A press for double-sided panels

Abstract

The application discloses a pressing machine for double-sided panels and relates to the field of pressing machines. The pressing machine comprises a base, a driving mechanism, a buffering mechanism, a clamping mechanism, a rotating mechanism, a sliding mechanism and two heating plates. A supporting frame is fixedly installed on the top of the base. The driving mechanism comprises an electric telescopic rod. One end of the electric telescopic rod penetrates through the supporting frame and is fixedly connected with the inner wall of the supporting frame. The buffering mechanism comprises a pressing rod and an air pressure valve. One end of the pressing rod is slidably connected with the inner wall of one end of the electric telescopic rod. The air pressure valve is fixedly installed on one side of the electric telescopic rod and is in communication with the inner cavity of the electric telescopic rod. A pressure sensor is fixedly installed on one side of the pressing rod. One side of the pressure sensor is fixedly connected with one side of one of the heating plates. One side of the other heating plate is fixedly connected with one side of the base. The application avoids the uneven force on the substrate when the conductive carrier is manually disassembled, prevents the substrate from being damaged or deformed, improves the production efficiency and effectively improves the yield of the double-sided panel.

Description

[0001] The present application is a divisional application of the application with application number 2022109507247, titled "A double-sided panel manufacturing method for reducing etching factor", filed on August 9, 2022. TECHNICAL FIELD

[0002] The present application relates to the technical field of pressing machines, in particular to a pressing machine for double-sided panels. BACKGROUND

[0003] The current double-sided panel manufacturing process mainly uses a substrate with a double-sided copper foil to obtain through drilling, electroplating, etching and other processes. SUMMARY

[0004] The purpose of the present application is to provide a pressing machine for double-sided panels to solve the above-mentioned deficiencies in the prior art.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme: a pressing machine for double-sided panels, comprising the following steps:

[0006] S1, carrier film pasting: polish one side of two conductive carriers and hot-press dry film to form a carrier plate;

[0007] S2, exposure and development: expose and develop one of the carrier plates using a film with a circuit pattern to expose the hollowed-out position on the carrier plate, and expose and develop the other carrier plate using another film with a circuit pattern to expose the hollowed-out position on the other carrier plate;

[0008] S3, copper plating and film removal: first, electroplate the two carrier plates to plate copper on the hollowed-out positions on the carrier plates, then heat the carrier plates to remove the dry film from the conductive carriers, leaving the plated copper circuit to form a copper-plated plate;

[0009] S4, substrate film pasting: paste protective films on both sides of the substrate;

[0010] S5, silver paste hole filling: first, laser drill the film-pasted substrate, then fill silver paste into the laser holes, then scrape off the silver paste above the protective film, and finally heat and pre-cure the silver paste;

[0011] S6, film tearing and pressing: first, tear off the protective films on both sides of the substrate, then place the two copper-plated plates on both sides of the substrate, heat and press the copper-plated plates and the substrate through the pressing machine, and after cooling, remove the conductive carriers on the two copper-plated plates to obtain a double-sided panel.

[0012] Further, the S1 conductive carrier is a steel plate or an aluminum plate, wherein one side surface roughness Ra of the conductive carrier is 40-50 nm, the other side surface roughness Ra of the conductive carrier is 20-30 nm, and the dry film heat pressing condition of one side of the conductive carrier is: dry film preheating temperature is 35-60℃, the pressure roller temperature is 80-100℃, the pressure is 4.0-5.0kgf / cm when pasting 2 , and the standing time after pasting is 20 min.

[0013] Further, the dry film removal condition in S3 is: the temperature is 40-50℃, and the film removal peeling strength is 10-15gf / mm.

[0014] Further, the protective film in S4 is a PET film or a PI film, and the thickness is 25-50μm, and the substrate pasting film condition is: the pasting temperature is 20-25℃, the pasting pressure is 0.1-0.2kgf / cm 2 , and the standing time after pasting is 30 min.

