Magnetic conductive assembly, connector, data line, charger and electronic equipment

Abstract

The invention provides a magnetic attraction conductive assembly, a connector, a data line, a charger and electronic equipment. The magnetic attraction conductive assembly comprises a circuit board, a first conductive part, a second conductive part and a magnetic part, the first conductive piece and the second conductive piece are arranged on the same side of the circuit board and are electrically connected with the circuit board; the first conductive part is also arranged around the second conductive part, and is spaced from the second conductive part; and the magnetic part is arranged between the first conductive part and the second conductive part and is configured to be used for adsorbing an external conductive structure, so that the first conductive part and the second conductive part are respectively in electric contact with the external conductive structure. By means of the arrangement, the magnetic parts can be arranged through the insulation interval between the first conductive part and the second conductive part, so that waste of layout space caused by the fact that the insulation interval is independently arranged is reduced.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and specifically relates to a magnetic conductive component, a connector, a data cable, a charger, and an electronic device. Background Art

[0002] In order to improve the connection convenience between electronic products and charging devices, some electronic products and charging devices on the market are magnetically connected by setting magnets, and are synchronously conducted through reserved conduction terminals during magnetic connection. However, there are problems of relatively large waste of layout space for magnets and conduction terminals on most electronic products and charging devices. Therefore, how to reduce the waste of layout space for magnets and conduction terminals has become the main focus of those in the industry. Summary of the Invention

[0003] This application provides a magnetic conductive component on one hand. The magnetic conductive component includes: a circuit board, a first conductive member, a second conductive member, and a magnetic member; the first conductive member and the second conductive member are arranged on the same side of the circuit board and are both electrically connected to the circuit board; the first conductive member also surrounds the second conductive member and is arranged at an interval from the second conductive member; the magnetic member is arranged between the first conductive member and the second conductive member and is configured to adsorb an external conductive structure so that the first conductive member and the second conductive member are respectively in electrical contact with the external conductive structure.

[0004] This application provides a connector on one hand. The connector includes: a mounting shell and the above-mentioned magnetic conductive component; the circuit board is arranged in the mounting shell, and at least part of the areas of the first conductive member and the second conductive member are exposed outside the mounting shell to be in electrical contact with the external conductive structure.

[0005] This application provides a data cable on one hand. The data cable includes: a wire and the above-mentioned connector; one end of the wire is arranged on the mounting shell and is electrically connected to the circuit board.

[0006] This application provides a charger on one hand. The charger includes: a charging head and the above-mentioned data cable, and the charging head is connected to the other end of the wire.

[0007] This application also provides an electronic device. The electronic device includes: a device main body and the above-mentioned magnetic conductive component; the circuit board is arranged on the device main body, and at least part of the areas of the first conductive member and the second conductive member are exposed outside the device main body to be in electrical contact with the external conductive structure.

[0008] The magnetic adsorption and conductive component provided by the present application arranges a first conductive member around a second conductive member on a circuit board, and a magnetic member is arranged between the first conductive member and the second conductive member, so that the magnetic member can be arranged by using the insulating spacer space between the first conductive member and the second conductive member, thereby reducing the waste of layout space caused by separately arranging the insulating spacer. Description of the Drawings

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0010] Figure 1 It is a schematic connection structure diagram of the magnetic adsorption and conductive component and the external conductive structure provided by the embodiment of the present application;

[0011] Figure 2 is Figure 1 a schematic structure diagram of the magnetic adsorption and conductive component in

[0012] Figure 3 is Figure 2 a schematic exploded structure diagram of the magnetic adsorption and conductive component in

[0013] Figure 4 is Figure 2 a schematic cross-sectional structure diagram of the magnetic adsorption and conductive component along V-V in

[0014] Figure 5 It is another schematic structure diagram of the magnetic adsorption and conductive component provided by the embodiment of the present application;

[0015] Figure 6 is Figure 5 a schematic cross-sectional structure diagram of the magnetic adsorption and conductive component along VI-VI in

[0016] Figure 7 It is another schematic structure diagram of the magnetic adsorption and conductive component provided by the embodiment of the present application;

[0017] Figure 8 is Figure 7 a schematic cross-sectional structure diagram of the magnetic adsorption and conductive component along VI-VI in

[0018] Figure 9 is Figure 1 a schematic cross-sectional structure diagram of the external conductive structure and the magnetic adsorption and conductive component along VII-VII in

[0019] Figure 10 is Figure 1 another schematic cross-sectional structure diagram of the external conductive structure and the magnetic adsorption and conductive component along VII-VII in

[0020] Figure 11 is Figure 1 Another cross-sectional structure schematic diagram of the external conductive structure and the magnetic adsorption conductive component along VII-VII;

[0021] Figure 12 It is a cross-sectional structure schematic diagram of the charger provided by the embodiment of the present application;

[0022] Figure 13 It is a structure schematic diagram of the electronic device provided by the embodiment of the present application. Detailed implementation manners

[0023] As used herein, "electronic device" (or simply referred to as "terminal") includes, but is not limited to, devices configured to receive / transmit communication signals via wired connections (such as via the Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via wireless interfaces (such as for cellular networks, Wireless Local Area Network (WLAN), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that can combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notepads, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices including radiotelephone transceivers. A mobile phone is an electronic device configured with a cellular communication module.

