Display substrate, display substrate preparation method and display panel

Abstract

The embodiment of the invention provides a display substrate, a display substrate preparation method and a display panel, and is applied to the technical field of electroluminescence. The display substrate comprises an under-screen camera shooting area, the under-screen camera shooting area comprises a plurality of metal isolation columns, a hole transport layer, a light-emitting layer, an electron transport layer and an isolation layer, and the metal isolation columns, the hole transport layer, the light-emitting layer, the electron transport layer and the isolation layer are sequentially arranged on the substrate; wherein the isolation layer can restrain the growth of the cathode material, and the under-screen camera shooting area does not comprise the cathode layer. In the under-screen camera shooting area of the display substrate, the isolation layer is arranged on one side, far away from the substrate, of the electron transmission layer, and the material of the isolation layer can inhibit the generation of the cathode material, so that the display substrate in the under-screen camera shooting area does not comprise the cathode layer; and the phenomenon that the cathode layer and the metal isolation column are overlapped to form electrochemical reaction to corrode the material of the display substrate to generate black spots is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electroluminescence, and particularly to a display substrate, a method for preparing a display substrate, and a display panel. Background Art

[0002] Today, with smart devices deeply integrated into daily life, the user interface with the digital world is undergoing a revolutionary evolution. The breakthrough of flexible OLED (Organic Light-Emitting Diode) technology enables folding-screen mobile phones to achieve a book-like opening and closing experience. The under-screen camera technology promotes the development of full-screen displays towards "true full-screen", and the arc designs of curved screens and waterfall screens create a visual spectacle of seamless extension between smart watches and mobile phone frames.

[0003] In one example, Figure 1 is a plan view of a display device, which includes a first non-display area 101, a display area 102, and a second non-display area 103. Among them, the first non-display area is the border of the display device, and the second non-display area is usually the under-screen camera area of the display device. Among them, the OLED structure in the second non-display area is the same as that in the display area, and the power-off of the non-display area is achieved only by laying a metal isolation structure for blocking OLED materials on the second non-display area.

[0004] However, in practical applications, the metal isolation structure in the second non-display area will undergo an electrochemical reaction with the cathode layer in the OLED, thereby corroding the internal structure of the display device, causing black spots 104 as shown in Figure 1 and affecting the display effect. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a display substrate, a method for preparing a display substrate, and a display panel to solve the technical problem of black spots appearing in the display device. The specific technical solutions are as follows:

[0006] In the first aspect of the embodiments of the present application, a display substrate is provided. The display substrate includes an under-screen camera area, and the under-screen camera area includes a plurality of metal isolation columns, a hole transport layer, a light-emitting layer, an electron transport layer, and an isolation layer.

[0007] The hole transport layer is located on the side of the metal isolation column away from the substrate;

[0008] The light-emitting layer is located on the side of the hole transport layer away from the substrate;

[0009] The electron transport layer is located on the side of the light-emitting layer away from the substrate;

[0010] The isolation layer is located on the side of the electron transport layer away from the substrate; wherein, the isolation layer can inhibit the growth of the cathode material, and the cathode layer is not included in the under-screen camera area.

[0011] In a possible implementation manner,

[0012] The isolation layer is prepared from an organic non-conductive material.

[0013] In a possible implementation manner,

[0014] The isolation layer includes a first slit structure, and the ash of the OLED organic functional layer is filled in the first slit structure;

[0015] In the hole transport layer, the light-emitting layer, and the electron transport layer, the ash of the OLED organic functional layer is filled in the area where the positive projection on the substrate of the first slit structure overlaps, wherein the OLED organic functional layer at least includes a cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer.

[0016] In a possible implementation manner,

[0017] The isolation layer includes a first slit structure,

[0018] The hole transport layer includes a second slit structure; the light-emitting layer includes a third slit structure; the electron transport layer includes a fourth slit structure;

[0019] The second slit structure, the third slit structure, and the fourth slit structure form a through structure with the first slit structure and overlap with the positive projection area of the first slit structure on the substrate, wherein the through structure is filled with the material of the barrier layer.

[0020] In a possible implementation manner,

[0021] The distance between every two adjacent metal isolation posts is greater than or equal to 10 micrometers, and the width of each metal isolation post is greater than or equal to 5 micrometers.

[0022] In a possible implementation manner, the under-screen camera area further includes a dam structure, the display substrate further includes a display area, and the metal isolation posts include metal inner isolation posts and metal outer isolation posts,

[0023] The metal inner isolation posts are located on the side of the dam structure close to the display area;

[0024] The metal outer isolation posts are located on the side of the dam structure away from the display area.

[0025] In a possible implementation manner,

[0026] There is at least 1 metal inner isolation column; there are at least 5 metal outer isolation columns.

[0027] In a second aspect of the embodiments of the present application, a method for preparing a display substrate is provided. The method includes:

[0028] Obtain a pre-prepared first substrate to be prepared. Among them, the first substrate to be prepared includes an under-screen camera area, and the under-screen camera area includes a plurality of metal isolation columns;

[0029] Evaporate the first substrate to be prepared successively through the evaporation sources corresponding to the hole transport layer, the light-emitting layer, and the electron transport layer to obtain a second substrate to be prepared;

[0030] Evaporate an isolation layer on the under-screen camera area of the second substrate to be prepared to obtain a third substrate to be prepared; among them, the isolation layer can inhibit the growth of the cathode material;

[0031] Pass the third substrate to be prepared through the evaporation source corresponding to the cathode layer and continue with the subsequent preparation process to obtain a first display substrate, where the under-screen camera area in the first display substrate does not include the cathode layer.

[0032] In a possible implementation manner, the evaporating the isolation layer on the under-screen camera area of the second substrate to be prepared to obtain a third substrate to be prepared includes:

[0033] Cover a metal mask on the second substrate to be prepared, and evaporate the second substrate to be prepared through the evaporation source corresponding to the isolation layer to obtain a third substrate to be prepared. Among them, the metal mask includes an opening area, and the opening area corresponds to the under-screen camera area of the display substrate.

