Laminating device of thick copper printed circuit board

Abstract

The invention belongs to the technical field of circuit boards, and particularly provides a thick copper printed circuit board laminating device which comprises a vacuum box, a clamping mechanism, a pressing mechanism, a moving mechanism and a laminating mechanism. The vacuum box comprises a box body, a box cover rotationally arranged on the box body and a guide rail arranged in the box body; the clamping mechanism is arranged on the box body and is clamped with the box cover; the laminating mechanism is arranged along the guide rail to realize lamination; the laminating mechanism adjusts the lifting of the laminating mechanism; the moving mechanism provides driving force for the pressing mechanism. According to the laminating device, through the design that the multiple laminating mechanisms move at the same time, multiple circuit board materials can be subjected to laminating machining.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and particularly to a laminating device for thick copper printed circuit boards. Background Art

[0002] Printed circuit boards are the most active industry in the contemporary electronic component industry. The industry growth rate is generally about 3 percentage points higher than that of the electronic component industry. From the development trend, the circuit board industry continues to grow at a high speed, and the import and export have also achieved high-speed growth. With the industry growth, it is gradually being optimized and improved. The laminator for printed circuit boards is one of the necessary equipment in the circuit board forming process.

[0003] The existing laminating devices for processing printed circuit boards generally include a chassis and a pair of lower pressing plates and upper pressing plates symmetrically arranged up and down inside the chassis. Through the driving mechanism connected to the motor, uniform pressure is applied to the symmetrically arranged and cooperatively facing lower pressing plate and upper pressing plate, so as to ensure the laminating efficiency while being beneficial to improving the laminating effect on the circuit board. However, in the prior art, the upper pressing plate and the lower pressing plate are used to laminate the circuit board, and multiple circuit boards cannot be laminated simultaneously, resulting in low guiding laminating efficiency. Summary of the Invention

[0004] In view of the above existing problems, the present invention provides a laminating device for thick copper printed circuit boards, which can perform laminating processing on multiple circuit board materials by simultaneously implementing the laminating action of multiple laminating mechanisms. The laminating device provided by the present invention integrates the simultaneous movement and pre-pressing design of multiple laminating mechanisms, has a compact structure and convenient operation, and provides a new device with high efficiency and guaranteed completion.

[0005] Specifically, a laminating device for thick copper printed circuit boards of the present invention includes: a vacuum box, including a box body, a box cover rotatably arranged on the box body, and a guide rail arranged inside the box body; a clamping mechanism arranged on the box body and clamped with the box cover to realize the locking and sealing of the vacuum box; at least two laminating mechanisms arranged along the guide rail for laminating the circuit board; a pressing mechanism for adjusting the lifting and spacing of the laminating mechanisms to realize the laminating of the circuit board material between the two laminating mechanisms; and a moving mechanism for providing the driving force for the lifting of the pressing mechanism.

[0006] Preferably, the clamping mechanism includes a clamping component arranged on the joint edge of the box body and a locking component connected to the clamping component. Among them, the clamping component includes a moving rod and a clamping rod rotatably connected to the moving rod. The clamping rod is in an L-shaped structure and can be clamped with the box cover.

[0007] Preferably, the locking assembly includes a mounting seat provided on the box body, a threaded rod threadedly engaged with the mounting seat, and a handle provided at the end of the threaded rod. The moving rod is connected to the threaded rod, and the threaded rod drives the moving rod to move relative to the mounting seat under the drive of the handle, thereby realizing the clamping of the clamping rod and the box cover by the moving rod. In addition, in addition to providing a threaded connection with the threaded rod, the mounting seat can also be provided with a guiding slide rod to provide guidance for the movement of the moving rod, and the moving rod can move along the guiding slide rod by passing through the guiding slide rod.

[0008] Preferably, a clamping groove is provided on the box cover; a clamping block is provided on the clamping rod, which is in concave-convex fit with the clamping groove.

[0009] Preferably, the guide rails are arranged parallel to the inner wall of the box body, preferably vertically arranged, and more preferably four guide rails are provided for the lamination mechanism to slide along. In the embodiment where the driving mechanism is arranged at the lower part of the box body, a support column connected / abutted to the lamination mechanism (hot pressing plate) is provided at the lower end of the guide rail.