[0024] Next, with reference to the accompanying drawings and embodiments, the present application will be further described in detail. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0025] Referring to "embodiment" in the present application means that the specific features, structures, or characteristics described in combination with the embodiment may be included in at least one embodiment of the present application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0026] Please refer to Figures 1 to 4 , Figure 1 which is a schematic connection structure diagram of the magnetic conductive component 100 and the external conductive structure 200 provided by the embodiments of the present application, Figure 2 and Figure 1 is a schematic structural diagram of the magnetic conductive component 100 in Figure 3 and Figure 2 is an exploded structural diagram of the magnetic conductive component 100 in Figure 4 and Figure 2 is a schematic cross-sectional structural diagram of the magnetic conductive component 100 along V-V in

[0027] The magnetic conductive component 100 provided by the embodiments of the present application can be used to achieve magnetic conductive connection between two identical or different devices, so as to realize functions such as charging or data transmission. As Figures 1 to 3 shown, the magnetic conductive component 100 may include: a circuit board 110, a first conductive member 120, a second conductive member 130, and a magnetic member 140. Among them, the first conductive member 120 and the second conductive member 130 are disposed on the same side of the circuit board 110 and are both electrically connected to the circuit board 110. The first conductive member 120 also surrounds the second conductive member 130 and is spaced apart from the second conductive member 130 to maintain electrical isolation from the second conductive member 130. The magnetic member 140 may be disposed between the first conductive member 120 and the second conductive member 130 and may be used to adsorb the external conductive structure 200 so that the first conductive member 120 and the second conductive member 130 are respectively in electrical contact with the external conductive structure 200.

[0028] Through the above settings, the magnetic conductive component 100 can be magnetically connected to the external conductive structure 200 through the magnetic member 140, and can be electrically connected to the external conductive structure 200 through the first conductive member 120 and the second conductive member 130 while magnetically connected, so as to realize the magnetic conductive connection between the magnetic conductive component 100 and the external conductive structure 200. At the same time, since the magnetic member 140 is arranged by using the insulating space between the first conductive member 120 and the second conductive member 130 to maintain insulation, it is also possible to reduce the waste of layout space caused by separately designing the insulating interval.

[0029] Furthermore, the reduction of layout space waste can make the layout of the first conductive member 120, the second conductive member 130, and the magnetic member 140 more compact, so as to reduce the layout space required by the first conductive member 120, the second conductive member 130, and the magnetic member 140, which is conducive to the miniaturization of the magnetic conductive assembly 100. Or, the reduction of layout space waste can, without changing the original layout space, increase the volume of the magnetic member 140 by using the insulation gap between the first conductive member 120 and the second conductive member 130, so as to enhance the magnetism of the magnetic member 140, thereby improving the magnetic adsorption firmness between the magnetic conductive assembly 100 and the external conductive structure 200.

[0030] The circuit board 110 can be used to mount the first conductive member 120, the second conductive member 130, and the magnetic member 140, and can be electrically connected to the first conductive member 120 and the second conductive member 130 respectively. Moreover, the circuit board 110 can also be electrically connected to the device provided with the magnetic conductive assembly 100. Among them, the circuit board 110 can be a rigid circuit board, so that the circuit board 110 can have a certain rigidity to better support the first conductive member 120, the second conductive member 130, and the magnetic member 140. At the same time, the circuit board 110 can also be electrically connected to the main board of the device equipped with the magnetic conductive assembly 100 through a board-to-board connector, and various electronic components can also be integrated on the circuit board 110 to achieve functions such as current control, current protection, and anti-static. Of course, in addition to the rigid circuit board, the circuit board 110 can also be a flexible circuit board, so that the circuit board 110 can have a smaller volume to reduce the occupied space of the circuit board 110.

[0031] The first conductive member 120 can be disposed on the circuit board 110 and can be in electrical contact with the external conductive structure 200 to conduct electricity between the circuit board 110 and the external conductive structure 200. As Figures 3 to 4 shown, the first conductive member 120 can be arranged around the second conductive member 130, so that even if the external conductive structure 200 rotates around the second conductive member 130, the first conductive member 120 can remain in contact with the external conductive structure 200 during the rotation process to improve the electrical connection stability between the magnetic conductive assembly 100 and the external conductive structure 200. Among them, the first conductive member 120 can be the negative electrode of the magnetic conductive assembly 100 and can be fixed on the circuit board 110 by means of soldering through a pad or bonding with a conductive adhesive.

[0032] The first conductive member 120 can also cooperate with the circuit board 110 and the second conductive member 130 to enclose a shielding space 150. The magnetic member 140 can be disposed within the shielding space 150 and can adsorb an external conductive structure 200, so that the external conductive structure 200 is in electrical contact with the side of the first conductive member 120 facing away from the circuit board 110. Among them, the shielding space 150 can be used to shield the magnetic member 140, so that the magnetic member 140 can be hidden within the shielding space 150 to prevent the magnetic member 140 from being directly exposed outside the magnetic adsorption conductive component 100. At the same time, since the side of the first conductive member 120 facing away from the circuit board 110 is in electrical contact with the external conductive structure 200, only the side of the first conductive member 120 facing away from the circuit board 110 needs to be exposed outside the device, so as to reduce the area of the first conductive member 120 exposed to the external environment.

[0033] To enclose the shielding space 150, the first conductive member 120 can include: a side wall 121 and a top wall 122. As Figures 3 to 4 shown, the side wall 121 can be disposed on the circuit board 110 and can be arranged around the second conductive member 130. The side wall 121 can be electrically connected to the circuit board 110 and the top wall 122 respectively. The top wall 122 can be connected to the side of the side wall 121 facing away from the circuit board 110, and can be arranged opposite to and spaced from the circuit board 110. The top wall 122 can also be arranged around the second conductive member 130. Among them, the side wall 121, the top wall 122, the circuit board 110 and the second conductive member 130 can jointly enclose the shielding space 150. The magnetic member 140 can adsorb the external conductive structure 200 from the side of the top wall 122 facing away from the circuit board 110, so that the external conductive structure 200 is in electrical contact with the side of the top wall 122 facing away from the circuit board 110.

[0034] Through the above settings, the top wall 122 can reuse the space occupied by the magnetic member 140 on the circuit board 110 to be in electrical contact with the external conductive structure 200 while shielding the magnetic member 140. This is conducive to making the side wall 121 thinner in the direction away from the second conductive member 130, so that the first conductive member 120, the second conductive member 130 and the magnetic member 140 can be more compactly arranged. Or, the space saved by making the side wall 121 thinner can be used to arrange a larger magnetic member 140 to enhance the magnetism of the magnetic member 140, thereby improving the magnetic adsorption firmness between the magnetic adsorption conductive component 100 and the external conductive structure 200.

