Electrical device

Abstract

The invention provides electrical equipment, and belongs to the technical field of electrics. The electrical equipment comprises a machine shell, a radiator and at least one discrete device. The radiator is connected with the outer side wall of the machine shell. The discrete device is located in the machine shell, and a metal frame of the discrete device is connected with the inner side wall of the machine shell. According to the invention, the heat dissipation area of the radiator is increased, the heat dissipation effect of the electrical equipment is improved, the working stability of the electrical equipment is improved, and the service life of the electrical equipment is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the field of electrical technologies, and particularly to an electrical device. Background Art

[0002] For some electrical devices, a power module can be applied therein as a rectifier or an inverter. The power module is usually a customized packaging structure, that is, a plurality of discrete devices are packaged together. When in use, the packaged power module can be installed in the casing of the electrical device and electrically connected to the control circuit board of the electrical device, so as to connect the power module into the control circuit of the electrical device.

[0003] Generally, a radiator is also provided on the power module, and when the discrete devices are applied, heat dissipation can be performed on them through the radiator.

[0004] However, due to the small volume of the power module, the heat dissipation area of the radiator is also small, resulting in poor heat dissipation effect and reducing the working stability and service life of the electrical device. Summary of the Invention

[0005] Embodiments of the present disclosure provide an electrical device, which can improve the heat dissipation effect of the electrical device, and further improve the working stability and service life of the electrical device. The technical solution is as follows:

[0006] Embodiments of the present disclosure provide an electrical device, characterized in that the electrical device includes a casing, a radiator, and at least one discrete device;

[0007] The radiator is connected to the outer side wall of the casing;

[0008] The discrete device is located inside the casing, and the metal frame of the discrete device is connected to the inner side wall of the casing.

[0009] In a possible implementation manner, the radiator includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are uniformly arranged on the outer side wall of the casing.

[0010] In a possible implementation manner, the electrical device further includes a weldable metal plate and a solder layer;

[0011] The weldable metal plate is located between the casing and the discrete device and is connected to the inner side wall of the casing;

[0012] The solder layer is located between the weldable metal plate and the discrete device, the solder layer is welded to the weldable metal plate, and is connected to the metal frame of the discrete device.

[0013] In a possible implementation, the number of the weldable metal plates, the solder layers, and the discrete devices is the same, and the position of each weldable metal plate corresponds to the position of a solder layer and a discrete device respectively.

[0014] In a possible implementation, at least one positioning groove is provided on the inner side wall of the casing, and the positioning groove is arranged along the edge of the weldable metal plate.

[0015] In a possible implementation, the positioning groove is an annular groove and is arranged around the edge of the weldable metal plate.

[0016] In a possible implementation, the weldable metal plate is a metal plate electroplated on the inner side wall of the casing.

[0017] In a possible implementation, the electrical device further includes a heat conducting member, the heat conducting member is located between the solder layer and the discrete device, and is welded and connected to the solder layer and the metal frame of the discrete device.

[0018] In a possible implementation, the heat conducting member includes a first metal layer, an insulating heat conducting layer, and a second metal layer which are stacked and connected in sequence;

[0019] The first metal layer is welded and connected to the solder layer, and the surface of the first metal layer close to the solder layer has a first ventilation groove, and both ends of the first ventilation groove are located on the side surface of the first metal layer;

[0020] The second metal layer is welded and connected to the metal frame of the discrete device.

[0021] In a possible implementation, the number of the first ventilation grooves is multiple, and the multiple first ventilation grooves are arranged in a grid pattern.

[0022] In a possible implementation, the surface of the second metal layer close to the metal frame has a second ventilation groove, and both ends of the second ventilation groove are respectively located on the side surface of the second metal layer.

[0023] The technical solutions provided by the embodiments of the present disclosure at least include the following beneficial effects:

[0024] The embodiments of the present disclosure provide an electronic device, which directly connects a discrete device to the casing of the electrical device, and realizes the connection between the discrete device and the radiator through the casing. Since the area of the casing is large, the heat dissipation area of the radiator can be increased. Moreover, the casing and the radiator dissipate heat together, improving the heat dissipation effect, and further improving the working stability and service life of the electrical device.

