Resonant cavity antenna and electronic equipment

Abstract

The invention relates to the technical field of terminal equipment, in particular to a resonant cavity antenna and electronic equipment. The resonant cavity antenna is used for the electronic equipment with a metal shell, and the electronic equipment comprises an audio module. The resonant cavity antenna is provided with a closed internal cavity, and the internal cavity is used for being communicated with an audio cavity of the audio module to serve as a part of a sound cavity of the audio module. The resonant cavity antenna comprises a dielectric substrate, a metal sheet and a metal ground, the metal sheet and the metal ground are fixed on the dielectric substrate, the metal sheet and the metal ground are arranged at intervals, a grounding point of the metal sheet is conductively connected with the metal ground, a resonant cavity is formed between the metal sheet and the metal ground, and electromagnetic waves sent or received by the resonant cavity antenna can be reflected in the resonant cavity. The internal cavity is at least partially located between the metal sheet and the metal ground. According to the resonant cavity antenna, the volume expansion of the sound cavity of the audio module is realized by utilizing the structure of the resonant cavity antenna, and the sound effect of the audio module can be optimized.

Description

Technical Field

[0001] This application relates to the technical field of terminal devices, and particularly to a resonant cavity antenna and an electronic device. Background Art

[0002] At present, consumers have relatively high requirements for the appearance texture and thin and light experience of terminal devices. The structure of terminal devices has evolved from a sandwich architecture to an all-metal integrated design. The all-metal body of a terminal device is generally a seamless design, and a resonant cavity antenna can be selected to meet the communication requirements of the terminal device.

[0003] However, the resonant cavity antennas in the prior art usually have a relatively large physical structure, occupy a large space in the terminal device, and will compress the sound cavity space of the speaker module, affecting the sound effect of the speaker. Summary of the Invention

[0004] A resonant cavity antenna and an electronic device provided in an embodiment of this application. The resonant cavity antenna utilizes its own structure to expand the sound cavity of the audio module, and can optimize the sound effect of the audio module.

[0005] In a first aspect, this application provides a resonant cavity antenna. The resonant cavity antenna can be used in an electronic device to perform a communication function. The electronic device further includes an audio module for generating sound. The resonant cavity antenna has a closed internal cavity, and the internal cavity is used to communicate with the audio cavity of the audio module to serve as a part of the sound cavity of the audio module. The resonant cavity antenna includes a dielectric substrate, a metal sheet and a metal ground fixed to the dielectric substrate. The metal sheet and the metal ground are spaced apart, and the grounding point of the metal sheet is electrically connected to the metal ground. A resonant cavity is formed between the metal sheet and the metal ground, and the electromagnetic wave transmitted or received by the resonant cavity antenna can be reflected in the resonant cavity. At least part of the internal cavity is located between the metal sheet and the metal ground.

[0006] The above-mentioned resonant cavity antenna forms an internal cavity based on its own structure, and does not increase the space occupied by the resonant cavity antenna. The communication between the internal cavity and the audio cavity of the audio module can expand the sound cavity of the audio module, thereby improving the sound effect of the audio module and reducing the influence of the relatively large volume of the resonant cavity antenna on the space compression of the audio module.

[0007] Wherein, according to different antenna implementation forms, the metal sheet can be a steel sheet or a flexible printed circuit board FPC (flexible printed circuit Board).

[0008] In order to isolate the metal sheet from the metal ground, the dielectric substrate has opposite first and second surfaces. The metal sheet is fixed to the first surface of the dielectric substrate, and the grounding point of the metal sheet exposes the second surface of the dielectric substrate; the metal ground is fixed to the second surface of the dielectric substrate and is electrically connected to the grounding point of the metal sheet.

[0009] The internal cavity formed by the resonant cavity antenna may have various implementation manners.

[0010] In some possible implementation manners, the dielectric substrate includes a hollow that communicates the first surface and the second surface, and a metal sheet seals the opening of the hollow located on the first surface. The metal ground can seal the opening of the hollow located on the second surface. At this time, an internal cavity is formed between the metal sheet, the hollow of the dielectric substrate, and the metal ground. The structural member can be made of plastic material, and the structural member can be specifically disposed between the second surface of the dielectric substrate and the metal ground. In order for the grounding point of the metal sheet to be electrically connected to the metal ground, the structural member needs to avoid the grounding point of the metal ground so that the grounding point of the metal sheet is exposed on the second surface to be electrically connected to the metal ground. Among them, the metal sheet and the dielectric substrate can be formed by an integral injection molding process, and the metal ground and the structural member can be formed by an integral injection molding process, and then the structural member is connected to the dielectric substrate.

[0011] Alternatively, the dielectric substrate includes a hollow that communicates the first surface and the second surface, and a metal sheet seals the opening of the hollow located on the first surface. The resonant cavity antenna includes a structural member for sealing the opening of the hollow located on the second surface. An internal cavity is formed among the metal sheet, the hollow of the dielectric substrate, and the structural member. The structural member can also be made of metal material. The structural member made of metal material can have a relatively thin thickness. On the premise that the overall thickness of the resonant cavity antenna remains unchanged, a thinner structural member can expand the internal cavity, and further realize the expansion of the sound cavity when the internal cavity communicates with the audio cavity of the audio module. When the structural member is made of metal material such as a steel sheet, the grounding point of the metal sheet can be connected to the structural member, and the structural member is connected to the metal ground. The grounding point of the metal sheet is equivalent to being connected to the metal ground through the structural member.

[0012] In some possible implementation manners, the dielectric substrate includes an opening groove with an opening located on the first surface, and a metal sheet seals the opening of the opening groove located on the first surface. An internal cavity is formed between the metal sheet and the opening groove of the dielectric substrate. The internal cavity can be formed by an integral injection molding process of the metal sheet and the dielectric substrate.

[0013] In some possible implementation manners, the dielectric substrate includes an opening groove with an opening located on the second surface, and a metal ground seals the opening of the opening groove located on the first surface. An internal cavity is formed between the metal ground and the opening groove of the dielectric substrate. The metal sheet and the dielectric substrate can be formed by an integral injection molding process, and then the metal ground is fixed to the second surface of the dielectric substrate to seal the opening of the opening groove.

[0014] Alternatively, the dielectric substrate includes an opening groove with an opening on the second surface. The resonant cavity antenna includes a structural member that seals the opening of the opening groove on the first surface, and an internal cavity is formed between the structural member and the opening groove of the dielectric substrate. Among them, the metal sheet and the dielectric substrate can be formed by an integral injection molding process, and the metal ground and the structural member can be formed by an integral injection molding process, and then the structural member and the dielectric substrate are connected.

[0015] In some possible implementation manners, the dielectric substrate is a cavity structure, and the inner wall of the cavity structure forms an internal cavity.

[0016] In some possible implementation manners, the dielectric substrate includes a first substrate and a second substrate connected to each other; the surface of the first substrate facing away from the second substrate is the first surface, and the metal sheet can be fixed to the first substrate by an integral injection molding process. The surface of the second substrate facing away from the first substrate is the second surface, and the metal ground can be fixed to the second substrate by an integral injection molding process. It should be understood that according to different implementation manners in which the dielectric substrate has a cavity structure, has a hollow opening through the first surface and the second surface, or has an opening groove with an opening on the first surface or the second surface, the specific structures of the first substrate and the second substrate need to be adaptively adjusted accordingly.

[0017] In some possible implementation manners, the dielectric substrate includes a first connection port and a communication channel, and the communication channel is connected between the internal cavity and the first connection port, and the first connection port is used to communicate with the audio cavity of the audio module.

[0018] In some possible implementation manners, the metal sheet includes a top plate and pins connected to the top plate, and the pins are used as the grounding point of the metal sheet to connect to the metal ground. Among them, the end of the pin used to connect to the metal housing can be in surface contact with the metal housing to improve the contact reliability.

[0019] In some possible implementation manners, the grounding point of the metal sheet and the metal ground are connected by a conductive foam. The conductive foam can play a buffering role while performing the electrical connection function, and at the same time, the deformable characteristic of the conductive foam can make the connection between the metal housing and the metal sheet more tight and continuous.

[0020] In a second aspect, the present application provides an electronic device, which can be a device with communication functions and audio functions such as a mobile phone or a tablet computer. The resonant cavity antenna includes a dielectric substrate, a metal sheet and a metal ground fixed to the dielectric substrate. The metal sheet and the metal ground are arranged at intervals and the grounding point of the metal sheet is conductively connected to the metal ground, and a resonant cavity is formed between the metal sheet and the metal ground; the resonant cavity antenna includes a closed internal cavity, and at least part of the internal cavity is a part of the resonant cavity; the audio module has an audio cavity, and the audio cavity is connected to the internal cavity. The internal cavity can be used as a part of the sound cavity of the audio module to realize the expansion of the audio module.

[0021] In some possible implementations, the electronic device includes a metal housing, and a part of the metal housing serves as the metal ground of the cavity antenna.

[0022] In some possible implementations, the metal housing includes a metal outer shell and a metal middle frame perpendicular to the metal outer shell. The dielectric substrate is fixed to the metal outer shell; the surface of the dielectric substrate for fixing to the metal ground includes opposite first and second sides. The first side is adjacent to the metal middle frame, and the second side is opposite to the metal middle frame; the metal sheets for connecting the grounding points of the metal ground are distributed on the second side.

[0023] In some possible implementations, there is a gap between the cavity antenna and the metal middle frame, and the cavity antenna is used to transmit or receive electromagnetic waves through the gap.

[0024] In one possible implementation, the cavity antenna includes a first connection port that communicates with the internal cavity; the audio module includes a second connection port that communicates with the audio chamber, and the second connection port is hermetically connected to the first connection port. A sealing ring may be provided between the first connection port and the second connection port, and the sealing ring surrounds the channel formed by the communication of the first connection port and the second connection port. Among them, the sealing ring may be a sealing foam or a sealing rubber sleeve.

