Heat dissipation device
By introducing capillary structures and aluminum mesh fins into the thermosiphon radiator, the problem of low efficiency in converting the evaporator liquid into steam is solved, and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202510349897.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2025-07-04
AI Technical Summary
After contacting the high-temperature chip, the evaporator cannot effectively convert the liquid into steam, resulting in poor heat transfer effect and low heat dissipation efficiency.
The capillary structure connection between the evaporator and the condenser is adopted, including the evaporation substrate, the evaporation cover plate, the support column and the condenser. The heat dissipation efficiency is improved through capillary action, and the heat transfer area is increased through the aluminum mesh and the heat dissipation fins.
It improves the heat transfer efficiency of the heat dissipation device, reduces thermal resistance, enhances the heat dissipation effect, and improves the overall heat dissipation performance.
Smart Images
Figure CN120264685A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat dissipation for electronic devices, and particularly to a heat dissipation device. Background Art
[0002] A thermosyphon radiator is a heat dissipation structure composed of an evaporator, a condenser, and external connecting fins, a corrugated tube, etc. Heat dissipation is achieved through the heat absorption and heat release of a phase change working fluid, combined with gas-liquid circulation.
[0003] In the process of implementing this application, the inventors found that there are at least the following technical problems in the prior art:
[0004] After the evaporator of the existing thermosyphon radiator contacts a chip with a relatively high temperature rise of the heat source, it cannot effectively convert the liquid into steam in a short time, resulting in poor overall heat transfer effect and low heat dissipation efficiency of the thermosyphon radiator. Summary of the Invention
[0005] In order to overcome the problems existing in the above prior art, the main purpose of this application is to provide a heat dissipation device that can improve the heat dissipation efficiency.
[0006] In order to achieve the above purpose, this application specifically adopts the following technical solutions:
[0007] A heat dissipation device, comprising:
[0008] An evaporator, the evaporator includes an evaporation substrate and an evaporation cover plate, the evaporation cover plate is connected to the evaporation substrate to enclose an evaporation chamber for accommodating a phase change working fluid, the evaporation chamber is used to communicate with a condensation chamber of a condenser through a connecting pipe, a first capillary structure is provided on a side of the evaporation cover plate facing the evaporation substrate, a second capillary structure is provided on a side of the evaporation substrate facing the evaporation cover plate, and the evaporation substrate is provided with a contact portion for contacting an external heat source;
[0009] A plurality of support columns, the plurality of support columns are respectively arranged in the evaporation chamber, two ends of each support column are respectively connected to the evaporation substrate and the evaporation cover plate, and a third capillary structure is provided on an outer surface of each support column, and the third capillary structure is respectively connected to the first capillary structure and the second capillary structure.
[0010] In some embodiments, the evaporator further includes a plurality of shovel teeth, the plurality of shovel teeth are respectively arranged in the evaporation chamber, and the plurality of shovel teeth are respectively spaced apart along the width direction of the evaporation substrate at the contact portion.
[0011] In some embodiments, a fourth capillary structure is respectively provided on an outer surface of each shovel tooth, and the fourth capillary structure is respectively connected to the first capillary structure and the second capillary structure.
[0012] In some embodiments, the evaporator further includes a fifth capillary structure located in the evaporation chamber. One end of the fifth capillary structure is connected to the contact portion, and the other end is connected to the evaporation cover plate. The fifth capillary structure is strip-shaped.
[0013] In some embodiments, the second capillary structure, the third capillary structure, the fourth capillary structure, and the fifth capillary structure are respectively made of metal powder material by sintering.
[0014] In some embodiments, the condenser includes a condensation substrate and a condensation cover plate. The condensation cover plate is connected to the condensation substrate to enclose the condensation chamber. The condensation cover plate is connected to the connecting pipe. A sixth capillary structure is provided on one side of the condensation substrate facing the condensation cover plate.
[0015] In some embodiments, the condenser further includes a plurality of heat dissipation protrusions respectively disposed in the condensation chamber. Both ends of each heat dissipation protrusion are respectively connected to the condensation substrate and the condensation cover plate. The sixth capillary structure is provided with a plurality of through holes, and each heat dissipation protrusion respectively passes through each through hole.
[0016] In some embodiments, the first capillary structure and the sixth capillary structure are respectively made of aluminum mesh by sintering.
[0017] In some embodiments, the connecting pipe includes a main body and a plurality of partition plates. One end of the main body is connected to the evaporation cover plate, and the other end is connected to the condensation cover plate. The main body is provided with a fluid channel communicating with the evaporation chamber and the condensation chamber. The plurality of partition plates are respectively disposed in the fluid channel to divide the fluid channel into a plurality of flow channels.