[0025] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0028] Figure 2 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0029] Figure 3 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0030] Figure 4 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0031] Figure 5 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0032] Figure 6 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0033] Figure 7 is a schematic structural diagram of an electrical device shown in an embodiment of the present disclosure;

[0034] Figure 8 is an exploded view of a discrete device, a heat conducting member, a solder layer, and a weldable metal plate shown in an embodiment of the present disclosure;

[0035] Figure 9 is an exploded view of a discrete device, a heat conducting member, a solder layer, and a weldable metal plate shown in an embodiment of the present disclosure;

[0036] Figure 10 is an exploded view of a discrete device, a heat conducting member, a solder layer, and a weldable metal plate shown in an embodiment of the present disclosure.

[0037] LEGEND

[0038] 1. Housing; 2. Radiator; 3. Discrete device; 4. Weldable metal plate; 5. Solder layer; 6. Heat conducting member;

[0039] 11. Positioning groove;

[0040] 61. The first metal layer; 62. The insulating and heat-conducting layer; 63. The second metal layer;

[0041] 611. The first ventilation groove; 631. The second ventilation groove. Detailed implementation manners

[0042] Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art to which this disclosure pertains. The terms "first", "second", "third" and similar terms used in the specification and claims of this patent application of the disclosure do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a" or "one" do not denote a quantity limitation, but mean that there is at least one. The terms such as "comprising" or "including" mean that the elements or items appearing before "comprising" or "including" cover the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", "right" etc. are only used to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationships may also change accordingly.

[0043] To make the objectives, technical solutions and advantages of this disclosure clearer, the following will further describe the embodiments of this disclosure in detail with reference to the accompanying drawings.

[0044] The embodiments of this disclosure provide an electrical device. Refer to Figure 1 、 Figure 2 and Figure 3 , this electrical device includes a housing 1, a radiator 2 and at least one discrete device 3. The radiator 2 is connected to the outer sidewall of the housing 1, the discrete device 3 is located inside the housing 1, and the metal frame of the discrete device 3 is connected to the inner sidewall of the housing 1.

[0045] Among them, the housing 1 can be the protective outer shell of the electrical device, which can be made of a metal material, for example, it can be a metal material such as aluminum alloy, etc. Of course, it can also be other reasonable materials, and the embodiments of this disclosure do not limit this.

[0046] The shape of the housing 1 can be any reasonable shape. For example, the housing 1 can have a rectangular structure, a cylindrical structure, etc.

[0047] The radiator 2 is connected to the outer side wall of the chassis 1, that is, the radiator 2 is arranged on the outer side of the chassis 1. The chassis 1 conducts the heat generated when the internally installed components work to the radiator 2, and the chassis 1 and the radiator 2 dissipate heat together.

[0048] In a possible implementation, referring to Figure 2 , the radiator 2 may include a plurality of heat sinks (or called heat fins), and the plurality of heat sinks are evenly arranged on the outer side wall of the chassis 1. In this way, the heat dissipation area of the radiator is increased through the plurality of heat sinks, the heat dissipation effect of the electrical equipment is improved, and further the working stability and service life of the electronic equipment are improved.

[0049] Of course, the structure and quantity of the radiator 2 can be set according to requirements. One radiator 2 can be set only on one side of the chassis 1, or one radiator 2 can be set on different sides of the chassis 1 respectively, or a plurality of radiators 2 can be set on different sides of the chassis 1 respectively, etc. The embodiments of the present disclosure do not limit this.

[0050] In a possible implementation, the connection area between the radiator 2 and the chassis 1 can be greater than half or three - quarters of the area of the chassis 1 to increase the heat dissipation area of the radiator 2.

[0051] The connection manner between the radiator 2 and the chassis 1 can be any reasonable manner. For example, the two can be connected together by welding or snap - connection, etc., or the radiator 2 and the chassis 1 can be an integrally formed structure, which is more convenient for production and thus improves production efficiency.

[0052] The discrete device 3 is located inside the chassis 1, and the metal frame of the discrete device 3 is connected to the inner side wall of the chassis 1. Among them, the metal frame of the discrete device 3 is the metal part on the discrete device 3 for fixed installation, and the fixed connection between the discrete device 3 and the inner side wall of the chassis 1 can be realized through this metal frame.

[0053] When the discrete device 3 in the electrical equipment works, the heat generated on it can be conducted to the chassis 1 and then conducted to the radiator 2 through the chassis 1. In this way, the heat generated on the discrete device 3 can be dissipated through the chassis 1 and the radiator 2, the heat dissipation effect is improved, and further the working stability and service life of the electrical equipment are improved.

