Glue dispensing device for free space isolator

Abstract

The invention relates to a dispensing device for a free space isolator, and belongs to the technical field of free space isolators, the dispensing device comprises a feeding device, an assembling device, a carrying device and a dispensing assembly, the feeding device is used for placing chips and magnetic rings; the assembling device is used for assembling a chip and a magnetic ring; the carrying device comprises a first carrying assembly used for carrying chips and a second carrying assembly used for carrying magnetic rings, and the first carrying assembly can drive the chips to rotate horizontally. The first carrying assembly and the second carrying assembly can carry chips and magnetic rings on the feeding device to the assembling device to be assembled. The dispensing assembly is arranged at the top of the base and can conduct dispensing treatment on the chip, when the first carrying assembly carries the chip to the dispensing position, the dispensing gun conducts dispensing on the chip, and the dispensing gun conducts dispensing once every time the chip rotates by 90 degrees, so that dispensing can be conducted on the four corners of the chip.

Description

Technical Field

[0001] The present invention relates to the technical field of free space isolators, and more specifically, to a dispensing device for a free space isolator. Background Art

[0002] A free space isolator is an optical device mainly used to achieve unidirectional transmission of optical signals. Its basic principle is to use the magneto-optical effect to irreversibly rotate the polarization state of light, thereby blocking the backward-propagating optical signals. The free space isolator has the advantages of strong power-carrying capacity, high structural adjustability, and suitability for various optical interfaces, and is widely used in high-power laser systems, optical experimental platforms, and precision measurement equipment to prevent the interference or damage of reflected light to the upstream light source and improve the stability and reliability of the system.

[0003] During the manufacturing process of a free space isolator, it is usually necessary to dispense glue at the four corners of its chip to fix the chip to the magnetic ring structure. However, traditional manufacturing devices usually have four fixed dispensing heads corresponding to the four corners of the chip to complete the dispensing operation. Due to the large number of dispensing heads, it not only increases the complexity of the device structure but also significantly increases the overall manufacturing cost. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that during the manufacturing process of a free space isolator, it is usually necessary to dispense glue at the four corners of its chip to fix the chip to the magnetic ring structure. However, traditional manufacturing devices usually have four fixed dispensing heads corresponding to the four corners of the chip to complete the dispensing operation. Due to the large number of dispensing heads, it not only increases the complexity of the device structure but also significantly increases the overall manufacturing cost. In view of the above defects of the prior art, a dispensing device for a free space isolator is provided.

[0005] The technical solution adopted by the present invention to solve its technical problems is as follows:

[0006] Construct a dispensing device for a free space isolator, including:

[0007] A base;

[0008] A feeding device for placing the chip and the magnetic ring;

[0009] An assembling device for assembling the chip and the magnetic ring;

[0010] A handling device, which includes a first handling component for handling the chip and a second handling component for handling the magnetic ring. The first handling component can drive the chip to rotate horizontally, and the first handling component and the second handling component can handle the chip and the magnetic ring on the feeding device to the assembling device for assembly;

[0011] A dispensing assembly, which is arranged on the top of the base.

[0012] Optionally, it includes a mounting frame arranged on the top of the mounting base. A sliding module is arranged on one side of the mounting frame. The sliding module includes a slide rail and an electric slider arranged on the slide rail and capable of reciprocating along the slide rail. The handling device is connected to the electric slider.

[0013] Optionally, at least two electric sliders are provided. The first handling component and the second handling component are respectively connected to different electric sliders.

[0014] Optionally, the dispensing assembly includes a glue tank and a glue gun. The glue gun is connected to the glue tank through a connecting pipe.

[0015] Optionally, a mounting seat is arranged on the top of the base. A mounting bracket is arranged on the top of the mounting seat. A positioning through hole is arranged on the mounting bracket. The glue gun is inserted into the positioning through hole for positioning.

[0016] Optionally, a camera device, which includes a first camera and a second camera. The first camera is used to detect the posture of the chip in the horizontal direction. The second camera detects the posture of the chip from bottom to top to determine whether the direction and inclination angle of the chip need to be corrected.

[0017] Optionally, an ultraviolet curing device, which is installed on the second handling component and used to cure the glue that adheres the chip and the magnetic ring.