[0035] In some embodiments, in addition to being made of conventional conductive materials, the first conductive member 120 can also be made of materials with certain magnetism such as permalloy, stainless steel and iron, so that the first conductive member 120 can also enhance the magnetism of the magnetic member 140 to improve the firmness of the electrical contact between the first conductive member 120 and the external conductive structure 200.

[0036] In some embodiments, in addition to using the first conductive member 120 to shield the magnetic member 140, the second conductive member 130 can also be used to shield the magnetic member 140. For example, one end of the second conductive member 130 away from the circuit board 110 can protrude laterally to form a shielding structure similar to the top wall 122, so as to jointly enclose a shielding space 150 with the circuit board 110 and the first conductive member 120 to shield and hide the magnetic member 140.

[0037] In some embodiments, the first conductive member 120 can also directly shield the magnetic member 140 by using the top wall 122, rather than being limited to jointly enclosing a shielding space 150 with the circuit board 110 and the second conductive member 130. Similarly, the second conductive member 130 can also directly shield the magnetic member 140 by using the shielding structure, rather than being limited to jointly enclosing a shielding space 150 with the circuit board 110 and the first conductive member 120.

[0038] In some embodiments, the design of the top wall 122 can also be omitted, and the magnetic member 140 can be directly exposed to the external environment. At this time, in order to ensure that the first conductive member 120 has sufficient contact area for electrical contact with the external conductive structure 200, the side wall 121 can be thickened in the direction away from the second conductive member 130 to expand the surface area on the side of the side wall 121 facing away from the circuit board 110, so as to ensure the electrical connection reliability between the first conductive member 120 and the external conductive structure 200.

[0039] In some embodiments, in addition to being able to electrically contact the side of the first conductive member 120 facing away from the circuit board 110, the external conductive structure 200 can also electrically contact the side of the first conductive member 120 facing away from the second conductive member 130, that is, the side of the side wall 121 facing away from the magnetic member 140. For example, the side of the side wall 121 facing away from the magnetic member 140 can also be exposed to the external environment, and the external conductive structure 200 can cover the first conductive member 120 and the second conductive member 130 to electrically contact the side of the side wall 121 facing away from the magnetic member 140. At the same time, considering the influence of factors such as tolerances, the external conductive structure 200 can use an elastic conductive structure such as an elastic probe to electrically contact the side wall 121.

[0040] The second conductive member 130 and the first conductive member 120 can be arranged on the same side of the circuit board 110 and can be electrically contacted with the external conductive structure 200 to conduct the circuit board 110 and the external conductive structure 200. As Figures 3 to 4As shown, the second conductive member 130 can be disposed within the space formed by surrounding the first conductive member 120, and can be spaced apart from the side wall 121 and the top wall 122 of the first conductive member 120 to be electrically isolated from the first conductive member 120. At the same time, the side of the second conductive member 130 facing away from the circuit board 110 can be used for electrical contact with the external conductive structure 200 to improve the consistency of electrical contact between the first conductive member 120 and the second conductive member 130 and the external conductive structure 200. Among them, the second conductive member 130 can be the positive electrode of the magnetic conductive assembly 100, and can be fixed on the circuit board 110 by means such as soldering through a pad or bonding with a conductive adhesive.

[0041] Since the magnetic member 140 is located between the second conductive member 130 and the side wall 121, and the top wall 122 is not blocked by the magnetic member 140, a certain spacing distance needs to be designed between the top wall 122 and the second conductive member 130 to eliminate the influence brought by factors such as tolerances. Among them, the spacing between the surface of the top wall 122 facing the second conductive member 130 and the second conductive member 130 can be 0.05 mm - 0.2 mm, specifically it can be 0.05 mm, 0.1 mm, 0.15 mm or 0.2 mm, and the spacing within this range can, while maintaining the electrical isolation between the top wall 122 and the second conductive member 130, minimize the impact of the insulation interval on the overall miniaturization of the magnetic conductive assembly 100.

[0042] Considering that a relatively small insulation interval may fail under external force impact, that is, the first conductive member 120 is deformed by external force impact and contacts the second conductive member 130, at least one of the first conductive member 120 and the second conductive member 130 can also be provided with an insulating layer 160, and the insulating layer 160 can be located on the surfaces of the first conductive member 120 and the second conductive member 130 close to each other. For example, an insulating layer 160 can be provided on a partial surface of the top wall 122 close to the second conductive member 130. When the top wall 122 is deformed by external force impact and contacts the second conductive member 130, the insulating layer 160 can electrically isolate the top wall 122 and the second conductive member 130. Of course, the insulating layer 160 can completely cover the outer surfaces of the first conductive member 120 and / or the second conductive member 130.

[0043] In some embodiments, the insulating layer 160 can be formed on the first conductive member 120 and / or the second conductive member 130 by means such as coating or spraying of an insulating material, so as to reduce the space occupied by the insulating layer 160 while achieving electrical isolation between the first conductive member 120 and the second conductive member 130. Of course, the insulating layer 160 can also be fixed on the surfaces of the first conductive member 120 and / or the second conductive member 130 by bonding, and there can be various specific formation methods of the insulating layer 160, which are not listed one by one in this embodiment.

[0044] In some embodiments, in addition to being made of conventional conductive materials, the second conductive member 130 can also be made of a strong magnetic material with conductivity, so that the second conductive member 130 can have both conductivity and magnetism at the same time. When the magnetic member 140 adsorbs the external conductive structure 200, the side of the second conductive member 130 facing away from the circuit board 110 can also adsorb the external conductive structure 200 and make electrical contact with the external conductive structure 200, so as to improve the magnetic adsorption firmness between the magnetic adsorption conductive assembly 100 and the external conductive structure 200.

[0045] Furthermore, the magnetic poles of the external conductive structure 200 adsorbed by the magnetic member 140 can be different from the magnetic poles of the external conductive structure 200 adsorbed by the second conductive member 130, so that the magnetic adsorption conductive assembly 100 and the external conductive structure 200 can be positioned and connected by different magnetic poles. Of course, the magnetic poles of the external conductive structure 200 adsorbed by the magnetic member 140 can also be the same as the magnetic poles of the external conductive structure 200 adsorbed by the second conductive member 130, as long as the magnetic member 140 and the second conductive member 130 can cooperate to adsorb the external conductive structure 200.