[0015] Further, the substrate in S5 is a semi-cured pp plate, the laser hole diameter is 40-300μm, the silver paste temperature when plugging is 20-26℃, the scraping plate for scraping silver paste is a silica gel scraping plate, the silica gel scraping plate hardness is 50, the silica gel scraping plate scraping speed is 200mm / s, the silver paste pre-curing temperature is 90℃, and the silver paste pre-curing time is 30 min.

[0016] Further, the protective film is removed 3-5min after the silver paste preheating is completed, the protective film removal peeling strength is 200-230gf / mm, the copper-plated plate and the substrate are pressed by a pressing machine, the heating rate of the two sides of the carrier plate is: 25-120℃ is 1.5-3℃ / min, 120-190℃ is 1.0-1.5℃ / min, the holding temperature is 180-190℃, the holding time is 70-80min, the cooling rate is: 100-190℃ is 1.5-2℃ / min, 25-100℃ is 2-2.5℃ / min, and the pressing machine includes a base, a driving mechanism, a buffer mechanism, a clamping mechanism, a rotating mechanism, a sliding mechanism, and two heating plates.

[0017] Further, the base top is fixedly installed with a support frame, the driving mechanism includes an electric telescopic rod, one end of the electric telescopic rod penetrates through the support frame and is fixedly connected with the inner wall of the support frame, the buffer mechanism includes a pressing rod and an air pressure valve, one end of the pressing rod is slidingly connected with the inner wall of one end of the electric telescopic rod, one side of the air pressure valve is fixedly installed on one side of the electric telescopic rod and is connected with the inner cavity of the electric telescopic rod, one side of the pressing rod is fixedly installed with a pressure sensor, one side of the pressure sensor is fixedly connected with one side of one of the heating plates, and the other heating plate is fixedly connected with one side of the base.

[0018] Further, the clamping mechanism comprises two clamping heads, the two clamping heads are symmetrically arranged on the heating plate on the base, one side of the clamping head is slidably connected with the inner wall of the heating plate, a fastening bolt is threadedly connected with the inner wall of the clamping head, the rotating mechanism comprises two rotating rods, one end of the rotating rod is slidably connected with a rotating shaft, one end of the rotating shaft is rotatably connected with one side of the electric telescopic rod, the other end of the rotating shaft is rotatably connected with the other side of the electric telescopic rod, one end of the rotating rod is rotatably connected with the inner wall of one side of the heating plate, and a clamping block is arranged on one side of the rotating rod.

[0019] Further, the sliding mechanism comprises four sliding rods, one end of the four sliding rods is slidably connected with the inner wall of the same heating plate, one end of the sliding rod is slidably connected with the inner wall of the base, a spring I is arranged on the surface of one end of the sliding rod, a sliding block is arranged on one side of the sliding rod, the sliding block is slidably connected with a jacking rod, the surface of the sliding block is slidably connected with the inner wall of the base, the jacking rod is sequentially penetrated through the base and the heating plate and is slidably connected with the inner walls of the base and the heating plate, and a spring II is arranged on the surface of the jacking rod.

[0020] Compared with the prior art, the double-sided panel pressing machine has the following beneficial effects:

[0021] 1. The double-sided panel pressing machine directly plates two layers of circuits in the form of electroplating after pressing film, exposure and development on two conductive carriers, avoids the generation of etching factors in the traditional process, improves the deviation value of actual impedance and design impedance, and the process is relatively simple, avoids the etching step of copper plate and the use of etching chemicals, and is more environmentally friendly.

[0022] 2. The double-sided panel pressing machine, by plugging the silver paste hole, scraping off the silver paste higher than the protective film, and finally heating and pre-solidifying the silver paste, then stacking the upper circuit, the silver paste plugged semi-cured sheet and the lower circuit in this order, and then heating and pressing the pressing machine to make the silver paste completely solidified and combined with the upper and lower circuits, so that the connecting hole can be completely plugged, avoiding the problem that the solder penetrates through the connecting hole during subsequent wave soldering of the PCB, which may cause short circuit or false welding, and the silver paste plugging method can have better conductive and heat-conductive effect.