[0018] In some embodiments, the heat dissipation device further includes a plurality of fins respectively connected to the outer surface of the connecting pipe.
[0019] Compared with the prior art, the heat dissipation device provided by this application has at least the following beneficial effects:
[0020] On one side of the evaporation cover plate of the present application facing the evaporation substrate, a first capillary structure is provided. On one side of the evaporation substrate facing the evaporation cover plate, a second capillary structure is provided. The outer surface of each support column is provided with a third capillary structure, and the third capillary structure is respectively connected to the first capillary structure and the second capillary structure. The heat dissipation efficiency of the heat dissipation device is improved through the capillary action of the capillary structure. Moreover, by connecting the evaporation substrate, the second capillary structure, the third capillary structure, the support column, the first capillary structure, and the evaporation cover plate to form an integral structure, the thermal resistance of the heat dissipation device is effectively reduced, and the heat transfer efficiency of the heat dissipation device is further improved, thereby enhancing the heat dissipation effect of the heat dissipation device. Brief Description of the Drawings
[0021] Figure 1 is an exploded view of the heat dissipation device provided by an embodiment of the present application;
[0022] Figure 2 is an exploded view of the evaporator of the heat dissipation device provided by an embodiment of the present application;
[0023] Figure 3 is a schematic structural view of the evaporation substrate of the heat dissipation device provided by an embodiment of the present application;
[0024] Figure 4 is a partial top view of the evaporation substrate of the heat dissipation device provided by an embodiment of the present application;
[0025] Figure 5 is an exploded view of the condenser of the heat dissipation device provided by an embodiment of the present application;
[0026] Figure 6 is a top view of the connecting pipe of the heat dissipation device provided by an embodiment of the present application.
[0027] Reference Numerals:
[0028] 1, condenser; 11, condensation substrate; 110, sixth capillary structure; 110a, through hole; 12, condensation cover plate; 120, second gas-liquid hole; 13, condensation cavity; 14, heat dissipation protrusion;
[0029] 2, evaporator; 21, evaporation substrate; 210, contact part; 211, second capillary structure; 211a, second connection hole; 22, evaporation cover plate; 220, first capillary structure; 220a, first connection hole; 221, first gas-liquid hole; 23, evaporation cavity;
[0030] 3, support column; 31, third capillary structure;
[0031] 4, fin;
[0032] 5, shovel tooth; 51, fourth capillary structure;
[0033] 6, fifth capillary structure;
[0034] 7. Connecting pipe; 71. Body; 710. Fluid passage; 72. Partition plate; 73. Flow channel; 730. Protrusion. Detailed implementation manners
[0035] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0036] In the description of the present application, unless otherwise clearly defined and limited, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated, the term "plural" means two or more, and the term "multiple types" means two or more types; the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0037] In the description of this specification, it should be understood that the orientation terms such as "upper" and "lower" described in the embodiments of the present application are described from the angles shown in the drawings and should not be construed as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected "above" or "below" another element, it can not only be directly connected "above" or "below" another element, but also be indirectly connected "above" or "below" another element through an intermediate element.
[0038] Refer to Figure 1 and Figure 2 as shown in Figure 1 which is an exploded view of the heat dissipation device provided by the embodiment of the present application. Figure 2Explosion diagram of the evaporator of the heat dissipation device provided by the embodiment of the present application. This embodiment discloses a heat dissipation device, which can be a thermosyphon radiator. The heat dissipation device includes a condenser 1, an evaporator 2 and a plurality of support columns 3. The condenser 1 is provided with a condensation chamber 13. The evaporator 2 includes an evaporation substrate 21 and an evaporation cover plate 22. The evaporation cover plate 22 is connected to the evaporation substrate 21 to enclose an evaporation chamber 23 for accommodating a phase change working medium (the phase change working medium can be pure water or ethylene glycol, etc.). The evaporation chamber 23 is communicated with the condensation chamber 13 through a connecting pipe 7. A liquid injection port is provided on the evaporation substrate 21 or the evaporation cover plate 22, and the liquid injection port is used to connect with a liquid supply device to inject the phase change working medium into the evaporation chamber 23, and the amount of the injected phase change working medium can be adjusted according to needs. A first capillary structure 220 is provided on the side of the evaporation cover plate 22 facing the evaporation substrate 21. The first capillary structure 220 is in a layered shape, and the first capillary structure 220 is provided with a plurality of first connection holes 220a. A second capillary structure 211 is provided on the side of the evaporation substrate 21 facing the evaporation cover plate 22. The second capillary structure 211 is in a layered shape, and the second capillary structure 211 is provided with a plurality of second connection holes 211a. And the evaporation substrate 21 protrudes outward to form a contact portion 210 for contacting an external heat source (the heat source is, for example, a central processing unit of a main board or other chips, etc.). The plurality of support columns 3 are respectively arranged in the evaporation chamber 23. One end of each support column 3 passes through each first connection hole 220a and is connected to the evaporation cover plate 22, and the other end of each support column 3 passes through each second connection hole 211a and is connected to the evaporation substrate 21. The support columns 3 are used to increase the overall stability of the evaporator 2, thereby improving the service life of the heat dissipation device. A third capillary structure 31 is provided on the outer surface of each support column 3. The shape of the third capillary structure 31 corresponds to the shape of the support column 3, and the third capillary structure 31 is respectively connected to the first capillary structure 220 and the second capillary structure 211.
