Bar automatic cleavage and clamping platform device

Abstract

The invention relates to an automatic bar cleavage and clamping platform device, and belongs to the technical field of semiconductor laser bar preparation cleavage device.The automatic bar cleavage and clamping platform device comprises an operation platform, a machining platform is arranged on the operation platform, a splitting platform is arranged on the machining platform, a connecting frame is arranged on one side of the machining platform, and the connecting frame is connected with the operation platform through an X-axis lead screw device; the connecting frame can horizontally move along the side face of the operation platform, the Z-axis lead screw device is vertically arranged on the connecting frame, one end of the tool bit clamp is connected with the connecting frame through the Z-axis lead screw device, the tool bit is arranged at the other end of the tool bit clamp, the tool bit clamp can drive the tool bit to vertically move on the connecting frame, and a workpiece bar to be cleaved is arranged on the splitting platform. And the bar is cleaved when the tool bit moves downwards in the vertical direction. And alternately placing the bar blocks and the plating accompanying sheets into a clamp by using a suction pen to realize placement. According to the semiconductor laser chip splitting device, splitting and placing are integrated on one platform, pollution and automation of the technology in the transferring process are avoided, development of semiconductor laser chip machining is promoted, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to a device for automatically cleaving and clamping a bar, belonging to the technical field of cleavage devices for preparing semiconductor laser bars. Background Art

[0002] Semiconductor lasers have a series of advantages such as small volume, high output power, light weight, and high reliability, and are the core technology of optoelectronic science today. They are widely used in fields such as laser ranging, laser communication, automatic control, and laser medicine. At present, countries around the world pay great attention to the theoretical application of key process technologies in the preparation of semiconductor lasers and are constantly stepping up research on semiconductor lasers. During the manufacturing process of lasers, the bars are usually placed according to different cavity lengths, but many defects are usually introduced in this process, thus affecting the life and reliability of the lasers.

[0003] The bar is the core part of a high-power semiconductor laser. Its cavity length, cavity surface quality, and front width will all affect the key performance such as the reliability, life, and output of the laser. At the same time, in order to improve the reflectivity of the bar product, a coating treatment is performed on the cavity surface. Therefore, improving the cavity surface quality and coating of the chip bar is an important part of improving the quality of the laser. Currently, it is mainly through mechanical cleavage to manually cleave it. First, an initial crack is scratched on the edge, and then the device is used to make it crack along this direction to obtain a neat natural cleavage surface. It is placed in the fixture by manual placement. During this process, cavity surface contamination and damage may occur due to operation, thus affecting the product yield. At the same time, currently, it is restricted and cannot integrate cleavage and placing in the fixture on one device, which limits the production efficiency.

[0004] Chinese Patent Document CN114883906A discloses a method for preparing the cavity surface of a semiconductor laser chip. This cleavage device integrates the scribing and cleaving processes through the movement of the XYZ axes, achieving automated and precise processing. First, the diamond tool head moves along the X and Y axes, applying force to the side surface of the workpiece to generate an initial cleavage crack. The diamond tool head is in the shape of a cone, applying a little force to precisely control the position and depth of crack generation. Subsequently, the cleavage tool moves along the Z axis, applying a cleavage load to the upper surface of the workpiece. The processing gap provides a direction for crack propagation, causing the workpiece to crack along the crack direction, and finally forming a smooth chip cavity surface. This device integrates the scribing and cleaving processes through the movement of the XYZ axes, achieving automated and precise processing. The selection and design of the diamond tool head and the cleavage tool ensure that the generation and propagation processes of the crack are controllable, thus obtaining a high-quality chip cavity surface. However, subsequent manual placement in the fixture is still required, so the technical solution provided by this patent cannot solve the problem of cavity surface damage during placement. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides an automatic cleavage and clamping platform device for bars, which can reduce the damage to products caused by manual operation errors. The designed structure has a small size, which can not only realize automatic cleavage but also realize the automatic placement of bars, improving the product yield and work efficiency.

