Heat conduction type fire extinguishing patch and preparation method thereof

Abstract

The invention discloses a heat conduction type fire extinguishing patch and a preparation method thereof, and relates to the technical field of fire-fighting equipment. The fire-extinguishing microcapsule comprises a modified adhesive and a microcapsule, the fire-extinguishing microcapsule is 50-80 parts, and the modified adhesive comprises 100 parts of an organic silicon resin adhesive, 10 parts of flame-retardant powder, 5 parts of a defoaming agent and 10 parts of heat-conducting powder. By adding the heat conduction powder, the overall heat conduction efficiency of the fire extinguishing patch is improved, the triggering time of the fire extinguishing patch is effectively shortened on the premise that triggering temperature setting is not sacrificed, the triggering sensitivity of the fire extinguishing microcapsules is further enhanced, the fire extinguishing requirement for rapid response in the initial stage is met, and the fire extinguishing effect is improved. The fire extinguishing patch is simple in structure, does not need an additional heating device, effectively guarantees the use flexibility and adaptability of the fire extinguishing patch, and is lower in production cost compared with a fire extinguishing patch adopting an additional heating device.

Description

Technical Field

[0001] The present invention belongs to the technical field of fire-fighting equipment, and particularly relates to a heat-conducting fire-extinguishing patch and a preparation method thereof. Background Art

[0002] The patch-type perfluorohexanone fire-extinguishing device is a micro-miniature fire-extinguishing device that can be installed in a narrow space and is commonly used to solve the fire safety problems in enclosed places. For example, a large number of patch-type perfluorohexanone fire-extinguishing devices are installed in cabinets or distribution cabinets in computer rooms and power distribution rooms.

[0003] As disclosed in Chinese Utility Model CN220546492U, a self-exciting fire-extinguishing patch is disclosed. When a fire occurs, the temperature rises, the main body of the fire-extinguishing patch cracks, and the fire-extinguishing medium is released. At the same time, the temperature control switch detects the temperature rise in the application scenario. When the temperature reaches the preset temperature, the temperature control switch closes, the circuit is connected, the heating wire works, heats the main body of the fire-extinguishing patch, accelerates the cracking of the main body of the fire-extinguishing patch, and accelerates the release of the fire-extinguishing medium.

[0004] However, in the prior art, the fire-extinguishing patch is heated by an electric heating method to promote its thermal cracking for fire extinguishing to ensure timely triggering of the fire-extinguishing patch. The use of additional electric heating not only increases the overall production cost of the fire-extinguishing patch, but also makes the overall volume of the fire-extinguishing patch larger, resulting in poor adaptability to the use scenario. Summary of the Invention

[0005] The purpose of the present invention is to provide a heat-conducting fire-extinguishing patch, which improves the overall heat conduction efficiency of the fire-extinguishing patch by adding heat-conducting powder, effectively shortens the triggering time of the fire-extinguishing patch, realizes the fire-extinguishing requirement of rapid initial response, and solves the problems that the existing fire-extinguishing patches have a large overall volume and poor adaptability due to the use of additional electric heating.

[0006] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0007] The present invention is a heat-conducting fire-extinguishing patch and a preparation method thereof, including a modified adhesive and microcapsules. The fire-extinguishing microcapsules are 50-80 parts, and the modified adhesive includes: 100 parts of silicone resin adhesive, 10 parts of flame retardant powder, 5 parts of defoaming agent, and 10 parts of heat-conducting powder.

[0008] As a preferred technical solution of the present invention, the composition of the silicone resin adhesive includes: 80 parts of high molecular mixture base material, 20 parts of bis(p-glycidyl phenyl) propane, 2 parts of γ-aminopropyltriethoxysilane, and 0.2 parts of dimethoxydibutyltin.

[0009] As a preferred technical solution of the present invention, the polymer mixture base material comprises: 80 parts of dimethyl silicone, 70 parts of styrene, and 60 parts of butyl acrylate.

[0010] As a preferred technical solution of the present invention, the fire-extinguishing microcapsules use an acrylate material as the shell, and the internal filler is perfluoromethyl hexanone fire extinguishing agent.

[0011] As a preferred technical solution of the present invention, the perfluoromethyl hexanone fire extinguishing agent accounts for 65% - 75% of the total mass of the fire-extinguishing microcapsules.

[0012] As a preferred technical solution of the present invention, the particle size of the fire-extinguishing microcapsules is 200 - 1500 μm.

[0013] As a preferred technical solution of the present invention, the heat-conducting powder includes but is not limited to one or more of graphene, aluminum nitride, boron nitride, or copper powder.

