Plating device and resistor for plating device

Abstract

The present invention provides a plating device capable of improving the uniformity of the thickness of a plated film formed on a plated object. The device-use resistor is a plating device-use resistor for adjusting the electric field, disposed between an anode and a holder holding the plated object in the plating device. The plating device-use resistor comprises a plate-shaped main body having an upper surface, a lower surface, and a plurality of through-holes connecting the upper surface and the lower surface. The plating device-use resistor further comprises an insert disposed within the main body, the insert having a plurality of through-holes, and the insert being movable between a first position in which the plurality of through-holes of the insert communicate with the plurality of through-holes of the main body, and a second position in which the plurality of through-holes of the insert are not connected with the plurality of through-holes of the main body.

Description

Technical Field

[0001] The present application relates to a plating device and an impedance for the plating device. Background Art

[0002] As an example of a plating device using an electroplating method, a so-called immersion-type plating device is known, in which a substrate (e.g., a semiconductor wafer) and an anode are placed horizontally opposite each other (e.g., see Patent Document 1). Furthermore, as another example of a plating device using an electroplating method, a cup-type plating device is known (e.g., see Patent Document 2). In a cup-type plating device, a substrate held on a substrate holder is immersed in a plating solution with the surface to be plated facing downward, and a voltage is applied between the substrate and the anode, thereby depositing a conductive film (plating film) on the surface of the substrate.

[0003] In such a plating device, usually, the substrate has an electrical contact at its peripheral portion. Due to the different distances from the electrical contacts, a potential difference may be generated between the peripheral portion and the central portion of the substrate during plating, causing the plating current to deviate. Therefore, in the past, in order to improve the uniformity of the thickness of the plated film formed on the substrate, it is known to configure an impedance body for adjusting the electric field between the substrate and the anode. In addition, in order to make the electric field adjustment more extensive and free, a plating device in which the size of the hole of the impedance body is made variable has been proposed (with reference to patent documentation 3).

[0004] Patent Document 1: Japanese Patent No. 7462125

[0005] Patent Document 2: Japanese Patent No. 7079388

[0006] Patent Document 3: Japanese Patent No. 7204060

[0007] In plating devices, except the distance relationship with electric contacts, sometimes the thickness of the plated film may be caused to deviate due to the resist pattern formed on the substrate. That is, if the plated surface of the substrate includes a region (non-opening region) where a resist opening is not formed to a certain extent, the plating current does not flow through the non-opening region, and the plating current is concentrated in the peripheral portion of the non-opening region and causes the thickness of the plated film to become larger. As a specific example, when the resist opening is only formed in the region of a roughly cross-shaped area in the substrate, the uniformity of the thickness of the plated film may be damaged due to the fact that the resist opening is not formed in the region of the cross-shaped outside. Here, for example, in patent document 1, in order to adjust the electric field between the anode and the substrate, an anode mask that can adjust the size of the anode opening is used. However, the existing structure is designed to cope with the deviation of the plated film thickness caused by the structure of the plating devices such as electric contacts, and sometimes cannot fully cope with the deviation of the plated film thickness caused by the resist pattern of the substrate. To make the thickness of the plating film uniform, it is also conceivable to form dummy openings in non-opening areas. However, this requires processing for forming the dummy openings and forms unnecessary plating in the dummy openings, thereby increasing the cost of the plating process. Summary of the Invention

[0008] The present invention has been made in view of the above-mentioned problems, and one of its objects is to provide a plating apparatus capable of improving the uniformity of the thickness of a plated film formed on a plated object.

[0009] According to one embodiment, an impedance body for a plating device is provided, which is an impedance body for a plating device for adjusting the electric field and is arranged between an anode and a retaining frame for retaining a plated object in a plating device. The above-mentioned impedance body for a plating device has a plate-shaped main body, and the above-mentioned plate-shaped main body has an upper surface, a lower surface, and a plurality of through holes connecting the above-mentioned upper surface and the above-mentioned lower surface. The above-mentioned impedance body for a plating device also has an insert body arranged inside the above-mentioned main body, and the above-mentioned insert body has a plurality of through holes. The above-mentioned insert body can move between a first position in which the above-mentioned plurality of through holes of the above-mentioned insert body are connected to the plurality of through holes of the above-mentioned main body, and a second position in which the above-mentioned plurality of through holes of the above-mentioned insert body are not connected to the plurality of through holes of the above-mentioned main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a perspective view showing the overall structure of a plating apparatus according to one embodiment.

[0011] Figure 2 It is a plan view showing the overall structure of a plating apparatus according to one embodiment.

[0012] Figure 3 It is a longitudinal sectional view schematically showing the structure of a plating module according to one embodiment.

[0013] Figure 4A This is a schematic diagram of an embodiment that can be used Figure 3 A transverse cross-sectional view of the impedance body of the plating module is shown.

[0014] Figure 4B It roughly indicates Figure 4A A longitudinal cross-sectional view of the resistor is shown.

[0015] Figure 5A This is a schematic diagram of an embodiment that can be used Figure 3 A transverse cross-sectional view of the impedance body of the plating module is shown.

[0016] Figure 5B It roughly indicates Figure 5A A longitudinal cross-sectional view of the resistor is shown.

[0017] Figure 6 This is a schematic diagram of an embodiment that can be used Figure 3 A transverse cross-sectional view of the impedance body of the plating module is shown.

[0018] Figure 7 This is a schematic diagram of an embodiment that can be used Figure 3 A transverse cross-sectional view of the impedance body of the plating module is shown.

[0019] Figure 8 This is a schematic diagram of an embodiment that can be used Figure 3 A transverse cross-sectional view of the impedance body of the plating module is shown.

[0020] Figure 9A This is a schematic diagram of an embodiment that can be used Figure 3 A perspective view of a portion of an impedance body of a plating module is shown.

[0021] Figure 9B Yes Figure 9A A cross-sectional perspective view of a portion of the resistor is shown.

[0022] Figure 9C Yes Figure 9A A cross-sectional perspective view of a portion of the resistor is shown.

[0023] Figure 10 1 is a top view showing the configuration of an insert according to one embodiment.

[0024] Figure 11 1 is a top view showing the configuration of an insert according to one embodiment.

[0025] Figure 12 This is a flowchart showing an example of a method for setting an operation plan of a resistor, an anode cover, and a shielding body by a control module.

[0026] Figure 13 This is a diagram schematically showing a resist pattern formed on a surface to be plated of a substrate according to one embodiment.

[0027] Figure 14 This is a flowchart showing an example of a method for setting an operation plan of a resistor, an anode mask, and a shielding body in a plating process by a control module. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and redundant descriptions are omitted.

[0029] <Overall structure of the plating equipment>

[0030] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to this embodiment. Figure 2 : is a top view showing the overall structure of the plating device of this embodiment. Figure 1 、 2 As shown, the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wet module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , a spin dryer 600 , a transfer device 700 , and a control module 800 .