[0034] In a possible implementation manner, the evaporating the third substrate to be prepared through the evaporation source corresponding to the cathode layer and continuing with the subsequent preparation process to obtain a first display substrate includes:

[0035] Remove the metal mask from the third substrate to be prepared, and then evaporate through the evaporation source corresponding to the cathode layer to obtain a fourth substrate to be prepared; among them, the metal mask includes a support bar, and in the area corresponding to the support bar, the under-screen camera area does not include the isolation layer;

[0036] Perform a subsequent packaging preparation process on the fourth substrate to be prepared to obtain a fifth substrate to be prepared;

[0037] For the area corresponding to the support bar, burn the OLED organic functional layer of the fifth substrate to be prepared into ash by laser to obtain the first display substrate, where the OLED organic functional layer at least includes the cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer.

[0038] In a possible implementation manner, continuing the subsequent preparation process for the third substrate to be prepared through the evaporation source corresponding to the cathode layer to obtain the first display substrate includes:

[0039] Removing the metal mask from the third substrate to be prepared, and then performing evaporation through the evaporation source corresponding to the cathode layer to obtain a fourth substrate to be prepared; wherein, the metal mask includes support bars, and within the regions corresponding to the support bars, the under-screen camera region does not include the isolation layer;

[0040] Preparing a barrier layer on the fourth substrate to be prepared to obtain a sixth substrate to be prepared;

[0041] For the regions corresponding to the support bars, etching the barrier layer and the OLED organic functional layer on the sixth substrate to be prepared to obtain a seventh substrate to be prepared; wherein, the OLED organic functional layer at least includes a cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer;

[0042] Performing a subsequent preparation process on the seventh substrate to be prepared to obtain the first display substrate.

[0043] In the third aspect of the embodiments of the present application, a display panel is provided, and the display panel includes the display substrate according to any one of the first aspects of the embodiments of the present application.

[0044] Advantages of the embodiments of the present application:

[0045] A display substrate, a display substrate preparation method, and a display panel provided by the embodiments of the present application. Since an isolation layer is provided on the side of the electron transport layer away from the substrate within the under-screen camera region of the display substrate, and the material of the isolation layer can inhibit the generation of the cathode material, the display substrate within the range of the under-screen camera region does not include the cathode layer, avoiding the formation of an electrochemical reaction between the cathode layer and the metal isolation posts to corrode the material of the display substrate and generate black spots.

[0046] Of course, it is not necessary for any product or method implementing the present application to simultaneously achieve all the above-mentioned advantages. Description of the Drawings

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application, and those of ordinary skill in the art can also obtain other embodiments based on these drawings.

[0048] Figure 1 It is a schematic plan view of a display device in the prior art;

[0049] Figure 2 It is a schematic structural diagram of a display device in the prior art;

[0050] Figure 3 It is a schematic structural diagram provided by an embodiment of the present application for magnifying the structure at 211;

[0051] Figure 4 It is a schematic structural diagram of a display substrate provided by an embodiment of the present application;

[0052] Figure 5 It is another schematic structural diagram of a display substrate provided by an embodiment of the present application;

[0053] Figure 6 It is a schematic plan view of a display substrate provided by an embodiment of the present application;

[0054] Figure 7 It is a schematic plan view of a metal mask provided by an embodiment of the present application;

[0055] Figure 8 It is a schematic plan view of the deposition of an isolation layer provided by an embodiment of the present application;

[0056] Figure 9 It is a schematic structural diagram of a display substrate within the corresponding area of a support bar provided by an embodiment of the present application;

[0057] Figure 10 It is another schematic structural diagram of a display substrate under the corresponding area of a support bar provided by an embodiment of the present application;

[0058] Figure 11 It is a schematic flow diagram of a method for manufacturing a display substrate provided by an embodiment of the present application;

[0059] Figure 12 It is a schematic diagram during the evaporation process of manufacturing a display substrate provided by an embodiment of the present application;

[0060] Figure 13 It is a schematic diagram for evaporating a camera-under-display area provided by an embodiment of the present application;

[0061] Figure 14 It is a schematic diagram for manufacturing a display substrate within the corresponding area of a support bar provided by an embodiment of the present application;

[0062] Figure 15 It is another schematic diagram for manufacturing a display substrate within the corresponding area of a support bar provided by an embodiment of the present application. Detailed implementation manners

[0063] The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art based on the present application belong to the scope of protection of the present application.

[0064] Today, with intelligent devices deeply integrated into daily life, the interaction interface between users and the digital world is undergoing a revolutionary evolution. The breakthrough of flexible OLED (Organic Light-Emitting Diode) technology enables folding-screen mobile phones to achieve a book-like opening and closing experience. The under-screen camera technology promotes the development of full-screen towards "true full-screen", and the arc designs of curved screens and waterfall screens create a visual wonder of unbounded extension between smart watches and mobile phone frames.

[0065] In one example, Figure 1 is a plan view of a display device, which includes a first non-display area 101, a display area 102, and a second non-display area 103. Among them, the first non-display area is the border of the display device, and the second non-display area is usually the under-screen camera area of the display device. Among them, the OLED structure in the second non-display area is the same as that in the display area. Only by laying a metal isolation structure for blocking OLED materials on the second non-display area can the power-off of the non-display area be achieved.

[0066] However, in actual applications, the metal isolation structure in the second non-display area will undergo an electrochemical reaction with the cathode layer in the OLED, thereby corroding the internal structure of the display device, causing the display device to have black spots 104 as shown in Figure 1 and affecting the display effect.

[0067] For Figure 1 the AA' area of the display substrate shown in, a cross-section is obtained to get the structural schematic diagram of the under-screen camera area shown in Figure 2 As shown in Figure 2As shown in the figure, the display substrate includes a metal plate 201, a flexible layer PI (Polyimide) 202, and a TFT inorganic layer 203. An I-shaped metal isolation column 210 is laid on the TFT inorganic layer, and a combined structure 204 including an organic film layer and a cathode layer of an OLED is laid on the metal isolation column. On the side of the cathode layer away from the metal plate, an EN encapsulation structure 205, a TSP (Touch Screen Panel) 206, a TOC (Touch Over Coating) 207, a POL (Polarizer) 208, and a CG&OCA (Cover Glass & Optical Clear Adhesive) 209 are laid in sequence.