[0054] Moreover, because the area of the chassis 1 is large, the heat dissipation area of the radiator 2 set on it can also be increased correspondingly, further improving the heat dissipation effect, thereby improving the working stability and service life of the electrical equipment.

[0055] Moreover, since there is no need to encapsulate the discrete device 3 in a packaging box anymore, production steps are saved, production efficiency is improved, and production costs are reduced.

[0056] Moreover, each discrete device 3 occupies a relatively small space, making it easier to set its position within the chassis 1 and increasing the power density.

[0057] Among them, the chassis 1 can also protect the discrete device 3 mounted on its inner sidewall, thereby improving the working stability and service life of the discrete device.

[0058] In the embodiments of the present disclosure, the discrete device 3 can be any reasonable component. For example, it can be a semiconductor discrete device such as a diode, MOSFET (Metal Oxide Semiconductor Field Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), and so on.

[0059] The connection manner between the discrete device 3 and the chassis 1 can be any reasonable manner. For example, it can be connected by snap connection, welding connection, and so on.

[0060] The electrical device in the embodiments of the present disclosure can be any reasonable device. For example, it can be a household energy storage PCS (Power Conversion System) system, various electrical devices on electric vehicles, and so on.

[0061] In the embodiments of the present disclosure, the electrical device may further include a control circuit board located within the chassis 1 and connected to the chassis 1. The control circuit board is electrically connected to the discrete device 3, thereby connecting the discrete device 3 to the control circuit of the electrical device.

[0062] In a possible implementation, referring to Figure 4 , the electrical device may further include a weldable metal plate 4 and a solder layer 5.

[0063] The weldable metal plate 4 is located between the chassis 1 and the discrete device 3 and is connected to the inner sidewall of the chassis 1. In this way, for a chassis 1 made of a material that is difficult to weld or cannot be directly welded (for example, an aluminum alloy chassis 1 is difficult to directly weld), setting the weldable metal plate 4 between it and the discrete device 3 makes it easier to weld-connect the chassis 1 and the discrete device 3.

[0064] The solder layer 5 is located between the weldable metal plate 4 and the discrete device 3. The solder layer 5 is welded to the weldable metal plate 4 and is connected to the discrete device 3.

[0065] It can be understood that the solder layer 5 here is connected to the discrete device 3. It can be a direct connection between the solder layer 5 and the discrete device 3, or an indirect connection between the two through other components. The embodiments of the present disclosure do not limit this.

[0066] When installing the discrete device 3, solder can be placed on the weldable metal plate 4, and then other components or the discrete device 3 can be placed on the solder, and then welded, so that the solder melts and welds the weldable metal plate 4 to other components or the discrete device 3 together. The cooled solder forms the solder layer 5.

[0067] Through the above-mentioned weldable metal plate 4 and solder layer 5, the connection between the housing 1 and the discrete device 3 can be realized by welding.

[0068] In a possible implementation manner, the weldable metal plate 4 is a metal plate electroplated on the inner side wall of the housing 1. In this way, the weldable metal plate 4 can be simply and conveniently connected to the housing 1 by electroplating.

[0069] Of course, the weldable metal plate 4 can also be connected to the housing 1 by other means. For example, it can be connected by snap connection or other means. The embodiments of the present disclosure do not limit this.

[0070] Among them, the material of the weldable metal plate 4 can be any material that can achieve welding. For example, it can be nickel material or tin material, etc. The material of the solder layer 5 can be any reasonable solder. For example, it can be solder paste, etc.

[0071] In the embodiments of the present disclosure, the welding connection method can be reflow soldering or sintering method, etc. Of course, it can also be other reasonable welding methods. The embodiments of the present disclosure do not limit this.

[0072] In a possible implementation manner, the number of discrete devices 3 can be one or multiple, and the number of weldable metal plates 4 and the number of solder layers 5 are one (not shown in the figure).

[0073] That is, during production, a layer of weldable metal plate 4 can be electroplated at a preset position of the housing 1, and then a piece of solder is placed at the position where the discrete device 3 needs to be installed on the weldable metal plate 4, and then one or more discrete devices 3 are placed on the solder, and then heated and welded. The cooled solder forms the solder layer 5. The one or more discrete devices 3 are all connected to the housing 1 through a piece of solder layer 5 and a piece of weldable metal plate 4.