[0006] The technical solution of the present invention is as follows:

[0007] An automatic cleavage and clamping platform device for bars includes an operation platform, on which a processing platform is provided. A cleavage platform is arranged on the processing platform. A connecting frame is provided on one side of the processing platform. The connecting frame is connected to the operation platform through an X-axis lead screw device and can horizontally move along the side surface of the operation platform. A Z-axis lead screw device is vertically arranged on the connecting frame. One end of the tool head fixture is connected to the connecting frame through the Z-axis lead screw device, and a tool head is arranged at the other end of the tool head fixture. The tool head fixture can drive the tool head to move vertically on the connecting frame. The workpiece bar to be cleaved is placed on the cleavage platform. When the tool head moves vertically downward, the bar is cleaved.

[0008] The workpiece bar to be cleaved is a semiconductor material, with a length of 26 - 30 mm, a width of 10 - 12 mm, and a thickness of 0.15 - 0.3 mm.

[0009] Preferably, a plating companion piece platform is also provided on the operation platform. The plating companion piece platform is located on one side of the processing platform, and plating companion pieces are placed on the plating companion piece platform.

[0010] Preferably, a fixture fixing point is provided on one side surface of the processing platform facing the plating companion piece platform. A fixture is arranged at the fixture fixing point. The cleaved bar falls into the fixture and enters the subsequent process together with the plating companion piece.

[0011] Preferably, a transmission chain is provided on the surface of the cleavage platform. The bar to be cleaved is placed on the chain. Each time a bar is cleaved, the chain moves horizontally by one cleavage block position, facilitating the cleavage of the remaining bars at the rear.

[0012] Preferably, the lower edge of the tool head has an angle of 0.5° with the horizontal plane.

[0013] Preferably, a suction pen is arranged on the operation platform between the processing platform and the plating companion piece platform. The suction pen is used to suck the plating companion piece and the cleaved bar block.

[0014] Preferably, an inclined surface is provided on one side of the surface of the cleavage platform, which is convenient for the cleaved bar block to fall into the fixture on the side through the inclined surface.

[0015] Preferably, the length of the tool head is greater than the width of the workpiece to be cleaved.

[0016] The beneficial effects of the present invention are as follows:

[0017] The present invention is used for preparing a semiconductor laser cleavage and automatic bar arranging device, which has a simple structure. By the interaction between the suction pen and the cleavage platform, the working cost is reduced and the cleavage efficiency is effectively improved. Specifically:

[0018] (1) The present invention realizes the cleavage device through the cooperation of the motor screw structure and the platform, and can automatically perform cleavage, reducing the damage and pollution of the P surface caused by the operation during the manual cleavage and extraction process.

[0019] (2) During the rotation process of the automatic suction pen of the present invention, the bar and the co-deposited wafer are cross-placed, reducing the cavity surface pollution and damage during the placement on the fixture, and improving the working efficiency at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is the front view schematic diagram of the device;

[0021] Figure 2 is the X-axis movement schematic diagram of the device;

[0022] Figure 3 is the random Y-axis movement schematic diagram of the device;

[0023] Figure 4 is the platform schematic diagram of the device;

[0024] Figure 5 is the three-dimensional structure schematic diagram of the device;

[0025] Among them: 1. Connecting frame, 2. Cleavage platform, 3. Processing platform, 4. Operation platform, 5. Cleavage device, 6. Cleavage block, 7. Co-deposited wafer platform, 8. X-axis screw device, 9. Tool head fixture, 10. Z-axis screw device, 11. Tool head, 12. Fixture fixing point, 13. Suction pen, 14. Fixture, 15. Inclined plane. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The present invention will be further described below by way of examples in conjunction with the drawings, but not limited thereto.

[0027] Example 1:

[0028] An automatic cleavage and clamping platform device for a bar includes an operation platform 4. A processing platform 3 is provided on the operation platform. A cleavage platform 2 is arranged on the processing platform. A connecting frame 1 is provided on one side of the processing platform 3. The connecting frame is connected to the operation platform through an X-axis screw device 8 and can horizontally move along the side of the operation platform. A Z-axis screw device 10 is vertically arranged on the connecting frame. One end of the tool head fixture 9 is connected to the connecting frame 1 through the Z-axis screw device 10, and the other end of the tool head fixture 9 is provided with a tool head 11. The tool head fixture can drive the tool head to move vertically on the connecting frame. The workpiece bar to be cleaved is placed on the cleavage platform 2, and the bar is cleaved when the tool head moves vertically downward.

[0029] The workpiece to be cleaved bar is a semiconductor material, with a length of 26 - 30 mm, a width of 10 - 12 mm, and a thickness of 0.15 - 0.3 mm.