[0014] A preparation method of a heat-conducting fire-extinguishing patch, comprising the following steps:

[0015] Step 1: Put the formulated modified adhesive and microcapsules into a blender, stir and mix evenly at a rotation speed of 100 - 200 rpm, and continuously stir for 15 minutes until a uniform fire-extinguishing patch slurry is formed.

[0016] Step 2: Inject the fire-extinguishing patch slurry into a box mold, and use tools to level its surface to ensure that the surface of the fire-extinguishing patch slurry maintains a consistent height;

[0017] Step 3: Place the patch slurry together with the box mold in a constant temperature environment of 50 °C for curing treatment. After curing for 6 - 8 hours, a heat-conducting fire-extinguishing patch can be obtained.

[0018] As a preferred technical solution of the present invention, the preparation method of the modified adhesive includes: preparing an organosilicon resin adhesive by uniformly mixing the formulated polymer mixture base material, bis(p-glycidylphenyl) propane, γ-aminopropyltriethoxysilane, and dimethoxydibutyltin, and then curing the uniformly stirred mixture in a constant temperature environment of 50 °C to obtain the organosilicon resin adhesive.

[0019] As a preferred technical solution of the present invention, the preparation method of the polymer mixture base material includes: mixing the formulated dimethyl silicone, styrene, and butyl acrylate, and carrying out copolymerization reaction at 160 °C for 6 - 8 hours to obtain the polymer mixed base material.

[0020] The present invention has the following beneficial effects:

[0021] By adding heat-conducting powder, the present invention improves the overall heat conduction efficiency of the fire-extinguishing patch, effectively shortens the triggering time of the fire-extinguishing patch without sacrificing the set triggering temperature, further enhances the triggering sensitivity of its fire-extinguishing microcapsules, realizes the fire-extinguishing requirement of rapid initial response, does not require an additional heating device, effectively ensures the flexibility and adaptability of the use of the fire-extinguishing patch, and has a lower production cost compared with the fire-extinguishing patch using an additional heating device.

[0022] Of course, it is not necessary for any product implementing the present invention to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for describing the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a schematic structural diagram of the heat-conducting fire-extinguishing patch and the box mold of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "periphery", etc. indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0027] Embodiment 1

[0028] The present invention relates to a heat-conducting fire-extinguishing patch, which includes a modified adhesive and microcapsules. There are 50 - 80 parts of fire-extinguishing microcapsules. The fire-extinguishing microcapsules use acrylate materials as the shell, and the internal filler is perfluoromethylcyclohexanone fire extinguishing agent. The perfluoromethylcyclohexanone fire extinguishing agent accounts for 65% - 75% of the total mass of the fire-extinguishing microcapsules, and the particle size of the fire-extinguishing microcapsules is 200 - 1500 μm.

[0029] The modified adhesive includes: 100 parts of silicone resin adhesive, 10 parts of flame retardant powder, 5 parts of defoaming agent, and 10 parts of heat-conducting powder. The heat-conducting powder includes but is not limited to one or more of graphene, aluminum nitride, boron nitride, or copper powder. Materials such as iron powder can also be used.

[0030] Among them, the composition of the silicone resin adhesive includes: 80 parts of high molecular mixture base material, 20 parts of bis(p-glycidylphenyl) propane, 2 parts of γ-aminopropyltriethoxysilane, and 0.2 parts of dimethoxydibutyltin.

[0031] The high molecular mixture base material includes: 80 parts of dimethylsiloxane, 70 parts of styrene, and 60 parts of butyl acrylate.

[0032] Example Two

[0033] A preparation method of a heat-conducting fire extinguishing patch in Example One. The specific implementation method includes the following steps:

[0034] Step One: First, prepare the high molecular mixture base material. The preparation method includes: mixing 80 parts of methylsiloxane, 70 parts of styrene, and 60 parts of butyl acrylate, and carrying out a copolymerization reaction at 160 °C for 6 - 8 h to obtain the high molecular mixture base material.

[0035] Then, prepare the silicone resin adhesive. The preparation method includes: taking 80 parts of the prepared high molecular mixture base material, 20 parts of bis(p-glycidylphenyl) propane, 2 parts of γ-aminopropyltriethoxysilane, and 0.2 parts of dimethoxydibutyltin, mixing them evenly, and then curing the evenly stirred mixture in a constant temperature environment at 50 °C to obtain the silicone resin adhesive.

[0036] Finally, put the formulated amount of modified adhesive and fire extinguishing microcapsules into a blender, that is, take 50 - 80 parts of fire extinguishing microcapsules, 100 parts of silicone resin adhesive, 10 parts of flame retardant powder, 5 parts of defoaming agent, and 10 parts of heat-conducting powder. The blender stirs at a speed of 100 - 200 rpm and continuously stirs for 15 - 30 minutes until a uniform fire extinguishing patch slurry is formed.

