Self-shielding structure, radio frequency front-end module and preparation method thereof

Abstract

The invention relates to the technical field of radio frequency shielding, and discloses a self-shielding structure, a radio frequency front-end module and a preparation method thereof, and the self-shielding structure comprises a substrate, a to-be-shielded circuit and a cover plate. Wherein a circuit to be shielded is located on the substrate; the cover plate is located on the substrate, a shielding cavity is formed in the surface, facing the substrate, of the cover plate, the circuit to be shielded is located in the shielding cavity, a shielding layer is arranged on the surface of the shielding cavity, and the shielding layer is grounded. The radio frequency front-end module has the beneficial effects that the self-shielding structure which is simple in structure and meets the miniaturization requirement is prepared and is applied to the radio frequency front-end module, so that the technical problem that the shielding process of the radio frequency front-end module is complicated in the related technology is effectively solved, the production cost is reduced, the production efficiency of the radio frequency front-end module is improved, and the product quality is improved. Therefore, actual production requirements can be met.

Description

Technical Field

[0001] The present application relates to the technical field of radio frequency shielding, and particularly relates to a self-shielding structure, a radio frequency front-end module and a preparation method thereof. Background Art

[0002] The rapid development of multi-mode wireless communication allows electronic devices to select the most suitable communication mode according to different network conditions, communication quality and power consumption requirements during wireless communication, improving the flexibility and reliability of wireless communication. To perform multi-mode wireless communication, multiple radio frequency front-end modules usually need to be installed in electronic devices, so as to integrate more communication systems into the electronic devices. However, the small size of electronic devices makes the radio frequency front-end modules arranged too compactly, resulting in self-interference and mutual interference between the radio frequency front-end modules. Therefore, it is necessary to shield the radio frequency front-end modules to reduce the influence of self-interference and mutual interference on the communication process. In the related art, there is a problem that the production process of the radio frequency front-end module is complex, and the production efficiency of the radio frequency front-end module still needs to be improved. Summary of the Invention

[0003] The present application provides a self-shielding structure, a radio frequency front-end module and a preparation method thereof. By preparing a self-shielding structure with a simple structure and meeting the requirements of miniaturization and applying it to the radio frequency front-end module, the technical problems of complex shielding process and too high cost in the related art are effectively solved, and the production efficiency of the radio frequency front-end module is improved, so as to meet the actual production requirements.

[0004] To achieve the above object, the main technical solutions adopted by the present application include:

[0005] In a first aspect, an embodiment of the present application provides a self-shielding structure, and the self-shielding structure includes:

[0006] A substrate;

[0007] A circuit to be shielded, located on the substrate;

[0008] A cover plate, located on the substrate, and a shielding cavity is provided on the surface of the cover plate facing the substrate. The circuit to be shielded is located in the shielding cavity, a shielding layer is provided on the surface of the shielding cavity, and the shielding layer is grounded.

[0009] The self-shielding structure proposed in the embodiments of the present application provides radio frequency shielding for the circuit to be shielded located in the shielding cavity by arranging a shielding cavity on the surface of the cover plate facing the substrate and arranging a shielding layer on the surface of the shielding cavity. Compared with the related art, the present application uses a shielding layer to replace the shielding cover in the related art, reducing the complex processing steps regarding the shielding cover in the related art, simplifying the shielding process of the radio frequency front-end module, and thus improving the production efficiency of the radio frequency front-end module. At the same time, the shielding layer has a smaller volume and weight compared with the shielding cover. Using the shielding layer for shielding can effectively reduce the thickness of the radio frequency front-end module, thereby meeting the strict requirements of small-sized electronic devices for spatial dimensions and weight, and adapting to the miniaturization trend of electronic devices and the development trend of multi-mode wireless communication.

[0010] Optionally, a plurality of circuits to be shielded are arranged in an array on the substrate;

[0011] Correspondingly, a plurality of shielding cavities covering the circuits to be shielded are arranged on the cover plate.

[0012] Optionally, the shielding layer is grounded through a grounding via in the substrate.

[0013] Optionally, the surface of the shielding cavity includes a side wall and a top surface, and the side wall and the top surface are attached with the shielding layer.

[0014] Optionally, the side wall forms an inclined angle with the surface of the substrate facing the cover plate, and the inclined angle is an acute angle.

[0015] Optionally, the circuit to be shielded constitutes a component to be shielded;

[0016] The height of the shielding cavity matches the height of the component to be shielded, and the width of the shielding cavity matches the area occupied by the component to be shielded on the substrate.