[0039] In this embodiment, the heat dissipation device further includes a plurality of fins 4. The plurality of fins 4 are respectively connected to the outer surface of the connecting pipe 7, and the heat dissipation surface area is increased through the plurality of fins 4 so as to effectively conduct heat to the surrounding environment, thereby improving the heat dissipation efficiency of the heat dissipation device.
[0040] During operation, the heat generated by the heat source is transmitted to the evaporation cover plate 22 through the evaporation substrate 21, the second capillary structure 211, the support column 3, the third capillary structure 31, and the first capillary structure 220. The phase change working medium in the evaporation chamber 23 is heated and undergoes a phase change, and its density becomes smaller and it rises. The heat is transmitted to the condensation chamber 13 through the connecting pipe 7. After condensing and releasing heat in the condensation chamber 13, it flows back to the evaporation chamber 23 along the connecting pipe 7, and circulates in this way, so as to achieve the purpose of dissipating heat from the heat source.
[0041] On one side of the evaporation cover plate 22 of this embodiment facing the evaporation substrate 21, a first capillary structure 220 is provided. On one side of the evaporation substrate 21 facing the evaporation cover plate 22, a second capillary structure 211 is provided. On the outer surface of each support column 3, a third capillary structure 31 is provided. The third capillary structure 31 is respectively connected to the first capillary structure 220 and the second capillary structure 211. Through the capillary action of the capillary structure, the heat dissipation efficiency of the heat dissipation device is improved. And by connecting the evaporation substrate 21, the second capillary structure 211, the third capillary structure 31, the support column 3, the first capillary structure 220 and the evaporation cover plate 22 to form an integral structure, the thermal resistance of the heat dissipation device is effectively reduced, and the heat transfer efficiency of the heat dissipation device is further improved, thereby enhancing the heat dissipation effect of the heat dissipation device.
[0042] Referring Figure 3 to Figure 4 and Figure 3 shown in Figure 4 FIG. 9 is a schematic structural view of the evaporation substrate of the heat dissipation device provided by the embodiment of the present application,
[0043] FIG. 10 is a partial top view of the evaporation substrate of the heat dissipation device provided by the embodiment of the present application. The evaporator 2 further includes a plurality of shovel teeth 5. The plurality of shovel teeth 5 are respectively arranged in the evaporation chamber 23, and the plurality of shovel teeth 5 are respectively distributed at intervals along the width direction of the evaporation substrate 21 on the contact portion 210. Each shovel tooth 5 extends along the length direction of the evaporation substrate 21. The plurality of shovel teeth 5 are used to increase the heat dissipation area and quickly conduct the heat of the contact portion 210, thereby improving the heat dissipation efficiency of the heat dissipation device for the heat source. On the outer surface of each shovel tooth 5, a fourth capillary structure 51 is respectively provided. The fourth capillary structure 51 is respectively connected to the first capillary structure 220 and the second capillary structure 211. Through the fourth capillary structure 51, the heat conduction efficiency is further improved, and the fourth capillary structure 51 forms an integral structure with the first capillary structure 220 and the second capillary structure 211, further improving the heat dissipation efficiency of the heat dissipation device.
[0044] It should be noted that the evaporation cover plate 22 and the evaporation substrate 21 may also be provided with shovel teeth 5 at places other than the contact portion 210, which is not limited herein. Figure 3 Continuing to refer Figure 4 to
[0045] In this embodiment, the outer surface of the fifth capillary structure 6 is provided with a protruding portion to increase the area of the fifth capillary structure 6, thereby further improving the overall heat dissipation efficiency of the heat dissipation device.