[0023] 3、The double-sided panel press machine moves upward through the electric telescopic rod, first drives the rotating rod to rotate, makes the two clamping blocks close to each other, and clamps the two clamping blocks to the two sides of the conductive carrier located above, realizes that the clamping block drives the conductive carrier located above to move upward and separate from the substrate, continues to move upward through the electric telescopic rod, the heating plate moves to drive the four sliding rods to move upward, the sliding rod moves upward to drive the sliding block to move, thereby driving the top rod to move upward, the four top rods move upward to push the substrate to move upward, realize the separation of the substrate and the conductive carrier below, avoid damage to the conductive carrier, improve the utilization rate of the conductive carrier, at the same time, avoid the uneven stress of the substrate caused by manual disassembly of the conductive carrier, leading to damage or deformation of the substrate, improve the production efficiency, and effectively improve the yield of the double-sided panel. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0025] Figure 1 Process flow chart for manufacturing double-sided panel of the present application;

[0026] Figure 2 Carrier film pasting, exposure and development, and copper plating process change schematic diagram for manufacturing double-sided panel of the present application;

[0027] Figure 3 Substrate film pasting and silver paste hole plugging process change schematic diagram for manufacturing double-sided panel of the present application;

[0028] Figure 4 Pressing process change schematic diagram for manufacturing double-sided panel of the present application;

[0029] Figure 5 Structure perspective view of the press machine provided by the embodiment of the present application;

[0030] Figure 6 Sectional view of the front view of the press machine structure provided by the embodiment of the present application;

[0031] Figure 7 Partial sectional view of the buffer mechanism and rotating mechanism in the press machine provided by the embodiment of the present application;

[0032] Figure 8 Partial sectional view of the sliding mechanism in the press machine provided by the embodiment of the present application;

[0033] Figure 9 Enlarged view of A in the embodiment of the present application; Figure 5 ​

[0034] Figure 10 The application provides a double-sided board and a manufacturing method thereof Figure 6 An enlarged view of B in the embodiment of the application.

[0035] Explanation of reference numerals:

[0036] 1, carrier plate; 11, conductive carrier; 12, dry film; 2, copper-plated plate; 3, substrate; 31, protective film; 32, silver paste; 4, double-sided board; 5, base; 51, driving mechanism; 511, electric telescopic rod; 52, buffering mechanism; 521, pressing rod; 522, air pressure valve; 523, pressure sensor; 53, clamping mechanism; 531, chuck; 54, rotating mechanism; 541, rotating rod; 542, clamping block; 55, sliding mechanism; 551, sliding rod; 552, ejector rod; 6, heating plate. DETAILED DESCRIPTION

[0037] In order to make the skilled in the art better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings.

[0038] Embodiment one:

[0039] Please refer to Figures 1-4 A pressing machine for double-sided board, specifically comprising the following steps:

[0040] S1, carrier film pasting: polish one side of two conductive carriers 11 and respectively hot-press and paste dry films 12 to form carrier plates 1;

[0041] S2, exposure and development: expose and develop one of the carrier plates 1 using a film with circuit patterns to expose the hollowed-out position on the carrier plate 1, and expose and develop the other carrier plate 1 using another film with circuit patterns to expose the hollowed-out position on the other carrier plate 1;

[0042] S3, copper plating and film removing: first, electroplate the two carrier plates 1 to plate copper on the hollowed-out positions on the carrier plates 1, then heat the carrier plates 1 to remove the dry films 12 from the conductive carriers 11, and leave the copper-plated circuit to form copper-plated plates 2;

[0043] S4, substrate 3 film pasting: paste protective films 31 on both sides of the substrate 3;

[0044] S5, silver paste 32 hole filling: first, laser drill the film-pasted substrate 3, then fill the silver paste 32 into the laser holes, then scrape off the silver paste 32 higher than the protective films 31, and finally heat and pre-cure the silver paste 32;

[0045] S6. Film peeling and pressing: First, peel off the protective film 31 on both sides of the substrate 3. Then, place the two copper-plated plates 2 on both sides of the substrate 3. Heat and press the copper-plated plates 2 and the substrate 3 together using a pressing machine. After cooling, remove the conductive carrier 11 on the two copper-plated plates 2 to obtain the double-sided panel 4.

