Display panel and manufacturing method thereof

Abstract

The invention discloses a display panel and a manufacturing method thereof, and belongs to the technical field of display. The manufacturing method of the display panel comprises the following steps: forming a first sacrificial layer and a first light-emitting layer which are stacked on one side, deviating from a driving back plate, of a pixel definition layer; and removing the first sacrificial layer so as to remove the part, overlapped with the first sacrificial layer, in the first light-emitting layer. And the part, exposed through the first avoiding hole in the first sacrificial layer, in the first light-emitting layer is at least located in the corresponding pixel holes. The shadow effect does not need to be considered when the first sacrificial layer is adopted to form the organic light-emitting layer, the part, located outside the pixel hole, in the first light-emitting layer is removed along with the first sacrificial layer, and the first light-emitting layers in the pixel hole are not connected together, so that compared with an FMM mode, the effect is better. The distance between the adjacent pixel holes in the mode of adopting the first sacrificial layer can be smaller, and the pixel density and the pixel aperture ratio of the display panel can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the same. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels are hailed as the next generation of display devices due to their advantages such as self-luminescence, high efficiency, bright colors, light weight, power saving and rollability, and have attracted increasing attention in recent years.

[0003] At present, the RGB light-emitting layer in the OLED display panel is made by Fine Metal Mask (FMM) evaporation technology. However, it is difficult to produce a display panel with ultra-high pixel density (Pixel Per Inch, PPI) using FMM evaporation technology. Therefore, the pixel density of the display panel currently produced by FMM evaporation technology is usually low. Summary of the invention

[0004] The embodiment of the present application provides a display panel and a manufacturing method thereof, which can solve the problem of small pixel aperture ratio of the OLED display panel in the prior art. The technical solution is as follows:

[0005] In one aspect, a method for manufacturing a display panel is provided, the method comprising:

[0006] Provide drive backplane;

[0007] forming a pixel definition layer on one side of the driving backplane, wherein the pixel definition layer has a plurality of pixel openings;

[0008] A first sacrificial layer and a first light-emitting layer are stacked on one side of the pixel definition layer away from the driving backplane; the first sacrificial layer is closer to the driving backplane than the first light-emitting layer, and the first sacrificial layer has a plurality of first avoidance openings, the plurality of first avoidance openings correspond to at least part of the pixel openings, and the orthographic projections of the first avoidance openings on the driving backplane overlap with the orthographic projections of the corresponding pixel openings on the driving backplane;

[0009] The first sacrificial layer is removed to remove a portion of the first light-emitting layer overlapping with the first sacrificial layer, so that a portion of the first light-emitting layer exposed through the first avoidance opening is at least located within the corresponding pixel opening.

[0010] Optionally, the first light-emitting layer is an organic light-emitting thin film formed by full-layer evaporation, the first avoidance opening corresponds to a first type of pixel opening among the plurality of pixel openings, a portion of the first light-emitting layer exposed through the first avoidance opening is a first type of light-emitting portion, and at least a portion of the first type of light-emitting portion is located within the first type of pixel opening.

[0011] Optionally, the method further includes:

[0012] Forming a second sacrificial layer and a second light-emitting layer stacked on the driving backplane where the first type of light-emitting portion is formed; the second sacrificial layer is closer to the driving backplane than the second light-emitting layer, and the second sacrificial layer has a plurality of second avoidance openings corresponding to a second type of pixel opening among the plurality of pixel openings, and a positive projection of the second avoidance opening on the driving backplane overlaps a positive projection of the corresponding second type of pixel opening on the driving backplane; the second light-emitting layer is an organic light-emitting thin film formed by full-layer evaporation;

[0013] Removing the second sacrificial layer to remove a portion of the second light-emitting layer that overlaps with the second sacrificial layer, so that a second type of light-emitting portion of the second light-emitting layer exposed through the second avoidance opening is at least located within the corresponding second type of pixel opening.

[0014] Optionally, the method further includes:

[0015] Forming a third sacrificial layer and a third light-emitting layer stacked on the driving backplane where the second type of light-emitting portion is formed; the third sacrificial layer is closer to the driving backplane than the third light-emitting layer, and the third sacrificial layer has a plurality of third avoidance openings corresponding to a third type of pixel opening among the plurality of pixel openings, and a positive projection of the third avoidance opening on the driving backplane overlaps a positive projection of the corresponding third type of pixel opening on the driving backplane; the third light-emitting layer is an organic light-emitting thin film formed by full-layer evaporation;

[0016] Removing the third sacrificial layer to remove a portion of the third light-emitting layer that overlaps with the third sacrificial layer, so that a third type of light-emitting portion of the third light-emitting layer exposed through the third avoidance opening is at least located within the corresponding third type of pixel opening;

[0017] Wherein, colors of light emitted by the first type of light-emitting portion, colors of light emitted by the second type of light-emitting portion, and colors of light emitted by the third type of light-emitting portion are different from each other.

[0018] Optionally, the method further includes:

[0019] Before forming the first sacrificial layer, a first functional layer is formed on the side of the pixel defining layer facing away from the driving backplane;

[0020] After removing the third sacrificial layer to remove the portion of the third light-emitting layer overlapping with the third sacrificial layer, a second functional layer and a cathode layer are formed in a stacked manner on the driving backplane where the third type of light-emitting portion is formed.

[0021] Optionally, the first light-emitting layer includes: a plurality of first light-emitting blocks; the plurality of first light-emitting blocks correspond one-to-one with the plurality of first avoidance openings and one-to-one with a plurality of pixel openings; the orthographic projection of the first avoidance opening on the driving backplane is located within the orthographic projection of the corresponding first light-emitting block on the driving backplane, and the orthographic projection of the first light-emitting block on the driving backplane intersects with the orthographic projection of the first sacrificial layer on the driving backplane;

[0022] Wherein, at least a portion of the first light-emitting block exposed through the corresponding first avoidance opening is located within the corresponding pixel opening.

[0023] Optionally, the method further includes:

[0024] After forming the first sacrificial layer and before forming the first light-emitting layer, a first functional layer is formed on the side of the first sacrificial layer facing away from the driving backplane;

[0025] During the process of removing the first sacrificial layer, the portions of the first functional layer and the first light-emitting block overlapping with the first sacrificial layer are removed.

[0026] Optionally, the method further includes:

[0027] After forming the first light-emitting layer and before removing the first sacrificial layer, a second functional layer is formed on the side of the first light-emitting layer facing away from the driving backplane;

[0028] During the process of removing the first sacrificial layer, the portions of the first functional layer, the first light-emitting block, and the second functional layer overlapping with the first sacrificial layer are removed;

[0029] A cathode layer is formed on the driving backplane with the patterned second functional layer.

[0030] Optionally, after forming the first light-emitting layer and before removing the first sacrificial layer, a second functional layer and a cathode layer are sequentially formed on the side of the first light-emitting layer facing away from the driving backplane;

[0031] During the process of removing the first sacrificial layer, the portions of the first functional layer, the first light-emitting block, the second functional layer, and the cathode layer that overlap with the first sacrificial layer are removed.

[0032] Optionally, the pixel defining layer further has a plurality of first auxiliary openings; the first sacrificial layer further has a plurality of second auxiliary openings; the method further includes:

[0033] Before forming the pixel defining layer, an anode layer is formed on one side of the driving backplane.

[0034] Wherein, the anode layer includes: a plurality of anode blocks arranged separately, and an auxiliary electrode arranged separately from the anode blocks.

[0035] The plurality of anode blocks correspond to the plurality of pixel openings, and the orthographic projection of the pixel openings on the driving backplane is located within the orthographic projection of the anode blocks on the driving backplane.

[0036] The orthographic projection of the first auxiliary openings on the driving backplane is located within the orthographic projection of the auxiliary electrode on the driving backplane, and the orthographic projection of the second auxiliary openings on the driving backplane is located within the orthographic projection of the auxiliary electrode on the driving backplane; the orthographic projections of the first functional layer, the first light-emitting block, and the second functional layer on the driving backplane do not coincide with the orthographic projection of the second auxiliary openings on the driving backplane.

[0037] The cathode layer is overlapped with the auxiliary electrode through the first auxiliary openings and the second auxiliary openings.

[0038] Optionally, the first light-emitting layer is an organic light-emitting thin film deposited by full-layer evaporation, the first avoidance openings correspond to the plurality of pixel openings one by one, and the portions of the first light-emitting layer exposed through the first avoidance openings are first sub-light-emitting portions; the plurality of first sub-light-emitting portions correspond to the plurality of pixel openings one by one, and at least part of the first sub-light-emitting portions is located within the pixel openings.

[0039] Optionally, the method further includes:

[0040] A second sacrificial layer and a second light-emitting layer are stacked on the driving backplane formed with the first sub-light-emitting portion; the second sacrificial layer is closer to the driving backplane than the second light-emitting layer, and the second sacrificial layer has a plurality of second avoidance openings, the second avoidance openings correspond to a part of the plurality of pixel openings, and the orthographic projections of the second avoidance openings on the driving backplane overlap with the orthographic projections of the corresponding pixel openings on the driving backplane; the second light-emitting layer includes: a plurality of second light-emitting blocks; the plurality of second light-emitting blocks correspond one-to-one to the plurality of second avoidance openings; the orthographic projections of the second avoidance openings on the driving backplane are located within the orthographic projections of the corresponding second light-emitting blocks on the driving backplane, and the orthographic projections of the second light-emitting blocks on the driving backplane overlap with the orthographic projections of the second sacrificial layer on the driving backplane;

[0041] The second sacrificial layer is removed to remove the portion of the second light-emitting block overlapping with the second sacrificial layer, so that the portion of the second light-emitting block exposed through the second avoidance opening is at least located within the corresponding pixel opening.

[0042] Optionally, the plurality of pixel openings include: a plurality of first-type pixel openings, a plurality of second-type pixel openings, and a plurality of third-type pixel openings; a portion of the second light-emitting block located within the first-type pixel openings is a second sub-light-emitting portion, and a portion of the second light-emitting block located within the second-type pixel openings is a third sub-light-emitting portion;

[0043] Among them, the first type of pixel openings are distributed with the first sub-light-emitting portion and the second sub-light-emitting portion arranged in a stacked manner; the second type of pixel openings are distributed with the first sub-light-emitting portion and the third sub-light-emitting portion arranged in a stacked manner; and the first sub-light-emitting portion is distributed in the third type of pixel openings.

[0044] Optionally, removing the first sacrificial layer includes:

[0045] The driving backplane formed with the first sacrificial layer and the first light-emitting layer is placed in a target gas, so that the first sacrificial layer reacts with the target gas, so that the first sacrificial layer is removed from the driving backplane.

