Multifunctional tin soldering machine

Abstract

The invention discloses a multifunctional tin soldering machine and relates to the field of tin soldering machines, the multifunctional tin soldering machine comprises a case and a feeding plate, a power assembly is arranged at the bottom of the feeding plate, a lifting assembly is arranged on the upper surface of the feeding plate, a tin soldering assembly is arranged in the lifting assembly, and a cleaning assembly used for cleaning a PCB is further arranged in the lifting assembly; a cooling assembly used for cooling welding spots is arranged at the top of an inner cavity of the machine box, a feeding plate is driven to move through a power assembly, a lifting plate is driven to descend while the feeding plate moves, the lifting plate drives a tin soldering assembly and a cleaning assembly to descend, and the tin soldering assembly and the cleaning assembly can be cleaned in the process that the feeding plate moves to the designated position. When the cleaning assembly descends, the PCB on the upper surface of the feeding plate can be cleaned, after the feeding plate moves to a designated position, the tin soldering assembly arrives at the designated position at the same time, so that tin soldering is achieved, after tin soldering is completed, the lifting plate ascends, and the cooling assembly is started to cool the PCB after tin soldering is completed.

Description

Technical Field

[0001] The present invention relates to the technical field of soldering machines, and particularly relates to a multifunctional soldering machine. Background Art

[0002] An automatic soldering machine is an automated soldering and welding device, which mainly completes soldering operations by using the motion function of a manipulator. The core part of the automatic soldering machine is the soldering system. The soldering system mainly consists of an automatic solder feeding mechanism, a temperature control unit, a heating element, and a soldering iron tip.

[0003] When the soldering machine performs soldering, workers need to pre-treat the PCB board to be soldered in advance, and then start the soldering machine for soldering by adjusting the positioning program of the soldering machine and installing the PCB board on the upper surface of the feeding tray.

[0004] The existing soldering machines can only process the soldering procedure during use. However, the pre-soldering steps such as surface cleaning and solder joint positioning need to be manually completed by workers, which results in overly cumbersome pre-soldering processing steps and increases the workload of workers. Summary of the Invention

[0005] (1) Technical Problems to be Solved

[0006] In view of the above problems existing in the prior art, the present invention provides a multifunctional soldering machine.

[0007] (2) Technical Solutions

[0008] To achieve the above objectives, the present invention is realized through the following technical solutions: A multifunctional soldering machine includes a chassis. Two feeding plates are slidably connected to the upper surface of the chassis. A lifting assembly is provided on the upper surface of the feeding plates. A soldering assembly is provided inside the chassis. A cleaning assembly is provided inside the chassis. A cooling assembly is provided at the top of the lifting assembly;

[0009] The lifting assembly includes a transverse movement rack fixedly connected to the upper surface of the feeding plate. A transmission gear is meshed with the upper surface of the transverse movement rack. A transmission shaft is inserted through the interior of the transmission gear. Two driven gears are fixedly connected to the outer surface of the transmission shaft. A lifting rack is meshed with the outer surface of the driven gears. The top end of the lifting rack is fixedly connected to a lifting plate. A power assembly is provided at the bottom end of the feeding plate;

[0010] Cleaning assembly, including two rotating shafts movably connected to the inner wall of the chassis through bearing seats. Two double-layer driving sprockets are fixedly connected to the outer surface of the rotating shafts. A transverse driving chain is drivingly connected between two adjacent double-layer driving sprockets. A vertical driving chain is drivingly connected to the outer surface of the double-layer driving sprocket. A single-layer driving sprocket is drivingly connected to the outer surface of the vertical driving chain. A cleaning roller for installing cleaning tools is inserted inside the single-layer driving sprocket. Both ends of the cleaning roller pass through the single-layer driving sprocket and are movably connected to a connecting plate through a bearing seat.