[0025] In one possible implementation, the audio module and the cavity antenna are arranged on the same layer. Along the arrangement direction of the audio module and the cavity antenna, the end face of the first connection port for docking with the second connection port is parallel to the end face of the second connection port for docking with the first connection port. When the audio module cooperates with the cavity antenna, the first connection port and the second connection port are arranged in the thickness direction of the electronic device, and they can be press-connected and sealed to improve the connection tightness.

[0026] In one possible implementation, the cavity antenna includes a first boss, and the audio module includes a second boss. The first boss and the second boss are overlapped and fixed along the direction perpendicular to the arrangement direction of the audio module and the cavity antenna. The first boss and the second boss can be fixedly connected to the metal housing of the electronic device through connectors such as bolts and screws in sequence.

[0027] In a third aspect, an electronic device is provided. The electronic device may be a device with communication functions and audio functions such as a mobile phone or a tablet computer. The electronic device in this application includes an audio module and any one of the cavity antennas provided in the first aspect above. The internal cavity of the cavity antenna can communicate with the audio module of the audio module to realize the expansion of the sound cavity. Among them, the structure of the cavity antenna may refer to the cavity antenna provided in the first aspect. Description of the Drawings

[0028] Figure 1aSchematic diagram of the structure of an electronic device provided by an embodiment of the present application;

[0029] Figure 1b Partial schematic diagram of the structure of an electronic device provided by an embodiment of the present application;

[0030] Figure 1c For Figure 1b Enlarged detail view at V1 in

[0031] Figure 2 Simplified schematic diagram of the co - cavity design of the resonant cavity antenna and the audio module of an electronic device provided by an embodiment of the present application;

[0032] Figure 3 Simplified schematic diagram of the partial cross - section of the resonant cavity antenna provided by an embodiment of the present application;

[0033] Figure 4a Schematic diagram of the structure of a resonant cavity antenna provided by Embodiment 1 of the present application;

[0034] Figure 4b Schematic diagram of the structure of a resonant cavity antenna provided by Embodiment 1 of the present application;

[0035] Figure 4c Exploded view of a resonant cavity antenna provided by Embodiment 1 of the present application;

[0036] Figure 4d Exploded view of a resonant cavity antenna provided by Embodiment 1 of the present application;

[0037] Figure 5 Partial cross - section structure schematic diagram of a resonant cavity antenna provided by Embodiment 1 of the present application;

[0038] Figure 6a Schematic diagram of the co - cavity design of the resonant cavity antenna and the audio module of an electronic device provided by Embodiment 1 of the present application;

[0039] Figure 6b For Figure 6a Enlarged detail view at V2 in

[0040] Figure 6c For Figure 6a Enlarged detail view at V3 in

[0041] Figure 6d Schematic diagram of the co - cavity design of the resonant cavity antenna and the audio module of an electronic device provided by Embodiment 1 of the present application;

[0042] Figure 7a Schematic diagram of the structure of the resonant cavity antenna and the audio module of an electronic device provided by Embodiment 1 of the present application;

[0043] Figure 7b Schematic diagram of the structure of a resonant cavity antenna and an audio module provided in Embodiment 1 of the present application;

[0044] Figure 7c Partial cross-sectional structure diagram of the co-cavity design of a resonant cavity antenna and an audio module provided in Embodiment 1 of the present application;

[0045] Figure 8a Partial structure diagram of an electronic device provided in Embodiment 1 of the present application;

[0046] Figure 8b Partial cross-sectional structure diagram of an electronic device provided in Embodiment 1 of the present application;

[0047] Figure 9 Simplified partial cross-sectional structure diagram of a resonant cavity antenna provided in Embodiment 2 of the present application;

[0048] Figure 10a Schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 2 of the present application;

[0049] Figure 10b Exploded view of a resonant cavity antenna provided in Embodiment 2 of the present application;

[0050] Figure 10c Exploded view of a resonant cavity antenna provided in Embodiment 2 of the present application;

[0051] Figure 11 Partial cross-sectional structure diagram of a resonant cavity antenna provided in Embodiment 2 of the present application;

[0052] Figure 12 Simplified partial cross-sectional structure diagram of a resonant cavity antenna provided in Embodiment 3 of the present application;

[0053] Figure 13a Schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 3 of the present application;

[0054] Figure 13b Schematic diagram of the structure of a resonant cavity antenna provided in Embodiment 3 of the present application;

[0055] Figure 13c Exploded view of a resonant cavity antenna provided in Embodiment 3 of the present application;

[0056] Figure 13d Exploded view of a resonant cavity antenna provided in Embodiment 3 of the present application;

[0057] Figure 14 Partial cross-sectional structure diagram of a resonant cavity antenna provided in Embodiment 3 of the present application;

[0058] Figure 15 Simplified partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 4 of the present application;

[0059] Figure 16 Exploded view of a resonant cavity antenna provided in Embodiment 4 of the present application;

[0060] Figure 17 Partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 4 of the present application;

[0061] Figure 18 Simplified partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 5 of the present application;

[0062] Figure 19 Exploded view of a resonant cavity antenna provided in Embodiment 5 of the present application;

[0063] Figure 20 Partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 5 of the present application;

[0064] Figure 21 Simplified partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 6 of the present application;

[0065] Figure 22a Exploded view of a resonant cavity antenna provided in Embodiment 6 of the present application;

[0066] Figure 22b Exploded view of a resonant cavity antenna provided in Embodiment 6 of the present application;

[0067] Figure 23 Partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 6 of the present application;

[0068] Figure 24 Simplified partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 7 of the present application;

[0069] Figure 25a Exploded view of a resonant cavity antenna provided in Embodiment 7 of the present application;

[0070] Figure 25b Exploded view of a resonant cavity antenna provided in Embodiment 7 of the present application;

[0071] Figure 26 Partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 7 of the present application;

[0072] Figure 27 Simplified partial cross-sectional structure schematic diagram of a resonant cavity antenna provided in Embodiment 8 of the present application;

[0073] Figure 28 Schematic diagram of a partial cross-sectional structure of a resonant cavity antenna provided in the eighth embodiment of the present application;

[0074] Figure 29 Schematic diagram of a simplified partial cross-sectional structure of a resonant cavity antenna provided in the ninth embodiment of the present application;

[0075] Figure 30a Exploded view of a resonant cavity antenna provided in the ninth embodiment of the present application;

[0076] Figure 30b Exploded view of a resonant cavity antenna provided in the ninth embodiment of the present application;

[0077] Figure 31 Schematic diagram of a partial cross-sectional structure of a resonant cavity antenna provided in the ninth embodiment of the present application.

[0078] Reference numerals:

[0079] 10 - Resonant cavity antenna; 101 - First connection port; 102 - Communication channel; 20 - Metal housing; 201 - Metal outer shell; 202 - Metal middle frame; 30 - Audio module; 301 - Second connection port; 40 - Screen; 50 - Sealing ring; 60 - Conductive foam; 70 - Buffer foam; 80 - Sealing foam; 1 - Metal sheet; 11 - Pin; 12 - Top plate; 2 - Dielectric substrate; 21 - First substrate; 22 - Second substrate; 23 - Protrusion; 3 - Metal ground; 4 - Structural member; 5 - Connecting member;

[0080] a1 - First surface; a2 - Second surface; c - Sound outlet hole; d1 - First side; d2 - Second side; j - Gap; s1 - Injection hole; s2 - Protrusion; t - Annular boss; B - Avoidance opening; C - Opening groove; J - Connection hole; K1 - First through hole; K2 - Second through hole; Q1 - Internal cavity; Q2 - Audio chamber; T1 - First boss; T2 - Second boss; U1 - First through groove; U2 - Second through groove; V - Hollowing. Detailed implementation manners

[0081] With the development of technology, the development of terminal devices is changing rapidly. Consumers not only have basic communication, photography, and audio requirements for terminal devices, but also pursue the appearance texture and thin and light experience of terminal devices. Existing terminal devices are gradually evolving from a sandwich architecture to an all-metal integrated design. In order to ensure the seamless appearance design of the metal body, the antenna solution is usually designed as a resonant cavity antenna. The main problem of the resonant cavity antenna is that it is usually a relatively large solid structure, which will compress the cavity space of the speaker module and affect the sound effect of the speaker.

[0082] Based on this situation, the present application provides a resonant cavity antenna and an electronic device having the resonant cavity antenna. The resonant cavity antenna has an internal cavity that can be used to connect with the audio chamber of the electronic device, so that the internal cavity serves as a part of the sound cavity of the audio module, thereby expanding the sound cavity of the audio module, thereby optimizing the sound effect while meeting the antenna performance.

[0083] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0084] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0085] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0086] The embodiment of the present application provides an electronic device, which can be a terminal device such as a laptop computer, a tablet computer, a mobile phone, a wearable device, etc. The electronic device has an integrated metal housing and has audio and communication functions. Figure 1a Taking the tablet computer shown in the figure as an example, the tablet computer includes a metal housing 20 and a screen 40. The screen 40 is embedded in the metal housing 20, and a space for accommodating other components of the tablet computer is formed between the screen 40 and the metal housing 20. Figure 1b The partial structure of the tablet computer behind the hidden screen 40 is shown, and the tablet computer further includes an audio module 30 and a resonant cavity antenna 10, which are arranged between the metal shell 20 and the screen 40. The metal shell 20 of the electronic device provided in the embodiment of the present application is an integrated structure design without a break, so the resonant cavity antenna 10 is used for communication.

[0087] Refer to Figure 1a and Figure 1bAs shown, the metal housing 20 includes a metal outer shell 201 and a metal middle frame 202. The metal outer shell 201 can be regarded as the bottom wall of the metal housing 20, and the metal middle frame 202 can be regarded as the side wall of the metal housing 20. The metal middle frame 202 surrounds the edge of the metal outer shell 201. Exemplarily, a sound outlet hole c is provided at a certain place of the metal middle frame 202, and an audio module 30 can be provided corresponding to the sound outlet hole c. The sound emitted by the audio module 30 can be transmitted out from the sound outlet hole c. Specifically, the number of audio modules 30 can be one or more, and different audio modules 30 are distributed at different positions at the corners of the metal housing 20 according to the design of the electronic device. Figure 1c is Figure 1b the detailed enlarged view at V1 in. As Figure 1c shown, there is a gap j between the side of the resonant cavity antenna 10 and the metal middle frame 202 of the metal housing 20, and the screen 40 will cover this gap j when installed on the metal housing 20. The screen 40 will not affect the transmission of electromagnetic waves. When the resonant cavity antenna 10 is installed inside the metal housing 20 of the electronic device, the resonant cavity antenna 10 can transmit or receive electromagnetic waves through this gap j.

