Laminating machine and heating type film pasting mechanism thereof
By setting movable heating parts in the lamination machine and independently performing the thermal welding procedure, the cracking or deformation of the film material caused by excessive heating time during the thermal welding process is solved, and the reliability and quality of film material adhesion is improved.
Patent Information
- Application Number
- CN202410027887.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-08
- Publication Date
- 2025-07-08
AI Technical Summary
In existing lamination machines, the film material is heated for too long in the thermal welding process, resulting in the film material breakage or deformation.
The heating element is movably arranged on the back of the film adsorption member, so that the thermal welding procedure can be performed independently of the pre-stick procedure, and the heat welding is performed through the independent heating element to avoid the heating time being subject to the pre-stick time.
It prevents the film from cracking or deforming due to excessive heating time, and improves the reliability and quality of film adhesion.
Smart Images
Figure CN120269830A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a heating type film laminating mechanism, and particularly to a heating type film laminating mechanism of a laminator. Background Art
[0002] Currently, in the semiconductor or electronic component industry, it is necessary to attach a film material (such as Mylar film or ABF film) to a substrate as a construction layer or an adhesive for subsequent processes. Generally, the film material is first picked up and transported to the film laminating working area corresponding to the substrate through a transmission mechanism, and then the film material is pushed to complete the operation of pressing the film material onto the surface of the substrate.
[0003] Laminators for laminating films on opposite surfaces of a substrate are widely used in related technical fields. In some application scenarios, in order to ensure that the film material is firmly attached to the surface of the substrate, a thermal welding process is performed after the film material is pre-laminated to the substrate to improve the adhesion between the film material and the surface of the substrate by heating the film material.
[0004] In existing laminators, the film laminating process and the thermal welding process are carried out simultaneously, but currently the industry faces the problem that the film material is broken or deformed due to too long heating time of the film material, which affects the result of attaching the film material to the substrate. Summary of the Invention
[0005] In view of the above problems, the present invention provides a laminator and its heating type film laminating mechanism, which helps to solve the problem that the film material is broken or deformed due to too long heating time of the film material in the thermal welding process.
[0006] The heating type film laminating mechanism disclosed by the present invention includes a film material adsorbing member and at least one heating member. The film material adsorbing member is used for adsorbing the film material, and the film material adsorbing member has a working surface and a back surface opposite to the working surface. The heating member is movably arranged on the back surface of the film material adsorbing member, and the heating member is used for thermally laminating the film material to the substrate.
[0007] The laminator disclosed by the present invention includes a film material supplying member and a film laminating mechanism. The film material supplying member is used to supply the film material along the feeding direction. The film laminating mechanism includes a film material adsorbing member and at least one heating member. The film material adsorbing member is used for adsorbing the film material. The film material adsorbing member is arranged corresponding to the film material supplying member, and the film material adsorbing member has a working surface and a back surface opposite to the working surface. The heating member is movably arranged on the back surface of the film material adsorbing member, and the heating member is used for thermally laminating the film material to the substrate.
[0008] According to the laminator and its heating film attaching mechanism disclosed by the present invention, the heating element is movably arranged on the back of the film material adsorbing member, such that the thermal welding process performed by the heating element can be independent of the pre-film attaching process performed by the film material adsorbing member. In this way, the time for the heating element to thermally bond the film material is not restricted by the time for the film material adsorbing member to pre-attach the film material. Thereby, it helps to prevent the problem that the film material is broken or deformed due to overlong heating time of the film material.
[0009] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principle of the present invention, and provide a further explanation of the claims of the present invention. Description of the Drawings
[0010] Figure 1 It is a schematic diagram of a laminator according to an embodiment of the present invention.
[0011] Figure 2 is Figure 1 a schematic diagram of the heating film attaching mechanism of the laminator of
[0012] Figure 3 is Figure 2 a three-dimensional schematic diagram of the heating element of the heating film attaching mechanism of
[0013] Figures 4 to 7 is for using Figure 1 the laminator of
[0014] Figure 8 is a schematic diagram of a heating film attaching mechanism according to another embodiment of the present invention. Detailed Embodiments
[0015] The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient for any person skilled in the art to understand the technical content of the present invention and implement it accordingly. And according to the content, claims and drawings disclosed in this specification, any person skilled in the art can easily understand the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any way.