[0068] Figure 3 For Figure 2 a schematic structural diagram for magnifying the structure at 211 at the edge of the metal isolation column in Figure 3 as shown in the figure, there are voids in the metal isolation column. In a high-temperature and high-humidity environment, the cathode layer of the OLED will reach the voids and lap with the side wall of the metal isolation column, such as at positions A and B. When the cathode layer laps with the side wall of the metal isolation column, an external electric field will be formed with the cathode layer of the OLED as the cathode (such as the EL (Electroluminescent) VSS (voltage) being -4.6V) and the metal isolation column in the under-screen camera area (Floating (pin floating) or "ELVSS + IR metal isolation column") as the anode, resulting in a violent electrochemical reaction. Among them, the following hydrogen evolution reaction will occur at the cathode end:

[0069] 2H + + 2e - → H2↑;

[0070]

[0071] Due to the hydrogen evolution reaction at the cathode end, holes will be formed in the OLED, increasing the transmission channels and speed of water and oxygen, and accelerating the corrosion of the internal structure of the display substrate.

[0072] And at the end of the metal isolation column, the following oxidation reaction will occur:

[0073] 2A g - 2e - → 2A g + ↑;

[0074]

[0075] In addition, K + also participates in the reaction to consume OH - , thereby enabling the above-mentioned anode and cathode ion reactions to proceed continuously, accelerating the corrosion of the internal structure of the display substrate, causing corrosion of the encapsulation structure EN and the inorganic layer of the thin film transistor, and generating GDSH (Growing Dark Spot, black spot):

[0076] Si3N4 + 6OH - + 3H2O = 3SiO3 2- + 4NH3↑.

[0077] To solve at least one of the above problems, in the first aspect of the embodiments of the present application, a display substrate is provided. The display substrate includes an under-screen camera area, as Figure 4 shown. The under-screen camera area includes a plurality of metal isolation pillars 210, a hole transport layer 402, a light-emitting layer 403, an electron transport layer 404, and an isolation layer 405,

[0078] The hole transport layer is located on the side of the metal isolation pillar away from the substrate 406;

[0079] The light-emitting layer is located on the side of the hole transport layer away from the substrate;

[0080] The electron transport layer is located on the side of the light-emitting layer away from the substrate;

[0081] The isolation layer is located on the side of the electron transport layer away from the substrate; wherein, the isolation layer can inhibit the growth of the cathode material, and the under-screen camera area does not include a cathode layer.

[0082] When preparing the under-screen camera area of the display substrate, it is necessary to first prepare metal isolation pillars on the substrate 406; then deposit each organic film layer of the OLED on the substrate with isolation pillars, so that within the range of the under-screen camera area, the metal isolation pillars can disconnect each organic film layer of the OLED, realizing the disconnection of the circuit. Among them, the under-screen camera area of the display substrate can no longer be laid with a backplane circuit, while the display area no longer has metal isolation pillars, and a thin film transistor is laid in the display area, thereby ensuring the normal display of the display area. In practical applications, after preparing the metal isolation pillars for the under-screen camera area, the under-screen camera area and the display area of the display substrate can be prepared using the same preparation process.

[0083] Among them, the metal isolation pillar can be designed as an I-shaped structure, that is, a structure with protrusions on the top and bottom and a concave in the middle, which can also be called an undercut structure, as Figure 4The shape of the metal isolation column shown in [the figure] enables the subsequent prepared organic film layers of the OLED to be disconnected at the side steps of the metal isolation column. Moreover, the side of the metal isolation column has a void structure, which can also cause the organic film layers of the OLED to be disconnected at the void structure, thereby preventing water and oxygen from entering the internal structure of the display area.

[0084] In the embodiments of the present application, the organic film layers of the OLED at least include all or part of a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer. In one example, the organic film layers of the OLED disposed on the metal isolation column in the under-screen camera area include a hole transport layer, a light-emitting layer, and an electron transport layer, as Figure 4 shown in 402, 403, and 404 in [the figure], and the isolation layer 405 is on the side of the electron transport layer away from the substrate. Among them, the light-emitting layer can be a three-color light-emitting layer of R / G / B (Red / Green / Blue) or a W (White) light-emitting layer.

[0085] In another example, the organic film layers of the OLED disposed on the metal isolation column in the under-screen camera area include a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer. Then, the hole injection layer is on the side of the metal isolation column away from the substrate, the hole transport layer is on the side of the hole injection layer away from the substrate, the electron blocking layer is on the side of the hole transport layer away from the substrate, the light-emitting layer is on the side of the electron blocking layer away from the substrate, the hole blocking layer is on the side of the light-emitting layer away from the substrate, the electron transport layer is on the side of the hole blocking layer away from the substrate, the electron injection layer is on the side of the electron transport layer away from the substrate, and the isolation layer is on the side of the electron injection layer away from the substrate.

[0086] In practical applications, the material of the isolation layer has atomic repulsion with the cathode material. Therefore, the material of the isolation layer can inhibit the growth of the cathode material, so that within the range of the under-screen camera area, the display substrate does not include a cathode layer.

[0087] Applying the display substrate of the embodiments of the present application, since an isolation layer is provided on the side of the electron transport layer away from the substrate within the under-screen camera area of the display substrate, and the material of the isolation layer can inhibit the generation of the cathode material, the display substrate within the range of the under-screen camera area does not include a cathode layer, avoiding the formation of an electrochemical reaction between the cathode layer and the metal isolation column to corrode the material of the display substrate to generate black spots.

[0088] In a possible implementation, the isolation layer is prepared from an organic non-conductive material. In practical applications, the cathode layer is usually prepared from materials such as Mg (magnesium) and Ag (silver). Then, the isolation layer is prepared from an organic non-conductive material that has atomic repulsion with the Mg / Ag material. For example, it is prepared from CPM / L (cathod pattern material / layer). In the area where the CPM / L material is formed, the corresponding area cannot "grow" Mg / Ag, thus inhibiting the growth of the cathode material into a film.

[0089] Applying the display substrate of the embodiment of the present application, since an isolation layer is provided in the under-screen camera area of the display substrate, and the material of the isolation layer can inhibit the generation of the cathode material, the display substrate within the range of the under-screen camera area does not include a cathode layer, avoiding the formation of an electrochemical reaction between the cathode layer and the metal isolation column to corrode the material of the display substrate and generate black spots.

[0090] In a possible implementation, the under-screen camera area of the display substrate includes a plurality of metal isolation columns, and the distance between every two adjacent metal isolation columns is greater than or equal to 10 micrometers, and the width of each metal isolation column is greater than or equal to 5 micrometers.