[0046] On the other hand, a display panel is provided, the display panel is manufactured by any of the above methods; the display panel comprises: a driving backplane, a pixel definition layer and a first light-emitting layer;

[0047] The pixel definition layer is located on one side of the driving backplane, and the pixel definition layer has a plurality of pixel openings; the first light-emitting layer is located on the side of the pixel definition layer away from the driving backplane, and at least part of the first light-emitting layer is located in the pixel openings.

[0048] The beneficial effects brought by the technical solution provided in the embodiment of the present application at least include:

[0049] In the protruding manufacturing method of the embodiment of the present application, a first sacrificial layer and a first light-emitting layer are formed in a stacked manner on the side of the pixel definition layer facing away from the driving backplane. Then, the first sacrificial layer is removed to remove the overlapping part of the first light-emitting layer with the first sacrificial layer. At least the part of the first light-emitting layer exposed through the first avoidance opening is located within the corresponding plurality of pixel openings. In this way, the part of the first light-emitting layer located within the pixel opening K correspondingly forms an organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the formation of the organic light-emitting layer in the light-emitting device by using FMM, in order to avoid the organic light-emitting layers in adjacent pixel openings being connected together, the distance between adjacent pixel openings is relatively large. However, when using the first sacrificial layer to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer located outside the pixel opening is removed along with the first sacrificial layer, and the first light-emitting layers within the pixel openings will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings can be smaller in the method using the first sacrificial layer, which can effectively improve the pixel density and pixel aperture ratio of the display panel. Description of the Drawings

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0051] Figure 1 is a flowchart of a manufacturing method of a display panel provided in an embodiment of the present application;

[0052] Figure 2 is Figure 1 a schematic diagram of the film layer structure of the pixel definition layer in the method shown;

[0053] Figure 3 is Figure 1 a schematic diagram of the film layer structure after forming the first sacrificial layer and the first light-emitting layer in the method shown;

[0054] Figure 4 is Figure 1 a schematic diagram of the film layer structure after removing the first sacrificial layer in the method shown;

[0055] Figure 5 is a flowchart of another manufacturing method of a display panel provided in an embodiment of the present application;

[0056] Figure 6 isFigure 5 Schematic diagram of the film layer structure after forming the anode layer in the method shown;

[0057] Figure 7 is Figure 5 Schematic diagram of the film layer structure after forming the pixel definition layer in the method shown;

[0058] Figure 8 is Figure 5 Schematic diagram of the film layer structure after forming the first functional layer in the method shown;

[0059] Figure 9 is Figure 5 Schematic diagram of the film layer structure after forming the first sacrificial layer and the first light-emitting layer in the method shown;

[0060] Figure 10 is Figure 5 Schematic diagram of the film layer structure after removing the first sacrificial layer in the method shown;

[0061] Figure 11 is Figure 5 Schematic diagram of the film layer structure after forming the second sacrificial layer and the second light-emitting layer in the method shown;

[0062] Figure 12 is Figure 5 Schematic diagram of the film layer structure after removing the second sacrificial layer in the method shown;

[0063] Figure 13 is Figure 5 Schematic diagram of the film layer structure after forming the third sacrificial layer and the third light-emitting layer in the method shown;

[0064] Figure 14 is Figure 5 Schematic diagram of the film layer structure after removing the third sacrificial layer in the method shown;

[0065] Figure 15 is Figure 5 Schematic diagram of the film layer structure after forming the second functional layer and the cathode layer which are stacked in the method shown;

[0066] Figure 16 is the flowchart of another manufacturing method of a display panel provided by an embodiment of the present application;

[0067] Figure 17 is Figure 16 Schematic diagram of the film layer structure after forming the anode layer in the method shown;

[0068] Figure 18 is Figure 16 Schematic diagram of the film layer structure after forming the pixel definition layer in the method shown;

[0069] Figure 19 isFigure 16 Schematic diagram of a film layer structure after forming a first sacrificial layer in the method shown;

[0070] Figure 20 It is on Figure 19 Schematic diagram of a film layer structure for forming a first functional layer on the display panel shown;

[0071] Figure 21 It is on Figure 20 Schematic diagram of a film layer structure for forming a first light-emitting layer on the display panel shown;

[0072] Figure 22 It is on Figure 21 Schematic diagram of a film layer structure for forming a second functional layer on the display panel shown;

[0073] Figure 23 It is Figure 22 Schematic diagram of the film layer structure after removing the first sacrificial layer from the display panel shown;

[0074] Figure 24 It is on Figure 22 Schematic diagram of a film layer structure for forming a cathode layer on the display panel shown;

[0075] Figure 25 It is a flowchart of another manufacturing method of a display panel provided by an embodiment of the present application;

[0076] Figure 26 It is Figure 25 Schematic diagram of a film layer structure after forming a first sacrificial layer in the method shown;

[0077] Figure 27 It is on Figure 26 Schematic diagram of a film layer structure for forming a first functional layer on the display panel shown;

[0078] Figure 28 It is on Figure 27 Schematic diagram of a film layer structure for forming a first light-emitting layer on the display panel shown;

[0079] Figure 29 It is on Figure 28 Schematic diagram of a film layer structure for forming a second functional layer on the display panel shown;

[0080] Figure 30 It is on Figure 29 Schematic diagram of a film layer structure for forming a cathode layer on the display panel shown;

[0081] Figure 31 It is Figure 30 Schematic diagram of the film layer structure after removing the first sacrificial layer from the display panel shown;

[0082] Figure 32It is a flowchart of a manufacturing method of a display panel provided by another embodiment of the present application;

[0083] Figure 33 It is Figure 32 A schematic diagram of a film layer structure after forming a first sacrificial layer in the method shown;

[0084] Figure 34 It is in Figure 33 A schematic diagram of a film layer structure of forming a first functional layer on the display panel shown;

[0085] Figure 35 It is Figure 34 A schematic diagram of a film layer structure of removing the first sacrificial layer from the display panel shown;

[0086] Figure 36 It is in Figure 35 A schematic diagram of a film layer structure of forming a second sacrificial layer and a second light-emitting layer arranged in a stack on the display panel shown;

[0087] Figure 37 It is in Figure 36 A schematic diagram of a film layer structure of removing the second sacrificial layer from the display panel shown;

[0088] Figure 38 It is a top view of a display panel provided by an embodiment of the present application;

[0089] Figure 39 It is a top view of another display panel provided by an embodiment of the present application;

[0090] Figure 40 It is in Figure 37 A schematic diagram of a film layer structure of forming a second functional layer and a cathode layer on the display panel shown;

[0091] Figure 41 It is a flowchart of a manufacturing method of another display panel provided by another embodiment of the present application;

[0092] Figure 42 It is Figure 41 Another schematic diagram of a film layer structure of forming a first functional layer in the method shown;

[0093] Figure 43 It is Figure 42 A schematic diagram of a film layer structure of removing the first sacrificial layer from the display panel shown;

[0094] Figure 44 It is in Figure 43 A schematic diagram of a film layer structure of forming a second sacrificial layer and a second light-emitting layer arranged in a stack on the display panel shown;

[0095] Figure 45 It is in Figure 44Schematic diagram of the film layer structure of the display panel with the second sacrificial layer removed;

[0096] Figure 46 is in Figure 45 Schematic diagram of the film layer structure of the second functional layer and the cathode layer formed on the display panel shown. Detailed implementation manners

[0097] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe the implementation manners of this application in detail with reference to the accompanying drawings.

[0098] Please refer to Figure 1 , Figure 1 which is a flowchart of a method for manufacturing a display panel provided by an embodiment of this application. The method may include:

[0099] Step 101, provide a driving backplane.

[0100] Step 102, form a pixel definition layer on one side of the driving backplane.

[0101] The process of forming the pixel definition layer may include: depositing a pixel definition layer thin film on one side of the driving backplane, and patterning the pixel definition layer thin film to form the pixel definition layer.

[0102] Exemplarily, please refer to Figure 2 , Figure 2 is Figure 1 a schematic diagram of the film layer structure of the pixel definition layer in the method shown. The display panel 000 may include a driving backplane 100 and a pixel definition layer 200 located on one side of the driving backplane 100. Among them, the pixel definition layer 200 has a plurality of pixel openings K.

[0103] It should be noted that for any one pixel opening K, the organic light-emitting layer located within the pixel opening K corresponds to the organic light-emitting layer in a light-emitting device.

[0104] Step 103, form a stacked first sacrificial layer and a first light-emitting layer on the side of the pixel definition layer facing away from the driving backplane.

[0105] The formation process may include: forming a first sacrificial layer thin film on the side of the pixel definition layer facing away from the driving backplane, and patterning the first sacrificial layer thin film to form the first sacrificial layer; forming a first light-emitting layer on the side of the first sacrificial layer facing away from the driving backplane.

[0106] Here, the process of patterning the first sacrificial layer film may include: coating a photoresist layer on the side of the first sacrificial layer facing away from the driving backplane, performing exposure processing and development processing on the photoresist layer, etching the first sacrificial layer coated with the photoresist to form a plurality of first avoidance openings. Stripping the photoresist layer on the side of the first sacrificial layer facing away from the driving backplane to form a patterned first sacrificial layer.

[0107] Please refer to Figure 3 , Figure 3 is Figure 1 a schematic diagram of the film layer structure after forming the first sacrificial layer and the first light-emitting layer in the method shown. Among them, the first sacrificial layer 300 is closer to the driving backplane 100 than the first light-emitting layer 400, and the patterned first sacrificial layer 300 has a plurality of first avoidance openings 310. The plurality of first avoidance openings 310 correspond to at least part of the pixel openings K, and the orthographic projection of the first avoidance openings 310 on the driving backplane 100 overlaps with the orthographic projection of the corresponding pixel openings K on the driving backplane 100. Exemplarily, the first sacrificial layer 300 can be made of oxide, nitride, carbide or oxynitride.

[0108] Step 104, removing the first sacrificial layer.

[0109] The process of removing the first sacrificial layer may include: placing the driving backplane formed with the first sacrificial layer and the first light-emitting layer in a target gas, reacting the first sacrificial layer with the target gas to remove the first sacrificial layer from the driving backplane. At the same time, the part of the first light-emitting layer overlapping with the first sacrificial layer is removed from the driving backplane together with the first sacrificial layer. Exemplarily, the target gas can be at least one of acetone, isopropanol, methanol and fluorocarbon-based gas fluids.

[0110] Please refer to Figure 4 , Figure 4 is Figure 1Schematic diagram of the film layer structure after removing the first sacrificial layer in the method shown. In the first light-emitting layer 400, the part located in the first avoidance opening 310 will not be removed from the driving backplane 100 along with the first sacrificial layer 300. Therefore, at least the part of the first light-emitting layer 400 exposed through the first avoidance opening 310 is located within the corresponding plurality of pixel openings K. In this way, the first light-emitting layer 400 located within the pixel opening K correspondingly forms the organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the formation of the organic light-emitting layer in the light-emitting device by using FMM, in order to prevent the organic light-emitting layers in adjacent pixel openings K from being connected together, the distance between adjacent pixel openings K is relatively large. However, when using the first sacrificial layer 300 to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer 400 located outside the pixel opening K is removed along with the first sacrificial layer 300, and the first light-emitting layer 400 within the pixel opening K will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings K can be smaller in the method using the first sacrificial layer 300, which can effectively improve the pixel density and pixel aperture ratio of the display panel 000.