[0011] Cooling assembly, including a connecting plate fixedly connected to the top of the inner cavity of the chassis. An airbag is fixedly connected to the lower surface of the connecting plate. An air pipe is fixedly connected to the outer surface of the connecting plate. The bottom end of the air pipe passes through the lifting plate and is fixedly connected to a fixing plate. The bottom end of the fixing plate is fixedly connected to the upper surface of the chassis. Three nozzles are fixedly connected to one side of the fixing plate close to the inside of the chassis.

[0012] As a preferred solution of the multifunctional soldering machine of the present invention, the power assembly includes a self-locking motor fixedly connected to the inner wall of the chassis. The output end of the self-locking motor is fixedly connected to a bidirectional lead screw. Two sliders are threadedly connected to the outer surface of the bidirectional lead screw. The top end of the slider is fixedly connected to the lower surface of the feeding plate. A transverse limiting rod is inserted inside the slider.

[0013] As a preferred solution of the multifunctional soldering machine of the present invention, a reduction motor is fixedly connected to the upper surface of the lifting plate. The output end of the reduction motor is fixedly connected to a driving gear. A driven gear is meshingly connected to the outer surface of the driving gear. The driven gear is fixedly connected to the outer surface of the rotating shaft.

[0014] As a preferred solution of the multifunctional soldering machine of the present invention, the soldering assembly includes four connecting cylinders fixedly connected to the lower surface of the lifting plate. The bottom end of the connecting cylinder is fixedly connected to a soldering head. The bottom end of the connecting cylinder is fixedly connected to a solder replenishing port. A replenishing material cylinder is fixedly connected to the lower surface of the lifting plate. The bottom end of the replenishing material cylinder is fixedly connected to four solder replenishing pipes. One end of the solder replenishing pipe away from the replenishing material cylinder passes through the connecting cylinder and is fixedly connected to the top end of the solder replenishing port.

[0015] As a preferred embodiment of the multifunctional soldering machine of the present invention, a clamping assembly is provided on the upper surface of the feeding plate. The clamping assembly includes a motor fixedly connected to the inner wall of the chassis. The output end of the motor is fixedly connected to a rotating rod. Two first bevel gears are fixedly connected to the outer surface of the rotating rod. The outer surface of the first bevel gear is meshed with a second bevel gear. A threaded rod is inserted through the inside of the second bevel gear. The threaded rod is movably connected to the lower surface of the feeding plate through a bearing seat. A threaded sleeve is threadedly connected to the outer surface of the threaded rod. The top end of the threaded sleeve passes through the feeding plate and is fixedly connected to a clamping disc.

[0016] As a preferred embodiment of the multifunctional soldering machine of the present invention, a chute for placing a PCB board is provided inside the clamping disc. Two springs are fixedly connected inside the clamping disc. One end of the two springs close to the welding position is fixedly connected to a pressing plate.

[0017] As a preferred embodiment of the multifunctional soldering machine of the present invention, the length of the transverse rack is less than the length of the lifting rack. The distance that the feeding plate moves on the outer surface of the bidirectional lead screw through the slider will not cause the transverse rack to disengage from the transmission gear. When the feeding plate moves into the chassis through the slider, when the lifting rack drops to the lowest point as the transverse rack moves, the welding head can just dock with the sheet material on the upper surface of the clamping disc.

[0018] As a preferred embodiment of the multifunctional soldering machine of the present invention, when the lifting plate drops to the lowest point, the airbag can be fully restored. When the lifting plate starts to rise, it squeezes the airbag. The gas inside the airbag is transmitted to the position of the nozzle through the connecting disc and the air pipe.

[0019] As a preferred embodiment of the multifunctional soldering machine of the present invention, a vertical limiting rod for limiting the lifting plate is inserted through the inside of the lifting plate.

[0020] As a preferred embodiment of the multifunctional soldering machine of the present invention, a rectangular groove for the operation of the vertical transmission chain is provided inside the lifting plate.