[0074] In another possible implementation manner, see Figure 4, the number of weldable metal plates 4, solder layers 5, and discrete devices 3 is the same, and the position of each weldable metal plate 4 corresponds to the position of a solder layer 5 and a discrete device 3 respectively.

[0075] In this way, on the one hand, after positioning the position where the discrete device 3 needs to be welded on the casing 1, the weldable metal plate 4 is electroplated at this position. Then, when using solder to weld the discrete device 3, rough positioning can be performed through the position of the weldable metal plate 4, and then the discrete device 3 can be welded to the weldable metal plate 4 more precisely, thereby improving the position accuracy of the discrete device 3 on the casing 1 and improving the production efficiency.

[0076] On the other hand, corresponding weldable metal plates 4 and solder layers 5 are set respectively for the discrete devices 3 to be installed, which greatly saves the usage amount of the materials of the weldable metal plates 4 and the solder layers 5, reduces the waste of resources, and reduces the production cost.

[0077] It can be understood that the orthographic projection of the metal frame of the discrete device 3 on the inner side wall of the casing 1 can be located in the orthographic projection of the weldable metal plate 4 on the inner side wall of the casing, and the difference in the areas of the two orthographic projections can be set according to requirements.

[0078] In the embodiment of the present disclosure, referring to Figure 5 , there is at least one positioning groove 11 on the inner side wall of the casing 1, and the positioning groove 11 is arranged along the edge of the weldable metal plate 4.

[0079] Among them, the positioning groove 11 can be formed by laser engraving or etching at a specific position after electroplating the weldable metal plate 4 on the casing 1, that is, after electroplating the weldable metal plate 4, for the discrete device 3 to be welded, the positioning groove 11 is laser engraved or etched along its edge.

[0080] In this way, when heating and welding the solder between the weldable metal plate 4 and the discrete device 3, the positioning groove 11 can effectively prevent the solder from flowing the discrete device 3 to a position with a large deviation, so that the discrete device 3 and the solder can be concentrated on the weldable metal plate 4, thereby improving the position accuracy of the discrete device 3 after welding. Of course, if the discrete device 3 is connected to the weldable metal plate 4 through other components, the positioning groove 11 improves the welding position accuracy of other components, and thus improves the position accuracy of the discrete device 3.

[0081] Among them, the positioning groove 11 can be a strip-shaped groove for arranging along the weldable metal plate 4. Of course, it can also be a groove of other shapes, and the embodiment of the present disclosure does not make specific limitations in this regard.

[0082] In a possible implementation, the shape of the positioning groove 11 can be set according to the shape of the weldable metal plate 4. For example, the positioning groove 11 can be rectangular, arc-shaped, etc. The positioning groove 11 can also be directly set as an annular groove and arranged around the edge of the weldable metal plate 4. Refer to Figure 5 , so that the positioning groove 11 can position the discrete device 3 to be welded on the weldable metal plate 4 in all directions, thereby further improving the position accuracy of the discrete device 3.

[0083] Regarding the number setting of the positioning grooves 11, one or more positioning grooves 11 can be respectively set for each weldable metal plate 4, and the setting can be made accordingly according to the shape of the positioning groove 11 and the requirements for positioning accuracy. The embodiments of the present disclosure do not limit this.

[0084] In the embodiments of the present disclosure, when the number of discrete devices 3 is multiple, the arrangement manner of the positioning grooves 11 on the chassis 1 can be set according to the specific component arrangement inside the electrical device and the connection requirements of the discrete devices 3. The embodiments of the present disclosure do not limit this.

[0085] When the distance between the discrete devices 3 is far, refer to Figure 5 , there can be a gap between adjacent positioning grooves 11. When the distance between the discrete devices 3 is close, refer to Figure 6 , adjacent positioning grooves 11 can be interconnected. The embodiments of the present disclosure do not limit the specific arrangement manner between multiple positioning grooves 11, and it can be set according to the actual position requirements of the discrete devices 3.

[0086] In the embodiments of the present disclosure, refer to Figure 7 , the electrical device can further include a heat conducting member 6. The heat conducting member 6 is located between the solder layer 5 and the discrete device 3 and is welded to the solder layer 5 and the metal frame of the discrete device 3. The heat conducting member 6 here is the above-mentioned other component, and the discrete device 3 realizes an indirect connection with the solder layer 5 through the heat conducting member 6.