[0088] Based on the above Figure 1a and Figure 1b illustrated electronic device, in Figure 1b the audio module 30 is exemplified as two tweeters, and the larger the space of the audio cavity, the better the sound effect. In the electronic device provided by the embodiments of the present application, the audio module 30 and the adjacent resonant cavity antenna 10 can adopt a common cavity design to realize the expansion of the audio cavity.

[0089] Figure 2 illustrates a simplified structural cross-sectional schematic diagram of the common cavity design of the resonant cavity antenna 10 and the audio module 30. As Figure 2 shown, the resonant cavity antenna 10 has an internal cavity Q1, and this internal cavity Q1 is a relatively enclosed space formed by the structure of the resonant cavity antenna 10 itself. The audio module 30 has an audio cavity Q2. The resonant cavity antenna 10 and the audio module 30 are connected and the internal cavity Q1 and the audio cavity Q2 are connected and communicated. The internal cavity Q1 and the audio cavity Q2 can be hermetically connected to form the audio cavity of the audio module 30. That is to say, a closed audio cavity can be formed between the resonant cavity antenna 10 and the audio module 30. It should be understood that the relatively enclosed space formed by the internal cavity Q1 here refers to that there are no other openings except being connected and communicated with the audio cavity Q2, meeting the closed design requirements of the audio module 30 for the audio cavity. For the convenience of understanding, a three-dimensional reference coordinate system is established in Figure 2 , and the X direction, Y direction and Z direction are perpendicular to each other in pairs. Combining Figure 1a with Figure 1bFor the electronic device shown, the X direction is the arrangement direction of the cavity antenna 10 and the audio module 30, and the X direction is parallel to the metal housing 201 of the electronic device. The Y direction is parallel to the metal housing 201 and perpendicular to the X direction, and the Z direction is perpendicular to the metal housing 201. It can be considered that the Z direction is the thickness direction of the cavity antenna 10.

[0090] For the cavity antenna 10, the cavity for reflecting electromagnetic waves is basically adapted to the volume of the cavity antenna 10. The internal cavity Q1 is part of the cavity of the cavity antenna 10 or at least shares a part of the space with the cavity of the cavity antenna 10. That is to say, based on the structure of the cavity antenna 10 itself, the structural design of the internal cavity Q1 does not increase the space occupied by the cavity antenna 10 itself. By forming the internal cavity Q1 through the cavity antenna 10 and connecting it with the audio cavity Q2 of the audio module 30, the sound cavity of the audio module 30 can be expanded, the sound effect of the audio module 30 can be improved, and the influence of the large volume of the cavity antenna 10 on the space compression of the audio module 30 can be reduced. It should be understood that the electronic device may also include some bass speakers that do not have a high demand for the size of the sound cavity space, which are not exemplified here.

[0091] There may be various implementation manners for the cavity antenna 10 provided in the embodiments of the present application. Next, the co-cavity design of the cavity antenna 10 and the audio module 30 will be exemplarily introduced through multiple specific embodiments.

[0092] Embodiment 1

[0093] As Figure 3 A simplified schematic cross-sectional structure diagram of a cavity antenna 10 is shown. The cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, a metal ground 3, and a structural member 4. The metal sheet 1, the dielectric substrate 2, and the structural member 4 can cooperate with each other to form the above-mentioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes opposite first surface a1 and second surface a2. Along the Z direction, the metal sheet 1 includes a top plate 12 and at least one pin 11. At least a part of the top plate 12 is located on the first surface a1 of the dielectric substrate 2. The pin 11 is connected to the top plate 12 and extends to the second surface a2 of the dielectric substrate 2. The pin 11 is connected to the metal ground 3. The dielectric substrate 2 has a hollow V penetrating the first surface a1 and the second surface a2. The top plate 12 of the metal sheet 1 can cover the opening at the first surface a1 of the dielectric substrate 2, and the structural member 4 can cover the opening at the second surface a2 of the dielectric substrate 2. Thus, a closed internal cavity Q1 is formed between the metal sheet 1, the dielectric substrate 2, and the structural member 4.

[0094] The resonant cavity antenna 10 also includes a first connection port 101 connected to the internal cavity Q1, and the first connection port 101 is used to communicate with the audio chamber of the audio module 30. Exemplarily, the first connection port 101 is connected to the internal cavity Q1 through a communication channel 102, and the first connection port 101 and the communication channel 102 are both formed on the dielectric substrate 2. Since the dielectric substrate 2 is formed by an injection molding process, the internal cavity Q1 and the first connection port 101 are connected through the communication channel 102, which can simplify the structure of the internal cavity Q1 and facilitate the formation of the internal cavity Q1.

[0095] Taking the structure of the electronic device as a reference, when the resonant cavity antenna 10 is installed in the metal shell 20 of the electronic device, the second surface a2 of the dielectric substrate 2 is used to face the metal shell 201, and the first surface a1 is the side of the dielectric substrate 2 facing away from the metal shell 20. It can be considered that the first surface a1 is used to face the screen 40 of the electronic device. When the resonant cavity antenna 10 is applied to an electronic device having a metal shell 20, the metal shell 201 of the metal shell 20 can replace the metal ground 3 here, that is, the metal ground 3 can be the metal shell 201 or at least can be a part of the metal shell 201.

[0096] Please continue to refer to Figure 3 As shown, the metal ground 3 is arranged on the side of the structural member 4 away from the second surface a2 of the dielectric substrate 2, the pin 11 of the metal sheet 1 extends to the side of the second surface a2 of the dielectric substrate 2 and is conductively connected to the metal ground 3 to achieve grounding, and the structural member 4 avoids the pin 11. The metal sheet 1 is used to receive or transmit electromagnetic waves in the resonant cavity antenna 10. At least a part of the dielectric substrate 2 is located between the metal ground 3 and the metal sheet 1, so that there is a certain interval between the metal sheet 1 and the metal ground 3, and a resonant cavity of the resonant cavity antenna 10 can be formed between the metal sheet 1 and the metal ground 3. The electromagnetic waves emitted or received by the resonant cavity antenna 10 can be reflected multiple times in the resonant cavity, so as to exert the communication function of the resonant cavity antenna 10. The space between the metal sheet 1 and the metal ground 3 can be considered as the resonant cavity of the resonant cavity antenna 10, and the resonant cavity can include at least part of the physical space occupied by the dielectric substrate 2. The internal cavity Q1 of the resonant cavity antenna 10 is illustratively formed by the cooperation of a metal sheet 1 and a dielectric substrate 2. The internal cavity Q1 can be considered as a part of the resonant cavity, or the internal cavity Q1 shares a part of the space with the resonant cavity. The formation of the internal cavity Q1 will not increase the space occupied by the overall structure of the resonant cavity antenna 10.

[0097] It should be understood that the first surface a1 and the second surface a2 of the dielectric substrate 2 are not necessarily flat, and may be provided with structures such as bosses and grooves according to the spatial design of the electronic device and the structural layout of the cavity antenna 10. At least a part of the top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2, and the pin 11 is partially located on the second surface a2 of the dielectric substrate 2. The setting position of the pin 11 can be adjusted according to the application scenario. When the pin 11 corresponds to the position of the first connection port 101 and passes through the communication channel height 102, at least one avoidance opening B is provided on the pin 11. When the pin 11 is injection-molded and fixed to the dielectric substrate 2, the avoidance opening B can conduct the internal cavity Q1 and the first connection port 101.

[0098] Figures 4a to 4d For Figure 3 A specific possible implementation manner of the cavity antenna 10 shown. Figure 4a Is the perspective view of observing the cavity antenna 10 from the top side in the thickness direction of the cavity antenna 10 along the Z direction, Figure 4b Is the perspective view of observing the cavity antenna 10 from the bottom side in the thickness direction of the cavity antenna 10 along the Z direction, Figure 4c Is the exploded view of observing the cavity antenna 10 from the top side in the thickness direction of the cavity antenna 10 along the Z direction, Figure 4d Is the exploded view of observing the cavity antenna 10 from the bottom side in the thickness direction of the cavity antenna 10 along the Z direction.

[0099] Refer to Figure 4a And Figure 4b , The metal sheet 1 can be made of a steel sheet, and the metal sheet 1 is fixed to the dielectric substrate 2 in an integrated injection-molding manner, and the dielectric substrate 2 provides support for the metal sheet 1. Along the Z direction, at least a part of the top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. Along the Z direction, the structural member 4 and the metal ground 3 are both arranged on the side of the second surface a2 of the dielectric substrate 2, and the structural member 4 is exemplarily located between the metal ground 3 and the dielectric substrate 2. At least a part of the pin 11 of the metal sheet 1 is located on the second surface a2 of the dielectric substrate 2, and the pin 11 does not contact the structural member 4 on the second surface a2 of the dielectric substrate 2. The metal ground 3 is fixed to the second surface a2 of the dielectric substrate 2 and at least partially overlaps the side of the structural member 4 facing away from the first surface a1 of the dielectric substrate 2, and the metal ground 3 is electrically connected to the pin 11 to achieve grounding.

[0100] Refer to Figure 4a And Figure 4b, in order to fix the resonant cavity antenna 10 to the metal housing 201 or connect and fix the resonant cavity antenna 10 to other structures, the dielectric substrate 2 is further provided with a plurality of connection holes J. According to different functions, the connection holes J can penetrate the dielectric substrate 2 or be blind holes. Among them, each connection hole J is not communicated with the internal cavity Q1 formed among the metal sheet 1, the dielectric substrate 2, and the structural member 4. The resonant cavity antenna 10 further includes a first boss T1 for lapping with the audio module 30 and a first through hole K1 provided on the first boss T1. The first boss T1 can be a part of the dielectric substrate 2 or have an integral structure with the dielectric substrate 2. The number of the first bosses T1 is not limited. In this embodiment, along the Y direction, a first boss T1 is respectively provided on both sides of the first connection port 101. Specifically, the shape of the first boss T1 is not limited. It can be a protruding plate protruding from the dielectric substrate 2 along the X direction or a groove formed on the edge of the dielectric substrate 2.