[0018] Optionally, the feeding device includes a first feeding tray and a second feeding tray. A plurality of first feeding grooves are arranged on the top of the first feeding tray. A plurality of chips are arranged in the first feeding grooves. A plurality of second feeding grooves are arranged on the top of the second feeding tray. A plurality of magnetic ring assemblies are arranged in the second feeding grooves.

[0019] Optionally, the camera device further includes a third camera assembly and a fourth camera assembly. The third camera assembly is used to photograph the chips placed on the first feeding tray so that the first handling component can accurately handle the chips. The fourth camera assembly is used to photograph the magnetic rings placed on the second feeding tray so that the second handling component can accurately handle the magnetic rings.

[0020] Optionally, it includes a push pin arranged on the first handling component. The push pin is used to adsorb the chip and then push it into the magnetic ring. After the chip is pushed into the magnetic ring, the push pin can also drive the chip to rotate so that the glue on the chip is fully in contact with the magnetic ring.

[0021] The beneficial effects of the present invention are as follows:

[0022] The present invention includes: a feeding device, an assembling device, a handling device, and a dispensing assembly. Among them, the feeding device is used to place chips and magnetic rings; the assembling device is used for assembling chips and magnetic rings; the handling device includes a first handling component for handling chips and a second handling component for handling magnetic rings. The first handling component can drive the chip to rotate horizontally. The first handling component and the second handling component can transport the chips and magnetic rings on the feeding device to the assembling device for assembly; the dispensing assembly is arranged on the top of the base and can perform dispensing on the chips. When the first handling component transports the chip to the dispensing position, the dispensing gun will dispense on the chip, and the dispensing gun performs dispensing once every 90 degrees of rotation of the chip, so that the four corners of the chip can be dispensed. Through the above technical solutions, the present application achieves a significant simplification of the equipment structure, replaces multiple fixed dispensing heads through the spatial reuse of a single dispensing assembly, and reduces the manufacturing cost and maintenance difficulty. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will further describe the present invention in conjunction with the drawings and embodiments. The drawings in the following description are only partial embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings:

[0024] Figure 1 It is an overall axonometric schematic diagram in the embodiment of the present invention.

[0025] Figure 2 It is another overall axonometric schematic diagram in the embodiment of the present invention.

[0026] Figure 3 It is a top view schematic diagram in the embodiment of the present invention.

[0027] Figure 4 It is a front view schematic diagram in the embodiment of the present invention.

[0028] The reference numerals are:

[0029] 100, base;

[0030] 210, first feeding tray; 211, first feeding groove; 220, second feeding tray; 221, second feeding groove;

[0031] 300, assembling device; 310, rotating platform; 320, driving part; 330, transmission belt;

[0032] 410, first handling component; 411, pushing pin; 420, second handling component;

[0033] 500, Dispensing assembly; 510, Glue tank; 520, Glue gun; 530, Connecting pipe;

[0034] 600, Mounting base; 610, Mounting bracket;

[0035] 700, Mounting frame; 710, Sliding module; 711, Slide rail; 712, Electric slider;

[0036] 800, Imaging device; 810, First camera; 820, Second camera; 830, Third camera

[0037] assembly; 840, Fourth camera assembly;

[0038] 900, UV curing device. Detailed implementation

[0039] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present invention without making creative efforts shall fall within the scope of protection of the present invention.

[0040] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0041] In the embodiments of the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal height than the second feature.

[0042] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0043] As shown in the embodiments of the present invention Figures 1 - 4 it relates to a dispensing device for a free - space isolator, including: a feeding device, an assembling device 300, a handling device, and a dispensing assembly 500. Among them, the feeding device is used to place chips (not shown in the figure) and magnetic rings (not shown in the figure); the assembling device 300 is used for the assembly of chips and magnetic rings; the handling device includes a first handling component 410 for handling chips and a second handling component 420 for handling magnetic rings. The first handling component 410 can drive the chip to rotate horizontally. The first handling component 410 and the second handling component 420 can transport the chips and magnetic rings on the feeding device to the assembling device 300 for assembly; the dispensing assembly 500 is arranged on the top of the base 100 and can perform dispensing treatment on the chip. When the first handling component 410 transports the chip to the dispensing position, the dispensing gun 520 will perform dispensing on the chip, and the dispensing gun 520 performs dispensing once after the chip rotates 90 degrees, so that the four corners of the chip can be dispensed. The feeding device refers to a material container for storing and supplying chips and magnetic rings, and can be specifically implemented by a partitioned tray. For example, a groove array is opened on the surface of the tray to position the materials, and its function is to provide a raw material basis for the assembly process. The handling device refers to a moving mechanism for realizing the position transfer of materials, and can be specifically implemented by combining a slide rail 711 and an electric slider 712. Its function is to sequentially transport the materials on the feeding device to the assembly station. The dispensing assembly 500 refers to a functional module for performing glue coating, and can be specifically implemented by a glue gun 520 and a glue supply pipeline system.