[0111] In summary, the embodiment of the present application provides a manufacturing method of a display panel. A first sacrificial layer and a first light-emitting layer are stacked and formed on the side of the pixel definition layer facing away from the driving backplane. The first sacrificial layer is removed to remove the overlapping part of the first light-emitting layer and the first sacrificial layer. At least the part of the first light-emitting layer exposed through the first avoidance opening is located within the corresponding plurality of pixel openings. In this way, the first light-emitting layer located within the pixel opening K correspondingly forms the organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the formation of the organic light-emitting layer in the light-emitting device by using FMM, in order to prevent the organic light-emitting layers in adjacent pixel openings from being connected together, the distance between adjacent pixel openings is relatively large. However, when using the first sacrificial layer to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer located outside the pixel opening is removed along with the first sacrificial layer, and the first light-emitting layer within the pixel opening will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings can be smaller in the method using the first sacrificial layer, which can effectively improve the pixel density and pixel aperture ratio of the display panel.

[0112] Please refer to Figure 5 , Figure 5 which is a flowchart of another manufacturing method of the display panel provided by the embodiment of the present application.

[0113] Step 201, provide a driving backplane.

[0114] The driving backplane includes a plurality of pixel driving circuits for providing electrical signals to the subsequently formed light-emitting devices, thereby enabling the display panel to display images. It should be noted that the formed light-emitting devices can be OLED light-emitting devices or OLED light-emitting devices.

[0115] Exemplarily, the driving backplane may include a plurality of pixel driving circuits. The plurality of pixel driving circuits are used to be correspondingly connected to a plurality of subsequently formed light-emitting devices, so that the pixel driving circuits can provide driving signals for the corresponding light-emitting devices to make the corresponding light-emitting devices emit light.

[0116] Step 202: Form an anode layer on one side of the driving backplane.

[0117] Please refer to Figure 6 , Figure 6 is Figure 5 The schematic diagram of the film layer structure after forming the anode layer in the method shown in. Among them, the anode layer 500 includes: a plurality of anode blocks 510 separated from each other, and the plurality of anode blocks are electrically connected to the driving backplane 100. Exemplarily, the plurality of anode blocks 510 can be correspondingly electrically connected to the plurality of pixel driving circuits in the driving backplane 100.

[0118] The formation process of the plurality of anode blocks may include: depositing an anode layer on one side of the driving backplane, and performing a patterning process on the anode layer to form a plurality of separated anode blocks.

[0119] It should be noted that in the embodiments of the present application, the process of performing a patterning process on a certain film layer includes: photoresist coating, exposure, development, etching, and photoresist stripping.

[0120] For example, the process of performing a patterning process on the anode layer includes: photoresist coating, exposure, development, etching, and photoresist stripping, and then a plurality of anode blocks can be obtained.

[0121] Step 203: Form a pixel definition layer on the side of the anode layer facing away from the driving backplane.

[0122] This step can refer to the above step 102 and will not be elaborated here.

[0123] It should be noted that please refer to Figure 7 , Figure 7 is Figure 5 The schematic diagram of the film layer structure after forming the pixel definition layer in the method shown in. The plurality of anode blocks 510 correspond to a plurality of pixel openings K, and the orthographic projection of the pixel openings K on the driving backplane 100 is located within the orthographic projection of the anode blocks 510 on the driving backplane 100.

[0124] Step 204: Form a first functional layer on the side of the pixel definition layer facing away from the driving backplane.

[0125] Please refer to Figure 8 , Figure 8 which Figure 5 is a schematic diagram of the film layer structure after forming the first functional layer in the method shown. The first functional layer 600 is a film formed by integral evaporation, and the first functional layer 600 is connected to the side of the plurality of anode blocks 510 facing away from the driving backplane 100.

[0126] Step 205: Form a first sacrificial layer and a first light-emitting layer which are stacked on the side of the first functional layer facing away from the driving backplane.

[0127] This step can refer to the above step 103 and will not be elaborated here.

[0128] It should be noted that, please refer to Figure 9 , Figure 9 which Figure 5 is a schematic diagram of the film layer structure after forming the first sacrificial layer and the first light-emitting layer in the method shown. The first light-emitting layer 400 is an organic light-emitting film formed by integral evaporation. The first avoidance opening 310 corresponds to the first type of pixel opening K1 among the plurality of pixel openings K. The part of the first light-emitting layer 400 exposed through the first avoidance opening K1 is the first type of light-emitting part 410, and at least part of the first type of light-emitting part 410 is located within the first type of pixel opening K1.

[0129] Step 206: Remove the first sacrificial layer.

[0130] The process of removing the first sacrificial layer may include: placing the driving backplane formed with the first sacrificial layer and the first light-emitting layer in a target gas, causing the first sacrificial layer to react with the target gas so that the first sacrificial layer is removed from the driving backplane. At the same time, the part of the first light-emitting layer overlapping with the first sacrificial layer is removed from the driving backplane together with the first sacrificial layer. Exemplarily, the target gas may be at least one of acetone, isopropyl alcohol, methanol, and fluorocarbon-based gas fluid.

[0131] Please refer to Figure 10 , Figure 10 which Figure 5Schematic diagram of the film layer structure after removing the first sacrificial layer in the method shown. In the first light-emitting layer 400, the part located in the first avoidance opening 310 will not be removed from the driving backplane 100 along with the first sacrificial layer 300. Therefore, at least the first type of light-emitting part 410 exposed through the first avoidance opening 310 in the first light-emitting layer 400 is located within the corresponding plurality of first pixel openings K1. Since there is a shadow effect during the formation of the first type of light-emitting part 410 by using FMM, in order to avoid the evaporated first type of light-emitting part 410 being deposited in adjacent pixel openings K, thus resulting in the bad phenomenon of color crosstalk, the distance between the plurality of pixel openings K is relatively large. In this application, the first type of light-emitting part 410 is not formed by using the FMM evaporation technology. When using the first sacrificial layer 300 to form the first type of light-emitting part 410, the shadow effect does not need to be considered. The part of the first light-emitting layer 400 connecting the plurality of first type of light-emitting parts 410 can be removed. The first light-emitting layer 400 within the first pixel opening K1 will not be connected together, and the first light-emitting layer 400 will only be exposed through the first avoidance opening 310 corresponding to the first pixel opening K1. Therefore, compared with the method using FMM, the distance between adjacent pixel openings K in the method using the first sacrificial layer 300 can be smaller, which can effectively improve the pixel density and pixel aperture ratio of the display panel 000.

[0132] Step 207: Form a second sacrificial layer and a second light-emitting layer which are stacked on the driving backplane formed with the first type of light-emitting part.

[0133] This formation process may include: forming a second sacrificial layer thin film on the side of the first type of light-emitting part facing away from the driving backplane, and performing patterning treatment on the second sacrificial layer thin film to form the second sacrificial layer; forming a second light-emitting layer on the side of the second sacrificial layer facing away from the driving backplane.

[0134] Here, the process of patterning the second sacrificial layer thin film may include: coating a photoresist layer on the side of the second sacrificial layer facing away from the driving backplane, performing exposure treatment and development treatment on the photoresist layer, etching the second sacrificial layer coated with the photoresist to form a plurality of second avoidance openings. Stripping the photoresist layer on the side of the second sacrificial layer facing away from the driving backplane to form the patterned second sacrificial layer.

[0135] Please refer to Figure 11 , Figure 11 is Figure 5Schematic diagram of the film layer structure after forming the second sacrificial layer and the second light-emitting layer in the method shown. Among them, the second sacrificial layer 700 is closer to the driving backplane 100 than the second light-emitting layer 800, and the patterned second sacrificial layer 700 has a plurality of second avoidance openings 710. The second avoidance openings 710 correspond to the second type of pixel openings K2 among the plurality of pixel openings K, and the orthographic projection of the second avoidance openings 710 on the driving backplane 100 overlaps with the orthographic projection of the corresponding second type of pixel openings K2 on the driving backplane 100. It should be noted that the second light-emitting layer 800 is an organic light-emitting thin film deposited by a whole layer. Exemplarily, the second sacrificial layer 700 can be made of oxide, nitride, carbide or oxynitride.

[0136] Step 208, removing the second sacrificial layer.

[0137] The process of removing the second sacrificial layer may include: placing the driving backplane formed with the second sacrificial layer and the second light-emitting layer in a target gas, reacting the second sacrificial layer with the target gas so as to remove the second sacrificial layer from the driving backplane. At the same time, the part of the second light-emitting layer overlapping with the second sacrificial layer is removed from the driving backplane together with the second sacrificial layer. Exemplarily, the target gas may be at least one of acetone, isopropyl alcohol, methanol and fluorocarbon-based gas fluid.

[0138] Please refer to Figure 12 , Figure 12 is Figure 5 Schematic diagram of the film layer structure after removing the second sacrificial layer in the method shown. The part of the second light-emitting layer 800 located in the second avoidance opening 710 will not be removed from the driving backplane 100 together with the second sacrificial layer 700. Therefore, the second light-emitting part 810 exposed through the second avoidance opening 710 in the second light-emitting layer 800 is at least located within the corresponding plurality of second pixel openings K2. Since there is a shadow effect during the formation of the second light-emitting part 810 by using FMM, in order to avoid the formed second light-emitting part 810 being deposited in adjacent pixel openings K and thus causing the adverse phenomenon of color crosstalk, the distance between the plurality of pixel openings K is relatively large. In the present application, the second light-emitting part 810 is not formed by using FMM evaporation technology. The method of forming the second light-emitting part 810 by using the second sacrificial layer 700 does not need to consider the shadow effect. The part of the second light-emitting layer 800 connecting the plurality of second light-emitting parts 810 can be removed. The second light-emitting layer 800 within the second pixel opening K2 will not be connected together, and the second light-emitting layer 400 will only be exposed through the second avoidance opening 710 corresponding to the second pixel opening K2. Therefore, compared with the method using FMM, the distance between adjacent pixel openings K in the manufacturing method using the second sacrificial layer 700 can be smaller, which can effectively improve the pixel density and pixel aperture ratio of the display panel 000.

[0139] Step 209: Form a third sacrificial layer and a third light-emitting layer which are stacked on the driving backplane formed with the second type of light-emitting part.

[0140] This forming process may include: forming a third sacrificial layer thin film on the side of the second type of light-emitting part away from the driving backplane, and performing patterning on the third sacrificial layer thin film to form the third sacrificial layer; forming the third light-emitting layer on the side of the third sacrificial layer away from the driving backplane.

