A chip mounter

Abstract

The application discloses a high-precision high-speed chip mounter, and belongs to the field of electronic equipment manufacturing. The high-precision high-speed chip mounter is composed of a rack, automatic feeding, discharging, substrate conveying, glue dispensing and glue dipping integrated modules, and is provided with a visual module. A linear module is driven by a linear motor, and is high in response speed and accurate in positioning. High-speed production is realized through double-carrier-table alternation and multi-suction-nozzle parallelism. The mounting precision is guaranteed through closed-loop detection of the visual module. Glue dispensing and glue dipping are integrated, and diversified glue feeding requirements are met. Meanwhile, at least six kinds of wafer feeding are supported, and parameters are automatically identified and adjusted. The chip mounter can realize substrate feeding, glue dispensing and glue dipping, chip taking, correction and mounting full-process automation, greatly improves production efficiency and mounting precision, and effectively solves the problems of low efficiency, poor precision and insufficient compatibility of traditional chip mounters.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic equipment manufacturing, in particular to a chip mounter. BACKGROUND

[0002] In the process of electronic equipment manufacturing, the chip mounter plays a key role in accurately installing electronic components onto the substrate. With the increasing integration and diversification of chips, the traditional chip mounter has become increasingly inadequate in terms of efficiency, precision, and compatibility.

[0003] For example, the semiconductor chip die bonding and mounting device disclosed in Chinese Patent No. CN117133683A can only complete the pick-and-place operation of a single chip at a time during the chip mounting process. When faced with multi-chip mounting tasks, it needs to frequently go back and forth to take materials, resulting in a significant increase in operation time. When replacing different types of chips, manual calibration of the suction nozzle and parameters is required, which not only prolongs the downtime of the device, but also introduces errors due to human factors. In addition, the device lacks real-time detection mechanisms and closed-loop correction functions, and as the multi-chip mounting process progresses, cumulative errors can easily exceed the allowed range. At the same time, the dispensing and dipping functions are separated, requiring the replacement of modules or programs, which is time-consuming and labor-intensive. In actual production processes, it cannot flexibly respond to diversified process requirements, severely restricting the improvement of production efficiency and product quality.

[0004] Therefore, developing a new type of chip mounter with high precision, high speed mounting capability, and the ability to meet various process requirements is not only the key to solving the current pain points of the electronic manufacturing industry, but also has extremely important practical significance for promoting the upgrading and development of the entire industry. SUMMARY

[0005] The present application overcomes the shortcomings of the above-mentioned technology and adopts the following technical solutions:

[0006] A chip mounter comprises:

[0007] A rack 1 serves as the support structure of the entire chip mounter and provides a mounting base for other modules;

[0008] An automatic feeding module 2 and an automatic unloading module 3 are arranged on both sides of the rack 1, the automatic feeding module 2 is used to push out unprocessed substrates, and the automatic unloading module 3 is used to receive substrates that have completed chip mounting;

[0009] A substrate conveying module 4 is connected between the automatic feeding module 2 and the automatic unloading module 3, comprising a first carrier table 41 and a second carrier table 42 arranged side by side, the first carrier table 41 is used to receive the substrates pushed out by the automatic feeding module 2, and the second carrier table 42 is used to receive the substrates sent out by the first carrier table 41 and transfer them;

[0010] The dispensing-glue-dipping integrated module 5 comprises a first longitudinal driving mechanism 51, a dispensing mechanism 52, a glue-dipping mechanism 53, a glue supply mechanism 54 and a second longitudinal driving mechanism 55, which are installed on the rack 1; the dispensing mechanism 52 and the glue-dipping mechanism 53 are connected to and driven by the first longitudinal driving mechanism 51; the glue supply mechanism 54 is connected to and driven by the second longitudinal driving mechanism 55, and is used for supplying glue to the dispensing mechanism 52 and the glue-dipping mechanism 53;

[0011] The wafer loading module 6 is arranged on the rack 1 and comprises a wafer jig 61 used for carrying a wafer;

[0012] The chip taking module 7 is used for taking out a chip from the wafer jig 61;

[0013] The correction station module 8 receives the chip taken out by the chip taking module 7 and corrects the posture of the chip;

[0014] The die bonder module 9 is arranged adjacent to the automatic unloading module 3 and is used for mounting the corrected chip on a substrate of the second carrier 42;

[0015] The vision module 10 comprises:

[0016] The first camera group 101 is arranged along a substrate and chip conveying path and is used for substrate positioning, chip posture detection and mounting result verification;

[0017] The second camera group 102 is arranged beside the tool head of the dispensing-glue-dipping integrated module 5, the chip taking module 7 and the die bonder module 9 and is used for dynamically detecting the working precision of the tool head and feeding back a correction.