[0044] Specifically, the feeding device stores the chips and magnetic rings in separate trays. The handling device moves to the feeding station along the slide rail 711 through the electric slider 712, clamps the materials, and then performs dispensing on the four corners of the chip through the dispensing assembly 500. Subsequently, the chips and magnetic rings are positioned and assembled on the assembling device 300.

[0045] Compared with the prior art, traditional devices rely on four fixed dispensing nozzles to dispense glue on a chip, resulting in a complex device structure and high cost. In this solution, the first handling component 410 transports the chip to the dispensing position, and then the first handling component 410 can drive the chip to rotate, enabling the dispensing gun 520 to dispense glue on the four corners of the chip, effectively reducing the number of dispensing nozzles. For example, the traditional solution requires four dispensing nozzles and four sets of glue supply pipelines, while this solution only requires one set of dispensing components 500, simplifying the pipeline layout and reducing the hardware cost.

[0046] Through the above technical solution, this application achieves a significant simplification of the device structure. By replacing multiple fixed dispensing nozzles with the space multiplexing of a single dispensing component 500, the manufacturing cost and maintenance difficulty are reduced. For example, in the same production scenario, the number of dispensing nozzles is reduced by 75%, and the hardware costs of the supporting glue supply system and drive module are synchronously reduced. In this embodiment, the handling component includes a vacuum suction nozzle and / or a vacuum clamp. The dispensing component 500 includes a glue tank 510 and a glue gun 520, and the glue gun 520 is connected to the glue tank 510 through a connecting pipe 530.

[0047] This application further proposes a structure including a base 100 and a mounting frame 700 provided on the top of the mounting base 100. A sliding module 710 is provided on one side of the mounting frame 700. The sliding module 710 includes a slide rail 711 and an electric slider 712 provided on the slide rail 711 and capable of reciprocating along the slide rail 711. The handling device is connected to the electric slider 712.

[0048] At least two electric sliders 712 are provided, and the first handling component 410 and the second handling component 420 are respectively connected to different electric sliders 712.

[0049] Among them, the base 100 refers to the base that bears the overall structure of the device, which can be specifically implemented by a metal casting or a welded frame structure. Its function is to provide a stable installation reference for the upper components. The mounting frame 700 refers to the mounting structure provided on the top of the base 100, which can be specifically implemented by a profile frame or a steel plate bending structure. Its function is to assemble the sliding module 710. The slide rail 711 refers to the structure that provides a linear motion guide for the electric slider 712, which can be specifically implemented by a linear guide rail. Its function is to ensure the displacement accuracy through a high-precision guiding path. The electric slider 712 refers to the driving module that moves along the slide rail 711, and its function is to convert rotational motion into linear motion and accurately control the displacement amount.

[0050] In this embodiment, an installation base 600 is provided on the top of the base 100. An installation bracket 610 is provided on the top of the installation base 600. A positioning through hole (not shown in the figure) is provided on the installation bracket 610. The glue gun 520 is inserted into the positioning through hole for positioning. Further, by sequentially providing the installation base 600 and the installation bracket 610 on the top of the base 100 and providing a through hole for positioning on the installation bracket 610, the glue gun 520 can be stably inserted into the through hole for positioning, thereby effectively improving the positioning accuracy during the dispensing process, avoiding poor dispensing caused by the deviation or jitter of the glue gun 520, and enhancing the consistency and reliability of the dispensing; at the same time, this structure simplifies the installation and debugging process of the glue gun 520, reduces the operation difficulty, enhances the assembly efficiency and maintenance convenience of the equipment, and further improves the stability and adaptability of the overall machine structure.