[0016] Please refer to Figure 1 and Figure 2 , wherein Figure 1 is a schematic diagram of a laminator according to an embodiment of the present invention, and Figure 2 is Figure 1Schematic diagram of the heating film laminating mechanism of the laminator. In this embodiment, the laminator 1 includes a film supply member 10, a carrying platform 20, and a film laminating mechanism 30. The laminator 1 can be a film laminating machine or a film pressing machine. The film laminating machine attaches the film 101 to the surface of the substrate 100, and the film pressing machine further presses the film 101 in addition to attaching the film 101 so that it is flattened on the substrate 100. In the aspect where the laminator 1 is a film laminating machine, the laminator 1 can further include a clamping mechanism, an airbag, and a vacuum chamber (not shown). In the aspect where the laminator 1 is a film pressing machine, the laminator 1 can further include a film pressing roller 40 or a flat pressing member (not shown). Figure 1 Exemplarily, the laminator 1 including the film pressing roller 40 is drawn as being used as a film pressing machine.
[0017] The film supply member 10 can include a conveying roller for supplying the film 101. Further, the film supply member 10 can include a roller provided with a film roll, or can include a roller capable of conveying the film 101 in a predetermined feeding direction D1 toward the film laminating mechanism 30. The carrying platform 20 is arranged corresponding to the film supply member 10, and the carrying platform 20 is used for carrying the substrate 100.
[0018] The film laminating mechanism 30 includes a film adsorbing member 310 and a heating module 320. The film adsorbing member 310 has a working surface 311 and a back surface 312 opposite to the working surface 311. The heating module 320 is arranged on the back surface 312 of the film adsorbing member 310. Specifically, the film adsorbing member 310 is not limited to a suction cup plate having negative pressure holes (not shown) formed on its outer surface. The area where the negative pressure holes are formed can be understood as the working surface 311 of the film adsorbing member 310, and at least a part of the area without negative pressure holes can be understood as the back surface 312 of the film adsorbing member 310.
[0019] Figure 1 Exemplarily, the laminator 1 is drawn as including two sets of components composed of the film supply member 10 and the film laminating mechanism 30, thereby realizing the double-sided film pressing operation of the substrate 100, but the present invention is not limited thereto. In other embodiments, the laminator 1 can include only one film supply member 10 and only one film laminating mechanism 30 to realize the single-sided film pressing operation of the substrate.
[0020] Please continue to refer to Figure 2, as shown in the figure, the heating module 320 includes a carrier 321, a heating element 322, and a power source 323, and the heating element 322 is movably disposed on the back surface 312 of the film suction and attachment member 310. Further, the carrier 321 is movably disposed on the back surface 312 of the film suction and attachment member 310. The power source 323 is disposed on the film suction and attachment member 310 and connected to the carrier 321. More specifically, the carrier 321 may include a connecting rod 3211 movably disposed on the film suction and attachment member 310 and a mounting bracket 3212 fixed to the connecting rod 3211. The power source 323 is, for example but not limited to, a stepper motor or a cylinder, and is connected to the connecting rod 3211 of the carrier 321. The heating element 322 is fixed to the mounting bracket 3212 of the carrier 321. The power source 323 can drive the carrier 321 to move up or down relative to the film suction and attachment member 310, thereby driving the heating element 322 to move closer to or away from the substrate 100 relative to the film suction and attachment member 310.
[0021] In this embodiment, the number of the heating elements 322 is multiple. As Figure 1 and Figure 2 shown, these heating elements 322 may be arranged at intervals along the length direction D2 of the film suction and attachment member 310, and the length direction D2 is substantially orthogonal to the aforementioned feeding direction D1. Further, these heating elements 322 may be arranged at equal intervals along the length direction D2.
[0022] In this embodiment, the heating element 322 may include a heating unit 3221 and a heat insulation unit 3222. Please refer to Figure 3 together, which is a three-dimensional schematic diagram of the heating element of the heating type film laminating mechanism in Figure 2 . As Figure 2 and Figure 3 shown, the heating unit 3221 is, for example but not limited to, an electric heating tube or an electric heating sheet, and the heat insulation unit 3222 is, for example but not limited to, a casing containing a heat insulating material. The heating unit 3221 is fixed to the mounting bracket 3212 of the carrier 321. The heat insulation unit 3222 wraps the heating unit 3221 and exposes the heating end 322a of the heating unit 3221.
[0023] The following describes a method of performing a film pressing operation using the laminator 1. Figures 4 to 7 It is a schematic diagram of performing a film laminating operation using the Figure 1 laminator. Figures 4 to 7 It shows laminating the film material 101 on the upper and lower surfaces of the substrate 100. However, for the sake of simplicity and ease of understanding, the following description only focuses on laminating the film material 101 on one side surface of the substrate 100, and the description of laminating the film material 101 on the other surface is omitted.
[0024] As Figure 1 and Figure 4As shown, the film material 101 is adsorbed through the negative pressure holes on the working surface 311 of the film material adsorber 310. The film material 101 is, for example but not limited to, a mylar film or an ABF film, and the substrate 100 is, for example but not limited to, a silicon wafer, a circuit board, a glass plate or a metal plate. The substrate 100 can pass through the film attaching mechanism 30 along the plate feeding direction D3.