[0018] Preferably, the first longitudinal driving mechanism 51 comprises a first Y-axis linear module 511 installed on the rack 1, a first movable seat 512 and a second movable seat 513 driven by the first Y-axis linear module 511; the dispensing mechanism 52 is installed on the first movable seat 512 and is provided with a dispensing head 521 capable of fine adjustment; the glue-dipping mechanism 53 is installed on the second movable seat 513 and is provided with a glue-dipping head 531 capable of fine adjustment; the second longitudinal driving mechanism 55 comprises a second Y-axis linear module 551 arranged in parallel with the first Y-axis linear module 511, and a third movable seat 552 driven by the second Y-axis linear module 551; and the glue supply mechanism 54 is fixed on the third movable seat 552;

[0019] The dispensing head 521 and the glue-dipping head 531 move synchronously through the first Y-axis linear module 511, and can simultaneously perform dispensing and glue-dipping on different regions of a single substrate, such as dispensing on the left side of the substrate and glue-dipping on the right side of the substrate, or sequentially switching processes without waiting.

[0020] Preferably, the substrate conveying module 4 further comprises a first X-axis linear module 43 mounted on the frame 1 and driving the first carrier table 41 and the second carrier table 42 to move along the X-axis direction, a fourth movable seat 44 and a fifth movable seat 45 driven by the first X-axis linear module 43; the first carrier table 41 is arranged on the fourth movable seat 44 and is provided with a first conveying device 411 for conveying the substrate on which the dispensing process or the dipping process is completed by the dispensing mechanism 52 or the dipping mechanism 53 to the second carrier table 42; the second carrier table 42 is arranged on the fifth movable seat 45 and is provided with a second conveying device 421 for conveying the substrate on which the chip mounting is completed to the automatic unloading module 3;

[0021] The first carrier table 41 receives the substrate from the feeding module, and after the dispensing / dipping process is completed, the substrate is moved to the second carrier table 42 through the first conveying device 411; the second carrier table 42 synchronously performs the chip mounting, forming a parallel process of “dispensing / mixing - mounting”. When the first carrier table processes the dispensing of the substrate A, the second carrier table processes the mounting of the substrate B, but a single carrier table only processes one substrate at a time, and the overall efficiency is improved by the alternation of the double carrier tables.

[0022] Preferably, the wafer feeding module 6 comprises a lifting mechanism 60 mounted on the frame 1 and used for lifting the wafer, a second X-axis linear module 62 mounted on the frame 1, and a sixth movable seat 63 driven by the second X-axis linear module 62; the sixth movable seat 63 is drivingly connected with a seventh movable seat 65 through a third Y-axis linear module 64; the wafer jig 61 is arranged on the seventh movable seat 65;

[0023] The wafer jig 61 can carry at least six different types of wafers, and the target wafer is switched by the second X-axis and third Y-axis linear modules; the vision system automatically identifies the wafer type and matches the corresponding suction nozzle parameters such as suction force and material taking height, realizing multi-chip mixed production, such as mounting chips from three types of wafers on the same substrate.

[0024] Preferably, the chip taking module 7 comprises a fourth Y-axis linear module 71 arranged above the first X-axis linear module 43, and an eighth movable seat 72 driven by the fourth Y-axis linear module 71; the eighth movable seat 72 is provided with a suction mechanism 73 for sucking the chip; the suction mechanism 73 is provided with at least two first suction nozzles 731 which can be finely adjusted;

[0025] The suction mechanism 73 is provided with at least two first suction nozzles 731 which can be independently finely adjusted, such as double suction nozzles and four suction nozzles, and can simultaneously suck multiple chips of the same type or different types from the wafer jig 61. The distance between the suction nozzles can be dynamically adjusted to adapt to any layout of the chips on the substrate, such as array type and dispersed type.

