production management.

[0124] In summary, the self-adaptive update and sorting method improves the flexibility and adaptability of encoding operations, can better adapt to the actual changes and complexity of identification information, enhances the speed and accuracy of encoding and decoding operations, and is of great significance in the modern production environment.

[0125] The chip removal device in the embodiments of the present invention has been described above. Next, the chip removal method in the embodiments of the present invention will be described. Please refer to Figure 2 , an embodiment of the chip removal method in the embodiments of the present invention includes: Identifying and locating the specific position of the chip to be processed on the working platform; Performing a unique identification mark on the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; Detecting and recording the specific information of the chip surface defects; wherein, the specific information of the chip surface defects includes the defect type, size and distribution position; According to the recorded specific information of the chip surface defects, selecting a corresponding removal tool to perform physical removal or repair operations on the chip to be processed with a unique identification mark.

[0126] The present invention also provides a chip removal device, which includes a memory and a processor. When the computer-readable instructions stored in the memory are executed by the processor, the processor executes the steps of the chip removal method in the above embodiments.

[0127] The present invention also provides a computer-readable storage medium, which can be a non-volatile computer-readable storage medium or a volatile computer-readable storage medium. Instructions are stored in the computer-readable storage medium. When the instructions run on a computer, the computer executes the steps of the chip removal method.

[0128] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated here.

[0129] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0130] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of various embodiments of the present invention.

Claims

1. A chip removal device, characterized in that, The chip removal device includes: A positioning module for identifying and positioning the specific position of the chip to be processed on the working platform; A marking module for uniquely identifying and marking the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; A detection module for detecting and recording the specific information of the chip surface defects; wherein, the specific information of the chip surface defects includes defect type, size, and distribution position; A removal module for selecting a corresponding removal tool to perform physical removal or repair operations on the uniquely identified chip to be processed according to the recorded specific information of the chip surface defects.

2. The chip removal device according to claim 1, wherein, The marking module is specifically used for: Obtaining the identification information of the chip to be processed, extracting the identification information, and obtaining first feature data and second feature data; wherein, the identification information at least includes the manufacturer information of the chip to be processed and the chip model of the chip to be processed; Converting the first feature data based on a preset graphic generation rule to generate a corresponding barcode; Converting the second feature data based on a preset identification character generation rule to generate a corresponding identification character combination; Associating the barcode and the identification character combination to generate a unique identification tracking mark character for the chip to be processed; Uniquely identifying and marking the surface of the chip to be processed based on the unique identification tracking mark character to ensure tracking of each unique chip during the removal process.

3. The chip removal device according to claim 2, wherein, The extracting the identification information to obtain first feature data and second feature data includes: Extracting characters at multiple specified positions from the identification information of the chip to be processed to obtain a marked character combination; Adaptive updating and sorting of the standard symbol reference list based on the marked character combination to generate an updated symbol reference list; Encoding the identification information of the chip to be processed using the updated symbol reference list to obtain an encoded character combination; Segmenting the encoded character combination based on a preset encoded character segmentation rule to obtain a first encoded string and a second encoded string; Decoding and data recovery of the first encoded string based on a preset encoded string-identification information mapping table to obtain first feature data; Decoding and data recovery of the second encoded string based on a preset encoded string-identification information mapping table to obtain second feature data.

4. The chip removal device according to claim 3, characterized in that, The adaptive updating and sorting of the standard symbol reference list based on the marked character combination to generate an updated symbol reference list includes: Obtaining the standard symbol reference list, which contains numerical sequence identifiers and corresponding symbols; Retrieving the matching degree of the content of the marked character combination with the existing symbols in the standard symbol reference list and marking the duplicate symbols to obtain the symbols in the excluded active state; Counting the usage frequencies of the remaining active state symbols and constructing a symbol selection sequence sorted from more to less usage frequencies; With reference to the symbol selection sequence, reassign numerical sequence identifiers to the remaining active state symbols. After the new numerical sequence identifiers are assigned, the symbols that exclude the active state are re-sequentially assigned the unoccupied numerical sequence identifiers in order. Integrate all the re-ordered and newly assigned numerical sequence identifiers and the corresponding symbols to generate an updated symbol reference list.

5. The chip removal device according to claim 1, wherein, The chip removal device further includes: a control module, which is used to control the coordinated work of the positioning module, the marking module, the detection module and the removal module based on a preset control program to automatically remove the defects on the chip surface.

6. A chip removal method, characterized in that, The chip removal method includes: Identify and locate the specific position of the chip to be processed on the working platform; Perform a unique identification mark on the surface of each chip to be processed to ensure tracking of each unique chip during the removal process; Detect and record the specific information of the chip surface defects; wherein, the specific information of the chip surface defects includes the defect type, size and distribution position; According to the recorded specific information of the chip surface defects, select the corresponding removal tool to perform physical removal or repair operations on the uniquely identified chip to be processed.

7. A chip removal device, characterized in that, The chip removal device includes: a memory and at least one processor, and instructions are stored in the memory; The at least one processor calls the instructions in the memory so that the chip removal device executes the chip removal method as claimed in claim 6.

8. A computer-readable storage medium having instructions stored thereon, characterized in that, When the instructions are executed by the processor, the chip removal method as claimed in claim 6 is implemented.

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