[0046] In this embodiment, the second capillary structure 211, the third capillary structure 31, the fourth capillary structure 51, and the fifth capillary structure 6 are respectively porous capillary structures made of metal powder material by sintering. The gaps between the metal powders form the pores of each capillary structure. The metal powder material made by sintering can improve the thermal conductivity, so that the second capillary structure 211, the third capillary structure 31, the fourth capillary structure 51, and the fifth capillary structure 6 can quickly conduct heat to the condensation cavity 13. And the metal powder in this embodiment is aluminum powder, which has good thermal conductivity to further improve the heat dissipation performance of the heat dissipation device and enhance the heat dissipation efficiency. In practical applications, the metal powder material can also be copper powder, iron powder, copper alloy powder, nickel alloy powder, etc., and the particle size of the powder is not limited.
[0047] Refer to Figure 5 as shown in Figure 5 is an exploded view of the condenser of the heat dissipation device provided by the embodiment of the present application. The condenser 1 includes a condensation substrate 11, a condensation cover plate 12, and a plurality of heat dissipation protrusions 14. The condensation cover plate 12 is connected to the condensation substrate 11 to enclose a condensation cavity 13. The condensation cover plate 12 is connected to the connecting pipe 7. The sixth capillary structure 110 is provided on the side of the condensation substrate 11 facing the condensation cover plate 12, and the sixth capillary structure 110 is layered. A plurality of heat dissipation protrusions 14 are respectively arranged in the condensation cavity 13, and both ends of each heat dissipation protrusion 14 are respectively connected to the condensation substrate 11 and the condensation cover plate 12. The heat dissipation protrusions 14 are used to increase the overall stability of the condenser 1, thereby improving the service life of the heat dissipation device. The sixth capillary structure 110 is provided with a plurality of through holes 110a, and each heat dissipation protrusion 14 respectively passes through each through hole 110a. The sixth capillary structure 110 promotes the condensation process and enhances the heat transfer effect, thereby further improving the overall heat dissipation efficiency of the heat dissipation device.
[0048] In this embodiment, the cross-section of the heat dissipation protrusion 14 is square to provide a large contact area, thereby ensuring the stability of the condenser 1. It can be understood that in other embodiments, the cross-section of the heat dissipation protrusion 14 can also be other shapes, such as circular or polygonal, etc.
[0049] In this embodiment, the first capillary structure 220 and the sixth capillary structure 110 are rectangular mesh capillary structures made of aluminum mesh by sintering. The first capillary structure 220 and the sixth capillary structure 110 made of aluminum mesh by sintering have a high porosity and a uniform pore structure, which can effectively control the distribution of air flow, strengthen mass transfer and heat transfer, thereby improving the heat dissipation efficiency. Moreover, the aluminum mesh has good thermal conductivity, enabling the first capillary structure 220 and the sixth capillary structure 110 to conduct heat quickly, thus further improving the heat dissipation efficiency of the heat dissipation device. In practical applications, the first capillary structure 220 and the sixth capillary structure 110 can also be made by sintering copper mesh, or sintering titanium alloy mesh, etc.
[0050] In one embodiment, a seventh capillary structure is provided on the outer surface of the heat dissipation protrusion 14, and an eighth capillary structure is provided on the side of the condensation cover plate 12 facing the condensation substrate 11. The seventh capillary structure is respectively connected to the sixth capillary structure 110 and the eighth capillary structure. By connecting the condensation cover plate 12, the eighth capillary structure, the heat dissipation protrusion 14, the seventh capillary structure, the sixth capillary structure 110 and the condensation substrate 11 to form an integral structure, the thermal resistance of the heat dissipation device is further effectively reduced, thereby further improving the heat transfer efficiency of the heat dissipation device, and further enhancing the heat dissipation effect of the heat dissipation device.
[0051] Refer to Figure 1 and Figure 6 as shown in Figure 6 is a top view of the connecting pipe of the heat dissipation device provided by the embodiment of the present application. The evaporation cover plate 22 is provided with a first gas-liquid hole 221 communicating with the evaporation chamber 23. The condensation cover plate 12 is provided with a second gas-liquid hole 120 communicating with the condensation chamber 13. The connecting pipe 7 is a mouth organ pipe. The connecting pipe 7 includes a main body 71 and a plurality of partition plates 72. One end of the main body 71 is connected to the first gas-liquid hole 221, the other end of the main body 71 is connected to the second gas-liquid hole 120. The main body 71 is provided with a fluid passage 710 communicating with the first gas-liquid hole 221 and the second gas-liquid hole 120. The plurality of partition plates 72 are respectively arranged in the fluid passage 710 to divide the fluid passage 710 into a plurality of flow channels 73, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the heat dissipation device.