[0031] The loading port 100 is a module for loading substrates stored in a box (not shown) such as a FOUP into the plating device 1000 or unloading substrates from the plating device 1000 to the box. In this embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and arrangement of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, and the transport device 700. When transferring substrates between the transport robot 110 and the transport device 700, the substrates can be transferred via a temporary placement table (not shown).

[0032] The aligner 120 is a module for aligning the orientation plane, recess, etc. of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged in a horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 replaces the air inside the pattern formed on the substrate surface with the treatment liquid by wetting the plated surface of the substrate before the plating process with a treatment liquid such as pure water or degassed water. The pre-wet module 200 is configured to implement a pre-wet process that easily supplies the plating liquid to the interior of the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wet modules 200 are arranged in a vertical direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0033] The prepreg module 300 is configured to implement a prepreg treatment in which a treatment solution such as sulfuric acid or hydrochloric acid is used to etch away an oxide film having a large resistance, such as a seed layer surface formed on the plated surface of the substrate before the plating treatment, to clean or activate the surface of the plating substrate. In the present embodiment, two prepreg modules 300 are arranged in the vertical direction, but the number and configuration of the prepreg modules 300 are arbitrary. The plating module 400 implements a plating treatment on the substrate. In the present embodiment, a unit of 12 plating modules 400, which are arranged in three units in the vertical direction and four units in the horizontal direction, is two groups, and a total of 24 plating modules 400 are provided, but the number and configuration of the plating modules 400 are arbitrary.

[0034] The cleaning module 500 is configured to perform cleaning on the substrate in order to remove the residual plating liquid etc. on the substrate after the plating process. In the present embodiment, two cleaning modules 500 are arranged in the vertical direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for rotating the substrate after the cleaning process at high speed to dry it. In the present embodiment, two spin dryers are arranged in the vertical direction, but the number and configuration of the spin dryers are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, and for example, can be composed of a general computer or a special computer having an input and output interface with an operator.

[0035] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the loading port 100. Next, the transport robot 110 removes the substrate from the cassette in the loading port 100 and transports it to the aligner 120. The aligner 120 aligns the orientation flats, notches, and other positions of the substrate in a predetermined direction. The transport robot 110 then delivers the substrate, aligned by the aligner 120, to the transport apparatus 700.

[0036] The transport device 700 transports the substrate received from the transport robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The transport device 700 transports the pre-wetting substrate to the pre-preg module 300. The pre-preg module 300 performs a pre-preg process on the substrate. The transport device 700 transports the pre-preg substrate to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0037] The transport device 700 transports the plated substrates to the cleaning module 500. The cleaning module 500 cleans the substrates. The transport device 700 transports the cleaned substrates to the spin dryer 600. The spin dryer 600 dries the substrates. The transport device 700 hands the dried substrates to the transport robot 110. The transport robot 110 transports the substrates received from the transport device 700 to a cassette in the load port 100. Finally, the cassette containing the substrates is unloaded from the load port 100.

[0038] <Structure of the plating module>

[0039] Next, the structure of the plating module 400 will be described. In this embodiment, the 24 plating modules 400 have the same structure, so only one plating module 400 will be described.

[0040] Figure 3 4 is a longitudinal sectional view schematically showing the structure of the plating module 400 of this embodiment. Figure 3 As shown, the plating module 400 includes a plating tank 410 for storing plating liquid. The plating tank 410 is composed of a cylindrical inner tank with an open top surface and an outer tank (not shown) provided around the inner tank to accumulate the plating liquid overflowing from the upper edge of the inner tank.

[0041] The plating module 400 includes a substrate holder 440 for holding the substrate Wf in a state where the plated surface Wf-a faces downward. In addition, the substrate holder 440 includes a power supply contact (not shown) for supplying power to the substrate Wf from a power source not shown. In one embodiment, the power supply contact contacts the outer edge of the substrate Wf to supply power to the outer edge of the substrate Wf. The plating module 400 includes a lifting mechanism 442 for raising and lowering the substrate holder 440. In addition, in one embodiment, the plating module 400 includes a rotating mechanism 448 for rotating the substrate holder 440 around a vertical axis. The lifting mechanism 442 and the rotating mechanism 448 can be implemented by a well-known mechanism such as a motor, for example.

[0042] The plating module 400 includes a diaphragm 420 that vertically divides the interior of the plating tank 410. The diaphragm 420 divides the interior of the plating tank 410 into a cathode region 422 and an anode region 424. The cathode region 422 and the anode region 424 are each filled with a plating solution. While this embodiment shows an example in which the diaphragm 420 is provided, the diaphragm 420 may not be provided.

[0043] An anode 430 is provided on the bottom surface of the anode region 424 of the plating tank 410. As an example, the anode 430 is a circular component having a surface approximately equal in size to the surface of the substrate Wf. Furthermore, an anode mask 426 is disposed in the anode region 424 to adjust the electric field between the anode 430 and the substrate Wf. The anode mask 426 is disposed near the anode 430 and is, for example, a roughly plate-shaped electric field shield made of a dielectric material. The anode mask 426 has an opening for the current flowing between the anode 430 and the substrate Wf. In this embodiment, the anode mask 426 is configured to have a variable opening size, which is adjusted by the control module 800. Here, the opening size refers to the diameter when the opening is circular, and to the length of one side or the longest width of the opening when the opening is polygonal. The opening size of the anode mask 426 can be changed using known mechanisms. While this embodiment shows an example in which the anode mask 426 is provided, it is also possible not to provide the anode mask 426. In addition, the diaphragm 420 may also be provided at the opening of the anode cover 426 .

[0044] The plating module 400 includes an impedance body 450 disposed between the substrate Wf and the anode 430. In the present embodiment, the impedance body 450 is disposed in the cathode region 422. The impedance body 450 is a component for achieving uniform plating treatment at the plated surface Wf-a of the substrate Wf by adjusting the electric field. The impedance body 450 increases the resistance value between the anode 430 and the substrate Wf, and the electric field is not easily expanded. As a result, the thickness of the plated film formed on the plated surface Wf-a of the substrate Wf can be uniformly distributed. Therefore, if the distance between the substrate Wf and the impedance body 450 increases, the space in which the electric field between the substrate Wf and the impedance body 450 can expand becomes larger. Therefore, the impedance body 450 is preferably disposed near the plated surface Wf-a of the substrate Wf. The impedance body 450 will be described in detail later.