[0046] The terms "first", "second", and "third" in this application are only for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features.

[0047] Please refer to Figures 5 to 6 , Figure 5 which is another schematic structural diagram of the magnetic adsorption conductive assembly 100 provided by the embodiments of this application, Figure 6 is Figure 5 the schematic cross-sectional structure of the magnetic adsorption conductive assembly 100 along VI-VI in

[0048] Considering the influence of factors such as tolerances, there may be a problem of contact deviation between the first conductive member 120 and the second conductive member 130, that is, they cannot maintain electrical contact with the external conductive structure 200 at the same time. Therefore, the second conductive member 130 provided by the embodiments of this application can also have elasticity. As Figures 5 to 6 shown, the second conductive member 130 can protrude from the first conductive member 120 in the direction away from the circuit board 110, and when the side of the first conductive member 120 facing away from the circuit board 110 makes electrical contact with the external conductive structure 200, the second conductive member 130 can undergo elastic deformation under the pressure of the external conductive structure 200, so as to abut against the external conductive structure 200 under the action of elastic force. With such a setting, the second conductive member 130 can use the elastic force generated by itself to eliminate the influence brought by factors such as tolerances, so as to improve the electrical connection reliability between the magnetic adsorption conductive assembly 100 and the external conductive structure 200.

[0049] To make the second conductive member 130 elastic, the second conductive member 130 may include: a fixing portion 131, a resisting portion 132, and an elastic portion 133. Among them, the fixing portion 131 may be disposed within the space formed by surrounding the first conductive member 120 on the circuit board 110, and may be spaced apart from the first conductive member 120. The fixing portion 131 may also surround and form a sliding space 1311. The resisting portion 132 may be slidably disposed within the sliding space 1311, and may protrude from the side of the fixing portion 131 facing away from the circuit board 110, and the resisting portion 132 may also protrude from the side of the first conductive member 120 facing away from the circuit board 110, that is, the side of the top wall 122 facing away from the circuit board 110, so as to be in electrical contact with the external conductive structure 200. The elastic portion 133 may be disposed within the sliding space 1311, and is electrically connected to the resisting portion 132 and the circuit board 110 respectively. When the external conductive structure 200 is in electrical contact with the resisting portion 132, the elastic portion 133 may be elastically deformed under the pressure of the resisting portion 132 to generate an elastic force to drive the resisting portion 132 to abut against the external conductive structure 200.

[0050] Through the above arrangement, when the magnetic member 140 adsorbs the external conductive structure 200 to be in electrical contact with the first conductive member 120, since the resisting portion 132 protrudes from the side of the first conductive member 120 facing away from the circuit board 110, the external conductive structure 200 will push the resisting portion 132 to displace in the direction close to the circuit board 110, and the resisting portion 132 can press the elastic portion 133 to elastically deform, so as to abut against the external conductive structure 200 under the drive of the elastic force generated by the elastic portion 133, thereby improving the reliability of electrical contact between the second conductive member 130 and the external conductive structure 200.

[0051] In addition to surrounding and forming the sliding space 1311 to accommodate the resisting portion 132 and the elastic portion 133, the fixing portion 131 can also provide guidance for the sliding of the resisting portion 132 and can provide shielding for the elastic portion 133 to prevent the elastic portion 133 from being directly exposed to the external environment. Among them, the fixing portion 131 may be made of an insulating material, so that the fixing portion 131 can also electrically isolate the first conductive member 120 and the resisting portion 132, and the first conductive member 120 and the elastic portion 133, so as to omit the design of the aforementioned insulating layer 160. Alternatively, the fixing portion 131 may also be made of a metal material, so that the fixing portion 131 can be electrically connected to the resisting portion 132 and the elastic portion 133 to conduct the external conductive structure 200 and the circuit board 110 together with the resisting portion 132 and the elastic portion 133, thereby improving the electrical connection reliability of the second conductive member 130. At this time, the insulating layer 160 may be located on the surface of the fixing portion 131 facing away from the sliding space 1311, that is, the surface close to the top wall 122, to electrically isolate the fixing portion 131 and the first conductive member 120.

[0052] The abutting portion 132 can be slidably disposed within the sliding space 1311, and can protrude from the side of the fixing portion 131 away from the circuit board 110, and be disposed on the side of the first conductive member 120 away from the circuit board 110. At the same time, the abutting portion 132 can also be engaged with the fixing portion 131 in the direction away from the circuit board 110 to prevent the abutting portion 132 from disengaging from the sliding space 1311. For example, the fixing portion 131 can have a retaining wall 1312 protruding into the sliding space 1311, and the retaining wall 1312 can be disposed at the end of the fixing portion 131 away from the circuit board 110. A convex edge 1321 can be formed on the circumferential side of the abutting portion 132, and the convex edge 1321 can be engaged with the retaining wall 1312 in the direction away from the circuit board 110 to limit the sliding range of the abutting portion 132. In this embodiment, the abutting portion 132 can be made of a metal material and can be in electrical contact with the external conductive structure 200.

[0053] The elastic portion 133 can be disposed within the sliding space 1311, and can be electrically connected to the abutting portion 132 and the circuit board 110 respectively, and the elastic portion 133 can also undergo elastic deformation under the pressing of the abutting portion 132. Among them, the elastic portion 133 can be a metal spring, and the opposite ends of the elastic portion 133 can be welded to the abutting portion 132 and the circuit board 110 respectively to improve the electrical connection reliability between the elastic portion 133 and the abutting portion 132 and the circuit board 110. Of course, the elastic portion 133 is not limited to a spring, and the elastic portion 133 can also be an elastic conductive structure such as a spring piece or a conductive gasket, and can be electrically connected to the abutting portion 132 and the circuit board 110 respectively by means of contact, welding, fusing or bonding. In addition, the elastic portion 133 can also be an elastic conductive structure formed by an elastic conductive material filled in the sliding space 1311, as long as the elastic portion 133 can be electrically connected to the abutting portion 132 and the circuit board 110 respectively and can undergo elastic deformation under the pressing of the abutting portion 132.