[0026] Preferably, the correction station module 8 comprises a third X-axis linear module 81, a first fine adjustment platform 82, and a second fine adjustment platform 83 installed below the fourth Y-axis linear module 71; the third X-axis linear module 81 is drivingly connected with a ninth movable seat 812 and a tenth movable seat 813; the first fine adjustment platform 82 is installed on the ninth movable seat 812 and is internally provided with a θ-axis rotating mechanism 82a and an X / Y-axis adjustment mechanism 82b for adjusting the angle and position of the chip; the second fine adjustment platform 83 is installed on the tenth movable seat 813 and is internally provided with a θ-axis rotating mechanism 83a and an X / Y-axis adjustment mechanism 83b, and alternately receives the chips of the chip picking module 7 with the first fine adjustment platform 82;

[0027] The first fine adjustment platform 82 and the second fine adjustment platform 83 alternately receive the plurality of chips of the chip picking module 7 through the third X-axis linear module 81; each platform is internally provided with a θ-axis rotating mechanism and an X / Y-axis adjustment mechanism, which can independently calibrate the angle of the chip ±0.01° and the position ±1μm, and realize the "picking - correction - mounting" pipeline operation. When the platform 1 is corrected, the platform 2 synchronously receives the new chip.

[0028] Preferably, the bonding head mounting module 9 comprises an eleventh movable seat 91 driven by the fourth Y-axis linear module 71 and a bonding head mechanism 92 installed on the eleventh movable seat 91; the bonding head mechanism 92 is provided with at least two groups of independently controlled second suction nozzles 921 for mounting the calibrated chips on the glued substrate; the bonding head mechanism 92 is provided with at least two groups of independently controlled second suction nozzles 921, which support the synchronous mounting of a plurality of corrected chips to different target positions of a single substrate; and simultaneously share the fourth Y-axis linear module 71, so that the picking and mounting paths are highly coincident, and the empty moving time is reduced.

[0029] Preferably, the bonding head mounting module 9 is further provided with a fifth Y-axis linear module 11 for driving the camera of the visual module 10 and a twelfth movable seat 111 driven by the fifth Y-axis linear module 11.

[0030] Preferably, the first camera group 101 comprises:

[0031] A first visual camera 101a arranged above the first object table 41 for detecting the initial position of the unglued substrate;

[0032] A second visual camera 101b arranged above the correction station module 8 for simultaneously detecting the offset X / Y / θ of a plurality of uncorrected chips and generating independent calibration parameters;

[0033] A third visual camera 101c arranged beside the bonding head mechanism 92 for verifying the posture of the corrected chip;

[0034] The fourth visual camera 101d is arranged on the twelfth movable seat 111 and is used for detecting the completed substrate.

[0035] Preferably, the second camera group 102 comprises:

[0036] The fifth visual camera 102a is arranged beside the glue dispensing mechanism 52 and is used for monitoring the position deviation of the glue dispensing in real time and triggering the dynamic path correction.

[0037] The sixth visual camera 102b is arranged beside the glue dipping mechanism 53 and is used for detecting the contact angle and the uniformity of the glue layer in real time and correcting in time.

[0038] The seventh visual camera 102c is arranged beside the adsorption mechanism 73 and is used for monitoring the posture of the multi-nozzle of the adsorption mechanism 73 in real time, so as to ensure that the horizontal error of each chip during adsorption is less than 0.1°.

[0039] The eighth visual camera 102d is arranged beside the bonding head mechanism 92 and is used for dynamically detecting the position of the multi-nozzle of the bonding head mechanism 92, automatically compensating the position deviation of each nozzle before mounting, such as the nozzle 1 offset + 2μm, the nozzle 2 offset - 1μm, and independently correcting the system.

[0040] The linear motor is used for driving each linear module, such as the X-axis and Y-axis linear modules, so as to provide power support for the multi-station collaborative work, with the characteristics of high-speed response, maximum moving speed ≥1000mm / s, high-precision positioning ±1μm and no mechanical wear.

[0041] Compared with the prior art, the present application has the following advantages:

[0042] 1. High-precision mounting: through the collaborative work of each module, the real-time detection and feedback correction function of the visual module, such as the fine adjustment design of the glue dispensing head and the glue dipping head, the chip posture correction and the mounting result verification, etc., each link from adsorption, correction to mounting of the chip is detected by the visual camera, such as the plane deviation X / Y displacement and θ rotation, and is fed back to the corresponding module in real time, such as the adjustment angle of the correction platform and the correction of the nozzle position of the bonding head, to form a closed loop of “detection - adjustment - verification”, so as to eliminate the cumulative error during the mounting of multiple chips. The high-precision mounting of the chip can be ensured.