[0010] Furthermore, the lamination mechanism includes a hot pressing plate capable of moving along the guide rails and pressing plates on both sides of the hot pressing plate. The circuit board material is placed on the upper surface of the lamination mechanism (upper pressing plate), and the lamination of the material is realized by the movement and extrusion between two groups of parallel lamination mechanisms.

[0011] Preferably, the pressing mechanism includes a connecting column provided on the hot pressing plate, a connecting rod rotatably connected to one end connecting column (preferably the lowermost connecting column, or the connecting column of the upper hot pressing plate, and in a few cases, it can also be the connecting column at other positions) and a scissor lifting assembly rotatably connected to the connecting rod. Among them, the scissor lifting assembly is rotatably connected to all other connecting columns except the above-mentioned end connecting column; the connecting rod is rotatably connected to the moving mechanism.

[0012] Preferably, the moving mechanism includes a connecting rod rotatably connected to the connecting rod, a moving plate rotatably connected to the connecting rod, a slide rod along which the moving plate can slide, and a moving assembly for driving the moving plate to move.

[0013] Preferably, the moving assembly includes a driving motor and a bidirectional lead screw driven by the driving motor. Among them, the bidirectional lead screw has a thread threadedly engaged with the moving plate. More preferably, generally, two moving plates are provided to drive the lifting adjustment / control of the two connecting rods of the pressing mechanism. In such an embodiment, the bidirectional lead screw has a first thread portion and a second thread portion with opposite helix directions; the first thread portion and the second thread portion are respectively threadedly connected to the two moving plates.

[0014] The operation process of the lamination device of the present invention is as follows: Release the limit on the box cover by rotating the handle of the rotary clamping mechanism, so that the box cover can be rotated and opened; Place the materials of multiple circuit boards on the upper pressing plates of multiple lamination mechanisms, drive the pressing mechanism through the moving mechanism to drive the lamination mechanisms to move along the guide rails, and the multiple lamination mechanisms move synchronously (for example, move downward simultaneously), the distance between the lamination mechanisms is reduced, so that the lower pressing plate of the upper lamination mechanism and the upper pressing plate of the next mechanism can gradually pre-press the circuit board materials therebetween; Check whether the materials are placed in place, then cover the box cover, achieve clamping through the cooperation of the clamping mechanism and the clamping groove on the joint edge of the box cover, and further screw in the handle to gradually tighten, so that the box cover and the box body are completely tightened and sealed, evacuate the air in the box through the vacuum equipment; After evacuation, heat the hot pressing plate, and the heat is transferred to the circuit board materials through the upper and lower pressing plates to perform lamination processing on the circuit boards. After the lamination processing is completed, open the clamping mechanism so that the box cover can be opened, and then drive the pressing mechanism through the moving mechanism to drive the lamination mechanisms to move, so that the lamination mechanisms are separated from each other, so that the circuit board materials can be taken out.

[0015] Compared with the prior art, the present invention has the following beneficial technical effects: Through the design of simultaneous movement of multiple lamination mechanisms, lamination processing can be carried out on multiple circuit board materials, with a compact structure and convenient operation, providing a lamination device for thick copper printed circuit boards that is efficient and has guaranteed completion. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a three-dimensional structure schematic diagram of an example of a lamination device for thick copper printed circuit boards of the present invention.

[0018] Figure 2 For Figure 1 It shows a three-dimensional structure schematic diagram of an example of a lamination device for thick copper printed circuit boards of the present invention in an open state.

[0019] Figure 3 For Figure 1 It shows a three-dimensional structure schematic diagram of the components inside the vacuum box of an example of a lamination device for thick copper printed circuit boards of the present invention.

[0020] Figure 4 For Figure 1 It shows a three-dimensional structure schematic diagram of the clamping mechanism of an example of a lamination device for thick copper printed circuit boards of the present invention.