[0045] The plating module 400 also includes an agitator 480 positioned between the substrate Wf held by the substrate holder 440 and the resistor 450, and an agitator stirring mechanism 482 for moving the agitator 480 within the plating solution to stir the solution. The agitator 480 is not limited and can, for example, be formed from a plate member having a plurality of honeycomb-shaped holes. The agitator stirring mechanism can be implemented using a known mechanism such as a motor. The agitator stirring mechanism 482 is configured to stir the plating solution near the plating surface Wf-a of the substrate Wf by reciprocating the agitator 480 along the plating surface Wf-a of the substrate Wf. However, this is not limited to this example. As an example, the agitator stirring mechanism 482 can also be configured to reciprocate the agitator 480 perpendicularly to the plating surface Wf-a. While this embodiment shows an example in which the agitator 480 and the agitator stirring mechanism 482 are provided, the agitator 480 and the agitator stirring mechanism 482 may also be omitted.

[0046] In addition, a sensor 460 for detecting parameters related to the coating formed on the plated surface Wf-a of the substrate Wf is provided in the cathode region 422. In the present embodiment, the parameter related to the coating refers to the film thickness of the coating, or a physical quantity used to infer the formation speed of the coating. The sensor 460 is configured to face the plated surface Wf-a. In the present embodiment, the sensor 460 is movably configured in a manner that can change the detection position along the radial direction of the substrate Wf. However, the present invention is not limited to such an example, and a plurality of sensors 460 facing the plated surface Wf-a may also be provided. In addition, in one embodiment, the detection end of the sensor 460 is configured inside the impedance body 450. However, the present invention is not limited to such an example, and the sensor 460 may also be provided at other locations outside the impedance body 450.

[0047] The detection signal from sensor 460 is input to control module 800. In this embodiment, a potential sensor having a detection electrode (not shown) is used as sensor 460. Furthermore, the detection electrode of sensor 460 can be positioned facing the plated surface Wf-a, or it can be positioned within a conduit that is positioned facing the plated surface Wf-a and filled with plating solution. Furthermore, when a potential sensor is used as sensor 460, at least one reference potential sensor 462 is preferably provided within plating tank 410. Reference potential sensor 462 is preferably positioned outside the region between substrate Wf and anode 430. In other words, reference potential sensor 462 is preferably positioned so as not to overlap with substrate Wf and anode 430 when viewed from a direction perpendicular to plated surface Wf-a of substrate Wf. Based on the potential difference between sensor 460 (which functions as a potential sensor) and reference potential sensor 462, control module 800 can infer the formation rate of the plated film formed on plated surface Wf-a and thereby measure the thickness of the plated film. This is based on the correlation between the plating current and the potential during the plating process. However, as long as the sensor 460 can detect parameters related to the coating, other sensors such as optical distance sensors such as white confocal sensors, magnetic field sensors, or eddy current sensors may be used in place of or in addition to the potential sensor. Furthermore, while this embodiment shows an example in which the sensor 460 is provided for detecting parameters related to the coating, the sensor 460 may not be provided.

[0048] A shielding body 470 for shielding the current flowing from the anode 430 to the substrate Wf is provided in the cathode region 422. In the present embodiment, the shielding body 470 is provided at the same height as the stirrer 480, but is not limited to such an example. The shielding body 470 is, for example, a roughly plate-shaped component made of a dielectric material. The shielding body 470 is configured to be able to move between a shielding position between the plated surface Wf-a of the substrate Wf and the anode 430 and a retreat position retreated from the plated surface Wf-a and the anode 430. In other words, the shielding body 470 is configured to be able to move between a shielding position below the plated surface Wf-a and a retreat position away from the bottom of the plated surface Wf-a. The position of the shielding body 470 is controlled by a drive mechanism 472 that receives instructions from the control module 800. The drive mechanism 472 can be implemented by a well-known mechanism such as a motor or a solenoid.

[0049] <Impedance body>

[0050] The resistor 450 of this embodiment will be described in detail. Figure 4A This schematically shows one embodiment. Figure 3 A transverse cross-sectional view of the resistor 450 is shown. Figure 4B It roughly indicates Figure 4A4 is a longitudinal cross-sectional view of the impedance body 450 shown in FIG. The impedance body 450 of this embodiment comprises a main body 452 in the shape of a circular plate, and a first insert body 456A and a second insert body 456B in the shape of an arc plate arranged inside the main body 452. In other words, the main body 452 has an annular space 455 inside, and the first insert body 456A and the second insert body 456B in the shape of an arc plate are arranged in the annular space 455. The main body 452 and the two insert bodies 456A and 456B are components with a higher resistivity than the plating solution, and are preferably dielectrics. In addition, the main body 452 and the insert bodies 456A and 456B can be formed of the same material or different materials.

[0051] In one embodiment, the main body 452 is a circular plate-shaped component fixed relative to the plating tank 410 and slightly larger than the substrate Wf when viewed from above. In addition, as an example, the main body 452 can also be configured to be able to move up and down in the plating tank 410. Figure 4A 、 4B As shown, the main body 452 is formed with a plurality of through holes 453 that communicate with the upper surface 452-a and the lower surface 452-b of the main body 452. In other words, the main body 452 is formed with a plurality of through holes 453 that open on the substrate holder 440 side and the anode 430 side. Figure 4A In the figure, the through hole 453 is indicated by a dotted line. The plurality of through holes 453 are through holes of the same size, and are long hole-shaped openings with a circumferential length of about twice the radial length. However, this is not limited to such an example. The plurality of through holes 453 may be in the shape of a perfect circle, any other shape, or different sizes when viewed from above. In addition, in one embodiment, the plurality of through holes 453 are arranged on two or more concentric imaginary reference circles (in Figure 4A , with reference to the dotted line). In this case, in one embodiment, the plurality of through holes 453 arranged on adjacent reference circles are arranged at positions that are offset from each other in angular positions in the reference circles. In other words, the through holes 453 arranged on adjacent reference circles are arranged in a manner that is staggered in the circumferential direction rather than having the centers of the through holes 453 arranged on the adjacent reference circles. However, the arrangement of the plurality of through holes 453 is not limited to such an example, and they may be arranged on a straight line extending in the radial direction, or the arrangement of the through holes 453 may be adopted only in a part of the area. In addition, in Figure 4A In the figure, for clarity of illustration, the plurality of through holes 453 are shown sparsely, but in actual design, more through holes 453 are formed in the main body 452.

[0052] like Figure 4AAs shown, the first insert 456A and the second insert 456B are components that are arc-shaped plates when viewed from above. As described above, the first insert 456A and the second insert 456B are arranged in the annular space 455 formed inside the main body 452. In addition, the first insert 456A and the second insert 456B are arranged concentrically with the substrate Wf or the anode 430 when viewed from above. In one embodiment, the first insert 456A and the second insert 456B have a size smaller than the substrate Wf or the anode 430 when viewed from above, and are arranged closer to the center side than the peripheral edge of the substrate Wf or the anode 430 (see Figure 3 As will be described later, the first insertion body 456A and the second insertion body 456B are each movable in the circumferential direction within the annular space 455 formed inside the main body 452 .