[0021] (III) Beneficial effects

[0022] The present invention provides a multifunctional soldering machine. It has the following beneficial effects:

[0023] 1. During soldering, the self-locking motor is started to drive the bidirectional lead screw to rotate, causing the two feeding plates to drive the PCB board placed on the clamping component to move towards each other. During the movement, through the settings of the transverse rack, driving gear, driven gear, and lifting rack, the lifting plate is driven to descend, thereby driving the soldering component to descend. When the feeding plate moves to the specified position, the soldering component descends to the position for soldering the PCB board, thus realizing soldering without the need for repeated positioning operations before soldering.

[0024] 2. While the lifting plate descends, it drives the cleaning component to descend. Through the settings of the reduction motor, driving gear, and passive gear, the rotating shaft is driven to rotate. The rotating shaft drives the single-layer transmission sprocket at the bottom to rotate through the double-layer transmission sprocket, transverse transmission chain, and vertical transmission chain, thereby driving the cleaning roller to rotate. Before soldering, a flexible cleaning substance with a certain thickness is sleeved on the outer surface of the cleaning roller, so that when the lifting plate descends, the surface of the PCB board on the upper surface of the horizontally moving feeding plate can be cleaned.

[0025] 3. After soldering is completed, the lifting plate rises, and the airbag is squeezed by the lifting plate, so that the gas inside the airbag is transported to the nozzle on the outer surface of the fixed plate through the connecting plate and the air pipe, and the nozzle cools and protects the solder joints of the PCB board after soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0027] Figure 1 It is a schematic structural diagram of the whole of the present invention.

[0028] Figure 2 It is a schematic structural diagram of the interior of the chassis of the present invention.

[0029] Figure 3 It is a schematic structural diagram of the lifting component of the present invention.

[0030] Figure 4 It is a schematic structural diagram of the clamping component of the present invention.

[0031] Figure 5 It is a schematic structural diagram of the clamping disc of the present invention.

[0032] Figure 6 It is a schematic structural diagram of the cleaning component of the present invention.

[0033] Figure 7 It is a schematic structural diagram of the soldering component of the present invention.

[0034] Figure 8 It is a schematic structural diagram of the cooling component of the present invention.

[0035] In the figure, 1 is the chassis; 2 is the feeding plate; 3 is the lifting component; 301 is the lifting plate; 302 is the transverse rack; 303 is the driving gear; 304 is the driven gear; 305 is the lifting rack; 306 is the transmission shaft; 4 is the power component; 401 is the bidirectional lead screw; 402 is the horizontal limiting rod; 403 is the slider; 404 is the self-locking motor; 5 is the clamping component; 501 is the threaded rod; 502 is the threaded sleeve; 503 is the motor; 504 is the first bevel gear; 505 is the second bevel gear; 506 is the clamping disc; 507 is the extrusion plate; 508 is the spring; 509 is the rotating rod; 6 is the cleaning component; 601 is the horizontal transmission chain; 602 is the rotating shaft; 603 is the double-layer transmission sprocket; 604 is the connecting plate; 605 is the cleaning roller; 606 is the single-layer transmission sprocket; 607 is the reduction motor; 608 is the driving gear; 609 is the vertical transmission chain; 610 is the driven gear; 7 is the cooling component; 701 is the connecting disc; 702 is the airbag; 703 is the air pipe; 704 is the fixing plate; 705 is the nozzle; 8 is the soldering component; 801 is the connecting cylinder; 802 is the welding head; 803 is the tin replenishing port; 804 is the tin replenishing pipe; 805 is the replenishing material cylinder. Specific embodiments

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.