[0051] In this embodiment, it includes a camera device 800. The camera device 800 includes a first camera 810 and a second camera 820. The first camera 810 is used to detect the posture of the chip in the horizontal direction, and the second camera 820 detects the posture of the chip from bottom to top to determine whether the direction and inclination angle of the chip need to be corrected. Further, the first camera 810 is used to detect the posture of the chip in the horizontal direction to identify the rotation, deviation or position deviation of the chip in the horizontal direction, and the second camera 820 detects the chip from the bottom-up direction to obtain the height, angle and tilt state of the chip in the vertical direction, so as to realize the comprehensive monitoring of the overall posture of the chip, and accordingly judge whether there is a deviation in the direction and inclination angle of the chip and whether correction is needed. After judging that the chip state is correct, the glue gun 520 dispenses glue on the chip, avoiding assembly deviation and dispensing error caused by the tilt or offset of the chip, thereby improving the assembly quality and the working stability of the automatic equipment, reducing the rework rate and defective product rate caused by poor posture, and further optimizing the overall manufacturing process.

[0052] In this embodiment, it includes an ultraviolet curing device 900. The ultraviolet curing device 900 is installed on the second handling component 420 and is used to cure the glue that adheres the chip and the magnetic ring. Further, the ultraviolet curing device 900 is provided on the second handling component 420 and is used to perform ultraviolet curing treatment on the glue used for adhering between the chip and the magnetic ring. The ultraviolet curing device 900 can move along with the movement of the second handling component 420 to realize the instant curing of the chip after dispensing and assembly, effectively shortening the curing waiting time and enhancing the production rhythm.

[0053] In this embodiment, the feeding device includes a first feeding tray 210 and a second feeding tray 220. A plurality of first feeding grooves 211 are provided on the top of the first feeding tray 210, and a plurality of chips are arranged in the first feeding grooves 211. A plurality of second feeding grooves 221 are provided on the top of the second feeding tray 220, and a plurality of magnetic ring assemblies are arranged in the second feeding grooves 221. Further, the feeding device includes a first feeding tray 210 and a second feeding tray 220. A plurality of first feeding grooves 211 for positioning and carrying chips are provided on the top of the first feeding tray 210, and a plurality of chips are arranged in an orderly manner in each first feeding groove 211 for the handling component to pick up materials in sequence. A plurality of second feeding grooves 221 for placing magnetic ring assemblies are provided on the top of the second feeding tray 220, and a plurality of magnetic ring assemblies are also stored in each second feeding groove 221 to ensure the continuity and stability of feeding. By arranging the chips and magnetic ring assemblies in different feeding grooves in an orderly manner, the standardized storage and efficient picking of materials are realized, which helps to improve the accuracy of handling positioning and the picking and placing efficiency, and reduce the handling failures or assembly abnormalities caused by material chaos, misalignment or interference. After the chips and magnetic rings are assembled, they can be put back into the second feeding tray 220.

[0054] In this embodiment, the imaging device 800 further includes a third camera assembly 830 and a fourth camera assembly 840. The third camera assembly 830 is used to photograph the chips placed on the first feeding tray 210 so that the first handling component 410 can accurately handle the chips. The fourth camera assembly 840 is used to photograph the magnetic rings placed on the second feeding tray 220 so that the second handling component 420 can accurately handle the magnetic rings. The imaging device 800 further includes a third camera assembly 830 and a fourth camera assembly 840. The third camera assembly 830 is used to collect images of the chips placed on the first feeding tray 210. By identifying the specific position and attitude information of the chips, it assists the first handling component 410 in performing precise positioning and grasping operations. The fourth camera assembly 840 is used to photograph the magnetic rings located on the second feeding tray 220 to obtain their spatial position and attitude information to guide the second handling component 420 to accurately perform the handling operation, so as to ensure that both the chips and the magnetic rings can complete the feeding process with high precision. By introducing visual recognition means in the feeding stage, the real-time positioning and dynamic calibration of the chips and magnetic rings are realized, which can effectively reduce the influence of material offset, rotation error, etc. on the handling accuracy and improve the stability and automation degree of the overall handling link.