[0053] The first insert 456A has through holes 457A that connect the upper surface and the lower surface of the first insert 456A. ​​In other words, the first insert 456A has a plurality of through holes 457A that open on the substrate holder 440 side and the anode 430 side. Figure 4A In FIG, a through hole 457A is represented by a solid line. In one embodiment, a plurality of through holes 457A are arranged on two or more imaginary reference circles (in FIG) that are concentric and have different diameters. Figure 4A , refer to the dotted line). In other words, the plurality of through holes 457A are arranged in a dispersed manner in the radial direction of the first insert 456A. ​​In this case, in one embodiment, the plurality of through holes 457A arranged on adjacent reference circles are arranged at positions that are offset from each other in angular positions in the reference circles. In other words, the through holes 457A arranged on adjacent reference circles are arranged in a staggered manner in the circumferential direction rather than in such a manner that the centers of the through holes 457A are arranged on a straight line extending in the radial direction. However, the plurality of through holes 457A are not limited to such an example, and may be arranged in a straight line extending in the radial direction. In addition, in one embodiment, the plurality of through holes 457A respectively define openings of the same size as the through holes 453 of the main body 452. That is, in Figure 4AIn the illustrated embodiment, the plurality of through holes 457A of the first insert 456A define an opening in the shape of a long hole whose circumferential length is approximately twice the radial length, similarly to the through holes 453 of the main body 452. However, the plurality of through holes 457A of the first insert 456A, when viewed from above, are not limited to being in the shape of a long hole, but may also be in the shape of a perfect circle or in any other shape. As an example, the plurality of through holes 457A of the first insert 456A may also be in the shape of a long hole defining an opening that is longer in the circumferential direction than the through holes 453 of the main body 452. In one embodiment, the through holes 457A are arranged in the same distribution as the through holes 453 of the main body 452. That is, the plurality of through holes 457A are configured so as to be able to overlap with the plurality of through holes 453 of the main body 452, respectively. Figure 4A Indicates a state where the plurality of through holes 457A overlap with the plurality of through holes 453 of the main body 452. Figure 4A In the figure, for clarity of illustration, multiple through holes 457A and 457B are shown sparsely, but in actual design, more through holes 457A and 457B are formed in the inserts 456A and 456B.

[0054] The second insert 456B has a plurality of through holes 457B that open toward the substrate holder 440 and the anode 430. Since the dimensions of the second insert 456B and its through holes 457B are the same as those of the first insert 456A, their description will be omitted.

[0055] like Figure 4A As shown, the first insert 456A and the second insert 456B are connected at one end thereof by an elastic member 454. Figure 4A 、 5A As shown, the resistor 450 of one embodiment includes a biasing member 490 for moving the first insert 456A and the second insert 456B in the circumferential direction within the annular space 455 of the main body 452. Figure 4A As shown, the force-applying member 490 is a wedge-shaped member and is a plate-like member having the same thickness as the first insert 456A and the second insert 456B. As shown, the force-applying member 490 is disposed at the end of the first insert 456A and the second insert 456B opposite to the end where the elastic member 454 is disposed. Furthermore, the force-applying member 490 is provided with a plurality of through-holes 494, similar to the first insert 456A and the second insert 456B. A drive mechanism 492 is connected to the force-applying member 490, and the force-applying member 490 is configured to be movable in the radial direction by the drive mechanism 492. The drive mechanism 492 for radially moving the force-applying member 490 can be any type, and for example, a cam mechanism or a ball screw can be used.

[0056] Figure 4A Indicates a state where no force is applied to the elastic member 454. In this specification, Figure 4A The positions of the first insert 456A and the second insert 456B shown are referred to as the “first position.” In the first position, the through holes 453 of the main body 452 of the resistor 450 are aligned with the through holes 457A and 457B of the first insert 456A and the second insert 456B, respectively. Figure 4B This is a longitudinal sectional view showing a state in which the plurality of through holes 453 of the main body 452 of the resistor 450 are aligned in a communication manner with the plurality of through holes 457A of the first insert 456A and the plurality of through holes 457B of the second insert 456B. In addition, in the first position, the plurality of through holes 494 of the force applying member 490 are aligned in a communication manner with the plurality of through holes 453 of the main body 452 of the resistor 450. Figure 4A In the figure, for clarity of illustration, the urging member 490 is shown as having one through hole 494 , but in actual design, a plurality of through holes 494 may be provided in the urging member 490 .

[0057] When the force applying member 490 is Figure 4A When the first position shown is moved radially inward by the drive mechanism 492, the first insert 456A and the second insert 456B are moved in the circumferential direction, compressing the elastic member 454. In other words, the drive mechanism 492 causes the force applying member 490 to overcome the force applied by the elastic member 454 to the first insert 456A and the second insert 456B, thereby moving the first insert 456A and the second insert 456B in the circumferential direction. Figure 5A Indicates a state where the first insert 456A and the second insert 456B move in the circumferential direction and apply force to the elastic member 454. In this specification, Figure 5A The illustrated position of the first insert 456A and the second insert 456B is referred to as the "second position." In the second position, the plurality of through-holes 453 of the main body 452 of the resistor 450 are disconnected from the plurality of through-holes 457A of the first insert 456A and the plurality of through-holes 457B of the second insert 456B. In other words, in the second position, the plurality of through-holes 453 of the main body 452 of the resistor 450 are blocked by the first insert 456A and the second insert 456B. Figure 5BThis is a longitudinal cross-sectional view showing a state in which the plurality of through-holes 453 of the main body 452 of the resistor 450 are disconnected from the plurality of through-holes 457A of the first insert 456A and the plurality of through-holes 457B of the second insert 456B. Furthermore, in the second position, the plurality of through-holes 494 of the force-applying member 490 are disconnected from the plurality of through-holes 453 of the main body 452 of the resistor 450. In other words, the plurality of through-holes 453 of the main body 452 of the resistor 450 are blocked by the force-applying member 490.

[0058] By applying force component 490 Figure 5A The second position shown is moved radially outward, and the compressive force applied to the elastic member 454 causes the first insert 456A and the second insert 456B to move toward the first position. In other words, the elastic member 454 applies a biasing force to the first insert 456A and the second insert 456B toward the first position. Figure 4A The first position shown is a state in which the through-holes 453 of the main body 452 of the resistor 450 are aligned with the through-holes 457A of the first insert 456A and the through-holes 457B of the second insert 456B, and the through-holes 453 of the main body 452 are fully open. The second position is a state in which the through-holes 453 of the main body 452 of the resistor 450 are completely blocked by the first insert 456A and the second insert 456B. In one embodiment, the first insert 456A and the second insert 456B can be positioned anywhere between the first and second positions, and the through-holes 453 of the main body 452 can be partially blocked by the first insert 456A and the second insert 456B. In one embodiment, the first insert 456A and the second insert 456B can be positioned anywhere between the first and second positions by adjusting the radial position of the force applying member 490. That is, the opening amounts of the plurality of through holes 453 of the main body 452 of the resistor 450 can be adjusted by adjusting the radial position of the urging member 490 .