[0017] Optionally, the substrate includes a glass substrate of the packaging module, and the cover plate includes a glass cover plate of the packaging module.

[0018] In a second aspect, an embodiment of the present application provides a radio frequency front-end module, which is an independent unit obtained by cutting a packaging module, and the packaging module includes the self-shielding structure according to any one of the above embodiments.

[0019] In a third aspect, an embodiment of the present application provides a preparation method for a self-shielding structure, and the method includes:

[0020] Mounting the circuit to be shielded on the substrate;

[0021] Forming a shielding cavity on the surface of the cover plate facing the substrate, and forming a shielding layer on the surface of the shielding cavity;

[0022] Connect the substrate to the cover plate to obtain the self-shielding structure; wherein, the circuit to be shielded is located in the shielding cavity, and the shielding layer is grounded.

[0023] In a fourth aspect, an embodiment of the present application provides a method for manufacturing a radio frequency front-end module, the method comprising:

[0024] Provide a packaging module; wherein, the packaging module includes a self-shielding structure obtained by the method according to any one of the above embodiments;

[0025] Cut the packaging module to obtain the radio frequency front-end module. Description of the Drawings

[0026] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a schematic structural diagram of the self-shielding structure provided by the embodiment of the present application;

[0028] Figure 2a It is a schematic diagram of a wafer-level cover plate in the embodiment of the present application;

[0029] Figure 2b It is a schematic diagram of a square plate-level cover plate in the embodiment of the present application;

[0030] Figure 3 It is a step diagram of the method for manufacturing the self-shielding structure provided by the embodiment of the present application;

[0031] Figure 4a It is a schematic diagram of the steps of forming a shielding cavity on the cover plate in the embodiment of the present application;

[0032] Figure 4b It is a schematic diagram of the steps of processing the cover plate in the embodiment of the present application;

[0033] Figure 4c It is a schematic diagram of the steps of forming a shielding layer on the cover plate in the embodiment of the present application;

[0034] Figure 5 It is a step diagram of forming a shielding cavity and a shielding layer in the embodiment of the present application.

[0035] Among them, the reference numerals of the drawings in the specification are as follows: 110. Substrate, 120. Circuit to be shielded, 130. Cover plate, 140. Shielding cavity, 150. Shielding layer, 160. Grounding through hole. Detailed implementation manners

[0036] For ease of understanding of the present application, the present application will be described more comprehensively below with reference to the relevant accompanying drawings. Embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present application is thorough and complete.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present application herein are for the purpose of describing specific embodiments only and are not intended to limit the present application.

[0038] It should be understood that when an element or layer is referred to as "on", "adjacent to", "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected or coupled to the other element or layer, or there can be intervening elements or layers. In contrast, when an element is referred to as "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types and / or parts, these elements, components, regions, layers, doping types and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type or part from another element, component, region, layer, doping type or part. Thus, without departing from the teachings of the present invention, the first element, component, region, layer, doping type or part discussed below can be referred to as the second element, component, region, layer or part; for example, the first doping type can be referred to as the second doping type, and similarly, the second doping type can be referred to as the first doping type; the first doping type and the second doping type are different doping types. For example, the first doping type can be P-type and the second doping type can be N-type, or the first doping type can be N-type and the second doping type can be P-type.

[0039] Spatial relationship terms such as "under", "below", "beneath", "underneath", "above", "over", etc. may be used herein to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms also include different orientations of the device during use and operation. For example, if the device in the attached drawing is flipped, an element or feature described as "under other elements" or "beneath them" or "underneath them" will be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "underneath" can include both upward and downward orientations. In addition, the device may also have other orientations (such as rotating 90 degrees or other orientations), and the spatial descriptors used herein are to be interpreted accordingly.

[0040] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising" or "having", etc. specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, in this specification, the term "and / or" includes any and all combinations of the related listed items.

[0041] The rapid development of multi-mode wireless communication allows electronic devices to select the most suitable communication mode for communication according to different network conditions, communication quality, and energy consumption requirements during wireless communication, improving the flexibility and reliability of wireless communication. To perform multi-mode wireless communication, it is usually necessary to install multiple radio frequency front-end modules in an electronic device, so as to integrate more communication systems into the electronic device. However, the small size of the electronic device makes the radio frequency front-end modules arranged too compactly, resulting in inevitable self-interference and mutual interference between the radio frequency front-end modules. Among them, self-interference means that the signal transmitted by the radio frequency front-end module will interfere with the signal received by itself, thereby affecting the receiving sensitivity of the radio frequency front-end module and causing the signal to be unable to be parsed; mutual interference means that different radio frequency front-end modules will affect each other when working simultaneously, resulting in small-power signals being interfered by large-power signals and causing a decline in signal quality. Therefore, it is necessary to shield the radio frequency front-end modules to reduce the impact of self-interference and mutual interference on the communication process.