[0025] As Figure 4 and Figure 5 shown, the film material adsorber 310 moves to drive the film material 101 close to the substrate 100. Further, the film material adsorber 310 moves close to the substrate holder 100, so as to pre - attach the end of the film material 101 to the surface of the substrate 100. The process of pre - attaching the film material 101 to the substrate 100 can be understood as a pre - attaching program executed by the film material adsorber 310. In Figure 5 the lower film material adsorber 310 can provide a certain degree of support for the substrate 100, so that the substrate 100 will not flex and sag.
[0026] Then, the film material 101 is thermally bonded to the surface of the substrate 100 through the heating member 322. Further, the heating member 322 can move up and down relative to the film material adsorber 310 and has a standby position and a film attaching position. More specifically, the heating member 322 can move relative to the film material adsorber 310 along the thermal bonding direction D4 substantially orthogonal to the plate feeding direction D3 through the carrier 321 and the power source 323 in Figure 2 .
[0027] As Figure 5 shown, when the heating member 322 is in the standby position, the heating member 322 is spaced from the bottom edge 313 of the film material adsorber 310. Further, in the case where the film material adsorber 310 has pre - attached the film material 101 to the substrate 100, the end of the film material 101 is clamped between the substrate 100 and the bottom edge 313 of the film material adsorber 310, and the heating member 322 in the standby position is spatially spaced from the film material 101. When the thermal welding process of thermally bonding the film material 101 to the substrate 100 is to be carried out, Figure 2 the power source 323 in
[0028] moves the heating member 322 to make it descend from the standby position to the film attaching position. Figure 6 As
[0029] shown, when the heating member 322 is in the film attaching position, the heating member 322 is flush with the bottom edge 313 of the film material adsorber 310, or further protrudes from the bottom edge 313 of the film material adsorber 310. The heating end 322a of the heating member 322 in the film attaching position can be in thermal contact with the end of the film material 101, thereby allowing the heating member 322 to perform the aforementioned thermal welding process.
[0029] As Figure 7As shown, the film material adsorbing member 310 stops adsorbing the film material 101. Further, the film material adsorbing member 310 stops adsorbing the film material 101 and returns to the initial position as shown in Figure 1 Then, the substrate 100 continues to pass through the film pressing roller 40 along the plate feeding direction D3, and the film material 101 is pressed onto the substrate 100 by the film pressing roller 40.
[0030] According to the film sticking mechanism 30 disclosed in this embodiment, the heating member 322 is movably disposed on the back surface 312 of the film material adsorbing member 310, so that the thermal welding process performed by the heating member 322 can be independent of the pre-sticking process performed by the film material adsorbing member 310. In this way, the time for the heating member 322 to thermally bond the film material 101 is not restricted by the time for the film material adsorbing member 310 to pre-stick the film material 101. For example, in the case where the film material adsorbing member 310 takes dozens of seconds to complete the pre-sticking of the film material 101, the heating member 322 that can be independently lifted and lowered allows the thermal bonding of the film material 101 to be completed in milliseconds to seconds. Thereby, it helps to prevent the problem that the film material 101 is broken or deformed due to the overlong heating time of the film material 101.
[0031] In addition, the film sticking mechanism 30 disclosed in this embodiment includes a plurality of heating members 322 arranged at intervals. Each heating member 322 can be independently operated, which helps to maintain the temperature uniformity of the film material 101 during the thermal welding process. Moreover, the heating member 322 is small in volume and fast in temperature response speed, and can quickly reach the set temperature.
[0032] In addition, the heating member 322 disclosed in this embodiment includes a heat insulation unit 3222. The heat insulation unit 3222 helps to prevent the heat generated by the heating unit 3221 from being transferred to the film material adsorbing member 310, thereby improving the efficiency of the heating member 322 in thermally bonding the film material 101, and at the same time preventing the heat generated by the heating unit 3221 from affecting the quality of the film material 101 on the working surface 311.
[0033] Figure 8 It is a schematic diagram of a heating type film sticking mechanism according to another embodiment of the present invention. In this embodiment, the film sticking mechanism 30A includes a film material adsorbing member 310A and a heating module 320. The film sticking mechanism 30A of this embodiment is similar to the Figure 2 film sticking mechanism 30 shown, so the differences between the two will be described below, and the same or similar parts of the two will not be elaborated.
[0034] In this embodiment, the film suction and attachment member 310A of the film laminating mechanism 30A has a gas flow channel 314, and the gas flow channel 314 is located between the working surface 311 and the heating member 322 of the heating module 320. Further, the gas flow channel 314 can be a channel formed inside the film suction and attachment member 310A or a pipeline disposed on the back surface 312 of the film suction and attachment member 310A. The gas flow channel 314 may not communicate with the negative pressure holes (not shown) of the film suction and attachment member 310A. The gas flow channel 314 allows air or nitrogen to flow through. The flowing gas in the gas flow channel 314 prevents the heat transfer generated by the heating member 322 from being conducted to the film suction and attachment member 310A, which helps to improve the efficiency of the heating member 322 in thermally laminating the film, and at the same time can also prevent the heat generated by the heating member 322 from affecting the quality of the film located on the working surface 311.