[0059] Furthermore, in one embodiment, regarding the radial dimensions of the first insert 456A and the second insert 456B, the inner diameters of the first insert 456A and the second insert 456B are 50% to 70% of the diameter of the main body 452 or the substrate Wf, preferably 55% to 65%. Furthermore, in one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90% of the diameter of the main body 452 or the substrate Wf, preferably 80% to 90%. The inner diameter and outer diameter of the first insert 456A and the second insert 456B mentioned above can also be said to be the inner diameter and outer diameter of the annular space 455 inside the main body 452. In one embodiment, the radial dimensions of the first insert 456A and the second insert 456B can also be determined to be the same as those described later. Figure 13The middle region B2 shown is consistent.

[0060] In addition, in one embodiment, a groove 459 for accommodating at least a portion of the sensor 460 is formed in the main body 452. In one embodiment, the groove 459 passes through the substrate holder 440 side and the anode 430 side, but as an example, the anode 430 side may also be closed. In addition, in Figures 4 to 5, the groove 459 is formed on the outer peripheral side of the annular space 455 for accommodating the first insert 456A and the second insert 456B, and is separated from the annular space 455 in the radial direction, but as an example, the annular space 455 and the groove 459 may also be connected to each other. In addition, in one embodiment, the groove 459 extends inward from the outer peripheral edge of the main body 452 when viewed from above. In one embodiment, as Figure 3 As shown, the sensor 460 is arranged in the groove 459 in a manner that does not protrude upward from the upper surface 452-a of the main body 452. As described above, the resistor 450 is preferably arranged near the plated surface Wf-a, and the sensor 460 for detecting parameters related to the plated film is also preferably arranged near the plated surface Wf-a of the substrate Wf. By arranging the sensor 460 in the groove 459, the distance between the resistor 450 and the plated surface Wf-a of the substrate Wf can be reduced, and parameters related to the film thickness of the plated film can be appropriately detected. In addition, in this embodiment, a stirrer 480 is arranged between the resistor 450 and the substrate Wf. By arranging the sensor 460 in the groove 459, the movement of the stirrer 480 for stirring is not restricted, and interference between the sensor 460 and the stirrer 480 can be prevented.

[0061] Figure 6 It is a rough representation of what can be used for Figure 3 A transverse cross-sectional view of an impedance body 450 of one embodiment of a plating module 400 is shown. Figure 6 The resistor 450 in the embodiment shown is dually configured with an insert. Figure 6 As shown, the main body 452 of the resistor 450 has an outer annular space 455A and an inner annular space 455B. A first insert 456A and a second insert 456B are disposed in the outer annular space 455A. Furthermore, a third insert 456C and a fourth insert 456D are disposed in the inner annular space 455B. Figure 6The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D of the embodiment shown in the figure have the same structure as the first insert 456A and the second insert 456B shown in Figures 4 and 5, except for the radial width. The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D each have a plurality of through holes 457A to 457D. However, for the sake of clarity of the figure, Figure 6 The plurality of through holes 457A to 457D are not shown in the figure.

[0062] like Figure 6 As shown, the first insert 456A and the second insert 456B are connected at one end thereof by an elastic member 454A, and the third insert 456C and the fourth insert 456D are connected at one end thereof by an elastic member 454B. Figure 6 As shown, a biasing member 490 is provided for moving the first insertion body 456A, the second insertion body 456B, the third insertion body 456C, and the fourth insertion body 456D in the circumferential direction within the annular spaces 455A and 455B of the main body 452 . Figure 6 The urging member 490 shown in FIG4 and FIG5 can be the same structure as the urging member 490 shown in FIG4 and FIG5. Figure 6 In the embodiment shown, the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D are movable between a first position where the plurality of through holes 457A to 457D of the respective inserts are connected to the plurality of through holes 453 of the main body 452, and a second position where they are not connected. In addition, the force-applying member 490 includes a plurality of through holes 494, and the through holes 490 are movable between a position where they are connected to the plurality of through holes 453 of the main body 452, and a position where they are not connected. Figure 6 In the illustrated state, the plurality of through holes 494 of the urging member 490 are aligned so as to communicate with the plurality of through holes 453 of the main body 452 .

[0063] Figure 7 The figure shows that the force-applying member 490 has moved radially inward to the middle, and the plurality of through holes 457A and 457B of the first insert 456A and the second insert 456B are connected to the plurality of through holes 453 of the main body 452, while the plurality of through holes 457C and 457D of the third insert 456C and the fourth insert 456D are not connected to the plurality of through holes 453 of the main body 452. Figure 7As shown in the position, the multiple through holes 494 of the force-applying component 490 can also be constructed to not be connected to the multiple through holes 453 of the main body 452 at the radial position where the first insert 456A and the second insert 456B are arranged, and the force-applying component 490 blocks the through holes 453 of the main body 452. Figure 8 The urging member 490 further moves radially inward, and the through holes 457A to 457D of the first insertion body 456A, the second insertion body 456B, the third insertion body 456C, and the fourth insertion body 456D are no longer connected to the through holes 453 of the main body 452. Figure 8 As shown in the position, the multiple through holes 494 of the force-applying component 490 can also be constructed to not be connected to the multiple through holes 453 of the main body 452 at the radial position where the first insert 456A, the second insert 456B, the third insert 456C and the fourth insert 456D are arranged, and the force-applying component 490 blocks the through holes 453 of the main body 452.

[0064] In one embodiment, regarding the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D, the inner diameters of the third insert 456C and the fourth insert 456D are 50% to 70% of the diameter of the main body 452 or the substrate Wf, preferably 55% to 65%. In addition, in one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90% of the diameter of the main body 452 or the substrate Wf, preferably 80% to 90%. In one embodiment, the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D may also be determined to be the same as described below. Figure 13 The middle region B2 shown is consistent.

[0065] Figure 9A It is a rough representation of what can be used for Figure 3 A perspective view of a portion of an impedance body 450 of one embodiment of a plating module 400 is shown. Figure 9B and Figure 9C Yes Figure 9A4 is a cross-sectional perspective view of a portion of the impedance body 450 shown. The impedance body 450 of this embodiment has a disk-shaped main body 452 and a cylindrical insert 560 arranged inside the main body 452, similarly to the above-mentioned embodiment. In other words, the main body 452 has a cylindrical space 455 inside, and a cylindrical insert 560 is arranged in the cylindrical space 455. The insert 560 is inserted into the cylindrical space 455 from the outer peripheral edge of the main body 452 toward the radial inside. The main body 452 and the insert 560 are components with a higher resistivity than the plating solution, and are preferably dielectrics. In addition, the main body 452 and the insert 560 can be formed of the same material or different materials.