[0021] Figure 5 For Figure 4 The partial enlarged structural schematic diagram at position A in

[0022] Reference numerals: 1, vacuum chamber; 101, chamber body; 102, chamber cover; 1021, clamping groove; 103, guide rail; 104, support column; 2, clamping assembly; 201, clamping rod; 202, clamping block; 203, moving rod; 3, locking assembly; 301, mounting seat; 302, threaded rod; 303, handle; 4, pressing mechanism; 401, connecting rod; 402, connecting column; 403, scissor lift assembly; 5, moving mechanism; 501, connecting rod; 502, moving plate; 503, sliding rod; 504, moving assembly; 505, mounting plate; 6, laminating mechanism; 601, hot pressing plate; 602, pressing plate. Detailed implementation manners

[0023] To make the above objects, features, and advantages of the present invention more apparent and understandable, the following detailed description of the specific implementation manners of the present invention will be given with reference to the accompanying drawings of the specification.

[0024] In the following description, many specific details are set forth to facilitate a thorough understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the spirit of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0025] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that can be included in at least one implementation manner of the present invention. The appearances of "in one embodiment" in different places in this specification do not all refer to the same embodiment, nor are they embodiments that are mutually exclusive of other embodiments individually or selectively.

[0026] Furthermore, the present invention is described in detail with reference to the schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional views showing the device structure will be enlarged locally in a non-general proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0027] As Figures 1-5 shown, a laminating device for a thick copper printed circuit board proposed by the present invention includes: a vacuum chamber 1, a clamping mechanism, a pressing mechanism 4, a moving mechanism 5, and a laminating mechanism 6.

[0028] Among them, referring to Figure 1 and 2, the vacuum chamber 1 includes a chamber body 101, a chamber cover 102 rotatably arranged on the chamber body 101, and a guide rail 103 vertically arranged inside the chamber body 101. Among them, the clamping mechanism is arranged on the chamber body 101 and is clamped with the chamber cover 102. A plurality of laminating mechanisms 6 are arranged in parallel and can all move along the guide rail 103. The pressing mechanism 4 is arranged inside the chamber body 101 and its output end is connected to the laminating mechanism 6. The moving mechanism 5 is arranged at the bottom of the chamber body 101 and its output end is connected to the pressing mechanism 4.

[0029] Among them, a support column 104 connected to the laminating mechanism 6 is arranged at the lower end of the guide rail 103. The laminating mechanism 6 includes a hot pressing plate 601 slidably arranged on the guide rail 103, and pressing plates 602 arranged on both sides of the hot pressing plate 601. Through the heating of the hot pressing plate 601, heat is transferred to the materials of the circuit board through the pressing plates 602. After the air in the vacuum chamber 1 is pumped out, hot pressing can be carried out to achieve the lamination processing of the circuit board.

[0030] Furthermore, by releasing the limit on the chamber cover 102 through the clamping mechanism, the chamber cover 102 can be rotated. After opening the chamber cover 102, the materials of a plurality of circuit boards can be placed on the pressing plates 602 of the plurality of laminating mechanisms 6. The moving mechanism 5 drives the pressing mechanism 4 to move, so that the pressing mechanism 4 can drive the laminating mechanism 6 to move, and the plurality of laminating mechanisms 6 move downward synchronously, so that the plurality of laminating mechanisms 6 move downward simultaneously, and the distance between the laminating mechanisms 6 is reduced, so that the circuit board can be gradually pre-pressed. Check whether the materials are placed in place, cover the chamber cover 102, clamp the chamber cover 102 through the clamping mechanism, and gradually lock it, so that the chamber cover 102 and the chamber body 101 are completely sealed. The air in the chamber body 101 is evacuated by a vacuum pumping device. After evacuation, the hot pressing plate 601 is heated, and heat is transferred to the materials of the circuit board through the pressing plates 602 to perform lamination processing on the circuit board.

[0031] After the lamination processing is completed, the clamping mechanism is opened so that the chamber cover 102 can be opened. Then, the moving mechanism 5 drives the pressing mechanism 4 to move, and the pressing mechanism 4 drives the laminating mechanism 6 to move, so that the laminating mechanism 6 can be separated, and thus the circuit board materials can be taken out.