[0037] Step Two: Inject the fire extinguishing patch slurry into the box mold, and use tools to level its surface to ensure that the surface of the fire extinguishing patch slurry maintains a consistent height.

[0038] As Figure 1 shown, the box mold has a fire extinguishing patch groove. For example, the box mold can be a rectangular frame structure. After the fire extinguishing patch slurry is injected into the fire extinguishing patch groove, a scraper tool scrapes off the excess fire extinguishing patch slurry to ensure that the edge of the slurry is precisely aligned with the four boundaries of the fire extinguishing patch groove and maintains a consistent height.

[0039] Step 3: Place the patch paste together with the box mold in a constant temperature environment of 50 °C for curing treatment. After curing for 6 - 8 hours, a heat-conducting fire-extinguishing patch can be obtained. After the fire-extinguishing patch paste is cured and formed into a fire-extinguishing patch, it can be demolded and used, directly pasted or bonded at the required position.

[0040] It can also be used without demolding. For example, installation holes are opened at the four corner positions of the box mold, and the box mold can be installed and fixed through the installation holes, so that the fire-extinguishing patch can be installed and used through the installation holes of the box mold, fixed at the required position, and the convenience of use is improved.

[0041] The fire-extinguishing microcapsules and the heat-conducting powder are evenly distributed in the modified adhesive. A powder material with excellent heat-conducting performance, such as graphene, aluminum nitride, boron nitride, or copper powder, is used alone or in combination to greatly improve the overall heat conduction efficiency of the fire-extinguishing patch. This strategy effectively shortens the triggering time of the fire-extinguishing patch without sacrificing the set triggering temperature, further enhancing its triggering sensitivity, thus better meeting the fire-extinguishing requirements for rapid response in the initial stage of a fire.

[0042] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0043] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not elaborate on all details, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A heat-conducting fire-extinguishing patch, characterized in that: The invention comprises a modified adhesive and microcapsules, wherein the fire extinguishing microcapsules are 50 to 80 parts, and the modified adhesive comprises:

2. The heat-conducting fire extinguishing patch according to claim 1, characterized in that, The composition of the organic silicone resin adhesive includes: 80 parts of a polymer mixture base material, 20 parts of bis(p-glycidylphenyl)propane, 2 parts of y-nitropropyltriethoxysilane and 0.2 parts of dimethoxydibutyltin.

3. The heat-conducting fire extinguishing patch according to claim 2, wherein, The polymer mixture base material comprises: 80 parts of dimethylsiloxane, 70 parts of styrene and 60 parts of butyl acrylate.

4. A heat-conducting fire extinguishing patch according to claim 1 or 2 or 3, characterized in that, The fire extinguishing microcapsule adopts acrylic ester material as the shell, and the internal filler is perfluorohexanone fire extinguishing agent.

5. The heat-conducting fire-extinguishing patch according to claim 4, characterized in that, The perfluorohexanone fire extinguishing agent accounts for 65% to 75% of the total mass of the fire extinguishing microcapsules.

6. The heat-conducting fire extinguishing patch according to claim 5, wherein The particle size of the fire extinguishing microcapsule is 200-1500 μm.

7. A heat-conducting fire extinguishing patch according to claim 1, characterized in that, The thermally conductive powder includes, but is not limited to, one or more of graphene, aluminum nitride, boron nitride or copper powder.

8. The preparation method of a heat-conducting fire extinguishing patch according to claims 1 to 7, characterized in that, The following steps are involved: Step 1: Add the modified adhesive and microcapsules in the formula into a blender and stir at a speed of 100 to 200 rpm to mix them evenly; Step 2: Inject the fire extinguishing patch slurry into the box body mold, and use tools to flatten its surface to ensure that the surface of the fire extinguishing patch slurry maintains a consistent height; Step 3: Place the patch slurry together with the box body mold in a constant temperature environment of 50°C for curing. After curing for 6 to 8 hours, a thermally conductive fire extinguishing patch can be obtained.

9. The preparation method of a heat-conducting fire extinguishing patch according to claim 8, wherein, The preparation method of the modified adhesive comprises: preparing an organic silicone resin adhesive by uniformly mixing a formulated amount of a polymer mixture base material, bis(p-glycidylphenyl)propane, y-nitropropyltriethoxysilane and dimethoxydibutyltin, and then curing the uniformly stirred mixture in a constant temperature environment of 50° C. to obtain the organic silicone resin adhesive.

10. The preparation method of a heat-conducting fire extinguishing patch according to claim 9, characterized in that, The preparation method of the polymer mixture base material comprises: mixing dimethylsiloxane, styrene and butyl acrylate in a prescribed amount, and copolymerizing them at 160° C. for 6 to 8 hours to obtain the polymer mixture base material.

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