Multi-layer PCB structure and installation method

Abstract

The invention discloses a multi-layer PCB structure and an installation method, and solves the problem of low utilization rate of a PCB stacking space in the prior art. A multi-layer PCB structure is characterized in that a component space is arranged between two layer heights, and the multi-layer PCB structure comprises a first mounting surface and a second mounting surface; wherein the first mounting space and the second mounting space are overlapped; the first mounting space is a normal component mounting height range of the first mounting surface; and the second mounting space is in a normal component mounting height range of the second mounting surface. According to the invention, the PCB stacking space is optimized, the signal integrity is improved, the heat dissipation efficiency is enhanced, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the technical field of printed circuit technology, and particularly to a multi-layer PCB structure and an installation method. Background Art

[0002] With the rapid development of electronic products, especially the evolution towards miniaturization and multi-functionality, the design and manufacturing of printed circuit boards (PCBs) face unprecedented challenges. Although traditional PCB stacking methods have been widely used in the past few decades, when dealing with the high-density and high-performance requirements of modern electronic products, many problems have gradually emerged. These problems not only limit the further miniaturization and function integration of electronic products, but also have a negative impact on signal integrity, heat dissipation performance, and manufacturing cost. The traditional PCB stacking method has problems such as low space utilization, serious signal interference, insufficient heat dissipation efficiency, and high wiring complexity. To sum up, the traditional PCB stacking method has obvious deficiencies in terms of space utilization, signal integrity, heat dissipation performance, and wiring complexity, and it is difficult to meet the requirements of modern electronic products for high performance, high reliability, and miniaturization. Therefore, an innovative PCB stacking technology is urgently needed to solve the above problems and promote the further development of electronic products. Summary of the Invention

[0003] This application proposes a multi-layer PCB structure and an installation method, which solves the problem of low space utilization of PCB stacking in the prior art.

[0004] An embodiment of this application provides a multi-layer PCB structure, in which a component space is set between two layer heights. The multi-layer PCB structure includes a first mounting surface and a second mounting surface. The first mounting space and the second mounting space overlap. The first mounting space is the component mounting height range in the normal direction of the first mounting surface. The second mounting space is the component mounting height range in the normal direction of the second mounting surface.

[0005] Further, the first mounting surface is within the range of the second mounting space, and / or, the second mounting surface is within the range of the first mounting space.

[0006] Preferably, it includes a bridging part for avoiding interlayer displacement of the multi-layer PCB.

[0007] Preferably, it includes a limiting component for the normal displacement of the multi-layer PCB layers.

[0008] Preferably, it further includes an electromagnetic shielding layer. The electromagnetic shielding layer is arranged outside the single-layer structure, and its shape fits the structure, and it is used to independently shield different layer structures.

[0009] Preferably, it further includes a heat dissipation channel and heat dissipation silica gel. The heat dissipation channel is arranged between the components of the single-layer structure or between two adjacent layers of the structure. The heat dissipation silica gel is filled between two adjacent layers of the structure.

[0010] Preferably, a hollow opening is provided in the structure to cause an overlapping space between the first installation space and the second installation space.

[0011] Preferably, the normal directions of the first installation surface and the second installation surface are the same or opposite.

[0012] Preferably, the arrangement of components on the first installation space and the second installation space between two adjacent layers of the structure includes: components with a height less than the first set threshold and greater than the second set threshold are arranged on the first installation surface, and no components are arranged on the opposite second installation surface; or, components with a height less than the second set threshold are arranged on the first installation surface, and components with a height less than the third set threshold are arranged on the opposite second installation surface; the sum of the second set threshold and the third set threshold is less than or equal to the first set threshold.

[0013] In a second aspect, the embodiments of the present application further provide a method for installing a multi-layer PCB structure, using the multi-layer PCB structure of any one of the embodiments in the first aspect, including the steps of: At least two PCB layers are stacked by laminating. A component space including a first installation surface and a second installation surface is provided between two layer heights; the first installation space and the second installation space overlap; the first installation space is the component installation height range in the normal direction of the first installation surface; the second installation space is the component installation height range in the normal direction of the second installation surface.