[0066] exist Figure 9A In the embodiment shown, the main body 452 is formed with a plurality of through holes 453 that are open on the substrate holder 440 side (upper side) and the anode 430 side (lower side). Figure 9A In the figure, for clarity of illustration, the plurality of through holes 453 of the main body 452 are shown only in the portion related to the insert 560, but the plurality of through holes 453 are formed throughout the entire main body 452. Figure 9A In the embodiment, the plurality of through holes 453 are through holes of the same size and are perfectly circular when viewed from above. However, the embodiment is not limited to this example. Each of the plurality of through holes 453 may be an opening in the shape of an elongated hole with a circumferential length approximately twice the radial length, as in the embodiment of Figures 4 and 5 . Alternatively, the plurality of through holes 453 may be of any other shape or may be through holes of different sizes.

[0067] like Figure 9A As shown, the insert 560 is a cylindrical component. Figure 9B As shown, the insert 560 is formed with a plurality of through holes 562 that are open on the substrate holder 440 side and the anode 430 side. Figure 9B In the embodiment shown, the plurality of through holes 562 of the insert 560 have openings of the same size and distribution as the plurality of through holes 453 of the main body 452. Figure 9A As shown, the insert 560 is connected to the drive mechanism 564 and is configured to be rotatable inside the main body 452. The drive mechanism 564 can be any drive mechanism including a motor. Figure 9A As shown, the plurality of through holes 562 of the insert 560 are formed in a portion of the axial direction (radial direction of the main body 452) of the insert 560. The axial dimension (radial direction of the main body 452) of the region of the insert 560 where the through holes 562 are formed can be arbitrary, but as an example, it can be as shown in FIG. Figure 8In one embodiment, the radial dimensions of the insert 456A to 456D are determined. In addition, in one embodiment, the axial dimensions (radial dimensions of the main body 452) of the region where the through hole 562 is formed in the insert 560 may also be determined to be the same as those described later. Figure 13 The middle region B2 shown is consistent.

[0068] Figure 9B Indicates a state where the plurality of through holes 453 of the main body 452 and the plurality of through holes 562 of the insert 560 are aligned in a communicating manner. Figure 9B The illustrated position of the insert 560 is referred to as the "first position." Figure 9C Indicates a state where the insert 560 is rotated 90 degrees and the plurality of through holes 453 of the main body 452 and the plurality of through holes 562 of the insert 560 are not connected. Figure 9C The position of the insert 560 shown is referred to as the "second position." In other words, in the second position, the plurality of through-holes 453 of the main body 452 of the resistor 450 are blocked by the insert 560. Furthermore, by slightly rotating the insert 560 from the first position, the plurality of through-holes 453 of the main body 452 and the plurality of through-holes 562 of the insert 560 are only partially aligned, and the plurality of through-holes 453 of the main body 452 can be partially blocked by the insert 560.

[0069] Figure 10 FIG is a diagram showing the configuration of an insert 560 according to one embodiment. Figure 10 As shown, in one embodiment, a plurality of inserts 560 are arranged at equal intervals on the outer periphery of the main body 452. Figure 10 In the embodiment shown, the plurality of inserts 560 are of the same structure. Figure 10 In the illustrated embodiment, the plurality of inserts 560 can be configured to be independently rotatable. By independently rotating the plurality of inserts 560 between a first position and a second position, the opening amount of the plurality of through-holes 453 can be adjusted. Furthermore, as an embodiment, the plurality of inserts 560 can be configured to rotate synchronously.

[0070] Figure 11 FIG is a diagram showing the configuration of an insert 560 according to one embodiment. Figure 11 As shown, in one embodiment, a plurality of inserts 560 are arranged at equal intervals on the outer periphery of the main body 452. Figure 11 In the embodiment shown, the plurality of inserts 560 have different lengths. Figure 11 In the embodiment shown, different lengths of the insert 560 can make the size and position of the area where the through hole 562 is formed different. Figure 11In the embodiment shown, the opening amount of the plurality of through holes 453 can be adjusted at different radial positions. Figure 10 、 11 In the figure, for clarity of illustration, the through holes 453 and 562 are not shown.

[0071] <Plating treatment>

[0072] Next, the plating process in the plating module 400 of this embodiment will be described in more detail. By using the lifting mechanism 442 to immerse the substrate Wf in the plating solution in the cathode region 422, the substrate Wf is exposed to the plating solution. In this state, the plating module 400 applies a voltage between the anode 430 and the substrate Wf, thereby plating the plated surface Wf-a of the substrate Wf. In one embodiment, the plating process is performed while the substrate holder 440 is rotated using the rotating mechanism 448. Through the plating process, a conductive film (plating film) is deposited on the plated surface Wf-a of the substrate Wf-a.

[0073] In one embodiment, the control module (controller) 800 adjusts the impedance 450 (the position of the insert) by controlling the drive mechanisms 492 and 564, thereby improving the uniformity of the coating thickness distribution across the entire substrate Wf. As an example, the impedance 450 is adjusted using the drive mechanisms 492 and 564 before the start of the plating process. Alternatively, as an example, the impedance 450 is adjusted using the drive mechanisms 492 and 564 in real time during the plating process based on the detection value of the sensor 460.

[0074] Figure 12 This is a flow chart showing an example of a method for setting the operation plan of the resistor 450, the anode mask 426 and the shielding body 470 by the control module 800. As an example, when a new substrate batch is processed, Figure 12 The method shown. In addition, the control module 800 may also set the action plan of only a part of the impedance body 450, the anode cover 426 and the shielding body 470. Here, the action plan of the impedance body 450 is a plan indicating the position of the inserts 456A to 456D, 560, that is, the opening amount of the through hole 453 of the main body 452. In addition, the action plan of the anode cover 426 is a plan indicating the opening size of the anode cover 426. In addition, the action plan of the shielding body 470 is a plan indicating the forward and backward position of the shielding body 470. In addition, instead of being set by the control module 800 of the plating device 1000, the action plan may be set by a computer outside the plating device 1000 and sent to the plating device 1000.

[0075] exist Figure 12In the example shown, first, the control module 800 obtains the resist pattern of the substrate Wf to be processed (step S110). The resist pattern refers to the pattern of the resist layer formed on the plated surface Wf-a in a manner that forms the desired plating pattern by plating treatment. The acquisition of the resist pattern can also be carried out by detecting the substrate Wf using a sensor provided in the plating device 1000. As an example, the plating device 1000 can also be provided with a shooting sensor (not shown) such as a camera that shoots the plated surface Wf-a of the substrate Wf. Then, the control module 800 can also obtain the shooting data detected by the shooting sensor and obtain the resist pattern of the plated surface Wf-a by analyzing the shooting data. The acquisition of the resist pattern from the shooting data can be carried out using a known method based on the shadow or feature points of the shooting data. In addition, as an example, the control module 800 can also obtain the resist pattern by external input via wired or wireless communication.