[0042] The shielding process in the related art includes providing a shielding cover outside the radio frequency front-end module. The external shielding cover is usually a complete physical component, and its material can be metal or other conductive materials, and has a certain shape and size, such as a shielding box, a shielding cover or a metal housing, etc. The shielding cover can be connected to the radio frequency front-end module using a variety of materials, including but not limited to welding, bonding, mechanical connection or other special structures for electrical connection. It can be seen that when using the shielding cover to shield the radio frequency front-end module, complex processing and assembly steps are required, resulting in an increase in the complexity of the shielding process and the cost. At the same time, the external shielding cover will also cause a decrease in the sensitivity of the radio frequency front-end module, and will cause an increase in harmonics in the radio frequency front-end module, affecting the communication quality of the radio frequency front-end module. The shielding cover also has a large size and weight, and using the shielding cover for shielding increases the volume and weight of the radio frequency front-end module, making it difficult to meet the requirements of electronic devices for space size and weight.

[0043] In some other related technologies, after the radio frequency front-end module is encapsulated, a shielding layer is formed by processing on the outside of the radio frequency front-end unit. Traditional processing steps include compression molding, high-temperature curing, unit cutting, and forming a shielding layer on multiple sides, etc. It can be seen that traditional processing steps require coating multiple sides of the radio frequency front-end module separately after unit cutting, or sintering using materials such as silver glue or nano-silver to form a shielding layer. The traditional processing steps are relatively complex, the process is cumbersome, and the processing cost is relatively high. In addition, the radio frequency front-end unit contains chips or electronic components, etc. Processing the radio frequency front-end module on the outside will cause damage to the chips or electronic components therein, affecting the communication quality of the radio frequency front-end module. The shielding layer formed on the outside of the radio frequency front-end unit is also easily affected by environmental factors, resulting in damage or change to the shielding layer, weakening the shielding effect of the shielding layer.

[0044] Based on the above problems, the present application provides a self-shielding structure, a radio frequency front-end module and a preparation method thereof. The self-shielding structure includes: a substrate; a circuit to be shielded, located on the substrate; a cover plate, located on the substrate, and a shielding cavity is provided on the surface of the cover plate facing the substrate. The circuit to be shielded is located in the shielding cavity, and a shielding layer is provided on the surface of the shielding cavity, and the shielding layer is grounded.

[0045] The self-shielding structure provided by the present application provides radio frequency shielding for the circuit to be shielded located in the shielding cavity by providing a shielding cavity on the surface of the cover plate facing the substrate and providing a shielding layer on the surface of the shielding cavity.

[0046] Compared with the related art, the present application uses a shielding layer to replace the shielding cover in the related art, reducing the complex processing steps of the shielding cover in the related art, simplifying the shielding process of the radio frequency front-end module, and thus improving the production efficiency of the radio frequency front-end module. At the same time, the shielding layer has a smaller volume and weight compared with the shielding cover. Using the shielding layer for shielding can effectively reduce the thickness of the radio frequency front-end module, thereby meeting the strict requirements of small-sized electronic devices for spatial dimensions and weight, and adapting to the miniaturization trend of electronic devices and the development trend of multi-mode wireless communication.

[0047] The self-shielding structure provided in this specification can be applied to the radio frequency front-end module in an electronic device to provide a shielding effect for the radio frequency front-end module. The electronic device can include a notebook, a desktop computer, a smart phone, a smart wearable device (virtual reality glasses, smart watches, etc.), a tablet computer, etc. It can be understood that after adaptive modification, the self-shielding structure provided in the present application can also be used in other devices, including but not limited to communication devices, medical devices, or automotive electronic devices, etc.

[0048] Embodiments of the invention are described herein with reference to cross-sectional views that are schematic illustrations of ideal embodiments (and intermediate structures) of the invention. It is thus contemplated that variations in the shapes of the illustrated regions result, for example, from manufacturing techniques and / or tolerances. Accordingly, embodiments of the invention should not be construed as limited to the particular shapes of regions illustrated herein but include deviations in shapes that result, for example, from manufacturing techniques. For example, an implanted region shown as rectangular will typically have rounded or curved features and / or an implanted concentration gradient at its edges rather than a binary change from the implanted to the non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions shown in the figures are substantially schematic in nature, and their shapes do not represent the actual shapes of regions of the device and do not limit the scope of the invention.