[0030] The operation platform 4 is also provided with a co-plating piece platform 7. The co-plating piece platform is located on one side of the processing platform, and co-plating pieces are placed on the co-plating piece platform.

[0031] On one side surface of the processing platform facing the co-plating piece platform, there are two fixture fixing points 12. Fixtures 14 are arranged at the fixture fixing points. After cleavage, the bar falls into the fixture and enters the subsequent process together with the co-plating piece.

[0032] The surface of the cleavage platform is provided with a transmission chain. The workpiece to be cleaved bar is placed on the chain. For each cleavage of a bar block, the motor controls the chain to horizontally move a cleavage block position, facilitating the cleavage of the remaining bars at the rear.

[0033] The lower edge of the tool head has an angle of 0.5° with the horizontal plane. The length of the tool head is greater than the width of the workpiece to be cleaved.

[0034] A suction pen 13 is arranged on the operation platform between the processing platform and the co-plating piece platform. The suction pen is used to suck the co-plating piece and the cleaved bar block.

[0035] On one side of the surface of the cleavage platform 2, there is a downward inclined plane 15. This facilitates the cleaved bar block to fall into the fixture on the side from the inclined plane.

[0036] During operation, the suction pen sucks a co-plating piece from the co-plating piece platform and puts it into the fixture, places the workpiece to be cleaved on the cleavage platform 2. After the motor controls the X-axis lead screw device to adjust the position of the connecting frame, it controls the Z-axis lead screw device to drive the tool head to move downward for cleavage. When reaching the workpiece, it cleaves the workpiece in a predetermined direction to form bar blocks. After cleavage, the motor controls the transmission chain on the surface of the cleavage platform to move, so that the cleaved bar blocks fall into the fixture from the inclined plane. At this time, there is one co-plating piece and one bar block in the fixture. Take them out and enter the next process. Then, the suction pen sucks another co-plating piece and puts it into the fixture. When waiting to cleave the second bar block, take it out again, and so on in a cycle. The bar blocks and co-plating pieces are alternately placed in the fixture by using the suction pen to achieve placement. Combining cleavage and placement on one platform can avoid contamination during the transfer process and automate the process, promoting the development of semiconductor laser chip processing and improving work efficiency.

[0037] The above embodiments are only partial implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. For those skilled in the art of this specialty, there can be various improvements and optimizations. Therefore, the present invention is not limited to the above example analysis, but is determined and defined by the appended dependent claims.

Claims

1. An automatic cleavage and clamping platform device for a strip, characterized in that It includes an operation platform, on which there is a processing platform. On the processing platform, there is a cleavage platform. On one side of the processing platform, there is a connecting frame, which is connected to the operation platform through an X-axis lead screw device. Vertically on the connecting frame, there is a Z-axis lead screw device. One end of the tool head fixture is connected to the connecting frame through the Z-axis lead screw device, and the other end of the tool head fixture is provided with a tool head. The workpiece bar to be cleaved is placed on the cleavage platform.

2. The bar automatic cleavage and clamping platform device according to claim 1, characterized in that, There is also a co-deposition chip platform on the operation platform. The co-deposition chip platform is located on one side of the processing platform, and co-deposition chips are placed on the co-deposition chip platform.

3. The bar automatic cleavage and clamping platform device according to claim 1, characterized in that, On the side surface of the processing platform facing the co-deposition chip platform, there is a fixture fixing point, and a fixture is set at the fixture fixing point.

4. The bar automatic cleavage and clamping platform device according to claim 1, characterized in that, There is a transmission chain on the surface of the cleavage platform, and the bar to be cleaved is placed on the chain.

5. The bar automatic cleavage and clamping platform device according to claim 1, wherein, There is an angle of 0.5° between the lower edge of the tool head and the horizontal plane.

6. The bar automatic cleavage and clamping platform device according to claim 1, characterized in that A suction pen is set on the operation platform between the processing platform and the co-deposition chip platform. The suction pen is used to suck the co-deposition chip and the cleaved bar block.

7. The bar automatic cleavage and clamping platform device according to claim 1, characterized in that, On one side of the surface of the cleavage platform, there is a downward inclined plane.

8. The bar automatic cleavage and clamping platform device according to claim 1, characterized in that, The length of the tool head is greater than the width of the workpiece to be cleaved.

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