[0032] Furthermore, refer to Figures 4-5, the clamping mechanism includes a clamping component 2 provided on one side of the engaging edge of the box body 101, and a locking component 3 provided on the box body 101 and connected to the clamping component 2. The locking component 3 includes a mounting seat 301 provided on the box body 101, a threaded rod 302 threadedly engaged with the mounting seat 301, and a handle 303 provided at the end of the threaded rod 302; the clamping component 2 includes a moving rod 203 that moves along the guide rod of the mounting seat 301 driven by the threaded rod 302, and a plurality of clamping rods 201 rotatably provided on the moving rod 203; the clamping rod 201 has an L-shaped structure and the clamping rod 201 is clamped with the box cover 102, and a clamping groove 1021 is provided on the box cover 102; a clamping block 202 is embedded in the clamping rod 201 and is embedded in the clamping groove 1021.

[0033] Further, the moving rod 203 is supported by the mounting seat 301. When fixing the box cover 102, by rotating the handle 303, the threaded rod 302 is driven to rotate. The threaded rod 302 drives the moving rod 203 to move. The moving rod 203 drives the clamping rod 201 to move in the direction of the box cover 102 until it reaches the position. After closing the box cover 102, the handle 303 is rotated in the reverse direction, so that the threaded rod 302 rotates to drive the moving rod 203 to move in the reverse direction, so that the clamping rod 201 presses on the box cover 102 to fix the box cover 102. The clamping groove 1021 on the box cover 102 is used to hold the clamping block 202, so that the clamping block 202 can be embedded in the clamping groove 1021 to prevent the clamping block 202 from falling off the box cover 102 and ensure the reliability of the connection. By continuing to rotate the handle 303 to increase the pressure, the sealing effect is achieved.

[0034] Further, referring to Figure 3 , the pressing mechanism 4 includes a plurality of connecting columns 402 provided on the hot pressing plate 601, two connecting rods 401 rotatably connected to the lowermost connecting column 402, and a scissor lifting assembly 403 rotatably connected to the connecting rods 401.

[0035] Further, the moving mechanism 5 includes two connecting rods 501 rotatably connected to the connecting rod 401, two moving plates 502 rotatably connected to the connecting rods 501, a sliding rod 503, and a moving component 504 for driving the moving plate 502 to move.

[0036] Further, the moving mechanism 5 includes a mounting plate 505 provided on the box body 101 and abutting against the hot pressing plate 601. A sliding rod 503 slidably connected to the moving plate 502 is provided on the mounting plate 505, and a moving component 504 is provided on the mounting plate 505.

[0037] Among them, the moving component 504 includes a driving motor disposed on the mounting plate 505 and a bidirectional lead screw of the driving motor; the bidirectional lead screw includes a first thread portion and a second thread portion with opposite thread directions; the first thread portion and the second thread portion are respectively threadedly connected to the moving plate 502.

[0038] By driving the bidirectional lead screw with the driving motor, the bidirectional lead screw drives the moving plate 502 to move, the moving plate 502 drives the connecting rod 501 to move, the sliding rod 503 guides the moving plate 502, the connecting rod 501 pushes the connecting rod 401 to move, the connecting rod 401 drives the scissor lifting assembly 403 to move, and when the scissor lifting assembly 403 moves, it will drive the laminating mechanism 6 except the lowermost laminating mechanism to move, so that the laminating mechanism 6 can be closed to perform lamination or after lamination is completed, the multiple laminating mechanisms 6 can be separated simultaneously to facilitate taking out the laminated circuit board and putting in new circuit board materials. The lowermost laminating mechanism 6 is supported by the mounting plate 505 so that the lowermost laminating mechanism 6 can be relatively fixed.

[0039] The embodiments of the present invention have been described in detail above with reference to the drawings, but the present invention is not limited thereto. Various changes can be made within the scope of knowledge of those skilled in the art without departing from the purpose of the present invention.