[0076] Then, the control module 800 sets the action plan of the resistor 450, the anode mask 426 and the shielding body 470 based on the obtained resist pattern (step S120). As a specific example, the control module 800 calculates the plating growth coefficient of each specified area of ​​the plated surface Wf of the substrate Wf based on the obtained resist pattern, and sets the action plan of each control object based on the calculated plating growth coefficient. Here, the plating growth coefficient is a parameter that represents the growth rate (formation rate) of the coating film when the resistor 450, the anode mask 426 and the shielding body 470 are not shielding the current at all. As an example, the plating growth coefficient can be the amount of coating formed (e.g., nanometers) per unit time (e.g., 1 second). As a specific example, the control module 800 can calculate the aperture ratio of the resist layer in each specified area based on the resist pattern, and calculate the plating growth coefficient based on the calculated aperture ratio. This is because the area of ​​plating accumulation and the plating amount required to form a certain amount of plating film are large in the region with a large aperture ratio of the resist layer, and the growth rate of the plating film tends to be lower than that in the region with a small aperture ratio of the resist layer.

[0077] Figure 13 Schematically shows a resist pattern formed on the plated surface Wf-a of the substrate Wf according to one embodiment. Figure 13In the figure, resist openings are formed only in the cross-shaped area A1 with hatched lines, and the area A2 outside the cross-shaped area A1 becomes a non-opening area where no resist openings are formed. When plating is performed on the substrate Wf having such a resist pattern, no plating current flows in the non-opening area, i.e., area A2, and plating current flows only in the opening area, i.e., area A1. In addition, in the present embodiment, plating is performed while the substrate holder 440 is rotated using the rotating mechanism 448, and in the area A1, especially in the cross-shaped convex area including the area A2 in the circumferential direction, the plating current is concentrated and the coating thickness increases. In this specification, when viewed along the circumferential direction, the area where almost all resist openings are formed is referred to as the "central area B1" (in the Figure 13 In the example shown, it is a circular area surrounded by the inner dot-dash line C1. In addition, when viewed in the circumferential direction, the area including both the area where the resist opening is formed (opening area A1) and the area where the resist opening is not formed (non-opening area A2), where the area of ​​the opening area A1 is larger than the area of ​​the non-opening area A2 in the circumferential direction, is referred to as the "middle area B2" (in the example shown). Figure 13 In the example shown, it is a circular area surrounded by dot-dash lines C1 and C2. In addition, when viewed along the circumferential direction, the area including both the opening area A1 and the non-opening area A2, where the area of ​​the opening area A1 is smaller than that of the non-opening area A2 in the circumferential direction, is referred to as the "outer peripheral area B3" (in the example shown, it is a circular area surrounded by dot-dash lines C1 and C2). Figure 13 In the example shown, it is a circular area surrounded by dot-dash lines C2 and C3. Figure 13 In the example shown, a central region B1, an intermediate region B2, and an outer peripheral region B3 are sequentially formed from the center toward the outer periphery of the plated surface Wf-a, and no resist openings are formed on the outer periphery of the outer peripheral region B3. However, the present invention is not limited to this example, and any resist pattern may be formed on the substrate Wf.

[0078] Here, the anode mask 426 or the shielding body 470 of the plating module 400 can appropriately adjust the formation speed of the plating film near the outer periphery of the plated surface Wf-a. Figure 13 When the substrate Wf shown is plated, the plating forming rate becomes relatively high in the region closer to the inner peripheral side than near the outer peripheral edge (particularly the middle region B2 ), which may impair the uniformity of the thickness of the plated film.

[0079] In contrast, in the plating module 400 of the above embodiment, the opening amount of the through hole 453 of the main body 452 can be adjusted by moving or rotating the inserts 456A to 456D, 560 disposed inside the resistor 450. This makes it possible to adjust the current flowing through the middle area B2 and adjust the plating forming speed of the middle area B2. As an example, in Figure 13In the case where the plating forming speed of the middle region B2 surrounded by the dot-dash lines C1 and C2 is relatively high in the substrate Wf, the thickness of the plating film formed in the middle region B2 can be reduced by moving or rotating the inserts 456A to 456D, 560 to reduce the opening of the through hole 453 of the main body 452. Figure 13 When the substrate Wf shown is subjected to plating treatment, the uniformity of the thickness of the coating can also be improved. In addition, the plating module 400 of this embodiment is equipped with an anode cover 426 and a shield 470. Thus, for the middle area B2, the plating formation speed can be adjusted by moving or rotating the inserts 456A to 456D and 560, and for the peripheral area B3, the plating formation speed can be adjusted by the anode cover 426 and the shield 470. Therefore, the impedance body 450, the anode cover 426 and the shield 470 can be controlled to adjust the plating formation speed for each area of ​​the substrate Wf, thereby improving the uniformity of the thickness of the coating. In addition, the radial dimensions of the various inserts 456A to 456D of the impedance body 450 and the radial dimensions of the area of ​​the insert 560 with the through hole 562 can be set to be substantially the same as the middle area B2, etc., and the dimensions can be determined based on the middle area B2.

[0080] Figure 14 This is a flowchart showing an example of a method for setting an operation plan of the resistor 450, the anode mask 426, and the shielding body 470 in the plating process by the control module 800. Figure 14 The method shown is to replace Figure 12 The method shown, or the correction Figure 12 Furthermore, the control module 800 may also set the operation pattern of only a portion of the resistor 450 , the anode mask 426 , and the shielding body 470 .

[0081] When the control module 800 starts the plating process (step S210), it obtains parameters related to the coating from the sensor 460 in real time (step S220). In this embodiment, the parameters related to the coating are detected by the sensor 460 as the substrate Wf rotates. In one embodiment, the parameters related to the coating are detected at multiple locations along the radial direction on the coating surface Wf-a. The control module 800 calculates the film thickness distribution of the coating on the coating surface Wf-a based on the detection value of the sensor 460 (step S230). Then, the control module 800 sets the action plan of the resistor 450, the anode mask 426 and the shielding body 470 based on the calculated film thickness distribution (step S240). Before the plating process is completed (step S250), the control module 800 repeats the processing of steps S220 to S240 to set the action plan of the control object. Then, the control module 800 controls the resistor 450, the anode mask 426 and the shielding body 470 based on the set action plan. In this manner, by setting or correcting the operation plan of the resistor 450 and the like during the plating process based on the parameters related to the plating film acquired from the sensor 460 , the uniformity of the thickness of the plating film can be further improved.

[0082] The present invention can also be described in the following aspects.