[0054] In some embodiments, in addition to using the first conductive member 120 and the second conductive member 130 to respectively form two paths to conduct the circuit board 110 and the external conductive structure 200, a path can also be added between the magnetic attraction conductive component 100 and the external conductive structure 200 by using the fixing portion 131, so as to realize functions such as data transmission while charging by using the paths formed by the first conductive member 120 and the second conductive member 130, thereby expanding the functions of the magnetic attraction conductive component 100. Among them, the fixing portion 131 can be electrically connected to the circuit board 110, and can be electrically isolated from the abutting portion 132 and the elastic portion 133. When the external conductive structure 200 is in electrical contact with the abutting portion 132, the side of the fixing portion 131 away from the circuit board 110 can also be in electrical contact with the external conductive structure 200 to conduct the circuit board 110 and the external conductive structure 200, thereby adding a path for realizing functions such as data transmission.

[0055] Further, the fixing portion 131 can be made of a metal material so that the fixing portion 131 can be electrically connected to the circuit board 110 by means such as soldering. At the same time, the surface of the fixing portion 131 located within the sliding space 1311 can also be provided with the aforementioned insulating layer 160 to maintain electrical isolation between the fixing portion 131 and the abutting portion 132 and the elastic portion 133 by means of the insulating layer 160. In addition, the side of the fixing portion 131 facing away from the circuit board 110 can also be exposed outside the magnetic conductive component 100 and can be flush with the side of the first conductive member 120 facing away from the circuit board 110, so that the side of the fixing portion 131 facing away from the circuit board 110 can be in electrical contact with the external conductive structure 200 synchronously with the first conductive member 120.

[0056] In some embodiments, in addition to maintaining electrical isolation between the fixing portion 131 and the abutting portion 132 and the elastic portion 133 by means of the insulating layer 160, the fixing portion 131 can also be divided into an insulating portion close to the sliding space 1311 and a conductive portion away from the sliding space 1311, and the insulating portion and the conductive portion can be integrally formed by metal insert molding or connected and fixed by means of bonding. Among them, the insulating portion can be used to electrically isolate the conductive portion from the abutting portion 132 and the elastic portion 133, while the conductive portion can be electrically connected to the circuit board 110, and a part of the surface of the conductive portion can also be arranged facing away from the circuit board 110 to make electrical contact with the external conductive structure 200.

[0057] In some embodiments, considering the influence of factors such as tolerances, the side of the fixing portion 131 facing away from the circuit board 110 may not be completely flush with the side of the first conductive member 120 facing away from the circuit board 110. Therefore, an elastic conductive structure such as elastic conductive glue can be provided on the side of the fixing portion 131 facing away from the circuit board 110 to absorb the contact gap between the external conductive structure 200 and the fixing portion 131 by means of the elastic conductive glue, thereby improving the electrical connection reliability between the fixing portion 131 and the external conductive structure 200.

[0058] In some embodiments, in addition to the above-described solutions for the fixing portion 131, the abutting portion 132, and the elastic portion 133, the second conductive member 130 can also adopt other solutions to abut against the external conductive structure 200. For example, the second conductive member 130 can also be divided into a metal portion electrically connected to the circuit board 110 and an elastic conductive structure (such as the aforementioned elastic conductive glue) provided on the side of the metal portion facing away from the circuit board 110 to make electrical contact with and abut against the external conductive structure 200 by means of the elastic conductive structure. Of course, there can be various elastic solutions for the second conductive member 130, and they are not listed one by one in this embodiment.

[0059] Please refer to Figures 7 to 8 , Figure 7It is another structural schematic diagram of the magnetic attraction and conductive component 100 provided by the embodiments of the present application. Figure 8 It is Figure 7 The cross-sectional structural schematic diagram of the magnetic attraction and conductive component 100 along VI-VI in

[0060] In some embodiments, in addition to providing an insulating layer 160 to electrically isolate the first conductive member 120 from the second conductive member 130, the first conductive member 120 can also be arranged in the same way as the aforementioned fixing portion 131. As Figures 7 to 8 shown, the first conductive member 120 can include: an insulating portion 123 and a conductive portion 124. Among them, the insulating portion 123 can be arranged on the circuit board 110 and can be arranged around the second conductive member 130, and the insulating portion 123 can also jointly enclose the aforementioned shielding space 150 with the second conductive member 130 and the circuit board 110. The conductive portion 124 can be arranged on the insulating portion 123 and can be electrically connected to the circuit board 110, and a partial area of the conductive portion 124 is also exposed on the side of the insulating portion 123 facing away from the circuit board 110 and can be used for electrical contact with the external conductive structure 200 to conduct the external conductive structure 200 and the circuit board 110.

[0061] The insulating portion 123 can be structurally similar to the combination of the side wall 121 and the top wall 122 in the aforementioned solution, so that the insulating portion 123 can jointly enclose the shielding space 150 with the circuit board 110 and the second conductive member 130. At the same time, the conductive portion 124 and the insulating portion 123 can be integrally formed by the metal insert injection molding process, so that the conductive portion 124 can be embedded in the insulating portion 123, and a partial surface of the conductive portion 124 can also be exposed on the side of the insulating portion 123 facing away from the circuit board 110 for electrical contact with the external conductive structure 200. Alternatively, the conductive portion 124 can also be bonded to the side of the insulating portion 123 facing away from the shielding space 150 and can be exposed on the surface of the insulating portion 123 facing away from the circuit board 110 and on the surface of the insulating portion 123 facing away from the second conductive member 130.