[0091] In practical applications, the metal isolation columns can be arranged around the shape of the under-screen camera area. In one example, if the under-screen camera area is a circular hole, the metal isolation columns can be arranged around the circular hole to form a ring. In order to enable the organic film layer of the OLED to be disconnected at the stepped surface of the metal isolation column, a certain distance needs to be maintained between every two adjacent metal isolation columns. In one example, this distance is greater than or equal to 10 micrometers, and the width of each metal isolation column is greater than or equal to 5 micrometers, so that the organic film layer can be disconnected at multiple places, ensuring the power-off of the corresponding area of the under-screen camera area and also facilitating preventing water and oxygen from entering the internal structure of the display substrate along the organic functional film layer.

[0092] Applying the display substrate of the embodiment of the present application, setting the distance between every two adjacent metal isolation columns to be greater than or equal to 10 micrometers and the width of each metal isolation column to be greater than or equal to 5 micrometers can ensure that the organic film layer of the OLED is disconnected at multiple places within the corresponding area of the under-screen camera area, thus ensuring the power-off of the corresponding area of the under-screen camera area and also facilitating preventing water and oxygen from entering the internal structure of the display substrate along the organic film layer.

[0093] In a possible implementation, the under-screen camera area further includes a dam structure, the display substrate further includes a display area, and the metal isolation columns include metal inner isolation columns and metal outer isolation columns.

[0094] The metal inner isolation columns are located on the side of the dam structure close to the display area.

[0095] The metal outer isolation column is located on the side of the dam structure away from the display area.

[0096] As Figure 5 shown, within the display substrate corresponding to the under-screen camera area, there is also a dam structure 501, which is configured to prevent the overflow of the inkjet printing (IJP) material 502 for forming the organic encapsulation border, so as to ensure the effectiveness of the thin film encapsulation, and thus ensure the product reliability. Metal isolation columns are distributed on both sides of the dam structure. The metal isolation column on the side of the dam structure close to the display area is called the metal inner isolation column 503, and the metal isolation column on the side of the dam structure close to the display area, that is, the side close to the under-screen camera area, is called the metal outer isolation column 504. Among them, the metal inner isolation column is arranged between the organic layer in the display area and the dam structure. As Figure 5 shown, the metal inner isolation column is arranged between the planarization layer (PLN) 508 and the edge of the pixel definition layer (PDL) 509 in the display area and the dam structure.

[0097] In practical applications, as Figure 5 shown, the complete display substrate further includes a U-film layer (adhesive layer) 505. The TFT inorganic layer may include a structural layer 506 composed of a barrier layer, a buffer layer, a gate insulator (GI), and a gate layer. The structural layer 507 is composed of a passivation layer (PVX) and an inter-layer dielectric (ILD). Among them, the dam structure may include a PLN layer, a pixel definition layer (Pixel Definition Layer, PDL), and a photo spacer (PS) layer. In practical applications, an anode layer is also laid on the PLN. On the side of the TOC away from the substrate and on the side of the POL close to the substrate, there is also an organic water absorption layer 510. Among them, the material of the organic water absorption layer may be the inkjet printing material IJP.

[0098] As Figure 6 shown is a plan view corresponding to the under-screen camera area of the display substrate. Among them, the under-screen camera area 601 is a round hole design. The metal inner isolation column 503 and the metal outer isolation column 504 are arranged around the round hole. Between the metal inner isolation column and the metal outer isolation column, a dam structure 501 is arranged to block the organic materials in the display area. And because an isolation layer capable of inhibiting the growth of the cathode material is laid on the metal isolation column, the cathode layer 602 can be blocked by the isolation layer outside the under-screen camera area, thereby avoiding the electro-chemical reaction between the cathode material and the metal isolation column.

[0099] By using the display substrate of the embodiment of the present application, a dam structure is provided within the camera area under the screen, which can prevent the organic material within the display area from overflowing, thereby ensuring the effectiveness of the thin film encapsulation and the reliability of the display substrate.

[0100] In a possible implementation, in order to ensure that the organic film layer of the camera area under the screen is disconnected, multiple metal spacers need to be provided, but since the distance between the dam and the organic layer of the display area is small, the number of metal inner spacers can be less than or equal to the number of metal outer spacers. In one example, there is no less than 1 metal inner spacer in the camera area under the screen; and no less than 5 metal outer spacers.

[0101] By using the display substrate of the embodiment of the present application, by providing at least one metal inner isolation column and at least five metal outer isolation columns, it is possible to ensure that a large number of metal isolation columns are laid within a limited spacing range, thereby ensuring that the organic film layer of the OLED is disconnected at multiple locations, thereby ensuring power failure in the area corresponding to the camera area under the screen, and also preventing water and oxygen from entering the internal structure of the display substrate along the organic film layer.

[0102] In a possible implementation, the metal isolation column includes at least one stacked structure, each of the stacked structures includes a first metal layer, a second metal layer, and a third metal layer.

[0103] The second metal layer is located on a side of the first metal layer away from the substrate; wherein the material of the second metal layer is aluminum;

[0104] The third metal layer is located on a side of the second metal layer away from the substrate, wherein the materials of the first metal layer and the third metal layer are titanium.

[0105] In practical applications, the metal isolation column can be a SD (Source / Drain) metal isolation column, or other isolation columns used to isolate the OLED organic film layer, which is not limited in the embodiments of the present application. For example, the metal isolation column is an I-shaped structure, and the width of the first metal layer and the third metal layer is greater than the width of the second metal layer.

[0106] In one example, the metal isolation column is a SD (Ti / Al / Ti, titanium / aluminum / titanium) isolation column structure, wherein a Ti / Al / Ti structure is a stacking structure, and the metal isolation column may be composed of a stacking structure or a plurality of stacking structures stacked in sequence.

[0107] Applying the display substrate of the embodiments of the present application, by arranging a plurality of metal isolation columns in the under-screen camera area, the organic film layer of the OLED can be disconnected, thereby ensuring power-off of the corresponding area in the under-screen camera area and also facilitating preventing water and oxygen from entering the internal structure of the display substrate along the organic film layer.

[0108] In a possible implementation manner, the under-screen camera area of the display substrate further includes other functions. For example, the under-screen camera area further includes a flexible layer, an inorganic layer, and a packaging layer.

[0109] The inorganic layer is located on the side of the flexible layer away from the substrate, and the inorganic layer is located on the side of the metal isolation column close to the substrate.