[0083] [Method 1] According to method 1, an impedance body for a plating device for adjusting an electric field is provided, which is arranged between an anode and a retaining frame for retaining a plated object in a plating device, the impedance body for a plating device having a plate-shaped main body, the plate-shaped main body having an upper surface, a lower surface, and a plurality of through holes connecting the upper surface and the lower surface, the impedance body for a plating device further having an insert body arranged inside the main body, the insert body having a plurality of through holes, and the insert body being able to move between a first position in which the plurality of through holes of the insert body are connected to the plurality of through holes of the main body, and a second position in which the plurality of through holes of the insert body are not connected to the plurality of through holes of the main body.

[0084] [Mode 2] According to Mode 2, in addition to the resistor for a plating device of Mode 1, the plurality of through holes of the insert communicate with the upper surface and the lower surface of the insert.

[0085] [Method 3] According to method 3, based on the resistor for the plating device of method 2, the above-mentioned insert has a first insert in the shape of an arc plate and a second insert in the shape of an arc plate, and the above-mentioned resistor for the plating device also has an elastic component connecting the above-mentioned first insert and the above-mentioned second insert, and the above-mentioned elastic component is configured to apply a biasing force to the above-mentioned first insert and the above-mentioned second insert in the direction of the above-mentioned first position.

[0086] [Mode 4] According to Mode 4, in addition to the resistor for plating apparatus of Mode 3, there is further provided a biasing member that causes the first insertion body and the second insertion body to overcome the biasing force of the elastic member and move toward the second position.

[0087] [Method 5] According to method 5, based on the impedance body for the plating device of method 3, the above-mentioned insert body has a third insert body in the shape of an arc plate and a fourth insert body in the shape of an arc plate, and the above-mentioned impedance body for the plating device also has a second elastic component connecting the above-mentioned third insert body and the above-mentioned fourth insert body, and the above-mentioned second elastic component is configured to apply a biasing force to the above-mentioned third insert body and the above-mentioned fourth insert body in the direction of the above-mentioned first position.

[0088] [Method 6] According to method 6, based on the impedance body for the plating device of method 1, the above-mentioned insert is a cylindrical component having the above-mentioned multiple through holes, which is inserted into the interior from the side of the above-mentioned plate-shaped main body and can move between the above-mentioned first position and the above-mentioned second position by rotating around the central axis of the above-mentioned cylindrical component.

[0089] [Method 7] According to method 7, based on the impedance body for the plating device of method 6, the above-mentioned plate-shaped main body is a circular plate shape, the above-mentioned insert has a plurality of the above-mentioned cylindrical parts, and the above-mentioned plurality of cylindrical parts are inserted along the radial direction of the above-mentioned plate-shaped main body.

[0090] [Mode 8] According to Mode 8, in addition to the resistor for plating equipment of Mode 7, the plurality of cylindrical members have different longitudinal dimensions.

[0091] [Method 9] According to method 9, a plating device is provided, which comprises: a plating tank; an anode, which is arranged in the above-mentioned plating tank; a retaining frame, which is used to retain the object to be plated; and an impedance body for electric field adjustment, which is arranged between the above-mentioned anode and the above-mentioned retaining frame, the above-mentioned impedance body having a plate-shaped main body, the above-mentioned plate-shaped main body having an upper surface, a lower surface, and a plurality of through holes connecting the above-mentioned upper surface and the above-mentioned lower surface, the above-mentioned impedance body also having an insert body arranged inside the above-mentioned main body, the above-mentioned insert body having a plurality of through holes, and the above-mentioned insert body can move between a first position in which the above-mentioned plurality of through holes of the above-mentioned insert body are connected to the plurality of through holes of the above-mentioned main body, and a second position in which the above-mentioned plurality of through holes of the above-mentioned insert body are not connected to the plurality of through holes of the above-mentioned main body.

[0092] Description of Reference Numerals

[0093] Wf-a…plated surface; Wf…substrate; 400…plating module; 410…plating tank; 420…diaphragm; 422…cathode region; 424…anode region; 430…anode; 440…substrate holder; 442…lifting mechanism; 448…rotating mechanism; 450…impedance body; 452…main body; 453…through hole; 456A~456D…insertion body; 457A~457D…through hole; 459…tank; 460…sensor; 470…shielding body; 480…agitator; 490…force-applying member; 492…driving mechanism; 494…through hole; 560…insertion body; 562…through hole; 564…driving mechanism; 800…control module; 1000…plating device.

Claims

1. A plating device impedance body, which is a plating device impedance body for adjusting the electric field and is arranged between an anode and a holder holding a plated object in a plating device, wherein: The resistor for a plating device has a plate-shaped main body having an upper surface, a lower surface, and a plurality of through holes communicating with the upper surface and the lower surface. The resistor for plating device further includes an insert disposed inside the main body, the insert having a plurality of through holes. The insert is movable between a first position where the through holes of the insert communicate with the through holes of the main body and a second position where the through holes of the insert are not communicated with the through holes of the main body.

2. The resistor for plating equipment according to claim 1, wherein The plurality of through holes of the insert communicate with the upper surface and the lower surface of the insert.

3. The resistor for plating equipment according to claim 2, wherein: The inserting body comprises a first inserting body in the shape of a circular arc plate and a second inserting body in the shape of a circular arc plate. The resistor for plating equipment further includes an elastic member connecting the first insert and the second insert. The elastic member is configured to apply a biasing force to the first insertion body and the second insertion body toward the first position.

4. The resistor for plating equipment according to claim 3, wherein: A biasing member is further provided for moving the first insertion body and the second insertion body toward the second position against the biasing force of the elastic member.

5. The resistor for plating equipment according to claim 3, wherein The inserting body comprises a third inserting body in the shape of a circular arc plate and a fourth inserting body in the shape of a circular arc plate. The resistor for plating equipment further includes a second elastic member connecting the third insertion body and the fourth insertion body. The second elastic member is configured to apply a biasing force to the third insertion body and the fourth insertion body toward the first position.

6. The resistor for plating equipment according to claim 1, wherein The insert is a cylindrical member having the plurality of through holes, is inserted into the plate-shaped main body from a side surface, and is movable between the first position and the second position by rotating around a central axis of the cylindrical member.

7. The resistor for plating equipment according to claim 6, wherein: The plate-like main body is in the shape of a circular plate, The insert has a plurality of cylindrical members, and the plurality of cylindrical members are inserted in a radial direction of the plate-shaped main body.

8. The resistor for plating equipment according to claim 7, wherein: The plurality of cylindrical components have different longitudinal dimensions.

9. A plating device, wherein: have: plating tank; an anode, disposed in the plating tank; A holder for holding the object to be plated; as well as An impedance body for adjusting the electric field is arranged between the anode and the holder. The resistor has a plate-shaped main body having an upper surface, a lower surface, and a plurality of through holes communicating with the upper surface and the lower surface. The resistor further includes an insert disposed inside the main body, the insert having a plurality of through holes. The insert is movable between a first position where the through holes of the insert communicate with the through holes of the main body and a second position where the through holes of the insert are not communicated with the through holes of the main body.

Images