[0087] During production, after placing the solder on the weldable metal plate 4, the heat conducting member 6 can be placed on the solder and heated for welding to form the solder layer 5. The solder layer 5 welds the heat conducting member 6 to the weldable metal plate 4, and then the discrete device 3 is connected to the surface of the heat conducting member 6 away from the solder layer 5, thereby realizing the installation of the discrete device 3.

[0088] In this way, the heat conducting member 6 can more efficiently conduct the heat generated when the discrete device 3 works to the chassis 1, and then to the radiator 2, thereby improving the heat dissipation effect of the discrete device 3 and further improving the working stability and service life of the electrical device.

[0089] In a possible implementation, refer to Figure 8 , the heat conducting member 6 includes a first metal layer 61, an insulating heat conducting layer 62, and a second metal layer 63 that are sequentially stacked and connected.

[0090] The first metal layer 61 is located on the side of the solder layer 5 away from the weldable metal plate 4 and is welded to the solder layer 5, that is, the surface of the first metal layer 61 close to the solder layer 5 is welded to the solder layer 5.

[0091] The second metal layer 63 is located between the first metal layer 61 and the discrete device 3 and is welded to the metal frame of the discrete device 3, that is, the surface of the second metal layer 63 close to the metal frame of the discrete device 3 is welded to the metal frame.

[0092] The insulating heat conducting layer 62 is located between the first metal layer 61 and the second metal layer 63, and both sides of the insulating heat conducting layer 62 are connected to the first metal layer 61 and the second metal layer 63 respectively.

[0093] In the embodiments of the present disclosure, the heat conducting member 6 may be a direct copper clad ceramic substrate, an active brazed ceramic substrate, an insulating metal substrate, etc., and the embodiments of the present disclosure do not make specific limitations thereon.

[0094] The surface of the first metal layer 61 close to the solder layer 5 has a first ventilation groove 611, and both ends of the first ventilation groove 611 are located on the side surface of the first metal layer 61, where the side surface of the first metal layer 61 refers to any surface perpendicular to the surface of the first metal layer 61 close to the solder layer 5.

[0095] When welding the weldable metal plate 4 and the metal frame of the heat conducting member 6, since both the weldable metal plate 4 and the first metal layer 61 have a certain area, when welding through solder, the gas released by the solder forms bubbles therein, and after cooling, a plurality of voids will be formed on the solder layer 5, thereby reducing the welding strength. Therefore, the first ventilation groove 611 provided in the embodiments of the present disclosure can enable the gas generated during welding to be released along the first ventilation groove 611, thereby reducing or even preventing the formation of voids on the solder layer 5, and further improving the welding strength, the working stability, and the service life of the electrical equipment.

[0096] In a possible implementation, the number of the first ventilation grooves 611 may be multiple, and the arrangement of these multiple first ventilation grooves 611 may be any reasonable shape, and the embodiments of the present disclosure do not make limitations thereon.

[0097] For example, multiple first ventilation grooves 611 are uniformly arranged in a first direction, refer to Figure 8 , where the first direction may be any direction parallel to the plane where the first metal layer 61 is located.

[0098] For another example, a plurality of first ventilation grooves 611 are arranged in a grid pattern. Refer to Figure 9 .

[0099] The groove area and number of the first ventilation grooves 611 can be set accordingly after comprehensively considering the requirements for heat conduction and welding strength. The embodiments of the present disclosure do not limit this.

[0100] In a possible implementation manner, refer to Figure 10 , the surface of the second metal layer 63 close to the metal frame has second ventilation grooves 631, and both ends of the second ventilation grooves 631 are located on the side surfaces of the second metal layer 63 respectively.

[0101] When welding the heat conducting member 6 and the metal frame of the discrete device 3, since both the heat conducting member 6 and the metal frame of the discrete device 3 have a certain area, when welding through solder, the gas released by the solder forms bubbles therein, and after cooling, a plurality of voids will be formed on other solder layers between the heat conducting member 6 and the discrete device 3, thereby reducing the welding strength. Therefore, the second ventilation grooves 631 provided in the embodiments of the present disclosure can enable the gas generated during welding to be released along the second ventilation grooves 631, thereby reducing or even preventing the formation of voids on other solder layers, and further improving the welding strength and the working stability and service life of the electrical equipment.