[0049] In this embodiment, a self-shielding structure is provided. Referring to Figure 1 as shown, the self-shielding structure includes a substrate, a circuit to be shielded, and a cover plate. Among them, the circuit to be shielded is located on the substrate. The cover plate is located on the substrate, and a shielding cavity is provided on the surface of the cover plate facing the substrate. The circuit to be shielded is located in the shielding cavity, and a shielding layer is provided on the surface of the shielding cavity, and the shielding layer is grounded.

[0050] Specifically, the self-shielding structure includes a substrate 110, a circuit to be shielded 120, and a cover plate 130. Among them, the substrate 110 is used to set the circuit to be shielded 120 and is fixedly connected to the cover plate 130 to encapsulate and protect the circuit to be shielded 120. The substrate 110 can be a Chip substrate, a Wafer wafer-level substrate, or a square plate-level substrate. The Chip substrate can be used for chip packaging, and the Wafer wafer-level substrate or the square plate-level substrate can be used for integrated circuit production. The type of substrate used can be determined according to the specific type of the circuit to be shielded 120.

[0051] Further, the circuit to be shielded 120 is located on the substrate 110, and the circuit to be shielded 120 can be mounted on the substrate 110 in a manner such as surface mounting. The circuit to be shielded 120 can be a circuit for connecting chips or electronic components to achieve communication functions or other functions. According to actual needs, the number of circuits to be shielded 120 can be one or more, and the number of chips or electronic components connected to the shielding circuit can also be one or more. It can be understood that the circuit to be shielded 120 generates and receives radio frequency signals during operation, and the above process will be affected by the radio frequency signals of the circuit to be shielded 120 itself and other radio frequency signals, affecting the quality of radio frequency signal transmission and reception. Therefore, a self-shielding structure needs to be designed for the circuit to be shielded 120 to provide a shielding effect for the circuit to be shielded 120.

[0052] Further, the cover plate 130 is similar to the substrate 110, and the cover plate 130 and the substrate 110 are closely attached and fixedly connected in the vertical direction. The cover plate 130 is provided with a shielding cavity 140 on the surface facing the substrate 110. The position of the shielding cavity 140 corresponds to the circuit to be shielded 120 and is used to place the circuit to be shielded 120. The shielding cavity 140 can be formed on the surface of the cover plate 130 by an etching process. The specific shape of the shielding cavity 140 can be changed by setting the process parameters in the etching process, and the specific shape of the shielding cavity 140 depends on the size of the circuit to be shielded 120. Therefore, the specific size and shape of the shielding cavity 140 can be determined according to actual scenario requirements. It can be understood that the shielding cavity 140 can be a cavity provided on the surface of the cover plate facing the substrate. A cavity can be formed by etching the substrate, so that existing cover plates can be used in the actual production process, thereby further reducing the production cost.

[0053] A shielding layer 150 is provided on the surface of the shielding cavity 140. The shielding layer 150 can be formed by means such as sputtering, spraying, and dip coating. The material of the shielding layer 150 can be metal, metal oxide, titanium nitride, etc. The shielding layer 150 improves its own shielding effect by grounding. Using the cover plate 130 and the shielding layer 150 to completely cover the circuit to be shielded 120, on the one hand, the cover plate 130 provides an encapsulation and protection effect for the circuit to be shielded 120, and on the other hand, the shielding layer 150 provides a radio frequency shielding effect for the circuit to be shielded 120.

[0054] It should be noted that in the related art, a shielding effect is usually provided for the circuit to be shielded by a shielding cover. The shielding cover is usually a complete physical component, and its material can be metal or other conductive materials, and has a certain shape and size, such as a shielding box, a shielding cover or a metal shell, etc. The shielding cover can be connected to the RF front-end module using a variety of materials, including but not limited to welding, bonding, mechanical connection or other special structures for electrical connection. It can be seen that when using a shielding cover to shield the RF front-end module, complex processing and assembly steps are required to obtain a self-shielding structure, and the size and weight of the shielding cover cannot meet the miniaturization requirements of electronic devices such as mobile phone terminals. At the same time, with the development of multi-mode wireless communication, RF front-end modules with multiple communication modes need to be integrated in electronic devices, so higher requirements are put forward for the size and weight of the RF front-end module.