[0014] The above at least one technical solution adopted by the embodiments of the present application can achieve the following beneficial effects: The present application optimizes the space of PCB stacking, so that the meshing structure reduces the interlayer gap, and the volume is reduced by about 20% - 30% compared with the traditional design. The signal integrity is improved, and the high-frequency signal loss is reduced by more than 15% by shortening the signal path and reducing crosstalk. The heat dissipation efficiency is enhanced, and the thermal resistance is reduced by 10% - 20% by the three-dimensional heat dissipation network. The cost is reduced, and the usage amount of the shielding layer and the isolation material is reduced. Description of the Drawings

[0015] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings: Figure 1.1 It is a schematic diagram of a hollowed-out structure on the side where the installation surfaces of the embodiments of the present application are not opposite. Figure 1.2Schematic diagram of a structure with both sides hollowed out where the mounting surfaces are not opposite, provided by an embodiment of the present application; Figure 1.3 Schematic diagram of a structure where the mounting surfaces are opposite, provided by an embodiment of the present application; Figure 2.1 Schematic diagram of complementary horizontal space of components, provided by an embodiment of the present application; Figure 2.2 Schematic diagram of components meshing with each other, provided by an embodiment of the present application; Figure 2.3 Schematic diagram of a component passing through a hollow opening, provided by an embodiment of the present application; Figure 3 Schematic diagram of an electromagnetic shielding and heat dissipation component of a multi - layer PCB structure, provided by an embodiment of the present application; Figure 4 Flowchart of a method for installing a multi - layer PCB structure, provided by an embodiment of the present application. Detailed implementation manners

[0016] To make the objectives, technical solutions, and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0017] The following will detail the technical solutions provided by each embodiment of the present application in conjunction with the drawings.

[0018] Figure 1.1 、 Figure 1.2 and Figure 1.3 Schematic diagram of a multi - layer PCB structure provided by an embodiment of the present application, including: a component space is set between two layer heights (PCB layers), and the multi - layer PCB structure includes a first mounting surface 11 and a second mounting surface 12.

[0019] It should also be noted that the multi - layer PCB structure described in the present application can be a complete structure. The multi - layer PCB structures cannot move relative to each other in a direction parallel to the PCB layer plane. It can also be multiple separable PCB layers. That is, the PCB layers can move relative to each other, or at least can be disassembled by moving in the normal direction.

[0020] The component 13 is arranged on the PCB layer.

[0021] The first installation space and the second installation space overlap; the first installation space is the installation height range of components in the normal direction of the first installation surface; the second installation space is the installation height range of components in the normal direction of the second installation surface. The installation space of the present application includes the range extended tangentially along the installation surface.

[0022] Further, the first installation surface is within the range of the second installation space, and / or the second installation surface is within the range of the first installation space.

[0023] It should be noted that the first installation surface and the second installation surface of the multi-layer PCB layer can be opposite or not. That is to say, the normal directions of the first installation surface and the second installation surface are the same or opposite.

[0024] The situation where the first installation surface and the second installation surface of the multi-layer PCB layer are not opposite includes: The hollow opening can be arranged on one side of the PCB structure, such as Figure 1.1 shown, the overlapping space of the first installation space and the second installation space is distributed on one side of the PCB structure, and it can also include being arranged on both sides of the PCB structure, such as Figure 1.2 shown, the overlapping space of the first installation space and the second installation space is distributed on both sides of the PCB structure. At this time, the first installation surface is within the range of the second installation space, and the second installation surface is also within the range of the first installation space.

[0025] The situation where the first installation surface and the second installation surface are opposite is as Figure 1.3 shown, the space between the first installation surface and the second installation surface is the overlapping space 14 of the first installation space and the second installation space.

[0026] Single-sided hollowing: Such as Figure 1.1 shown, components with packages are arranged in the first installation space on one surface of the multi-layer PCB structure, and the inside is hollowed out on this side to expose the internal PCB layer, and components with packages are arranged in the second installation space on the internal PCB layer. The height of the components with packages arranged on the internal PCB layer is greater than the distance between the internal and outer two PCB layers. Therefore, there is an overlapping space between the first installation space and the second installation space, as Figure 1.1 shown by the dashed box in.

[0027] Double-sided hollowing: Such as Figure 1.2 shown, the two sides of the multi-layer PCB structure are respectively hollowed out at non-opposite positions to expose the internal PCB layer. The internal PCB layers hollowed out on the two sides are used as the first installation surface and the second installation surface respectively. Since the first installation surface and the second installation surface are staggered with each other in the PCB structure, there is an overlapping space between the first installation space and the second installation space. As Figure 1.2 shown by the dashed box in.