[0062] In some embodiments, in addition to adding a path between the magnetic attraction and conductive component 100 and the external conductive structure 200 through the fixing portion 131, multiple paths can also be formed between the magnetic attraction and conductive component 100 and the external conductive structure 200 by using the conductive portion 124. As Figures 7 to 8As shown, the number of the conductive parts 124 can be multiple, and the multiple conductive parts 124 can be disposed on the insulating part 123 at intervals along the direction around the second conductive part 130, so that electrical isolation can be maintained between the multiple conductive parts 124, and the multiple conductive parts 124 are respectively used to conduct the circuit board 110 and the external conductive structure 200, thereby forming multiple paths between the magnetic conductive component 100 and the external conductive structure 200. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0063] In some embodiments, when it is not necessary to increase multiple paths, the multiple conductive parts 124 can also be connected to form an integral body to form a larger conductive part 124 to conduct the circuit board 110 and the external conductive structure. At this time, the conductive part 124 can also be disposed around the second conductive part 130, and can completely cover the surface of the insulating part 123 facing away from the circuit board 110 and the surface of the insulating part 123 facing away from the second conductive part 130.

[0064] The magnetic part 140 can be hidden in the shielding space 150 and can adsorb the external conductive structure 200 to be in electrical contact with the first conductive part 120 and the second conductive part 130 respectively. As Figures 7 to 8 shown, the magnetic part 140 can also be disposed around the second conductive part 130 and can separate the first conductive part 120 and the second conductive part 130, that is, separate the side wall 121 and the second conductive part 130, so as to maintain electrical isolation between the first conductive part 120 and the second conductive part 130. Wherein, the side of the magnetic part 140 facing away from the circuit board 110 can be used to adsorb the external conductive structure 200, so that the external conductive structure 200 can be in electrical contact with the side of the first conductive part 120 facing away from the circuit board 110 and the side of the second conductive part 130 facing away from the circuit board 110 respectively. Of course, in some embodiments, the magnetic part 140 is not limited to being disposed around the second conductive part 130, and it is only necessary that the magnetic part 140 is disposed between the first conductive part 120 and the second conductive part 130 and can adsorb the external conductive structure 200.

[0065] In some embodiments, the number of the magnetic members 140 can also be multiple, and the multiple magnetic members 140 can be disposed at intervals between the first conductive member 120 and the second conductive member 130, that is, within the shielding space 150, and can be arranged to surround the second conductive member 130 together. Among them, the magnetic poles on the side of some of the magnetic members 140 facing away from the circuit board 110 are different from the magnetic poles on the side of the remaining magnetic members 140 facing away from the circuit board 110, so that the magnetic adsorption conductive assembly 100 can use the arrangement method with different magnetic poles of the multiple magnetic members 140 to perform positioning adsorption with the external conductive structure 200. That is, the external conductive structure 200 has multiple magnets corresponding to the multiple magnetic members 140 one by one and with different magnetic poles, so as to perform one-to-one positioning adsorption with the multiple magnetic members 140, thereby ensuring that the multiple conductive parts 124 can be in electrical contact with the multiple conductive structures on the external conductive structure 200 one by one. Of course, the solution of the multiple magnetic members 140 can be used not only for Figures 7 to 8 the magnetic adsorption conductive assembly 100 shown in Figures 3 to 6 but also for

[0066] All the directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the drawings). If this specific posture changes, the directional indication will also change accordingly. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0067] Please refer to Figures 9 to 11 , Figure 9 which is Figure 1 a schematic cross-sectional structure diagram of the external conductive structure and the magnetic adsorption conductive assembly 100 along VII-VII in Figure 10 and Figure 1 is Figure 11 another schematic cross-sectional structure diagram of the external conductive structure and the magnetic adsorption conductive assembly 100 along VII-VII in Figure 1 and

[0068] The structure of the external conductive structure 200 can be the same as or similar to that of the magnetic attraction conductive component 100, such that the external conductive structure 200 can magnetically connect with the magnetic component 140 of the magnetic attraction conductive component 100 by using its own magnetic component 140, and can electrically contact the first conductive member 120 and the second conductive member 130 of the magnetic attraction conductive component 100 by using its own first conductive member 120 and second conductive member 130 respectively. Among them, the external conductive structure 200 and the magnetic attraction conductive component 100 can be Figure 9 the same structure shown, and both use an inelastic second conductive member 130. Or, the external conductive structure 200 and the magnetic attraction conductive component 100 can also be Figure 10 a similar structure shown, one uses an elastic second conductive member 130, while the other uses an inelastic second conductive member 130.

[0069] It can be understood that, in addition to the solutions shown in Figure 9 and Figure 10 for the magnetic attraction conductive component 100, the structure of the external conductive structure 200 can also adopt other solutions of the magnetic attraction conductive component 100 shown in the foregoing embodiments. For example, both the magnetic attraction conductive component 100 and the external conductive structure 200 can adopt the solution of the magnetic attraction conductive component 100 with an inelastic second conductive member 130, or both can adopt the solution of the magnetic attraction conductive component 100 with multiple conductive portions 124, as long as the external conductive structure 200 can perform corresponding magnetic attraction electrical connection with the magnetic attraction conductive component 100.

[0070] In some embodiments, the external conductive structure 200 can also omit the design of the magnetic component 140, which can not only simplify the structure of the external conductive structure 200, but also reduce the size of the external conductive structure 200. That is, the external conductive structure 200 can omit the design of the magnetic component 140 on the basis of the structure of the magnetic attraction conductive component 100, and rely on the magnetic component 140 on the magnetic attraction conductive component 100 for magnetic attraction electrical connection. As Figure 11 shown, the external conductive structure 200 can also include: a first conduction portion 210, a second conduction portion 220, and a bearing portion 230. Among them, the first conduction portion 210 and the second conduction portion 220 can be disposed on the same side of the bearing portion 230, and can both be electrically connected to the bearing portion 230, and the first conduction portion 210 can also be disposed around the second conduction portion 220. At the same time, the first conduction portion 210 can be adsorbed by the magnetic component 140 on the magnetic attraction conductive component 100 to drive the second conduction portion 220 to electrically contact the first conductive member 120 and the second conductive member 130 on the magnetic attraction conductive component 100 respectively.