[0110] The packaging layer is located on the side of the isolation layer away from the substrate.

[0111] In practical applications, the display substrate may further include other hierarchical structures as shown in Figure 2 or Figure 5 shown. However, in the display substrate of the embodiments of the present application, within the range of the under-screen camera area, the display substrate includes an isolation layer capable of suppressing cathode growth and does not include a cathode layer. In one example, the substrate of the display substrate is attached with a metal plate. In practical applications, the bottom of the display substrate may also be attached with PET (Polyethylene terephthalate). In practical applications, a POL (Polarizer), a CG (Cover Glass), and an OCA (Optical Clear Adhesive) are also arranged on the upper part of the display substrate of the embodiments of the present application. The flexible layer, that is, a PI film (Polyimide), is located on the substrate to provide flexible support for the display substrate.

[0112] At one end of the flexible layer away from the substrate, an inorganic layer of a thin-film transistor is laid within the range of the under-screen camera area, and thin-film transistors are laid within the display area. As shown in Figure 5 shown, the hierarchical structure 511 includes an organic film layer and an isolation layer 405. Among them, the organic film layer includes at least the organic film layer as shown in Figure 4 shown. In Figure 5It is not shown in the figure. On the side of the isolation layer away from the substrate, there is a packaging structure EN, that is, the packaging layer of the embodiment of the present application. The packaging structure may include an inorganic barrier layer formed by CVD (Chemical Vapor Deposition) and an organic water-absorbing layer (such as an inkjet printing material IJP). The inorganic barrier layer and the organic water-absorbing layer can be arranged in multiple layers to prevent water vapor from entering the display module and also prevent impurities from diffusing between the transparent substrate and the display module. Among them, the inorganic barrier layer can be silicon oxide, silicon nitride, silicon oxynitride or a stacked structure thereof. Between the packaging structure EN and the polarizer POL, a TSP (Touch Screen Panel) and a TOC (Touch Over Coating) are also arranged in the under-screen camera area to ensure that the display substrate can achieve a touch function.

[0113] By applying the display panel of the embodiment of the present application, by setting the packaging layer, the packaging layer can absorb water vapor in the air, thereby preventing water vapor from entering the display module and also preventing impurities from diffusing between the transparent substrate and the display module.

[0114] In a possible implementation manner, when preparing the isolation layer, it is necessary to ensure that the under-screen camera area includes the isolation layer while the display area does not include the isolation layer. Therefore, a metal mask can be used for preparing the isolation layer. In one example, the metal mask has a solid area and an opening area. The solid area covers the substrate within the display area, and the opening area corresponds to the part within the non-display area where the isolation layer needs to be prepared. This part can be the entire under-screen camera area or the metal isolation pillars in the under-screen camera area. Among them, the opening area should at least correspond to the metal isolation pillars in the under-screen camera area to ensure that the isolation layer can be prepared on the metal isolation pillars.

[0115] In actual application, the metal mask needs to be fixed on the display substrate by the support of support bars, and these support bars are usually solid. Therefore, within the area corresponding to the support bars, the cathode layer is still included in the under-screen camera area of the display substrate, and this cathode layer needs to be removed in the subsequent preparation process. As Figure 7 is a schematic structural diagram of a metal mask provided by the embodiment of the present application. The metal mask includes two cross-shaped support bars 701. Then, when using this metal mask for evaporating the isolation layer, within the area corresponding to the cross-shaped support bars, the isolation layer will not be evaporated, and the evaporated isolation layer will have an area such as Figure 8 shown as area 802. Then, the cathode will still grow and form a film in this area, while in area 801 not blocked by the support bars, due to the presence of the isolation layer, the growth of the cathode layer will not occur.

[0116] In view of this situation, in a possible implementation manner, the isolation layer of the display substrate in the embodiments of the present application includes a first slit structure, which is generated because the isolation layer cannot be vapor-deposited in the corresponding area of the support bar.

[0117] The shape and number of the first slit structure can be determined according to the support bar of the metal mask plate. For example, Figure 8 The first slit structure shown is in a "cross" shape according to the number and shape of the metal bars. In practical applications, the number and shape of the support bars can be various. For example, the number of support bars can be 3, 6, or 9, etc., and the support bars can be in different shapes such as straight, wavy, or circular. In the embodiments of the present application, no specific limitation is made.

[0118] The isolation layer includes a first slit structure, and the first slit structure is filled with the ash of the OLED organic functional layer;

[0119] In the hole transport layer, the light-emitting layer, and the electron transport layer, the ash of the OLED organic functional layer is filled in the area where the positive projection on the substrate of the first slit structure overlaps. Among them, the OLED organic functional layer at least includes a cathode layer, a hole transport layer, a light-emitting layer, and an electron transport layer.

[0120] Among them, the ash of the OLED organic functional layer can be the non-combustible residue generated by burning the OLED organic functional layer with a laser. In practical applications, the OLED functional layer in the under-screen camera area corresponding to the support bar can be burned with a laser to make it physically ineffective and become discontinuous ash, and it no longer has functions such as conductivity and light emission. When the laser burns the OLED organic functional layer, at least the cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer of the OLED are burned to ensure that the cathode layer is not included in the area corresponding to the support bar either. As Figure 9 shown, in the first slit structure corresponding to the support bar, the OLED organic functional layer on the side of the metal isolation column away from the substrate is all in the ash structure 901 and no longer has functions such as conductivity and light emission.

[0121] Applying the display substrate of the embodiments of the present application, in the area where the positive projection of the first slit structure of the display substrate on the substrate overlaps, the OLED organic functional layer is filled with ash that has lost its physical properties, so as to ensure that in the under-screen camera area of the display substrate, the cathode layer of the OLED does not exist in the area corresponding to the support bar, ensuring that the under-screen camera area of the display substrate does not include the cathode layer, and avoiding the generation of black spots due to the electrochemical reaction between the cathode layer and the metal isolation column corroding the internal structure of the display substrate.

[0122] In a possible implementation manner, the isolation layer includes a first slit structure,

[0123] The hole transport layer includes a second slit structure; the light-emitting layer includes a third slit structure; the electron transport layer includes a fourth slit structure;

[0124] The second slit structure, the third slit structure, and the fourth slit structure form a through structure with the first slit structure, and overlap with the orthographic projection area of the first slit structure on the substrate, wherein the through structure is filled with the material of the barrier layer.