[0028] Internal space: As Figure 1.3 shown, between two PCB layers (the first PCB layer and the second PCB layer) of the multi-layer PCB structure. The component heights in different regions on the opposite faces of the first PCB layer and the second PCB layer are complementary.

[0029] Through the height engagement and complementarity in the normal direction of the board surfaces of different regions of the first PCB layer and the second PCB layer, there is an overlapping space between the first installation space and the second installation space. As Figure 1.3 shown by the dashed box in

[0030] When the PCB structure includes multiple PCBs: The first mounting surface and the second mounting surface are on different PCBs respectively, in the cases where the first mounting surface and the second mounting surface are opposite and not opposite.

[0031] The first mounting surface and the second mounting surface are opposite, and the overlapping space is the space sandwiched between the first mounting surface and the second mounting surface. The component arrangement therein can be as Figure 2.1 shown, occupying different spaces in the direction parallel to the board surface of the PCB layer to mount components. It can be as Figure 2.2 shown, occupying different heights in the normal direction of the board surface of the PCB layer and engaging and complementing each other.

[0032] Preferably, for the component arrangement on the first installation space and the second installation space between the two-layer structure, components with a height less than the first set threshold and greater than the second set threshold are arranged on the first mounting surface, and no components are arranged on the opposite second mounting surface; or, components with a height less than the second set threshold are arranged on the first mounting surface, and components less than the third set threshold are arranged on the opposite second mounting surface; the sum of the second set threshold and the third set threshold is less than or equal to the first set threshold.

[0033] The first mounting surface and the second mounting surface are not opposite, and the overlapping space is on the same side of the first mounting surface and the second mounting surface. As Figure 2.3 shown, the first PCB layer and the second PCB layer can be two adjacent layers of the structure. A hollow opening 16 is provided on the second PCB layer. The first mounting surface on the first PCB layer is close to the second PCB layer, and the second mounting surface on the second PCB layer is far from the first PCB layer. The overlapping space is on the side of the second PCB layer far from the first PCB layer. The component structure arranged on the first mounting surface can extend through the hollow opening into the overlapping space. At this time, the first mounting surface is not within the range of the second installation space, but the second mounting surface is within the range of the first installation space.

[0034] Between the two-layer PCB structures, there is: a hollow opening is provided on the PCB structure for overlapping the first installation space and the second installation space. Specifically, for example Figure 1.1 , Figure 1.2 and Figure 2.3 .

[0035] For example, a hollow opening is provided in a partial area on the first PCB layer or the second PCB layer for accommodating overly tall devices.

[0036] Again, for example, a hollow opening is provided in a partial area on the PCB layer for accommodating components with a height greater than the distance between adjacent PCB layers and arranged on opposite surfaces of two PCB layers. The shape and size of the hollow opening are dynamically adjusted according to the device height.

[0037] Furthermore, there is also a bridging part 15 for preventing displacement between multiple PCB layers.

[0038] The structure of the bridging part is for interconnecting the structures between layers of the multi-layer PCB structure, that is, it is a part of the multi-layer PCB structure. Or, the structure of the bridging part is to connect two systems with an FPC line to achieve electrical interconnection of each mounting surface of multiple PCB structures or a multi-layer PCB structure.

[0039] The multi-layer PCB layers in this application can be an integral structure or multiple PCB boards. In an embodiment of this application, there is also a limiting component for preventing displacement between the multi-layer PCB structures. Structurally: for example, in the case where the PCB structure is multiple PCB boards, at least two PCB layers are fixed with screws, and then the two PCB layers are fixed with a structural frame to prevent displacement.

[0040] Also, for example, in the case where the PCB structure is an integral structure, the space between two PCB layers is filled with an insulating material, and the two PCB layers are fixed through the insulating material to prevent displacement.

[0041] It should be noted that whether the PCB layers of different layers can be detached depends on whether the bridging structure between layers can be disassembled. If the bridging structure can be disassembled, the PCB layers can be detached in the vertical direction. If the bridging structure cannot be disassembled, the PCB layers cannot be detached.

[0042] In an embodiment of this application, there is a limiting component for the normal displacement of the multi-layer PCB structure.

[0043] Preferably, as Figure 3 shown, there is also an electromagnetic shielding layer 18. The electromagnetic shielding layer is provided on the outer side of the single-layer structure, and its shape conforms to the structure for independently shielding different layer structures.