[0101] As Figure 4c and Figure 4d shown, the resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, a metal ground 3, and a structural member 4. The hollow V of the dielectric substrate 2 penetrates the dielectric substrate 2 along the thickness direction of the dielectric substrate 2. The metal sheet 1 can be integrally injection-molded with the dielectric substrate 2, and the top plate 12 of the metal sheet 1 can cover and seal the opening of the hollow V on the first surface a1. The structural member 4 is used to be fixed on one side of the second surface a2 of the dielectric substrate 2 to cover and seal the opening of the hollow V on the second surface a2, so as to form an internal cavity Q1 of the resonant cavity antenna 10 among the metal sheet 1, the dielectric substrate 2, and the structural member 4. The internal cavity Q1 is a relatively closed space. The hollow V is communicated with the first connection port 101. In this resonant cavity antenna 10, the first connection port 101, the communication channel 102, and the first boss T1 for lapping with the audio module 30 are formed by the dielectric substrate 2. The metal ground 3 is used to be fixed on one side of the second surface a2 of the dielectric substrate 2, and the metal ground 3 is used to conductively connect with the lead 11 of the metal sheet 1.

[0102] Please continue to refer to Figure 4cAs shown, the metal sheet 1 includes a top plate 12 and a plurality of pins 11. Each pin 11 is connected to the edge of the top plate 12 and extends and bends towards the dielectric substrate 2. At least part of the top plate 12 is located on the first surface a1 of the dielectric substrate 2, and the plurality of pins 11 are used to extend to expose the second surface a2 of the dielectric substrate 2. One of the pins 11 corresponds to the position of the first connection port 101, and at least one avoidance opening B is provided on this pin 11. When this pin 11 is injection-molded and fixed to the dielectric substrate 2, the avoidance opening B can conduct the opening groove C and the first connection port 101. The number and shape of the pins 11 are not limited. The partial structure of the pins 11 located on the second surface a2 of the dielectric substrate 2 is exemplarily close to a rectangle. Among them, the pins 11 are in a broken line shape, and one end of the pins 11 for connecting to the metal ground 3 forms a contact plane to make surface contact connection with the metal ground 3 surface, enhancing the connection reliability. The metal sheet 1 also has a plurality of injection holes s1, and the plurality of injection holes s1 can be distributed on the edge of the top plate 12. When the metal sheet 1 and the dielectric substrate 2 are formed by an integral injection molding process, the molten liquid used to form the dielectric substrate 2 can enter the plurality of injection holes s1. After the metal sheet 1 and the dielectric substrate 2 are cooled and formed, the dielectric substrate 2 includes protrusions s2 filled in the injection holes s1, and the injection holes s1 of the metal sheet 1 and the protrusions s2 of the dielectric substrate 2 can form an interpenetrating connection structure, enhancing the structural strength of the cavity antenna 10.

[0103] Figure 5 The partial cross-sectional structure of the cavity antenna 10 is shown. The top plate 12 of the metal sheet 1 covers the opening of the hollow V of the dielectric substrate 2 located on the first surface a1. The structural member 4 is fixed to one side of the second surface a2 of the dielectric substrate 2 and covers the opening of the hollow V located on the second surface a2. An internal cavity Q1 is formed between the top plate 12, the dielectric substrate 2 and the structural member 4. Among them, the pins 11 of the metal sheet 1 expose the second surface a2 of the dielectric substrate 2 and are conductively connected to the metal ground 3 to achieve grounding. Among them, when the structural member 4 is fixed to the second surface a2 of the dielectric substrate 2, the pins 11 of the metal sheet 1 are avoided, so that the pins 11 can expose the second surface a2 of the dielectric substrate 2. The pins 11 and the metal ground 3 can be conductively connected through a conductive foam 60. The conductive foam 60 can play a buffering role while performing an electrical connection function. At the same time, the deformable characteristic of the conductive foam 60 can make the contact surfaces between the conductive foam 60 and the pins 11 and between the conductive foam 60 and the metal ground 3 more closely continuous, and the electrical connection effect is better.

[0104] Specifically, the structural member 4 and the dielectric substrate 2 can be integrally injection-molded with the metal sheet 1 at the same time. Or, the metal sheet 1 and the dielectric substrate 2 can be integrally injection-molded, and then the dielectric substrate 2 and the structural member 4 can be fixed by welding or other methods. It should be understood that the structural member 4 can be a plastic part made of the same material as the dielectric substrate 2. At this time, the structural member 4 and the dielectric substrate 2 can be connected by ultrasonic welding, dispensing or other methods.

[0105] In some embodiments, the structural member 4 can be made of a metal material, such as a steel sheet. The structural member 4 made of a metal material has a thinner thickness, and when the thickness of the entire resonant cavity antenna 10 remains unchanged, the space of the internal cavity Q1 can be increased. After connecting the internal cavity Q1 of the resonant cavity antenna 10 to the audio cavity Q2 of the audio module 30, the audio expansion of the audio module 30 can be further realized.

[0106] Among them, when selecting a structural member 4 made of a metal material such as a steel sheet, the structural member 4 can be connected to the metal sheet 1 by spot welding or other means, and the structural member 4 can be used as the grounding point of the metal sheet 1 for grounding. That is to say, the metal sheet 1 can be grounded by electrically connecting the pin 11 to the metal ground 3, or can be grounded by electrically connecting the structural member 4 to the metal ground 3, and either one or both of the two methods can be selected. When the metal sheet 1 is not selected to be electrically connected to the metal ground 3 through the structural member 4 made of a metal material, there is no need for spot welding connection between the structural member 4 and the metal sheet 1, which can reduce costs.

[0107] As Figure 6a shows the structure of the resonant cavity antenna 10 and the audio module 30 in this embodiment. Exemplarily, the resonant cavity antenna 10 and the audio module 30 are arranged adjacent to each other in the X direction.

[0108] Figure 6b For Figure 6a the detailed enlarged view at V2 in. Referring to Figure 6a and Figure 6b together, one side of the resonant cavity antenna 10 facing the audio module 30 has a first boss T1, and one side of the audio module 30 facing the resonant cavity antenna 10 has a second boss T2. The first boss T1 and the second boss T2 can be overlapped along the Z direction of the resonant cavity antenna 10, and the resonant cavity antenna 10 and the audio module 30 can be fixed by screws passing through the first boss T1 and the second boss T2 in sequence. The resonant cavity antenna 10 and the audio module 30 can also be fixed to the metal housing 201 or other structures together by screws. Of course, the resonant cavity antenna 10 and the audio module 30 may also be fixed by other means, which is not limited in this application. Among them, the structures of the first boss T1 and the second boss T2 are only examples.

[0109] Figure 6c For Figure 6a the detailed enlarged view at V3 in. As Figure 6cAs shown, a first connection port 101 is formed on one side of the resonant cavity antenna 10 facing the audio module 30, and this first connection port 101 is used to communicate with the internal cavity Q1 of the resonant cavity antenna 10. A second connection port 301 is formed on one side of the audio module 30 facing the resonant cavity antenna 10, and this second connection port 301 is used to communicate with the audio chamber Q2 of the audio module 30. The first connection port 101 and the second connection port 301 are docked and communicated, so that the internal cavity Q1 and the audio chamber Q2 can be communicated, realizing the co-cavity design of the resonant cavity antenna 10 and the audio module 30. Exemplarily, in order to enhance the connection reliability and sealing performance, the first connection port 101 and the second connection port 301 are connected by a sealing ring 50. When the first connection port 101 and the second connection port 301 are docked, the sealing ring 50 is pressed between the end face of the first connection port 101 and the end face of the second connection port 301, and the sealing ring 50 surrounds the first connection port 101 and the second connection port 301 to form a channel for sealing. Among them, the sealing ring 50 can be a sealing foam, a sealing rubber ring and other structures. Of course, the sealed connection between the first connection port 101 and the second connection port 301 may also be realized by other means such as bonding with sealant. It should be understood that the internal cavity Q1 is the internal structure of the resonant cavity antenna 10, and the audio chamber Q is the internal structure of the audio module 30. Therefore, the internal cavity Q1 and the audio chamber Q2 are not shown here.

[0110] Combined with Figure 6a , Figure 6d shows the mating structure of the resonant cavity antenna 10 and the audio module 30 when observed from one side of the second surface a2 of the dielectric substrate 2 along the Z direction. As Figure 6d shown, the metal sheet 1 of the resonant cavity antenna 10 has at least one pin 11 exposed on the side of the dielectric substrate 2 facing the metal housing 201, and these pins 11 can be used as the grounding points of the metal sheet 1 to connect to the metal ground 3. When specifically fixing the resonant cavity antenna 10 to the metal housing 201, a buffer structure such as an insulating foam can be added between the dielectric substrate 2 and the metal housing 201 to protect the resonant cavity antenna 10.

[0111] Based on Figures 6a to 6d the mating structure of the resonant cavity antenna 10 and the audio module 30 shown, Figure 7a and Figure 7b shows the separated structure of the resonant cavity antenna 10 and the audio module 30.

[0112] Refer to Figure 7a and Figure 7bAs shown, the first connection port 101 of the resonant cavity antenna 10 and the second connection port 301 of the audio module 30 can be connected through the sealing ring 50 to expand the sound cavity of the audio module 30 and optimize the audio effect. Exemplarily, on one side of the resonant cavity antenna 10 for connecting the audio module 30, two first bosses T1 are formed for lapping and connecting the audio module 30. Each first boss T1 is correspondingly provided with a first through hole K1 penetrating through the first boss T1, and a second boss T2 for lapping with the first boss T2 is provided with a second through hole K2 penetrating through the second boss T2. When the first boss T1 and the second boss T2 are lapped, the first through hole K1 and the second through hole K2 can be correspondingly aligned and communicated along the thickness direction of the resonant cavity antenna 10. At this time, connecting members such as bolts and screws can pass through the first through hole K1 and the second through hole K2 in sequence and be fixedly connected to the metal housing 201 of the electronic device.