[0125] Similar to the above embodiment, after the first slit structure is generated on the isolation layer due to the support bar structure, the OLED organic functional layer can be removed by methods such as hollowing out the OLED organic functional layer or etching. Then, in the area overlapping with the orthographic projection of the first slit structure on the substrate, slit structures also exist in each organic functional layer. As Figure 10 shown, after directly removing the OLED organic functional layer, there is no longer an OLED organic functional layer under the corresponding area of the support bar, thus forming a through structure, and this through structure will be filled with the materials of subsequent organic layers due to subsequent preparation processes, such as filled with the materials of the barrier layer and / or the encapsulation layer. In one example, as Figure 10 shown in the upper structure of the metal isolation column corresponding to the under-screen camera area, after the preparation of the barrier layer 1005 is completed after the preparation of the OLED organic functional layer, then after removing the OLED organic functional layer in the corresponding area of the support bar, the first slit structure 1001, the second slit structure 1002, the third slit structure 1003, and the fourth slit structure 1004 are all filled with the materials of the barrier layer CVD.

[0126] Applying the display substrate of the embodiment of the present application, in the area overlapping with the orthographic projection of the first slit structure of the display substrate on the substrate, there is a through structure filled with the material of the barrier layer in the OLED organic functional layer, and no longer includes the cathode layer, thus ensuring that in the under-screen camera area of the display substrate, there is also no cathode layer of the OLED in the corresponding area of the support bar, ensuring that the under-screen camera area of the display substrate does not include the cathode layer, and avoiding the generation of black spots due to the electrochemical reaction between the cathode layer and the metal isolation column corroding the internal structure of the display substrate.

[0127] In the second aspect of the embodiment of the present application, a method for manufacturing a display substrate is provided, and this method includes the steps as Figure 11 shown:

[0128] Step S1101: Obtain a first substrate to be prepared that has been prepared in advance.

[0129] Wherein, the first substrate to be prepared includes an under-screen camera area, and the under-screen camera area includes a plurality of metal isolation columns. In one example, as Figure 12 shown, the first substrate to be prepared 1201 that has been prepared in advance includes 2 metal isolation columns.

[0130] Step S1102: Evaporate the first substrate to be prepared successively through the evaporation sources corresponding to the hole transport layer, the light-emitting layer, and the electron transport layer to obtain a second substrate to be prepared.

[0131] In practical applications, the second substrate to be prepared can be prepared according to the sequence of each film layer structure of the organic film layer. In one example, if the organic film layer includes a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer, the first substrate to be prepared needs to pass successively through the evaporation sources corresponding to the hole injection layer, the hole transport layer, the electron blocking layer, the light-emitting layer, the hole blocking layer, the electron transport layer, and the electron injection layer to obtain a second substrate to be prepared. Among them, the functional layer closer to the substrate is evaporated first. As Figure 12 shown, evaporate the organic film layer 1205 on the first substrate to be prepared to obtain a second substrate to be prepared 1202, where the organic film layer includes multiple functional layers but does not include the cathode layer, which is not shown in the figure. The film layer structure of the organic film layer can be obtained by referring to the above embodiments.

[0132] Step S1103: Evaporate the isolation layer on the under-screen camera area of the second substrate to be prepared to obtain a third substrate to be prepared.

[0133] Among them, the isolation layer can inhibit the growth of the cathode material. In practical applications, to ensure that the display area of the display substrate can be normally displayed without being affected by the isolation layer, when evaporating the isolation layer, only the under-screen camera area needs to be evaporated to prevent the isolation layer from entering the display area, thereby avoiding the isolation layer from damaging the internal structure of the display area. In one example, the method of fine metal mask (FMM) evaporation or open mask evaporation can be used to evaporate the isolation layer for the range of the under-screen camera area. As Figure 12 shown, the display substrate is the display substrate corresponding to the under-screen camera area, which is provided with metal isolation posts. Evaporate the isolation layer 405 on the corresponding area of the under-screen camera area to obtain a third substrate to be prepared 1203.

[0134] Step S1104: Evaporate the third substrate to be prepared through the evaporation source corresponding to the cathode layer, and continue with the subsequent preparation process to obtain the first display substrate.

[0135] Among them, the under-screen camera area in the first display substrate does not include a cathode layer. After depositing the isolation layer on the under-screen camera area, the same deposition method can be used for the under-screen camera area and the display area. In one example, after depositing the isolation layer on the under-screen camera area by using the fine metal mask deposition method, the mask plate is removed, and subsequent cathode layer deposition and deposition of functional layers such as the encapsulation layer are performed on the entire display substrate until the first display substrate is obtained. Among them, since the under-screen camera area of the display substrate includes an isolation layer, even if the cathode layer deposition step is performed on the under-screen camera area, the cathode material cannot grow into a film in the under-screen camera area. Therefore, the under-screen camera area in the first display substrate does not include a cathode layer. As Figure 12 shown, continue to deposit the subsequent material 1206 on the third substrate to be prepared 1203 until the production of the display substrate is completed to obtain the first display substrate 1204. Among them, when subsequent deposition is performed on the under-screen camera area of the first display substrate, only a CPL (Capping Layer, a protective film layer covering the cathode layer) / LiF (lithium fluoride) will be formed, and it will not include a CTD (cathode layer).

[0136] Applying the method of the embodiment of the present application, when depositing on the display substrate, the isolation layer can be deposited only on the under-screen camera area of the display substrate, so as to avoid the growth of the cathode material into a film within the range of the under-screen camera area, and further avoid the electrochemical reaction between the cathode material within the range of the under-screen camera area and the metal isolation posts to corrode the internal structure of the display substrate, and avoid the generation of black spots.

[0137] In a possible implementation manner, the isolation deposition only for the under-screen camera area can be achieved by the following method:

[0138] Cover a metal mask plate on the second substrate to be prepared, and deposit the second substrate to be prepared through the deposition source corresponding to the isolation layer to obtain a third substrate to be prepared, where the metal mask plate includes an opening area, and the opening area corresponds to the under-screen camera area of the display substrate.