[0055] In some other related technologies, after the encapsulation of the circuit to be shielded is completed, processing is carried out on the outside of the RF front-end unit by means of sputtering, spraying and dip coating, etc. to form a shielding layer. At this time, the RF front-end unit contains the circuit to be shielded and its connected chips or electronic components, etc. Methods such as sputtering, spraying and dip coating will cause a certain degree of damage to the chips or electronic components, etc., affecting the communication quality of the RF front-end module. In addition, the shielding layer formed on the outside of the RF front-end unit is easily affected by environmental factors, resulting in damage or change of the shielding layer, reducing the shielding effect brought by the shielding layer.

[0056] Compared with the related art, in this application, a shielding cavity 140 is formed on the cover plate 130, and a shielding layer 150 is formed on the surface of the shielding cavity 140. The shielding cavity 140 with the shielding layer 150 is used to form a self-shielding structure, providing an RF shielding effect and an encapsulation protection effect for the circuit 120 to be shielded. When forming the shielding layer 150 in this application, the influence on the circuit 120 to be shielded and its connected chips or electronic components and other devices is reduced. It not only brings great size advantages to the RF front-end module, but also can reduce complex production steps, simplify the shielding process of the RF front-end module, and thus improve the production efficiency of the RF front-end module.

[0057] The self-shielding structure provided in this embodiment is used to provide RF shielding for the circuit to be shielded located in the shielding cavity by setting a shielding cavity on the surface of the cover plate facing the substrate and setting a shielding layer on the surface of the shielding cavity.

[0058] Compared with the related art, the present application uses a shielding layer to replace the shielding cover in the related art, reducing the complex processing steps regarding the shielding cover in the related art, simplifying the shielding process of the RF front-end module, and thus improving the production efficiency of the RF front-end module. At the same time, the shielding layer has a smaller volume and weight compared with the shielding cover. Using the shielding layer for shielding can effectively reduce the thickness of the RF front-end module, thereby meeting the strict requirements of small-sized mobile phone terminals for spatial dimensions and weight, and adapting to the miniaturization trend of mobile phone terminals and the development trend of multi-mode wireless communication.

[0059] As an embodiment of the present application, a plurality of shielded circuits arranged in an array are provided on the substrate. Corresponding shielded cavities covering the shielded circuits are provided on the cover plate.

[0060] Specifically, the areas of the substrate 110 and the cover plate 130 in the self-shielding structure can be determined according to actual requirements. When the area of the substrate 110 is large enough, one or more shielded circuits 120 can be mounted on the substrate 110. Different shielded circuits 120 can be connected to each other or independent of each other. According to the positions and sizes of the shielded circuits 120, shielded cavities 140 with corresponding positions and sizes are formed on the cover plate 130 to provide shielding effects for the shielded circuits 120.

[0061] Further, when a plurality of shielded circuits 120 are mounted on the substrate 110, the plurality of shielded circuits 120 can be arranged in a uniform array. At this time, the shielded cavities 140 on the cover plate 130 are also arranged in a uniform array corresponding to the shielded circuits 120. After aligning and fixedly connecting the substrate 110 and the cover plate 130, the self-shielding structure is cut according to the positions of the shielded circuits 120, and a plurality of independent units including the shielded circuits 120 and the self-shielding structure can be obtained to serve as RF front-end modules.

[0062] Refer to Figures 2a to 2b As shown, in which Figure 2a shows the cover plate corresponding to the wafer-level substrate, Figure 2b shows the cover plate corresponding to the square-plate-level substrate. It can be seen that the shielded circuits 120 arranged in an array can maximize the utilization of the areas of the substrate 110 and the cover plate 130, improving the yield of single processing. During the production process, the shielding layer 150 is formed in a plurality of shielded cavities 140 simultaneously by means of sputtering, spraying, dip coating, etc., and a plurality of RF front-end modules with similar structures are obtained after cutting, achieving the technical effect of simplifying the production process and greatly improving the production efficiency of the RF front-end module.

[0063] As an embodiment of the present application, the shielding layer is grounded through the grounding vias in the substrate.

[0064] Specifically, a grounding via 160 is provided in the substrate 110. The position of the grounding via 160 can be determined according to the position of the circuit 120 to be shielded, so that the grounding via 160 will not affect the electrical connection of the circuit 120 to be shielded. In some embodiments, the grounding via 160 can be obtained by processing the substrate 110 using the Through Glass Via (TGV) technology. Metal materials can be filled in the grounding via 160 by methods such as copper filling process to achieve electrical connection between different surfaces of the substrate 110.