[0037] Embodiment 1

[0038] Refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 And Figure 5 , which is the first embodiment of the present invention. This embodiment provides a multifunctional soldering machine, including a chassis 1. Two feeding plates 2 are slidably connected to the upper surface of the chassis 1. The upper surface of the feeding plate 2 is provided with a lifting component 3. A soldering component 8 is arranged inside the chassis 1. A cleaning component 6 is arranged inside the chassis 1. The top of the lifting component 3 is provided with a cooling component 7. The lifting component 3 includes a transverse rack 302 fixedly connected to the upper surface of the feeding plate 2. The upper surface of the transverse rack 302 is meshed with a driving gear 303. A transmission shaft 306 is inserted inside the driving gear 303. Two driven gears 304 are fixedly connected to the outer surface of the transmission shaft 306. The outer surface of the driven gear 304 is meshed with a lifting rack 305. The top end of the lifting rack 305 is fixedly connected to a lifting plate 301. The bottom end of the feeding plate 2 is provided with a power component 4.

[0039] Specifically, the power assembly 4 includes a self-locking motor 404 fixedly connected to the inner wall of the chassis 1. The output end of the self-locking motor 404 is fixedly connected to a bidirectional lead screw 401. Two sliders 403 are threadedly connected to the outer surface of the bidirectional lead screw 401. The top of the slider 403 is fixedly connected to the lower surface of the feeding plate 2. A horizontal limiting rod 402 is inserted through the slider 403. The soldering assembly 8 includes four connecting cylinders 801 fixedly connected to the lower surface of the lifting plate 301. The bottom end of the connecting cylinder 801 is fixedly connected to a soldering head 802. The bottom end of the connecting cylinder 801 is fixedly connected to a solder replenishing port 803. The lower surface of the lifting plate 301 is fixedly connected to a replenishing cylinder 805. The bottom end of the replenishing cylinder 805 is fixedly connected to four solder replenishing pipes 804. One end of the solder replenishing pipe 804 away from the replenishing cylinder 805 passes through the connecting cylinder 801 and is fixedly connected to the top end of the solder replenishing port 803. A clamping assembly 5 is arranged on the upper surface of the feeding plate 2. The clamping assembly 5 includes a motor 503 fixedly connected to the inner wall of the chassis 1. The output end of the motor 503 is fixedly connected to a rotating rod 509. Two first bevel gears 504 are fixedly connected to the outer surface of the rotating rod 509. The outer surface of the first bevel gear 504 is meshed with a second bevel gear 505. A threaded rod 501 is inserted through the second bevel gear 505. The threaded rod is movably connected to the lower surface of the feeding plate 2 through a bearing seat. A threaded sleeve 502 is threadedly connected to the outer surface of the threaded rod 501. The top end of the threaded sleeve 502 passes through the feeding plate 2 and is fixedly connected to a clamping disc 506. A chute for placing the PCB board is opened inside the clamping disc 506. Two springs 508 are fixedly connected inside the clamping disc 506. One end of the two springs 508 close to the welding position is fixedly connected to a pressing plate 507. The length of the transverse rack 302 is less than the length of the lifting rack 305. The distance that the feeding plate 2 moves on the outer surface of the bidirectional lead screw 401 through the slider 403 will not cause the transverse rack 302 to disengage from the transmission gear 303. When the feeding plate 2 moves into the chassis 1 through the slider 403 and the lifting rack 305 descends to the lowest point as the transverse rack 302 moves, the soldering head 802 can just be butted against the sheet material on the upper surface of the clamping disc 506. A vertical limiting rod for limiting the lifting plate 301 is inserted through the lifting plate 301.