[0141] Here, the process of patterning the third sacrificial layer thin film may include: coating a photoresist layer on the side of the third sacrificial layer away from the driving backplane, performing exposure processing and development processing on the photoresist layer, etching the third sacrificial layer coated with the photoresist to form a plurality of third avoidance openings. Stripping the photoresist layer on the side of the third sacrificial layer away from the driving backplane to form the patterned third sacrificial layer.

[0142] Please refer to Figure 13 , Figure 13 is Figure 5 the schematic diagram of the film layer structure after forming the third sacrificial layer and the third light-emitting layer in the method shown. Among them, the third sacrificial layer 900 is closer to the driving backplane 100 than the third light-emitting layer 1000, and the patterned third sacrificial layer 900 has a plurality of third avoidance openings 910. The third avoidance openings 910 correspond to the third type of pixel openings K3 among the plurality of pixel openings K, and the orthographic projection of the third avoidance openings 910 on the driving backplane 100 overlaps with the orthographic projection of the corresponding third type of pixel openings K3 on the driving backplane 100. It should be noted that the third light-emitting layer 1000 is an organic light-emitting thin film deposited by a whole layer. Exemplarily, the third sacrificial layer 900 may be made of an oxide, a nitride, a carbide or a nitrogen oxide.

[0143] Step 210: Remove the third sacrificial layer.

[0144] The process of removing the third sacrificial layer may include: placing the driving backplane formed with the third sacrificial layer and the third light-emitting layer in a target gas, making the third sacrificial layer react with the target gas to remove the third sacrificial layer from the driving backplane. At the same time, the part of the third light-emitting layer overlapping with the third sacrificial layer is removed from the driving backplane together with the third sacrificial layer. Exemplarily, the target gas may be at least one of acetone, isopropyl alcohol, methanol and fluorocarbon-based gas fluid.

[0145] Please refer to Figure 14 , Figure 14 is Figure 5Schematic diagram of the film layer structure after removing the third sacrificial layer in the method shown. In the third light-emitting layer 1000, the part located in the third avoidance opening 910 will not be removed from the driving backplane 100 along with the third sacrificial layer 900. Therefore, at least the third type of light-emitting part 1010 exposed through the third avoidance opening 910 in the third light-emitting layer 1000 is located within the corresponding multiple third pixel openings K3. Since there is a shadow effect during the formation of the third type of light-emitting part 1010 using FMM, in order to avoid the evaporated third type of light-emitting part 1010 being deposited in adjacent pixel openings K, resulting in the adverse phenomenon of color crosstalk, the distance between multiple pixel openings K is relatively large. In the present application, the third type of light-emitting part 1010 is not formed using FMM evaporation technology. The method of forming the third type of light-emitting part 1010 using the third sacrificial layer 900 does not need to consider the shadow effect. The part of the third light-emitting layer 1000 connecting multiple third type of light-emitting parts 1010 can be removed, and the third light-emitting layer 1000 within the third pixel opening K3 will not be connected together. Moreover, the third light-emitting layer 1000 will only be exposed through the third avoidance opening 910 corresponding to the third pixel opening K3. Therefore, compared with the method using FMM, the distance between adjacent pixel openings K in the manufacturing method using the third sacrificial layer 900 can be smaller, which can effectively improve the pixel density and pixel aperture ratio of the display panel 000.

[0146] It should be noted that the colors of the light rays emitted by the first type of light-emitting part 410, the second type of light-emitting part 810, and the third type of light-emitting part 1010 are different. Exemplarily, the first type of light-emitting part 410 can be used to emit red light, the second type of light-emitting part 810 can be used to emit blue light, and the third type of light-emitting part 1010 can be used to emit green light.

[0147] Step 211: Form a second functional layer and a cathode layer stacked on the driving backplane where the third type of light-emitting part is formed.

[0148] This formation process can include: forming a second functional layer on the side of the third type of light-emitting part facing away from the driving backplane, and forming a cathode layer on the side of the second functional layer facing away from the driving backplane.

[0149] Exemplarily, please refer to Figure 15 , Figure 15 is Figure 5 Schematic diagram of the film layer structure after forming the second functional layer and the cathode layer stacked. The second functional layer 1100 is closer to the driving backplane 100 than the cathode layer 1200, and the second functional layer 1100 and the cathode layer 1200 are thin films deposited as a whole layer.

[0150] Thus, for any first - type pixel opening K1, the anode block 510 corresponding to this first - type pixel opening K1, the first - type light - emitting part 410 distributed within this first - type pixel opening K1, and the parts of the first functional layer 600, the second functional layer 1100, and the cathode layer 1200 distributed within this first - type pixel opening K1 can form a first - type light - emitting device.

[0151] For any second - type pixel opening K2, the anode block 510 corresponding to this second - type pixel opening K2, the second - type light - emitting part 810 distributed within this second - type pixel opening K2, and the parts of the first functional layer 600, the second functional layer 1100, and the cathode layer 1200 distributed within this second - type pixel opening K2 can form a second - type light - emitting device.

[0152] For any third - type pixel opening K3, the anode block 510 corresponding to this third - type pixel opening K3, the third - type light - emitting part 1010 distributed within this third - type pixel opening K3, and the parts of the first functional layer 600, the second functional layer 1100, and the cathode layer 1200 distributed within this third - type pixel opening K3 can form a third - type light - emitting device.

[0153] It should be noted that the first functional layer 600 may include a hole - injection layer and a hole - transport layer arranged in a stacked manner, and the hole - injection layer is closer to the anode block 510 than the hole - transport layer. The second functional layer 1100 may include an electron - transport layer and an electron - injection layer arranged in a stacked manner, and the electron - transport layer is closer to the anode block 510 than the electron - injection layer.

[0154] In summary, the embodiment of the present application provides a manufacturing method of a display panel. A first sacrificial layer and a first light - emitting layer are formed in a stacked manner on the side of the pixel - defining layer facing away from the driving backplane. The first sacrificial layer is removed to remove the part of the first light - emitting layer overlapping with the first sacrificial layer. The part of the first light - emitting layer exposed through the first avoidance opening is at least located within the corresponding plurality of pixel openings. Thus, the part of the first light - emitting layer located within the pixel opening K correspondingly forms an organic light - emitting layer in a light - emitting device. Since there is a shadow effect during the process of forming the organic light - emitting layer in the light - emitting device by using FMM, in order to avoid the organic light - emitting layers in adjacent pixel openings from being connected together, the distance between adjacent pixel openings is relatively large. However, when using the first sacrificial layer to form the organic light - emitting layer in the light - emitting device, the shadow effect does not need to be considered. The part of the first light - emitting layer located outside the pixel opening is removed along with the first sacrificial layer, and the organic light - emitting layers in the pixel openings will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings in the method using the first sacrificial layer can be smaller, which can effectively improve the pixel density and pixel aperture ratio of the display panel.

[0155] Please refer to Figure 16 , Figure 16 which is a flowchart of another manufacturing method of a display panel provided by an embodiment of the present application.

[0156] Step 301: Provide a driving backplane.

[0157] This step can refer to the above step 201 and will not be elaborated here.

[0158] Step 302: Form an anode layer on one side of the driving backplane.

[0159] Please refer to Figure 17 , Figure 17 which Figure 16 is a schematic diagram of a film layer structure after forming the anode layer in the method shown in

[0160] . Among them, the anode layer 500 includes: a plurality of anode blocks 510 arranged separately, and a plurality of auxiliary electrodes 520 arranged separately from the anode blocks 510. And the plurality of anode blocks 510 and the plurality of auxiliary electrodes 520 are electrically connected to the driving backplane 100. Exemplarily, the plurality of anode blocks 510 can be electrically connected to a plurality of pixel driving circuits in the driving backplane, and the plurality of auxiliary electrodes 520 can be electrically connected to the cathode signal lines in the driving backplane.

[0161] The forming process of the plurality of anode blocks 510 and the plurality of auxiliary electrodes 520 can include: depositing an anode layer on one side of the driving backplane, and performing a patterning process on the anode layer to form a plurality of anode blocks arranged separately and a plurality of auxiliary electrodes arranged separately from the anode blocks.

[0162] Step 303: Form a pixel definition layer on the side of the anode layer facing away from the driving backplane.

[0163] Exemplarily, please refer to Figure 18 , Figure 18 which Figure 16 is a schematic diagram of a film layer structure after forming the pixel definition layer in the method shown in

[0164] . The pixel definition layer 200 has a plurality of pixel openings K and a plurality of first auxiliary openings F, and at least one first auxiliary opening F is distributed between two adjacent pixel openings K.

[0165] Step 304: Form a first sacrificial layer on the side of the pixel definition layer facing away from the driving backplane.

[0166] This forming process may include: forming a first sacrificial layer thin film on the side of the pixel definition layer facing away from the driving backplane, and patterning the first sacrificial layer thin film to form the first sacrificial layer.

[0167] The process of patterning the first sacrificial layer thin film may include: coating a photoresist layer on the side of the first sacrificial layer facing away from the driving backplane, performing exposure and development processes on the photoresist layer, etching the first sacrificial layer coated with the photoresist to form a plurality of first avoidance openings. Stripping the photoresist layer on the side of the first sacrificial layer facing away from the driving backplane to form a patterned first sacrificial layer.

[0168] Exemplarily, please refer to Figure 19 , Figure 19 is Figure 16 a schematic diagram of a film layer structure after forming the first sacrificial layer in the method shown. The first sacrificial layer 300 has a plurality of first avoidance openings 310, the plurality of first avoidance openings 310 correspond to the plurality of pixel openings K one by one, and the orthographic projection of the first avoidance openings 310 on the driving backplane 100 overlaps with the orthographic projection of the corresponding pixel openings K on the driving backplane 100.

[0169] Step 305: Form a first functional layer on the side of the first sacrificial layer facing away from the driving backplane.

[0170] Please refer to Figure 20 , Figure 20 is Figure 19 a schematic diagram of a film layer structure for forming the first functional layer on the display panel shown. The first functional layer 600 is a thin film formed by full-layer evaporation, and the first functional layer 600 is connected to the side of the plurality of anode blocks 510 facing away from the driving backplane 100.

[0171] Step 306: Form a first light-emitting layer on the side of the first functional layer facing away from the driving backplane.

[0172] The process of forming the first light-emitting layer may include: the organic light-emitting material passes through the holes in the FMM and is deposited at least in the plurality of pixel openings K to form a plurality of first light-emitting blocks. Here, among the plurality of first light-emitting blocks, there may be first light-emitting blocks for emitting different colors. In this case, the plurality of first light-emitting blocks for emitting the same color are made of one FMM. Exemplarily, if there are a plurality of first light-emitting blocks for emitting red, green, and blue colors among the plurality of first light-emitting blocks, these three first light-emitting blocks are made of three different FMMs respectively.