[0044] The electromagnetic shielding layer is disposed outside the PCB layer, and its shape conforms to the PCB layer and the components disposed thereon, for independent shielding of the PCB layer. For example, the electromagnetic shielding layer is disposed outside a single PCB layer, and its shape conforms to the PCB layer and the components disposed thereon, for independent shielding of the PCB layer.

[0045] The electromagnetic shielding layer can be a copper foil wrap or an independent shielding cover. For example, a copper foil wrap is disposed outside the PCB layer to cover the high-frequency signal processing module, reducing electromagnetic radiation interference.

[0046] Preferably, it further includes a heat dissipation channel and heat dissipation silicone 19 ( Figure 3 as shown in).

[0047] The heat dissipation channel (not shown in the figure) is disposed between components of a single-layer structure, or between adjacent two-layer structures. The heat dissipation channel can have a specific structure or be virtual. For example, the heat of board B is evenly distributed throughout the system through heat dissipation materials, forming a virtual heat dissipation channel. In one embodiment, the heat dissipation channel is integrated within a single PCB layer and disposed between electronic devices. In one embodiment, the heat dissipation channel includes a metallized via array or a heat-conducting material (such as graphene). For example, a metallized via array is disposed within the PCB layer to conduct heat from the device to the edge of the PCB layer.

[0048] The heat dissipation silicone is a filling material with a high thermal conductivity coefficient. The heat dissipation silicone is filled between adjacent two-layer structures. Or, the heat dissipation silicone is filled between adjacent PCB layers. For example, heat-conducting silicone is filled between the first PCB layer and the second PCB layer to form a three-dimensional heat dissipation network. Another example is that the distance between the first PCB layer and the second PCB layer is 4 mm. An opening is hollowed out on the first PCB layer for accommodating a radio frequency module with a height of 6 mm on the second PCB layer. An opening is hollowed out on the second PCB layer for accommodating a module with a height of 6 mm on the first PCB layer.

[0049] Preferably, layers of different PCB structures are arranged with independent functional modules. For example, the functional modules include a power module, a signal module, and a ground module.

[0050] Figure 4 The following is a flowchart of a method for installing a multi-layer PCB structure provided by an embodiment of the present application. Using the multi-layer PCB structure of any one of the embodiments in the first aspect, it includes the steps: Step 410: At least two PCB layers are stacked by board layer stacking.

[0051] The board layer stacking refers to partial or complete alignment in the vertical direction and maintaining the relative position through a physical structure (such as a support column or a fixing member).

[0052] For example, the first PCB layer and the second PCB layer are centered with each other, and a 1-cm overlapping area is left at the edges for the structural connection of the bridging part.

[0053] The structure of the bridging part can be a multi-layer PCB, an impedance-matched microstrip line, a coplanar waveguide, or a flexible printed circuit board (FPC). For example, a microstrip line bridging structure is arranged in the edge area of the first PCB layer and the second PCB layer to ensure low-loss transmission of high-frequency signals.

[0054] The components are arranged on the PCB layers. For example, the components are arranged on both sides of the PCB layer. The components include resistors, capacitors, integrated circuits (ICs), connectors, etc. For example, a high-frequency signal processing module is arranged on the upper surface of the first PCB layer, and a power module is arranged on the lower surface; a radio frequency module is arranged on the upper surface of the second PCB layer, and a grounding module is arranged on the lower surface.

[0055] Step 420: Set a component space between two layer heights. The multi-layer PCB structure includes a first mounting surface and a second mounting surface; the first mounting space and the second mounting space overlap; the first mounting space is the component mounting height range in the normal direction of the first mounting surface; the second mounting space is the component mounting height range in the normal direction of the second mounting surface.

[0056] For example, the first mounting surface and the second mounting surface of adjacent PCB layers are opposite to each other, and the components arranged on the mounting surfaces are meshed and arranged in cooperation with each other.

[0057] Again, for example, the first mounting surface and the second mounting surface of adjacent PCB layers are not opposite to each other, and the components arranged on the mounting surfaces are arranged adjacent to each other in cooperation. That is, a hollow opening is provided on the first PCB layer and / or the second PCB layer, and the components on the panel of the first PCB layer close to the second PCB layer and higher than the first set threshold pass through the hollow opening provided on the second PCB layer and are staggered in the direction perpendicular to the normal of the PCB layer with the components on the panel of the second PCB layer far from the first PCB layer.