[0040] Further, when soldering, place the PCB board to be soldered in the card slot on the upper surface of the clamping plate 506, and fix the PCB board by squeezing it with the squeezing plate 507 and the spring 508. Then start the motor 503. The rotation of the threaded rod 501 is driven through the settings of the first bevel gear 504 and the second bevel gear 505, thereby driving the movement of the threaded sleeve 502. The upper surface of the threaded sleeve 502 passes through the feeding plate 2 and is fixedly connected to the lower surface of the clamping plate 506. A rectangular groove with the same width as the threaded sleeve 502 is opened inside the feeding plate 2. Through the cooperation of the threaded sleeve 502 and the threaded rod 501, the clamping plate 506 is driven to move to the side of the feeding plate 2 close to the soldering assembly 8. Then start the self-locking motor 404, which drives the rotation of the bidirectional lead screw 401, thereby driving the two feeding plates 2 to move towards each other. While the feeding plate 2 moves, it drives the transverse rack 302 to move. The transverse rack 302 drives the transmission gear 303 to rotate. The transmission gear 303 drives the driven gear 304 to rotate through the transmission shaft 306, so that the lifting rack 305 is lifted and lowered under the action of the driven gear 304. While the two feeding plates 2 move towards each other, the lifting plate 301 also descends simultaneously. When the two feeding plates 2 move towards each other to the limit position of the thread on the outer surface of the bidirectional lead screw 401, the lifting plate 301 drives the soldering assembly 8 to descend to the lowest point simultaneously, and the welding head 802 can just contact the surface of the PCB board. The bottom end of the welding head 802 contacts the bottom end of the tin replenishing port 803. Thus, the fixed-point soldering of the surface of the PCB board is realized through the cooperation of the welding head 802 and the tin replenishing port 803. Before the soldering process of the same batch and the same solder joint, the positions of the welding head 802 and the tin replenishing port 803 can be adjusted to meet the fixed-point soldering, and no secondary positioning is required during the subsequent soldering process of the same batch.

[0041] Embodiment 2

[0042] Refer to Figure 1 、 Figure 2 And Figure 6 This is the second embodiment of the present invention. Based on the previous embodiment, the cleaning assembly 6 includes two rotating shafts 602 movably connected to the inner wall of the chassis 1 through bearing seats. Two double-layer driving sprockets 603 are fixedly connected to the outer surface of the rotating shaft 602. A transverse driving chain 601 is connected between two adjacent double-layer driving sprockets. The outer surface of the double-layer driving sprocket 603 is connected to a vertical driving chain 609. The outer surface of the vertical driving chain 609 is connected to a single-layer driving sprocket 606. A cleaning roller 605 for installing cleaning tools is inserted inside the single-layer driving sprocket 606. Both ends of the cleaning roller 605 pass through the single-layer driving sprocket 606 and are movably connected to a connecting plate 604 through bearing seats.

[0043] Specifically, a deceleration motor 607 is fixedly connected to the upper surface of the lifting plate 301. The output end of the deceleration motor 607 is fixedly connected to a driving gear 608. The outer surface of the driving gear 608 is meshed with a driven gear 610. The driven gear 610 is fixedly connected to the outer surface of the rotating shaft 602. A rectangular groove for the operation of the vertical transmission chain 609 is formed inside the lifting plate 301.

[0044] Further, when the lifting plate 301 descends during the movement of the feeding plate 2, it simultaneously drives the cleaning assembly 6 to descend. By sleeving a flexible cleaning substance such as cleaning cotton on the outer surface of the cleaning roller 605, the PCB board placed on the upper surface of the clamping plate 506 can be cleaned. And the bottom end of the connecting plate 604 should be lower than the position of the welding head 802. And during cleaning, the cleaning roller 605 needs to be used in combination with a flexible cleaning substance. When the bottom end of the cleaning roller 605 descends with the lifting plate 301, it will not collide with the upper surface of the clamping plate 506. And the height difference between the cleaning roller 605 and the clamping plate 506 can realize the cleaning of the surface of the PCB board through the flexible cleaning substance sleeved on the surface of the cleaning roller 605. When the lifting plate 301 descends, the deceleration motor 607 is started. Thus, one of the rotating shafts 602 is driven to rotate through the driving gear 608 and the driven gear 610. When the rotating shaft 602 rotates, the other rotating shaft 602 is driven to rotate through the double-layer transmission sprocket 603 and the horizontal transmission chain 601. The double-layer transmission sprocket 603 drives the single-layer transmission sprocket 606 to rotate through the vertical transmission chain 609, and finally drives the cleaning roller 605 to rotate. When the cleaning roller 605 rotates, it drives the flexible cleaning substance sleeved on its outer surface to clean the upper surface of the PCB board.