[0065] Furthermore, the shielding layer 150 in the shielding cavity 140 is also attached to the surface of the cover plate 130 facing the substrate 110. The shielding layer 150 in the shielding cavity 140 and the shielding layer 150 on the surface of the cover plate 130 facing the substrate 110 are continuous. After the cover plate 130 is fixedly connected to the substrate 110, the surface of the cover plate 130 facing the substrate 110 closely adheres to the substrate 110, so that the shielding layer 150 attached to the surface of the cover plate 130 facing the substrate 110 can be electrically connected to the grounding via 160, thereby enabling the shielding layer 150 in the shielding cavity 140 to be connected to the other surface of the substrate 110 through the grounding via 160 and grounded on the other surface of the substrate 110. The shielding layer 150 in the shielding cavity 140 provides an effective RF shielding effect for the circuit 120 to be shielded through grounding, reduces the interference of irrelevant RF signals, and improves the signal transceiver quality of the RF front-end module.

[0066] As an embodiment of the present application, the surface of the shielding cavity includes a side wall and a top surface, and the side wall and the top surface are attached with a shielding layer.

[0067] Specifically, the top surface of the shielding cavity 140 is a horizontal plane, which is parallel to the surface of the substrate 110 where the circuit 120 to be shielded is provided, avoiding physical damage to the circuit 120 to be shielded. The shielding cavity 140 completely covers the circuit 120 to be shielded through the side wall and the top surface, providing a sealed environment for the circuit 120 to be shielded, thereby avoiding the influence of the external environment on the circuit 120 to be shielded and extending the service life of the RF front-end module.

[0068] Furthermore, in the shielding cavity 140, the shielding layer 150 completely covers the side wall and the top surface of the shielding cavity 140, achieving complete coverage of the circuit 120 to be shielded, thereby providing an RF shielding effect for the circuit 120 to be shielded and improving the signal transceiver quality of the RF front-end module.

[0069] As an embodiment of the present application, the side wall forms an inclined angle with the surface of the substrate facing the cover plate, and the inclined angle is an acute angle.

[0070] Specifically, the side wall forms an inclined angle with the surface of the substrate 110 facing the cover plate 130, and the inclined angle between the two is an acute angle, that is, the side wall of the shielding cavity 140 faces the surface of the substrate 110 facing the cover plate 130, and the opening of the shielding cavity 140 is in the shape of a smaller inner and larger outer. It should be noted that the shielding layer 150 on the surface of the shielding cavity 140 can be obtained by means such as sputtering, spraying, and dip coating. When forming the shielding layer 150 by the above methods, the inclined angle between the side wall and the surface of the substrate 110 facing the cover plate 130 enables the shielding layer 150 to adhere more closely to the surface of the shielding cavity 140, improving the adhesion and reliability of the shielding layer 150.

[0071] In some embodiments, the shielding cavity 140 can be formed on the surface of the cover plate 130 through an etching process. By changing the process parameters in the etching process, the specific shape of the shielding cavity 140 can be changed, including the inclined angle between the side wall and the surface of the substrate 110 facing the cover plate 130, etc. It can be understood that the process parameters of the etching process can be determined according to the size of the chip or electronic component connected to the circuit to be shielded 120 and the size requirements of the RF front-end module, so as to change the specific shape of the shielding cavity 140 according to actual requirements.

[0072] As an embodiment of the present application, the circuit to be shielded constitutes the element to be shielded. The height of the shielding cavity matches the height of the element to be shielded, and the width of the shielding cavity matches the area occupied by the element to be shielded on the substrate.

[0073] Specifically, the circuit to be shielded 120 is mounted on the substrate 110 and is used to connect the element to be shielded. The element to be shielded can be a chip or an electronic component, and the number thereof can be one or more. The element to be shielded is electrically connected through the circuit to be shielded 120 to achieve communication functions or other functions.

[0074] Furthermore, the height of the shielding cavity 140 matches the height of the element to be shielded, and the width of the shielding cavity 140 matches the area occupied by the element to be shielded on the substrate 110, so that the element to be shielded can be placed in the shielding cavity 140 and completely covered. While the shielding cavity 140 provides encapsulation protection for the element to be shielded and avoids physical damage to the element to be shielded, it also provides an effective RF shielding effect for the element to be shielded, improving the signal reception quality of the element to be shielded.