[0102] Similar to the arrangement of the plurality of first ventilation grooves 611, when the number of the second ventilation grooves 631 is multiple, their arrangement can be any reasonable shape, and the groove area and number of the second ventilation grooves 631 can be set accordingly after comprehensively considering the requirements for heat conduction and welding strength. The embodiments of the present disclosure do not limit this.

[0103] The embodiments of the present disclosure provide an electronic device, which directly connects the discrete device 3 to the housing 1 of the electrical equipment, and realizes the connection between the discrete device 3 and the radiator 2 through the housing 1. Since the area of the housing 1 is large, the heat dissipation area of the radiator 2 can be increased, and the housing 1 and the radiator 2 dissipate heat together, improving the heat dissipation effect and further improving the working stability and service life of the electrical equipment.

[0104] The embodiments of the present disclosure also provide a method for manufacturing an electrical equipment, which is applied to the above-mentioned electrical equipment. The method includes: electroplating a weldable metal plate 4 at a preset position on the inner side wall of the housing 1, placing solder on the weldable metal plate 4, placing the heat conducting member 6 on the solder, placing the discrete device 3 on the heat conducting member 6, heating and welding the solder, and after the solder cools, forming a solder layer 5 to weld and connect the weldable metal plate 4 and the heat conducting member 6.

[0105] Through the above preparation method of the electrical device, the discrete device 3 is directly mounted on the casing 1. When the electrical device is working, the heat generated on the discrete device 3 can be conducted to the radiator 2 through the heat conducting member 6 and the casing 1, thereby improving its heat dissipation effect and enhancing the working stability and service life of the electrical device.

[0106] The above are only optional embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. An electrical device, characterized in that, The electrical device includes a housing (1), a radiator (2), and at least one discrete device (3); The radiator (2) is connected to the outer side wall of the housing (1); The discrete device (3) is located inside the housing (1), and the metal frame of the discrete device (3) is connected to the inner side wall of the housing (1).

2. The electrical device according to claim 1, characterized in that, The radiator (2) includes a plurality of fins, and the plurality of fins are evenly arranged on the outer side wall of the housing (1).

3. The electrical device according to claim 1, characterized in that, The electrical device further includes a weldable metal plate (4) and a solder layer (5); The weldable metal plate (4) is located between the housing (1) and the discrete device (3), and is connected to the inner side wall of the housing (1); The solder layer (5) is located between the weldable metal plate (4) and the discrete device (3), the solder layer (5) is welded to the weldable metal plate (4), and is connected to the metal frame of the discrete device (3).

4. The electrical device according to claim 3, characterized in that, The number of the weldable metal plates (4), the solder layers (5), and the discrete devices (3) is the same, and the position of each weldable metal plate (4) corresponds to the position of a solder layer (5) and a discrete device (3) respectively.

5. The electrical device according to claim 3, characterized in that, The inner side wall of the housing (1) has at least one positioning groove (11), and the positioning groove (11) is arranged along the edge of the weldable metal plate (4).

6. The electrical device according to claim 5, characterized in that, The positioning groove (11) is an annular groove and is arranged around the edge of the weldable metal plate (4).

7. The electrical device according to claim 3, characterized in that, The weldable metal plate (4) is a metal plate electroplated on the inner side wall of the housing (1).

8. The electrical device according to claim 3, characterized in that The electrical device further includes a heat conducting member (6), the heat conducting member (6) is located between the solder layer (5) and the discrete device (3), and is welded to the solder layer (5) and the metal frame of the discrete device (3).

9. The electrical device according to claim 8, characterized in that, The heat conducting member (6) includes a first metal layer (61), an insulating heat conducting layer (62), and a second metal layer (63) that are sequentially stacked and connected; The first metal layer (61) is welded to the solder layer (5), and the surface of the first metal layer (61) close to the solder layer (5) has a first ventilation groove (611), and both ends of the first ventilation groove (611) are located on the side surface of the first metal layer (61); The second metal layer (63) is welded to the metal frame of the discrete device (3).

10. The electrical device according to claim 9, characterized in that, The number of the first ventilation grooves (611) is multiple, and the multiple first ventilation grooves (611) are arranged in a grid pattern.

11. The electrical device according to claim 9, characterized in that, The surface of the second metal layer (63) close to the metal frame has a second ventilation groove (631), and both ends of the second ventilation groove (631) are respectively located on the side surface of the second metal layer (63).

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