[0071] In some embodiments, in addition to being positioned and connected by a plurality of magnetic members 140 with different magnetic poles, the magnetic conductive component 100 and the external conductive structure 200 can also be positioned and connected by structural limitation. As Figure 9 shown, when the external conductive structure 200 is in electrical contact with the first conductive member 120 and the second conductive member 130 respectively, at least one of the first conductive member 120 and the second conductive member 130 in the magnetic conductive component 100 can be engaged with the external conductive structure 200 to limit the misalignment sliding of the external conductive structure 200 on the side of the first conductive member 120 and the second conductive member 130 facing away from the circuit board 110.

[0072] Taking the engagement of the first conductive member 120 of the magnetic conductive component 100 with the external conductive structure 200 as an example, a protrusion 125 can be provided on the first conductive member 120 of the magnetic conductive component 100, and a groove 201 can be provided on the first conductive member 120 of the external conductive structure 200. When the first conductive member 120 of the magnetic conductive component 100 is in electrical contact with the first conductive member 120 of the external conductive structure 200, the protrusion 125 can be disposed in the groove 201 and can be engaged with the side wall of the groove 201, that is, the first conductive member 120 of the external conductive structure 200, to limit the misalignment sliding of the magnetic conductive component 100 and the external conductive structure 200.

[0073] In some embodiments, the positions of the protrusion 125 and the groove 201 can also be interchanged. That is, the first conductive member 120 of the magnetic conductive component 100 has the groove 201, and the first conductive member 120 of the external conductive structure 200 has the protrusion 125. Similarly, the second conductive member 130 of the magnetic conductive component 100 and the second conductive member 130 of the external conductive structure 200 can also be positioned and connected by means of the protrusion 125 and the groove 201.

[0074] In some embodiments, considering that the magnetic conductive component 100 and the external conductive structure 200 can also rotate, the groove 201 can also be an annular groove provided around the second conductive member 130. When the magnetic conductive component 100 and the external conductive structure 200 rotate, the protrusion 125 can rotate around the second conductive member 130 in the groove 201 to prevent the protrusion 125 and the groove 201 from restricting the rotation of the magnetic conductive component 100 and the external conductive structure 200.

[0075] In some embodiments, the design of the protrusion 125 and the groove 201 can also be formed at other positions of the magnetic conductive component 100 and the external conductive structure 200. For example, when the magnetic conductive component 100 and the external conductive structure 200 adopt the Figure 7 shown structural solution, the design of the protrusion 125 and the groove 201 can also be formed on the insulating portions 123 of the magnetic conductive component 100 and the external conductive structure 200 respectively.

[0076] It can be understood that, in addition to the positioning connection scheme through the cooperation of the protrusion 125 and the groove 201, the magnetic conductive component 100 and the external conductive structure 200 can also adopt other similar anti-fooling designs for positioning connection, and the embodiments will not list and illustrate them one by one here.

[0077] Please refer to Figures 12 to 13 , Figure 12 which is a schematic cross-sectional structure diagram of the charger 20 provided by the embodiment of the present application, Figure 13 and which is a schematic structural diagram of the electronic device 10 provided by the embodiment of the present application.

[0078] The embodiment of the present application also provides a charger 20, and the charger 20 may include: a charging head 21 and a data cable 22. As Figure 12 shown, the charging head 21 can be connected to the data cable 22, and the data cable 22 may also have the magnetic conductive component 100 in the foregoing embodiment, so that the charging head 21 can be conducted through the data cable 22 with the external conductive structure 200 to connect to an external power supply to supply power to the device equipped with the external conductive structure 200.

[0079] Further, the data cable 22 may include: a wire 221 and a connector 222. Wherein, one end of the wire 221 can be connected to the connector 222, and the other end can be connected to the charging head 21 in a detachable or non-detachable manner. At the same time, the connector 222 may have the magnetic conductive component 100 in the foregoing embodiment, and the wire 221 can conduct the magnetic conductive components 100 on the charging head 21 and the connector 222, so that the charging head 21 can connect to an external power supply to supply power to the device equipped with the external conductive structure 200.

[0080] Further, the connector 222 may include: a mounting shell 2221 and the magnetic conductive component 100 in the foregoing embodiment. Wherein, the circuit board 110 of the magnetic conductive component 100 can be disposed in the mounting shell 2221, and at least partial regions of the first conductive member 120 and the second conductive member 130 are exposed outside the mounting shell 2221 to make electrical contact with the external conductive structure 200. At the same time, one end of the wire 221 can be connected to the mounting shell 2221 in a detachable or non-detachable manner and can be electrically connected to the circuit board 110 in the mounting shell 2221, so that the wire 221 can conduct the charging head 21 and the magnetic conductive component 100. It can be understood that the leading-out direction of the wire 221 in Figure 12 is only an exemplary illustration, and the wire 221 is not limited to leading out from the bottom of the mounting shell 2221.

[0081] In some embodiments, the connector 222 referred to in this embodiment can be detachably or non-detachably disposed on corresponding devices, such as smartphones, wireless earphones, smart glasses, action cameras, and smart watches, etc., in addition to being used for charging devices such as charger 20, so as to achieve electrical connection between the device and the charging device equipped with the external conductive structure 200.

[0082] An embodiment of the present application also provides an electronic device 10, and the electronic device 10 can be an electrical device such as a smartphone, wireless earphone, smart glass, action camera, and smart watch. As Figure 12 shown, the electronic device 10 may include: a device main body 11 and the magnetic conductive component 100 in the above embodiment. Among them, the circuit board 110 of the magnetic conductive component 100 can be disposed inside the device main body 11, and at least part of the regions of the first conductive member 120 and the second conductive member 130 can be exposed outside the device main body 11 to be in electrical contact with the external conductive structure 200. At the same time, the circuit board 110 can also be electrically connected to corresponding electronic components inside the device main body 11, such as a main board or a battery, etc., so that the device main body 11 can be electrically connected to a charging device equipped with an external conductive structure 200, such as the aforementioned charger 20, through the magnetic conductive component 100.

[0083] In the magnetic conductive component 100 provided by the present application, by arranging the first conductive member 120 around the second conductive member 130 on the circuit board 110, and the magnetic member 140 is disposed between the first conductive member 120 and the second conductive member 130, the magnetic member 140 can be arranged by using the insulating space between the first conductive member 120 and the second conductive member 130 to maintain insulation, so as to reduce the waste of layout space caused by separately arranging the insulating space.