[0173] Exemplarily, please refer to Figure 21 , Figure 21 is inFigure 20 Schematic diagram of the film layer structure for forming the first light-emitting layer on the display panel shown. The first light-emitting layer 400 includes: a plurality of first light-emitting blocks 400a. The plurality of first light-emitting blocks 400a correspond one-to-one with the plurality of first avoidance openings 310 and also correspond one-to-one with the plurality of pixel openings K. The orthographic projection of the first avoidance opening 310 on the driving backplane 100 is located within the orthographic projection of the corresponding first light-emitting block 400a on the driving backplane 100, and the orthographic projection of the first light-emitting block 400a on the driving backplane 100 intersects with the orthographic projection of the first sacrificial layer 300 on the driving backplane 100.

[0174] Wherein, the part of the first light-emitting block 400a exposed through the corresponding first avoidance opening 310 is at least located within the corresponding pixel opening K.

[0175] It should be noted that the material in the first sacrificial layer 300 contains water and oxygen, or water and oxygen may be generated during the reaction between the first sacrificial layer 300 and the target gas. However, since there is a first functional layer 600 formed by whole-layer evaporation between the first sacrificial layer 300 and the first light-emitting layer 400, the first sacrificial layer 300 and the first light-emitting layer 400 do not contact. Therefore, water and oxygen will not erode the first light-emitting layer 400 made of organic light-emitting materials, thus enabling the display panel to have a better display effect.

[0176] Step 307: Form a second functional layer on the side of the first light-emitting layer facing away from the driving backplane.

[0177] Please refer to Figure 22 , Figure 22 which is Figure 21 a schematic diagram of the film layer structure for forming the second functional layer on the display panel shown. The second functional layer 1100 is a film formed by whole-layer evaporation.

[0178] Step 308: Remove the first sacrificial layer.

[0179] The process of removing the first sacrificial layer can refer to the above-mentioned step 101 and will not be elaborated here.

[0180] Please refer to Figure 23 , Figure 23 which is Figure 22 a schematic diagram of the film layer structure of the display panel after removing the first sacrificial layer, Figure 28 which is Figure 27 a schematic diagram of the film layer structure for forming the cathode layer on the display panel shown. During the process of removing the first sacrificial layer 300, the parts of the first functional layer 600, the first light-emitting block 400a, and the second functional layer 1100 that overlap with the first sacrificial layer 300 are removed, and the first functional layer 600, the first light-emitting block 400a, and the second functional layer 1100 are patterned by removing the first sacrificial layer so that the side of the auxiliary electrode 320 facing away from the driving backplane 100 is exposed.

[0181] Step 309: Form a cathode layer on the side of the second functional layer facing away from the driving backplane.

[0182] Please refer to Figure 24 , Figure 24 is a schematic diagram of the film layer structure for forming the cathode layer on the display panel shown in Figure 22 . On the driving backplane with the patterned second functional layer 1100 formed thereon, a cathode layer 1200 formed by full-layer evaporation is formed. Since the side of the auxiliary electrode 320 facing away from the driving backplane 100 can be exposed, the cathode layer 1200 can be overlapped with the auxiliary electrode 320 through a plurality of first auxiliary openings F. In this way, a plurality of auxiliary electrodes 520 can apply a cathode signal to the cathode layer 1200 provided in a whole layer, thereby avoiding the obvious voltage drop at the position farther from the power supply point in the cathode layer 1200 provided in a whole layer, and further causing the obvious phenomenon of uneven light emission of the display panel.

[0183] In addition, even if the first light-emitting layer 400 is formed by FMM evaporation, as shown in Figure 21 , the edges of a plurality of first light-emitting blocks 400a will overlap due to the shadow effect. However, since the edges of a plurality of first light-emitting blocks 400a overlap with the first sacrificial layer 300, during the process of removing the first sacrificial layer 300, the overlapping edges of the plurality of first light-emitting blocks 400a are removed together with the first sacrificial layer. Therefore, for the display panel formed by the method shown in Figure 16 , the distance between the pixel openings K can be reduced, and the pixel density of the display panel can be improved. And the part of the light-emitting block 400a located in a plurality of pixel openings K will not have color mixing, and the display effect of the display panel is better.

[0184] In summary, the embodiment of the present application provides a manufacturing method of a display panel. A first sacrificial layer and a first light-emitting layer are stacked and formed on the side of the pixel definition layer facing away from the driving backplane. The first sacrificial layer is removed to remove the overlapping part of the first light-emitting layer with the first sacrificial layer. At least the part of the first light-emitting layer exposed through the first avoidance opening is located within the corresponding plurality of pixel openings. In this way, the first light-emitting layer located within the pixel opening K correspondingly forms an organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the process of forming the organic light-emitting layer in the light-emitting device by using FMM, in order to avoid the connection of the organic light-emitting layers in adjacent pixel openings, the distance between adjacent pixel openings is relatively large. However, when using the first sacrificial layer to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer located outside the pixel opening is removed along with the first sacrificial layer, and the first light-emitting layer within the pixel opening will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings can be smaller in the method using the first sacrificial layer, and the pixel density and pixel aperture ratio of the display panel can be effectively improved.

[0185] Please refer to Figure 25 , Figure 25 which is a flowchart of still another method for manufacturing a display panel provided by an embodiment of the present application.

[0186] Step 401: Provide a driving backplane.

[0187] This step can refer to the above step 201, and will not be elaborated here.

[0188] Step 402: Form an anode layer on one side of the driving backplane.

[0189] This step can refer to the above step 302, and will not be elaborated here.

[0190] Step 403: Form a pixel definition layer on the side of the anode layer facing away from the driving backplane.

[0191] This step can refer to the above step 303, and will not be elaborated here.

[0192] Step 404: Form a first sacrificial layer on the side of the pixel definition layer facing away from the driving backplane.

[0193] This forming process may include: forming a first sacrificial layer film on the side of the pixel definition layer facing away from the driving backplane, and patterning the first sacrificial layer film to form the first sacrificial layer.

[0194] The process of patterning the first sacrificial layer film may include: coating a photoresist layer on the side of the first sacrificial layer facing away from the driving backplane, performing exposure processing and development processing on the photoresist layer, etching the first sacrificial layer coated with the photoresist to form a plurality of first avoidance openings and a plurality of second auxiliary openings. Stripping the photoresist layer on the side of the first sacrificial layer facing away from the driving backplane to form a patterned first sacrificial layer.

[0195] Exemplarily, please refer to Figure 26 , Figure 26 which Figure 25 is a schematic diagram of a film layer structure after forming the first sacrificial layer in the method shown. The first sacrificial layer 300 has a plurality of first avoidance openings 310 and a plurality of second auxiliary openings 320. The plurality of first avoidance openings 310 correspond to a plurality of pixel openings K one by one, and the orthographic projection of the first avoidance openings 310 on the driving backplane 100 overlaps with the orthographic projection of the corresponding pixel openings K on the driving backplane 100; the plurality of second auxiliary openings 320 correspond to a plurality of auxiliary electrodes 520 one by one, and the orthographic projection of the second auxiliary openings 320 on the driving backplane 100 is located within the orthographic projection of the auxiliary electrodes 520 on the driving backplane 100.

[0196] It should be noted that the part of the cathode layer within the pixel opening and the part of the cathode layer within the first auxiliary opening need to be connected together. Therefore, in order to avoid the simultaneous removal of the part of the cathode layer connecting these two parts and the first sacrificial layer during the removal of the first sacrificial layer, the first avoidance opening and the second auxiliary opening in the first sacrificial layer are in communication, so that after the first sacrificial layer is removed, the part of the cathode layer overlapping with the first avoidance opening and the part overlapping with the second auxiliary opening can be connected together.

[0197] Step 405: Form a first functional layer on the side of the first sacrificial layer facing away from the driving backplane.

[0198] Please refer to Figure 27 , Figure 27 is a schematic diagram of the film layer structure for forming the first functional layer on the display panel shown in Figure 26 . The first functional layer 600 is patterned by the FMM, and the material of the first functional layer 600 passes through the holes in the FMM and is deposited at least in a plurality of pixel openings K. In this case, since the auxiliary electrode 520 needs to be electrically connected to the cathode layer formed subsequently, the orthographic projection of the first functional layer 600 on the driving backplane 100 does not coincide with the orthographic projection of the second auxiliary opening 320 on the driving backplane 100.

[0199] Step 406: Form a first light-emitting layer on the side of the first functional layer facing away from the driving backplane.

[0200] The process of forming the first light-emitting layer may include: the organic light-emitting material passes through the holes in the FMM and is deposited at least in a plurality of pixel openings to form a plurality of first light-emitting blocks. Here, the plurality of first light-emitting blocks may include a plurality of first light-emitting blocks for emitting different colors. In this case, the plurality of first light-emitting blocks for emitting the same color are made of one FMM. Exemplarily, if the plurality of first light-emitting blocks include a plurality of first light-emitting blocks for emitting red, green, and blue colors, these three first light-emitting blocks are made of three different FMMs respectively.

[0201] Exemplarily, please refer to Figure 28 , Figure 28 is in Figure 27Schematic diagram of the film layer structure for forming the first light-emitting layer on the display panel shown. The first light-emitting layer 400 includes: a plurality of first light-emitting blocks 400a. The plurality of first light-emitting blocks 400a correspond one-to-one with the plurality of first avoidance openings 310 and also correspond one-to-one with the plurality of pixel openings K. The orthographic projection of the first avoidance opening 310 on the driving backplane 100 is located within the orthographic projection of the corresponding first light-emitting block 400a on the driving backplane 100, and the orthographic projection of the first light-emitting block 400a on the driving backplane 100 intersects with the orthographic projection of the first sacrificial layer 300 on the driving backplane 100. Since the auxiliary electrode 520 needs to be electrically connected to the cathode layer formed subsequently, the orthographic projection of the first light-emitting block 400a on the driving backplane 100 does not coincide with the orthographic projection of the second auxiliary opening 320 on the driving backplane 100.

[0202] Among them, the part of the first light-emitting block 400a exposed through the corresponding first avoidance opening 310 is at least located within the corresponding pixel opening K.

[0203] Step 407: Form a second functional layer on the side of the first light-emitting layer facing away from the driving backplane.

[0204] Please refer to Figure 29 , Figure 29 which is Figure 28 a schematic diagram of the film layer structure for forming the second functional layer on the display panel shown. The second functional layer 1100 is patterned by the FMM, and the material of the second functional layer 1100 passes through the holes in the FMM and is deposited at least in the plurality of pixel openings K. In this case, the orthographic projection of the second functional layer 1100 on the driving backplane 100 does not coincide with the orthographic projection of the second auxiliary opening 320 on the driving backplane 100.

[0205] Step 408: Form a cathode layer on the side of the second functional layer facing away from the driving backplane.