[0113] Exemplarily, along the arrangement direction of the audio module 30 and the resonant cavity antenna 10, the end face of the first connection port 101 for docking with the second connection port 301 and the end face of the second connection port 301 for docking with the first connection port 101 are inclined and parallel to each other. Among them, the end face of the first connection port 101 of the resonant cavity antenna 10 is inclined and faces away from the metal housing 201, and the end face of the second connection port 301 of the audio module 30 is inclined and faces the side close to the metal housing 201. When installing the audio module 30 and the resonant cavity antenna 10, the sealing ring 50 can be first adhesively fixed to the first connection port 101 of the resonant cavity antenna 10, and the sealing ring 50 surrounds the first connection port 101, and then the second connection port 301 of the audio module 30 is pressed against the second connection port 301 of the resonant cavity antenna 10 along the direction from the screen 40 of the electronic device to the metal housing 201, so that the first connection port 101 and the second connection port 301 are hermetically connected through the sealing ring 50. The end faces of the first connection port 101 and the second connection port 301 are inclined and parallel to each other. During press-fitting, an external force can be used to strengthen the connection tightness between the first connection port 101 and the second connection port 301. After the resonant cavity antenna 10 and the audio module 30 are fixed to the metal housing 201 through fasteners such as screws, the end face of the second connection port 301 of the audio module 30 presses against the end face of the first connection port 101 of the resonant cavity antenna 10, so that a certain pressing force is always maintained between the first connection port 101 and the second connection port 301, which can ensure that the first connection port 101 and the second connection port 301 are hermetically connected through the sealing ring 50.

[0114] Among them, the end face inclination modes of the first connection port 101 and the second connection port 301 can be interchanged. That is to say, it can also be the structure where the end face of the first connection port 101 presses against the end face of the second connection port 301. Of course, the first connection port 101 of the resonant cavity antenna 10 and the second connection port 301 of the audio module 30 can also be connected and fixed in other ways, which will not be elaborated here.

[0115] Figure 7c This is a partial cross-sectional structure of the connection between a resonant cavity antenna 10 and an audio module 30 provided by this embodiment of the application. As Figure 7c shown, the resonant cavity antenna 10 has an internal cavity Q1. Exemplarily, the internal cavity Q1 is formed by the cooperation of the dielectric substrate 2, the top plate 12 of the metal sheet 1, and the structural member 4 of the resonant cavity antenna 10, and the internal cavity Q1 is a relatively enclosed space. The relative enclosure of the internal cavity Q1 can be considered that other parts of the internal cavity Q1 are enclosed except for the part communicating with the first connection port 101. The pin 11 of the metal sheet 1 exposes the bottom surface of the dielectric substrate 2 facing the metal housing 201 and is electrically connected to the metal ground 3 through the conductive foam 60, so that a resonant cavity of the resonant cavity antenna 10 is formed between the metal sheet 1 and the metal housing 201. At least a part of the internal cavity Q1 is located in the resonant cavity of the resonant cavity antenna 10. It can be considered that the internal cavity Q1 shares a part of the space with the resonant cavity, and the formation of the internal cavity Q1 will not increase the space occupied by the overall structure of the resonant cavity antenna 10. It should be understood that the structure of the structural member 4 may not be regular and may be adaptively in an irregular shape according to the application scenario. The irregularity of the structural member 4 will affect the shape of the internal cavity Q1. For example, Figure 7c as shown in the example, the inner wall of the structural member 4 of the resonant cavity antenna 10 may be formed with structures such as grooves and protrusions.

[0116] When the resonant cavity antenna 10 provided by this embodiment is applied to an electronic device with a metal housing 20, the metal housing 201 of the metal housing 20 can replace the metal ground 3 of the resonant cavity antenna 10. Figure 8aIt is exemplified that the resonant cavity antenna 10 is disposed at a corner of the metal housing 20. The resonant cavity antenna 10 includes at least one first side d1 and at least one second side d2. The first side d1 is adjacent to the metal middle frame 202 of the metal housing 20, and the second side d2 is opposite to the metal middle frame 202 of the metal housing 20. It can be considered that the second side d2 is the side of the resonant cavity antenna 10 far from the metal middle frame 202. The resonant cavity antenna 10 is approximately rectangular. Exemplarily, two pins 11 included in the metal sheet 1 are respectively disposed near the two second sides d2 of the resonant cavity antenna 10 far from the metal middle frame 202. Two dashed boxes indicate the positions of the pins 11 of the metal sheet 1, and the two rectangular pins 11 are respectively opposite to the two metal middle frames 202. When the two pins 11 are connected to the metal housing 201 serving as the metal ground 3, a resonant cavity approximately in the shape of a cuboid is formed between the metal sheet 1 and the metal housing 201. The metal housing 201, the metal middle frame 202, and the two pins 11 respectively correspond to at least a part of the side walls of the resonant cavity of the resonant cavity antenna 10, which can optimize the antenna performance.

[0117] Figure 8b It is a partial cross-sectional schematic diagram of the cooperation of the resonant cavity antenna 10, the audio module 30, and the metal housing 201. As Figure 8b shown, the pins 11 of the metal sheet 1 are exposed from the dielectric substrate 2 and are electrically connected to the metal housing 20 through a conductive foam 60 or other conductive connectors. A buffer foam 70 can be filled between the dielectric substrate 2 and the metal housing 201 to increase the anti-seismic effect and realize the protection of the resonant cavity antenna 10. The audio module 30 is fixed to the metal housing 201, and the second connection port 301 of the audio module 30 and the first connection port 101 are hermetically connected through a sealing ring 50 to realize the communication between the audio cavity Q2 and the internal cavity Q1. Of course, a buffer structure such as a buffer foam can also be filled between the audio module 30 and the metal housing 201 to protect the audio module 30.

[0118] Embodiment 2

[0119] As Figure 9 shown is a simplified cross-sectional structure schematic diagram of a resonant cavity antenna 10. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in Embodiment 1, the resonant cavity antenna 10 provided in this embodiment does not include a structural member 4, and the metal sheet 1 and the dielectric substrate 2 can cooperate to form the above-mentioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes opposite first surface a1 and second surface a2. At least a part of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. Specifically, the dielectric substrate 2 has an opening groove C with an opening on the first surface a1, and the top plate 12 of the metal sheet 1 can cover the first surface a1 of the dielectric substrate 2 to close the opening of the opening groove C. Thus, a closed internal cavity Q1 is formed between the metal sheet 1 and the dielectric substrate 2.

[0120] Figures 10a to 10c A Figure 9 specific possible implementation manner of a cavity antenna 10 as shown. Figure 10a is a perspective view of observing the cavity antenna 10 from the bottom side in the thickness direction of the cavity antenna 10 along the Z direction, Figure 10b is an exploded view of observing the cavity antenna 10 from the top side in the thickness direction of the cavity antenna 10 along the Z direction, Figure 10c is an exploded view of observing the cavity antenna 10 from the bottom side in the thickness direction of the cavity antenna 10 along the Z direction. Among them, the structure of observing the cavity antenna 10 from the top side in the thickness direction of the cavity antenna 10 along the Z direction can be referred to the Figure 4a structure shown in the first embodiment, and no further examples are given here.

[0121] As Figure 10a shown, a part of the pin 11 of the metal sheet 1 is located on the second surface a2 of the dielectric substrate 2, and the pin 11 is connected to the metal ground 3 to realize the grounding of the metal sheet 1.

[0122] As Figure 10b shown, the dielectric substrate 2 is formed with an opening groove C, and the opening of the opening groove C is located on the first surface a1. The metal sheet 1 can be fixed on the first surface a1 of the dielectric substrate 2 and seal the opening of the opening groove C, then an internal cavity Q1 can be formed between the metal sheet 1 and the dielectric substrate 2, and the internal cavity Q1 is a relatively closed space. The first connection port 101 is formed on the outer surface of the dielectric substrate 2 for facing the audio module 30, and the first connection port 101 is communicated with the opening groove C.

[0123] Figure 11 is a partial cross-sectional structure schematic of the cavity antenna 10. The top plate 12 of the metal sheet 1 covers the opening of the opening groove C of the dielectric substrate 2, and the top plate 12 and the opening groove C of the dielectric substrate 2 cooperate to form a relatively closed internal cavity Q1. The first connection port 101 is formed on the dielectric substrate 2, and the first connection port 101 is connected to the internal cavity Q1 through a communication channel 102. Among them, the pin 11 of the metal sheet 1 exposes the second surface a2 of the dielectric substrate 2. The pin 11 and the metal ground 3 can be conductively connected through a conductive foam 60. The conductive foam 60 can play a buffering role while playing an electrical connection function. At the same time, the deformable characteristic of the conductive foam 60 can make the contact surfaces between the conductive foam 60 and the pin 11 and between the conductive foam 60 and the metal ground 3 more closely continuous, and the electrical connection effect is better.

[0124] It should be understood that the structure of the dielectric substrate 2 may not be regular and may be adaptively in a special-shaped structure according to the application scenario. The special shape of the dielectric substrate 2 will affect the shape of the internal cavity Q1. For example, Figure 7cThe inner wall of the dielectric substrate 2 of the illustrated resonant cavity antenna 10 may be formed with structures such as grooves and protrusions.

[0125] Embodiment III

[0126] As Figure 12 A simplified schematic cross-sectional structure diagram of a resonant cavity antenna 10 is shown. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in Embodiment II, the metal sheet 1, the dielectric substrate 2, and the metal ground 3 included in the resonant cavity antenna 10 provided in this embodiment can cooperate to form the above-mentioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes opposite first surface a1 and second surface a2. Specifically, the dielectric substrate 2 has a hollow V penetrating through the first surface a1 and the second surface a2. The top plate 12 of the metal sheet 1 can cover the opening at the first surface a1 of the dielectric substrate 2, and the metal ground 3 can cover the opening at the second surface a2 of the dielectric substrate 2. Thus, a closed internal cavity Q1 is formed between the metal sheet 1, the dielectric substrate 2, and the metal ground 3.