[0045] Embodiment 3

[0046] Refer to Figure 1 、 Figure 2 And Figure 8 This is the second embodiment of the present invention. Based on the previous embodiment, the cooling assembly 7 includes a connection disk 701 fixedly connected to the top of the inner cavity of the chassis 1. The lower surface of the connection disk 701 is fixedly connected to an airbag 702. The outer surface of the connection disk 701 is fixedly connected to an air pipe 703. The bottom end of the air pipe 703 passes through the lifting plate 301 and is fixedly connected to a fixing plate 704. The bottom end of the fixing plate 704 is fixedly connected to the upper surface of the chassis 1. Three nozzles 705 are fixedly connected to one side of the fixing plate 704 close to the inside of the chassis 1.

[0047] Specifically, when the lifting plate 301 descends to the lowest point, the airbag 702 can be fully restored. When the lifting plate 301 starts to rise, it squeezes the airbag 702. The gas inside the airbag 702 is transmitted to the position of the nozzle 705 through the connection disk 701 and the air pipe 703.

[0048] Further, after the soldering assembly 8 finishes soldering the PCB board placed on the clamping plate 506, the self-locking motor 404 rotates in reverse, driving the two feeding plates 2 to move away from each other, thereby driving the lifting plate 301 to rise. When the lifting plate 301 descends, the airbag 702 is restored as it loses the extrusion of the lifting plate 301. An air inlet is provided on the outer surface of the connecting plate 701, and a one-way valve is arranged inside the air inlet. When the airbag 702 is restored, it inhales air through the air inlet and the one-way valve. When the lifting plate 301 rises, it squeezes the airbag 702, driving the gas inside the airbag 702 to be transported through the connecting plate 701 and the air pipe 703 to the nozzle 705 installed on the outer surface of the fixing plate 704, thereby cooling components such as the soldered PCB board and the soldering head 802. If needed, an external air pipe 703 can be connected through the air inlet to transport a protective gas into the airbag 702. After soldering is completed, the gas is output through the nozzle 705 to protect the solder joints on the surface of the PCB board.

[0049] Working principle: When using the multifunctional soldering machine for soldering, first adjust the positions of the soldering head 802 and the solder replenishing port 803 according to the positions of the solder joints to be soldered on the PCB boards of the same batch. And select whether to externally connect a protective gas through the air inlet of the connection pad 701 via the air pipe 703 according to the soldering requirements. During soldering, place the PCB board to be soldered in the card slot on the upper surface of the clamping plate 506, and fix the PCB board by squeezing it with the squeezing plate 507 and the spring 508. Then start the motor 503, drive the threaded rod 501 to rotate through the settings of the first bevel gear 504 and the second bevel gear 505, thereby driving the threaded sleeve 502 to move. Through the cooperation of the threaded sleeve 502 and the threaded rod 501, drive the clamping plate 506 to move to the side of the feeding plate 2 close to the soldering assembly 8. Then start the self-locking motor 404, thereby driving the bidirectional lead screw 401 to rotate, driving the two feeding plates 2 to move towards each other. While the feeding plate 2 moves, it drives the transverse rack 302 to move. Drive the transmission gear 303 to rotate through the transverse rack 302. The transmission gear 303 drives the driven gear 304 to rotate through the transmission shaft 306, so that the lifting rack 305 descends under the action of the driven gear 304. When the two feeding plates 2 move towards each other to the limit position of the thread on the outer surface of the bidirectional lead screw 401, the soldering head 802 simultaneously descends to the lowest point, thus realizing the soldering of the PCB board surface. During the movement of the feeding plate 2, while the lifting plate 301 descends, it drives the cleaning assembly 6 to descend. Make the driving gear 608 and the passive gear 610 drive one of the rotating shafts 602 to rotate through the reduction motor 607. While the rotating shaft 602 rotates, drive the rotating shaft 602 on the other side to rotate through the double-layer transmission sprocket 603 and the transverse transmission chain 601, so that the double-layer transmission sprocket 603 drives the single-layer transmission sprocket 606 to rotate through the vertical transmission chain 609, and finally drives the cleaning roller 605 to rotate. When the cleaning roller 605 rotates, it drives the soft cleaning substance sleeved on the outer surface to clean the upper surface of the PCB board. During the descent of the lifting plate 301, the airbag 702 loses the extrusion of the lifting plate 301 and thus resumes its original shape. Through the air inlet and the one-way valve provided on the outer surface of the connection pad 701, the airbag 702 is inflated when it resumes its original shape. After soldering, the self-locking motor 404 rotates in reverse, thereby driving the two feeding plates 2 to move away from each other. At the same time, the lifting plate 301 rises, thereby squeezing the airbag 702. The gas inside the airbag 702 is then transported through the connection pad 701 and the air pipe 703 to the nozzle 705 installed on the outer surface of the fixing plate 704, thus realizing the cooling of the solder joints. When the feeding plate 2 moves to the side away from the soldering assembly 8 as the bidirectional lead screw 401 rotates, then reverse the flipping motor 503, thereby driving the clamping plate 506 to move out of the chassis 1 through the threaded sleeve 502, facilitating the worker to remove the soldered PCB board, and finally completing the soldering of the PCB board.Moreover, no secondary positioning is required during soldering, nor is it necessary to pre-clean the surface of the PCB board. After soldering is completed, the temperature of the solder joints can be reduced to protect the solder joints.