[0052] In this embodiment, the inner surfaces of the respective flow channels 73 are respectively provided with protrusions 730 to increase the heat exchange area of the connecting pipe 7, thereby quickly dissipating heat and enhancing the heat dissipation effect of the heat dissipation device.
[0053] In this embodiment, the connection between the body 71 and the evaporation cover plate 22, between the body 71 and the condensation cover plate 12, between the evaporation cover plate 22 and the evaporation substrate 21, and between the condensation cover plate 12 and the condensation substrate 11 are respectively connected by welding to ensure the connection tightness and the structural strength of the connection, reduce the leakage of the phase change working fluid from the connection points, and ensure the normal operation of the heat dissipation device.
[0054] It should be noted that the number of the connecting pipes 7 can be set as required and is not limited herein, and the numbers of the first gas-liquid holes 221 and the second gas-liquid holes 120 are correspondingly set according to the number of the connecting pipes 7.
[0055] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed by the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A heat dissipation device, characterized in that, Comprising: An evaporator, the evaporator includes an evaporation substrate and an evaporation cover plate, the evaporation cover plate is connected to the evaporation substrate to enclose an evaporation chamber for accommodating a phase change working medium, the evaporation chamber is used to communicate with a condensation chamber of a condenser through a connecting pipe, a first capillary structure is provided on a side of the evaporation cover plate facing the evaporation substrate, a second capillary structure is provided on a side of the evaporation substrate facing the evaporation cover plate, and the evaporation substrate is provided with a contact portion for contacting an external heat source; A plurality of support columns, the plurality of support columns are respectively arranged in the evaporation chamber, both ends of each support column are respectively connected to the evaporation substrate and the evaporation cover plate, and a third capillary structure is provided on an outer surface of each support column, and the third capillary structure is respectively connected to the first capillary structure and the second capillary structure.
2. The heat dissipation device according to claim 1, wherein, The evaporator further includes a plurality of shovel teeth, the plurality of shovel teeth are respectively arranged in the evaporation chamber, and the plurality of shovel teeth are respectively spaced apart along the width direction of the evaporation substrate on the contact portion.
3. The heat dissipation device according to claim 2, wherein, A fourth capillary structure is respectively provided on an outer surface of each shovel tooth, and the fourth capillary structure is respectively connected to the first capillary structure and the second capillary structure.
4. The heat dissipation device according to claim 3, characterized in that, The evaporator further includes a fifth capillary structure, the fifth capillary structure is located in the evaporation chamber, and one end of the fifth capillary structure is connected to the contact portion, and the other end of the fifth capillary structure is connected to the evaporation cover plate, and the fifth capillary structure is in a strip shape.
5. The heat dissipation device according to claim 4, wherein The second capillary structure, the third capillary structure, the fourth capillary structure and the fifth capillary structure are respectively made of a metal powder material by a sintering method.
6. The heat dissipation device according to claim 1, wherein The condenser includes a condensation substrate and a condensation cover plate, the condensation cover plate is connected to the condensation substrate to enclose the condensation chamber, the condensation cover plate is connected to the connecting pipe, and a sixth capillary structure is provided on a side of the condensation substrate facing the condensation cover plate.
7. The heat dissipation device according to claim 6, wherein, The condenser further includes a plurality of heat dissipation protrusions, the plurality of heat dissipation protrusions are respectively arranged in the condensation chamber, and both ends of each heat dissipation protrusion are respectively connected to the condensation substrate and the condensation cover plate, and the sixth capillary structure is provided with a plurality of through holes, and each heat dissipation protrusion respectively passes through each through hole.
8. The heat dissipation device according to claim 6, wherein, The first capillary structure and the sixth capillary structure are respectively made of an aluminum mesh by a sintering method.
9. The heat dissipation device according to claim 6, wherein The connecting pipe includes a body and a plurality of partition plates, one end of the body is connected to the evaporation cover plate, the other end of the body is connected to the condensation cover plate, the body is provided with a fluid passage communicating with the evaporation chamber and the condensation chamber, and the plurality of partition plates are respectively arranged in the fluid passage to divide the fluid passage into a plurality of flow channels.
10. The heat dissipation device according to any one of claims 1 to 9, characterized in that, The heat dissipation device further includes a plurality of fins, and the plurality of fins are respectively connected to an outer surface of the connecting pipe.