[0127] Figures 13a to 13d For Figure 12 A specific possible implementation manner of a resonant cavity antenna 10 is shown. Figure 13a It is the structure of the resonant cavity antenna 10 observed from the top side in the thickness direction of the resonant cavity antenna 10 along the Z direction. Figure 13b It is the structure of the resonant cavity antenna 10 observed from the bottom side in the thickness direction of the resonant cavity antenna 10 along the Z direction. Figure 13c It is an exploded view observed from the top side in the thickness direction of the resonant cavity antenna 10 along the Z direction. Figure 13d It is an exploded view observed from the bottom side in the thickness direction of the resonant cavity antenna 10 along the Z direction.

[0128] As Figure 13a And Figure 13b As shown, the metal sheet 1 is fixed to the dielectric substrate 2 by an integral injection molding process. The top plate 12 of the metal sheet 1 located on the first surface a1 of the dielectric substrate 2 is shown in Figure 13a , and the lead pins 11 of the metal sheet 1 located on the second surface a2 of the dielectric substrate 2 are shown in Figure 13b . The metal ground 3 is fixed to the second surface a2 of the dielectric substrate 2, and the metal ground 3 is electrically connected to the lead pins 11.

[0129] As Figure 13c And Figure 13dAs shown, exemplarily, the dielectric substrate 2 has a hollowed-out V that communicates with the second opening v2 on the first surface a1 and the second surface a2. The top plate 12 of the metal sheet 1 can cover and seal the opening of the hollowed-out V on the first surface a1, and the metal ground 3 can cover and seal the opening of the hollowed-out V on the second surface a2. Among them, the number of the opening of the hollowed-out V on the first surface a1 and the number of the opening of the hollowed-out V on the second surface a2 are not limited. Among them, an example of the opening of the hollowed-out V on the first surface a1 is one, and an example of the opening of the hollowed-out V on the second surface a2 is two. The hollowed-out V communicates with the first connection port 101. In the resonant cavity antenna 10, the first connection port 101, the communication channel 102, and the first boss T1 for lapping the audio module 30 are formed by the dielectric substrate 2.

[0130] As Figure 13d shown, on the second surface a2 of the dielectric substrate 2, the dielectric substrate 2 can form an annular boss t surrounding the opening of the hollowed-out V on the second surface a2. The annular boss t at least partially protrudes from the second surface a2 of the dielectric substrate 2. The annular boss t is used for sealing connection with the metal ground 3, so as to seal the opening of the hollowed-out V on the second surface a2. When the number of the openings of the hollowed-out V on the second surface a2 is multiple, the surfaces of the annular bosses t corresponding to each opening of the hollowed-out V on the second surface a2 facing away from the metal sheet 1 can be designed to be coplanar, which is convenient for the metal ground 3 to seal multiple openings at the same time, can simplify the process, and improve the sealing performance.

[0131] Figure 14 shows a partial cross-sectional structure of the resonant cavity antenna 10. As Figure 14 shown, after the metal sheet 1 and the dielectric substrate 2 are injection-molded, the top plate 12 of the metal sheet 1 covers and seals the opening of the hollowed-out V on the first surface a1, the metal ground 3 is fixed on the second surface a2 of the dielectric substrate 2 and covers and seals the opening of the hollowed-out V on the second surface a2, and the lead 11 of the metal sheet 1 extends to the second surface a2 of the dielectric substrate 2 and is electrically connected to the metal ground 3. A closed internal cavity Q1 is formed among the metal sheet 1, the hollowed-out V of the dielectric substrate 2, and the metal ground 3.

[0132] Specifically, on one side of the second surface a2 of the dielectric substrate 2, the annular boss t arranged around the opening of the hollowed-out V on the second surface a2 and the metal ground 3 can be sealed and connected through structures such as a sealing foam 80. The lead 11 of the metal sheet 1 can be electrically connected to the metal ground 3 through a conductive foam 60. Structures such as a buffer foam 70 can be filled between the dielectric substrate 2 and the metal ground 3 to protect the resonant cavity antenna 10.

[0133] After the first connection port 101 of the resonant cavity antenna 10 is communicated with the audio cavity sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to realize the expansion of the sound cavity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in the first embodiment, and the difference lies in the specific implementation manner of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not exemplified here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10, and its cooperation method is also specifically described in the first embodiment, which will not be elaborated here.

[0134] Embodiment Four

[0135] As Figure 15 A simplified schematic cross-sectional structure diagram of a resonant cavity antenna 10 shown, the resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in the third embodiment, in the resonant cavity antenna 10 provided in this embodiment, the metal sheet 1 and the metal ground 3 are connected by a connecting member 5. Here, the connecting member 5 is a structure independent of the metal sheet 1, and the connecting member 5 can be considered as a split pin 11 of the metal sheet 1. Both ends of the connecting member 5 are used to be respectively connected to the top plate 12 of the metal sheet 1 and the metal ground 3, and the connecting member 5 is independent of the top plate 12 of the metal sheet 1 and the metal ground 3.

[0136] Figure 16 For Figure 15 An exploded view of a specific possible implementation manner of a resonant cavity antenna 10 shown. The connecting member 5 has conductivity and can be made of a metal material. The connecting member 5 is independent of the metal sheet 1 and the metal ground 3. The top plate 12 of the metal sheet 1 can be connected to the metal ground 3 through the connecting member 5. The connecting member 5 is in a bent shape, and the bent plane at one end is used for surface contact connection with the top plate 12 of the metal sheet 1, and the bent plane at the other end is used for surface contact connection with the metal ground 3. Exemplarily, the connecting member 5 is located on one side of the connection port 101, and the connecting member 5 is provided with an avoidance hole B for communicating the spaces on both sides of the connecting member 5. Of course, the metal sheet 1 can also include the pin 11 in the second embodiment and be conductively connected to the metal ground 3 through the pin 11.

[0137] Figure 17A partial cross-sectional structural schematic diagram of the resonant cavity antenna 10 is shown. The top plate 12 of the metal sheet 1 is disposed on the first surface a1 of the dielectric substrate 2 and covers and seals the opening of the hollow V located on the first surface a1. The metal ground 3 is disposed on the second surface a2 of the dielectric substrate 2 and covers the opening of the hollow V located on the second surface a3. An internal cavity Q1 is formed by enclosing between the top plate 12 of the metal sheet 1, the dielectric substrate 2, and the metal ground 3. The top plate 12 of the metal sheet 1 and the metal ground 3 can be electrically connected through a connecting member 5, or can be electrically connected through the lead 11 of the metal sheet 1. Of course, in such a resonant cavity antenna 10, the metal sheet 1 may not be used as the lead 11 to simplify the structure. The connecting member 5 is exemplarily located on one side of the first connection port 101. The avoidance hole B on the connecting member 5 allows the internal cavity Q1 to communicate with the first connection port 101 through the communication channel 102. Among them, the top plate 12 of the metal sheet 1 and the connecting member 5 can be connected by spot welding, and the metal ground 3 and the connecting member 5 can also be connected by spot welding.

[0138] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to realize the expansion of the sound cavity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in the first embodiment, and the difference lies in the specific implementation manner of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not exemplified here again. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10, and its cooperation method is also specifically described in the first embodiment and will not be elaborated here.

[0139] Embodiment Five

[0140] As Figure 18 A simplified cross-sectional structural schematic diagram of a resonant cavity antenna 10 is shown. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the resonant cavity antenna 10 provided in the fourth embodiment, the dielectric substrate 2 of the resonant cavity antenna 10 provided in this embodiment includes a first substrate 21 and a second substrate 22. The first substrate 21 and the second substrate 22 are connected to form the dielectric substrate 2. The surface of the first substrate 21 facing away from the second substrate 22 can be regarded as the first surface a1 of the dielectric substrate 2, and the surface of the second substrate 22 facing away from the first substrate 21 can be regarded as the second surface a2 of the dielectric substrate 2. Both the first substrate 21 and the second substrate 22 are of a frame structure, and the structure formed by connecting the first substrate 21 and the second substrate 22 is similar to the dielectric substrate 2 in the fourth embodiment. The metal sheet 1 and the metal ground 3 can be connected through a connecting member 5, and both ends of the connecting member 5 are respectively connected between the top plate 12 of the metal sheet 1 and the metal ground 3.

[0141] Figure 19 ForFigure 18 Exploded view of a possible implementation of the resonant cavity antenna 10 shown. Among them, the first substrate 21 has a first through groove U1 penetrating the first substrate 21, the second substrate 22 has a second through groove U2 penetrating the second substrate 22, the first substrate 21 and the second substrate 22 are connected to form a dielectric substrate 2, and the first through groove U1 and the second through groove U2 can communicate to form a hollow V. It can be considered that the surface of the first substrate 21 facing away from the second substrate 22 is the first surface a1 of the dielectric substrate 2, and the surface of the second substrate 22 facing away from the first substrate 21 is the second surface a2 of the dielectric substrate 2. The metal sheet 1 is used to integrally injection-mold with the first substrate 21 and seal the opening of the first through groove U1 on the first surface a1, and the metal ground 3 is used to integrally injection-mold with the second substrate 22 and seal the opening of the second through groove U2 on the second surface a2. Then, the first substrate 21 and the second substrate 22 are connected by welding or other means, and finally an internal cavity Q1 is formed among the metal sheet 1, the first substrate 21, the second substrate 22, and the structure 3. In this resonant cavity antenna 10, the dielectric substrate 2 is designed in a split manner as the first substrate 21 and the second substrate 22, which can simplify the manufacturing process.

[0142] Figure 20 It is a partial cross-sectional structure schematic diagram of the resonant cavity antenna 10. The metal sheet 1 can be integrally injection-molded with the first substrate 21 and cover and seal the opening of the first through groove U1 on the first surface a1. The metal ground 3 can be integrally injection-molded with the second substrate 22 and cover and seal the opening of the second through groove U2 on the second surface a2. The first substrate 21 and the second substrate 22 can be connected and fixed by welding or other means, and the first through U1 and the second through U2 can communicate to form a hollow V of the dielectric substrate 2. An internal cavity Q is formed among the metal sheet 1, the first substrate 21, the second substrate 22, and the structural member 4. The top plate 12 of the metal sheet 1 and the structural member 4 can be conductively connected through the connecting member 5, or can be conductively connected through the lead 11 of the metal sheet 1.