[0046] In this invention, the conductive carrier 11 in S1 is a steel plate or an aluminum plate. One side of one conductive carrier 11 has a surface roughness Ra of 40-50 nm, and the other side has a surface roughness Ra of 20-30 nm. The hot-pressing dry film 12 conditions for one side of the conductive carrier 11 are: a preheating temperature of 35-60°C for the dry film 12, a roller temperature of 80-100°C, and a bonding pressure of 4.0-5.0 kgf / cm². 2 After bonding, the settling time is 20 minutes. The bonding force between the electroplated copper and the carrier is less than the bonding force between the copper and the substrate 3 after curing. The copper and the conductive carrier 11 can be separated by external force. The different surface roughness of the two conductive carriers 11 can achieve the effect of separation one by one after the double-sided panels 4 are pressed together.

[0047] In this invention, the conditions for removing the dry film 12 in S3 are: temperature of 40-50℃ and peel strength of 10-15gf / mm. The lower peel strength makes it easier for the dry film 12 to separate from the conductive carrier 11, thus improving work efficiency.

[0048] In this invention, the protective film 31 in S4 is a PET film or a PI film with a thickness of 25-50 μm. The film lamination conditions for the substrate 3 are: lamination temperature of 20-25℃ and lamination pressure of 0.1-0.2 kgf / cm. 2 After bonding, the resting time is 30 minutes. The appropriate temperature and pressure ensure the bonding effect of the protective film 31 while avoiding deformation of the semi-cured substrate 3 under stress.

[0049] In this invention, the substrate in S5 is a semi-cured PP board, the diameter of the laser hole is 40-300μm, the temperature of the silver paste when plugging the hole is 20-26℃, the scraper for scraping the silver paste is a silicone scraper with a hardness of 50 and a scraping speed of 200mm / s, the pre-curing temperature of the silver paste is 90℃, and the pre-curing time of the silver paste is 30min.

[0050] In the application, the protective film 31 in S6 is removed 3-5 minutes after the preheating of the silver paste 32 is completed, the peeling strength of the protective film 31 is 200-230 gf / mm, the temperature rising rate of the carrier plate 1 on both sides is 1.5-3 ℃ / min at 25-120 ℃, 1.0-1.5 ℃ / min at 120-190 ℃, the holding temperature is 180-190 ℃, the holding time is 70-80 min, the cooling rate is 1.5-2 ℃ / min at 100-190 ℃ and 2-2.5 ℃ / min at 25-100 ℃, the silver paste hole preheating has a better effect of electric conduction and heat conduction, the substrate 3 still retains a certain temperature within 3-5 minutes after the preheating of the silver paste 32, the protective film 31 is easier to remove and less likely to remain at this time, the temperature control in the pressing process makes the copper-plated circuit better combined with the substrate 3, and makes the substrate 3 fully flow, so that the substrate 3 is more flat and less likely to deform after solidification.

[0051] Embodiment two:

[0052] Please refer to Figures 5-10 , the embodiment provides a technical scheme based on the embodiment one: the pressing machine in S6 includes a base 5, a driving mechanism 51, a buffer mechanism 52, a clamping mechanism 53, a rotating mechanism 54, a sliding mechanism 55 and two heating plates 6, the top of the base 5 is fixedly installed with a support frame, the driving mechanism 51 includes an electric telescopic rod 511, one end of the electric telescopic rod 511 penetrates through the support frame and is fixedly connected with the inner wall of the support frame, the buffer mechanism 52 includes a pressing rod 521 and an air pressure valve 522, one end of the pressing rod 521 is slidably connected with the inner wall of one end of the electric telescopic rod 511, one side of the air pressure valve 522 is fixedly installed on one side of the electric telescopic rod 511 and is in communication with the inner cavity of the electric telescopic rod 511, the inner cavity between the electric telescopic rod 511 and the pressing rod 521 is inflated and deflated by adjusting the air pressure valve 522, one side of the pressing rod 521 is fixedly installed with a pressure sensor 523, one side of the pressure sensor 523 is fixedly connected with one side of one of the heating plates 6, and one side of the other heating plate 6 is fixedly connected with one side of the base 5, the two heating plates 6 are controlled by a PLC programming program, the electric telescopic rod 511 is controlled to move downward, the pressing rod 521 is driven to move, and the upper heating plate 6 is driven to move downward, the copper-plated plate 2 and the substrate 3 are pressed by the pressing parameters set on the pressing machine.

[0053] In the application, the clamping mechanism 53 comprises two clamping heads 531 symmetrically arranged on the heating plate 6 on the base 5, one side of the clamping head 531 is in sliding connection with the inner wall of the heating plate 6, the inner wall of the clamping head 531 is in threaded connection with a fastening bolt, the rotating mechanism 54 comprises two rotating rods 541, one end of the rotating rod 541 is in sliding connection with a rotating shaft, the two ends of one of the rotating shafts are in rotating connection with one side of the electric telescopic rod 511, the two ends of the other rotating shaft are in rotating connection with the other side of the electric telescopic rod 511, one end of the rotating rod 541 is in rotating connection with one side of the inner wall of the heating plate 6, one side of the rotating rod 541 is provided with a clamping block 542, when the upper heating plate 6 presses one side of the upper copper-plated plate 2, the electric telescopic rod 511 continues to move and the air in the inner cavity thereof is compressed, at the same time, the electric telescopic rod 511 moves downward to drive the two rotating rods 541 to rotate, so that the clamping blocks 542 at the two ends of the two rotating rods 541 move away from each other, after the pressing is completed, the electric telescopic rod 511 moves upward, first drives the rotating rod 541 to rotate, so that the two clamping blocks 542 move close to each other, and are clamped to the two sides of the upper conductive carrier 11 through the two clamping blocks 542, so that the clamping block 542 drives the upper conductive carrier 11 to move upward and separate from the substrate 3.

[0054] In the application, the sliding mechanism 55 comprises four sliding rods 551, one end of the four sliding rods 551 is in sliding connection with the inner wall of the same heating plate 6, one end of the sliding rod 551 is in sliding connection with the inner wall of the base 5, one end of the sliding rod 551 is provided with a spring I, one side of the sliding rod 551 is provided with a sliding block, one side of the sliding block is in sliding connection with a jacking rod 552, the surface of the sliding block is in sliding connection with the inner wall of the base, one end of the jacking rod 552 penetrates the base 5 and the heating plate 6 in sequence and is in sliding connection with the inner walls of the base 5 and the heating plate 6, the surface of the jacking rod 552 is provided with a spring II, through the continuous upward movement of the electric telescopic rod 511, the heating plate 6 moves to drive the four sliding rods 551 to move upward, the upward movement of the sliding rod 551 drives the sliding block to move, so as to drive the jacking rod 552 to move upward, the upward movement of the four jacking rods 552 drives the substrate 3 to move upward, so as to separate the substrate 3 from the lower conductive carrier 11.