[0075] As an embodiment of the present application, the substrate includes the glass substrate of the packaging module, and the cover plate includes the glass cover plate of the packaging module.

[0076] Specifically, when a plurality of shielded circuits 120 arranged in an array are provided on the substrate 110, and shielding cavities 140 corresponding to the plurality of shielded circuits 120 are provided on the cover plate 130, after the processed substrate 110 and the cover plate 130 are aligned according to the positions of the shielded circuits 120 and fixedly connected, a packaged module is obtained. It can be understood that the packaged module includes a plurality of shielded circuits 120 and corresponding self-shielding structures, and different shielded circuits 120 can be independent of each other.

[0077] Further, the substrate 110 of the packaged module can be a glass substrate, and the cover plate 130 of the packaged module can be a glass cover plate. Compared with using materials such as resin as the material of the substrate 110 or the cover plate 130 in the related art, in this application, glass with a lower cost is used as the material of the substrate 110 or the cover plate 130, reducing the production cost of the self-shielding structure and the radio frequency front-end module. In addition, the thermal conductivity of the glass material has obvious advantages compared with that of the resin. When there is a problem of large heat generation in the shielded circuit 120 or the shielded component, the glass cover plate and the glass substrate can dissipate heat quickly, reducing the influence of heat accumulation on the shielded circuit 120 or the shielded component.

[0078] It can be understood that in other embodiments, the substrate 110 can also be a quartz substrate or a ceramic substrate, etc., and the material used for the substrate 110 is not limited to the above materials. Similarly, the cover plate 130 can also be a quartz substrate or a ceramic substrate, etc., and the material used for the cover plate 130 is not limited to the above materials. The heat dissipation performance of quartz and ceramic is better than that of resin. Quartz also has high hardness and high temperature resistance, which can improve the reliability of the radio frequency front-end module, while ceramic has high hardness and wear resistance, and has a relatively high thermal conductivity, so as to adapt to high-temperature working environments.

[0079] This application also provides a radio frequency front-end module, which is an independent unit obtained by cutting the packaged module, and the packaged module includes the self-shielding structure described in any one of the above embodiments.

[0080] Specifically, the packaged module includes a plurality of shielded circuits 120 and their corresponding self-shielding structures, and different shielded circuits 120 are independent of each other. By cutting the packaged module, a plurality of independent units are obtained as the radio frequency front-end modules. It can be understood that each radio frequency front-end module includes one or more shielded circuits 120 and their corresponding self-shielding structures, where the number of shielded circuits 120 can be determined according to actual requirements, and the functions of each radio frequency front-end module can be the same or different.

[0081] It should be noted that in this application, a plurality of shielded circuits 120 arranged in an array are mounted on the substrate 110. A cover plate 130 is fixedly connected to the substrate 110 to form a self-shielding structure, and a plurality of radio frequency front-end modules are obtained by cutting. Based on the above technical solution, this application can maximize the utilization of the areas of the substrate 110 and the cover plate 130, and quickly prepare a plurality of radio frequency front-end modules through a simple process method, effectively improving the production efficiency of the radio frequency front-end modules and reducing the production cost of the radio frequency front-end modules.

[0082] Referring Figure 3 as shown, this application also provides a preparation method for a self-shielding structure, which is used to prepare the self-shielding structure described in any one of the above embodiments. The method includes:

[0083] S310. Mount the circuit to be shielded on the substrate.

[0084] S320. Form a shielding cavity on the surface of the cover plate facing the substrate, and form a shielding layer on the surface of the shielding cavity.

[0085] S330. Connect the substrate and the cover plate to obtain a self-shielding structure; wherein, the circuit to be shielded is located in the shielding cavity, and the shielding layer is grounded.

[0086] Specifically, mount the circuit to be shielded on the substrate, and connect the element to be shielded through the circuit to be shielded to form a functional module of the radio frequency front-end module. A grounding via is preset in the substrate, and the position of the grounding via surrounds the circuit to be shielded, and at least one grounding via is provided for any circuit to be shielded.

[0087] Further, form a shielding cavity on the surface of the cover plate facing the substrate, and form a shielding layer on the surface of the shielding cavity. In this embodiment, the shielding cavity can be a cavity provided on the surface of the cover plate facing the substrate. It can be understood that the size of the shielding cavity matches the size of the circuit to be shielded and is used to accommodate the circuit to be shielded and the element to be shielded connected thereto. Referring Figures 4a to 4c as shown, the process of forming the shielding cavity and the shielding layer is exemplarily described, including: forming the shielding cavity on the surface of the cover plate facing the substrate by etching, and forming the shielding layer on the surface of the shielding cavity by any one of sputtering, spraying, and dip coating to obtain a shielding cavity with a shielding layer on the attachment surface, and completing the processing of the cover plate.