[0139] As Figure 13 shown, in practical applications, multiple display substrates can be deposited at one time. For example, display substrates AA1, AA2,..., AA4 are deposited. The solid areas of the fine metal mask plate are used to cover other parts of the display substrate except the under-screen display area, so that the opening areas of the fine metal mask plate FMM are aligned with the under-screen camera areas of the display substrates. When each display substrate passes through the deposition source corresponding to the isolation layer, the material of the isolation layer enters the display substrate through the opening area and is deposited within the corresponding range of the under-screen camera area of the display substrate to generate an isolation layer. For other areas of the display substrate, since they are blocked by the solid areas of the fine metal mask plate, no isolation layer will be generated.

[0140] By applying the method of the embodiments of the present application, when depositing the isolation layer on the under-screen camera area of the display substrate, by covering the metal mask, the material of the isolation layer can only reach the area within the under-screen camera area through the opening area, without damaging the internal structure of the display area.

[0141] As described in the above embodiments, in the area corresponding to the support bar, there will still be a cathode layer in the under-screen camera area because the isolation layer cannot be deposited. For this area, the cathode layer can be removed in the following way:

[0142] In a possible implementation manner, step S1104 can be implemented through the following steps:

[0143] Step 1: Remove the metal mask from the third substrate to be prepared, and then deposit through the evaporation source corresponding to the cathode layer to obtain the fourth substrate to be prepared.

[0144] Among them, the metal mask includes support bars. In the area corresponding to the support bars, the under-screen camera area does not include an isolation layer. When performing the FMM process, the metal mask is usually welded to the substrate for evaporation. After evaporation, the metal mask needs to be desoldered for subsequent preparation processes. In order to fix the metal mask on the substrate, there are support bars in the metal mask for easy fixation, and the support bars may block some areas that need to be evaporated in the under-screen camera area. Therefore, in the area corresponding to the support bars, the under-screen camera area cannot be evaporated with the isolation layer.

[0145] Step 2: Perform subsequent packaging preparation processes on the fourth substrate to be prepared to obtain the fifth substrate to be prepared.

[0146] The subsequent packaging preparation processes may include the preparation of the barrier layer CVD, the packaging EVEN process, and / or the Touch touch process, etc. The specific processes can be reasonably arranged according to the actual production line equipment. After the packaging process is completed, for the under-screen camera area not blocked by the support bars, there will be no cathode layer due to the presence of the isolation layer. For the area blocked by the support bars, there will still be a cathode layer. Therefore, the following steps are needed to remove the cathode layer.

[0147] Step 3: For the area corresponding to the support bars, burn the OLED organic functional layer of the fifth substrate to be prepared into ash by laser to obtain the first display substrate.

[0148] Among them, the OLED organic functional layer at least includes a cathode layer, a hole transport layer, a light-emitting layer, and an electron transport layer. In practical applications, by setting the wavelength of the laser, it is possible to only damage the OLED organic functional layer without damaging the upper encapsulation layer. In one example, the laser wavelength can be set to 365 nm to only damage the OLED organic functional layer.

[0149] In practical applications, after the encapsulation process or the touch process is completed, a laser site can be set, and for the area corresponding to the support bar, such as Figure 8 the 802 area in Figure 14 as shown, for the under-screen camera area corresponding to the support bar, after the encapsulation process is completed, the fifth substrate to be prepared 1401 does not include an isolation layer, and the OLED organic functional layer 1402 (i.e., Figure 2 the combined structure 204 including the organic film layer and the cathode layer of OLED in

[0150] includes a cathode layer), after laser burning, the OLED organic functional layer becomes ash, and this structure can be ignored. It is considered that under the area corresponding to the support bar, there is no OLED organic functional layer. Therefore, it is not shown in the display substrate 1403 under the area corresponding to the support bar. On the side of the metal isolation column away from the substrate 406 is the barrier layer 1005, and finally the first display substrate is obtained.

[0151] In another possible implementation, step S1104 can be implemented through the following steps:

[0152] Step 1: Remove the metal mask plate from the third substrate to be prepared, and then perform evaporation through the evaporation source corresponding to the cathode layer to obtain the fourth substrate to be prepared.

[0153] Among them, the metal mask plate includes a support bar. In the area corresponding to the support bar, the under-screen camera area does not include an isolation layer. This step is the same as step one of the above embodiment and will not be elaborated here.

[0154] Step 2: Prepare a barrier layer on the fourth substrate to be prepared to obtain the sixth substrate to be prepared.

[0155] In practical applications, the preparation of the barrier layer can also be the same as that in the above embodiment. The barrier layer can be used to prevent water and oxygen from entering the internal structure of the display substrate.

[0156] Step 3: For the area corresponding to the support bar, etch the barrier layer and the OLED organic functional layer on the sixth substrate to be prepared to obtain the seventh substrate to be prepared.

[0157] Among them, the OLED organic functional layer at least includes a cathode layer, a hole transport layer, a light-emitting layer, and an electron transport layer. Etching can include dry etching or wet etching to remove the barrier layer and the underlying OLED organic functionality. Among them, for dry etching, one or more of SF6, NF4, Cl2, etc. can be selected, and for wet etching solution, solutions such as TMAH (C4H 13 NO, tetramethylammonium hydroxide) etc. can be used. Further, after the etching is completed, one or more gases such as H2, N2, N2O, O2, etc. can be used for plasma treatment to improve and enhance the adhesion of the film layer at the edge of the corresponding area.

[0158] Step 4: Perform subsequent preparation processes on the seventh substrate to be prepared to obtain the first display substrate.

[0159] After removing the barrier layer and the OLED organic functional layer in the corresponding area of the support bar, the barrier layer CVD can be formed again by chemical vapor deposition. The composition of the barrier layer is the same as that of the barrier layer in other areas not blocked by the support bar, and it can be composed of one or several film layers stacked among silicon nitride, silicon oxide, and silicon oxynitride. Then, the packaging and touch control processes are further completed to obtain the first display substrate without a cathode layer in the under-screen camera area. As Figure 15 shown, it is the manufacturing process of the under-screen camera area display substrate in the corresponding area of the support bar. The OLED organic functional layer 1402 in the sixth substrate to be prepared 1501 includes a cathode layer. Therefore, after the preparation of the barrier layer, the preparation of the barrier layer and the OLED organic functional layer is carried out, and the barrier layer and the OLED organic functional layer are removed to obtain the seventh substrate to be prepared 1502. Then, the preparation of the barrier layer and the packaging layer is carried out again for this area, so that the display substrate 1403 under the corresponding area of the support bar does not include the OLED organic functional layer, and then the subsequent preparation process is continued to obtain the first display substrate.