[0035] In summary, according to the laminator and its heating film laminating mechanism disclosed by the present invention, the heating member is movably disposed on the back surface of the film suction and attachment member, so that the thermal welding process performed by the heating member can be independent of the pre-laminating process performed by the film suction and attachment member. In this way, the time for the heating member to thermally laminate the film is not restricted by the time for the film suction and attachment member to pre-laminate the film. Thereby, it helps to prevent the problems of film rupture or deformation caused by overlong heating time of the film.
[0036]
Symbol Description
[0037] 1: Laminator
[0038] 100: Substrate
[0039] 101: Film
[0040] 10: Film supply member
[0041] 20: Carrying table
[0042] 30, 30A: Film laminating mechanism
[0043] 310, 310A: Film suction and attachment member
[0044] 311: Working surface
[0045] 312: Back surface
[0046] 313: Bottom edge
[0047] 314: Gas flow channel
[0048] 320: Heating module
[0049] 321: Carrier
[0050] 3211: Connecting rod
[0051] 3212: Mounting frame
[0052] 322: Heating element
[0053] 3221: Heating unit
[0054] 3222: Heat insulation unit
[0055] 322a: Heating end
[0056] 323: Power source
[0057] 40: Film pressing roller
[0058] D1: Feeding direction
[0059] D2: Length direction
[0060] D3: Board feeding direction
[0061] D4: Thermal lamination direction.
Claims
1. A heating film laminating mechanism, characterized in that, Comprising: A film material adsorbing member for adsorbing a film material, and the film material adsorbing member has a working surface and a back surface opposite to the working surface; and At least one heating member movably disposed on the back surface of the film material adsorbing member, and the at least one heating member is used to thermally bond the film material to a substrate.
2. The heating type film laminating mechanism according to claim 1, wherein the plurality of heating members are arranged at intervals along the length direction of the film material adsorbing member.
3. The heating film laminating mechanism according to claim 1, wherein, It further comprises a carrier movably disposed on the back surface of the film material adsorbing member, and the plurality of heating members are fixed to the carrier.
4. The heating film laminating mechanism according to claim 3, wherein, It further comprises a power source disposed on the film material adsorbing member, and the power source is connected to the carrier.
5. The heating type film laminating mechanism according to claim 1, wherein the at least one heating member comprises a heating unit and a heat insulation unit, the heat insulation unit covers the heating unit and exposes the heating end of the heating unit.
6. The heating type film laminating mechanism according to claim 1, wherein the at least one heating member can move relative to the film material adsorbing member to have a standby position and a film laminating position, In the standby position, the at least one heating member is spaced apart from the bottom edge of the film material adsorbing member, and In the film laminating position, the at least one heating member is flush with the bottom edge of the film material adsorbing member, or protrudes from the bottom edge of the film material adsorbing member.
7. The heating type film laminating mechanism according to claim 1, wherein the film material adsorbing member has a gas flow channel, and the gas flow channel is between the working surface and the at least one heating member.
8. A lamination machine, characterized in that, Comprising: A film material supply member for supplying a film material along a feeding direction; and A film laminating mechanism, comprising: A film material adsorbing member for adsorbing the film material, the film material adsorbing member is disposed corresponding to the film material supply member, and the film material adsorbing member has a working surface and a back surface opposite to the working surface; and At least one heating member movably disposed on the back surface of the film material adsorbing member, and the at least one heating member is used to thermally bond the film material to a substrate.
9. The laminator according to claim 8, wherein the film material adsorbing member can move relative to the film material supply member to drive the film material close to the substrate.
10. The laminator according to claim 8, wherein the length direction of the film material adsorbing member is substantially orthogonal to the feeding direction, and the plurality of heating members are arranged at intervals along the length direction of the film material adsorbing member.
11. The laminator according to claim 8, wherein the at least one heating member comprises a heating unit and a heat insulation unit, the heat insulation unit covers the heating unit and exposes the heating end of the heating unit.
12. The laminator according to claim 8, wherein the substrate can pass through the film laminating mechanism along the plate entering direction, the at least one heating member can move relative to the film material adsorbing member along a thermal bonding direction substantially orthogonal to the plate entering direction to have a standby position and a film laminating position, In the standby position, the at least one heating member is spaced apart from the bottom edge of the film material adsorbing member, and In the film laminating position, the at least one heating member is flush with the bottom edge of the film material adsorbing member, or protrudes from the bottom edge of the film material adsorbing member.