[0055] In this embodiment, it includes a push pin 411 disposed on the first handling component 410. The push pin 411 is used to adsorb the chip and then push it into the magnetic ring. After the chip is pushed into the magnetic ring, the push pin 411 can also drive the chip to rotate so that the glue on the chip fully contacts the magnetic ring. Further, the push pin 411 is used to grab the chip by adsorption during the handling process and accurately push it into the magnetic ring at a preset position after the chip is positioned. During the pushing process, it is ensured that the chip is inserted into the magnetic ring in the correct direction and with the correct force to prevent position deviation or damage. In addition, after the chip is pushed by the push pin 411, the push pin 411 also has a rotation driving function and can drive the chip to rotate moderately, so that the glue on the chip is evenly distributed under the action of rotation and fully contacts the inner wall of the magnetic ring, improving the adhesion coverage effect and accelerating the initial bonding and forming. In another embodiment, the assembling device 300 includes a rotating platform 310 and a driving member 320. The rotating platform 310 is connected to the driving member 320 through a transmission belt 330. After the chip is dispensed with glue and pushed into the magnetic ring by the push pin 411, the driving member 320 can be driven to drive the rotating platform 310 to drive the magnetic ring to rotate, so that the glue on the chip is evenly smeared on the magnetic ring. The driving member 320 can be a motor.

[0056] For those of ordinary skill in the art, modifications or variations can be made according to the above description, and all such modifications and variations should fall within the protection scope of the appended claims of the present invention.

Claims

1. A dispensing device for a free space isolator, characterized in that, Comprising: A base (100); A feeding device for placing chips and magnetic rings; An assembling device (300) for assembling chips and magnetic rings; A handling device including a first handling component (410) for handling chips and a second handling component (420) for handling magnetic rings. The first handling component (410) can drive the chip to rotate horizontally, and the first handling component (410) and the second handling component (420) can transport the chips and magnetic rings on the feeding device to the assembling device (300) for assembly; A dispensing component (500) disposed on the top of the base (100).

2. The dispensing device for a free space isolator according to claim 1, wherein Including a mounting frame body (700) disposed on the top of the mounting base (100). A sliding module (710) is disposed on one side of the mounting frame body (700). The sliding module (710) includes a slide rail (711) and an electric slider (712) disposed on the slide rail (711) and capable of reciprocating along the slide rail (711). The handling device is connected to the electric slider (712).

3. The dispensing device for free space isolators according to claim 2, characterized in that, At least two electric sliders (712) are provided, and the first handling component (410) and the second handling component (420) are respectively connected to different electric sliders (712).

4. The dispensing device for a free space isolator according to claim 1, wherein, The dispensing component (500) includes a glue tank (510) and a glue gun (520). The glue gun (520) is connected to the glue tank (510) through a connecting pipe (530).

5. The dispensing device for free space isolator according to claim 4, characterized in that, A mounting seat (600) is disposed on the top of the base (100). A mounting bracket (610) is disposed on the top of the mounting seat (600). A positioning through hole is provided on the mounting bracket (610), and the glue gun (520) is inserted into the positioning through hole for positioning.

6. The dispensing device for free space isolator according to claim 1, wherein, A camera device (800) including a first camera (810) and a second camera (820). The first camera (810) is used to detect the posture of the chip in the horizontal direction, and the second camera (820) detects the posture of the chip from bottom to top to determine whether the direction and inclination angle of the chip need to be corrected.

7. The dispensing device for a free space isolator according to claim 1, characterized in that, Including an ultraviolet curing device (900) mounted on the second handling component (420) and used for curing the glue that adheres the chip and the magnetic ring.

8. The dispensing device for free space isolator according to claim 1, characterized in that, The feeding device includes a first feeding tray (210) and a second feeding tray (220). A plurality of first feeding grooves (211) are provided on the top of the first feeding tray (210), and a plurality of chips are disposed in the first feeding grooves (211). A plurality of second feeding grooves (221) are provided on the top of the second feeding tray (220), and a plurality of magnetic ring components are disposed in the second feeding grooves (221).

9. The dispensing device for free space isolators according to claim 1, characterized in that, The imaging device (800) further includes a third camera assembly (830) and a fourth camera assembly (840). The third camera assembly (830) is configured to photograph the chip placed on the first feeder tray (210), so that the first handling assembly (410) can accurately handle the chip. The fourth camera assembly (840) is configured to photograph the magnetic ring placed on the second feeder tray (220), so that the second handling assembly (420) can accurately handle the magnetic ring.

10. The dispensing device for free space isolator according to claim 6, characterized in that, It includes a push pin (411) disposed on the first handling assembly (410). The push pin (411) is used to adsorb the chip and then push it into the magnetic ring. After the chip is pushed into the magnetic ring, the push pin (411) can also drive the chip to rotate so that the glue on the chip can fully contact the magnetic ring.

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