[0160] By applying the method of the embodiment of the present application, during the preparation process of the display substrate, the barrier layer and the OLED organic functional layer in the corresponding area of the support bar can be etched and removed, so as to ensure that in the under-screen camera area of the display substrate, there is no cathode layer of the OLED in the corresponding area of the support bar, ensuring that the under-screen camera area of the display substrate does not contain a cathode layer, and avoiding the generation of black spots caused by the electrochemical reaction between the cathode layer and the metal isolation column corroding the internal structure of the display substrate.

[0161] In the third aspect of the embodiment of the present application, a display panel is provided, and the display panel includes the display substrate according to any one of the first aspects of the embodiment of the present application. In one example, the display panel can be the screen of a device that needs to perform display, such as a mobile phone, a tablet computer, a computer, a car machine screen, a television, etc.

[0162] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0163] Each embodiment in this specification is described in a related manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the method and display panel embodiments, since they are basically similar to the display substrate embodiments, the description is relatively simple. For the relevant parts, reference can be made to the partial description of the method embodiments.

[0164] The above are only the preferred embodiments of the present application and are not intended to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application are all included in the protection scope of the present application.

Claims

1. A display substrate, characterized in that, The display substrate includes an under-screen camera area, and the under-screen camera area includes a plurality of metal isolation posts, a hole transport layer, a light-emitting layer, an electron transport layer, and an isolation layer. The hole transport layer is located on a side of the metal isolation posts away from the substrate. The light-emitting layer is located on a side of the hole transport layer away from the substrate. The electron transport layer is located on a side of the light-emitting layer away from the substrate. The isolation layer is located on a side of the electron transport layer away from the substrate. Wherein, the isolation layer can inhibit the growth of the cathode material, and the under-screen camera area does not include a cathode layer.

2. The display substrate according to claim 1, wherein the isolation layer is prepared from an organic non-conductive material.

3. The display substrate according to claim 1, wherein The isolation layer includes a first slit structure, and the first slit structure is filled with the ash of the OLED organic functional layer. In the hole transport layer, the light-emitting layer, and the electron transport layer, the area overlapping with the orthographic projection of the first slit structure on the substrate is filled with the ash of the OLED organic functional layer, wherein the OLED organic functional layer at least includes a cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer.

4. The display substrate according to claim 1, wherein The isolation layer includes a first slit structure. The hole transport layer includes a second slit structure; the light-emitting layer includes a third slit structure; the electron transport layer includes a fourth slit structure. The second slit structure, the third slit structure, and the fourth slit structure form a through structure with the first slit structure and overlap with the orthographic projection area of the first slit structure on the substrate, wherein the through structure is filled with the material of the barrier layer.

5. The display substrate according to claim 1, wherein the distance between every two adjacent metal isolation posts is greater than or equal to 10 microns, and the width of each metal isolation post is greater than or equal to 5 microns.

6. The display substrate according to claim 1, wherein The under-screen camera area further includes a dam structure, the display substrate further includes a display area, and the metal isolation posts include metal inner isolation posts and metal outer isolation posts. The metal inner isolation posts are located on a side of the dam structure close to the display area. The metal outer isolation posts are located on a side of the dam structure away from the display area. Wherein, there is at least 1 metal inner isolation post; there are at least 5 metal outer isolation posts.

7. A method for preparing a display substrate, characterized in that, The method includes: obtaining a first substrate to be prepared in advance, wherein the first substrate to be prepared includes an under-screen camera area, and the under-screen camera area includes a plurality of metal isolation posts. successively evaporating the first substrate to be prepared through evaporation sources corresponding to the hole transport layer, the light-emitting layer, and the electron transport layer to obtain a second substrate to be prepared. evaporating an isolation layer on the under-screen camera area of the second substrate to be prepared to obtain a third substrate to be prepared. Wherein, the isolation layer can inhibit the growth of the cathode material. evaporating the third substrate to be prepared through an evaporation source corresponding to the cathode layer, and continuing with subsequent preparation processes to obtain a first display substrate, wherein the under-screen camera area in the first display substrate does not include a cathode layer.

8. The method according to claim 7, wherein The evaporating an isolation layer on the under-screen camera area of the second substrate to be prepared to obtain a third substrate to be prepared includes: Cover a metal mask on the second substrate to be prepared, and evaporate the second substrate to be prepared through the evaporation source corresponding to the isolation layer to obtain a third substrate to be prepared. Wherein, the metal mask includes an opening area, and the opening area corresponds to the under-screen camera area of the display substrate.

9. The method according to claim 8, characterized in that Evaporating the third substrate to be prepared through the evaporation source corresponding to the cathode layer and continuing the subsequent preparation process to obtain the first display substrate includes: Removing the metal mask from the third substrate to be prepared, and then evaporating through the evaporation source corresponding to the cathode layer to obtain a fourth substrate to be prepared; wherein, the metal mask includes a support bar, and in the area corresponding to the support bar, the under-screen camera area does not include the isolation layer; Performing a subsequent packaging preparation process on the fourth substrate to be prepared to obtain a fifth substrate to be prepared; For the area corresponding to the support bar, burning the OLED organic functional layer of the fifth substrate to be prepared into ash by laser to obtain the first display substrate, wherein the OLED organic functional layer at least includes a cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer.

10. The method according to claim 8, wherein Evaporating the third substrate to be prepared through the evaporation source corresponding to the cathode layer and continuing the subsequent preparation process to obtain the first display substrate includes: Removing the metal mask from the third substrate to be prepared, and then evaporating through the evaporation source corresponding to the cathode layer to obtain a fourth substrate to be prepared; wherein, the metal mask includes a support bar, and in the area corresponding to the support bar, the under-screen camera area does not include the isolation layer; Preparing a barrier layer on the fourth substrate to be prepared to obtain a sixth substrate to be prepared; For the area corresponding to the support bar, etching the barrier layer and the OLED organic functional layer of the sixth substrate to be prepared to obtain a seventh substrate to be prepared; wherein, the OLED organic functional layer at least includes a cathode layer, the hole transport layer, the light-emitting layer, and the electron transport layer; Performing a subsequent preparation process on the seventh substrate to be prepared to obtain the first display substrate.

11. A display panel, characterized in that, The display panel includes the display substrate according to any one of claims 1-6.

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