[0043] 2. High-speed production: through the simultaneous taking of multiple nozzles ≥2, the alternative work of double correction platforms, and the synchronous mounting of multiple nozzles, the “taking - correcting - mounting” pipeline processing of multiple chips on a single substrate is realized. For example, two chips are taken by double nozzles at the same time, the correction station is corrected by two platforms at the same time, and the double nozzles of the bonding head are mounted at the same time. Compared with the serial processing of single nozzle, the production efficiency is obviously improved. The double material tables are alternately used for gluing and mounting, substrate A is glued, and substrate B is mounted at the same time, so as to further reduce the idle time of the equipment.

[0044] 3, Integrated function: The dispensing head and the dipping head are integrated in the same driving mechanism, and the seamless switching and synchronous operation of the two processes are realized through the intelligent control system. For example, in the production process of a certain packaged device, the packaged device needs to be dipped with a certain type of chip to enhance heat dissipation and fixation, and another type of chip needs to be dispensed to realize precise connection. The patch machine can complete the two processes at the same time without stopping or manual intervention, significantly improving the processing efficiency of complex substrates and meeting the diversified gluing needs of high-density packaging. At the same time, relying on the second longitudinal driving mechanism to accurately drive the glue supply mechanism, the dynamic optimization of the glue supply path and the precise control of the glue quality are realized. The glue supply mechanism, dispensing head and dipping head are synchronized through the linear module. When the tool head moves at high speed along the Y axis, the glue supply mechanism follows synchronously, shortening the glue delivery distance to the shortest, avoiding the problems of glue stagnation and pressure fluctuation caused by long path in traditional fixed pipeline, and ensuring the glue point position accuracy and glue layer uniformity.

[0045] 4, Polysilicon compatibility and automatic calibration: The patch machine rack integrates 6 groups of wafer jigs, and through the high-precision motion control of the second X-axis linear module and the third Y-axis linear module, the rapid switching and accurate positioning of different types of wafers are realized. The chip picking module can quickly align the target chip by precisely controlling the wafer height with the lifting mechanism, avoiding the time-consuming mechanical calibration of traditional equipment. The vision module scans the wafer in real time, automatically identifies chip size, pin layout and other parameters, dynamically adjusts the suction force parameters of the suction mechanism, and synchronously matches the angle adjustment parameters of the correction station and the mounting pressure of the bonding head. The whole process does not require manual intervention, and the equipment can quickly complete wafer switching and enter production state. At the same time, it supports the same column or the same row of different wafers to be loaded at the same time, significantly improving the flexibility of multi-variety small-batch production, and providing an efficient and compatible production solution for complex scenarios such as semiconductor packaging.

[0046] 5, Fully automatic feeding and double carrier table flow operation: The automatic feeding module continuously pushes the substrate to the first carrier table, the first carrier table automatically moves to the second carrier table after completing the gluing, and the mounted substrate is collected by the automatic unloading module. The whole process is free of manual intervention, realizing the continuous operation of "feeding - processing - unloading". BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 is a schematic diagram of the overall structure of the present application;

[0048] Figure 2 is a top plan view of the present application;

[0049] Figure 3 is a schematic diagram of the substrate conveying module of the present application

[0050] Figure 4 is a schematic diagram of the dispensing and dipping integrated module of the present application;

[0051] Fig. 5 is a schematic diagram of the wafer loading module of the present application;

[0052] Fig. 6 is a schematic diagram of the substrate conveying module and the die bonding head patch module of the present application;

[0053] Fig. 7 is a schematic diagram of the correction station module of the present application; DETAILED DESCRIPTION

[0054] (I) Substrate loading

[0055] The automatic loading module 2 pushes the unprocessed substrate to the first stage 41, and the first X-axis linear module 43 drives the first stage 41 to move to the visual inspection station; the first visual camera 101a detects the initial position of the unglued substrate, providing a positioning reference for the subsequent dispensing and bonding processes.