[0143] The first substrate 21 and the second substrate 22 can be connected to form the dielectric substrate 2 by ultrasonic welding, dispensing, etc. This method can also be applied to the dielectric substrate 2 shown in the first embodiment. When the structural member 4 is a metal structure such as a steel sheet, the structural member 4 can be integrally injection-molded with the substrate 22, and the internal cavity Q1 is formed among the metal sheet 1, the first substrate 21, the second substrate 22, and the structural member 4.

[0144] After connecting the first connection port 101 of the resonant cavity antenna 10 to the audio cavity sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to realize the expansion of the sound cavity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in the first embodiment, and the difference lies in the specific implementation manner of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not exemplified here again. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10, and its cooperation method is also specifically described in the first embodiment, which will not be elaborated here.

[0145] Embodiment Six

[0146] As Figure 21 A simplified schematic cross-sectional structure diagram of a resonant cavity antenna 10 is shown. The resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, and a metal ground 3. Compared with the structure of the resonant cavity antenna 10 shown in the first embodiment, the difference is that in this embodiment, the structural member 4 is omitted, and the internal cavity Q1 is formed by the cooperation between the metal sheet 1 and the metal ground 3. Along the Z direction, the dielectric substrate 2 includes opposite first surface a1 and second surface a2. The metal sheet 1 can be made of a steel sheet, and the metal sheet 1 is fixed to the dielectric substrate 2 by an integral injection molding method. The top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. The dielectric substrate 2 has an opening groove C, and the opening of the opening groove C is located on the second surface a2. The metal ground 3 is fixed to one side of the second surface a2 of the dielectric substrate 2 and closes the opening of the opening groove C, so that an internal cavity Q1 is formed between the dielectric substrate 2 and the metal ground 3.

[0147] Figure 22a and Figure 22b is Figure 21 An exploded view of a possible implementation manner of the resonant cavity antenna 10 is shown, Figure 23 is a partial cross-sectional structure schematic diagram of the resonant cavity antenna 10. Figure 22a is the perspective view of observing the resonant cavity antenna 10 from the top side in the thickness direction of the resonant cavity antenna 10 along the Z direction, Figure 22bFor viewing the resonant cavity antenna 10 from the bottom side in the thickness direction of the resonant cavity antenna 10 along the Z direction, the first surface a1 of the dielectric substrate 2 is in a closed state. The opening of the opening slot C of the dielectric substrate 2 is located on the second surface a2, the metal ground 3 is fixed to the dielectric substrate 2 and closes the opening of the opening slot C, and a relatively closed internal cavity Q1 can be formed between the dielectric substrate 2 and the metal ground 3. The metal ground 3 and the dielectric substrate 2 can be integrally injection molded with the metal sheet 1 at the same time. Alternatively, the metal sheet 1 and the dielectric substrate 2 can be integrally injection molded, and then the dielectric substrate 2 and the metal ground 3 are fixed by welding or the like. In this structure, when the structural member 4 is a metal material, the structural member 4 can be connected to the metal sheet 1 to act as a grounding point for the metal sheet 1 to be grounded. The structure of the resonant cavity antenna 10 after assembly can refer to that shown in the first embodiment, and is not shown again here.

[0148] After the first connection port 101 of the resonant cavity antenna 10 is connected to the audio cavity sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to achieve the expansion of the sound cavity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that of the first embodiment, and the difference lies in the specific implementation method of the internal cavity Q1. Therefore, the matching structure of the resonant cavity antenna 10 and the audio module 30 is not illustrated here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal shell 20, the metal shell 201 of the metal shell 20 can replace the metal ground 3 in the resonant cavity antenna 10. The matching method is also specifically described in the first embodiment and will not be repeated here.

[0149] Embodiment 7

[0150] like Figure 24 A simplified schematic diagram of the cross-sectional structure of a resonant cavity antenna 10 is shown, and the resonant cavity antenna 10 includes a metal sheet 1, a dielectric substrate 2, a metal ground 3 and a structural member 4. The difference compared with the structure of the resonant cavity antenna 10 shown in Example 6 is that the dielectric substrate 2 and the structural member 4 of the resonant cavity antenna 10 provided in the embodiment of the present application cooperate to form the above-mentioned internal cavity Q1. Along the Z direction, the dielectric substrate 2 includes a first surface a1 and a second surface a2 relative to each other. The metal sheet 1 can be made of a steel sheet, and the metal sheet 1 is fixed to the dielectric substrate 2 by an integral injection molding method. The top plate 12 of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2. The dielectric substrate 2 has an open groove C, and the opening of the open groove C is located on the second surface a2. The structural member 4 is fixed to one side of the second surface a2 of the dielectric substrate 2 and closes the opening of the open groove C, so that an internal cavity Q1 is formed between the dielectric substrate 2 and the structural member 4. The metal ground 3 is arranged on the side of the structure 4 away from the second surface a2 of the dielectric substrate 2 . The pins 11 of the metal sheet 1 extend toward the second surface a2 of the dielectric substrate 2 and are conductively connected to the metal ground 3 . The structure 4 avoids the pins 11 .

[0151] Figure 25a and Figure 25b is Figure 24 an exploded view of a possible implementation of the resonant cavity antenna 10 shown in Figure 26 a partial cross-sectional structure schematic diagram of the resonant cavity antenna 10. The first surface a1 of the dielectric substrate 2 is in a closed state. The opening of the opening groove C of the dielectric substrate 2 is located on the second surface a2, and the structural member 4 is fixed to the dielectric substrate 2 and closes the opening of the opening groove C. A closed internal cavity Q1 can be formed between the dielectric substrate 2 and the structural member 4. The pin 11 of the metal sheet 1 can be electrically connected to the metal ground 3 through the conductive foam 60. In this structure, when the structural member 4 is made of a metal material, the structural member 4 can be connected to the metal sheet 1 to act as the grounding point for the metal sheet 1 to connect to the metal ground 3.

[0152] After the first connection port 101 of the resonant cavity antenna 10 is communicated with the audio cavity sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to realize the expansion of the sound cavity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in the first embodiment, and the difference lies in the specific implementation manner of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not illustrated here again. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10, and its cooperation method is also specifically described in the first embodiment and will not be elaborated here.

[0153] Embodiment Eight

[0154] As Figure 27 a simplified schematic diagram of the cross-sectional structure of a resonant cavity antenna 10 shown in

[0155] Figure 28 is Figure 27Partial cross-sectional structure schematic diagram of a possible implementation of the resonant cavity antenna 10 shown. The metal sheet 1 can be made of a steel sheet. The metal sheet 1 is fixed to the dielectric substrate 2 in an integrally injection-molded manner, such that the top plate 12 is located on the first surface a1 of the dielectric substrate 2, and the pin 11 passes through the dielectric substrate 2 and exposes the second surface a2 of the dielectric substrate. The metal ground 3 can be fixed to the second surface a2 of the dielectric substrate 2 by welding. The metal ground 3 is exemplarily electrically connected to the pin 11 through a conductive foam 60. The dielectric substrate 2 is a cavity structure, and the inner wall of its cavity structure can form a closed internal cavity Q1. Both the first surface a1 and the second surface a2 of the dielectric substrate 2 are closed. The communication channel 102 and the first connection port 101 are also both formed in the dielectric substrate 2. The first connection port 101 is connected to the internal cavity Q1 through the communication channel 102.

[0156] It should be understood that the dielectric substrate 2 in the resonant cavity antenna 10 can be injection-molded from the structural member 4 and the dielectric substrate 2 in Embodiment VII, or the dielectric substrate 2 in the resonant cavity antenna 10 can be formed by buckling two dielectric substrate 2 grooves in Embodiment II.

[0157] After the first connection port 101 of the resonant cavity antenna 10 is communicated with the audio chamber sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to realize the expansion of the sound cavity. It should be understood that the communication structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment I, and the difference lies in the specific implementation manner of the internal cavity Q1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not exemplified here again. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10, and its cooperation method is also specifically described in Embodiment I, which will not be elaborated here.

[0158] Embodiment IX

[0159] As Figure 29 Simplified cross-sectional structure schematic diagram of a resonant cavity antenna 10 shown. The difference from Embodiment VII is that the metal sheet 1 of the resonant cavity antenna 10 provided in this application embodiment is made of a flexible circuit board. The metal sheet 1 is wrapped on the surface of the dielectric substrate 2. At least part of the metal sheet 1 is located on the first surface a1 of the dielectric substrate 2, and at least part is located on the second surface a2 of the dielectric substrate 2. The dielectric substrate 2 has an opening groove C with an opening on the second surface a2. The metal ground 3 closes the opening of the opening groove C, such that an internal cavity Q1 is formed by the cooperation between the dielectric substrate 2 and the metal ground 3.

[0160] Figure 30a and Figure 30b is Figure 29 Exploded view of a possible implementation of the resonant cavity antenna 10 shownFigure 31 It is a partial cross-sectional structural schematic diagram of the resonant cavity antenna 10. The metal sheet 1 has a bent structure and includes a top plate 12 and pins 11 with an integral structure. The metal sheet 1 is bent and wrapped around the outer surface of the dielectric substrate 2. The top plate 12 is located on the first surface a1 of the dielectric substrate 2, and the pins 11 are located on the second surface a2 of the dielectric substrate 2. The space between the top plate 12 and the pins 11 is used to accommodate the dielectric substrate 2. The metal ground 3 is located on one side of the second surface a2 of the dielectric substrate 2, and the pins 11 are used to connect to the metal ground 3 to achieve grounding.

[0161] It should be understood that the metal ground 3 in this embodiment can be an integral structure with the pins 11. That is to say, the metal sheet 1 can be large enough to cover the opening of the opening groove C of the dielectric substrate 2 after being bent. The partial structure of the metal sheet 1 located on the second surface a2 of the dielectric substrate 2 can be regarded as the metal ground 3.