[0055] Working principle: when carrying out the pressing step in S6, first, the worker places the copper-plated plate 2 containing the conductive carrier 11 with low surface roughness on the lower heating plate 6 and places the positioning hole of the carrier plate 1 on the top rod 552, moves the chuck 531 on both sides of the heating plate 6, rotates the fastening bolt to fix the edge of the conductive carrier 11 with the chuck 531, then places the substrate 3 of S5 on the copper-plated plate 2, and then places another copper-plated plate 2 on the substrate 3, and then starts the electric telescopic rod 511 to move downward and drives the pressing rod 521 to move, thereby driving the upper heating plate 6 to move downward, when the upper heating plate 6 presses one side of the upper copper-plated plate 2, the electric telescopic rod 511 continues to move and the air in the inner cavity is compressed, at the same time, the electric telescopic rod 511 moves downward to drive the two rotating rods 541 to rotate, so that the clamping blocks 542 at one end of the two rotating rods 541 move away from each other, and the copper-plated plate 2 and the substrate 3 are pressed according to the set pressing parameters of the pressing machine, after the pressing is completed, the electric telescopic rod 511 moves upward, first drives the rotating rod 541 to rotate, so that the two clamping blocks 542 move close to each other and are clamped to the two sides of the upper conductive carrier 11 through the two clamping blocks 542, the electric telescopic rod 511 continues to move upward, the pressure in the inner cavity is reduced, and the heating plate 6 is driven to move upward through the pressing rod 521, so that the upper conductive carrier 11 is driven to move upward and separate from the substrate 3 through the clamping block 542, the electric telescopic rod 511 continues to move upward, the four sliding rods 551 are driven to move upward through the movement of the heating plate 6, and spring one is compressed under stress, the sliding rod 551 moves upward to drive the sliding block to move, thereby driving the top rod 552 to move upward and compressing spring two under stress, the four top rods 552 move upward to push the substrate 3 to move upward, so that the substrate 3 is separated from the lower conductive carrier 11, and the double-sided plate 4 is obtained, that is, the production of the double-sided plate 4 is completed.

[0056] The foregoing merely describes some exemplary embodiments of the present application by way of illustration, and it is needless to say that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present application. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of the claims of the present application.

Claims

1. A double-sided panel laminating machine, characterized in that: The press includes a base (5), a drive mechanism (51), a buffer mechanism (52), a clamping mechanism (53), a rotating mechanism (54), a sliding mechanism (55), and two heating plates (6); The base (5) is fixedly mounted with a support frame. The drive mechanism (51) includes an electric telescopic rod (511). One end of the electric telescopic rod (511) passes through the support frame and is fixedly connected to the inner wall of the support frame. The buffer mechanism (52) includes a pressure rod (521) and a pressure valve (522). One end of the pressure rod (521) is slidably connected to the inner wall of one end of the electric telescopic rod (511). One side of the pressure valve (522) is fixedly mounted on one side of the electric telescopic rod (511) and communicates with the inner cavity of the electric telescopic rod (511). One side of the pressure rod (521) is fixedly mounted with a pressure sensor (523). One side of the pressure sensor (523) is fixedly connected to one side of one of the heating plates (6), and one side of the other heating plate (6) is fixedly connected to one side of the base (5). The rotating mechanism (54) includes two rotating rods (541). One end of each rotating rod (541) is slidably connected to a rotating shaft. One of the rotating shafts is rotatably connected to one side of an electric telescopic rod (511), and the other rotating shaft is rotatably connected to the other side of the electric telescopic rod (511). One end of each rotating rod (541) is rotatably connected to the inner wall of one side of the heating plate (6). A locking block (542) is provided on one side of each rotating rod (541). The sliding mechanism (55) includes four sliding rods (551). One end of each of the four sliding rods (551) is slidably connected to the inner wall of the same heating plate (6). One end of each sliding rod (551) is slidably connected to the inner wall of the base (5). A spring is sleeved on the surface of one end of each sliding rod (551). A sliding block is provided on one side of each sliding rod (551). A top rod (552) is slidably connected on one side of each sliding block. The surface of the sliding block is slidably connected to the inner wall of the base. One end of the top rod (552) passes through the base (5) and the heating plate (6) in sequence and is slidably connected to the inner walls of the base (5) and the heating plate (6). A spring is sleeved on the surface of the top rod (552).

2. The double-sided panel pressing machine according to claim 1, characterized in that, The clamping mechanism (53) includes two clamps (531), which are symmetrically arranged on the heating plate (6) located on the base (5). One side of the clamp (531) is slidably connected to the inner wall of the heating plate (6), and the inner wall of the clamp (531) is threaded with a fastening bolt.

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