[0206] Please refer to Figure 30 , Figure 30 which is Figure 29 a schematic diagram of the film layer structure for forming the cathode layer on the display panel shown. A cathode layer 1200 with a full-layer evaporation coating is formed on the driving backplane on which the second functional layer 1100 is formed.

[0207] Step 409: Remove the first sacrificial layer.

[0208] The process of removing the first sacrificial layer can refer to the above step 101 and will not be elaborated here.

[0209] Please refer to Figure 31 , Figure 31 which is Figure 30Schematic diagram of the film layer structure after removing the first sacrificial layer in the shown display panel. During the process of removing the first sacrificial layer 300, the overlapping parts of the first functional layer 310, the first light-emitting block 400a, the second functional layer 1100, and the cathode layer 1200 with the first sacrificial layer 300 are removed. And the part of the cathode layer 1200 overlapping with the first avoidance opening 310 can be connected to the cathode layer 1200 in the second auxiliary opening 320, so that the auxiliary electrode 520 can apply a cathode signal to the part of the cathode layer 1200 overlapping with the first avoidance opening 310.

[0210] It should be noted that since multiple auxiliary electrodes 520 can apply a cathode signal to the cathode layer 1200, the voltage drop at the position farther from the power supply point in the entire cathode layer 1200 arranged in a layer is avoided, and thus the phenomenon of obvious uneven light emission of the display panel is prevented.

[0211] In addition, even if the first light-emitting layer 400 is formed by FMM evaporation, the edges of multiple first light-emitting blocks 400a will overlap due to the shadow effect. However, since the edges of multiple first light-emitting blocks 400a overlap with the first sacrificial layer 300, during the process of removing the first sacrificial layer 300, the overlapping edges of multiple first light-emitting blocks 400a are removed together with the first sacrificial layer. Therefore, Figure 25 For the display panel formed by the method shown, the distance between pixel openings K can be reduced, and the pixel density of the display panel can be increased. And the part of the light-emitting block 400a located in multiple pixel openings K will not have color mixing, and the display effect of the display panel is better.

[0212] In summary, the embodiment of the present application provides a manufacturing method of a display panel. A first sacrificial layer and a first light-emitting layer are stacked on the side of the pixel definition layer away from the driving backplane. The first sacrificial layer is removed to remove the part of the first light-emitting layer overlapping with the first sacrificial layer. The part of the first light-emitting layer exposed through the first avoidance opening is at least located within the corresponding multiple pixel openings. In this way, the first light-emitting layer located within the pixel opening K correspondingly forms an organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the process of forming the organic light-emitting layer in the light-emitting device by FMM, in order to prevent the organic light-emitting layers in adjacent pixel openings from being connected together, the distance between adjacent pixel openings is relatively large. However, when using the first sacrificial layer to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer located outside the pixel opening is removed together with the first sacrificial layer, and the first light-emitting layers within the pixel openings will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings can be smaller in the method using the first sacrificial layer, and the pixel density and pixel aperture ratio of the display panel can be effectively increased.

[0213] Please refer to Figure 32 ,Figure 32 It is a flowchart of a manufacturing method of a display panel provided by another embodiment of the present application.

[0214] Step 501: Provide a driving backplane.

[0215] This step can refer to the above step 201 and will not be elaborated here.

[0216] Step 502: Form an anode layer on one side of the driving backplane.

[0217] This step can refer to the above step 202 and will not be elaborated here.

[0218] Step 503: Form a pixel definition layer on the side of the anode layer facing away from the driving backplane.

[0219] This step can refer to the above step 203 and will not be elaborated here.

[0220] Step 504: Form a first sacrificial layer on the side of the pixel definition layer facing away from the driving backplane.

[0221] This forming process may include: forming a first sacrificial layer film on the side of the pixel definition layer facing away from the driving backplane, and performing patterning on the first sacrificial layer film to form the first sacrificial layer.

[0222] The process of patterning the first sacrificial layer film may include: coating a photoresist layer on the side of the first sacrificial layer facing away from the driving backplane, performing exposure and development on the photoresist layer, etching the first sacrificial layer coated with the photoresist to form a plurality of first avoidance openings. Stripping the photoresist layer on the side of the first sacrificial layer facing away from the driving backplane to form a patterned first sacrificial layer.

[0223] Exemplarily, please refer to Figure 33 , Figure 33 is Figure 32 a schematic diagram of a film layer structure after forming the first sacrificial layer in the method shown. The first sacrificial layer 300 has a plurality of first avoidance openings 310, and the plurality of first avoidance openings 310 correspond to a plurality of pixel openings K one by one, and the orthographic projection of the first avoidance openings 310 on the driving backplane 100 overlaps with the orthographic projection of the corresponding pixel openings K on the driving backplane 100.

[0224] Step 505: Form a stacked first functional layer and a first light-emitting layer on the side of the first sacrificial layer facing away from the driving backplane.

[0225] This forming process may include: depositing the first functional layer in a whole layer on the side of the first sacrificial layer facing away from the driving backplane, and depositing the first light-emitting layer in a whole layer on the side of the first functional layer facing away from the driving backplane.

[0226] Exemplarily, please refer toFigure 34 , Figure 34 is a schematic diagram of a film layer structure for forming a first functional layer on the display panel shown in Figure 33 . At least a part of the first functional layer 600 and the first light-emitting layer 400 is located within a plurality of pixel openings K.

[0227] Step 506: Remove the first sacrificial layer to form a first sub-light-emitting part.

[0228] The process of removing the first sacrificial layer can refer to the above-mentioned step 101 and will not be elaborated here.

[0229] It should be noted that, please refer to Figure 35 , Figure 35 is Figure 34 a schematic diagram of the film layer structure of the display panel after removing the first sacrificial layer. Since the first light-emitting layer 400 is an organic light-emitting thin film deposited as a whole layer, and the first avoidance opening 310 corresponds to each of the plurality of pixel openings K one by one, therefore, after removing the first sacrificial layer 300, the part of the first light-emitting layer 400 located within the plurality of pixel openings K is exposed through the first avoidance opening 310, and the part of the first light-emitting layer 400 exposed through the first avoidance opening 310 is the first sub-light-emitting part 400b. The plurality of first sub-light-emitting parts 400b correspond to the plurality of pixel openings K one by one, and at least a part of the first sub-light-emitting part 400b is located within the pixel opening K.

[0230] Similarly, the part of the first functional layer 600 overlapping with the first sacrificial layer 300 is removed together with the first sacrificial layer 300.

[0231] Step 507: Form a second sacrificial layer and a second light-emitting layer stacked on the side of the first sub-light-emitting part facing away from the driving backplane.

[0232] This forming process may include: forming a second sacrificial layer thin film on the side of the first sub-light-emitting part facing away from the driving backplane, and performing patterning on the second sacrificial layer thin film to form a second sacrificial layer; forming a patterned second light-emitting layer on the side of the second sacrificial layer facing away from the driving backplane.

[0233] Here, the process of patterning the second sacrificial layer thin film may include: coating a photoresist layer on the side of the second sacrificial layer facing away from the driving backplane, performing exposure and development on the photoresist layer, etching the second sacrificial layer coated with the photoresist to form a plurality of second avoidance openings. Stripping the photoresist layer on the side of the third sacrificial layer facing away from the driving backplane to form a patterned second sacrificial layer.

[0234] The process of forming the patterned second light-emitting layer may include: patterning the second light-emitting layer through an FMM, and the second light-emitting layer material passes through the holes in the FMM and is deposited at least in a plurality of pixel openings.

[0235] Exemplarily, please refer to Figure 36 , Figure 36 which is a schematic diagram of a film layer structure in which a second sacrificial layer and a second light-emitting layer are stacked on the display panel shown in Figure 35 . Among them, the second sacrificial layer 700 is closer to the driving backplane 100 than the second light-emitting layer 800, and the second sacrificial layer 700 has a plurality of second avoidance openings 710. The second avoidance openings 710 correspond to a part of the pixel openings K among the plurality of pixel openings K, and the orthographic projection of the second avoidance openings 710 on the driving backplane 100 overlaps with the orthographic projection of the corresponding pixel openings K on the driving backplane 100.

[0236] The second light-emitting layer 800 includes: a plurality of second light-emitting blocks 800a. The plurality of second light-emitting blocks 800a correspond one-to-one with the plurality of second avoidance openings 710. The orthographic projection of the second avoidance openings 710 on the driving backplane 100 is located within the orthographic projection of the corresponding second light-emitting blocks 800a on the driving backplane 100, and the orthographic projection of the second light-emitting blocks 800a on the driving backplane 100 overlaps with the orthographic projection of the second sacrificial layer 700 on the driving backplane 100.

[0237] Step 508: Remove the second sacrificial layer.

[0238] The process of removing the second sacrificial layer can refer to the above step 208 and will not be elaborated here.

[0239] Please refer to Figure 37 , Figure 37 which is a schematic diagram of the film layer structure of the display panel shown in Figure 36 after removing the second sacrificial layer. During the process of removing the second sacrificial layer 700, the part of the second light-emitting blocks 800a that overlaps with the second sacrificial layer 700 is removed together, so that the part of the second light-emitting blocks 800a exposed through the second avoidance openings 710 is at least located within the corresponding pixel openings K.

[0240] Here, the plurality of pixel openings K may include: a plurality of first-type pixel openings K1, a plurality of second-type pixel openings K2, and a plurality of third-type pixel openings K3. Among them, the part of the second light-emitting blocks 800a located within the first-type pixel openings K1 is the second sub-light-emitting part 800b, and the part of the second light-emitting blocks 800a located within the second-type pixel openings K2 is the third sub-light-emitting part 800c.

[0241] In this case, the first sub-light-emitting part 400b and the second sub-light-emitting part 800b which are stacked are distributed in the first type of pixel opening K1; the first sub-light-emitting part 400b and the third sub-light-emitting part 800c which are stacked are distributed in the second type of pixel opening K2; the first sub-light-emitting part 400b is distributed in the third type of pixel opening K3. Exemplarily, the first sub-light-emitting part 400b can be used to emit green light, the second sub-light-emitting part 800b can be used to emit red light, and the third sub-light-emitting part 800c can be used to emit blue light.

[0242] It should be noted that since the first sub-light-emitting part 400b capable of emitting green light is distributed in the first type of pixel opening K1 and the second type of pixel opening K2, and the light-emitting devices corresponding to the first type of pixel opening K1 and the second type of pixel opening K2 are respectively used to emit red and blue light, therefore, in order to reduce the proportion of green light in the light emitted by the light-emitting devices corresponding to the first type of pixel opening K1 and the second type of pixel opening K2, the anode block 510 can have a microcavity structure for filtering the green light in the light emitted by the light-emitting devices corresponding to the first type of pixel opening K1 and the second type of pixel opening K2.