[0088] Further, align the cover plate and the substrate according to the position of the circuit to be shielded, and fixedly connect the cover plate and the substrate. The way of fixed connection can be any one of metal-glass bonding or bonding with conductive silver glue, etc. After the fixed connection, a self-shielding structure is obtained, in which the circuit to be shielded is placed in the shielding cavity, and the shielding layer on the surface of the shielding cavity is grounded through the grounding via holes of the substrate. In the self-shielding structure, the shielding cavity and the shielding layer completely cover the circuit to be shielded, providing effective package protection and RF shielding for the circuit to be shielded.

[0089] Referring Figure 5 as shown, the present application also provides a preparation method of a radio frequency front-end module for preparing the radio frequency front-end module described in any one of the above embodiments. The method includes:

[0090] S510. Provide a packaging module; wherein, the packaging module includes a self-shielding structure obtained by the method described in any one of the above embodiments.

[0091] S520. Cut the packaging module to obtain the radio frequency front-end module.

[0092] Specifically, in the case where a plurality of circuits to be shielded arranged in an array are mounted on the substrate, using the preparation method of the self-shielding structure described in any one of the above embodiments, a plurality of self-shielding structures arranged in an array are formed on the substrate to obtain a packaging module. According to the boundaries between the circuits to be shielded in the packaging module, the packaging module is cut, so as to obtain a plurality of independent units with similar structures as the radio frequency front-end module. It should be noted that the radio frequency front-end module includes the circuit to be shielded and its corresponding self-shielding structure. In other embodiments, the radio frequency front-end module obtained by cutting may also have different structures and include circuits to be shielded that implement different functions.

[0093] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations all fall within the scope defined by the appended claims.

[0094] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, commodity or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, commodity or device. Without further limitation, the element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, commodity or device including the said element.

[0095] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for the relevant parts, reference can be made to the description of the method embodiment.

[0096] The above description is only for the embodiments of the present application and is not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

[0097] Although the embodiments of the present application are described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A self-shielding structure, characterized in that, The self-shielding structure includes: a substrate; a circuit to be shielded, located on the substrate; a cover plate, located on the substrate, and a shielding cavity is provided on the surface of the cover plate facing the substrate. The circuit to be shielded is located in the shielding cavity, a shielding layer is provided on the surface of the shielding cavity, and the shielding layer is grounded.

2. The self-shielding structure according to claim 1, wherein A plurality of circuits to be shielded arranged in an array are provided on the substrate; Correspondingly, a plurality of shielding cavities covering the shielded circuits are provided on the cover plate.

3. The self-shielding structure according to claim 1, characterized in that The shielding layer is grounded through a grounding via hole in the substrate.

4. The self-shielding structure according to claim 1, wherein The surface of the shielding cavity includes a side wall and a top surface, and the shielding layer is attached to the side wall and the top surface.

5. The self-shielding structure according to claim 4, characterized in that The side wall forms an acute angle with the surface of the substrate facing the cover plate.

6. The self-shielding structure according to claim 1, wherein The circuit to be shielded constitutes a component to be shielded; The height of the shielding cavity matches the height of the component to be shielded, and the width of the shielding cavity matches the area occupied by the component to be shielded on the substrate.

7. The self-shielding structure according to claim 1, characterized in that The substrate includes a glass substrate of the packaging module, and the cover plate includes a glass cover plate of the packaging module.

8. A radio frequency front-end module, characterized in that, The radio frequency front-end module is an independent unit obtained by cutting the packaging module, and the packaging module includes the self-shielding structure according to any one of claims 1 to 7.

9. A preparation method of a self-shielding structure, characterized in that, The method includes: mounting the circuit to be shielded on the substrate; forming a shielding cavity on the surface of the cover plate facing the substrate, and forming a shielding layer on the surface of the shielding cavity; connecting the substrate and the cover plate to obtain the self-shielding structure; wherein, the circuit to be shielded is located in the shielding cavity, and the shielding layer is grounded.

10. A preparation method of a radio frequency front-end module, characterized in that, The method includes: providing a packaging module; wherein, the packaging module includes the self-shielding structure obtained by the method according to claim 9; cutting the packaging module to obtain the radio frequency front-end module.

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