[0056] (II) Dispensing and dipping

[0057] The first longitudinal driving mechanism 51 drives the dispensing mechanism 52 and the dipping mechanism 53 to move, and according to the position of the substrate and the processing requirements, the appropriate dispensing or dipping method is selected for the gluing process of the substrate, such as the dispensing head 521 dispensing glue on the substrate area A, and the dipping head 531 dipping glue on the area B. The dispensing head 521 and the dipping head 531 move synchronously along the Y-axis through the first Y-axis linear module 511, the dispensing head sprays glue dots with a diameter of ±5μm at an interval of 0.1mm, and the dipping head contacts the substrate at an angle of 30° to dip the glue. The fifth visual camera 102a and the sixth visual camera 102b monitor the dispensing and dipping positions in real time, and if there is a deviation, the control system drives the first Y-axis linear module 511 to adjust the position. The glue supply mechanism 55 stabilizes the glue supply through the second Y-axis linear module 551 to ensure the gluing quality.

[0058] (III) Chip picking

[0059] The fourth Y-axis linear module 71 of the chip picking module 7 drives the eighth movable seat 72 to move, so that the first suction nozzle 731 of the suction mechanism 73 picks up the chip from the wafer fixture 61, and the seventh visual camera 102c detects the chip picking posture in real time.

[0060] (IV) Chip correction

[0061] The chip picking module 7 sends the picked chip to the correction station module 8, and the first fine adjustment platform 82 and the second fine adjustment platform 83 alternately receive the chip. The built-in θ-axis rotation mechanism and X / Y-axis adjustment mechanism adjust the angle and position of the chip, and the second visual camera 101b detects the offset of the uncorrected chip to provide data support for correction.

[0062] (V) Chip bonding

[0063] The bonding head mechanism 92 of the bonding head patch module 9 adsorbs the corrected chip through the second suction nozzle 921, and under the driving of the fourth Y-axis linear module 71, the chip is attached to the substrate on the second object table 42 which has been glued. The third visual camera 101c verifies the posture of the corrected chip, and the eighth visual camera 102d detects the chip adsorbed by the bonding head mechanism 92 in real time.

[0064] (Six) Substrate blanking

[0065] The second conveying device 421 of the second object table 42 conveys the substrate on which the chip attachment is completed to the automatic blanking module 3, the first X-axis linear module 43 drives the second object table 42 to quickly reset, and prepares to process the next substrate; the fourth visual camera 101d detects the substrate on which the attachment is completed, and verifies the attachment result.

[0066] The above only describes the preferred embodiments of the present application and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A chip mounter characterized by comprising: The utility model relates to a kind of chip mounting machine, including: Rack (1); Automatic feeding module (2) and automatic unloading module (3) are arranged on both sides of rack (1), the automatic feeding module (2) is used to push out unprocessed substrate, the automatic unloading module (3) is used to receive the substrate that chip mounting is completed; Substrate conveying module (4) is bridged between automatic feeding module (2) and automatic unloading module (3), including first load table (41) and second load table (42) arranged side by side, the first load table (41) is used to receive the substrate that automatic feeding module (2) pushes out;The second load table (42) is used to receive the substrate that first load table (41) sends out and transshipment; Dispensing and glue dipping integrated module (5) includes first longitudinal driving mechanism (51) installed on rack (1), dispensing mechanism (52), glue dipping mechanism (53), glue supply mechanism (54) and second longitudinal driving mechanism (55);The dispensing mechanism (52) and glue dipping mechanism (53) are connected to first longitudinal driving mechanism (51) and are driven thereby; The glue supply mechanism (54) is connected to second longitudinal driving mechanism (55) and is driven thereby, for dispensing mechanism (52), glue dipping mechanism (53) glue supply; Wafer feeding module (6) is arranged on rack (1), including wafer fixture (61) for carrying wafer; Chip taking module (7) is used to take out chip from wafer fixture (61); Correction station module (8) receives the chip that chip taking module (7) takes out and corrects chip posture; Bonding head patching module (9) is arranged adjacent to automatic unloading module (3), for mounting corrected chip to the substrate of second load table (42); Visual module (10) includes: First camera group (101) is arranged along substrate and chip conveying path, for substrate positioning, chip posture detection and mounting result verification; Second camera group (102) is arranged beside tool head of dispensing and glue dipping integrated module (5), chip taking module (7) and bonding head patching module (9), for dynamically detecting tool head working precision and feeding back rectification; The substrate conveying module (4) further includes first X-axis linear module (43) installed on rack (1) and driving first load table (41) and second load table (42) to move along X-axis direction, fourth movable seat (44) and fifth movable seat (45) driven by first X-axis linear module (43);The first load table (41) is arranged on the fourth movable seat (44), and is provided with first conveying device (411) for conveying the substrate that glue processing is completed by dispensing mechanism (52) or glue dipping mechanism (53) to second load table (42);The second load table (42) is arranged on the fifth movable seat (45), and is provided with second conveying device (421) for conveying the substrate that chip mounting is completed to automatic unloading module (3); The first longitudinal driving mechanism (51) comprises a first Y-axis linear module (511) mounted on the rack (1), a first movable seat (512) and a second movable seat (513) driven by the first Y-axis linear module (511); the glue dispensing mechanism (52) is mounted on the first movable seat (512) and is provided with a glue dispensing head (521) capable of fine adjustment; the glue dipping mechanism (53) is mounted on the second movable seat (513) and is provided with a glue dipping head (531) capable of fine adjustment; the second longitudinal driving mechanism (55) comprises a second Y-axis linear module (551) arranged in parallel with the first Y-axis linear module (511), a third movable seat (552) driven by the second Y-axis linear module (551); the glue supply mechanism (54) is fixed on the third movable seat (552); The chip taking module (7) comprises a fourth Y-axis linear module (71) arranged above the first X-axis linear module (43), an eighth movable seat (72) driven by the fourth Y-axis linear module (71); the eighth movable seat (72) is provided with an adsorption mechanism (73) for adsorbing chips; the adsorption mechanism (73) is provided with at least two first suction nozzles (731) capable of fine adjustment; The bonding head patch module (9) comprises an eleventh movable seat (91) driven by the fourth Y-axis linear module (71) and a bonding head mechanism (92) mounted on the eleventh movable seat (91); the bonding head mechanism (92) is provided with at least two groups of independently controlled second suction nozzles (921) for mounting calibrated chips on the glued substrate.