[0084] The above are only some embodiments of the present application, and thus do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A magnetic conductive component, characterized in that, The magnetic conductive component comprises: a circuit board, a first conductive member, a second conductive member and a magnetic member; The first conductive member and the second conductive member are arranged on the same side of the circuit board and are both electrically connected to the circuit board; the first conductive member is also arranged around the second conductive member and is spaced apart from the second conductive member; The magnetic member is disposed between the first conductive member and the second conductive member, and is configured to absorb an external conductive structure so that the first conductive member and the second conductive member are in electrical contact with the external conductive structure respectively.

2. The magnetic conductive component according to claim 1, wherein The first conductive member, the second conductive member and the circuit board are jointly arranged to form a shielding space; The magnetic member is hidden in the shielding space and adsorbs the external conductive structure to be in electrical contact with a side of the first conductive member facing away from the circuit board and a side of the second conductive member facing away from the circuit board.

3. The magnetic conductive component according to claim 2, wherein The first conductive member includes: a side wall and a top wall both disposed around the second conductive member; The side walls are electrically connected to the top wall and the circuit board, respectively; the top wall is opposite to the circuit board and is spaced apart from it, and is together with the side walls, the second conductive member and the circuit board to form the shielding space; the magnetic member absorbs the external conductive structure and makes electrical contact with the side of the top wall facing away from the circuit board.

4. The magnetic conductive component according to claim 2, wherein The second conductive member is elastic and is configured to be elastically deformed when in electrical contact with the external conductive structure, so as to abut against the external conductive structure under the action of elastic force.

5. The magnetic conductive component according to claim 4, wherein The second conductive member includes: a fixing portion, a supporting portion and an elastic portion; The fixing portion is disposed on the circuit board and is surrounded by a sliding space; the abutting portion is slidably disposed in the sliding space and protrudes from a side of the fixing portion away from the circuit board and a side of the first conductive member away from the circuit board; The elastic portion is arranged in the sliding space and is electrically connected to the supporting portion and the circuit board respectively; when the external conductive structure is in electrical contact with the first conductive member, the supporting portion presses the elastic portion under the push of the external conductive structure, so as to be in contact with the external conductive structure under the drive of the elastic force generated by the elastic portion.

6. The magnetic conductive component according to claim 5, wherein The fixing portion is electrically connected to the circuit board and is electrically isolated from the abutting portion and the elastic portion; When the external conductive structure is in electrical contact with the abutting portion, the side of the fixing portion facing away from the circuit board is also in electrical contact with the external conductive structure.

7. The magnetic conductive component according to claim 2, wherein The first conductive member comprises: an insulating portion and a conductive portion; The insulating portion is disposed on the circuit board and is arranged around the second conductive member, and the insulating portion is also jointly arranged with the second conductive member and the circuit board to form the shielding space; The conductive part is arranged on the insulating part and is electrically connected to the circuit board; a partial area of ​​the conductive part is also exposed on a side of the insulating part away from the circuit board so as to be in electrical contact with the external conductive structure.

8. The magnetic conductive component according to claim 7, wherein There are a plurality of the conductive parts, and the plurality of the conductive parts are arranged on the insulating part at intervals along a direction surrounding the second conductive member.

9. The magnetic conductive component according to claim 1, wherein The magnetic member also surrounds the first conductive member and separates the first conductive member and the second conductive member.

10. The magnetic conductive component according to claim 2, wherein The number of the magnetic members is plural, and the plural magnetic members are disposed between the first conductive member and the second conductive member at intervals and commonly surround the second conductive member; The magnetic poles of one part of the magnetic members on the side facing away from the circuit board are different from the magnetic poles of the remaining part of the magnetic members on the side facing away from the circuit board, so as to position and adsorb the external conductive structure.

11. The magnetic conductive component according to claim 1, wherein When the external conductive structure is in electrical contact with the first conductive member and the second conductive member respectively, at least one of the first conductive member and the second conductive member is clamped with the external conductive structure to limit the misaligned sliding of the external conductive structure on the first conductive member and the second conductive member.

12. The magnetic conductive component according to claim 11, wherein One of the first conductive member and the external conductive structure has a groove, and the other has a protrusion; when the first conductive member is in electrical contact with the external conductive structure, the protrusion is located in the groove and is clamped with the side wall of the groove.

13. The magnetic conductive component according to claim 12, wherein The groove is an annular groove surrounding the second conductive member, and the protrusion can rotate around the second conductive member in the groove.

14. The magnetic conductive component according to claim 1, wherein The second conductive member also has magnetism and is configured to jointly adsorb the external conductive structure with the magnetic member.

15. The magnetic conductive component according to claim 14, wherein The magnetic pole of the second conductive member adsorbing the external conductive structure is different from the magnetic pole of the magnetic member adsorbing the external conductive structure.

16. The magnetic conductive component according to claim 1, wherein At least one of the first conductive member and the second conductive member is provided with an insulating layer, and the insulating layer is located on the surfaces of the first conductive member and the second conductive member close to each other.

17. A connector, characterized in that, The connector includes: a mounting shell and the magnetic adsorption conductive assembly according to any one of claims 1-16; The circuit board is disposed in the mounting shell, and at least partial regions of the first conductive member and the second conductive member are exposed out of the mounting shell to be in electrical contact with the external conductive structure.

18. A data cable, characterized in that, The data line includes: a wire and the connector according to claim 17; One end of the wire is disposed on the mounting shell and is electrically connected to the circuit board.

19. A charger, characterized in that, The charger includes: a charging head and the data line according to claim 18, and the charging head is connected to the other end of the wire.

20. An electronic device, characterized in that, The electronic device includes: a device main body and the magnetic adsorption conductive assembly according to any one of claims 1-16; The circuit board is disposed in the device main body, and at least partial regions of the first conductive member and the second conductive member are exposed out of the device main body to be in electrical contact with the external conductive structure.

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