[0243] It should also be noted that, please refer to Figure 38 and Figure 39 , Figure 38 is a top view of a display panel provided by an embodiment of the present application, Figure 39 is a top view of another display panel provided by an embodiment of the present application. The arrangement manner and size of the first type of pixel opening K1, the second type of pixel opening K2 and the third type of pixel opening K3 can refer to Figure 38 and Figure 39 . Since the orthographic projection of the third type of pixel opening K3 on the driving backplane 100 is located in the orthographic projection of the second sacrificial layer 700 on the driving backplane 100, therefore, when the distance between the first type of pixel opening K1 and the third type of pixel opening K3 is small, and the distance between the second type of pixel opening K2 and the third type of pixel opening K3 is small, during the formation of the second light-emitting layer 800, even if the material of the second light-emitting layer 800 covers the part of the second sacrificial layer 700 that overlaps with the third type of pixel opening K3 due to the shadow effect, after removing the second sacrificial layer 700, the material of this part of the second light-emitting layer 800 is removed together with the second sacrificial layer 700. In this way, the distance between the first sub-light-emitting part 400b and the second sub-light-emitting part 800b located in the third type of pixel opening K3 can be effectively reduced, and the distance between the first sub-light-emitting part 400b and the third sub-light-emitting part 800c located in the third type of pixel opening K3 can be effectively reduced, and thus the pixel density and pixel aperture ratio of the display panel 000 can be effectively improved.

[0244] In addition, when the distance between the first type of pixel opening K1 and the second type of pixel opening K2 is small, even if the first light-emitting layer 400 is formed by FMM evaporation coating, the edges of multiple second light-emitting blocks 800a will overlap due to the shadow effect. However, since the edges of multiple second light-emitting blocks 800a overlap with the second sacrificial layer 700, during the process of removing the second sacrificial layer 700, the overlapping edges of multiple second light-emitting blocks 800a are removed together with the second sacrificial layer 700. Therefore, for the display panel formed by the method shown in Figure 32 , the distance between the first type of pixel opening K1 and the second type of pixel opening K2 can be further reduced, and the pixel density and pixel aperture ratio of the display panel can be further improved. Moreover, color crosstalk does not occur in the portions of the second light-emitting block 800a located in the first type of pixel opening K1 and the second type of pixel opening K2, and the display effect of the display panel is good.

[0245] Step 509: Form a second functional layer and a cathode layer which are stacked on the side of the second light-emitting layer facing away from the driving backplane.

[0246] The forming process of this step may include: forming a second functional layer on the side of the second light-emitting layer facing away from the driving backplane, and forming a cathode layer on the side of the second functional layer facing away from the driving backplane. Exemplarily, please refer to Figure 40 , Figure 40 which is Figure 37 a schematic diagram of the film layer structure of forming the second functional layer and the cathode layer on the display panel shown. The second functional layer 1100 is closer to the driving backplane than the cathode layer 1200, and both the second functional layer 1100 and the cathode layer 1200 are film layers formed by whole-layer evaporation coating.

[0247] In summary, the embodiment of the present application provides a manufacturing method of a display panel. A first sacrificial layer and a first light-emitting layer which are stacked are formed on the side of the pixel definition layer facing away from the driving backplane. The first sacrificial layer is removed to remove the overlapping part of the first light-emitting layer with the first sacrificial layer. At least the part of the first light-emitting layer exposed through the first avoidance opening is located within the corresponding multiple pixel openings. In this way, the first light-emitting layer located within the pixel opening K correspondingly forms the organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the process of forming the organic light-emitting layer in the light-emitting device by using FMM, in order to avoid the connection of the organic light-emitting layers in adjacent pixel openings, the distance between adjacent pixel openings is large. However, when using the first sacrificial layer to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer located outside the pixel opening is removed along with the first sacrificial layer, and the first light-emitting layer within the pixel opening will not be connected together. Therefore, compared with the method using FMM, the distance between adjacent pixel openings in the method using the first sacrificial layer can be smaller, and the pixel density and pixel aperture ratio of the display panel can be effectively improved.

[0248] Please refer to Figure 41 , Figure 41 which is a flowchart of another manufacturing method of a display panel provided by another embodiment of the present application.

[0249] Step 601: Provide a driving backplane.

[0250] This step can refer to the above step 201 and will not be elaborated here.

[0251] Step 602: Form an anode layer on one side of the driving backplane.

[0252] This step can refer to the above step 302 and will not be elaborated here.

[0253] Step 603: Form a pixel definition layer on the side of the anode layer facing away from the driving backplane.

[0254] This step can refer to the above step 303 and will not be elaborated here.

[0255] Step 604: Form a first sacrificial layer on the side of the pixel definition layer facing away from the driving backplane.

[0256] This step can refer to the above step 304 and will not be elaborated here.

[0257] Step 605: Form a first functional layer and a first light-emitting layer on the side of the first sacrificial layer facing away from the driving backplane.

[0258] This step can refer to the above step 505 and will not be elaborated here.

[0259] It should be noted that, please refer to Figure 42 , Figure 42 which Figure 41 is another schematic diagram of a film layer structure for forming the first functional layer in the method shown. At least a part of the first functional layer 600 and the first light-emitting layer 400 is located within a plurality of pixel openings K. Since the side of the auxiliary electrode 520 facing away from the driving backplane 100 needs to be exposed to be electrically connected to the subsequently formed cathode layer. Therefore, the orthographic projection of the plurality of first auxiliary openings F on the driving backplane 100 is located within the orthographic projection of the first sacrificial layer 300 on the driving backplane 100, so that after removing the first sacrificial layer 300, the side of the auxiliary electrode 520 facing away from the driving backplane 100 is exposed.

[0260] Step 606: Remove the first sacrificial layer to form a first sub-light-emitting part.

[0261] This step can refer to the above step 506 and will not be elaborated here.

[0262] It should be noted that, please refer to Figure 43 , Figure 43 which Figure 42Schematic diagram of the film layer structure of the display panel with the first sacrificial layer removed. Since the orthographic projection of the multiple first auxiliary openings F on the driving backplane 100 is located within the orthographic projection of the first sacrificial layer 300 on the driving backplane 100, therefore, after removing the first sacrificial layer 300, the side of the auxiliary electrode 520 facing away from the driving backplane 100 is exposed.

[0263] Step 607: Form a second sacrificial layer and a second light-emitting layer stacked on the side of the first sub-light-emitting part facing away from the driving backplane.

[0264] This step can refer to the above step 507 and will not be elaborated here.

[0265] It should be noted that please refer to Figure 44 , Figure 44 is the schematic diagram of the film layer structure of the second sacrificial layer and the second light-emitting layer stacked on the display panel shown in Figure 43 . Since the side of the auxiliary electrode 520 facing away from the driving backplane 100 needs to be exposed to be electrically connected to the subsequent formed cathode layer. For this reason, the orthographic projection of the multiple first auxiliary openings F on the driving backplane 100 is located within the orthographic projection of the second sacrificial layer 700 on the driving backplane 100, so that after removing the second sacrificial layer 700, the side of the auxiliary electrode 520 facing away from the driving backplane 100 is exposed.

[0266] Step 608: Remove the second sacrificial layer.

[0267] This step can refer to the above step 508 and will not be elaborated here.

[0268] Please refer to Figure 45 , Figure 45 is the schematic diagram of the film layer structure of the display panel with the second sacrificial layer removed shown in Figure 44 . Please refer to Figure 38 and Figure 39, since the orthographic projection of the third type of pixel opening K3 on the driving backplane 100 is located within the orthographic projection of the second sacrificial layer 700 on the driving backplane 100, when the distance between the first type of pixel opening K1 and the third type of pixel opening K3 is small and the distance between the second type of pixel opening K2 and the third type of pixel opening K3 is small, during the formation of the second light-emitting layer 800, even if the material of the second light-emitting layer 800 covers the portion of the second sacrificial layer 700 that overlaps with the third type of pixel opening K3 due to the shadow effect, after removing the second sacrificial layer 700, the material of this portion of the second light-emitting layer 800 is removed together with the second sacrificial layer 700. In this way, the distance between the first sub-light-emitting portion 400b and the second sub-light-emitting portion 800b located in the third type of pixel opening K3 can be effectively reduced, and the distance between the first sub-light-emitting portion 400b and the third sub-light-emitting portion 800c located in the third type of pixel opening K3 can be effectively reduced. Furthermore, the pixel density and pixel aperture ratio of the display panel 000 can be effectively improved.

[0269] In addition, when the distance between the first type of pixel opening K1 and the second type of pixel opening K2 is small, even if the first light-emitting layer 400 is formed by FMM evaporation, the edges of multiple second light-emitting blocks 800a will overlap due to the shadow effect. However, since the edges of multiple second light-emitting blocks 800a overlap with the second sacrificial layer 700, during the removal of the second sacrificial layer 700, the overlapping edges of multiple second light-emitting blocks 800a are removed together with the second sacrificial layer 700. Therefore, for the display panel formed by the method Figure 32 shown, the distance between the first type of pixel opening K1 and the second type of pixel opening K2 can also be reduced, further improving the pixel density and pixel aperture ratio of the display panel. Moreover, the portions of the second light-emitting block 800a located in the first type of pixel opening K1 and the second type of pixel opening K2 do not experience color bleeding, and the display effect of the display panel is good.

[0270] Step 609: Form a second functional layer and a cathode layer stacked on the side of the second light-emitting layer facing away from the driving backplane.

[0271] The formation process of this step may include: forming a patterned second functional layer on the side of the second light-emitting layer facing away from the driving backplane, and forming a cathode layer on the side of the second functional layer facing away from the driving backplane. Among them, the process of forming the patterned second functional layer may include: patterning the second light-emitting layer through an FMM, and the material of the second light-emitting layer passes through the holes in the FMM and is deposited at least in multiple pixel openings. Exemplarily, please refer to Figure 46 , Figure 46 is at Figure 45Schematic diagram of a film layer structure for forming a second functional layer and a cathode layer on the shown display panel. The orthographic projection of the second functional layer 1100 on the driving backplane 100 does not overlap with the orthographic projection of the first auxiliary opening F on the driving backplane 100. In this case, the side of the auxiliary electrode 520 facing away from the driving backplane 100 is exposed and can be electrically connected to the cathode layer 1200. Since a plurality of auxiliary electrodes 520 can apply a cathode signal to the cathode layer 1200 provided as a whole layer, it is thus avoided that the voltage drop at a position farther from the power supply point in the cathode layer 1200 provided as a whole layer is more obvious, thereby causing an obvious phenomenon of uneven light emission in the display panel.