2. A chip mounter according to claim 1, wherein The wafer loading module (6) comprises a lifting mechanism (60) mounted on the rack (1) and used for lifting the wafer, a second X-axis linear module (62) mounted on the rack (1), a sixth movable seat (63) driven by the second X-axis linear module (62); the sixth movable seat (63) is drivingly connected with a seventh movable seat (65) through a third Y-axis linear module (64); the wafer jig (61) is arranged on the seventh movable seat (65).

3. The chip mounter according to Claim 1, wherein The correction station module (8) comprises a third X-axis linear module (81) mounted below the fourth Y-axis linear module (71), a first fine adjustment platform (82) and a second fine adjustment platform (83); the third X-axis linear module (81) is drivingly connected with a ninth movable seat (812) and a tenth movable seat (813); the first fine adjustment platform (82) is mounted on the ninth movable seat (812) and is provided with a built-in θ-axis rotating mechanism (82a) and an X / Y-axis adjusting mechanism (82b) for adjusting the angle and position of the chip; the second fine adjustment platform (83) is mounted on the tenth movable seat (813) and is provided with a built-in θ-axis rotating mechanism (83a) and an X / Y-axis adjusting mechanism (83b), and alternately receives the chip taken by the chip taking module (7) with the first fine adjustment platform (82).

4. The chip mounter according to Claim 1, wherein The bonding head patch module (9) is further provided with a fifth Y-axis linear module (11) for driving the camera of the vision module (10) and a twelfth movable seat (111) driven by the fifth Y-axis linear module (11).

5. A chip mounter according to claim 4, wherein The first camera group (101) comprises: a first vision camera (101a) arranged above the first object table (41) and used for detecting the initial position of the un-glued substrate; a second vision camera (101b) arranged above the correction station module (8) and used for detecting the offset of the un-corrected chip; a third vision camera (101c) arranged beside the bonding head mechanism (92) and used for verifying the posture of the corrected chip; a fourth vision camera (101d) arranged on the twelfth movable seat (111) and used for detecting the completed substrate.

6. The chip mounter according to Claim 1, wherein The second camera group (102) comprises: a fifth vision camera (102a) arranged beside the glue dispensing mechanism (52) and used for monitoring the deviation of the glue dispensing position in real time and triggering the dynamic path correction; a sixth vision camera (102b) arranged beside the glue dipping mechanism (53) and used for detecting the contact angle of the glue dipping and the uniformity of the glue layer in real time and correcting in time; a seventh vision camera (102c) arranged beside the adsorption mechanism (73) and used for detecting the posture of the chip adsorbed in real time; an eighth vision camera (102d) arranged beside the bonding head mechanism (92) and used for detecting the chip adsorbed by the bonding head mechanism (92) in real time.

Images