[0058] It should be noted that when the first mounting surface and the second mounting surface are not opposite to each other, the arrangement mode between the components on the first mounting surface and the second mounting surface is a staggered three-dimensional arrangement, that is, through physical space dislocation (such as opening penetration), the components of the two PCBs are nested with each other in three-dimensional space to avoid interference.

[0059] For example, the high components of the first PCB penetrate the openings of the second PCB. The components on the back surface (the side far from the first PCB) of the second PCB are staggered with the penetrating components in the direction perpendicular to the normal.

[0060] The space between adjacent PCB layers, that is, the overlapping height space of the first mounting space and the second mounting space, is less than the first set threshold.

[0061] The first set threshold value can be twice the height of components of any height. That is, by determining the height of the components, the components on the opposite surfaces of adjacent PCB layers are arranged to mesh with each other, thereby reducing the thickness of the combination of PCB layers stacked together through the layers.

[0062] Preferably, the meshing arrangement includes concave-convex structure meshing or three-dimensional broken line structure meshing.

[0063] The concave-convex structure refers to a space complementary arrangement formed by the height difference of components.

[0064] For example, a power module with a height of 5 mm is arranged on the lower surface of the first PCB layer, and a radio frequency module with a height of 3 mm is arranged on the upper surface of the second PCB layer. The two are meshed through the concave-convex structure to reduce the overall thickness.

[0065] For the three-fold line structure meshing, for example, the components are arranged in a specific geometric shape (such as "Z" shape or wave shape) in the direction parallel to the board surface of the PCB layer to achieve a compact layout and efficient signal transmission. This arrangement method optimizes the space utilization rate and improves the signal transmission performance by increasing the flexibility of device distribution.

[0066] Preferably, the component arrangement structure on the opposite surfaces of adjacent PCB layers includes: As Figure 2.1 shown, components with a height less than the first set threshold value and greater than the second set threshold value are arranged on the first PCB layer, and no components are arranged on the opposite second PCB layer.

[0067] Or, As Figure 2.2 shown, components with a height less than the second set threshold value are arranged on the first PCB layer, and components with a height less than the third set threshold value are arranged on the opposite second PCB layer; the sum of the second set threshold value and the third set threshold value is less than or equal to the first set threshold value.

[0068] For example, the first set threshold value is 5 mm. Components higher than this value are arranged on the first PCB layer, and no components are arranged on the opposite second PCB layer.

[0069] The second set threshold value is 3 mm, and the third set threshold value is 2 mm. Components lower than 3 mm but higher than 2 mm are arranged on the first PCB layer, and components lower than 2 mm are arranged on the opposite second PCB layer.

[0070] Preferably, the distance between adjacent PCB layers is less than the fourth set threshold value and greater than 0; the fourth set threshold value is twice the height of the tallest component.

[0071] For example, if the maximum device height is 5 mm, the distance between the two boards is less than 10 mm, for example, set to 8 mm, to ensure that the devices do not interfere with each other.

[0072] It should be noted that, without the premise of choosing to hollow out some areas on the upper part of the board surface, the distance between the two boards is preferably slightly higher than the maximum device height, and the part higher than the maximum device height is used to fill the heat dissipation silica gel. When choosing to hollow out the board surface, the preferred distance between the two boards can be only the distance for filling the heat dissipation silica gel.

[0073] In one embodiment, heat dissipation silica gel 19 is filled between the PCB layers. The heat dissipation silica gel is filled between adjacent PCB layers. The heat dissipation silica gel is a filling material with a high thermal conductivity coefficient. For example, thermal conductive silica gel is filled between the first PCB layer and the second PCB layer to form a three-dimensional heat dissipation network.

[0074] In one embodiment, the structures that are mutually engaged and matched on the opposite surfaces of the PCB layers include: hollow openings are provided in some areas on the first PCB layer or the second PCB layer for components with a height greater than the distance between adjacent PCB layers on the opposite surface of the adjacent PCB layer to pass through. Hollow openings are provided in some areas on the first PCB layer or the second PCB layer for accommodating over-height devices. The shape and size of the hollow openings are dynamically adjusted according to the device height.

[0075] For example, the distance between the first PCB layer and the second PCB layer is 4 mm, and a hollow opening is made on the first PCB layer for accommodating a radio frequency module with a height of 6 mm on the second PCB layer.