[0272] In summary, the embodiment of the present application provides a manufacturing method of a display panel. A first sacrificial layer and a first light-emitting layer are formed in a stacked manner on a side of the pixel definition layer facing away from the driving backplane. The first sacrificial layer is removed to remove the part of the first light-emitting layer overlapping with the first sacrificial layer. The part of the first light-emitting layer exposed through the first avoidance opening is at least located within the corresponding plurality of pixel openings. In this way, the part of the first light-emitting layer located within the pixel opening K correspondingly forms an organic light-emitting layer in a light-emitting device. Since there is a shadow effect during the process of forming the organic light-emitting layer in the light-emitting device by using an FMM, in order to avoid the organic light-emitting layers in adjacent pixel openings being connected together, the distance between adjacent pixel openings is relatively large. However, when using the first sacrificial layer to form the organic light-emitting layer in the light-emitting device, the shadow effect does not need to be considered. The part of the first light-emitting layer located outside the pixel opening is removed along with the first sacrificial layer, and the first light-emitting layer within the pixel opening will not be connected together. Therefore, compared with the method using an FMM, the distance between adjacent pixel openings in the method using the first sacrificial layer can be smaller, and the pixel density and pixel aperture ratio of the display panel can be effectively improved.

[0273] The embodiment of the present application further provides a display panel, which can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, an advertising machine, a display screen, a digital photo frame, etc.

[0274] It should be noted that in the drawings, the dimensions of layers and regions may be exaggerated for clarity of illustration. Moreover, it can be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be an intermediate layer. Additionally, it can be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intermediate layer or element. Additionally, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Like reference numerals throughout indicate like elements.

[0275] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "plural" means two or more unless otherwise specifically defined.

[0276] The above are only optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included within the protection scope of this application.

Claims

1. A manufacturing method of a display panel, characterized in that, The method includes: providing a driving backplane; forming a pixel definition layer on one side of the driving backplane, the pixel definition layer having a plurality of pixel openings; forming a first sacrificial layer and a first light-emitting layer which are stacked on the side of the pixel definition layer facing away from the driving backplane; the first sacrificial layer is closer to the driving backplane than the first light-emitting layer, and the first sacrificial layer has a plurality of first avoidance openings, the plurality of first avoidance openings corresponding to at least a part of the pixel openings, and a positive projection of the first avoidance openings on the driving backplane overlapping a positive projection of the corresponding pixel openings on the driving backplane; removing the first sacrificial layer to remove an overlapping part of the first light-emitting layer with the first sacrificial layer, so that a part of the first light-emitting layer exposed through the first avoidance openings is at least located within the corresponding pixel openings.

2. The manufacturing method according to claim 1, characterized in that, The first light-emitting layer is an organic light-emitting thin film formed by full-layer evaporation, the first avoidance openings correspond to first-type pixel openings among the plurality of pixel openings, a part of the first light-emitting layer exposed through the first avoidance openings is a first-type light-emitting part, and at least a part of the first-type light-emitting part is located within the first-type pixel openings.

3. The manufacturing method according to claim 2, characterized in that, The method further includes: forming a second sacrificial layer and a second light-emitting layer which are stacked on the driving backplane formed with the first-type light-emitting part; the second sacrificial layer is closer to the driving backplane than the second light-emitting layer, and the second sacrificial layer has a plurality of second avoidance openings, the second avoidance openings corresponding to second-type pixel openings among the plurality of pixel openings, and a positive projection of the second avoidance openings on the driving backplane overlapping a positive projection of the corresponding second-type pixel openings on the driving backplane; the second light-emitting layer is an organic light-emitting thin film formed by full-layer evaporation; removing the second sacrificial layer to remove an overlapping part of the second light-emitting layer with the second sacrificial layer, so that a second-type light-emitting part of the second light-emitting layer exposed through the second avoidance openings is at least located within the corresponding second-type pixel openings.

4. The manufacturing method according to claim 3, wherein The method further includes: forming a third sacrificial layer and a third light-emitting layer which are stacked on the driving backplane formed with the second-type light-emitting part; the third sacrificial layer is closer to the driving backplane than the third light-emitting layer, and the third sacrificial layer has a plurality of third avoidance openings, the third avoidance openings corresponding to third-type pixel openings among the plurality of pixel openings, and a positive projection of the third avoidance openings on the driving backplane overlapping a positive projection of the corresponding third-type pixel openings on the driving backplane; the third light-emitting layer is an organic light-emitting thin film formed by full-layer evaporation; removing the third sacrificial layer to remove an overlapping part of the third light-emitting layer with the third sacrificial layer, so that a third-type light-emitting part of the third light-emitting layer exposed through the third avoidance openings is at least located within the corresponding third-type pixel openings; wherein, colors of light emitted by the first-type light-emitting part, colors of light emitted by the second-type light-emitting part, and colors of light emitted by the third-type light-emitting part are different from each other.

5. The manufacturing method according to any one of claims 2-4, characterized in that, The method further includes: Before forming the first sacrificial layer, a first functional layer is formed on the side of the pixel defining layer facing away from the driving backplane. After removing the third sacrificial layer to remove the portion of the third light-emitting layer overlapping with the third sacrificial layer, a second functional layer and a cathode layer are formed in a stacked manner on the driving backplane where the third type of light-emitting portion is formed.

6. The manufacturing method according to claim 1, characterized in that, The first light-emitting layer includes: a plurality of first light-emitting blocks; the plurality of first light-emitting blocks correspond one-to-one with the plurality of first avoidance openings and also correspond one-to-one with a plurality of pixel openings; the positive projection of the first avoidance opening on the driving backplane is located within the positive projection of the corresponding first light-emitting block on the driving backplane, and the positive projection of the first light-emitting block on the driving backplane intersects with the positive projection of the first sacrificial layer on the driving backplane. Wherein, at least a portion of the first light-emitting block exposed through the corresponding first avoidance opening is located within the corresponding pixel opening.

7. The manufacturing method according to claim 6, characterized in that, The method further includes: After forming the first sacrificial layer and before forming the first light-emitting layer, a first functional layer is formed on the side of the first sacrificial layer facing away from the driving backplane. During the process of removing the first sacrificial layer, the first functional layer and the portion of the first light-emitting block overlapping with the first sacrificial layer are removed.

8. The manufacturing method according to claim 7, characterized in that, The method further includes: After forming the first light-emitting layer and before removing the first sacrificial layer, a second functional layer is formed on the side of the first light-emitting layer facing away from the driving backplane. During the process of removing the first sacrificial layer, the first functional layer, the first light-emitting block, and the portion of the second functional layer overlapping with the first sacrificial layer are removed. A cathode layer is formed on the driving backplane with the patterned second functional layer.

9. The manufacturing method according to claim 7, characterized in that, After forming the first light-emitting layer and before removing the first sacrificial layer, a second functional layer and a cathode layer are sequentially formed on the side of the first light-emitting layer facing away from the driving backplane. During the process of removing the first sacrificial layer, the first functional layer, the first light-emitting block, the second functional layer, and the portion of the cathode layer overlapping with the first sacrificial layer are removed.

10. The manufacturing method according to claim 8 or 9, characterized in that, The pixel defining layer further has a plurality of first auxiliary openings. The first sacrificial layer further has a plurality of second auxiliary openings. The method further includes: Before forming the pixel defining layer, an anode layer is formed on one side of the driving backplane. Wherein, the anode layer includes: a plurality of anode blocks separated from each other, and an auxiliary electrode separated from the anode blocks. The plurality of anode blocks correspond to the plurality of pixel openings, and the positive projection of the pixel opening on the driving backplane is located within the positive projection of the anode block on the driving backplane. The positive projection of the first auxiliary opening on the driving backplane is located within the positive projection of the auxiliary electrode on the driving backplane, and the positive projection of the second auxiliary opening on the driving backplane is located within the positive projection of the auxiliary electrode on the driving backplane; the positive projections of the first functional layer, the first light-emitting block, and the second functional layer on the driving backplane do not coincide with the positive projection of the second auxiliary opening on the driving backplane. The cathode layer overlaps the auxiliary electrode through the first auxiliary opening and the second auxiliary opening.

11. The manufacturing method according to claim 1, characterized in that, The first light-emitting layer is a whole layer of evaporated organic light-emitting film, the first avoidance opening corresponds to the plurality of pixel openings one by one, and the portion of the first light-emitting layer exposed through the first avoidance opening is a first sub-light-emitting portion; The plurality of first sub-light-emitting portions correspond one-to-one to the plurality of pixel openings, and at least a portion of the first sub-light-emitting portions are located in the pixel openings.

12. The manufacturing method according to claim 11, characterized in that, The method further comprises: A second sacrificial layer and a second light-emitting layer are stacked on the driving backplane formed with the first sub-light-emitting portion; the second sacrificial layer is closer to the driving backplane than the second light-emitting layer, and the second sacrificial layer has a plurality of second avoidance openings, the second avoidance openings correspond to a part of the plurality of pixel openings, and the orthographic projections of the second avoidance openings on the driving backplane overlap with the orthographic projections of the corresponding pixel openings on the driving backplane; the second light-emitting layer includes: a plurality of second light-emitting blocks; the plurality of second light-emitting blocks correspond one-to-one to the plurality of second avoidance openings; the orthographic projections of the second avoidance openings on the driving backplane are located within the orthographic projections of the corresponding second light-emitting blocks on the driving backplane, and the orthographic projections of the second light-emitting blocks on the driving backplane overlap with the orthographic projections of the second sacrificial layer on the driving backplane; The second sacrificial layer is removed to remove the portion of the second light-emitting block overlapping with the second sacrificial layer, so that the portion of the second light-emitting block exposed through the second avoidance opening is at least located within the corresponding pixel opening.

13. The manufacturing method according to claim 12, characterized in that, The plurality of pixel openings include: a plurality of first-type pixel openings, a plurality of second-type pixel openings, and a plurality of third-type pixel openings; the portion of the second light-emitting block located in the first-type pixel openings is a second sub-light-emitting portion, and the portion of the second light-emitting block located in the second-type pixel openings is a third sub-light-emitting portion; Among them, the first type of pixel openings are distributed with the first sub-light-emitting portion and the second sub-light-emitting portion arranged in a stacked manner; the second type of pixel openings are distributed with the first sub-light-emitting portion and the third sub-light-emitting portion arranged in a stacked manner; and the first sub-light-emitting portion is distributed in the third type of pixel openings.

14. The manufacturing method according to any one of claims 1-4, 6-9, 11-13, characterized in that, Removing the first sacrificial layer includes: The driving backplane formed with the first sacrificial layer and the first light-emitting layer is placed in a target gas, so that the first sacrificial layer reacts with the target gas, so that the first sacrificial layer is removed from the driving backplane.

15. A display panel, characterized in that, The display panel is manufactured by the method described in any one of claims 1 to 14; the display panel comprises: a driving backplane, a pixel definition layer and a first light-emitting layer; The pixel definition layer is located on one side of the driving backplane, and the pixel definition layer has a plurality of pixel openings; the first light-emitting layer is located on the side of the pixel definition layer away from the driving backplane, and at least part of the first light-emitting layer is located in the pixel openings.

Images