[0162] Among them, the structure of the dielectric substrate 2 and the formation of the internal cavity Q1 can also refer to the implementation methods in other embodiments. Exemplarily, when the first surface a1 of the dielectric substrate 2 in this embodiment is open and sealed by the metal sheet 1, the dielectric substrate 2 can be regarded as the dielectric substrate shown in Embodiment 3. When the first surface a1 of the dielectric substrate 2 in this embodiment is open and sealed by the metal sheet 1, and the second surface a2 is open and sealed by the metal ground 3, the dielectric substrate 2 can be regarded as the dielectric substrate 2 shown in Embodiment 2. When the first surface a1 of the dielectric substrate 2 in this embodiment is open and sealed by the metal sheet 1, and the second surface a2 is open and sealed by the structural member 4, the dielectric substrate 2 can be regarded as the dielectric substrate 2 described in Embodiment 1. When the dielectric substrate 2 in this embodiment is formed by connecting the first substrate 21 and the second substrate 22, the dielectric substrate 2 can be regarded as a structural deformation of the dielectric substrate 2 in Embodiment 5.

[0163] After connecting the first connection port 101 of the resonant cavity antenna 10 to the audio cavity sheet of the audio module 30, the internal cavity Q1 can be used as a part of the sound cavity to realize the expansion of the sound cavity. It should be understood that the connection structure between the resonant cavity antenna 10 and the audio module 30 is similar to that in Embodiment 1, and the difference lies in the specific implementation method of the internal cavity Q1 and the line-of-sight method of the metal sheet 1. Therefore, the cooperation structure between the resonant cavity antenna 10 and the audio module 30 is not exemplified here. Of course, when the resonant cavity antenna 10 is applied to an electronic device with a metal housing 20, the metal outer shell 201 of the metal housing 20 can replace the metal ground 3 in the resonant cavity antenna 10, and its cooperation method is also specifically described in Embodiment 1, which will not be elaborated here.

[0164] It should be understood that the above embodiments are several possible structural examples of the resonant cavity antenna 10 provided by this application, and are not limited to the above several embodiments. The structures in the different embodiments listed above can be superimposed, substituted, or reduced according to the usage scenario during application, as long as a closed internal cavity Q1 can be formed in the resonant cavity antenna 10. This internal cavity Q1 can communicate with the audio chamber of the audio module 30 to realize the expansion of the sound cavity, which is the technical solution to be protected by the embodiments of this application. For example, the metal ground 3 in Embodiment 4 can also be used as the structural member 4 made of metal in Embodiment 3. Both can be regarded as structures made of metal, and are not limited to the definition of the name. Or for another example, the method of forming the dielectric substrate 2 by the first substrate 21 and the second substrate 22 in Embodiment 5 can also be applied to the formation method of the dielectric substrate 2 of the resonant cavity antenna 10 in other embodiments. For the embodiment where the metal sheet 1 is a flexible circuit board, various structural deformations of the dielectric substrate 2, the formation of the internal cavity Q1 between the dielectric substrate 2 and the metal sheet 1, the formation of the internal cavity Q1 between the dielectric substrate 2 and the structural member 4, the formation of the internal cavity Q1 between the dielectric substrate 2 and the metal ground 3, etc. can all be implemented on this basis, which will not be elaborated here.

[0165] In summary, a resonant cavity antenna 10 provided by an embodiment of this application forms an internal cavity Q1 by using the structure of the resonant cavity antenna 10 itself. This internal cavity Q1 can be used to communicate with the audio chamber Q2 of the audio module 30 to realize the expansion of the sound cavity of the audio module 30 and improve the sound effect of the audio module 30. Without increasing the space occupied by the resonant cavity antenna 10 itself, this internal cavity Q1 realizes the expansion of the sound cavity of the audio module 30, and can improve the problem that the sound cavity space of the audio module 30 is compressed due to the large space occupied by the resonant cavity antenna 10. An electronic device with this resonant cavity antenna 10 has a better experience in audio playback.

[0166] The above are only the specific implementation manners of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application, and all should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A resonant cavity antenna, characterized in that, The resonant cavity antenna is used for an electronic device, and the electronic device includes an audio module; The resonant cavity antenna has a closed internal cavity, and the internal cavity is used to communicate with the audio cavity of the audio module; The resonant cavity antenna includes a dielectric substrate, a metal sheet and a metal ground fixed to the dielectric substrate. The metal sheet and the metal ground are arranged at intervals, and the grounding point of the metal sheet is electrically connected to the metal ground. A resonant cavity is formed between the metal sheet and the metal ground; at least part of the internal cavity is located between the metal sheet and the metal ground.

2. The resonant cavity antenna according to claim 1, wherein, The dielectric substrate has opposite first and second surfaces; The metal sheet is fixed to the first surface of the dielectric substrate, and the grounding point of the metal sheet exposes the second surface of the dielectric substrate; The metal ground is fixed to the second surface of the dielectric substrate and is electrically connected to the grounding point of the metal sheet.

3. The resonant cavity antenna according to claim 2, wherein The dielectric substrate includes a hollowing that communicates the first surface and the second surface, and the metal sheet seals the opening of the hollowing on the first surface; The metal ground seals the opening of the hollowing on the second surface, and the internal cavity is formed between the metal sheet, the hollowing of the dielectric substrate and the metal ground; or, the resonant cavity antenna includes a structural member, and the structural member is used to seal the opening of the hollowing on the second surface, and the internal cavity is formed between the metal sheet, the hollowing of the dielectric substrate and the structural member.

4. The resonant cavity antenna according to claim 3, characterized in that, The structural member is made of metal, and the grounding point of the metal sheet is connected to the metal ground through the structural member.

5. The resonant cavity antenna according to claim 2, wherein, The dielectric substrate includes an opening groove with an opening on the first surface, and the metal sheet seals the opening of the opening groove on the first surface, and the internal cavity is formed between the metal sheet and the opening groove of the dielectric substrate.

6. The resonant cavity antenna according to claim 2, characterized in that, The dielectric substrate includes an opening groove with an opening on the second surface; The metal ground seals the opening of the opening groove on the first surface, and the internal cavity is formed between the metal ground and the opening groove of the dielectric substrate; or, the resonant cavity antenna includes a structural member, and the structural member seals the opening of the opening groove on the first surface, and the internal cavity is formed between the structural member and the opening groove of the dielectric substrate.

7. The resonant cavity antenna according to claim 2, wherein, The dielectric substrate is a cavity structure, and the inner wall of the cavity structure forms the internal cavity.

8. The resonant cavity antenna according to any one of claims 2-7, characterized in that, The dielectric substrate includes a first substrate and a second substrate connected to each other; The surface of the first substrate facing away from the second substrate is the first surface, and the metal sheet is fixed to the first substrate; The surface of the second substrate facing away from the first substrate is the second surface, and the metal ground is fixed to the second substrate.

9. The resonant cavity antenna according to any one of claims 1-8, characterized in that, The dielectric substrate includes a first connection port and a communication channel, and the communication channel is connected between the internal cavity and the first connection port, and the first connection port is used to communicate with the audio cavity of the audio module.

10. The resonant cavity antenna according to any one of claims 1-9, characterized in that, The metal sheet includes a top plate and leads connected to the top plate. The leads are used as the grounding point of the metal sheet to connect to the metal ground, and there is a surface contact between the leads and the metal ground.

11. The resonant cavity antenna according to any one of claims 1-10, characterized in that, The metal sheet is a steel sheet or a flexible circuit board.

12. The resonant cavity antenna according to any one of claims 1-11, characterized in that, The grounding point of the metal sheet is connected to the metal ground through a conductive foam.

13. An electronic device, characterized in that, The audio module and the resonant cavity antenna of the electronic device; The resonant cavity antenna includes a dielectric substrate, a metal sheet and a metal ground fixed to the dielectric substrate. The metal sheet and the metal ground are arranged at intervals, and the grounding point of the metal sheet is electrically connected to the metal ground, and a resonant cavity is formed between the metal sheet and the metal ground; The resonant cavity antenna includes a closed internal cavity, and at least part of the internal cavity is a part of the resonant cavity; The audio module has an audio chamber, and the audio chamber is communicated with the internal cavity.

14. The electronic device according to claim 13, characterized in that, The electronic device includes a metal housing, and a part of the metal housing is the metal ground of the resonant cavity antenna.

15. The electronic device according to claim 14, wherein The metal housing includes a metal housing and a metal middle frame perpendicular to the metal housing, and the dielectric substrate is fixed to the metal housing; The surface of the dielectric substrate for being fixed to the metal ground includes opposite first and second sides. The first side is adjacent to the metal middle frame, and the second side is opposite to the metal middle frame; The grounding points of the metal sheet for connecting to the metal ground are distributed on the second side.

16. The electronic device according to claim 15, characterized in that, There is a gap between the resonant cavity antenna and the metal middle frame, and the resonant cavity antenna is used to transmit or receive electromagnetic waves through the gap.

17. The electronic device according to any one of claims 13-16, characterized in that, The resonant cavity antenna includes a first connection port, and the first connection port is communicated with the internal cavity; The audio module includes a second connection port, and the second connection port is communicated with the audio chamber. The second connection port is hermetically communicated with the first connection port.

18. The electronic device according to claim 17, wherein A sealing ring is arranged between the first connection port and the second connection port, and the sealing ring surrounds the channel formed by the communication of the first connection port and the second connection port.

19. The electronic device according to claim 18, wherein The sealing ring is a sealing foam or a sealing rubber sleeve.

20. The electronic device according to claim 18 or 19, characterized in that, The audio module and the resonant cavity antenna are arranged on the same layer. Along the arrangement direction of the audio module and the resonant cavity antenna, the end face of the first connection port for docking the second connection port and the end face of the second connection port for docking the first connection port are inclined and parallel to each other.

21. The electronic device according to any one of claims 13-20, characterized in that, The resonant cavity antenna includes a first boss, and the audio module includes a second boss. The first boss and the second boss are lapped and fixed along the direction perpendicular to the arrangement direction of the audio module and the resonant cavity antenna.

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