[0040] It should be understood that the orientation indications such as "upper", "lower", "bottom", "inner" described herein are divided according to the self-direction of the device shown in the example in the figure. It should be understood that in the solution of the present invention, the position indications such as up and down, inside and outside can be interchanged without causing a substantial limitation to the solution.

Claims

1. A lamination device for a thick copper printed circuit board, characterized in that, The device includes: A vacuum chamber (1), comprising a chamber body (101), a chamber cover (102) rotatably arranged on the chamber body (101), and a guide rail (103) arranged inside the chamber body (101); A clamping mechanism, arranged on the chamber body (101) and clamped with the chamber cover (102) to lock the vacuum chamber (1); At least two laminating mechanisms (6), arranged along the guide rail (103) for laminating the circuit board; A pressing mechanism (4) for adjusting the lifting of the laminating mechanism (6) to laminate the circuit board; and A moving mechanism (5) for providing the driving force for the lifting of the pressing mechanism (4).

2. The lamination device for a thick copper printed circuit board according to claim 1, characterized in that, The clamping mechanism includes a clamping component (2) arranged on the joint edge of the chamber body (101) and a locking component (3) connected to the clamping component (2); the clamping component (2) includes a moving rod (203) and a clamping rod (201) rotatably connected to the moving rod (203); the clamping rod (201) has an L-shaped structure and can be clamped with the chamber cover (102).

3. The lamination device for a thick copper printed circuit board according to claim 2, characterized in that, The locking component (3) includes a mounting seat (301) arranged on the chamber body (101), a threaded rod (302) threadedly engaged with the mounting seat (301), and a handle (303) arranged at the end of the threaded rod (302); the moving rod (203) is connected to the threaded rod (302), and the threaded rod (302) drives the moving rod (203) to move relative to the mounting seat (301) under the drive of the handle (303).

4. The lamination device for a thick copper printed circuit board according to claim 3, characterized in that, A clamping groove (1021) is arranged on the chamber cover (102); a clamping block (202) matched with the clamping groove (1021) is arranged on the clamping rod (201).

5. The lamination device for a thick copper printed circuit board according to claim 4, characterized in that, The guide rail (103) is arranged parallel to the inner wall of the chamber body (101); the laminating mechanism (6) includes a hot pressing plate (601) capable of moving along the guide rail (103) and pressing plates (602) on both sides of the hot pressing plate (601).

6. The lamination device for a thick copper printed circuit board according to claim 5, characterized in that, The pressing mechanism (4) includes a connecting column (402) arranged on the hot pressing plate (601), a connecting rod (401) rotatably connected to one end of the connecting column (402), and a scissor lifting assembly (403) rotatably connected to the connecting rod (401); the scissor lifting assembly (403) is rotatably connected to the other connecting columns (402) except the connecting column (402) at the one end; the connecting rod (401) is rotatably connected to the moving mechanism (5).

7. The lamination device for a thick copper printed circuit board according to claim 6, characterized in that, The moving mechanism (5) includes a connecting rod (501) rotatably connected to the connecting rod (401), a moving plate (502) rotatably connected to the connecting rod (501), a sliding rod (503) along which the moving plate (502) can slide, and a moving component (504) for driving the moving plate (502) to move.

8. The lamination device for a thick copper printed circuit board according to claim 7, characterized in that, The moving component (504) includes a driving motor and a bidirectional lead screw driven by the driving motor; the bidirectional lead screw has a thread threadedly engaged with the moving plate (502).

9. The lamination device for a thick copper printed circuit board according to claim 8, characterized in that, The bidirectional lead screw has a first thread portion and a second thread portion with opposite helix directions, and is respectively in threaded fit with at least two of the moving plates (502).

10. The lamination device for a thick copper printed circuit board according to claim 9, characterized in that, When the moving mechanism (5) is arranged at the lower part of the box body (101), a support column (104) for supporting the lowermost lamination mechanism (6) is preferably arranged at the lower end of the guide rail (103); the moving mechanism (5) further includes a mounting plate (505) with both ends abutted against the box body (101) and the lowermost lamination mechanism (601), and the slide rod (503) is preferably arranged between the mounting plates (505).

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