[0050] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

Claims

1. A multifunctional soldering machine, comprising a chassis (1), characterized in that: On the upper surface of the chassis (1), two feeding plates (2) are slidably connected. On the upper surface of the feeding plates (2), a lifting assembly (3) is provided. Inside the chassis (1), a soldering assembly (8) is provided. Inside the chassis (1), a cleaning assembly (6) is provided. At the top of the lifting assembly (3), a cooling assembly (7) is provided; The lifting assembly (3) includes a transverse rack (302) fixedly connected to the upper surface of the feeding plate (2). On the upper surface of the transverse rack (302), a transmission gear (303) is meshed. Inside the transmission gear (303), a transmission shaft (306) is inserted. On the outer surface of the transmission shaft (306), two driven gears (304) are fixedly connected. On the outer surface of the driven gears (304), a lifting rack (305) is meshed. At the top of the lifting rack (305), a lifting plate (301) is fixedly connected. At the bottom end of the feeding plate (2), a power assembly (4) is provided; The cleaning assembly (6) includes two rotating shafts (602) movably connected to the inner wall of the chassis (1) through bearing seats. On the outer surface of the rotating shafts (602), two double-layer driving sprockets (603) are fixedly connected. Between two adjacent double-layer driving sprockets (603), a transverse driving chain (601) is drivingly connected. On the outer surface of the double-layer driving sprockets (603), a vertical driving chain (609) is drivingly connected. On the outer surface of the vertical driving chain (609), a single-layer driving sprocket (606) is drivingly connected. Inside the single-layer driving sprocket (606), a cleaning roller (605) for installing cleaning tools is inserted. The two ends of the cleaning roller (605) pass through the single-layer driving sprocket (606) and are movably connected to a connecting plate (604) through bearing seats; The cooling assembly (7) includes a connecting plate (701) fixedly connected to the top of the inner cavity of the chassis (1). On the lower surface of the connecting plate (701), an airbag (702) is fixedly connected. On the outer surface of the connecting plate (701), an air pipe (703) is fixedly connected. The bottom end of the air pipe (703) passes through the lifting plate (301) and is fixedly connected to a fixing plate (704). The bottom end of the fixing plate (704) is fixedly connected to the upper surface of the chassis (1). On one side of the fixing plate (704) close to the inside of the chassis (1), three nozzles (705) are fixedly connected.