[0076] In one embodiment, adjacent PCB layers are installed and disassembled perpendicular to the board surface as a whole. Perpendicular installation and disassembly means installation or disassembly along the normal direction of the PCB layer. For example, during assembly, the first PCB layer and the second PCB layer are aligned and fixed in the vertical direction to avoid damage caused by lateral displacement.

[0077] In one embodiment, different PCB layouts have independent functional modules. For example, the functional modules include a power module, a signal module, and a ground module. The power module is laid out on the first PCB layer, and the signal module is laid out on the second PCB layer, and the two are interconnected through a bridging structure.

[0078] In one embodiment, the layout of the PCB layer is dynamically adjustable, and a double-sided layout or a single-sided layout is selected according to the device height and functional requirements. The number of layers, thickness, size, and shape of the PCB layer can be adjusted.

[0079] Through the above specific embodiments, the meshing PCB structure of the present invention can effectively solve the problems of traditional PCB designs in terms of space utilization, signal integrity, heat dissipation performance, and electromagnetic compatibility, and has broad application prospects and significant technical advantages.

[0080] It should also be noted that the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, commodity or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the statement "comprising..." does not exclude the presence of additional identical elements in the process, method, commodity or device comprising said element.

[0081] Those skilled in the art of the present technology can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the" and "said" used may also include the plural form. It should be further understood that the term "including" used in the description of the present invention means the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or their groups. It should be understood that when an element is "connected" or "coupled" to another element, it can be directly connected or coupled to other elements, or there may also be intermediate elements. In addition, the "connection" or "coupling" used here may include wireless connection or wireless coupling.

[0082] In the description of the present application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. In addition, in the description of the present application, unless otherwise specified, "a plurality" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after.

[0083] Those skilled in the art of the present technology can understand that, unless otherwise defined, all terms used herein (including technical, terminological and scientific terms) have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs.

[0084] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. A multi-layer PCB structure, characterized in that, A component space is set between two layer heights. The multi-layer PCB structure includes a first mounting surface and a second mounting surface; the first mounting space and the second mounting space therein overlap; the first mounting space is the component mounting height range in the normal direction of the first mounting surface; the second mounting space is the component mounting height range in the normal direction of the second mounting surface.

2. The multi-layer PCB structure according to claim 1, characterized in that, The first mounting surface is within the second mounting space, and / or, the second mounting surface is within the first mounting space.

3. The multi-layer PCB structure according to claim 1, characterized in that, It includes a bridging part for preventing displacement between multi-layer PCB layers.

4. The multi-layer PCB structure according to claim 1, wherein It includes a limiting component for the normal displacement of multi-layer PCB layers.

5. The multi-layer PCB structure according to claim 1, wherein It also includes an electromagnetic shielding layer; The electromagnetic shielding layer is arranged on the outer side of the single-layer structure, and its shape fits the structure, for independently shielding different layer structures.

6. The multi-layer PCB structure according to claim 1, wherein, It also includes a heat dissipation channel and heat dissipation silica gel; The heat dissipation channel is arranged between components in the single-layer structure, or between adjacent two-layer structures; The heat dissipation silica gel is filled between adjacent two-layer structures.

7. The multi-layer PCB structure according to claim 1, characterized in that, A hollow opening is set in the structure to make the first mounting space and the second mounting space generate an overlapping space.

8. The multi-layer PCB structure according to claim 1, characterized in that, The normal directions of the first mounting surface and the second mounting surface are the same or opposite.

9. The multi-layer PCB structure according to claim 1, wherein, The component arrangement on the first mounting space and the second mounting space between adjacent two-layer structures includes: Components with a height less than the first set threshold and greater than the second set threshold are arranged on the first mounting surface, and no components are arranged on the opposite second mounting surface; Or, Components with a height less than the second set threshold are arranged on the first mounting surface, and components with a height less than the third set threshold are arranged on the opposite second mounting surface; the sum of the second set threshold and the third set threshold is less than or equal to the first set threshold.

10. A method for installing a multi-layer PCB structure, using the multi-layer PCB structure described in any one of claims 1 to 9, characterized in that, It includes the steps of: At least two PCB layers are stacked by board layer; A component space is set between two layer heights, including a first mounting surface and a second mounting surface; the first mounting space and the second mounting space therein overlap; the first mounting space is the component mounting height range in the normal direction of the first mounting surface; the second mounting space is the component mounting height range in the normal direction of the second mounting surface.

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