2. The multifunctional soldering machine according to claim 1, wherein: The power assembly (4) includes a self-locking motor fixedly connected to the inner wall of the chassis (1). The output end of the self-locking motor is fixedly connected to a bidirectional lead screw (401). On the outer surface of the bidirectional lead screw (401), two sliders (403) are threadedly connected. The top ends of the sliders (403) are fixedly connected to the lower surface of the feeding plate (2). Inside the sliders (403), a transverse limiting rod (402) is inserted.

3. A multifunctional soldering machine according to claim 2, characterized in that: A reduction motor (607) is fixedly connected to the upper surface of the lifting plate (301). The output end of the reduction motor (607) is fixedly connected to a driving gear (608). The outer surface of the driving gear (608) is meshed with a driven gear (610). The driven gear (610) is fixedly connected to the outer surface of a rotating shaft (602).

4. A multifunctional soldering machine according to claim 3, characterized in that: The soldering assembly (8) includes four connecting cylinders (801) fixedly connected to the lower surface of the lifting plate (301). The bottom end of the connecting cylinder (801) is fixedly connected to a soldering head (802). The bottom end of the connecting cylinder (801) is fixedly connected to a solder replenishing port (803). A replenishing material cylinder (805) is fixedly connected to the lower surface of the lifting plate (301). Four solder replenishing pipes (804) are fixedly connected to the bottom end of the replenishing material cylinder (805). One end of the solder replenishing pipe (804) far from the replenishing material cylinder (805) passes through the connecting cylinder (801) and is fixedly connected to the top end of the solder replenishing port (803).

5. A multifunctional soldering machine according to claim 4, characterized in that: A clamping assembly (5) is arranged on the upper surface of the feeding plate (2). The clamping assembly (5) includes a motor (503) fixedly connected to the inner wall of the chassis (1). The output end of the motor (503) is fixedly connected to a rotating rod (509). Two first bevel gears (504) are fixedly connected to the outer surface of the rotating rod (509). The outer surface of the first bevel gear (504) is meshed with a second bevel gear (505). A threaded rod (501) is inserted into the second bevel gear (505). The threaded rod is movably connected to the lower surface of the feeding plate (2) through a bearing seat. A threaded sleeve (502) is threadedly connected to the outer surface of the threaded rod (501). The top end of the threaded sleeve (502) passes through the feeding plate (2) and is fixedly connected to a clamping disc (506).

6. The multifunctional soldering machine according to claim 5, characterized in that: A chute for placing the PCB board is formed inside the clamping disc (506). Two springs (508) are fixedly connected to the inside of the clamping disc (506). One end of the two springs (508) close to the soldering position is fixedly connected to a pressing plate (507).

7. A multifunctional soldering machine according to claim 6, characterized in that: The length of the transverse moving rack (302) is less than that of the lifting rack (305). The distance that the feeding plate (2) moves on the outer surface of the bidirectional lead screw (401) through the slider (403) will not cause the transverse moving rack (302) to disengage from the transmission gear (303). When the feeding plate (2) moves into the chassis (1) through the slider (403), when the lifting rack (305) descends to the lowest point along with the movement of the transverse moving rack (302), the soldering head (802) can just be butted against the sheet material on the upper surface of the clamping disc (506).

8. A multi-functional soldering machine according to claim 7, characterized in that: When the lifting plate (301) descends to the lowest point, the airbag (702) can be fully restored. When the lifting plate (301) starts to rise, it squeezes the airbag (702). The gas inside the airbag (702) is transmitted to the position of the nozzle (705) through the connecting disc (701) and the air pipe (703).

9. The multifunctional soldering machine according to claim 8, characterized in that: A vertical limiting rod for limiting the lifting plate (301) is inserted into the lifting plate (301).

10. A multifunctional soldering machine according to claim 9, characterized in that: A rectangular groove for the operation of the vertical transmission chain (609) is formed inside the lifting plate (301).

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